TECHNICAL DATA IN74ACT192 Presettable BCD/Decade UP/DOWN Counter High-Speed Silicon-Gate CMOS The IN74ACT192 is identical in pinout to the LS/ALS192, HC/HCT192. The IN74ACT192 may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. The counter has two separate clock inputs, a Count Up Clock and Count Down Clock inputs. The direction of counting is determined by which input is clocked. The outputs change state synchronous with the LOW-to-HIGH transitions on the clock inputs. This counter may be preset by entering the desired data on the P0, P1, P2, P3 input. When the Parallel Load input is taken low the data is loaded independently of either clock input. This feature allows the counters to be used as devide-by-n by modifying the count lenght with the preset inputs. In addition the counter can also be cleared. This is accomplished by inputting a high on the Master Reset input. All 4 internal stages are set to low independently of either clock input.Both a Terminal Count Down (TCD) and Terminal Count Up (TCU) Outputs are provided to enable cascading of both up and down counting functions. The TCD output produces a negative going pulse when the counter underflows and TCU outputs a pulse when the counter overflows. The counter can be cascaded by connecting the TCU and TCD outputs of one device to the Count Up Clock and Count Down Clock inputs, respectively, of the next device. • TTL/NMOS Compatible Input Levels • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 4.5 to 5.5 V • Low Input Current: 1.0 µA; 0.1 µA @ 25°C • Outputs Source/Sink 24 mA ORDERING INFORMATION IN74ACT192N Plastic IN74ACT192D SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM PIN 16 =VCC PIN 8 = GND Rev. 00 IN74ACT192 MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TJ Junction Temperature (PDIP) TA Operating Temperature, All Package Types IOH Output Current - High IOL Output Current - Low tr, tf * Parameter Input Rise and Fall Time (except Schmitt Inputs) * Min Max Unit 4.5 5.5 V 0 VCC V 140 °C +85 °C -24 mA 24 mA 10 8.0 ns/V -40 VCC =4.5 V VCC =5.5 V 0 0 VIN from 0.8 V to 2.0 V This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74ACT192 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limits V 25 °C -40°C to 85°C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V 4.5 5.5 2.0 2.0 2.0 2.0 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V 4.5 5.5 0.8 0.8 0.8 0.8 V VOH Minimum HighLevel Output Voltage IOUT ≤ -50 µA 4.5 5.5 4.4 5.4 4.4 5.4 V 4.5 5.5 3.86 4.86 3.76 4.76 4.5 5.5 0.1 0.1 0.1 0.1 VIN=VIH IOL=24 mA IOL=24 mA 4.5 5.5 0.36 0.36 0.44 0.44 Maximum Input Leakage Current VIN=VCC or GND 5.5 ±0.1 ±1.0 µA IOLD +Minimum Dynamic Output Current VOLD=1.65 V Max 5.5 75 mA IOHD +Minimum Dynamic Output Current VOHD=3.85 V Min 5.5 -75 mA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND 5.5 80 µA * VIN=VIH or VIL IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 µA V * IIN 8.0 * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. FUNCTION TABLE MR PL Inputs CPU H X L L L H L H L H L H X = don’t care X X H H Mode CPD X X H H Reset(Asyn.) Preset(Asyn.) No Count Count Up Count Down No Count The IN74ACT192 can be preset to any state, but will not count beyond 9. If preset to state 10, 11, 12, 13, 14 or 15, it will follow the sequence 10, 11, 6: 12, 13, 4: 14, 15, 2 if counting Up, and follow the sequence 15, 14, 13, 12, 11, 10, 9 if counting Down. Logic equations For Terminal Count: TCU = Q0 • Q3 • CPU TCD = Q0 • Q1 • Q2 • Q3 • CPD Rev. 00 IN74ACT192 AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V ± 10%, CL=50pF,Input tr=tf=3.0 ns) Guaranteed Limits Symbol Parameter 25 °C Min -40°C to 85°C Max Min 100 Unit Max fmax Maximum Clock Frequency (Figure 1) 80 tPLH Propagation Delay, CPU or CPD to TCU or TCD (Figure 2) 15 16.5 ns tPHL Propagation Delay, CPU or CPD to TCU or TCD (Figure 2) 14 15.5 ns tPLH Propagation Delay, CPU or CPD to Qn (Figure 1) 12 13.5 ns tPHL Propagation Delay, CPU or CPD to Qn (Figure 1) 12 13.5 ns tPLH Propagation Delay, Pn to Qn (Figure 3) 12 13.5 ns tPHL Propagation Delay, Pn to Qn (Figure 3) 12 13.5 ns tPLH Propagation Delay, PL to Qn (Figure 4) 12 13.5 ns tPHL Propagation Delay, PL to Qn (Figure 4) 15 16.5 ns tPHL Propagation Delay, MR to Qn (Figure 5) 15 16.5 ns tPLH Propagation Delay, MR to TCU (Figure 6) 14 15.5 ns tPHL Propagation Delay, MR to TCD (Figure 6) 14 15.5 ns tPLH Propagation Delay, PL to TCU or TCD (Figure 6) 15 16.5 ns tPHL Propagation Delay, PL to TCU or TCD (Figure 6) 11 12.5 ns tPLH Propagation Delay, Pn to TCU or TCD (Figure 6) 15 16.5 ns tPHL Propagation Delay, Pn to TCU or TCD (Figure 6) 15 16.5 ns CIN Maximum Input Capacitance 4.5 MHz 4.5 pF Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 45 pF Rev. 00 IN74ACT192 TIMING REQUIREMENTS (CL=50pF, Input tr=tf=3.0 ns, VCC=5.0 V ± 10%) Guaranteed Limits Symbol Parameter 25 °C -40°C to 85°C Unit tsu Minimum Setup Time, Pn to PL (Figure 7) 8 9 ns th Minimum Hold Time, PL to Pn (Figure 7) -1.0 -1.0 ns tw Minimum Pulse Width, PL (Figure 4) 14 15 ns tw Minimum Pulse Width, CPU or CPD (Figure 1) 10 11 ns tw Minimum Pulse Width, MR (Figure 5) 12 14 ns trec Minimum Recovery Time, PL to CPU or CPD (Figure 5) 8 9 ns trec Minimum Recovery Time, MR to CPU or CPD (Figure 5) 14 16 ns Figure 1. Switching Waveforms Figure 3. Switching Waveforms Figure 2. Switching Waveforms Figure 4. Switching Waveforms Rev. 00 IN74ACT192 Figure 5. Switching Waveforms Figure 6. Switching Waveforms Figure 7. Switching Waveforms TIMING DIAGRAM Rev. 00 IN74ACT192 EXPANDED LOGIC DIAGRAM Rev. 00 IN74ACT192 N SUFFIX PLASTIC DIP (MS - 001BB) A Dimension, mm 9 16 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 B 1 8 5.33 C F L C D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 -T- SEATING PLANE N G K M H D J 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AC) Dimension, mm A 16 9 H B 1 G P 8 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 9.8 10 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.72 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 Rev. 00