Spec. No. : C749E3 Issued Date : 2006.07.26 Revised Date : Page No. : 1/3 CYStech Electronics Corp. 10Amp. Glass Passivated Efficient Fast Recovery Rectifiers EF10CXXE3 Series Features • Fast switching for high efficiency • Low forward voltage drop • High current capability • Low reverse leakage current • High surge current capability Mechanical Data • Case: Molded plastic, TO-220AB • Terminals: Solderrable per MIL-STD-202 method 208 • Epoxy: UL 94V-0 rate flame retardant • Mounting Position: Any • Weight: 2.24 grams Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. resistive or inductive load. Single phase, half wave, 60Hz, For capacitive load, derate current by 20%.) Parameter Maximum Recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage@ IF=5A Maximum Average forward rectified current @ TL=100℃ Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TJ=25℃ VR=VRRM,TJ=125℃ Diode junction capacitance @ f=1MHz and applied 4V reverse voltage Maximum reverse recovery time@ IF=0.5A, IR=1A, Irr=0.25A Typical thermal resistance, junction to lead Storage temperature Operating temperature EF10CXXE3 Symbol EF 10C01 EF 10C02 Type EF 10C03 EF 10C05 EF 10C06 Units VRRM 50 100 200 400 600 V VRMS 35 70 140 280 420 V VDC 50 100 200 400 600 V 1.25 1.85 V VF 0.95 I(AV) 10 A IFSM 100 A IR 10 250 µA CJ 65 pF trr 25 ns RθJC 2.2 ℃/W Tstg TJ -55 ~ +150 -55 ~ +150 ℃ ℃ CYStek Product Specification CYStech Electronics Corp. Spec. No. : C749E3 Issued Date : 2006.07.26 Revised Date : Page No. : 2/3 Characteristic Curves EF10CXXE3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C749E3 Issued Date : 2006.07.26 Revised Date : Page No. : 3/3 TO-220AB Dimension Equivalent Circuit : Style: Pin 1.Anode 2.Cathode 3.Anode 3-Lead TO-220AB Plastic Package CYStek Package Code: E3 Inches Min. Max. 0.412 0.103 0.113 0.05 0.06 0.587 0.594 0.14 0.16 0.53 0.56 0.037 0.027 DIM A B C D E F G Millimeters Min. Max. 10.5 2.62 2.87 1.27 1.52 14.9 15.1 3.56 4.06 13.46 14.22 0.94 0.68 DIM H I J K L M R Inches Min. Max. 0.105 0.095 0.175 0.185 0.045 0.055 0.27 0.23 0.10 0.11 0.014 0.025 0.148 0.154 Millimeters Min. Max. 2.67 2.41 4.44 4.70 1.14 1.40 6.86 5.84 2.54 2.79 0.35 0.64 3.74 3.91 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. EF10CXXE3 CYStek Product Specification