ON ASM3P2508AG-08SR Peak emi reducing Datasheet

ASM3P2508A
Product Preview
Peak EMI Reducing
Solution
Description
The ASM3P2508A is a versatile spread spectrum frequency
modulator. The ASM3P2508A reduces electromagnetic interference
(EMI) at the clock source. The ASM3P2508A allows significant
system cost savings by reducing the number of circuit board layers and
shielding that are required to pass EMI regulations. The
ASM3P2508A modulates the output of PLL in order to spread the
bandwidth of a synthesized clock, thereby decreasing the peak
amplitudes of its harmonics. This results in significantly lower system
EMI compared to the typical narrow band signal produced by
oscillators and most clock generators. Lowering EMI by increasing a
signal’s bandwidth is called spread spectrum clock generation.
The ASM3P2508A has a feature to power down the 72 MHz /
48 MHz output by writing data into specific registers in the device via
I2C. By writing a ‘0’ into bit 1 of Byte 0, the PLL block generating
72 MHz / 48 MHz can be powered down. Writing ‘0’ into bit ‘7’ of
Byte 1 selects an output of 72 MHz on FOUT2CLK while a ‘1’ at the
same location selects a 48 MHz clock output. However, the I2C block,
crystal oscillator, and the PLL block generating 120 MHz would be
always running.
Features
SOIC−8
S SUFFIX
CASE 751BD
PIN CONFIGURATION
XIN
1
VSS
XOUT
SCL
VDD
SDA
FOUT2CLK
FOUT1CLK
(Top View)
ORDERING INFORMATION
• Generates an EMI Optimized Clocking Signal at Output
• Input Frequency − 14.31818 MHz
• Frequency Outputs:
•
•
•
•
•
•
•
•
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See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
− 120 MHz (modulated) − Default
− 72 MHz (modulated) or 48 MHz (modulated) Selectable via I2C
±1% Centre Spread
Modulation Rate: 40 KHz
Byte Write via I2C
Supply Voltage Range 3.3 V ± 0.3 V
Available in 8−pin SOIC Package
Available in Commercial and Industrial
Temperature Ranges
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. P3
1
Publication Order Number:
ASM3P2508A/D
ASM3P2508A
VDD
XIN
Crystal
Oscillator
XOUT
PLL 1
FOUT1CLK
(120 MHz)
I2C
Interface
SCL
SDA
FOUT2CLK
(72 MHz / 48 MHz)
PLL 2
VSS
Figure 1. Block Diagram
Table 1. PIN DESCRIPTION
Pin Name
Type
Description
XIN
I
Connection to crystal
XOUT
O
Connection to crystal
VDD
P
Power supply for the analog and digital blocks
FOUT1CLK
O
Clock output−1 (120 MHz) − default
FOUT2CLK
O
Clock output−2 (72 MHz / 48 MHz)
SDA
I/O
I2C Data
SCL
I
I2C Clock
VSS
P
Ground to entire chip
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol
VDD, VIN
TSTG
Rating
Unit
Voltage on any pin with respect to Ground
Parameter
−0.5 to +4.6
V
Storage temperature
−40 to +85
°C
0 to 70
°C
TA
Operating temperature
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
2
KV
TDV
Static Discharge Voltage (As per JEDEC STD22− A114−B)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. OPERATING CONDITIONS
Symbol
VDD
TA
FXIN
Parameter
Supply Voltage
3.3 V ± 10%
Ambient Operating Temperature Range
Min
Typ
3
3.3
−10
Crystal Resonator Frequency
Serial Data Transfer Rate
CL
Condition / Description
Max
3.6
V
+70
°C
14.31818
Standard Mode
Output Driver Load Capacitance
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2
10
Unit
MHz
100
Kb/s
15
pF
ASM3P2508A
Table 4. DC ELECTRICAL CHARACTERISTICS
(Test Condition: All the parameters are measured at room temperature (25°C), unless otherwise stated.)
Symbol
Parameter
Conditions / Description
Min
Typ
Max
Unit
OVERALL
Supply Current, Dynamic
Icc
VDD = 3.3 V, FCLK = 14.31818 MHz,
CL = 15 pF
40
49
60
mA
Supply Current, Static
IDD
VDD = 3.3 V, Software Power Down
(Note 1)
27
35
43
mA
High−Level Input Voltage
VIH
VDD = 3.3 V
2.0
−
VDD+0.3
V
Low−Level Input Voltage
VIL
VDD = 3.3 V
VSS−0.3
−
0.8
V
High−Level Input Current
IIH
−1
−
1
mA
Low−Level Input Current
(pull−up)
IIL
−20
−36
−80
mA
ALL INPUT PINS
CLOCK OUTPUTS (FOUT1CLK, FOUT2CLK)
High−Level Output Voltage
VOH
VDD = 3.3 V, IOH = 20 mA
2.5
−
3.3
V
Low−Level Output Voltage
VOL
VDD = 3.3 V, IOL = 20 mA
0
−
0.4
V
Output Impedance
ZOH
VO = 0.5 VDD; output driving high
−
29
−
W
ZOL
Vo = 0.5 VDD; output driving low
−
27
−
1. FOUT1CLK (120 MHz) is functional and not loaded.
Table 5. AC ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Rise Time
tr
Fall Time
tf
Conditions / Description
VO = 0.8 V to 2.0 V; CL = 15 pF
VO = 2.0 V to 0.8 V; CL = 15 pF
Min
Typ
Max
Unit
FOUT1CLK
640
680
750
pS
FOUT2CLK
440
480
600
FOUT1CLK
660
720
800
FOUT2CLK
460
520
570
pS
Clock Duty Cycle
tD
Ratio of pulse width (as measured from rising edge to
next falling edge at 2.5 V) to one clock period
45
−
55
%
Frequency
Deviation
fD
Output Frequency = 120 MHz
−
±2.73
−
%
Output Frequency = 72 MHz / 48 MHz
−
±1.78
−
Jitter, Long Term
Tj (LT)
On rising edges 500 mS apart at 2.5 V relative to an
ideal clock, PLL B inactive (Note 2)
−
45
−
On rising edges 500 mS apart at 2.5 V relative to an
ideal clock, PLL B active (Note 2)
−
165
−
From rising edge to next rising edge at 2.5 V,
PLL B inactive (Note 2)
−
110
−
From rising edge to next rising edge at 2.5 V,
PLL B active (Note 2)
−
390
−
Output active from power up, RUN Mode via Software
Power Down
−
125
−
Jitter, peak to peak
Clock Stabilization
Time
Tj (DT)
tSTB
2. CL = 15 pF, Fxin = 14.31818 MHz.
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3
pS
pS
mS
ASM3P2508A
R1 = 510 W
Crystal
C1 = 27 pF
C2 = 27 pF
Figure 2. Typical Crystal Oscillator Circuit
Table 6. TYPICAL CRYSTAL SPECIFICATIONS
Fundamental AT Cut Parallel Resonant Crystal
Nominal Frequency
14.31818 MHz
Frequency Tolerance
±50 ppm or better at 25°C
Operating temperature range
−20°C to +85°C
Storage Temperature
−40°C to +85°C
Load Capacitance
18 pF
Shunt capacitance
7 pF maximum
ESR
25 W
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4
ASM3P2508A
I2C Serial Interface Information
The information in this section assumes familiarity with I2C programming.
How to Program ASM3P2508A through I2C:
•
•
•
•
•
•
•
•
•
•
How to Read from ASM3P2508A through I2C:
•
•
•
•
Master (host) sends a start bit.
Master (host) sends the write address D4 (H).
ASM3P2508A device will acknowledge.
Master (host) sends the beginning byte location
(N = 0, 1).
ASM3P2508A device will acknowledge.
Master (host) sends a byte count (X = 1, 2).
ASM3P2508A device will acknowledge.
Master (host) starts sending byte N through byte
(N+X−1).
ASM3P2508A device will acknowledge each byte one
at a time.
Master (host) sends a Stop bit.
Controller (Host)
•
•
•
•
•
•
•
ASM3P2508A
(slave/receiver)
•
•
Start Bit
Master (host) will send start bit.
Master (host) sends the write address D4 (H).
ASM3P2508A device will acknowledge.
Master (host) sends the beginning byte location
(N = 0, 1).
ASM3P2508A device will acknowledge.
Master (host) will send a separate start bit.
Master (host) sends the read address D5 (H).
ASM3P2508A device will acknowledge.
ASM3P2508A device will send the byte count
(X = 1, 2).
Master (host) acknowledges.
ASM3P2508A device sends byte N through byte
(N+X−1).
Master (host) will need to acknowledge each byte.
Master (host) will send a stop bit.
Slave Address D4 (H)
Controller (Host)
ACK
ASM3P2508A
(slave/receiver)
Start Bit
Beginning byte location (=N)
Slave Address D4 (H)
ACK
ACK
Byte count (=X)
Beginning Byte = N
ACK
ACK
Beginning byte (Byte N)
Repeat start
ACK
Slave address D5 (H)
Next Byte (Byte N+1)
ACK
ACK
Byte Count (= X)
−−−−−−−
ACK
−−−−
Beginning byte N
Last Byte (Byte N+X−1)
ACK
ACK
Next Byte N+1
Stop Bit
ACK
−−−−
−−−−−−−
Last Byte (Byte N+X−1)
Not Acknowledge
Stop Bit
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5
ASM3P2508A
An example of a Byte Write via I2C to partially ‘power down’ the device:
ASM3P2508A can be partially ‘powered down’ using bit 1 of Byte 0. The organization of the register bits for Byte ‘0’ is
given with default values below:
Bit
7
6
5
4
3
2
1
0
Resv
Resv
Resv
Resv
Resv
Resv
PLL2 Enable
PLL1 Enable
0
1
0
1
0
1
1
1
down’ mode where the PLL block generating 72 MHz /
48 MHz would be powered down while I2C block, crystal
oscillator, and the PLL block generating 120 MHz would
still be active. The organization of the register bits is as
below:
The function of partial power down of the device is of
interest to us − that is bit 1 of Byte 0. In the default mode this
bit is logic ‘1’. As such, the Byte 0 default value is 57 (H).
To put ASM3P2508A in ‘power down’ mode, the bit 1 of
Byte 0 is to be changed to logic ‘0’. Hence writing a 55 (H)
via I2C into Byte 0 would put the device in partial ‘power
Bit
7
6
5
4
3
2
1
0
Resv
Resv
Resv
Resv
Resv
Resv
PLL2 Enable
PLL1 Enable
0
1
0
1
0
1
0
1
Byte 0
Byte 1
FOUT1CLK (MHz)
FOUT2CLK (MHz)
Power up default
6F (H)
3F (H)
120
72
48_MHz Mode
6F (H)
BF (H)
120
48
Power down PLL with 72 MHz
6D (H)
3F (H)
120
−
Power down PLL with 48 MHz
6D (H)
BF (H)
120
−
Figure Showing a Complete Data Transfer:
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6
ASM3P2508A
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD−01
ISSUE O
E1
E
SYMBOL
MIN
A
1.35
1.75
A1
0.10
0.25
b
0.33
0.51
c
0.19
0.25
D
4.80
5.00
E
5.80
6.20
E1
3.80
4.00
MAX
1.27 BSC
e
PIN # 1
IDENTIFICATION
NOM
h
0.25
0.50
L
0.40
1.27
θ
0º
8º
TOP VIEW
D
h
A1
θ
A
c
e
b
L
END VIEW
SIDE VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
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7
ASM3P2508A
Table 7. ORDERING INFORMATION
Part Number
Marking
Package Type
Temperature
ASM3P2508AG−08ST
3P2508AG
8−PIN SOIC, TUBE, Green
Commercial
ASM3P2508AG−08SR
3P2508AG
8−PIN SOIC, TAPE AND REEL, Green
Commercial
ASM3I2508AG−08ST
3I2508AG
8−PIN SOIC, TUBE, Green
ASM3I2508AG−08SR
3I2508AG
8−PIN SOIC, TAPE AND REEL, Green
ASM3P2508AF−08ST
3P2508AF
8−PIN SOIC, TUBE, Pb Free
Commercial
ASM3P2508AF−08SR
3P2508AF
8−PIN SOIC, TAPE AND REEL, Pb Free
Commercial
ASM3I2508AF−08ST
3I2508AF
8−PIN SOIC, TUBE, Pb Free
Industrial
ASM3I2508AF−08SR
3I2508AF
8−PIN SOIC, TAPE AND REEL, Pb Free
Industrial
Industrial
Industrial
ON Semiconductor and
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ASM3P2508A/D
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