PRELIMINARY DATA SHEET SE2605L: High Power (+26 dBm) 802.11n WLAN Power Amplifier with Integrated Power Detector Applications Description IEEE 802.11n WLAN enabled: Access points Media gateways Set top boxes LCD TVs The SE2605L is a 2 GHz Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SE2605L ideal for Wireless Local Area Network (WLAN IEEE 802.11n) applications. Other broadband triple-play multimedia applications Features Linear output power for IEEE 802.11n, 64-QAM, EVM ≤ 3% = +26 dBm @ 5.0 V The device is fabricated using SiGe BiCMOS technology. The device is internally matched and mounted in a 20-pin, 4 x 4 mm Quad Flat No-Lead (QFN) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution. A block diagram of the SE2605L is shown in Figure 1.The device package and pinout for the 16-pin QFN are shown in Figure 2. Signal pin assignments and functional pin descriptions are described in Table 1. High gain: 32 dB Power shutdown mode Superior gain flatness Fully matched at RF input/output ports Load insensitive power detector Small footprint QFN (16-pin, 3 x 3 mm) SMT package (MSL3, 260 C per JEDEC J-STD-020) Skyworks GreenTM products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of GreenTM, document number SQ04–0074. RF_IN Bias Input Match Inter-Stage Match Inter-Stage Match RF_OUT Y0252 PA_EN Detector VCC1 VCC2 VDET VCC3 Figure 1. SE2605L Block Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 1 GND VCC1 N/C VCC2 PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA 16 15 14 13 RF_IN 1 12 GND EN 2 11 RF_OUT GND 3 10 RF_OUT VCC0 4 5 6 7 8 GND GND DET N/C 9 GND Y0251 Figure 2. SE2605L Pinout (Top View) Table 1. SE2605L Signal Descriptions Pin Name Description Pin Name Description 1 RF_IN RF Input 9 GND Ground 2 EN Power amplifier enable 10 RF_OUT RF output 3 GND Ground 11 RF_OUT RF output 4 VCC0 Power supply for bias circuit 12 GND Ground 5 GND Ground 13 VCC2 Power supply for second stage 6 GND Ground 14 N/C Not connected. Can be left floating or grounded. 7 DET Power detector output 15 VCC1 Power Supply driver stages 8 N/C Not connected. Can be left floating or grounded. 16 GND Ground Technical Description Electrical and Mechanical Specifications The SE2605L PA contains all of the needed RF matching and DC biasing circuits. The device also provides an output power detector voltage. The absolute maximum ratings of the SE2605L are provided in Table 2. Recommended operating conditions are specified in Table 3. Electrical specifications are provided in Tables 4, 5, and 6. The SE2605L is a three-stage, SiGe BiCMOS device optimized for high linearity and power efficiency. These features make the device suitable for wideband digital applications, where PA linearity and power consumption are of critical importance (e.g., WiFi systems or WLANs). The device has been characterized with the highest specified data rates for IEEE 802.11n (64 QAM). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Table 2. SE2605L Absolute Maximum Ratings1 Parameter Symbol Minimum Maximum Units V Supply voltage VCC1, VCC2, VCC3 –0.3 +5.5 Enable voltage PA_EN –0.3 +3.6 V RF input power PIN +12 dBm Operating temperature TOP –40 +85 C Storage temperature TST –40 +150 C Junction temperature TJ +160 C Thermal resistance ΘJC 13 C/W Electrostatic discharge: ESD 1000 V Human Body Model (HBM), Class 1C 1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SE2605L Recommended Operating Conditions Parameter Symbol Minimum Typical Maximum Units 3.0 5.00 5.25 V 3.6 V +25 +85 C Supply voltage VCC1, VCC2, VCC3 Enable voltage PA_EN 1.8 Case operating temperature TOP –40 Table 4. SE2605L Electrical Specifications: DC Characteristics1 (VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C as Measured on the Evaluation Board, Unless Otherwise Noted) Parameter Supply current Symbol ICC Quiescent Current ICQ Enable voltage: High Low PAEN_H PAEN_L Enable current IEN Enable pin input impedance ZEN Test Condition Min Typical Max Units POUT = +26 dBm, MCS7, 54 Mbps, 64 QAM 400 500 560 mA POUT = +29 dBm, 11Mbps, CCK signal, BT = 0.45 600 650 690 PA_EN = 0 V, No RF 10 100 No RF 220 802.11n: μA 3.6 0.5 1.8 0 Passive pull down mA V V 300 μA 10 kΩ 1 Performance is guaranteed only under the conditions listed in this table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 3 PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Table 5. SE2605L Electrical Specifications: General1 (VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, Unless Otherwise Noted) Parameter Symbol Frequency range f Output power POUT 1 dB output compression point OP1dB Small signal gain |S21| Test Condition Min Typical 2.4 Max Units 2.5 GHz 54 Mbps OFDM signal, 64 QAM, 3% EVM +24 +26 11 Mbps CCK signal, BT = 0.045 , mask +27 +29 dBm PIN = CW +29 +32 dBm 30 33 10 dBm 36 dB Input return loss |S11| 15 dB Gain variation S21 Over 40 MHz channel Over entire band 0.5 1.0 dB dB 2nd and 3rd harmonics 2fo, 3fo POUT = +29 dBm –50 Rise and fall time tR, tF 50% of VEN edge to 10%/90% of final power level Stability POUT = +29 dBm, VSWR = 4:1, all phases Ruggedness Ru –45 dBm/MHz μs 0.5 All non-harmonically related outputs < –42 dBm/MHz PIN = +12dBm, 50% duty cycle, VSWR = 6:1, all phases No damage 1 Performance is guaranteed only under the conditions listed in this table. Table 6. SE2605L Electrical Specifications: Power Detector Characteristics1 (VCC = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, f = 2.45 GHz, Unless Otherwise Noted) Parameter Symbol Output power detector range PDR Detector voltage VDET Test Condition Min Typical 0 Max Units OP1dB dBm POUT = +30 dBm 0.90 1.00 1.15 V POUT = +26 dBm 0.65 0.73 0.82 V POUT = 5 dB 0.30 0.33 0.36 V VSWR = 3:1 –1.5 to +1.5 dB –1.5 Detector accuracy ERRDET Output impedance PDZOUT 2.3 kΩ DC load impedance PDZLOAD 26.5 kΩ +1.5 1 Performance is guaranteed only under the conditions listed in this table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E dB PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Evaluation Board Description The SE2605L Evaluation Board is used to test the performance of the SE2605L WLAN PA. A schematic diagram of the SE2605L Evaluation Board is shown in Figure 3. A photograph of the Evaluation Board is shown in Figure 4. Component values for the SE2605L Evaluation Board are listed in Table 7. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation. NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the life of the device. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: Evaluation Board Setup Procedure 1. Connect system ground to pin 1 of connector J5. Paths to ground should be made as short as possible. 2. Apply 5.0 V to pins 3 and 4 of connector J5. The ground pad of the SE2605L has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. 3. By applying 3.3 V on PA_EN (pin 1 of the J4 header), the PA is enabled. By placing a ground on PA_EN, the PA is disabled and placed in a shutdown state, drawing minimal current. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For further information, refer to the Skyworks Application Note PCB Design Guidelines for High Power Dissipation Packages, document number 201211. Bypass capacitors should be used on the DC supply lines. Refer to the schematic drawing in Figure 3 for further details. 4. The 2 GHz amplifier performance can be monitored by applying an RF signal to connector J1 (RF_IN). Monitor the output power on the RF_OUT port connector, J1. Detector performance can be monitored on pin 4 of connector J4. CAUTION: Do not overdrive the amplifier by applying too much RF on the device input. A suitable starting input power setting is –20 dBm. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 5 PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA J5 1 VCC VCC R2 91 Ω C5 10 pF C3 1 μF C4 DNI VCC0 / N/C 2 VCC 3 VCC 4 C6 1 nF 5 Header 5 VCC J1 SMA RF Input 1 VEN 2 C2 DNI 17 16 15 PAD GND VCC1 14 N/C C9 DNI GND RF_IN C10 DNI C12 2.2 pF C11 4.7 μF 12 R3 0Ω C7 DNI EN SE2605L 3 4 RF_OUT RF_OUT GND VCC0 VCC0 / N/C GND GND 5 C20 100 nF GND 6 DET 7 N/C 8 11 10 9 C18 3.3 pF T1 C15 T5 T3 C14 2.4 pF L3 50 Ω 1.5 nH T2 15 pF T4 C16 2.4 pF C17 1.2 pF U1 VDET Header 4 4 13 VCC2 VDET R1 26.1K C19 DNI 3 2 1 VEN J4 Y0254 Figure 3. SE2605L Evaluation Board Schematic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E J2 SMA PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Y0262 Figure 4. SE2605L Evaluation Board Table 7. SE2605L Evaluation Board Bill of Materials Component C2,C4,C7,C9,C10,C19 Quantity 6 Value Vendor Part Number DNI C3 1 1 μF Murata GRM155R60J105KE19 C5 1 10 Pf Murata GRM1555C1H100JZ01 C6 1 1 nF Murata GRM155R71H102KA01 C11 1 4.7 μF Murata GRM188R60J475KE19 C12 1 2.2 pF Murata GRM1555C1H2R2CZ01 C14 and C16 2 2.4 pF Murata GRM1555C1H2R4CZ01 C15 1 1.2 pF Murata GRM1555C1H150JZ01 C17 1 3.3 pF Murata GRM1555C1H1R2CZ01 C18 1 27 Ω Murata GRM1555C1H3R3CZ01 C20 1 100 nF Murata GRM155R61A104KA01 J1 and J2 2 SMA Johnson 142-0701-851 J4 1 Header 4 Samtec TSW-104-07-G-S J5 1 Header 5 Samtec TSW-105-07-G-S L3 1 1.5 nH Murata LQG15HN1N5S02D PCB1 1 Z264-B Skyworks Z264-B R1 1 26.7 K Panasonic ERJ2RKF2672 R2 1 91 Ω Panasonic ERJ2GEJ910 R3 1 0Ω Panasonic ERJ3GEJ0R0 SE2605L Skyworks SE2605L U1 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 7 PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Package Dimensions Package and Handling Information The PCB layout footprint for the SE2605L is provided in Figure 5. Typical part markings are shown in Figure 6. Package dimensions are shown in Figure 7, and tape and reel dimensions are provided in Figure 8. Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE2605L is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information, document number 200164. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. 3 x 3 QFN Package Outline 3.20 0.25 Typ 0.50 Typ 16 15 14 3.20 3.30 0.35 Typ 16 13 15 14 0.25 Typ 0.50 Typ 13 16 15 14 13 0.60 Typ 1 12 1 12 2 11 1 12 2 11 3 10 4 9 3.30 3.20 2 11 1.80 3 10 4 9 0.58 Typ 0.500 Typ 1.70 3 10 4 9 0.500 Typ 3.20 0.10 0.675 Typ 0.500 Typ 5 6 7 8 5X Ø0.254 0.58 Typ 5 6 7 8 1.70 5 6 0.10 7 8 0.675 Typ 1.80 Board Metal and Via Pattern (Note 4) NOTES: Solder Mask Pattern (Note 6) 1. 2. 3. 4. All dimensions are in millimeters. Dimensions and tolerances per ASME Y14.5M-1994. Unless specified, dimensions are symmetrical about center lines. Via hole recommendations: Size (Ø): 0.150 to 0.300 mm Pitch: 0.500 Cu via wall plating: 30-35 μm Should be tented with solder mask on PCB backside and filled with solder. 5. Stencil recommendations: 0.127 mm stencil thickness. 6. Solder mask recommendations: Aperture array to tarret approximately 50 to 80% coverage of solder mask openings, except as noted. Stencil Pattern (Note 5) 63% Solder Coverage on Center Pad Y0264 Figure 5. PCB Layout Footprint for the SE2605L Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Pin 1 Indicator Pin 1 Indicator SiGe 2605L XXXXX SKY 2605L XXXXX Part Number Lot Code Part Number Lot Code Y0189 Figure 6. Typical Part Markings (Top View) 2X A 3.000 ±0.050 0.15 C 1.700 ±0.050 0.10 M C A B 0.850 ±0.050 See Note 3 B 16 15 14 0.300 X 45° 0.203 Ref. 13 1 12 2 11 1.700 ±0.050 3.000 ±0.050 3 10 4 9 13 14 15 16 12 1 11 2 10 3 0.500 R0.075 Typ. 9 4 0.10 M C A B 2X 0.15 C 5 6 7 8 0 – 0.05 Seating Plane C 8 16X 0.250 ±0.050 0.10 M C A B 0.05 M C Top View 7 6 5 16X 0.350 ±0.050 Bottom View NOTES: 1. All measurements are in millimeters. 2. Dimensioning and tolerancing according to ASME Y14.5M-1994. Unless otherwise specified the following values apply: Decimal Tolerance: Angular Tolerance: X.X (1 place) ± 0.1 mm ±1° X.XX (2 places) ± 0.05 mm X.XXX (3 places) ± 0.025 mm 3. Terminal #1 identification mark located within marked area. 4. Coplanarity applies to the exposed heat sink ground pad as well as the terminals. 5. Unless specified, dimensions are symmetrical about center lines. Y0265 Figure 7. SE2605L Package Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 9 PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA 8.00 ± 0.10 ∅1.50 2.00 ± 0.05 ± 0.10 1.75 ± 0.10 A A 4.25 ± 0.10 10o Max B ∅1.50 12.00 +0.30/–0.10 B 5.50 ± 0.05 1.13 ± 0.10 (Ko) 4.00 ± 0.10 Reference Pin Indicator ± 0.25 0.229 ± 0.02 (T) B 10o Max Notes: 1. Carrier tape material: black conductive polycarbonate or polysterene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 9.3 mm width 4. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC tape and reel specification. 5. Tolerance: .XX = ±0.10 6. All measurements are in millimeters 4.25 ± 0.10 (Ao) A Figure 8. SE2605L Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E S2585 PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Ordering Information Model Name SE2605L High Power WLAN Power Amplifier Manufacturing Part Number SE2605L Evaluation Board Part Number SE2605L-EK1 Copyright © 2012-2014, 2016 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. 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Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 11