ISL83239E TM Data Sheet September 2001 ±15kV ESD Protected, 10nA SupplyCurrent, +3V to +5.5V, 250kbps, RS-232 Transmitters/Receivers The Intersil ISL83239E contains 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Additionally, it provides ±15kV ESD protection (IEC 1000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are cell phones, PDAs, Palmtops, and data cables where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with the manual powerdown function, reduce the standby supply current to a 10nA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. File Number 6015.1 Features • ESD Protection For RS-232 I/O Pins to ±15kV (IEC1000) • Drop In Replacement for SP3239E • Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V • RS-232 Compatible Outputs at 2.7V • Latch-Up Free • On-Chip Voltage Converters Require Only Four External Capacitors • Manual Powerdown Feature • Flow Through Pinout • Rx and Tx Hysteresis For Improved Noise Immunity • Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps • Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs The ISL83239E is a 5 driver, 3 receiver device that also includes a noninverting always-active receiver for “wake-up” capability. • Wide Power Supply Range . . . . . . . Single +3V to +5.5V Table 1 summarizes the features of the device represented by this data sheet, while Application Note AN9863 summarizes the features of each device comprising the ICL32XX 3V family. Applications • Low Supply Current in Powerdown State. . . . . . . . . . 10nA • Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - PDA Data Cradles and Cables - Cellular/Mobile Phones, Data Cables Ordering Information PART NO. TEMP. RANGE ( oC) PACKAGE PKG. NO. ISL83239EIA -40 to 85 28 Ld SSOP M28.209 ISL83239EIA-T -40 to 85 Tape and Reel M28.209 ISL83239EIV -40 to 85 28 Ld TSSOP M28.173 ISL83239EIV-T -40 to 85 Tape and Reel M28.173 TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL83239E NO. OF NO. OF Tx. Rx. 5 3 1 NO. OF MONITOR Rx. (R OUTB) DATA RATE (kbps) Rx. ENABLE FUNCTION? READY OUTPUT? MANUAL POWERDOWN? AUTOMATIC POWERDOWN FUNCTION? 1 250 NO NO YES NO CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. | Copyright © Intersil Americas Inc. 2001 ISL83239E Pinout ISL83239E (SSOP, TSSOP) TOP VIEW C2+ 1 28 C1+ GND 2 27 V+ C2- 26 VCC 3 25 C1- V- 4 T1 OUT 5 24 T1IN T2 OUT 6 23 T2IN T3 OUT 7 22 T3IN R1IN 8 21 R1 OUT R2IN 9 20 R2 OUT 19 T4IN T4OUT 10 R3IN 11 18 R3 OUT T5 OUT 12 17 T5IN N.C. 13 16 R1 OUTB 15 N.C. SHDN 14 Pin Descriptions PIN VCC FUNCTION System power supply input (3.0V to 5.5V). V+ Internally generated positive transmitter supply (+5.5V). V- Internally generated negative transmitter supply (-5.5V). GND Ground connection. C1+ External capacitor (voltage doubler) is connected to this lead. C1- External capacitor (voltage doubler) is connected to this lead. C2+ External capacitor (voltage inverter) is connected to this lead. C2- External capacitor (voltage inverter) is connected to this lead. TIN TTL/CMOS compatible transmitter Inputs. TOUT RIN ROUT ±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs. ±15kV ESD Protected, RS-232 compatible receiver inputs. TTL/CMOS level receiver outputs. ROUTB TTL/CMOS level, noninverting, always enabled receiver output. SHDN Active low input shuts down transmitters, receivers, and on-board power supply, to place device in low power mode. N.C. No internal connection. 2 ISL83239E Typical Operating Circuit ISL83239E NOTE 2 + 0.1µF 28 C1 0.1µF + C2 0.1µF + + C3 (OPTIONAL CONNECTION, NOTE 1) +3.3V 25 1 3 C1+ 26 27 VCC + V+ C1C2+ V- 4 C2T1 24 NOTE 2 C4 0.1µF + 5 T1IN T1 OUT T2 23 6 T2IN T2 OUT T3 22 7 T3IN T3 OUT T4 19 RS-232 LEVELS 10 T4IN T4 OUT T5 17 12 T5IN TTL/CMOS LOGIC LEVELS C3 0.1µF T5 OUT 16 R1OUTB 21 8 R1OUT R1IN 5kΩ R1 20 9 R2OUT R2IN 5kΩ R2 18 11 R3OUT R3IN 5kΩ R3 VCC RS-232 LEVELS 14 SHDN GND 2 NOTES: 1. THE NEGATIVE TERMINAL OF C3 CAN BE CONNECTED TO EITHER VCC OR GND. 2. FOR VCC = 3.15V (3.3V -5%), USE C 1 - C4 = 0.1µF OR GREATER. FOR VCC = 3.0V (3.3V -10%), USE C1 - C4 = 0.22µF. 3 ISL83239E Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, SHDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V CC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical, Note 3) θJA (oC/W) 28 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Moisture Sensitivity (see Technical Brief TB363) All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only) Operating Conditions Temperature Range ISL83239EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF; VCC = 3V, C1 - C4 = 0.22µF, Unless Otherwise Specified. Typicals are at TA = 25oC PARAMETER TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS DC CHARACTERISTICS Supply Current, Powerdown Disabled All Outputs Unloaded, V CC = 3.15V, SHDN = VCC 25 - 0.3 1.0 mA Supply Current, Powerdown SHDN = GND 25 - 10 300 nA LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low TIN, SHDN Input Logic Threshold High TIN, SHDN Full - - 0.8 V VCC = 3.3V Full 2.0 - - V VCC = 5.0V Full 2.4 - - V 25 - 0.5 - V Full - ±0.01 ±1.0 µA Transmitter Input Hysteresis Input Leakage Current TIN, SHDN Output Leakage Current SHDN = GND (Receivers Disabled) Full - ±0.05 ±10 µA Output Voltage Low IOUT = 1.6mA Full - - 0.4 V Output Voltage High IOUT = -1.0mA Full - V VCC -0.6 V CC -0.1 RECEIVER INPUTS Input Voltage Range Input Threshold Low Input Threshold High Full -25 - 25 V VCC = 3.3V 25 0.6 1.2 - V VCC = 5.0V 25 0.8 1.5 - V VCC = 3.3V to 5.0V 25 - 1.6 2.4 V Input Hysteresis 25 - 0.5 - V Input Resistance 25 3 5 7 kΩ TRANSMITTER OUTPUTS Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground Full ±5.0 ±5.4 - V Output Resistance VCC = V+ = V- = 0V, Transmitter Output = ±2V Full 300 10M - Ω Full - ±35 ±60 mA VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND Full - - ±25 µA Output Short-Circuit Current Output Leakage Current TIMING CHARACTERISTICS 4 ISL83239E Electrical Specifications Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF; VCC = 3V, C1 - C4 = 0.22µF, Unless Otherwise Specified. Typicals are at TA = 25oC (Continued) PARAMETER TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS Maximum Data Rate RL = 3kΩ, CL = 1000pF One Transmitter Switching Full 250 700 - kbps Receiver Propagation Delay Receiver Input to Receiver Output, C L = 150pF tPHL 25 - 0.15 - µs tPLH 25 - 0.15 - µs Receiver Output Enable Time Normal Operation 25 - 200 - ns Receiver Output Disable Time Normal Operation 25 - 200 - ns Transmitter Skew tPHL - tPLH 25 - 100 Receiver Skew tPHL - tPLH, CL = 150pF 25 - 50 - ns Transition Region Slew Rate VCC = 3.3V, RL = 3kΩ to 7kΩ, CL = 150pF to 1000pF Measured From 3V to -3V CL = 150pF to 2500pF or -3V to 3V 25 6 17 30 V/µs 25 4 12 30 V/µs Human Body Model 25 - ±15 - kV IEC1000-4-2 Air Gap Discharge 25 - ±15 - kV IEC1000-4-2 Contact Discharge 25 - ±8 - kV Human Body Model 25 - ±2.5 - kV ns ESD PERFORMANCE RS-232 Pins (TOUT, RIN) All Other Pins 5 ISL83239E Detailed Description The ISL83239E operates from a single +3V to +5.5V supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1µF (0.22µF for V CC = 3.0V) capacitors, features low power consumption, and meets all EIA/TIA-232 and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers. Charge-Pump Intersil’s new 3V RS-232 family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions at V CC = 3.3V. See the “Capacitor Selection” section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings. Additionally, it includes a noninverting (monitor) receiver (denoted by the R OUTB label) that is always active, regardless of the state of any control lines. All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kΩ to 7kΩ input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers’ Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. Monitor receivers remain active even during manual powerdown, making them extremely useful for Ring Indicator monitoring. Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral’s protection diodes (see Figures 2 and 3). This renders them useless for wake up functions, but the corresponding monitor receiver can be dedicated to this task as shown in Figure 3. VCC RXIN RXOUT -25V ≤ VRIN ≤ +25V 5kΩ GND ≤ VROUT ≤ VCC GND FIGURE 1. INVERTING RECEIVER CONNECTIONS Transmitters The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. All transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see Table 2). These outputs may be driven to ±12V when disabled. The ISL83239E guarantees a 250Kbps data rate for full load conditions (3kΩ and 250pF), VCC ≥ 3.0V, with one transmitter operating at full speed. Under more typical conditions of V CC ≥ 3.3V, C1-4 = 0.1 µF, RL = 3kΩ, and CL = 250pF, one transmitter easily operates at 1Mbps. Transmitter inputs float if left unconnected, and may cause ICC increases. Connect unused inputs to GND for the best performance. Receivers The ISL83239E contains standard inverting receivers that tristate when the SHDN control line is driven low. Powerdown Functionality This 3V device requires a nominal supply current of 0.3mA during normal operation (not in powerdown mode). This is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 10nA, because the on-chip charge pump turns off (V+ collapses to VCC , V- collapses to GND), and the transmitter outputs tristate. This micro-power mode makes the ISL83239E ideal for battery powered and portable applications. Software Controlled (Manual) Powerdown On the ISL83239E, the powerdown control is via a simple shutdown (SHDN) pin. Driving this pin high enables normal operation, while driving it low forces the IC into it’s powerdown state. Connect SHDN to VCC if the powerdown function isn’t needed. Note that all the transmitter and receiver outputs tri-state during shutdown (see Table 2). The time required to exit powerdown, and resume transmission is only 100µs. TABLE 2. POWERDOWN LOGIC TRUTH TABLE SHDN INPUT TRANSMITTER OUTPUTS RECEIVER OUTPUTS ROUTB OUTPUT L High-Z High-Z Active Manual Powerdown H Active Active Active Normal Operation 6 MODE OF OPERATION ISL83239E VCC VCC TABLE 3. REQUIRED CAPACITOR VALUES CURRENT FLOW VCC VOUT = VCC Rx POWERED DOWN UART Tx SHDN = GND GND OLD RS-232 CHIP VCC (V) C1 (µF) C2, C 3, C4 (µF) 3.0 to 3.6 (3.3V ±10%) 0.22 0.22 3.15 to 3.6 (3.3V ±5%) 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.22 1.0 Power Supply Decoupling FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC. VCC Operation down to 2.7V ISL83239E transmitter outputs meet RS-562 levels (±3.7V) with VCC as low as 2.7V. RS-562 levels typically ensure inter operability with RS-232 devices. TRANSITION DETECTOR TO WAKE-UP LOGIC ISL83239E Transmitter Outputs when Exiting Powerdown VCC R1OUTB RX POWERED DOWN UART VOUT = HI-Z R1OUT TX R1IN T1IN T1OUT SHDN = GND Figure 4 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V. FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN 5V/DIV SHDN T1 Capacitor Selection The charge pumps require 0.1µF capacitors for 3.3V (5% tolerance) operation. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C 3, and C4 can be increased without increasing C1’s value, however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-. 7 2V/DIV T2 VCC = +3.3V C1 - C4 = 0.1µF TIME (20µs/DIV.) FIGURE 4. TRANSMITTER OUTPUTS WHEN EXITING POWERDOWN High Data Rates The ISL83239E maintains the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 5 details a transmitter loopback test circuit, and Figure 6 illustrates the loopback test result at 120kbps. For this test, ISL83239E all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 7 shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver. VCC + 0.1µF + C1+ VCC V+ C1 C1+ V- C2+ + C3 C4 + C2TIN VCC SYSTEM POWER-SUPPLY SUPPLY VOLTAGE VOLTAGE (V) (V) 3.3 3.3 5 5 5 3.3 TOUT RIN ROUT CL 5k VCC The ISL83239E directly interfaces with 5V CMOS and TTL logic families. Nevertheless, with the device at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ISL83239E inputs, but ISL83239E outputs do not reach the minimum VIH for these logic families. See Table 4 for more information. TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES ISL83239E C2 Interconnection with 3V and 5V Logic SHDN FIGURE 5. TRANSMITTER LOOPBACK TEST CIRCUIT COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. ISL83239E outputs are incompatible with AC, HC, and CD4000 CMOS inputs. ±15kV ESD Protection All pins on ISL832XX devices include ESD protection structures, but the ISL83239E fsincorporates advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to ±15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don’t interfere with RS-232 signals as large as ±25V. 5V/DIV. T1IN T1OUT R1OUT VCC = +3.3V C1 - C4 = 0.1µF 5µs/DIV. FIGURE 6. LOOPBACK TEST AT 120kbps 5V/DIV. T1IN T1OUT Human Body Model (HBM) Testing As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5kΩ current limiting resistor, making the test less severe than the IEC-1000 test which utilizes a 330Ω limiting resistor. The HBM method determines an ICs ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD events to ±15kV. IEC1000-4-2 Testing R1OUT VCC = +3.3V C1 - C4 = 0.1µF 2µs/DIV. FIGURE 7. LOOPBACK TEST AT 250kbps 8 The IEC 1000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower ISL83239E current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain Typical Performance Curves repeatable results.The “E” device RS-232 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. All “E” family devices survive ±8kV contact discharges on the RS-232 pins. VCC = 3.3V, TA = 25oC 25 VOUT+ 4 -SLEW 20 SLEW RATE (V/µs) TRANSMITTER OUTPUT VOLTAGE (V) 6 2 1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps 0 -2 +SLEW 10 VOUT - -4 15 -SLEW -6 0 1000 2000 3000 4000 5 5000 0 1000 LOAD CAPACITANCE (pF) 55 3.5 50 3.0 250kbps 40 120kbps 35 30 25 20kbps 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 10. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA 9 4000 5000 NO LOAD ALL OUTPUTS STATIC 2.5 2.0 1.5 1.0 0.5 20 0 3000 FIGURE 9. SLEW RATE vs LOAD CAPACITANCE SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) FIGURE 8. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE 45 2000 LOAD CAPACITANCE (pF) 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) FIGURE 11. SUPPLY CURRENT vs SUPPLY VOLTAGE 6.0 ISL83239E Die Characteristics DIE DIMENSIONS: PASSIVATION: 106 mils x 128 mils (2700µm x 3250µm) METALLIZATION: Type: Silox Thickness: 13kÅ TRANSISTOR COUNT: Type: Metal 1: AISi(1%) Thickness: Metal 1: 8kÅ Type: Metal 2: AISi (1%) Thickness: Metal 2: 10kÅ 609 PROCES SUBSTRATE POTENTIAL (POWERED UP): GND 10 Si Gate CMOS ISL83239E Shrink Small Outline Plastic Packages (SSOP) M28.209 (JEDEC MO-150-AH ISSUE B) 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA 0.25(0.010) M H B M INCHES E -B1 2 SYMBOL GAUGE PLANE 3 L 0.25 0.010 SEATING PLANE -A- A D -C- e µα B 0.25(0.010) M C 0.10(0.004) C A M MAX A - A1 0.002 B S 5. Dimensioning and tolerancing per ANSI Y14.5M-1982. 6. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 7. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 8. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 9. “L” is the length of terminal for soldering to a substrate. 10. “N” is the number of terminal positions. 11. Terminal numbers are shown for reference only. 12. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 13. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 11 NOTES 0.078 - 2.00 - - 0.05 - - 0.065 0.072 1.65 1.85 - 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.390 0.413 9.90 10.50 3 E 0.197 0.220 5.00 5.60 4 0.026 BSC 0.65 BSC - H 0.292 0.322 7.40 8.20 - L 0.022 0.037 0.55 0.95 6 8o 0o α 4. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. MAX B N NOTES: MIN A2 e A2 A1 MILLIMETERS MIN 28 0o 28 7 8o Rev. 1 3/95 ISL83239E Thin Shrink Small Outline Plastic Packages (TSSOP) M28.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE B M 3 L 0.05(0.002) -A- SEATING PLANE A D -C- α e A1 b 0.10(0.004) M 0.25 0.010 A2 C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.047 - 1.20 - A1 0.002 0.006 0.05 0.15 - A2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - D 0.378 0.386 9.60 9.80 3 E1 0.169 0.177 4.30 4.50 4 e c 0.10(0.004) B S 0.026 BSC E 0.246 L 0.0177 N NOTES: MILLIMETERS α 0.65 BSC 0.256 6.25 0.0295 0.45 28 0o 6.50 0.75 28 8o 0o 14. These package dimensions are within allowable dimensions of JEDEC MO-153-AE, Issue E. 6 7 8o Rev. 0 6/98 15. Dimensioning and tolerancing per ANSI Y14.5M-1982. 16. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 17. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 18. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 19. “L” is the length of terminal for soldering to a substrate. 20. “N” is the number of terminal positions. 21. Terminal numbers are shown for reference only. 22. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 23. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation 7585 Irvine Center Drive Suite 100 Irvine, CA 92618 TEL: (949) 341-7000 FAX: (949) 341-7123 Intersil Corporation 2401 Palm Bay Rd. Palm Bay, FL 32905 TEL: (321) 724-7000 FAX: (321) 724-7946 12 EUROPE Intersil Europe Sarl Ave. C - F Ramuz 43 CH-1009 Pully Switzerland TEL: +41 21 7293637 FAX: +41 21 7293684 ASIA Intersil Corporation Unit 1804 18/F Guangdong Water Building 83 Austin Road TST, Kowloon Hong Kong TEL: +852 2723 6339 FAX: +852 2730 1433