MURS120T3G Series, SURS8120T3G Series Surface Mount Ultrafast Power Rectifiers MURS105T3G, MURS110T3G, MURS115T3G, MURS120T3G, MURS140T3G, MURS160T3G, SURS8105T3G, SURS8110T3G, SURS8115T3G, SURS8120T3G, SURS8140T3G, SURS8160T3G www.onsemi.com ULTRAFAST RECTIFIERS 1.0 AMPERE, 50−600 VOLTS Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.71 to 1.05 V Max @ 1.0 A, TJ = 150°C) NRVUS and SURS8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 95 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Rating: ♦ Human Body Model = 3B (> 8 kV) ♦ Machine Model = C (> 400 V) SMB CASE 403A MARKING DIAGRAM AYWW U1x G G A Y WW U1 = = = = Assembly Location* Year Work Week Device Code x = A, B, C, D, G, or J G = Pb−Free Package (Note: Microdot may be in either location) * The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank. ORDERING INFORMATION See detailed ordering and shipping information in the table on page 2 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking table on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2016 October, 2016 − Rev. 13 1 Publication Order Number: MURS120T3/D MURS120T3G Series, SURS8120T3G Series MAXIMUM RATINGS MURS/SURS8 Symbol 105T3 110T3 115T3 Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 50 100 150 Average Rectified Forward Current IF(AV) 1.0 @ TL = 155°C 2.0 @ TL = 145°C 1.0 @ TL = 150°C 2.0 @ TL = 125°C A Non−Repetitive Peak Surge Current, (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 40 35 A Rating Operating Junction Temperature 120T3 140T3 160T3 Unit 200 400 600 V *65 to +175 TJ °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS MURS/SURS8 Rating Symbol Thermal Resistance Junction−to−Lead (TL = 25°C) 105T3 115T3 110T3 120T3 140T3 160T3 Unit °C/W RqJL 13 ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 1) (iF = 1.0 A, TJ = 25°C) (iF = 1.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) trr Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) tfr Typical Peak Reverse Recovery Current (IF = 1.0 A, di/dt = 50 A/ms) V 0.875 0.71 1.25 1.05 2.0 50 5.0 150 35 25 75 50 25 50 0.75 1.60 mA ns ns IRM A 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. DEVICE MARKING AND ORDERING INFORMATION Marking Package Shipping† MURS105T3G, SURS8105T3G* U1A SMB (Pb−Free) 2,500 Units / Tape & Reel MURS110T3G, NRVUS110VT3G* SURS8110T3G* U1B SMB (Pb−Free) 2,500 Units / Tape & Reel MURS115T3G, SURS8115T3G* U1C SMB (Pb−Free) 2,500 Units / Tape & Reel MURS120T3G, NRVUS120VT3G* SURS8120T3G* U1D SMB (Pb−Free) 2,500 Units / Tape & Reel MURS140T3G, SURS8140T3G* U1G SMB (Pb−Free) 2,500 Units / Tape & Reel MURS160T3G, NRVUS160VT3G* SURS8160T3G* U1J SMB (Pb−Free) 2,500 Units / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NRVUS and SURS8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. www.onsemi.com 2 MURS120T3G Series, SURS8120T3G Series MURS105T3G, MURS110T3G, MURS115T3G, MURS120T3G, SURS8105T3G, SURS8110T3G, SURS8115T3G, SURS8120T3G 10 IR, REVERSE CURRENT (m A) 7.0 5.0 3.0 i , INSTANTANEOUS FORWARD CURRENT (AMPS) F 175°C 100°C 2.0 TC = 25°C 1.0 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 TJ = 175°C TJ = 100°C 0.08 0.04 0.02 0.008 0.004 0.002 0.7 TJ = 25°C 0 20 40 0.5 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current* *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied VR is sufficiently below rated VR. 0.3 0.2 50 0.1 45 0.07 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF C, CAPACITANCE (pF) 40 0.05 0.03 0.02 35 30 25 20 15 10 0.01 5.0 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 0 0 vF, INSTANTANEOUS VOLTAGE (VOLTS) 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage 10 RATED VOLTAGE APPLIED RqJC = 13°C/W TJ = 175°C 9.0 8.0 7.0 6.0 5.0 4.0 DC 3.0 2.0 SQUARE WAVE 1.0 0 80 90 100 110 120 130 140 150 160 170 180 PF(AV) , AVERAGE POWER DISSIPATION (WATTS) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 3. Typical Capacitance 5.0 TJ = 175°C 4.0 5.0 I 10 (CAPACITANCELOAD) PK + 20 I 3.0 AV 2.0 DC SQUARE WAVE 1.0 0 0 0.5 1.0 1.5 2.0 TC, CASE TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating, Case Figure 5. Power Dissipation www.onsemi.com 3 2.5 MURS120T3G Series, SURS8120T3G Series MURS140T3G, MURS160T3G, SURS8140T3G, SURS8160T3G 10 IR, REVERSE CURRENT (m A) 7.0 175°C 5.0 100°C 3.0 i , INSTANTANEOUS FORWARD CURRENT (AMPS) F TC = 25°C 2.0 1.0 0.7 400 200 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 0.08 0.04 0.02 0.008 0.004 TJ = 175°C TJ = 100°C TJ = 25°C 0 100 200 0.5 300 400 500 600 700 VR, REVERSE VOLTAGE (VOLTS) Figure 7. Typical Reverse Current* *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied VR is sufficiently below rated VR. 0.3 0.2 25 0.1 0.07 NOTE: TYPICAL CAPACITANCE AT 0 V = 24 pF C, CAPACITANCE (pF) 20 0.05 0.03 0.02 15 10 5.0 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 0 0 vF, INSTANTANEOUS VOLTAGE (VOLTS) 4.0 8.0 12 16 20 24 28 32 36 40 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Typical Forward Voltage 10 RATED VOLTAGE APPLIED RqJC = 13°C/W TJ = 175°C 9.0 8.0 7.0 6.0 5.0 4.0 DC 3.0 2.0 SQUARE WAVE 1.0 0 0 20 40 60 80 100 120 140 160 180 200 PF(AV) , AVERAGE POWER DISSIPATION (WATTS) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 8. Typical Capacitance 5.0 4.0 5.0 10 (CAPACITANCE LOAD) I PK + 20 I SQUARE WAVE AV 3.0 DC TJ = 175°C 2.0 1.0 0 0 0.5 1.0 1.5 2.0 TC, CASE TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Current Derating, Case Figure 10. Power Dissipation www.onsemi.com 4 2.5 MURS120T3G Series, SURS8120T3G Series PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE J HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.95 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.30 2.47 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.077 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.091 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.097 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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