NCP1240G Product Preview Fixed Frequency Current Mode Controller for Flyback Converters The NCP1240G is a new fixed−frequency current−mode controller featuring the Dynamic Self−Supply. This function greatly simplifies the design of the auxiliary supply and the VCC capacitor by activating the internal startup current source to supply the controller during start−up, transients, latch, stand−by etc. This device contains a special HV detector which detect the application unplug from the AC input line and triggers the X2 discharge current. This HV structure allows the brown−out detection as well. It features a timer−based fault detection that ensures the detection of overload and an adjustable compensation to help keep the maximum power independent of the input voltage. Due to frequency foldback, the controller exhibits excellent efficiency in light load condition while still achieving very low standby power consumption. Internal frequency jittering, ramp compensation, and a versatile latch input make this controller an excellent candidate for the robust power supply designs. A dedicated Off mode allows to reach the extremely low no load input power consumption via “sleeping” whole device and thus minimize the power consumption of the control circuitry. www.onsemi.com MARKING DIAGRAM 8 SOIC−7 CASE 751U 40G065 ALYWX G 1 40G065 = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package PIN CONNECTIONS Latch 1 8 HV 6 VCC FB 2 Features • Fixed−Frequency Current−Mode Operation (65 kHz and 100 kHz • • • • • • • • CS 3 GND 4 5 DRV frequency options) (Top View) Frequency Foldback then Skip Mode for Maximized Performance in Light Load and Standby Conditions Timer−Based Overload Protection with Latched (Option G) ORDERING INFORMATION High−voltage Current Source with Brown−Out Detection and See detailed ordering and shipping information on page 43 of this data sheet. Dynamic Self−Supply, Simplifying the Design of the VCC Circuitry Frequency Modulation for Softened EMI Signature Adjustable Overpower Protection Dependant on the Bulk Voltage Latch−off Input Combined with the Overpower Protection Sensing Input VCC Operation up to 28 V, With Overvoltage Detection Typical Applications 500/800 mA Source/Sink Drive Peak Current • AC−DC Adapters for Notebooks, LCD, and Printers Capability • Offline Battery Chargers 10 ms Soft−Start • Consumer Electronic Power Supplies Internal Thermal Shutdown • Auxiliary/Housekeeping Power Supplies No−Load Standby Power < 30 mW • Offline Adapters for Notebooks X2 Capacitor in EMI Filter Discharging Feature • • • • • These Devices are Pb−Free and Halogen Free/BFR Free This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. P0 1 Publication Order Number: NCP1240G/D NCP1240G GND GND GND VCC 6 DRV 5 + W2 RLOAD W1 4 GND 6 Q1 COUT GND NCP1240 ROPP R4 GND GND 3 CS 4 GND C1 HV 8 RSENSE NTC 2 5 W3 1 LATCH 2 FB C4 CCLAMP RCLAMP CBULK + D5 34 D4 34 IC1 dc output D1 3 D3 D8 D10 CX1 CX2 ac input GND RHV D9 12 L1 1 TR D2 12 L2 D7 D6 TYPICAL APPLICATION EXAMPLE GND 2 PC817 GND GND C3 R1 1 3 IC2 NCP431 R2 C2 R3 OK1 4 GND GND Figure 1. Flyback Converter Application Using the NCP1240G OPTIONS Part Option Frequency OCP Fault NCP1240 G 65 kHz Latched PIN FUNCTION DESCRIPTION Pin No Pin Name Function Pin Description 1 LATCH Latch−Off Input Pull the pin up or down to latch−off the controller. An internal current source allows the direct connection of an NTC for over temperature detection. 2 FB Feedback + Shutdown pin An optocoupler collector to ground controls the output regulation. The part goes to the low consumption Off mode if the FB input pin is pulled to GND. 3 CS Current Sense 4 GND − 5 DRV Drive output 6 VCC VCC input 8 HV High−voltage pin This Input senses the Primary Current for current−mode operation, and offers an overpower compensation adjustment. The controller ground Drives external MOSFET This supply pin accepts up to 28 Vdc, with overvoltage detection. The pin is connected to an external auxiliary voltage. It is not allowed to connect another circuit to this pin to keep low input power consumption. Connects to the rectified AC line to perform the functions of Start−up Current Source, Self−Supply, brown−out detection and X2 capacitor discharge function and the HV sensing for the overpower protection purposes. It is not allowed to connect this pin to DC voltage. www.onsemi.com 2 NCP1240G SIMPLIFIED INTERNAL BLOCK SCHEMATIC Intc Intc Vdd Vhv DC sample HV Brown_Out OVP_CMP SG & X2 & Vcc TSD Dual HV Start−up current source control VCC Vcc_Int UVLO_CMP 9.3V Latch ICstartB Vdd reg ON_CMP Brown_Out 10.8V Q Vcc regulator PowerOnReset_CMP RESET Vdd VccON Reset Qb Vcc(reg) Set VccOFF SS_end UVLO VccRESET 26V OTP 0.4V Votp 1k 350 us Filter 1.2V Vclamp Rclamp OTP_CMP 10 us Filter VccOVP VccOVP LATCH 8 mA VccOVP_CMP 2.5V Vovp AC_Off OVP 50 us Filter 5V 12V VccON RESET STOP_CMP VccMIN 8.4V Off_mode_CMP1 2.2V Set Von VccMIN 5uA VCC ICstart Q Reset Qb Off_mode_CMP2 FB 0.8V OSC 65kHz ton_max output 3.0V PFM input freq folback CSref Saw output Ramp_OTA FBbuffer 4uMho VCC Vskip SkipB 1.4V Skip_CMP Vramp_offset Rfb1 Vfb(reg) Square output FM input jittering Internal resitance 40k Voff GoToOffMode timer 500ms Clamp PWM_CMP Set IC stopB Q PWM Qb LatchB SoftStart_CMP V to I FaultB Reset Brown_OutB Vfb(opc) DRV Division ratio 4 Rfb3 Rfb2 Vhv DC sample MAX_ton Iopc = 0.5u*(Vhv−125) Enable Soft Start timer Vdd SS_end 1uA Itran_CMP Itran Vcs(tran) 0.5V CS Set Reset Ilimit_CMP Q Transient timer up/down Fault Qb MAX_ton Ilimit Set Fault timer Q RESET Fault Qb Latch management GND 0.7V Vilim IC stop Reset Autorecovery timer CSstop_CMP LEB 120ns Brown_Out 1.05V VCSstop 4 events timer TSD Figure 2. Simplified Internal Block Schematic www.onsemi.com 3 TSD Latch NCP1240G MAXIMUM RATINGS Rating Symbol Value Unit –0.3 to 20 ±1000 (peak) V mA VCCPower Supply voltage, VCC pin, continuous voltage Power Supply voltage, VCC pin, continuous voltage (Note 1) –0.3 to 28 ±30 (peak) V mA Maximum voltage on HV pin (Dc−Current self−limited if operated within the allowed range) –0.3 to 500 ±20 V mA Vmax Maximum voltage on low power pins (except pin 5, pin 6 and pin 8) (Dc−Current self−limited if operated within the allowed range) (Note 1) –0.3 to 10 ±10 (peak) V mA RqJ−A Thermal Resistance SOIC−7 Junction-to-Air, low conductivity PCB (Note 2) Junction-to-Air, medium conductivity PCB (Note 3) Junction-to-Air, high conductivity PCB (Note 4) 162 147 115 RqJ−C Thermal Resistance Junction−to−Case 73 °C/W TJMAX Operating Junction Temperature −40 to +150 °C Storage Temperature Range DRV (pin 5) Maximum voltage on DRV pin (Dc−Current self−limited if operated within the allowed range) (Note 1) VCC (pin 6) HV (pin 8) TSTRGMAX °C/W −60 to +150 °C ESD Capability, HBM model (All pins except HV) per JEDEC Standard JESD22, Method A114E > 2000 V ESD Capability, Machine Model per JEDEC Standard JESD22, Method A115A > 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device contains latch-up protection and exceeds 100 mA per JEDEC Standard JESD78. 2. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51-1 conductivity test PCB. Test conditions were under natural convection or zero air flow. 3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51-2 conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51-3 conductivity test PCB. Test conditions were under natural convection or zero air flow. ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, VHV = 125 V, VCC = 11 V unless otherwise noted) Symbol Min Typ Max Unit VHV(min) − 30 40 V VCC = 0 V VCC = VCC(on) − 0.5 V Istart1 Istart2 0.2 5 0.5 8 0.8 11 mA Off−state Leakage Current VHV = 500 V, VCC = 15 V Istart(off) 10 25 50 mA Off−mode HV Supply Current VHV = 141 V, VHV = 325 V, VCC loaded by 4.7 mF cap IHV(off) − − 45 50 60 70 mA HV Current Source Regulation Threshold VCC(reg) 8 11 − V Turn−on Threshold Level, VCC Going Up HV Current Source Stop Threshold VCC(on) 11.0 12.0 13.0 V HV Current Source Restart Threshold VCC(min) 7.8 8.4 9.0 V Turn−off Threshold (Note 5) VCC(off) 8.8 9.3 9.8 V Overvoltage Threshold VCC(ovp) 25 26.5 28 V Characteristics Test Condition HIGH VOLTAGE CURRENT SOURCE Minimum Voltage for Current Source Operation Current Flowing Out of VCC Pin (X2 discharge current value is equal to Istart2) SUPPLY 5. 6. 7. 8. VCC(off) < VCC(min) with the minimum gap 0.5 V. Internal supply current only, currents sourced via FB pin is not included (current is flowing in GND pin only). Guaranteed by design. CS pin source current is a sum of Ibias and IOPC, thus at VHV = 125 V is observed the Ibias only, because IOPC is switched off. www.onsemi.com 4 NCP1240G ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, VHV = 125 V, VCC = 11 V unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit Blanking Duration on VCC(off) and VCC(ovp) Detection tVCC(blank) − 10 − ms VCC Decreasing Level at Which the Internal Logic Resets VCC(reset) 4.8 7.0 7.7 V VCC Level for ISTART1 to ISTART2 Transition VCC(inhibit) 0.2 0.8 1.25 V DRV open, VFB = 3 V, 65 kHz DRV open, VFB = 3 V, 100 kHz ICC1 ICC1 1.3 1.3 1.85 1.85 2.2 2.2 mA Cdrv = 1 nF, VFB = 3 V, 65 kHz Cdrv = 1 nF, VFB = 3 V, 100 kHz ICC2 ICC2 1.8 2.0 2.6 2.9 3.0 3.2 Off mode (skip or before start−up) ICC3 0.5 0.65 0.8 Fault mode (fault or latch) ICC4 0.35 0.5 0.7 VHV going up VHV going down VHV(start) VHV(stop) 102 94 111 103 120 112 V tHV 35 50 75 ms VHV(hyst) 1.5 3.5 5 V Tsample − 1.0 − ms Timer Duration for No Line Detection tDET 43 64 86 ms Discharge Timer Duration tDIS 43 64 86 ms fOSC 58 87 65 100 72 109 kHz SUPPLY Internal Current Consumption (Note 6) BROWN−OUT Brown−Out Thresholds Timer Duration for Line Cycle Drop−out X2 DISCHARGE Comparator Hysteresis Observed at HV Pin HV Signal Sampling Period OSCILLATOR Oscillator Frequency Maximum On Time for TJ = 25°C to +125°C Only fOSC = 65 kHz fOSC = 100 kHz tONmax(65kHz) tONmax(100kHz) 11.5 7.5 12.3 8.0 13.1 8.5 ms Maximum On Time fOSC = 65 kHz fOSC = 100 kHz tONmax(65kHz) tONmax(100kHz) 11.3 7.4 12.3 8.0 13.1 8.5 ms Maximum Duty Cycle (corresponding to maximum on time at maximum switching frequency) fOSC = 65 kHz fOSC = 100 kHz DMAX − 80 − % Frequency Jittering Amplitude, in Percentage of FOSC Ajitter ±3 ±5.5 ±8 % Frequency Jittering Modulation Frequency Fjitter 85 125 165 Hz FREQUENCY FOLDBACK Feedback Voltage Threshold Below Which Frequency Foldback Starts TJ = 25°C VFB(foldS) 2.35 2.5 2.6 V Feedback Voltage Threshold Below Which Frequency Foldback is Complete TJ = 25°C VFB(foldE) 1.4 1.5 1.6 V VFB = Vskip(in) + 0.1 fOSC(min) 23 27 32 kHz VCC = VCC(min) + 0.2 V, CDRV = 1 nF trise − 40 70 ns Minimum Switching Frequency OUTPUT DRIVER Rise Time, 10% to 90% of VCC 5. 6. 7. 8. VCC(off) < VCC(min) with the minimum gap 0.5 V. Internal supply current only, currents sourced via FB pin is not included (current is flowing in GND pin only). Guaranteed by design. CS pin source current is a sum of Ibias and IOPC, thus at VHV = 125 V is observed the Ibias only, because IOPC is switched off. www.onsemi.com 5 NCP1240G ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, VHV = 125 V, VCC = 11 V unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit Fall Time, 90% to 10% of VCC VCC = VCC(min) + 0.2 V, CDRV = 1 nF tfall − 40 70 ns Current Capability VCC = VCC(min) + 0.2 V, CDRV = 1 nF DRV high, VDRV = 0 V DRV low, VDRV = VCC OUTPUT DRIVER mA IDRV(source) IDRV(sink) − − 500 800 − − VCC = VCCmax – 0.2 V, DRV high, RDRV = 33 kW, Cload = 220 pF VDRV(clamp) 11 13.5 16 V VCC = VCC(min) + 0.2 V, RDRV = 33 kW, DRV high VDRV(drop) − − 1 V Input Pull−up Current VCS = 0.7 V Ibias − 1 − mA Maximum Internal Current Setpoint VFB > 3.5 V VILIM 0.66 0.70 0.74 V Propagation Delay from VIlimit Detection to DRV Off VCS = VILIM tdelay − 80 110 ns tLEB 200 250 340 ns Threshold for Fast Fault Protection Activation VCS(stop) 0.95 1.05 1.15 V Leading Edge Blanking Duration for VCS(stop) (Note 7) tBCS 90 120 150 ns tSSTART 8 11 14 ms Scomp(65kHz) Scomp(100kHz) − − −32.5 −50 − − mV / ms RFB(up) 30 40 50 kW KFB − 4 − − VFB(ref) 4.5 5 5.5 V TJ = 25°C VFB(off) − 0.8 − V VFB going down, TJ = 25°C VFB going up, TJ = 25°C Vskip(in) Vskip(out) 1.1 1.2 1.2 1.3 1.3 1.4 V The Voltage Above which the Part Enters the On Mode VCC > VCC(off), VHV = 60 V VON − 2.2 − V The Voltage Below which the Part Enters the Off Mode VCC > VCC(off) VOFF 0.5 0.6 0.7 V VCC > VCC(off), VHV = 60 V VHYST 500 − − mV Clamping Voltage (maximum gate voltage) High−state Voltage Drop CURRENT SENSE Leading Edge Blanking Duration for VILIM Soft−start Duration From 1st pulse to VCS = VILIM INTERNAL SLOPE COMPENSATION Slope of the Compensation Ramp FEEDBACK Internal Pull−up Resistor TJ = 25°C VFB to Internal Current Setpoint Division Ratio Internal Pull−up Voltage on the FB Pin (Note 7) Feedback Voltage Below which the Peak Current is Frozen SKIP CYCLE MODE Feedback Voltage Thresholds for Skip Mode REMOTE CONTROL ON FB PIN Minimum Hysteresis Between the VON and VOFF Pull−up Current in Off Mode VCC > VCC(off) IOFF − 5 − mA Go To Off Mode Timer VCC > VCC(off) tGTOM 400 500 600 ms 5. 6. 7. 8. VCC(off) < VCC(min) with the minimum gap 0.5 V. Internal supply current only, currents sourced via FB pin is not included (current is flowing in GND pin only). Guaranteed by design. CS pin source current is a sum of Ibias and IOPC, thus at VHV = 125 V is observed the Ibias only, because IOPC is switched off. www.onsemi.com 6 NCP1240G ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, VHV = 125 V, VCC = 11 V unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit tfault 44 64 84 ms tautorec 0.85 1.00 1.35 s VCS(tran) 0.46 0.49 0.52 V ttran 2.5 3.6 4.8 s KOPC − 0.54 − mA / V OVERLOAD PROTECTION Fault Timer Duration Autorecovery Mode Latch−off Time Duration CS Threshold for Transient Peak Timer Activation Transient Peak Power Timer Duration VCS(peak) = VCS(tran) + 0.1 V from 1st time VCS > VCS(tran) to DRV stop OVERPOWER PROTECTION VHV to IOPC Conversion Ratio Current Flowing out of CS Pin (Note 8) VHV = 125 V VHV = 162 V VHV = 325 V VHV = 365 V IOPC(125) IOPC(162) IOPC(325) IOPC(365) − − − 105 0 20 110 130 − − − 150 mA FB Voltage Above which IOPC is Applied VHV = 365 V VFB(OPCF) − 2.6 − V FB Voltage Below which is No IOPC Applied VHV = 365 V VFB(OPCE) − 2.1 − V VLatch going up VOVP 2.35 2.5 2.65 V LATCH−OFF INPUT High Threshold Low Threshold OTP Resistance Threshold (TJ = 25°C) (TJ = 80°C) (TJ = 110°C) VLatch going down VOTP − 0.4 − V External NTC resistance is going down ROTP 6.6 − − 7.7 8.5 9.5 8.6 − − kW INTC 20 60 50 100 70 140 35 20 50 35 70 55 ms mA Current Source for Direct NTC Connection During Sormal Operation During Soft−start VLatch = 0 V Blanking Duration On High Latch Detection 65 kHz version 100 kHz version tLatch(OVP) tLatch(OTP) − 350 − ms ILatch = 0 mA ILatch = 1 mA Vclamp0(Latch) Vclamp1(Latch) 1.0 1.8 1.2 2.4 1.4 3.0 V TJ going up TTSD − 150 − °C TJ going down TTSD(HYS) − 30 − °C INTC(SSTART) Blanking Duration On Low Latch Detection Clamping voltage TEMPERATURE SHUTDOWN Temperature shutdown Temperature shutdown hysteresis 5. 6. 7. 8. VCC(off) < VCC(min) with the minimum gap 0.5 V. Internal supply current only, currents sourced via FB pin is not included (current is flowing in GND pin only). Guaranteed by design. CS pin source current is a sum of Ibias and IOPC, thus at VHV = 125 V is observed the Ibias only, because IOPC is switched off. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 7 NCP1240G TYPICAL CHARACTERISTIC 30 32 28 30 Istart(off) (mA) VHV(min) (V) 26 24 22 20 26 24 22 18 16 −50 −25 0 25 50 75 100 20 −50 125 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 3. Minimum Current Source Operation VHV(min) Figure 4. Off−State Leakage Current Istart(off) 50 8.8 45 8.7 8.6 40 IHV(off) @ VHV = 325 V Istart2 (mA) IHV(off) (mA) 28 35 8.5 8.4 30 8.3 25 8.2 −25 0 25 50 75 100 8.1 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 5. Off−Mode HV Supply Current IHV(off) Figure 6. High Voltage Startup Current Flowing Out of VCC Pin Istart2 120 120 115 115 VHV(stop) (V) VHV(start) (V) 20 −50 110 105 100 95 −50 125 110 105 100 −25 0 25 50 75 100 125 95 −50 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 7. Brown−out Device Start Threshold VHV(start) Figure 8. Brown−out Device Stop Threshold VHV(stop) www.onsemi.com 8 NCP1240G TYPICAL CHARACTERISTIC 0.52 0.75 0.74 0.51 0.73 VCS(tran) (V) VILIM (V) 0.72 0.71 0.70 0.69 0.68 0.67 0.50 0.49 0.48 0.47 0.66 0.65 −50 −25 0 25 50 75 100 0.46 −50 125 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 9. Maximum Internal Current Setpoint VILIM Figure 10. Threshold for Transient Peak Power Timer Activation VCS(tran) 90 1.15 1.13 80 1.11 70 1.07 tdelay (ns) VCS(stop) (V) 1.09 1.05 1.03 60 50 1.01 0.99 40 0.97 0.95 −50 −25 0 25 50 75 100 30 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 11. Threshold for Immediate Fault Protection Activation VCS(stop) Figure 12. Propagation Delay tdelay 125 130 320 128 310 126 124 IOPC(365) (mA) tLEB (ns) 300 290 280 122 120 118 116 270 114 260 250 −50 112 −25 0 25 50 75 100 110 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 13. Leading Edge Blanking Duaration tLEB Figure 14. Maximum Overpower Compensating Current IOPC(365) Flowing Out of CS Pin www.onsemi.com 9 125 NCP1240G TYPICAL CHARACTERISTIC 5.20 50 48 5.10 46 5.00 VFB(ref) (V) RFB(up) (kW) 44 42 40 38 4.90 4.80 36 34 4.70 32 30 −50 −25 0 25 50 75 100 4.60 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 15. FB Pin Internal Pull−up Resistor RFB(up) Figure 16. FB Pin Open Voltage VFB(ref) 4.50 1.20 4.40 1.10 125 4.30 1.00 VFB(off) (V) KFB (−) 4.20 4.10 4.00 3.90 0.90 0.80 0.70 3.80 0.60 3.70 0.50 3.60 −25 0 25 50 75 100 0.40 −50 125 0 25 50 75 100 TEMPERATURE (°C) Figure 17. VFB to Internal Current Setpoint Division Ratio KFB Figure 18. Offset Voltage VFB(off) between FB Pin and Internal FB Divider 2.65 12 2.60 11 2.55 10 2.50 8 2.40 7 −25 0 25 50 75 100 125 6 −50 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 19. Latch Pin High Threshold VOVP Figure 20. OTP Reistance Threshold ROTP at Latch Pin www.onsemi.com 10 125 9 2.45 2.35 −50 −25 TEMPERATURE (°C) ROTP (kW) VOVP (V) 3.50 −50 125 NCP1240G TYPICAL CHARACTERISTIC 120 70 65 110 60 INTC(SSTART) (mA) INTC (mA) 55 50 45 40 35 30 100 90 80 70 25 −25 0 25 50 75 100 60 −50 125 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 22. Current INTC(SSTART) Sourced from the Latch Pin, During Soft−Start 100 8.5 99 8.4 98 8.3 97 8.2 96 95 94 8.1 8.0 7.9 93 7.8 92 7.7 91 7.6 90 −50 −25 Figure 21. Current INTC Sourced from the Latch Pin, Allowing Direct NTC Connection fOSC (kHz) fOSC (kHz) 20 −50 −25 0 25 50 75 100 7.5 −50 125 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 23. Oscillator fOSC for the 65 kHz Version Figure 24. Maximum ON Time tONmax for the 65 kHz Version 82 30 81 29 80 28 fOSC(min) (ms) DMAX (%) 79 78 77 76 27 26 25 75 24 74 23 73 72 −50 −25 0 25 50 75 TEMPERATURE (°C) 100 125 22 −50 Figure 25. Maximum Duty Ratio DMAX −25 0 25 50 75 TEMPERATURE (°C) 100 Figure 26. Minimum Switching Frequency fOSC(min) www.onsemi.com 11 125 NCP1240G TYPICAL CHARACTERISTIC 1.80 2.80 1.70 2.70 VFB(foldE) (V) VFB(foldS) (V) 1.60 2.60 2.50 2.40 1.50 1.40 1.30 1.20 2.30 2.20 −50 1.10 −25 0 25 50 75 100 125 1.00 −50 −25 0 25 50 75 100 125 TEMPERATURE (°C) Figure 28. FB Pin Voltage Below Which Frequency Foldback Complete VFB(foldE) 1.50 1.60 1.40 1.50 1.30 1.40 Vskip(on) (V) Vskip(in) (V) Figure 27. FB Pin Voltage Below Which Frequency Foldback Starts VFB(foldS) 1.20 1.10 1.30 1.20 1.00 1.10 0.90 1.00 0.80 −50 −25 0 25 50 75 100 125 0.90 −50 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 29. FB Pin Skip−In Level Vskip(in) Figure 30. FB Pin Skip−Out Level Vskip(out) 2.80 2.50 2.40 2.70 2.30 2.20 VFB(OPCE) (V) VFB(OPCF) (V) 2.60 2.50 2.40 2.10 2.00 1.90 1.80 2.30 1.70 2.20 2.10 −50 1.60 −25 0 25 50 75 100 125 1.50 −50 TEMPERATURE (°C) −25 0 25 50 75 100 TEMPERATURE (°C) Figure 31. FB Pin Level VFB(OPCF) Above Which is the Overpower Compensation Applied Figure 32. FB Pin Level VFB(OPCE) Below Which is No Overpower Compensation Applied www.onsemi.com 12 125 NCP1240G TYPICAL CHARACTERISTIC 9.0 13.0 12.8 8.8 12.6 VCC(min) (V) VCC(on) (V) 12.4 12.2 12.0 11.8 11.6 11.4 8.6 8.4 8.2 8.0 11.2 11.0 −50 −25 0 25 50 75 100 7.8 −50 125 −25 TEMPERATURE (°C) 0 25 50 75 100 125 TEMPERATURE (°C) Figure 33. VCC Turn−on Threshold Level, VCC Going Up HV Current Source Stop Threshold VCC(on) Figure 34. HV Current Source Restart Threshold VCC(min) 9.4 7.0 6.9 9.3 6.8 VCC(reset) (V) VCC(off) (V) 9.2 9.1 9.0 6.7 6.6 6.5 6.4 6.3 8.9 6.2 8.8 −50 −25 0 25 50 75 100 6.1 −50 125 −25 TEMPERATURE (°C) 0 25 50 75 100 125 TEMPERATURE (°C) Figure 35. VCC Turn−off Threshold (UVLO) VCC(off) Figure 36. VCC Decreasing Level at Which the Internal Logic Resets VCC(reset) 2.2 3.2 2.1 3.0 2.0 2.8 ICC2 (mA) ICC1 (mA) 1.9 1.8 1.7 1.6 2.6 2.4 1.5 2.2 1.4 1.3 −50 −25 0 25 50 TEMPERATURE (°C) 75 100 125 2.0 −50 Figure 37. Internal Current Consumption when DRV Pin is Unloaded −25 0 25 50 75 TEMPERATURE (°C) 100 125 Figure 38. Internal Current Consumption when DRV Pin is Loaded by 1 nF www.onsemi.com 13 NCP1240G 4.0 1.10 3.8 1.08 3.6 1.06 3.4 1.04 Tsample (ms) VHV(hyst) (V) TYPICAL CHARACTERISTIC 3.2 3.0 2.8 1.02 1.00 0.98 2.6 0.96 2.4 0.94 2.2 0.92 2.0 −50 −25 0 25 50 75 100 0.90 −50 125 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 39. X2 Discharge Comparator Hysteresis Observed at HV Pin VHV(hyst) Figure 40. HV Signal Sampling Period Tsample 80 75 70 75 70 60 tfault (V) tHV (ms) 65 55 50 65 60 45 55 40 35 −50 −25 0 25 50 75 100 50 −50 125 0 25 50 75 100 TEMPERATURE (°C) Figure 41. Timer Duration for Line Cycle Drop−out tHV Figure 42. Fault Timer Duration tfault 8.00 600 7.50 580 125 560 7.00 540 tGTOM (ms) 6.50 ttran (s) −25 TEMPERATURE (°C) 6.00 5.50 520 500 480 460 5.00 440 4.50 420 4.00 −50 −25 0 25 50 75 100 125 400 −50 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 43. Transient Peak Power Timer Timer Duration ttran Figure 44. Go To Off Mode Timer Duration tGTOM www.onsemi.com 14 125 NCP1240G APPLICATION INFORMATION Functional Description range, the duty−ratio may increase up to 50%. The build−in slope compensation prevents the appearance of sub−harmonic oscillations in this operating area. The converter operates in frequency foldback mode (FFM) for loads that are between approximately 17% and 48% of full rated power. Effectively, operation in FFM results in the application of constant volt−seconds to the flyback transformer each switching cycle. Voltage regulation in FFM is achieved by varying the switching frequency in the range from 65 kHz (or 100 kHz) to 27 kHz. For extremely light loads (below approximately 6% full rated power), the converter is controlled using bursts of 27 kHz pulses. This mode is called as skip mode. The FFM, keeping constant peak current and skip mode allows design of the power supplies with increased efficiency under the light loading conditions. Keep in mind that the aforementioned boundaries of steady−state operation are approximate because they are subject to converter design parameters. The NCP1240G includes all necessary features to build a safe and efficient power supply based on a fixed−frequency flyback converter. The NCP1240G is a multimode controller as illustrated in Figure 45. The mode of operation depends upon line and load condition. Under all modes of operation, the NCP1240G terminates the DRV signal based on the switch current. Thus, the NCP1240G always operates in current mode control so that the power MOSFET current is always limited. Under normal operating conditions, the FB pin commands the operating mode of the NCP1240G at the voltage thresholds shown in Figure 45. At normal rated operating loads (from 100% to approximately 33% full rated power) the NCP1240G controls the converter in fixed frequency PWM mode. It can operate in the continuous conduction mode (CCM) or discontinuous conduction mode (DCM) depending upon the input voltage and loading conditions. If the controller is used in CCM with a wide input voltage Low consumption off mode ON OFF 0V PWM at f OSC FFM Skip mode 0.8 V 1.2 V 1.5 V 1.3 V 2.2 V 2.5 V 3.6 V VFB Figure 45. Mode Control with FB Pin Voltage decreases below the 0.6 V the controller will enter the low consumption off mode. The controller can start if the FB pin voltage increases above the 2.2 V level. See the detailed status diagrams for the versions fully latched A and the autorecovery B on the following figures. The basic status of the device after wake–up by the VCC is the off mode and mode is used for the overheating protection mode if the thermal shutdown protection is activated. There was implemented the low consumption off mode allowing to reach extremely low no load input power. This mode is controlled by the FB pin and allows the remote control (or secondary side control) of the power supply shut−down. Most of the device internal circuitry is unbiased in the low consumption off mode. Only the FB pin control circuitry and X2 cap discharging circuitry is operating in the low consumption off mode. If the voltage at feedback pin www.onsemi.com 15 NCP1240G VHV > VHV(NOAC) < VOFF) * GTOMtimer*(VCC > VCCoff) BO+TSD Reset Latch=0 VCC fault Soft Start (VCC < VCCoff (VCC > VCCon)*BO Efficient operating mode BO+TSD Stop VCC > VCCoff SSend Skip in Running Skip mode Dynamic Self−Supply Skip out (if not enoughgh auxiliary voltage is present) www.onsemi.com Extra Low Consumption (VFB (VFB > VON)*Latch BO Latch Latch=1 (VCC < VCCoff 16 Off Mode Latch=X (VFB > VON)*Latch No AC AC present + discharged BO OVP+OTP+VCCovp+VCSstop (VILIM +MaxDC)*tfault X2 cap Discharge Latch=0 VCC > VCCreset Power On Reset Latch=0 Regulated Self−Supply VCC > VCCreset Figure 46. Operating Status Diagram for the Fully Latched Versions A and E of the Device NCP1240G VHV > V VCC > VCCoff (VCC > VCCon)*BO Efficient operating mode BO+TSD Stop BO Autorecovery Latch AutoRec=1 Soft Start VCC fault VCC < SSend Skip in VCCoff Running Skip mode present) Skip out Dynamic Self−Supply (if not enough auxiliary voltage is www.onsemi.com BO+TSD Reset Latch=0 AutoRec=0 BO+tautorec Extra Low Consumption (VFB > VON)*Latch*AutoRec BO Latch Latch=1 VCSstop VCC < VCCoff 17 Off Mode Latch=X AutoRec=X BO OVP+OTP+VCCovp (VFB > VON)*AutoRec (VILIM + MaxDC)*tfault (VFB < VOFF) * GTOMtimer*(VCC > VCCoff) AC present + discharged (VFB > VON)*Latch No AC HV(NOAC) X2 cap Discharge Latch=0 AutoRec=0 VCC < VCCreset Power On Reset Latch=0 AutoRec=0 Regulated Self−Supply VCC > VCCreset Figure 47. Operating Status Diagram for the Autorecovery Versions B and F of the Device NCP1240G Even though the Dynamic Self−Supply is able to maintain the VCC voltage between VCC(on) and VCC(min) by turning the HV start−up current source on and off, it can only be used in light load condition, otherwise the power dissipation on the die would be too much. As a result, an auxiliary voltage source is needed to supply VCC during normal operation. The Dynamic Self−Supply is useful to keep the controller alive when no switching pulses are delivered, e.g. in brown−out condition, or to prevent the controller from stopping during load transients when the VCC might drop. The NCP1240G accepts a supply voltage as high as 28 V, with an overvoltage threshold VCC(ovp) that latches the controller off. The information about the fault (permanent Latch or Autorecovery) is kept during the low consumption off mode due the safety reason. The reason is not to allow unlatch the device by the remote control being in off mode. Start−up of the Controller At start−up, the current source turns on when the voltage on the HV pin is higher than VHV(min), and turns off when VCC reaches VCC(on), then turns on again when VCC reaches VCC(min), until the input voltage is high enough to ensure a proper start−up, i.e. when VHV reaches VHV(start). The controller actually starts the next time VCC reaches VCC(on). The controller then delivers pulses, starting with a soft−start period tSSTART during which the peak current linearly increases before the current−mode control takes over. VHV V HV(start) V HV(min) Waits next VCC(on) before starting time VCC V CC(on) V CC(min) HV current source = I start1 HV current source = Istart2 V CC(inhibit) time DRV Figure 48. VCC Start−up Timing Diagram www.onsemi.com 18 time NCP1240G For safety reasons, the start−up current is lowered when VCC is below VCC(inhibit), to reduce the power dissipation in case the VCC pin is shorted to GND (in case of VCC capacitor failure, or external pull−down on VCC to disable the controller). There is only one condition for which the current source doesn’t turn on when VCC reaches VCC(inhibit): the voltage on HV pin is too low (below VHV(min)). threshold and an autorecovery brown−out protection; both of them independent of the ripple on the input voltage. It is allowed only to work with an unfiltered, rectified ac input to ensure the X2 capacitor discharge function as well, which is described in following. The brown−out protection thresholds are fixed, but they are designed to fit most of the standard ac−dc conversion applications. When the input voltage goes below VHV(stop), a brown−out condition is detected, and the controller stops. The HV current source maintains VCC at VCC(min) level until the input voltage is back above VHV(start). HV Sensing of Rectified AC Voltage The NCP1240G features on its HV pin a true ac line monitoring circuitry. It includes a minimum start−up www.onsemi.com 19 NCP1240G Figure 49. Ac Line Drop−out Timing Diagram www.onsemi.com 20 NCP1240G VOUT VOUT(typ) Overload applied Waits next VccON before VCC time VCC(on) VCC(off) VCC(min) tautorec Autorecovery timer starts Autorecovery timer elapses time DRV Controller restarts Controller latches off time Figure 50. VCC Collapses After Overload and Its Recovery www.onsemi.com 21 NCP1240G HV timer elapsed VHV VHV(start) VHV(stop) Spike induced by residual energy in HV stop tHV time Brown−out detected Waits next VccON before starting VCC time VCC(on) VCC(min) DRV Brown−out condition resets the Internal Latch Figure 51. Ac Line Drop−out Timing Diagram with Parasitic Spike time time immediately after the device is stopped by the residual energy in the EMI filter. The device restart is allowed only after the 1st watch dog signal event. The basic principle is shown at Figure 49 and detail of the device restart is shown at Figure 52. When VHV crosses the VHV(start) threshold, the controller can start immediately. When it crosses VHV(stop), it triggers a timer of duration tHV, this ensures that the controller doesn’t stop in case of line cycle drop−out. The device restart after the ac line voltage drop-out is protected to the parasitic restart initiated e.g. the spikes induced at HV pin www.onsemi.com 22 NCP1240G Figure 52. Detailed Timing Diagram of the Device Restart After the Short ac Line Drop−out www.onsemi.com 23 NCP1240G X2 Cap Discharge Feature In case of the dc signal presence on the high voltage input, the direct sample of the high voltage obtained via the high voltage sensing structure and the delayed sample of the high voltage are equivalent and the comparator produces the low level signal during the presence of this signal. No edges are present at the output of the comparator, that’s why the detection timer is not reset and dc detect signal appears. The minimum detectable slope by this ac detector is given by the ration between the maximum hysteresis observed at HV pin VHV(hyst),max and the sampling time: The X2 capacitor discharging feature is offered by usage of the NCP1240G. This feature saves approximately 16 mW − 25 mW input power depending on the EMI filter X2 capacitors volume and it saves the external components count as well. The discharge feature is ensured via the start−up current source with a dedicated control circuitry for this function. The X2 capacitors are being discharged by current defined as Istart2 when this discharge event is detected. There is used a dedicated structure called ac line unplug detector inside the X2 capacitor discharge control circuitry. See the Figure 53 for the block diagram for this structure and Figures 54, 55, 56 and 57 for the timing diagrams. The basic idea of ac line unplug detector lies in comparison of the direct sample of the high voltage obtained via the high voltage sensing structure with the delayed sample of the high voltage. The delayed signal is created by the sample & hold structure. The comparator used for the comparison of these signals is without hysteresis inside. The resolution between the slopes of the ac signal and dc signal is defined by the sampling time TSAMPLE and additional internal offset NOS. These parameters ensure the noise immunity as well. The additional offset is added to the picture of the sampled HV signal and its analog sum is stored in the C1 storage capacitor. If the voltage level of the HV sensing structure output crosses this level the comparator CMP output signal resets the detection timer and no dc signal is detected. The additional offset NOS can be measured as the VHV(hyst) on the HV pin. If the comparator output produces pulses it means that the slope of input signal is higher than set resolution level and the slope is positive. If the comparator output produces the low level it means that the slope of input signal is lower than set resolution level or the slope is negative. There is used the detection timer which is reset by any edge of the comparator output. It means if no edge comes before the timer elapses there is present only dc signal or signal with the small ac ripple at the HV pin. This type of the ac detector detects only the positive slope, which fulfils the requirements for the ac line presence detection. S min + V HV(hyst),max (eq. 1) T sample Than it can be derived the relationship between the minimum detectable slope and the amplitude and frequency of the sinusoidal input voltage: V max + V HV(hyst),max 2 @ p @ f @ T sample + 5 2 @ p @ 35 @ 1 @ 10 −3 (eq. 2) + 22.7 V The minimum detectable AC RMS voltage is 16 V at frequency 35 Hz, if the maximum hysteresis is 5 V and sampling time is 1 ms. The X2 capacitor discharge feature is available in any controller operation mode to ensure this safety feature. The detection timer is reused for the time limiting of the discharge phase, to protect the device against overheating. The discharging process is cyclic and continues until the ac line is detected again or the voltage across the X2 capacitor is lower than VHV(min). This feature ensures to discharge quite big X2 capacitors used in the input line filter to the safe level. It is important to note that it is not allowed to connect HV pin to any dc voltage due this feature. e.g. directly to bulk capacitor. During the HV sensing or X2 cap discharging the VCC net is kept above the VCC(off) voltage by the Self−Supply in any mode of device operation to supply the control circuitry. During the discharge sequence is not allowed to start−up the device. www.onsemi.com 24 NCP1240G Figure 53. The ac Line Unplug Detector Structure Used for X2 Capacitor Discharge System Figure 54. The ac Line Unplug Detector Timing Diagram www.onsemi.com 25 NCP1240G Figure 55. The ac Line Unplug Detector Timing Diagram Detail with Noise Effects www.onsemi.com 26 NCP1240G Figure 56. HV Pin ac Input Timing Diagram with X2 Capacitor Discharge Sequence When the Application is Unplugged Under Extremely Low Line Condition www.onsemi.com 27 NCP1240G Figure 57. HV Pin ac Input Timing Diagram with X2 Capacitor Discharge Sequence When the Application is Unplugged Under High Line Condition The Low Consumption Off Mode Only the X2 cap discharge and Self−Supply features is enabled in the low consumption off mode. The X2 cap discharging feature is enable due the safety reasons and the Self−Supply is enabled to keep the VCC supply, but only very low VCC consumption appears in this mode. Any other features are disabled in this mode. The information about the latch status of the device is kept in the low consumption off mode and this mode is used for the TSD protection as well. The protection timer GoToOffMode tGTOM is used to protect the application against the false activation of the low consumption off mode by the fast drop outs of the FB pin voltage below the 0.6 V level. E.g. in case when is present high FB pin voltage ripple during the skip mode. There was implemented the low consumption off mode allowing to reach extremely low no load input power as described in previous chapters. If the voltage at feedback pin decreases below the 0.6 V the controller enters the off mode. The internal VCC is turned−off, the IC consumes extremely low VCC current and only the voltage at external VCC capacitor is maintained by the Self−Supply circuit. The Self−Supply circuit keeps the VCC voltage at the VCC(reg) level. The supply for the FB pin watch dog circuitry and FB pin bias is provided via the low consumption current sources from the external VCC capacitor. The controller can only start, if the FB pin voltage increases above the 2.2 V level. See Figure 58 for timing diagrams. www.onsemi.com 28 NCP1240G Figure 58. Start−up, Shutdown and AC Line Unplug Time Diagram Oscillator with Maximum On Time and Frequency Jittering The NCP1240G includes an oscillator that sets the switching frequency 65 kHz or 100 kHz depending on the version. The maximum on time is 12.3 ms (for 65 kHz version) or 8 ms (for 100 kHz version) with an accuracy of ±7%. The maximum on time corresponds to maximum duty cycle of the DRV pin is 80% at full switching frequency. In order to improve the EMI signature, the switching frequency jitters ±6 % around its nominal value, with a triangle−wave shape and at a frequency of 125 Hz. This frequency jittering is active even when the frequency is decreased to improve the efficiency in light load condition. Figure 59. Frequency Modulation of the Maximum Switching Frequency www.onsemi.com 29 NCP1240G Low Load Operation Modes: Frequency Foldback Mode (FFM) and Skip Mode VFB(foldS), and is complete when VFB reaches VFB(foldE). The maximum on−time duration control is kept during the frequency foldback mode to provide the natural transformer core anti−saturation protection. The frequency jittering is still active while the oscillator frequency decreases as well. In order to improve the efficiency in light load conditions, the frequency of the internal oscillator is linearly reduced from its nominal value down to fOSC(min). This frequency foldback starts when the voltage on FB pin goes below Figure 60. Frequency Foldback Mode Characteristic When the FB voltage reaches Vskip(in) while decreasing, skip mode is activated: the driver stops, and the internal consumption of the controller is decreased. While VFB is below Vskip(out), the controller remains in this state; but as soon as VFB crosses the skip out threshold, the DRV pin starts to pulse again. Figure 61. Skip Mode Timing Diagram www.onsemi.com 30 NCP1240G Figure 62. Technique Preventing Short Pulses in Skip Mode Clamped Driver resulting voltage is applied to the CS pin. It is applied to one input of the PWM comparator through a 250 ns LEB block. On the other input the FB voltage divided by 5 sets the threshold: when the voltage ramp reaches this threshold, the output driver is turned off. The maximum value for the current sense is 0.7 V, and it is set by a dedicated comparator. Each time the controller is starting, i.e. the controller was off and starts – or restarts – when VCC reaches VCC(on), a soft−start is applied: the current sense setpoint is increased by 15 discrete steps from 0 (the minimum level can be higher than 0 because of the LEB and propagation delay) until it reaches VILIM (after a duration of tSSTART), or until the FB loop imposes a setpoint lower than the one imposed by the soft−start (the two comparators outputs are OR’ed). The supply voltage for the NCP1240G can be as high as 28 V, but most of the MOSFETs that will be connected to the DRV pin cannot accept more than 20 V on their gate. The driver pin is therefore clamped safely below 16 V. This driver has a typical capability of 500 mA for source current and 800 mA for sink current. Current−Mode Control With Slope Compensation and Soft−Start NCP1240G is a current−mode controller, which means that the FB voltage sets the peak current flowing in the inductance and the MOSFET. This is done through a PWM comparator: the current is sensed across a resistor and the www.onsemi.com 31 NCP1240G Figure 63. Soft−Start Feature In order to allow the NCP1240G to operate in CCM with a duty cycle above 50%, the fixed slope compensation is internally applied to the current−mode control. The slope appearing on the internal voltage setpoint for the PWM comparator is −32.5 mV/ms typical for the 65 kHz version, and −50 mV/ms for the 100 kHz version. The slope compensation can be observable as a value of the peak current at CS pin. The internal slope compensation circuitry uses a sawtooth signal synchronized with the internal oscillator is subtracted from the FB voltage divided by KFB. Under some conditions, like a winding short−circuit for instance, not all the energy stored during the on time is transferred to the output during the off time, even if the on time duration is at its minimum (imposed by the propagation delay of the detector added to the LEB duration). As a result, the current sense voltage keeps on increasing above VILIM, because the controller is blind during the LEB blanking time. Dangerously high current can grow in the system if nothing is done to stop the controller. That’s what the additional comparator, that senses when the current sense voltage on CS pin reaches VCS(stop) ( = 1.5 x VILIM ), does: the controller enters the protection mode as soon as this comparator toggles four times consecutively. www.onsemi.com 32 NCP1240G Figure 64. Slope Compensation Block Diagram Figure 65. Slope Compensation Timing Diagram Internal Overpower Protection Unfortunately, due to the inherent propagation delay of the logic, the actual peak current is higher at high input voltage than at low input voltage, leading to a significant difference in the maximum output power delivered by the power supply. The power delivered by a flyback power supply is proportional to the square of the peak current in discontinuous conduction mode: P OUT + 1 @ h @ L P @ F SW @ I P 2 2 (eq. 3) www.onsemi.com 33 NCP1240G Figure 66. Needs for Line Compensation For True Overpower Protection But this offset is unwanted to appear when the current sense signal is small, i.e. in light load conditions, where it would be in the same order of magnitude. Therefore the compensation current is only added when the FB voltage is higher than VFB(OPCE). However, because the HV pin is being connected to ac voltage, there is needed an additional circuitry to read or at least closely estimate the actual voltage on the bulk capacitor. To compensate this and have an accurate overpower protection, an offset proportional to the input voltage is added on the CS signal by turning on an internal current source: by adding an external resistor in series between the sense resistor and the CS pin, a voltage offset is created across it by the current. The compensation can be adjusted by changing the value of the resistor. Figure 67. Overpower Protection Current Relation to Feedback Voltage Figure 68. Overpower Protection Current Relation to Peak of Rectified Input Line AC voltage www.onsemi.com 34 NCP1240G HV Positive slope R1 Sample & Hold CMP Detection timer reset Q1 Nos R2 Lo frq OSC OPC control C1 Rfb1 Vfb(reg) FB Internal resitance 40k Out sq A/D 3 bit Converter + Peak detector 3 bit Register FBbuffer Vfb(opcf) Ictrl Division ratio 4 Rfb3 Rfb2 I generator PWM_CMP PWM CS LEB 250ns Figure 69. Block Schematic of Overpower Protection Circuit www.onsemi.com 35 DC detect NCP1240G A 3 bit A/D converter with the peak detector senses the ac input, and its output is periodically sampled and reset, in order to follow closely the input voltage variations. The sample and reset events are given by the output from the ac line unplug detector. The sensed HV pin voltage peak value is validated when no HV edges from comparator are present after last falling edge during two sample clocks. See Figure 70 for details. When this event occurs, an internal tfault timer is started: once the timer times out, DRV pulses are stopped and the controller is either latched off (latched protection, options A and E) or this latch is released by the autorecovery mode (options B and F), the controller tries to restart after tautorec. Other possibilities of the latch release are the brown−out condition or the VCC power on reset. The timer is reset when the CS setpoint goes back below VILIM before the timer elapses. The fault timer is also started if the driver signal is reset by the maximum on time. The controller also enters the same protection mode if the voltage on the CS pin reaches 1.5 times the maximum internal setpoint VCS(stop) (allows to detect winding short−circuits) or there appears low VCC supply. See Figures 71 and 72 for the timing diagram. In autorecovery mode if the fault has gone, the supply resumes operation; if not, the system starts a new burst cycle. Overcurrent Protection with Fault timer The overload protection depends only on the current sensing signal, making it able to work with any transformer, even with very poor coupling or high leakage inductance. When an overcurrent event occurs on the output of the power supply, the FB loop asks for more power than the controller can deliver, and the CS setpoint reaches VILIM. www.onsemi.com 36 NCP1240G VHVSAMPLE TSAMPLE VHV(hyst) time 1st HV edge resets the watch dog and starts the peak detection of HV pin signal Comparator Output time Sample clock time Watch dog signal 2nd sample clock pulse after last HV edge initiates the watch dog signal 2nd sample clock pulse after last HV edge initiates the watch dog signal time Peak detector Reset Reset Sample Sample time IOPC time Figure 70. Overpower Compensation Timing Diagram www.onsemi.com 37 NCP1240G PROTECTION MODES AND THE LATCH MODE RELEASES Event Timer Protection Next Device Status Release to Normal Operation Mode Overcurrent VILIM > 0.7 V Fault timer Latch Brown−out VCC < VCC(reset) Peak power VILIM > 0.5 V Transient timer Latch Brown−out VCC < VCC(reset) Maximum on time Fault timer Latch Brown−out VCC < VCC(reset) Winding short Vsense > VCS(stop) 4consecutive pulses Latch Brown−out VCC < VCC(reset) Low supply VCC < VCC(off) 10 ms timer Latch Autorecovery – B and F versions Brown−out VCC < VCC(reset) External OTP, OVP 55 ms (35 ms at 100 kHz) Latch Brown−out VCC < VCC(reset) High supply VCC > VCC(ovp) 10 ms timer Latch Brown−out VCC < VCC(reset) Brown−out VHV < VHV(stop) HV timer Device stops (VHV > VHV(start)) & (VCC > VCC(on)) Internal TSD 10 ms timer Device stops, HV start−up current source stops (VHV > VHV(start)) & (VCC > VCC(on)) & TSDb Off mode VFB < VOFF 150 ms timer Device stops and internal VCC is turned off (VHV > VHV(start)) & (VCC > VCC(on)) & (VFB > VON) www.onsemi.com 38 NCP1240G VCC(on) VCC(min) Figure 71. Latched Timer−Based Overcurrent Protection (Option G) Duel−Level Overcurrent Protection comparator whose threshold is VCS(tran), a CS voltage level lower than VILIM, which starts the counting of another timer, with a duration ttran longer than tfault (3.6 s is the typical value). If the timer reaches its maximum duration, the controller enters protection mode which is latched or autorecovery released depending on the option. For some applications (e.g. limited power supplies), it is necessary that the controller maintains regulation while it has detected a first level of overload. This is to authorize a transient peak power higher than the maximum continuous output power. This is implemented by adding another www.onsemi.com 39 NCP1240G Figure 72. Too Long Transient Peak Power Delivery If the conditions change from transient power delivery to overload, the overload timer starts to count. The timing diagram could look like the one in Figure 73. www.onsemi.com 40 NCP1240G Figure 73. Transient Peak Power Followed by Overload www.onsemi.com 41 NCP1240G Latch−Off Input Figure 74. Latch Detection Schematic The Latch pin is dedicated to the latch−off function: it includes two levels of detection that define a working window, between a high latch and a low latch: within these two thresholds, the controller is allowed to run, but as soon as either the low or the high threshold is crossed, the controller is latched off. The lower threshold is intended to be used with an NTC thermistor, thanks to an internal current source INTC. An active clamp prevents the voltage from reaching the high threshold if it is only pulled up by the INTC current. To reach the high threshold, the pull−up current has to be higher than the pull−down capability of the clamp (typically 1.5 mA at VOVP). To avoid any false triggering, spikes shorter than 50 ms (for the high latch and 65 kHz version) or 350 ms (for the low latch) are blanked and only longer signals can actually latch the controller. C LATCH max + t SSTART Reset occurs when a brown−out condition is detected or the VCC is cycled down to a reset voltage, which in a real application can only happen if the power supply is unplugged from the ac line. Upon startup, the internal references take some time before being at their nominal values; so one of the comparators could toggle even if it should not. Therefore the internal logic does not take the latch signal into account before the controller is ready to start: once VCC reaches VCC(on), the latch pin High latch state is taken into account and the DRV switching starts only if it is allowed; whereas the Low latch (typically sensing an over temperature) is taken into account only after the soft−start is finished. In addition, the NTC current is doubled to INTC(SSTART) during the soft−start period, to speed up the charging of the Latch pin capacitor. The maximum value of Latch pin capacitor is given by the following formula (The standard start−up condition is considered and the NTC current is neglected): min @ I NTC(SSTART) min V clamp0 min + 8.0 @ 10 −3 @ 130 @ 10 −6 F + 1.04 mF (eq. 4) 1.0 www.onsemi.com 42 NCP1240G VCC(on) VCC(min) Figure 75. Latch Timing Diagram Temperature Shutdown low power consumption. There is kept the VCC supply to keep the TSD information. When the temperature falls below the low threshold, the start−up of the device is enabled again, and a regular start−up sequence takes place. See the status diagrams at the Figure 46. The NCP1240 includes a temperature shutdown protection with a trip point typically at 150°C and the typical hysteresis of 30°C. When the temperature rises above the high threshold, the controller stops switching instantaneously, and goes to the off mode with extremely ORDERING INFORMATION Ordering Part No. NCP1240GD065R2G Overload Protection Switching Frequency Package Shipping† Latched 65 kHz SOIC−7 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 43 NCP1240G PACKAGE DIMENSIONS SOIC−7 CASE 751U ISSUE E −A− 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B ARE DATUMS AND T IS A DATUM SURFACE. 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 5. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5 −B− S 0.25 (0.010) B M M 1 4 DIM A B C D G H J K M N S G C R X 45 _ J −T− SEATING PLANE H 0.25 (0.010) K M D 7 PL M T B S A S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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