Material Content Data Sheet Sales Product Name IFX1963TEV Issued MA# MA001083988 Package PG-TO252-5-11 29. August 2013 Weight* 365.15 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 4.428 1.21 0.205 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.21 12128 12128 560 0.061 0.02 204.243 55.94 56.02 559346 168 560074 0.195 0.05 0.05 535 535 0.295 0.08 807 13.548 3.71 133.423 36.54 40.33 365397 403308 5.072 1.39 1.39 13892 13892 0.076 0.02 0.000 0.00 0.090 0.02 0.072 0.02 3.436 0.94 37104 209 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 210 197 0.98 Important Remarks: 1. 1 246 9410 9853 1000000