1PS76SB21; BAT721 series Schottky barrier diodes in small packages Rev. 06 — 21 December 2006 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package NXP Configuration JEITA 1PS76SB21 SOD323 SC-76 single BAT721 SOT23 - single BAT721A SOT23 - dual common anode BAT721C SOT23 - dual common cathode BAT721S SOT23 - dual series 1.2 Features n Low forward voltage n Small SMD plastic packages n Low capacitance 1.3 Applications n n n n Ultra high-speed switching Voltage clamping Line termination Reverse polarity protection 1.4 Quick reference data Table 2. Symbol Quick reference data Parameter Conditions Min Typ Max Unit - - 200 mA - - 40 V - - 550 mV Per diode IF forward current VR reverse voltage VF [1] forward voltage Pulse test: tp ≤ 300 µs; δ ≤ 0.02. IF = 200 mA [1] 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol 1PS76SB21 1 cathode 2 anode [1] 1 1 2 2 sym001 BAT721 1 anode 2 not connected 3 cathode 3 3 2 n.c. 1 006aaa436 1 2 006aaa144 BAT721A 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1), anode (diode 2) 3 3 1 2 006aaa439 1 2 006aaa144 BAT721C 1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1), cathode (diode 2) 3 3 1 2 006aaa438 1 2 006aaa144 BAT721S 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 3 3 1 2 006aaa437 1 2 006aaa144 [1] The marking bar indicates the cathode. 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 2 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 3. Ordering information Table 4. Ordering information Type number Package Name Description Version 1PS76SB21 SC-76 plastic surface-mounted package; 2 leads SOD323 BAT721 - plastic surface-mounted package; 3 leads SOT23 BAT721A BAT721C BAT721S 4. Marking Table 5. Marking codes Type number Marking code[1] 1PS76SB21 S1 BAT721 L7* BAT721A L8* BAT721C L9* BAT721S L0* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR reverse voltage - 40 V IF forward current - 200 mA IFSM non-repetitive peak forward current - 1 A Tj junction temperature - 125 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C half sine wave; JEDEC method; tp = 8.3 ms 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 3 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 6. Thermal characteristics Table 7. Symbol Thermal characteristics Parameter Conditions Min Typ Max Unit thermal resistance from junction to ambient in free air 1PS76SB21 - - 450 K/W BAT721 - - 500 K/W BAT721A - - 500 K/W BAT721C - - 500 K/W BAT721S - - 500 K/W Per diode Rth(j-a) [1] [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit forward voltage IF = 10 mA [1] - - 300 mV IF = 100 mA [1] - - 420 mV IF = 200 mA [1] - - 550 mV - - 15 µA Per diode VF IR reverse current Cd diode capacitance [1] VR = 30 V VR = 30 V; Tj = 100 °C - - 3 mA VR = 0 V; f = 1 MHz - 40 50 pF Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 4 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 006aaa689 103 IR (mA) IF (mA) 006aaa690 10 (1) 1 (2) 102 10−1 (1) (2) (3) 10−2 (4) (3) 10 10−3 10−4 1 10−5 10−1 (4) 10−6 0 200 400 600 0 10 20 30 40 VR (V) VF (mV) (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C (4) Tamb = −40 °C (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values mbk574 102 Cd (pF) 10 1 0 10 20 30 VR (V) 40 Tamb = 25 °C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 5 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 8. Package outline 1.35 1.15 1.1 0.8 3.0 2.8 0.45 0.15 1 1.1 0.9 3 0.45 0.15 2.7 2.3 2.5 1.4 2.1 1.2 1.8 1.6 1 2 0.40 0.25 0.25 0.10 Dimensions in mm 2 1.9 03-12-17 Fig 4. Package outline SOD323 (SC-76) 0.48 0.38 Dimensions in mm 0.15 0.09 04-11-04 Fig 5. Package outline SOT23 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 1PS76SB21 SOD323 4 mm pitch, 8 mm tape and reel -115 -135 BAT721 SOT23 4 mm pitch, 8 mm tape and reel -215 -235 BAT721A BAT721C BAT721S [1] For further information and the availability of packing methods, see Section 13. 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 6 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 6. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 7. Wave soldering footprint SOD323 (SC-76) 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 7 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 8. Reflow soldering footprint SOT23 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 9. Wave soldering footprint SOT23 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 8 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 11. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes 1PS76SB21_BAT721_SER_6 20061221 Product data sheet - 1PS76SB21_BAT721 _SER_5 - BAT721_SERIES_4 1PS76SB21_3 Modifications: 1PS76SB21_BAT721_SER_5 Modifications: • Amended Table 10 “Revision history” 20061205 Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. • • • • • • • • • • • • • • • • • • • Table 1 “Product overview”: added This data sheet is a combination of data sheets BAT721_SERIES_4 and 1PS76SB21_3. Section 1.2 “Features”: amended Section 1.3 “Applications”: amended Table 2 “Quick reference data”: added Table 5 “Marking codes”: for 1PS76SB21 amended Table 5 “Marking codes”: enhanced table note section Table 6 “Limiting values”: indication per diode added Table 6 “Limiting values”: for 1PS76SB21 IFSM condition amended Table 6 “Limiting values”: Tamb ambient temperature added Table 7 “Thermal characteristics”: indication per diode added Table 7: Rth(j-a) thermal resistance from junction to ambient condition amended Table 8 “Characteristics”: indication per diode added Table 8 “Characteristics”: reference to Table note 1 amended Table 8: for 1PS76SB21 Cd minimum value changed to typical value Figure 1 and 2: amended Figure 4 and 5: superseded by minimized package outlines Section 9 “Packing information”: added Section 10 “Soldering”: added Section 12 “Legal information”: updated BAT721_SERIES_4 20040315 Product specification - BAT721_SERIES_3 1PS76SB21_3 20040126 Product specification - 1PS76SB21_2 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 9 of 11 1PS76SB21; BAT721 series NXP Semiconductors Schottky barrier diodes in small packages 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 1PS76SB21_BAT721_SER_6 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 06 — 21 December 2006 10 of 11 NXP Semiconductors 1PS76SB21; BAT721 series Schottky barrier diodes in small packages 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 21 December 2006 Document identifier: 1PS76SB21_BAT721_SER_6