CALMIRCO CM3106 2 amp source/ sink bus termination regulator Datasheet

CM3106
2 Amp Source/ Sink Bus Termination Regulator
Features
Product Description
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The CM3106 is a sinking and sourcing regulator specifically designed for providing power to DDR memory
terminating resistors and companion chip set VTT
power. The output voltage accurately tracks VDDQ/2.
The CM3106 can source and sink current up to 2A,
ideal for DDR-I memory systems, and 1.2A for DDR-II
systems, while maintaining a load regulation of 0.5% in
either application.
Ideal for DDR-I and DDR-II VTT applications
Sinks and sources 2.0A for DDR-I
Over current protection
Over temperature protection
Integrated power MOSFETs
Excellent accuracy (0.5% load regulation)
Pin and functionally compatible with LP2995
8-lead SOIC and PSOP packages
Lead-free versions available
The CM3106 provides over current and over temperature protection which protects the device from excessive heating due to high current and high temperature.
A shutdown capability using an external transistor
reduces power consumption and provides a high
impedance output.
Applications
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Single and Dual Channel DDR Memory
Bus Termination
Active Termination Buses
Graphics Card Memory Termination
The CM3106 is housed in both 8-lead SOIC and PSOP
packages and is available with optional lead-free finishing.
Simplified Electrical Schematic
VDDQ
Over Temp
Over Current
Reference
PVIN
50K
AVIN
Driver
OUT
VTT
IN
Buffer
50K
VREF
VSENSE
GND
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
1
CM3106
PACKAGE / PINOUT DIAGRAM
TOP VIEW
NC
GND
1
8
2
7
VSENSE
V REF
3
6
4
5
TOP VIEW
VTT
PVIN
AVIN
VDDQ
NC
GND
1
8
2
7
VSENSE
V REF
3
8-lead SOIC
GND
4
6
5
VTT
PVIN
AVIN
VDDQ
8-lead PSOP
Note: This drawing is not to scale.
PIN DESCRIPTIONS
LEAD(S)
NAME
1
NC
DESCRIPTION
2
GND
3
VSENSE
4
VREF
Reference Output, VDDQ/2
5
VDDQ
VDDQ Input
6
AVIN
Analog Input
7
PVIN
Power Input
8
VTT
Output
No Connect
Ground
Feedback
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Ordering Part
Lead-free Finish
Ordering Part
Pins
Package
Number1
Part Marking
Number1
Part Marking
8
SOIC-8
CM3106-12SN
CM310601S
CM3106-12SM
CM3106-12SM
8
PSOP-8
CM3106-12SB
CM3106-12SB
CM3106-12SH
CM3106-12SH
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
© 2004 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
02/02/04
CM3106
Specifications
ABSOLUTE MAXIMUM RATINGS
RATING
UNITS
AVIN Operating Supply Voltage
PARAMETER
7
V
VDDQ Input Voltage
7
V
Pin Voltages
VTT Output
Any other pins
7
7
V
V
±2000
V
ESD (HBM)
Storage Temperature Range
-40 to +150
°C
Operating Temperature Range
Ambient
Junction
-40 to +85 (see note1)
-40 to +150
°C
°C
Power Dissipation (see note 1)
Internally Limited
W
Note 1: These devices must be derated based on thermal resistance at elevated temperatures. The device packaged in a 8-lead
SOIC leadframe must be derated at θJA = 151°C/W . θ JA of the 8-lead PSOP is 40°C/W.
STANDARD OPERATING CONDITIONS
VALUE
UNITS
VDDQ
PARAMETER
2.5
V
AVIN
2.5
V
PVIN
2.5
V
Ambient Operating Temperature
CTT
0 to +70
°C
220 +20%
µF
ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1)
SYMBOL
VIN
PARAMETER
CONDITIONS
Input Voltage Range
VDDQ
AVIN
ICC
VRLOAD
VREF
UNITS
2.2
2.2
2.5
2.5
AVIN
5.5
V
V
450
µA
Load Regulation
0A < IVTT < 2.0A or -2.0A < IVTT < 0A
6.25
mV
Output Reference Voltage
VDDQ=2.5V, IREF=0A
ZREF
VREF Output Impedance
TDISABLE
THYST
MAX
IVTT = 0A
Output Offset from VREF
ILIM
TYP
AVIN Quiescent Current
VOSVTT
ZVDDQ
MIN
1.225
1.25
-20
-5µA < IREF < 5µA
1.275
V
20
mV
5
kΩ
VDDQ Input Impedance
100
kΩ
VTT Current Limit
2.5
A
Shutdown Temperature
Thermal Hysteresis
150
50
°C
°C
Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified.
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
3
CM3106
Performance Information
Typical DC Characteristics (nominal conditions unless otherwise specified)
Figure 1. Output Voltage with
AVIN Supply (VDDQ=2.5V)
Figure 3. Reference Voltage with
AVIN Supply (VDDQ=2.5V)
Figure 2. Load Regulation (Sink)
Figure 4. Load Regulation (Source)
© 2004 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
02/02/04
CM3106
Performance Information (cont’d)
Typical DC Characteristics (nominal conditions unless otherwise specified)
Figure 7. Over Current Limit (Source)
Figure 5. Over Current Limit (Sink)
Figure 6. AVIN Supply Current with Supply Voltage
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
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CM3106
Performance Information (cont’d)
Typical Transient Characteristics (nominal conditions unless otherwise specified)
Figure 8. Load Transient
(0A to 2.0A Sink)
Figure 9. Line Transient
(0A to 2.0A Source)
© 2004 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
02/02/04
CM3106
Performance Information (cont’d)
Typical Thermal Characteristics (nominal conditions unless otherwise specified)
The overall junction to ambient thermal resistance
(θJA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction
to the case (θ JC) which is defined by the package style,
and the second path is case to ambient (θ CA) thermal
resistance which is dependent on board layout. The
final operating junction temperature for any set of conditions can be estimated by the following thermal equation:
increases from 0.42A to 0.58A for the CM3106-12SN
and a maximum instantaneous current of 2A should
not be exceeded for more than 29% of the time. For
CM3106-12SB, the maximum RMS current increases
from 1.3A to 2.2A. Thus, the maximum continuous current can be 2A all the time.
TJUNC = TAMB + PD (θJC) + PD (θCA)
= TAMB + PD (θJA)
When a CM3106-12SN is mounted on a double sided
printed circuit board with two square inches of copper
allocated for "heat spreading", the resulting θJA is
151°C/W. Based on the over temperature limit of 150°C
with an ambient of 70°C, the available power of this
package will be:
PD = (150°C - 85°C) / 151°C/W = 0.43W
Since the θJA of the CM3106-12SB (PSOP) is 40°C/W,
the available power for this package will be:
Figure 10. Duty Cycle vs. Ambient
Temperature (ILOAD=2.0A)
PD = (150°C - 85°C) / 40°C/W = 1.625W
DDR Memory Application
Since the output voltage is 1.25V, and the device can
either source current from VDD or sink current to
Ground, the power dissipated in the device at any time
is 1.25V times the current load. This means the the
maximum average RMS current (in either direction) is
0.344A for the CM3106-12SN and 1.3A for the
CM3106-12SB. The maximum instantaneous current is
specified at 2A, so this condition should not be
exceeded for more than 17% of the time for the
CM3106-12SN and 65% of the time for the CM310612SB. It is highly unlikely in most usage of DDR memory that this might occur, because it means the DDR
memory outputs are either all high or all low for 17%
(SOIC) and 65% (PSOP) of the time.
If the ambient temperature is 40°C instead of 85°C,
which is typically the maximum in most DDR memory
applications, the power dissipated (PD) can be 0.73W,
for the CM3106-12SN and 2.75W for the CM310612SB. So the maximum average RMS current
Figure 11. Duty Cycle vs. Output
Current (Temp=70°C)
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
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CM3106
Performance Information (cont’d)
Typical Thermal Characteristics (cont’d) (nominal conditions unless otherwise specified)
The theoretical calculations of these relationships
show the safe operating area of the CM3106 in the
SOIC package.
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for "heat spreading".
Figure 12. Reference Voltage vs. Temperature
Measurements showing performance up to a junction
temperature of 150°C were performed under light load
conditions (5mA). This allows the ambient temperature
to be representative of the internal junction temperature.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance.
Figure 13. VTT Output Voltage vs.Temperature
(5mA load)
Figure 14. AVIN Quiescent Current vs.Temperature
© 2004 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
02/02/04
CM3106
Application Information
CM3106
VDDQ
VREF
VDDQ
VREF
CREF
AVIN
AVIN
PVIN
PVIN
VSENSE
0.1µF
VTT
GND
CAVIN
47µF
VTT
CTT
220µF
CPVIN
47µF
Figure 15. Typical Application Circuit
PCB Layout Considerations
The CM3106-12SB has a heat spreader attached to
the underneath of the PSOP-8 package in order for
heat to be transferred much easier from the package to
the PCB. The heat spreader is a copper pad of dimensions just smaller than the package itself. By positioning the matching pad on the PCB top layer to connect
to the spreader during manufacturing, the heat will be
transferred between the two pads. The drawing below
shows the recommended PCB layout. Note that there
are six vias on either side to allow the heat to dissipate
into the ground and power planes on the inner layers of
the PCB. Vias can be placed underneath the chip, but
this can cause blockage of the solder. The ground and
power planes should be at least 2 sq in. of copper by
the vias. It also helps dissipation to spread if the chip is
positioned away from the edge of the PCB, and not
near other heat dissipating devices. A good thermal
link from the PCB pad to the rest of the PCB will ensure
a thermal link from the CM3106 package to ambient,
θ JA, of around 40°C/W.
Figure 16. Recommended Heat Sink PCB Layout
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
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CM3106
Mechanical Details
The CM3106 is available in an 8-lead SOIC and PSOP
package.
Mechanical Package Diagrams
SOIC-8 Mechanical Specifications
TOP VIEW
Dimensions for CM3106 devices packaged in 8-pin
SOIC packages are presented below.
D
8
7
6
5
For complete information on the SOIC-8 package, see
the California Micro Devices SOIC Package Information document.
H
Pin 1
Marking
E
PACKAGE DIMENSIONS
Package
SOIC
Leads
Dimensions
1
3
4
8
Millimeters
Inches
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.19
0.150
0.165
e
2
1.27 BSC
SIDE VIEW
A
A1
SEATING
PLANE
B
END VIEW
0.050 BSC
H
5.80
6.20
0.228
0.244
L
0.40
1.27
0.016
0.050
# per tube
100 pieces*
# per tape
and reel
2500 pieces
e
C
L
Controlling dimension: inches
Package Dimensions for SOIC-8
* This is an approximate number which may vary.
© 2004 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
02/02/04
CM3106
Mechanical Details
PSOP-8 Mechanical Specifications
Dimensions for CM3106 devices packaged in 8-pin
PSOP packages with an intagrated heatslug are presented below.
Mechanical Package Diagrams
TOP VIEW
D
8
7
6
5
PACKAGE DIMENSIONS
Package
PSOP-8
Leads
8
Dimensions
Millimeters
Inches
H
Min
Max
Min
Max
A
1.30
1.62
0.051
0.064
A1
0.03
0.10
0.001
0.004
B
0.33
0.51
0.013
0.020
C
0.18
0.25
0.007
0.010
D
4.83
5.00
0.190
0.197
E
3.81
3.99
0.150
0.157
e
1.02
1.52
0.040
0.060
H
5.79
6.20
0.228
0.244
L
0.41
1.27
0.016
0.050
x**
3.30
3.81
0.130
0.150
y**
2.29
2.79
0.090
0.110
# per tube
100 pieces*
# per tape
and reel
2500 pieces
Pin 1
Marking
1
2
3
E
4
BOTTOM VIEW
D
1
2
3
4
Heat Slug
x
H y
E
x/2
8
7
y/2
6
5
Controlling dimension: inches
SIDE VIEW
* This is an approximate number which may vary.
** Centered on package centerline.
A
A1
SEATING
PLANE
B
e
END VIEW
C
L
Package Dimensions for PSOP-8
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
11