TI1 LM4050BIM3-2.5/NOPB Precision micropower shunt voltage reference Datasheet

Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
LM4050-N/-Q1 Precision Micropower Shunt Voltage Reference
1 Features
3 Description
•
•
•
•
Ideal for space-critical applications, the LM4050-N
precision voltage reference is available in the subminiature (3 mm × 1.3 mm) SOT-23 surface-mount
package. The LM4050-N design eliminates the need
for an external stabilizing capacitor while ensuring
stability with any capacitive load, thus making the
LM4050-N easy to use. Further reducing design effort
is the availability of several fixed reverse breakdown
voltages: 2.048 V, 2.5 V, 4.096 V, 5 V, 8.192 V, and
10 V. The minimum operating current increases from
60 μA for the LM4050-N-2.0 to 100 μA for the
LM4050-N-10.0. All versions have a maximum
operating current of 15 mA.
1
•
Small Package: SOT-23
No Output Capacitor Required
Tolerates Capacitive Loads
Fixed Reverse Breakdown Voltages of 2.048 V,
2.5 V, 4.096 V, 5 V, 8.192 V, and 10 V
Key Specifications (LM4050-N)
– Output Voltage Tolerance (A Grade, 25°C)
±0.1% (Maximum)
– Low Output Noise (10 Hz to 10 kHz) 41 μVrms
(Typical)
– Wide Operating Current Range 60 μA to 15
mA
– Industrial Temperature Range −40°C to 85°C
– Extended Temperature Range −40°C to 125°C
– Low Temperature Coefficient 50 ppm/°C (max)
– LM4050-N-Q1 is AEC-Q100 Grade 1 Qualified
and are Manufactured on an Automotive
Grade Flow
All grades and voltage options of the LM4050-N are
available in both an industrial temperature range
(−40°C and 85°C) and an extended temperature
range (−40°C and 125°C).
2 Applications
•
•
•
•
•
•
•
•
The LM4050-N utilizes fuse and Zener-zap reverse
breakdown voltage trim during wafer sort to ensure
that the prime parts have an accuracy of better than
±0.1% (A grade) at 25°C. Bandgap reference
temperature drift curvature correction and low
dynamic
impedance
ensure
stable
reverse
breakdown voltage accuracy over a wide range of
operating temperatures and currents.
Portable, Battery-Powered Equipment
Data Acquisition Systems
Instrumentation
Process Control
Energy Management
Product Testing
Automotive
Precision Audio Components
Device Information(1)
PART NUMBER
LM4050-N
LM4050-N-Q1
PACKAGE
SOT-23 (3)
BODY SIZE (NOM)
2.92 mm × 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Shunt Regulator Schematic
IQ+IL
IL
Vout
Vs
Rs
Cathode
Anode
IQ
Cout
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
7
8
1
1
1
2
3
3
Absolute Maximum Ratings ...................................... 3
ESD Ratings.............................................................. 3
Recommended Operating Conditions ...................... 4
Thermal Information .................................................. 4
Electrical Characteristics: 2-V Option ....................... 5
Electrical Characteristics: 2.5-V Option .................... 6
Electrical Characteristics: 4.1-V Option .................... 7
Electrical Characteristics: 5-V Option ...................... 8
Electrical Characteristics: 8.2-V Option ................... 9
Electrical Characteristics: 10-V Option ................ 10
Typical Characteristics .......................................... 11
Parameter Measurement Information ................ 12
Detailed Description ............................................ 13
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
13
13
13
13
Application and Implementation ........................ 14
9.1 Application Information............................................ 14
9.2 Typical Applications ................................................ 15
10 Power Supply Recommendations ..................... 21
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 22
12.1
12.2
12.3
12.4
12.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
22
22
22
22
22
13 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (June 2015) to Revision G
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
•
Removed Vapor Phase and Infrared Lead Temperatures from Abs Max Ratings table. ...................................................... 3
Changes from Revision E (April 2013) to Revision F
Page
•
Deleted "-25" from (LM4050-N) in Key Specifications title and "A/-Q1B/-Q1C" from Key Specification re: auto grade ........ 1
•
Added Maximum Junction Temperature to Abs Max Ratings table ...................................................................................... 3
•
Added table notes to Operating Ratings table to clarify operating and high junction temperature ranges ............................ 4
•
Deleted "-N" from part numbers in EC table "Limits" column headers .................................................................................. 5
Changes from Revision D (April 2013) to Revision E
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 20
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
5 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View
*This pin must be left floating or connected to pin 2.
Pin Functions
PIN
NAME
I/O
NO.
DESCRIPTION
Cathode
1
I/O
Shunt current and input voltage
Anode
2
O
Common pin, normally connected to ground
NC
3
—
No internal connection
6 Specifications
6.1 Absolute Maximum Ratings
See
(1) (2)
,
MAX
UNIT
Reverse Current
MIN
20
mA
Forward Current
10
mA
280
mW
150
°C
150
°C
Power Dissipation (TA = 25°C)
(3)
Maximum Junction Temperature
(4)
Storage Temperature
(1)
(2)
(3)
(4)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N,
TJmax = 150°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package.
High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
Machine model (MM)
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
3
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Industrial Temperature Range
Extended Temperature Range
(1)
(2)
(1) (2)
MIN
MAX
UNIT
Ambient Temperature Range
–40
85
°C
Junction Temperature Range
–40
85
°C
Ambient Temperature Range
–40
125
°C
Junction Temperature
–40
125
°C
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N,
TJmax = 150°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package.
Recommended Operating Conditions are conditions under the device is intended to be functional. For specifications and conditions, see
Electrical Characteristics section.
6.4 Thermal Information
LM4050-N/-Q1
THERMAL METRIC (1)
DBZ (SOT-23)
UNIT
3 PINS
RθJA
Junction-to-ambient thermal resistance
287
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
106.6
°C/W
RθJB
Junction-to-board thermal resistance
57.7
°C/W
ψJT
Junction-to-top characterization parameter
5.5
°C/W
ψJB
Junction-to-board characterization parameter
56.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
6.5 Electrical Characteristics: 2-V Option
All other limits TA = TJ = 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2%, and 0.5% respectively.
PARAMETER
TEST CONDITIONS
Reverse Breakdown Voltage
IR = 100 μA
IR = 100 μA
VR
Reverse breakdown voltage
tolerance (3)
Industrial temperature range
TA = TJ = TMIN to TMAX
Extended temperature range
TA = TJ = TMIN to TMAX
MIN (1)
TYP (2)
2.048
±2.048
LM4050BIM3, LM4050BEM3
±4.096
LM4050CIM3, LM4050CEM3
±1024
LM4050AIM3, LM4050AEM3
±9.0112
LM4050BIM3, LM4050BEM3
±11.4688
LM4050CIM3, LM4050CEM3
±14.7456
LM4050AIM3, LM4050AEM3
±12.288
LM4050BIM3, LM4050BEM3
±14.7456
Minimum operating current
ΔVR/ΔT
Average reverse breakdown
voltage temperature
coefficient (3)
TA = TJ = 25°C
ΔVR/ΔIR
Reverse breakdown voltage
change with operating current
change (4)
60
65
IR = 10 mA
±20
IR = 1 mA
±15
IR = 100 μA, TA = TJ = 25°C
±15
IR = 100 μA,
TA = TJ = TMIN to TMAX
μA
ppm/°C
±50
0.3
IRMIN ≤ IR ≤ 1 mA,
TA = TJ = TMIN to TMAX
1 mA ≤ IR ≤ 15 mA, TA = TJ = 25°C
mV
±17.2032
41
TA = TJ = TMIN to TMAX
IRMIN ≤ IR ≤ 1 mA, TA = TJ = 25°C
UNIT
V
LM4050AIM3, LM4050AEM3
LM4050CIM3, LM4050CEM3
IRMIN
MAX (1)
0.8
1.2
2.3
1 mA ≤ IR ≤ 15 mA,
TA = TJ = TMIN to TMAX
6
mV
8
ZR
Reverse dynamic impedance
IR = 1 mA, f = 120 Hz, IAC = 0.1 IR
0.3
Ω
eN
Wideband noise
IR = 100 μA, 10 Hz ≤ f ≤ 10 kHz
34
μVrms
ΔVR
Reverse breakdown voltage
long term stability
t = 1000 hrs, T = 25°C ±0.1°C, IR = 100 μA
120
ppm
ΔT = −40°C to 125°C
0.7
mV
VHYST
(1)
(2)
(3)
(4)
(5)
Thermal hysteresis
(5)
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
Typicals are at TJ = 25°C and represent most likely parametric norm.
The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
5
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
6.6 Electrical Characteristics: 2.5-V Option
All other limits TA = TJ = 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2%, and 0.5% respectively.
PARAMETER
MIN (1)
TEST CONDITIONS
IR = 100 μA
Reverse breakdown voltage
VR
TYP (2)
2.500
LM4050AIM3, LM4050AEM3
IR = 100 μA
Industrial temperature range,
TA = TJ = TMIN to TMAX
Reverse breakdown voltage
tolerance (3)
Extended temperature range,
TA = TJ = TMIN to TMAX
Minimum operating current
V
LM4050BIM3, LM4050BEM3
±5
LM4050CIM3, LM4050CEM3
±13
LM4050AIM3, LM4050AEM3
±11
LM4050BIM3, LM4050BEM3
±24
LM4050CIM3, LM4050CEM3
±21
LM4050AIM3, LM4050AEM3
±15
LM4050BIM3, LM4050BEM3
±18
TA = TJ = 25°C
UNIT
±2.5
LM4050CIM3, LM4050CEM3
IRMIN
MAX (1)
mV
mV
±25
41
TA = TJ = TMIN to TMAX
60
65
IR = 10 mA
±20
IR = 1 mA
±15
IR = 100 μA, TA = TJ = 25°C
±15
μA
ΔVR/ΔT
Average reverse breakdown
voltage temperature coefficient (3)
IRMIN ≤ IR ≤ 1 mA, TA = TJ = 25°C
ΔVR/ΔIR
Reverse breakdown voltage
change with operating current
change (4)
Reverse breakdown voltage
change with operating current
change (4)
1 mA ≤ IR ≤ 15 mA, TA = TJ = 25°C
ΔVR/ΔIR
ZR
Reverse dynamic impedance
IR = 1 mA, f = 120 Hz, IAC = 0.1 IR
0.3
Ω
eN
Wideband noise
IR = 100 μA, 10 Hz ≤ f ≤ 10 kHz
41
μVrms
ΔVR
Reverse breakdown voltage long
term stability
120
ppm
07
mV
IR = 100 μA, TA = TJ = TMIN to TMAX
VHYST
(1)
(2)
(3)
(4)
(5)
6
Thermal hysteresis
(5)
ppm/°C
±50
0.3
IRMIN ≤ IR ≤ 1 mA
TA = TJ = TMIN to TMAX
0.8
1.2
2.3
1 mA ≤ IR ≤ 15 mA,
TA = TJ = TMIN to TMAX
6
8
t = 1000 hrs, T = 25°C ±0.1°C, IR = 100 μA
ΔT = −40°C to 125°C
mV
mV
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
Typicals are at TJ = 25°C and represent most likely parametric norm.
The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
6.7 Electrical Characteristics: 4.1-V Option
All other limits TA = TJ = 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2%, and 0.5% respectively.
PARAMETER
Reverse Breakdown Voltage
TEST CONDITIONS
IR = 100 μA
IR = 100 μA
VR
Reverse Breakdown Voltage
Tolerance (2)
Industrial temperature range,
TA = TJ = TMIN to TMAX
Extended temperature range,
TA = TJ = TMIN to TMAX
MIN
TYP (1)
±4.1
LM4050BIM3,LM4050BEM3
±8.2
LM4050CIM3, LM4050CEM3
±21
LM4050AIM3, LM4050AEM3
±18
LM4050BIM3,LM4050BEM3
±22
LM4050CIM3, LM4050CEM3
±34
LM4050AIM3, LM4050AEM3
±25
LM4050BIM3,LM4050BEM3
±29
TA = TJ = 25°C
Minimum Operating Current
Average reverse breakdown voltage
temperature coefficient (2)
Industrial temperature range,
TA = TJ = TMIN to TMAX
68
μA
73
78
IR = 10 mA
±30
IR = 1 mA
±20
IR = 100 μA, TA = TJ = 25°C
±20
IR = 100 μA, TA = TJ = TMIN to TMAX
IRMIN ≤ IR ≤ 1 mA, TA = TJ = 25°C
mV
±41
52
Extended temperature range, TA = TJ = TMIN to TMAX
ΔVR/ΔT
UNIT
V
LM4050AIM3, LM4050AEM3
LM4050CIM3, LM4050CEM3
IRMIN
MAX
4.096
ppm/°C
±50
0.2
IRMIN ≤ IR ≤ 1 mA, TA = TJ = TMIN to TMAX
0.9
1.2
ΔVR/ΔIR
Reverse breakdown voltage change
with operating current change (3)
ZR
Reverse dynamic impedance
IR = 1 mA, f = 120 Hz, IAC = 0.1 IR
0.5
Ω
eN
Wideband noise
IR = 100 μA, 10 Hz ≤ f ≤ 10 kHz
93
μVrms
ΔVR
Reverse breakdown voltage long
term stability
120
ppm
1.148
mV
1 mA ≤ IR ≤ 15 mA, TA = TJ = 25°C
2
1 mA ≤ IR ≤ 15 mA, TA = TJ = TMIN to TMAX
VHYST
(1)
(2)
(3)
(4)
Thermal hysteresis
(4)
t = 1000 hrs, T = 25°C ±0.1°C, IR = 100 μA
ΔT = −40°C to 125°C
7
mV
10
Typicals are at TJ = 25°C and represent most likely parametric norm.
The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
7
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
6.8 Electrical Characteristics: 5-V Option
All other limits TA = TJ = 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2% and 0.5% respectively.
PARAMETER
Reverse Breakdown Voltage
IR = 100 μA
IR = 100 μA
VR
Reverse Breakdown Voltage
Tolerance (3)
MIN (1)
TEST CONDITIONS
Industrial Temp. Range
TA = TJ = TMIN to TMAX
Extended Temp. Range
TA = TJ = TMIN to TMAX
TYP (2)
5
±5
LM4050BIM3. LM4050BEM3
±10
LM4050CIM3, LM4050CEM3
±25
LM4050AIM3, LM4050AEM3
±22
LM4050BIM3, LM4050BEM3
±27
LM4050CIM3, LM4050CEM3
±42
LM4050AIM3, LM4050AEM3
±30
LM4050BIM3, LM4050BEM3
±35
IRMIN
Average Reverse Breakdown
Voltage Temperature Coefficient (3)
ΔVR/ΔT
TA = TJ = 25°C
ΔVR/ΔIR
80
Extended Temp. Range
TA = TJ = TMIN to TMAX
90
IR = 10 mA
±30
IR = 1 mA
±20
IR = 100 μA, TA = TJ = 25°C
±20
IRMIN ≤ IR ≤ 1 mA, TA = TJ = 25°C
0.2
IRMIN ≤ IR ≤ 1 mA
TA = TJ = TMIN to TMAX
2
IR = 100 μA
10 Hz ≤ f ≤ 10 kHz
ΔVR
Reverse Breakdown Voltage Long
Term Stability
VHYST
Thermal Hysteresis (5)
(1)
(2)
(3)
(4)
(5)
8
1
8
mV
12
IR = 1 mA, f = 120 Hz
Wideband Noise
ppm/°C
1.4
0.5
IAC = 0.1 IR
eN
μA
±50
1 mA ≤ IR ≤ 15 mA, TA = TJ = 25°C
Reverse Dynamic Impedance
74
Industrial Temp. Range
TA = TJ = TMIN to TMAX
1 mA ≤ IR ≤ 15 mA
TA = TJ = TMIN to TMAX
ZR
mV
±50
56
IR = 100 μA
TA = TJ = TMIN to TMAX
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
UNIT
V
LM4050AIM3, LM4050AEM3
LM4050CIM3, LM4050CEM3
Minimum Operating Current
MAX (1)
Ω
93
μVrms
t = 1000 hrs
T = 25°C ±0.1°C
IR = 100 μA
120
ppm
ΔT = –40°C to 125°C
1.4
mV
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
Typicals are at TJ = 25°C and represent most likely parametric norm.
The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
6.9 Electrical Characteristics: 8.2-V Option
All other limits TA = TJ = 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1% and
±0.2% and 0.5% respectively.
PARAMETER
TEST CONDITIONS
IR = 150 μA
Reverse Breakdown Voltage
IR = 150 μA
VR
Reverse Breakdown Voltage
Tolerance (3)
Industrial Temp. Range
TA = TJ = TMIN to TMAX
Extended Temp. Range
TA = TJ = TMIN to TMAX
MIN (1)
TYP (2)
ΔVR/ΔT
Average Reverse Breakdown
Voltage Temperature Coefficient
(3)
±8.2
LM4050BIM3, LM4050BEM3
±16
LM4050CIM3, LM4050CEM3
±41
LM4050AIM3, LM4050AEM3
±35
LM4050BIM3, LM4050BEM3
±43
LM4050CIM3, LM4050CEM3
±68
LM4050AIM3, LM4050AEM3
±49
LM4050BIM3, LM4050BEM3
±57
ΔVR/ΔIR
95
Extended Temp. Range
TA = TJ = TMIN to TMAX
100
IR = 10 mA
±40
IR = 1 mA
±20
IR = 150 μA, TA = TJ = 25°C
±20
0.6
IRMIN ≤ IR ≤ 1 mA
TA = TJ = TMIN to TMAX
1 mA ≤ IR ≤ 15 mA, TA = TJ = 25°C
eN
ΔVR
VHYST
(1)
(2)
(3)
(4)
(5)
μA
ppm/°C
±50
1.3
2.5
7
1 mA ≤ IR ≤ 15 mA
TA = TJ = TMIN to TMAX
ZR
91
Industrial Temp. Range
TA = TJ = TMIN to TMAX
IRMIN ≤ IR ≤ 1 mA, TA = TJ = 25°C
mV
±82
74
IR = 150 μA
TA = TJ = TMIN to TMAX
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
V
LM4050AIM3, LM4050AEM3
TA = TJ = 25°C
Minimum Operating Current
UNIT
8.192
LM4050CIM3, LM4050CEM3
IRMIN
MAX (1)
mV
10
18
Reverse Dynamic Impedance
IR = 1 mA, f = 120 Hz,
IAC = 0.1 IR
0.6
Ω
Wideband Noise
IR = 150 μA
10 Hz ≤ f ≤ 10 kHz
150
μVrms
Reverse Breakdown Voltage Long
Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 150 μA
120
ppm
Thermal Hysteresis
ΔT = −40°C to 125°C
2.3
mV
(5)
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
Typicals are at TJ = 25°C and represent most likely parametric norm.
The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
9
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
6.10 Electrical Characteristics: 10-V Option
All other limits TA = TJ = 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1% and
±0.2% and 0.5% respectively.
PARAMETER
IR = 150 μA
Reverse Breakdown Voltage
IR = 150 μA
VR
MIN (1)
TEST CONDITIONS
Reverse Breakdown Voltage
Tolerance (3)
Industrial Temp. Range
TA = TJ = TMIN to TMAX
Extended Temp. Range
TA = TJ = TMIN to TMAX
Minimum Operating Current
ΔVR/ΔT
Average Reverse Breakdown
Voltage Temperature Coefficient
(3)
±10
LM4050BIM3, LM4050BEM3
±20
LM4050CIM3, LM4050CEM3
±50
LM4050AIM3, LM4050AEM3
±43
LM4050BIM3, LM4050BEM3
±53
LM4050CIM3, LM4050CEM3
±83
LM4050AIM3, LM4050AEM3
±60
LM4050BIM3, LM4050BEM3
±70
LM4050CIM3, LM4050CEM3
±100
80
103
Extended Temp. Range
TA = TJ = TMIN to TMAX
110
μA
IR = 10 mA
±40
IR = 1 mA
±20
IR = 150 μA, TA = TJ = 25°C
±20
0.8
IRMIN ≤ IR ≤ 1 mA
TA = TJ = TMIN to TMAX
1 mA ≤ IR ≤ 15 mA, TA = TJ = 25°C
8
IR = 1 mA, f = 120 Hz,
IAC = 0.1 IR
0.7
eN
Wideband Noise
IR = 150 μA
10 Hz ≤ f ≤ 10 kHz
150
Reverse Breakdown Voltage Long
Term Stability
t = 1000 hrs
T = 25°C ±0.1°C
IR = 150 μA
120
ΔVR
VHYST
Thermal Hysteresis (5)
ΔT = −40°C to 125°C
2.8
(5)
10
12
mV
23
Reverse Dynamic Impedance
(4)
1.5
3.5
ZR
(2)
(3)
ppm/°C
±50
1 mA ≤ IR ≤ 15 mA
TA = TJ = TMIN to TMAX
(1)
mV (max)
100
Industrial Temp. Range
TA = TJ = TMIN to TMAX
IRMIN ≤ IR ≤ 1 mA, TA = TJ = 25°C
Reverse Breakdown Voltage
Change with Operating Current
Change (4)
UNIT
V
LM4050AIM3, LM4050AEM3
IR = 150 μA
TA = TJ = TMIN to TMAX
ΔVR/ΔIR
MAX (1)
10
TA = TJ = 25°C
IRMIN
TYP (2)
Ω
μVrms
ppm
mV
Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
Typicals are at TJ = 25°C and represent most likely parametric norm.
The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔV R/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VR is the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C
B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C
C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
6.11 Typical Characteristics
Figure 1. Output Impedance vs Frequency
Figure 2. Output Impedance vs Frequency
Figure 3. Reverse Characteristics and Minimum Operating
Current
Figure 4. Noise Voltage vs Frequency
Figure 5. Thermal Hysteresis
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
11
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
6.11.1 Start-Up Characteristics
Figure 6. Input Voltage Step Response LM4050-N-2.5
Figure 7. Input Voltage Step Response LM4050-N-5
Figure 8. Input Voltage Step Response LM4050-N-10
7 Parameter Measurement Information
Figure 9. Test Circuit
12
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
8 Detailed Description
8.1 Overview
The LM4050-N device is a precision micropower shunt voltage reference. The part comes in 6 different fixedoutput voltage options for space-constrained applications, removing the need for feedback resistors. The voltage
tolerance accuracies are ±0.1%, ±0.2%, and ±0.5% for Versions A, B, and C, respectively. The LM4050-N comes
in two application versions, Industrial and Extended temperature range, which are operational from –40°C to
85°C and –40°C to 125°C, respectively.
8.2 Functional Block Diagram
8.3 Feature Description
The LM4050-N behaves as a high-precision Zener diode. The voltage is regulated between its cathode and
anode which is dependent on the current being supplied to the cathode. This current is needed for the LM4050-N
to regulate within the specified limits. Refer to the minimum and maximum operating requirements for the specific
voltage option used. The LM4050-N is internally compensated to be stable without the use of an output
capacitor. However, if desired, a bypass capacitor may be used.
8.4 Device Functional Modes
The LM4050-N can only operate in closed loop due to the fact that the feedback resistors are internal to the
device. Additionally, the output voltage cannot be adjusted for the same reason. The output voltage is regulated
in a closed loop, provided the Rs (see Functional Block Diagram) resistor is sized to deliver the current to the
cathode within the limits specified for the fixed-voltage version being used.
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
13
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LM4050-N is a precision micropower curvature-corrected bandgap shunt voltage reference. For space
critical applications, the LM4050-N is available in the sub-miniature SOT-23 surface-mount package. The
LM4050-N has been designed for stable operation without the need of an external capacitor connected between
the + pin and the − pin. If, however, a bypass capacitor is used, the LM4050-N remains stable. Reducing design
effort is the availability of several fixed reverse breakdown voltages: 2.048 V, 2.5 V, 4.096 V, 5 V, 8.192 V, and
10 V. The minimum operating current increases from 60 μA for the LM4050-N-2.0 to 100 μA for the LM4050-N10.0. All versions have a maximum operating current of 15 mA.
LM4050-Ns in the SOT-23 packages have a parasitic Schottky diode between pin 2 (−) and pin 3 (Die attach
interface contact). Therefore, pin 3 of the SOT-23 package must be left floating or connected to pin 2.
The 4.096-V version allows single 5-V 12-bit ADCs or DACs to operate with an LSB equal to 1 mV. For 12-bit
ADCs or DACs that operate on supplies of 10 V or greater, the 8.192-V version gives 2 mV per LSB.
The typical thermal hysteresis specification is defined as the change in 25°C voltage measured after thermal
cycling. The device is thermal cycled to temperature –40°C and then measured at 25°C. Next the device is
thermal cycled to temperature 125°C and again measured at 25°C. The resulting VOUT delta shift between the
25°C measurements is thermal hysteresis. Thermal hysteresis is common in precision references and is induced
by thermal-mechanical package stress. Changes in environmental storage temperature, operating temperature
and board mounting temperature are all factors that can contribute to thermal hysteresis.
In a conventional shunt regulator application (Figure 10) , an external series resistor (RS) is connected between
the supply voltage and the LM4050-N. RS determines the current that flows through the load (IL) and the
LM4050-N (IQ). Since load current and supply voltage may vary, RS should be small enough to supply at least
the maximum guaranteed IRMIN (spec. table) to the LM4050-N even when the supply voltage is at its minimum
and the load current is at its maximum value. When the supply voltage is at its maximum and IL is at its
minimum, RS should be large enough so that the current flowing through the LM4050-N is less than 15 mA.
RS is determined by the supply voltage, (VS), the load and operating current, (IL and IQ), and the LM4050-N's
reverse breakdown voltage, VR.
V - VR
RS = S
IL + IQ
(1)
14
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
9.2 Typical Applications
9.2.1 Shunt Regulator
IQ+IL
IL
Vout
Vs
Rs
Cathode
IQ
Cout
Anode
Figure 10. Shunt Regulator Schematic
9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters.
Table 1. Design Parameters
DESIGN PARAMETER
VALUE
Output Voltage
2 V, 2.5 V, 4.1 V, 5 V, 8.2 V, 10 V
Minimum Cathode Current
41 µA, 41 µA, 52 µA, 56 µA, 74 µA, 80 µA (Typical) (Respective to Above field)
9.2.1.2 Detailed Design Procedure
RS sets the cathode current of the shunt reference. Ensure that this current is greater than the minimum cathode
current to ensure regulation and less that the maximum reverse current to prevent overheating of the shunt
reference. A suggested good starting value for most designs is from approximately 0.5 mA to 1 mA.
V - Vout
IRMIN < s
< 0.015A
Rs
(2)
9.2.1.3 Application Curve
Figure 11. Reverse Characteristics and Minimum Operating Current
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
15
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
9.2.2 Precision Reference for an Analog-to-Digital Converter
**Ceramic monolithic
*Tantalum
Figure 12. LM4050-N-4.1'S Nominal 4.096 Breakdown Voltage Gives ADC12451 1 MV/LSB
9.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
DESIGN PARAMETER
VALUE
Output Voltage
4.1 V
9.2.2.2 Detailed Design Procedure
Set IQ to approximately 1 mA.
V - Vout
Rs = s
IQ
where
•
16
Rs = 900 Ω, nearest preferred Value = 909 Ω
Submit Documentation Feedback
(3)
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
9.2.3 VOUT Bounded Amplifier
Bounded amplifier reduces saturation-induced delays and can prevent succeeding stage damage. Nominal clamping
voltage is ±11.5 V (LM4050-N's reverse breakdown voltage +2 diode VF).
Figure 13. Bounded Amplifier
9.2.3.1 Design Requirements
The only design requirement is VOUT bounded to ±11.5 V.
9.2.3.2 Detailed Design Procedure
Vbound = 2 ´ Vwd + Vout
(4)
Vf wd = 0.7 V
(5)
Vbound = (2 ´ 0.7 V) + 10 V
(6)
Set IQ to approximately 0.6 mA.
Vs + - Vs - Vout
Rs =
IQ
(7)
30 V - 10 V
Rs =
0.0006A
where
•
RS (total) = 33 kΩ (select 2 × 15 kΩ)
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
(8)
Submit Documentation Feedback
17
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
9.2.4 VIN Bounded Amplifier
The bounding voltage is ±4 V with the LM4050-N-2.5 (LM4050-N's reverse breakdown voltage + 3 diode VF).
Figure 14. Protecting Op Amp Input
9.2.4.1 Design Requirements
The only design requirement is VIN bounded to ±4.6 V.
9.2.4.2 Detailed Design Procedure
Vbound = 3 ´ Vwd + Vout
(9)
Vf wd = 0.7 V
(10)
Vbound = (3 ´ 0.7 V) + 2.5 V
(11)
Set IQ to approximately 0.6 mA.
Vs + - Vs - Vout
Rs =
IQ
(12)
where
•
18
RS (total) = 12.5 kΩ (select 2 × 5 kΩ)
Submit Documentation Feedback
(13)
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
9.2.5 ±4.096 Precision Reference
Figure 15. Precision ±4.096v Reference
9.2.5.1 Design Requirements
The only design requirement is a positive and negative reference generated from a positive reference, ±4.096 V.
9.2.5.2 Detailed Design Procedure
Follow the design procedure set in Precision Reference for an Analog-to-Digital Converter.
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
19
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
9.2.6 ±1-mA Precision Current Sources
Iout =
Vout
R2
Figure 16. Precision 1-µA to 1-mA Current Source (±)
9.2.6.1 Design Requirements
The only design requirement is a dual ±1-mA current source.
9.2.6.2 Detailed Design Procedure
Set worse-case cathode current to 0.6 mA.
Voutopampmax = 12 V
R1=
(14)
VoutOpampmax - Vout
IQ
(15)
12 V - 2.5 V
R1 =
0.0006A
(16)
4
R1 = 1.583 ´ 10 W
V
Iout = out
R2
20
Submit Documentation Feedback
(17)
(18)
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N, LM4050-N-Q1
www.ti.com
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
10 Power Supply Recommendations
Noise on the power supply input to RS can affect output noise performance. Noise performance can be reduced
by using an optional bypass capacitor at the input side of RS and Ground. TI recommends a 0.1-µF ceramic
capacitor or higher.
11 Layout
11.1 Layout Guidelines
Place RS as close to the cathode as possible. If an input and output capacitor is used, place this as close to the
reference as possible.
11.2 Layout Example
Set Rs Close to Ref
Rs
Vout
Vs
Cathode
Cin
Cout
Anode
Set Cin Close to Ref
Set Cout Close to Ref
Figure 17. Layout Recommendation
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Submit Documentation Feedback
21
LM4050-N, LM4050-N-Q1
SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015
www.ti.com
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM4050-N
Click here
Click here
Click here
Click here
Click here
LM4050-N-Q1
Click here
Click here
Click here
Click here
Click here
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
22
Submit Documentation Feedback
Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Mar-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
LM4050AEM3-10/NOPB
Package Type Package Pins Package
Drawing
Qty
ACTIVE
SOT-23
DBZ
3
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RGA
(4/5)
LM4050AEM3-2.0
NRND
SOT-23
DBZ
3
TBD
Call TI
Call TI
-40 to 125
RNA
LM4050AEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RNA
LM4050AEM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
RCA
LM4050AEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RCA
LM4050AEM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
REA
LM4050AEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
REA
LM4050AEM3-8.2
LIFEBUY
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
RFA
LM4050AEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RFA
LM4050AEM3X-10
NRND
SOT-23
DBZ
3
TBD
Call TI
Call TI
-40 to 125
RGA
LM4050AEM3X-10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RGA
LM4050AEM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RCA
LM4050AEM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
REA
LM4050AIM3-10
LIFEBUY
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RGA
LM4050AIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RGA
LM4050AIM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RCA
LM4050AIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCA
LM4050AIM3-4.1
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RDA
LM4050AIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDA
LM4050AIM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
REA
LM4050AIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REA
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
22-Mar-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050AIM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCA
LM4050AIM3X-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDA
LM4050AIM3X-5.0
NRND
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
REA
LM4050AIM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REA
LM4050BEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RGB
LM4050BEM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
RCB
LM4050BEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RCB
LM4050BEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RDB
LM4050BEM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
REB
LM4050BEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
REB
LM4050BEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RFB
LM4050BEM3X-10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RGB
LM4050BEM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RCB
LM4050BEM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
REB
LM4050BIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RGB
LM4050BIM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RCB
LM4050BIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCB
LM4050BIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDB
LM4050BIM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
REB
LM4050BIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REB
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
22-Mar-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050BIM3X-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RNB
LM4050BIM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCB
LM4050BIM3X-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDB
LM4050BIM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REB
LM4050CEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
RGC
LM4050CEM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 125
RCC
LM4050CEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RCC
LM4050CEM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
REC
LM4050CEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
REC
LM4050CEM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM4050CEM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM4050CIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RGC
LM4050CIM3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RCC
LM4050CIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCC
LM4050CIM3-4.1
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
RDC
LM4050CIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDC
-40 to 125
RCC
REC
LM4050CIM3-5.0
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
REC
LM4050CIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REC
LM4050CIM3X-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RNC
LM4050CIM3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RCC
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
22-Mar-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050CIM3X-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RDC
LM4050CIM3X-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
REC
LM4050QAEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYA
LM4050QAEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSA
LM4050QAEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTA
LM4050QAEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUA
LM4050QAEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVA
LM4050QAEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXA
LM4050QAEM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYA
LM4050QAEM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSA
LM4050QAEM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTA
LM4050QAEM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUA
LM4050QAEM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVA
LM4050QAEM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXA
LM4050QAIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RYA
LM4050QAIM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RSA
LM4050QAIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RTA
LM4050QAIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RUA
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
22-Mar-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050QAIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RVA
LM4050QAIM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RXA
LM4050QAIM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RYA
LM4050QAIM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RSA
LM4050QAIM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RTA
LM4050QAIM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RUA
LM4050QAIM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RVA
LM4050QAIM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RXA
LM4050QBEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYB
LM4050QBEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSB
LM4050QBEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTB
LM4050QBEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUB
LM4050QBEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVB
LM4050QBEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXB
LM4050QBEM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYB
LM4050QBEM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSB
LM4050QBEM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTB
LM4050QBEM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUB
Addendum-Page 5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
22-Mar-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050QBEM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVB
LM4050QBEM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXB
LM4050QBIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RYB
LM4050QBIM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RSB
LM4050QBIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RTB
LM4050QBIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RUB
LM4050QBIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RVB
LM4050QBIM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RXB
LM4050QBIM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RYB
LM4050QBIM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RSB
LM4050QBIM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RTB
LM4050QBIM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RUB
LM4050QBIM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RVB
LM4050QBIM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RXB
LM4050QCEM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYC
LM4050QCEM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSC
LM4050QCEM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTC
LM4050QCEM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUC
Addendum-Page 6
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
22-Mar-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM4050QCEM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVC
LM4050QCEM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXC
LM4050QCEM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RYC
LM4050QCEM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RSC
LM4050QCEM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RTC
LM4050QCEM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RUC
LM4050QCEM3X5.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RVC
LM4050QCEM3X8.2/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
RXC
LM4050QCIM3-10/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RYC
LM4050QCIM3-2.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RSC
LM4050QCIM3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RTC
LM4050QCIM3-4.1/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RUC
LM4050QCIM3-5.0/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RVC
LM4050QCIM3-8.2/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RXC
LM4050QCIM3X10/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RYC
LM4050QCIM3X2.0/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RSC
LM4050QCIM3X2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RTC
LM4050QCIM3X4.1/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
RUC
Addendum-Page 7
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
22-Mar-2016
Status
(1)
LM4050QCIM3X5.0/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
SOT-23
DBZ
3
3000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
RVC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM4050-N, LM4050-N-Q1 :
Addendum-Page 8
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
22-Mar-2016
• Catalog: LM4050-N
• Automotive: LM4050-N-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 9
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
SOT-23
DBZ
3
1000
178.0
8.4
LM4050AEM3-2.0/NOPB SOT-23
LM4050AEM3-10/NOPB
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-5.0/NOPB SOT-23
LM4050AEM3-2.5
LM4050AEM3-5.0
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3-8.2
LM4050AEM3X-10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AEM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-10
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-2.5/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-4.1
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-4.1/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3-5.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
LM4050AIM3-5.0/NOPB
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050AIM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-4.1/NOPB SOT-23
LM4050AIM3X-5.0
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3-5.0
LM4050BEM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3X-10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BEM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-2.5/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-4.1/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-5.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3-5.0/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050BIM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CEM3-5.0
LM4050CIM3-10/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-2.5
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-2.5/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-4.1
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-4.1/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-5.0
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3-5.0/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3X-2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3X-2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3X-4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050CIM3X-5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM4050QAEM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-2.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-2.5/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-4.1/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-5.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3-8.2/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X10/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-2.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-4.1/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QAIM3X8.2/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-2.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-2.5/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-4.1/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-5.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3-8.2/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBEM3X10/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM4050QBEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
LM4050QBEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
178.0
LM4050QBEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
LM4050QBEM3X5.0/NOP
B
SOT-23
DBZ
3
LM4050QBEM3X8.2/NOP
B
SOT-23
DBZ
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-2.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-4.1/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X2.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X2.5/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X4.1/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X5.0/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QBIM3X8.2/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-2.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-2.5/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-4.1/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-5.0/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3-8.2/NOP
B
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X10/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-10/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-2.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-2.5/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM4050QCIM3-4.1/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-5.0/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3-8.2/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X10/NOPB SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X2.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X2.5/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X4.1/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM4050QCIM3X5.0/NOP
B
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050AEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
Pack Materials-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050AEM3-8.2
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AEM3X-10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AEM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AEM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3-10
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-4.1
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050AIM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3X-4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3X-5.0
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050AIM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BEM3X-10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BEM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BEM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050BIM3X-2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BIM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BIM3X-4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050BIM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CEM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CEM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050CIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-2.5
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-4.1
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-5.0
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050CIM3X-2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CIM3X-2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CIM3X-4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050CIM3X-5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAEM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QAIM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QAIM3X8.2/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
Pack Materials-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050QBEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBEM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QBIM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QBIM3X8.2/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCEM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X2.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X2.5/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X4.1/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X5.0/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCEM3X8.2/NOP
B
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3-10/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-2.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-2.5/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-4.1/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-5.0/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM4050QCIM3-8.2/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
Pack Materials-Page 8
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4050QCIM3X10/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X2.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X2.5/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X4.1/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM4050QCIM3X5.0/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 9
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated