CPC1977 i4-PAC™ Power Relay Description Characteristics Parameter Blocking Voltage Rating Units 600 VP Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. Load Current, TA=25°C: With 5°C/W Heat Sink 3.1 No Heat Sink 1.25 On-Resistance 1 Ω 0.35 °C/W RθJC As part of this family, the CPC1977 single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 3.1Arms continuous load current with a 5°C/W heat sink. Arms Features • • • • • • • • • • 3.1Arms Load Current with 5°C/W Heat Sink Low 1Ω On-Resistance 600VP Blocking Voltage 2500Vrms Input/Output Isolation Low Thermal Resistance (0.35 °C/W) Electrically Non-conductive Thermal Pad for Heat Sink Applications Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable Applications • • • • Industrial Controls / Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense The CPC1977 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output, constructed with efficient MOSFET switches and photovoltaic die, uses Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique i4-PAC package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.35 °C/W). Ordering Information Part Description CPC1977J i4-PAC Package (25 per tube) Switching Characteristics Approvals • UL 508 Recognized Component: File E69938 Form-A Pin Configuration IF 90% 10% ILOAD ton RoHS 2002/95/EC DS-CPC1977 - R06 toff e3 www.clare.com 1 CPC1977 1 Specifications 1.1 Absolute Maximum Ratings @ 25°C Symbol Blocking Voltage Ratings Units 600 VP Reverse Input Voltage 5 V Input Control Current 100 mA 1 A 150 mW Peak (10ms) Input Power Dissipation Isolation Voltage, Input to Output 2500 Vrms Operational Temperature -40 to +85 °C Storage Temperature -40 to +125 °C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 Electrical Characteristics @ 25°C Parameter Conditions Symbol Minimum Typical Maximum Units 15 AP Output Characteristics Load Current 1 Peak Continuous Continuous Continuous 2 On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current 3 Input Dropout Current Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output t≤10ms No Heat Sink TC=25°C IL TC=99°C IL(99) IF=10mA, IL=1A RON - 0.57 1 Ω VL=600VP ILEAK - - 1 μA ton - 7.5 20 toff - 0.085 5 VL=25V, f=1MHz Cout - 2450 - pF IL=1A IF - - 10 mA IF=5mA IF 0.6 - - mA VF 0.9 1.2 1.4 V VR=5V IR - - 10 μA - CI/O - 1 - pF IF=20mA, VL=10V - - 1.25 12.25 Arms 1.4 ms 1 Higher load currents possible with proper heat sinking. Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (T > 60ºC) a LED drive current of 20mA is recommended. C 2 R06 www.clare.com 2 CPC1977 PRELIMINARY 2 Thermal Characteristics Parameter Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Junction Temperature (Operating) Conditions Symbol Minimum Typical Maximum Units - RθJC - - 0.35 °C/W Free Air RθJA - 33 - °C/W - TJ -40 - 100 °C 2.1 Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W. 2.2 Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating RθCA = (TJ - TA) IL(99)2 IL2 • PD(99) - RθJC TJ = Junction Temperature (°C), TJ ≤ 100°C * TA = Ambient Temperature (°C) IL(99) = Load Current with Case Temperature @ 99°C (ADC) IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX) RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W * Elevated junction temperature reduces semiconductor lifetime. 3 www.clare.com R06 CPC1977 3 Performance Data 25 Device Count (N) Device Count (N) 30 25 20 15 10 5 1.30 20 15 10 5 1.31 1.32 1.33 35 6.5 7.0 7.5 8.0 Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC, TA=25ºC) 35 Device Count (N) Device Count (N) 20 15 10 8.5 0.55 0.56 0.57 0.58 0.09 0.10 0.11 Typical Blocking Voltage Distribution (N=50, TA=25ºC) 25 20 15 10 0.59 815 820 Turn-On (ms) 1.6 1.4 IF=50mA 1.2 IF=20mA IF=10mA 1.0 0.8 60 80 100 Typical Turn-On vs. LED Forward Current (IL=1ADC, TA=25ºC) 18 16 14 12 10 8 6 4 2 1 0 120 825 830 835 840 Typical Turn-Off vs. LED Forward Current (IL=1ADC, TA=25ºC) 0.18 0.17 0.16 Turn-Off (ms) 1.8 0.15 0.14 0.12 0.12 0.10 0.08 0 0 5 10 15 20 25 30 35 40 45 0 50 5 10 15 20 25 30 35 40 45 Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA) Typical IF for Switch Operation vs. Temperature (IL=1ADC) Typical Turn-On vs. Temperature (IF=10mA, IL=1ADC) Typical Turn-Off vs. Temperature (IF=10mA, IL=1ADC) 0.30 10 0.25 8 6 4 0 20 40 60 Temperature (ºC) 80 100 0.20 0.15 0.10 0.05 0 -20 50 0.35 12 Turn-Off (ms) Turn-On (ms) 14 2 -40 0.08 Blocking Voltage (VP) Typical LED Forward Voltage Drop vs. Temperature 20 18 16 14 12 10 8 6 4 2 0 0.06 Turn-Off (ms) On-Resistance (Ω) 40 0.04 9.0 0 0.54 20 5 5 0 0 10 30 25 5 -20 15 Turn-On (ms) 30 -40 20 0 1.34 LED Forward Voltage (V) LED Forward Voltage Drop (V) 25 0 0 LED Current (mA) Typical Turn-Off Time (N=50, IF=10mA, IL=1ADC, TA=25ºC) Typical Turn-On Time (N=50, IF=10mA, IL=1ADC, TA=25ºC) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=10mA, TA=25ºC) 0 -40 -20 0 20 40 60 80 100 -40 Temperature (ºC) -20 0 20 40 60 80 100 Temperature (ºC) Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.clare.com 4 CPC1977 PRELIMINARY 1.4 Load Current (A) 1.2 1.0 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 100 1.25 1.00 0.75 0.50 0.25 0 -0.25 -0.50 -0.75 -1.00 -1.25 -2.0 0 -0.66 0.66 1.33 6 5 4 5ºC/W 3 10ºC/W 2 Free Air 1 2.0 0 20 40 60 80 Temperature (ºC) Load Voltage (V) Temperature (ºC) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 1&2 (VL=600VP) Energy Rating Curve Free Air, No Heat Sink 845 0.014 840 0.012 Leakage (μA) 835 830 825 820 15 0.010 0.008 0.006 0.002 810 805 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 100 18 0.004 815 -40 1ºC/W 7 0 -1.33 Maximum Load Current vs. Temperature with Heat Sink (IF=20mA) 8 Load Current (AP) On-Resistance (Ω) 1.6 Load Current (Arms) 1.8 Blocking Voltage (VP) Typical Load Current vs. Load Voltage (IF=10mA, TA=25ºC) Typical On-Resistance vs. Temperature (IF=20mA, IL=0.75A) 12 9 6 3 0 -20 0 20 40 60 80 100 10µs 100µs 1ms 10ms 100ms Temperature (ºC) 1s 10s 100s Time Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.clare.com R06 CPC1977 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1977J MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1977J 245°C for 30 seconds 4.4 Board Wash Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. RoHS 2002/95/EC R06 e3 www.clare.com 6 CPC1977 PRELIMINARY 4.5 Mechanical Dimensions 5.029 ± 0.127 (0.198 ± 0.005) 19.914 ± 0.254 (0.784 ± 0.010) 1.930 ± 0.381 (0.076 ± 0.015) 17.221 ± 0.254 (0.678 ± 0.010) 1.181 ± 0.076 (0.047 ± 0.003) 15.317 ± 0.254 (0.603 ± 0.010) 20.879 ± 0.254 (0.822 ± 0.010) Isolated Heat Sink 20.396 ± 0.508 (0.803 ± 0.020) 15.240 ± 0.508 (0.600 ± 0.020) 2.362 ± 0.381 (0.093 ± 0.015) DIMENSIONS mm (inches) 3.810 ± 0.254 (0.150 ± 0.010) 0.635 ± 0.076 (0.025 ± 0.003) 1.270 TYP (0.050 TYP) 2.794 ± 0.127 (0.110 ± 0.005) NOTE: Back-side heat sink meets 2500Vrms isolation to the pins. For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1977-R06 ©Copyright 2011, Clare, Inc. All rights reserved. Printed in USA. 1/7/2011 7 www.clare.com R06