TI LMH0002 Lmh0002 smpte 292m / 259m serial digital cable driver Datasheet

LMH0002
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SNLS215E – JANUARY 2006 – REVISED APRIL 2013
LMH0002 SMPTE 292M / 259M Serial Digital Cable Driver
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FEATURES
APPLICATIONS
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2
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SMPTE 292M, SMPTE 344M and SMPTE 259M
Compliant
Supports DVB-ASI at 270 Mbps
Data Rates to 1.485 Gbps
Differential Input
75Ω Differential Output
Selectable Slew Rate
Adjustable Output Amplitude
Single 3.3V Supply Operation
Operating Temperature Range: Commercial
0°C to +70°C (LMH0002MA) or Industrial −40°C
to +85°C (LMH0002TMA and LMH0002SQ)
Typical Power Consumption: 125 mW in SD
Mode and 149 mW in HD Mode
8–pin SOIC or 16–pin WQFN Package
Replaces the GS1528, GS1528A, or GS1578A
•
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SMPTE 292M, SMPTE 344M, and SMPTE 259M
Serial Digital Interfaces
Sonet/SDH and ATM Interfaces
Digital Routers and Switches
Distribution Amplifiers
Buffer Applications
Set Top Boxes
Security Cameras
DESCRIPTION
The LMH0002 SMPTE 292M / 259M serial digital
cable driver is a monolithic, high-speed cable driver
designed for use in SMPTE 292M / 259M serial
digital video and ITU-T G.703 serial digital data
transmission applications. The LMH0002 drives 75Ω
transmission lines (Belden 8281, Belden 1694A or
equivalent) at data rates up to 1.485 Gbps.
The LMH0002 provides two selectable slew rates for
SMPTE 259M and SMPTE 292M compliance. The
output voltage swing is adjustable via a single
external resistor.
The LMH0002 is powered from a single 3.3V supply.
Power consumption is typically 125 mW in SD mode
and 149 mW in HD mode. The LMH0002 is available
in an 8-pin SOIC or 16-pin WQFN package.
Typical Application
VCC
75:
SD/HD
VCC
75:
0.1 PF
5.6 nH
4.7 PF
1.0 PF
SDI VCC
SD/HD
50:
LMH0002
RREF
Differential
Input
1.0 PF
50:
75:
SDO
SDO
75:
4.7 PF
SDI
VEE
VCC
5.6 nH
0.1 PF
750:
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2013, Texas Instruments Incorporated
LMH0002
SNLS215E – JANUARY 2006 – REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
−0.5V to 3.6V
Supply Voltage:
−0.3V to VCC+0.3V
Input Voltage (all inputs)
Output Current
28 mA
−65°C to +150°C
Storage Temperature Range
Junction Temperature
+150°C
Lead Temperature (Soldering 4 Sec)
+260°C
Package Thermal Resistance
θJA 8-pin SOIC
θJA 16-pin WQFN
θJC 8-pin SOIC
θJC 16-pin WQFN
+160°C/W
+78.9°C/W
+105°C/W
+42.7°C/W
ESD Rating (HBM)
5kV
ESD Rating (MM)
(1)
250V
"Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – VEE):
3.3V ±5%
Operating Free Air Temperature (TA)
LMH0002MA
LMH0002TMA and LMH0002SQ
2
0°C to +70°C
−40°C to +85°C
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DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2).
Symbol Parameter
VCMIN
Input Common Mode Voltage
VSDI
Input Voltage Swing
Conditions
Reference
SDI, SDI
Typ
1.6 +
VSDI/2
Differential
100
VCMOUT Output Common Mode Voltage
VSDO
Min
SDO, SDO
Output Voltage Swing
SD/HD Input Voltage
Max
Units
VCC –
VSDI/2
V
2000
mVP−P
VCC –
VSDO
V
Single-ended, 75Ω load,
RREF = 750Ω 1%
750
800
850
mVP-P
Single-ended, 75Ω load,
RREF = 590Ω 1%
900
1000
1100
mVP-P
Min for SD
SD/HD
2.4
V
Max for HD
SD/HD Input Current
ICC
(1)
(2)
(3)
0.8
V
3.7
Supply Current
µA
SD/HD = 0 (3)
45
49
mA
SD/HD = 1 (3)
38
43
mA
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3V and TA = +25°C.
Maximum ICC is measured at VCC = +3.465V and TA = +70°C.
AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1).
Symbol
Parameter
Conditions
DRSDI
Input Data Rate
.
tjit
Additive Jitter
1.485 Gbps
tr,tf
Output Rise Time, Fall Time
Reference
(2)
SDO, SDO
Typ
Max
Units
1485
Mbps
26
psP-P
270 Mbps
18
SD/HD = 0, 20% – 80%, (3)
120
220
ps
560
800
ps
SD/HD = 1, 20% – 80%
400
(2)
psP-P
Mismatch in Rise/Fall Time
.
30
ps
Duty Cycle Distortion
SD/HD = 0,
(2)
30
ps
SD/HD = 1,
(2)
100
ps
tOS
Output Overshoot
.
(2)
RLSDO
Output Return Loss
.
(4)
(1)
(2)
(3)
(4)
Min
SDI, SDI
8
15
20
%
dB
Typical values are stated for VCC = +3.3V and TA = +25°C.
Specification is ensured by characterization.
Specification is ensured by characterization and verified by test.
Output return loss is dependent on board design. The LMH0002 meets this specification on the SD002 evaluation board from 5MHz to
1.5GHz.
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1
2
3
4
SDI
SDI
VEE
RREF
LMH002MA
CONNECTION DIAGRAM
SDO
SDO
SD/HD
VCC
8
7
6
5
VEE
3
RREF
4
NC
NC
NC
13
LMH0002SQ
(top view)
5
6
7
8
NC
2
14
NC
SDI
15
NC
1
16
NC
SDI
NC
Figure 1. 8-Pin SOIC
See D Package
12
SDO
11
SDO
10
SD/HD
9
VCC
Figure 2. 16-Pin WQFN
See RUM0016A Package
Table 1. PIN DESCRIPTIONS
SOIC
Pin #
WQFN
Pin #
1
1
SDI
Serial data true input.
2
2
SDI
Serial data complement input.
3
3
VEE
Negative power supply (ground).
4
4
RREF
Output driver level control. Connect a resistor to VCC to set output voltage swing.
5
9
VCC
Positive power supply (+3.3V).
6
10
SD/HD
Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and
SMPTE 259M when high.
7
11
SDO
Serial data complement output.
8
12
SDO
Serial data true output.
—
—
4
Name
5, 6, 7, 8, NC
13, 14, 15,
16
DAP
VEE
Description
No connect.
Connect exposed DAP to negative power supply (ground).
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LMH0002
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SNLS215E – JANUARY 2006 – REVISED APRIL 2013
APPLICATION INFORMATION
Device Operation
INPUT INTERFACING
The LMH0002 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple AC
or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. SDI and SDI are selfbiased at approximately 2.1V with VCC = 3.3V. Figure 3 shows the differential input stage for SDI and SDI.
VCC
SDI
SDI
VCC
5 k:
10 k:
80:
10 k:
10 k:
Figure 3. Differential Input Stage for SDI and SDI.
OUTPUT INTERFACING
The LMH0002 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75Ω AC-coupled
coaxial cable (with RREF = 750Ω). Output level is controlled by the value of the RREF resistor connected between
the RREF pin and VCC.
The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane
layers below the RREF network should be removed to minimize parasitic capacitance.
OUTPUT SLEW RATE CONTROL
The LMH0002 output rise and fall times are selectable for either SMPTE 259M or SMPTE 292M compliance via
the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high. For faster rise
and fall times, or SMPTE 292M compliance, SD/HD is set low.
REPLACING THE GENNUM GS1528, GS1528A, and GS1578A
The LMH0002MA is form-fit-function compatible with the Gennum GS1528 and GS1528A. The LMH0002SQ is
form-fit-function compatible with the Gennum GS1578A.
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LMH0002
SNLS215E – JANUARY 2006 – REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
6
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 5
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMH0002MA
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
L002
LMH0002MA/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L002
LMH0002MAX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L002
LMH0002SQ
NRND
WQFN
RUM
16
1000
TBD
Call TI
Call TI
L002
LMH0002SQ/NOPB
ACTIVE
WQFN
RUM
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L002
LMH0002SQ/S250
ACTIVE
WQFN
RUM
16
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L002
LMH0002SQE/NOPB
ACTIVE
WQFN
RUM
16
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L002
LMH0002SQX/NOPB
ACTIVE
WQFN
RUM
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L002
LMH0002TMA
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
L002T
LMH0002TMA/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L002T
LMH0002TMAX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L002T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LMH0002MAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LMH0002SQ
WQFN
RUM
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LMH0002SQ/NOPB
WQFN
RUM
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LMH0002SQ/S250
WQFN
RUM
16
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LMH0002SQE/NOPB
WQFN
RUM
16
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LMH0002SQX/NOPB
WQFN
RUM
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LMH0002TMAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMH0002MAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LMH0002SQ
WQFN
RUM
16
1000
210.0
185.0
35.0
LMH0002SQ/NOPB
WQFN
RUM
16
1000
210.0
185.0
35.0
LMH0002SQ/S250
WQFN
RUM
16
250
210.0
185.0
35.0
LMH0002SQE/NOPB
WQFN
RUM
16
250
210.0
185.0
35.0
LMH0002SQX/NOPB
WQFN
RUM
16
4500
367.0
367.0
35.0
LMH0002TMAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
SQB16A (Rev A)
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