NSC ADC08500CIYB High performance, low power 8-bit, 500 msps a/d converter Datasheet

ADC08500
High Performance, Low Power 8-Bit, 500 MSPS A/D
Converter
General Description
Features
The ADC08500 is a low power, high performance CMOS
analog-to-digital converter that digitizes signals to 8 bits resolution at sampling rates up to 500 MSPS. Consuming a
typical 0.8 Watts at 500 MSPS from a single 1.9 Volt supply,
this device is guaranteed to have no missing codes over the
full operating temperature range. The unique folding and interpolating architecture, the fully differential comparator design, the innovative design of the internal sample-and-hold
amplifier and the self-calibration scheme enable a very flat
response of all dynamic parameters beyond Nyquist, producing a high 7.5 ENOB with a 250 MHz input signal and a 500
MHz sample rate while providing a 10-18 B.E.R. Output formatting is offset binary and the LVDS digital outputs are
compatible with IEEE 1596.3-1996, with the exception of an
adjustable common mode voltage between 0.8V and 1.2V.
The converter has a 1:2 demultiplexer that feeds two LVDS
buses and reduces the output data rate on each bus to half
the sampling rate.
The converter typically consumes less than 3.5 mW in the
Power Down Mode and is available in a 128-lead, thermally
enhanced exposed pad LQFP and operates over the Industrial (-40°C ≤ TA ≤ +85°C) temperature range.
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Internal Sample-and-Hold
Single +1.9V ±0.1V Operation
Choice of SDR or DDR output clocking
Multiple ADC Synchronization Capability
Guaranteed No Missing Codes
Serial Interface for Extended Control
Fine Adjustment of Input Full-Scale Range and Offset
Duty Cycle Corrected Sample Clock
Key Specifications
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Resolution
Max Conversion Rate
Bit Error Rate
ENOB @ 250 MHz Input
DNL
Power Consumption
— Operating
— Power Down Mode
8 Bits
500 MSPS (min)
10-18 (typ)
7.5 Bits (typ)
±0.15 LSB (typ)
0.8 W (typ)
3.5 mW (typ)
Applications
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Direct RF Down Conversion
Digital Oscilloscopes
Satellite Set-top boxes
Communications Systems
Test Instrumentation
Block Diagram
20206453
© 2007 National Semiconductor Corporation
202064
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ADC08500 High Performance, Low Power 8-Bit, 500 MSPS A/D Converter
June 2007
ADC08500
Ordering Information
Industrial Temperature Range
(-40°C < TA < +85°C)
NS Package
ADC08500CIYB
128-Pin Exposed Pad LQFP
ADC08500DEV
Development Board
Pin Configuration
20206401
* Exposed pad on back of package must be soldered to ground plane to ensure rated performance.
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2
ADC08500
Pin Descriptions and Equivalent Circuits
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
OutV / SCLK
Output Voltage Amplitude and Serial Interface Clock. Tie this
pin high for normal differential DCLK and data amplitude.
Ground this pin for a reduced differential output amplitude and
reduced power consumption. See1.1.6 The LVDS Outputs.
When the extended control mode is enabled, this pin functions
as the SCLK input which clocks in the serial data. See 1.2
NORMAL/EXTENDED CONTROL for details on the extended
control mode. See 1.3 THE SERIAL INTERFACE for
description of the serial interface.
OutEdge / DDR /
SDATA
DCLK Edge Select, Double Data Rate Enable and Serial Data
Input. This input sets the output edge of DCLK+ at which the
output data transitions. When this pin is floating or connected
to 1/2 the supply voltage, DDR clocking is enabled. See1.1.5.2
Double Data Rate. When the extended control mode is
enabled, this pin functions as the SDATA input. See 1.2
NORMAL/EXTENDED CONTROL for details on the extended
control mode. See 1.3 THE SERIAL INTERFACE for
description of the serial interface.
15
DCLK_RST
DCLK Reset. A positive pulse on this pin is used to reset and
synchronize the DCLK outs of multiple converters. See 1.5
MULTIPLE ADC SYNCHRONIZATION for detailed
description.
26
PD
Power Down Pin. A logic high on the PD pin puts the entire
device into the Power Down Mode.
CAL
Calibration Cycle Initiate. A minimum tCAL_L input clock cycles
logic low followed by a minimum of tCAL_H input clock cycles
high on this pin initiates the self calibration sequence. See
2.4.2 Self Calibration for an overview of self-calibration and
2.4.2.2 On-Command Calibration for a description of oncommand calibration.
FSR/ECE
Full Scale Range Select and Extended Control Enable. In nonextended control mode, a logic low on this pin sets the fullscale differential input range to a reduced VIN input level . A
logic high on this pin sets the full-scale differential input range
to a higher VIN input level. See Converter Electrical
Characteristics. To enable the extended control mode,
whereby the serial interface and control registers are
employed, allow this pin to float or connect it to a voltage equal
to VA/2. See 1.2 NORMAL/EXTENDED CONTROL for
information on the extended control mode.
3
4
30
14
3
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ADC08500
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
CalDly / SCS
Calibration Delay and Serial Interface Chip Select. With a logic
high or low on pin 14, this pin functions as Calibration Delay
and sets the number of clock cycles after power up before
calibration begins. See 1.1.1 Self-Calibration. With pin 14
floating, this pin acts as the enable pin for the serial interface
input and the CalDly value becomes "0" (short delay with no
provision for a long power-up calibration delay).
CLK+
CLK-
LVDS Clock input pins for the ADC. The differential clock
signal must be a.c. coupled to these pins. The input signal is
sampled on the falling edge of CLK+. See1.1.2 Acquiring the
Input for a description of acquiring the input and 2.3 THE
CLOCK INPUTS for an overview of the clock inputs.
VIN+
VIN−
Analog signal inputs to the ADC. The differential full-scale
input range of this input is programmable using the FSR pin
14 in normal mode and the Input Full-Scale Voltage Adjust
register in the extended control mode. Refer to the VIN
specification in the Converter Electrical Characteristics for the
full-scale input range in the normal mode. Refer to 1.4
REGISTER DESCRIPTION for the full-scale input range in the
extended control mode.
7
VCMO
Common Mode Voltage. This pin is the common mode output
in d.c. coupling mode and also serves as the a.c. coupling
mode select pin. When d.c. coupling is used, the voltage
output at this pin is required to be the common mode input
voltage at VIN+ and VIN− when d.c. coupling is used. This pin
should be grounded when a.c. coupling is used at the analog
inputs. This pin is capable of sourcing or sinking 100 μA. See
2.2 THE ANALOG INPUT.
31
VBG
126
CalRun
127
18
19
11
10
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Bandgap output voltage capable of 100 μA source/sink.
Calibration Running indication. This pin is at a logic high when
calibration is running.
4
ADC08500
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
32
REXT
34
35
Tdiode_P
Tdiode_N
Temperature Diode Positive (Anode) and Negative (Cathode)
for die temperature measurements. See 2.6.2 Thermal
Management.
83
84
85
86
89
90
91
92
93
94
95
96
100
101
102
103
D7D7+
D6D6+
D5D5+
D4D4+
D3D3+
D2D2+
D1D1+
D0D0+
Input channel LVDS Data Outputs that are not delayed in the
output demultiplexer. Compared with the Dd outputs, these
outputs represent the later time samples. These outputs
should always be terminated with a 100Ω differential resistor.
104
105
106
107
111
112
113
114
115
116
117
118
122
123
124
125
Dd7Dd7+
Dd6Dd6+
Dd5Dd5+
Dd4Dd4+
Dd3Dd3+
Dd2Dd2+
Dd1Dd1+
Dd0Dd0+
Input channel LVDS Data Outputs that are delayed by one
CLK cycle in the output demultiplexer. Compared with the D
outputs, these outputs represent the earlier time sample.
These outputs should always be terminated with a 100Ω
differential resistor.
External bias resistor connection.
Nominal value is 3.3 kOhms (±0.1%) to ground. See 1.1.1
Self-Calibration.
5
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ADC08500
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
OR+
OR-
Out Of Range output. A differential high at these pins indicates
that the differential input is out of range (outside the range
±VIN/2 as programmed by the FSR pin in non-extended control
mode or the Input Full-Scale Voltage Adjust register setting in
the extended control mode).
82
81
DCLK+
DCLK-
Differential Clock outputs used to latch the output data.
Delayed and non-delayed data outputs are supplied
synchronous to this signal. This signal is at 1/2 the input clock
rate in SDR mode and at 1/4 the input clock rate in the DDR
mode.The DCLK outputs are not active during a calibration
cycle, therefore this is not recommended as a system clock.
2, 5, 8, 13,
16, 17, 20,
25, 28, 33,
128
VA
Analog power supply pins. Bypass these pins to ground.
40, 51 ,62,
73, 88, 99,
110, 121
VDR
Output Driver power supply pins. Bypass these pins to DR
GND.
1, 6, 9, 12,
21, 24, 27,
41
GND
Ground return for VA.
42, 53, 64,
74, 87, 97,
108, 119
DR GND
Ground return for VDR.
22, 23, 29,
36–39,
43–50, 52,
54–61, 63,
65–72,
75–78, 98,
109, 120
NC
79
80
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No Connection. Make no connection to these pins.
6
Operating Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Ambient Temperature Range
Supply Voltage (VA, VDR)
Supply Difference
VDR - VA
Voltage on Any Input Pin
Ground Difference
|GND - DR GND|
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
Power Dissipation at TA = 85°C
ESD Susceptibility (Note 4)
Human Body Model
Machine Model
−40°C ≤ TA ≤ +85°C
Supply Voltage (VA)
Driver Supply Voltage (VDR)
Analog Input Common Mode Voltage
VIN+, VIN- Voltage Range
(Maintaining Common Mode)
Ground Difference
(|GND - DR GND|)
CLK Pins Voltage Range
Differential CLK Amplitude
2.2V
0V to 100 mV
−0.15V to (VA +0.15V)
Storage Temperature
(Notes 1, 2)
0V to 100 mV
±25 mA
±50 mA
2.0 W
+1.8V to +2.0V
+1.8V to VA
VCMO ±50 mV
200 mV to VA
0V
0V to VA
0.4VP-P to 2.0VP-P
Package Thermal Resistance
2500V
250V
−65°C to +150°C
Package
θJA
128-Lead
Exposed Pad
LQFP
25°C / W
θJC (Top of
θJ-PAD
Package)
(Thermal Pad)
10°C / W
2.8°C / W
Soldering
process
must
comply
with
National
Semiconductor's Reflow Temperature Profile specifications.
Refer to www.national.com/packaging. (Note 5)
Converter Electrical Characteristics
The following specifications apply after calibration for VA = VDR =
+1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential 870 mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock,
fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG = Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%,
Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C,
unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
STATIC CONVERTER CHARACTERISTICS
INL
Integral Non-Linearity
DC Coupled, 1MHz Sine Wave
Overanged
±0.3
±0.9
LSB (max)
DNL
Differential Non-Linearity
DC Coupled, 1MHz Sine Wave
Overanged
±0.15
±0.6
LSB (max)
8
Bits
−1.5
0.5
LSB (min)
LSB (max)
±25
mV (max)
±25
mV (max)
±15
%FS
Resolution with No Missing Codes
VOFF
Offset Error
VOFF_ADJ Input Offset Adjustment Range
PFSE
Positive Full-Scale Error (Note 9)
NFSE
Negative Full-Scale Error (Note 9)
FS_ADJ
Full-Scale Adjustment Range
-0.5
Extended Control Mode
Extended Control Mode
±45
±20
mV
DYNAMIC CONVERTER CHARACTERISTICS
FPBW
Full Power Bandwidth
B.E.R.
Bit Error Rate
Gain Flatness
ENOB
SINAD
SNR
Effective Number of Bits
Signal-to-Noise Plus Distortion Ratio
Signal-to-Noise Ratio
1.7
GHz
10-18
Error/Sample
d.c. to 500 MHz
±0.5
dBFS
fIN = 50 MHz, VIN = FSR − 0.5 dB
7.5
fIN = 124 MHz, VIN = FSR − 0.5 dB
7.5
7.1
Bits (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
7.5
7.1
Bits (min)
fIN = 50 MHz, VIN = FSR − 0.5 dB
47
fIN = 124 MHz, VIN = FSR − 0.5 dB
47
44.5
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
47
44.5
dB (min)
fIN = 50 MHz, VIN = FSR − 0.5 dB
48
fIN = 124 MHz, VIN = FSR − 0.5 dB
47.5
45.3
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
47.5
45.3
dB (min)
7
Bits
dB
dB
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ADC08500
Absolute Maximum Ratings (Notes 1, 2)
ADC08500
Symbol
THD
2nd Harm
3rd Harm
SFDR
IMD
Parameter
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free dynamic Range
Intermodulation Distortion
Out of Range Output Code
(In addition to OR Output high)
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
fIN = 50 MHz, VIN = FSR − 0.5 dB
-55
fIN = 124 MHz, VIN = FSR − 0.5 dB
-56
−47.5
dB (max)
fIN = 248 MHz, VIN = FSR − 0.5 dB
-56
−47.5
dB (max)
fIN = 50 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 124 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 50 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 124 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 50 MHz, VIN = FSR − 0.5 dB
55
fIN = 124 MHz, VIN = FSR − 0.5 dB
56
47.5
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
56
47.5
dB (min)
fIN1 = 121 MHz, VIN = FSR − 7 dB
fIN2 = 126 MHz, VIN = FSR − 7 dB
-50
dB
dB
dB
(VIN+) − (VIN−) > + Full Scale
255
(VIN+) − (VIN−) < − Full Scale
0
ANALOG INPUT AND REFERENCE CHARACTERISTICS
VIN
650
FSR pin 14 High
870
Full Scale Analog Differential Input
Range
VCMI
Analog Input Common Mode Voltage
CIN
Analog Input Capacitance, Normal
operation (Notes 10, 11)
RIN
FSR pin 14 Low
VCMO
Differential
0.02
Each input pin to ground
1.6
Differential Input Resistance
100
570
mVP-P (min)
730
mVP-P (max)
790
mVP-P (min)
950
mVP-P (max)
VCMO − 50
VCMO + 50
mV (min)
mV (max)
pF
pF
94
Ω (min)
106
Ω (max)
0.95
1.45
V (min)
V (max)
ANALOG OUTPUT CHARACTERISTICS
VCMO
Common Mode Output Voltage
ICMO = ±100 µA
1.26
VCMO_LVL
VCMO input threshold to set DC
Coupling mode
VA = 1.8V
0.60
V
VA = 2.0V
0.66
V
TC VCMO
Common Mode Output Voltage
Temperature Coefficient
TA = −40°C to +85°C
118
ppm/°C
CLOAD
VCMO
Maximum VCMO load Capacitance
VBG
Bandgap Reference Output Voltage
IBG = ±100 µA
TC VBG
Bandgap Reference Voltage
Temperature Coefficient
TA = −40°C to +85°C
IBG = ±100 µA
CLOAD VBG
Maximum Bandgap Reference Load
Capacitance
1.26
80
pF
1.20
1.33
V (min)
V (max)
28
ppm/°C
80
pF
TEMPERATURE DIODE CHARACTERISTICS
ΔVBE
Temperature Diode Voltage
192 µA vs. 12 µA,
TJ = 25°C
71.23
mV
192 µA vs. 12 µA,
TJ = 85°C
85.54
mV
1
LSB
CHANNEL-TO-CHANNEL CHARACTERISTICS
Offset Error Match
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8
Typical
(Note 8)
Positive Full-Scale Error Match
Zero offset selected in Control Register
1
Negative Full-Scale Error Match
Zero offset selected in Control Register
1
LSB
Phase Matching (I,Q)
FIN = 1.0 GHz
<1
Degree
Sine Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
Square Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
VIN = 0 or VIN = VA
±1
µA
Differential
0.02
pF
Each input to ground
1.5
pF
Parameter
Limits
(Note 8)
Units
(Limits)
LSB
CLOCK INPUT CHARACTERISTICS
VID
Differential Clock Input Level
II
Input Current
CIN
Input Capacitance (Notes 10, 11)
DIGITAL CONTROL PIN CHARACTERISTICS
VIH
Logic High Input Voltage
(Note 12)
VIL
Logic Low Input Voltage
(Note 12)
CIN
Input Capacitance (Notes 11, 13)
Each input to ground
1.2
Measured differentially, OutV = VA,
VBG = Floating, (Note 15)
710
0.85 x VA
V (min)
0.15 x VA
V (max)
pF
DIGITAL OUTPUT CHARACTERISTICS
VOD
LVDS Differential Output Voltage
Measured differentially, OutV = GND,
VBG = Floating, (Note 15)
510
400
mVP-P (min)
920
mVP-P (max)
280
mVP-P (min)
720
mVP-P (max)
Δ VO DIFF
Change in LVDS Output Swing
Between Logic Levels
VOS
Output Offset Voltage, see Figure 1
VOS
Output Offset Voltage, see Figure 1
Δ VOS
Output Offset Voltage Change
Between Logic Levels
IOS
Output Short Circuit Current
ZO
Differential Output Impedance
VOH
Cal_Run H level output
IOH = -400 uA (Note 12)
1.65
1.5
V
VOL
Cal_Run L level output
IOH = 400 uA (Note 12)
0.15
0.3
V
±1
mV
VBG = Floating
800
mV
VBG = VA (Note 15)
1200
mV
±1
mV
Output+ & Output- connected to 0.8V
±4
mA
100
Ohms
POWER SUPPLY CHARACTERISTICS
IA
Analog Supply Current
PD = Low
PD = High
340
1.8
408
mA (max)
mA
IDR
Output Driver Supply Current
PD = Low
PD = High
112
0.012
157
mA (max)
mA
PD
Power Consumption
PD = Low
PD = High
0.8
3.5
1.0
W (max)
mW
PSRR1
D.C. Power Supply Rejection Ratio
Change in Full Scale Error with change
in VA from 1.8V to 2.0V
30
dB
PSRR2
A.C. Power Supply Rejection Ratio
248 MHz, 50mVP-P riding on VA
51
dB
AC ELECTRICAL CHARACTERISTICS
fCLK1
Maximum Input Clock Frequency
fCLK2
Minimum Input Clock Frequency
500
MHz (min)
% (min)
% (max)
200
MHz
Input Clock Duty Cycle
200 MHz ≤ Input clock frequency ≤
800 MHz (Note 12)
50
20
80
tCL
Input Clock Low Time
(Note 12)
500
400
ps (min)
tCH
Input Clock High Time
(Note 12)
500
400
ps (min)
DCLK Duty Cycle
(Note 12)
50
45
55
% (min)
% (max)
9
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ADC08500
Conditions
Symbol
ADC08500
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
tRS
Reset Setup Time
(Note 12)
150
ps
tRH
Reset Hold Time
(Note 12)
250
ps
tSD
Synchronizing Edge to DCLK Output
Delay
tRPW
Reset Pulse Width
(Note 11)
tLHT
Differential Low to High Transition
Time
10% to 90%, CL = 2.5 pF
250
ps
tHLT
Differential High to Low Transition
Time
10% to 90%, CL = 2.5 pF
250
ps
tOSK
DCLK to Data Output Skew
50% of DCLK transition to 50% of Data
transition, SDR Mode
and DDR Mode, 0° DCLK (Note 12)
±50
ps (max)
tSU
Data to DCLK Set-Up Time
DDR Mode, 90° DCLK (Note 12)
1.7
ns
tH
DCLK to Data Hold Time
DDR Mode, 90° DCLK (Note 12)
1.9
ns
tAD
Sampling (Aperture) Delay
Input CLK+ Fall to Acquisition of Data
1.3
ns
tAJ
Aperture Jitter
0.4
ps rms
tOD
Input Clock to Data Output Delay (in
addition to Pipeline Delay)
50% of Input Clock transition to 50% of
Data transition
3.1
ns
Pipeline Delay (Latency)
(Notes 11, 14)
D Outputs
13
Dd Outputs
14
Over Range Recovery Time
tOD + tOSK
4
Differential VIN step from ±1.2V to 0V
to get accurate conversion
CLK± Cycles
(min)
CLK± Cycles
1
CLK± Cycle
500
ns
tWU
PD low to Rated Accuracy Conversion
(Wake-Up Time)
fSCLK
Serial Clock Frequency
(Note 12)
100
MHz
tSSU
Data to Serial Clock Setup Time
(Note 12)
2.5
ns (min)
tSH
Data to Serial Clock Hold Time
(Note 12)
1
ns (min)
Serial Clock Low Time
4
ns (min)
Serial Clock High Time
4
ns (min)
tCAL
Calibration Cycle Time
tCAL_L
CAL Pin Low Time
See Figure 9 (Note 11)
80
CLK± Cycles
(min)
tCAL_H
CAL Pin High Time
See Figure 9 (Note 11)
80
CLK± Cycles
(min)
CalDly = Low
See 1.1.1 Self-Calibration, Figure 9,
(Note 15)
225
CLK± Cycles
(min)
CalDly = High
See 1.1.1 Self-Calibration, Figure 9,
(Note 15)
231
CLK± Cycles
(max)
tCalDly
Calibration delay determined by
CalDly (pin 127)
1.4 x
105
CLK± Cycles
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no guarantee of operation at the Absolute Maximum
Ratings. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications
and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than VA), the current at that pin should be limited to
25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to
two. This limit is not placed upon the power, ground and digital output pins.
Note 4: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO Ohms.
Note 5: Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 6: The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device.
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10
ADC08500
20206404
Note 7: To guarantee accuracy, it is required that VA and VDR be well bypassed. Each supply pin must be decoupled with separate bypass capacitors. Additionally,
achieving rated performance requires that the backside exposed pad be well grounded.
Note 8: Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are guaranteed to National's AOQL (Average Outgoing Quality
Level).
Note 9: Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device,
therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Transfer Characteristic Figure 2. For relationship between Gain Error and FullScale Error, see Specification Definitions for Gain Error.
Note 10: The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF each pin to
ground are isolated from the die capacitances by lead and bond wire inductances.
Note 11: This parameter is guaranteed by design and is not tested in production.
Note 12: This parameter is guaranteed by design and/or characterization and is not tested in production.
Note 13: The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated from the die
capacitances by lead and bond wire inductances.
Note 14: The ADC08500 has two LVDS output buses, which each clock data out at one half the sample rate. The data at each bus is clocked out at one half the
sample rate. The second bus (D0 through D7) has a pipeline latency that is one clock cycle less than the latency of the first bus (Dd0 through Dd7)
Note 15: Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400 mv (typical), as shown in the VOS specification above. Tying VBG to the
supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40mV (typical).
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ADC08500
Specification Definitions
APERTURE (SAMPLING) DELAY is the amount of delay,
measured from the sampling edge of the CLK input, after
which the signal present at the input pin is sampled inside the
device.
APERTURE JITTER (tAJ) is the variation in aperture delay
from sample to sample. Aperture jitter shows up as input
noise.
Bit Error Rate (B.E.R.) is the probability of error and is defined as the probable number of word errors on the ADC
output per unit of time divided by the number of words seen
in that amount of time. A B.E.R. of 10-18 corresponds to a
statistical error in one word about every four (4) years.
CLOCK DUTY CYCLE is the ratio of the time that the clock
wave form is at a logic high to the total time of one clock period.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
Measured at sample rate = 500 MSPS with a 1MHz input
sinewave.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion Ratio, or SINAD. ENOB is defined as (SINAD −
1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH (FPBW) is a measure of the
frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
GAIN ERROR is the deviation from the ideal slope of the
transfer function. It can be calculated from Offset and FullScale Errors:
Positive Gain Error = Offset Error − Positive Full-Scale
Error
Negative Gain Error = −(Offset Error − Negative FullScale Error)
Gain Error = Negative Full-Scale Error − Positive FullScale Error = Positive Gain Error + Negative Gain Error
INTEGRAL NON-LINEARITY (INL) is a measure of worst
case deviation of the ADC transfer function from an ideal
straight line drawn through the ADC transfer function. The
deviation of any given code from this straight line is measured
from the center of that code value step. The best fit method
is used.
INTERMODULATION DISTORTION (IMD) is the creation of
additional spectral components as a result of two sinusoidal
frequencies being applied to the ADC input at the same time.
It is defined as the ratio of the power in the second and third
order intermodulation products to the power in one of the
original frequencies. IMD is usually expressed in dBFS.
LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is
20206446
FIGURE 1.
LVDS OUTPUT OFFSET VOLTAGE (VOS) is the midpoint
between the D+ and D- pins output voltage referenced to
ground. ie., [(VD+) +( VD-)]/2.
MISSING CODES are those output codes that are skipped
and will never appear at the ADC outputs. These codes cannot be reached with any input value.
MSB (MOST SIGNIFICANT BIT) is the bit that has the largest
value or weight. Its value is one half of full scale.
NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of
how far the first code transition is from the ideal 1/2 LSB above
a differential -VIN/2. For the ADC08500 the reference voltage
is assumed to be ideal, so this error is a combination of fullscale error and reference voltage error.
OFFSET ERROR (VOFF) is a measure of how far the midscale point is from the ideal zero voltage differential input.
Offset Error = Actual Input causing average of 8k samples to result in an average code of 127.5.
OUTPUT DELAY (tOD) is the time delay after the falling edge
of DCLK before the data update is present at the output pins.
OVER-RANGE RECOVERY TIME is the time required after
the differential input voltages goes from ±1.2V to 0V for the
converter to recover and make a conversion with its rated accuracy.
PIPELINE DELAY (LATENCY) is the number of clock cycles
between initiation of conversion and when that data is presented to the output driver stage. New data is available at
every clock cycle, but the data lags the conversion by the
Pipeline Delay plus the tOD.
POSITIVE FULL-SCALE ERROR (PFSE) is a measure of
how far the last code transition is from the ideal 1-1/2 LSB
below a differential +VIN/2 . For the ADC08500 the reference
voltage is assumed to be ideal, so this error is a combination
of full-scale error and reference voltage error.
POWER SUPPLY REJECTION RATIO (PSRR) can be one
of two specifications. PSRR1 (DC PSRR) is the ratio of the
change in full-scale error that results from a power supply
voltage change from 1.8V to 2.0V. PSRR2 (AC PSRR) is a
measure of how well an a.c. signal riding upon the power
supply is rejected from the output and is measured with a 248
MHz, 50 mVP-P signal riding upon the power supply. It is the
ratio of the output amplitude of that signal at the output to its
amplitude on the power supply pin. PSRR is expressed in dB.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal at the output to the rms
value of the sum of all other spectral components below onehalf the sampling frequency, not including harmonics or d.c.
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or
SINAD) is the ratio, expressed in dB, of the rms value of the
input signal at the output to the rms value of all of the other
spectral components below half the clock frequency, including harmonics but excluding d.c.
VFS / 2n
where VFS is the differential full-scale amplitude VIN as set by
the FSR input and "n" is the ADC resolution in bits, which is
8 for the ADC08500.
LVDS DIFFERENTIAL OUTPUT VOLTAGE (VOD) is the absolute value of the difference between the VD+ & VD- outputs;
each measured with respect to Ground.
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Transfer Characteristic
20206422
FIGURE 2. Input / Output Transfer Characteristic
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ADC08500
where Af1 is the RMS power of the fundamental (output) frequency and Af2 through Af10 are the RMS power of the first 9
harmonic frequencies in the output spectrum.
– Second Harmonic Distortion (2nd Harm) is the difference, expressed in dB, between the RMS power in the input
frequency seen at the output and the power in its 2nd harmonic level at the output.
– Third Harmonic Distortion (3rd Harm) is the difference
expressed in dB between the RMS power in the input frequency seen at the output and the power in its 3rd harmonic
level at the output.
SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input
signal at the output and the peak spurious signal, where a
spurious signal is any signal present in the output spectrum
that is not present at the input, excluding d.c.
TOTAL HARMONIC DISTORTION (THD) is the ratio expressed in dB, of the rms total of the first nine harmonic levels
at the output to the level of the fundamental at the output. THD
is calculated as
ADC08500
Timing Diagrams
20206414
FIGURE 3. ADC08500 Timing — SDR Clocking
20206459
FIGURE 4. ADC08500 Timing — DDR Clocking
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14
ADC08500
20206419
FIGURE 5. Serial Interface Timing
20206420
FIGURE 6. Clock Reset Timing in DDR Mode
20206423
FIGURE 7. Clock Reset Timing in SDR Mode with OUTEDGE Low
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ADC08500
20206424
FIGURE 8. Clock Reset Timing in SDR Mode with OUTEDGE High
20206425
FIGURE 9. Self Calibration and On-Command Calibration Timing
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16
VA = VDR= 1.9V, fCLK= 500 MHz, TA= 25°C unless otherwise stated.
INL vs CODE
INL vs TEMPERATURE
20206464
20206465
DNL vs. CODE
DNL vs. TEMPERATURE
20206466
20206467
POWER CONSUMPTION vs. SAMPLE RATE
ENOB vs. TEMPERATURE
20206481
20206476
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ADC08500
Typical Performance Characteristics
ADC08500
ENOB vs. SUPPLY VOLTAGE
ENOB vs. SAMPLE RATE
20206477
20206478
ENOB vs. INPUT FREQUENCY
SNR vs. TEMPERATURE
20206479
20206468
SNR vs. SUPPLY VOLTAGE
SNR vs. SAMPLE RATE
20206469
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20206470
18
ADC08500
SNR vs. INPUT FREQUENCY
THD vs. TEMPERATURE
20206471
20206472
THD vs. SUPPLY VOLTAGE
THD vs. SAMPLE RATE
20206473
20206474
THD vs. INPUT FREQUENCY
SFDR vs. TEMPERATURE
20206475
20206485
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ADC08500
SFDR vs. SUPPLY VOLTAGE
SFDR vs. SAMPLE RATE
20206484
20206482
SFDR vs. INPUT FREQUENCY
Spectral Response at fIN = 98 MHz
20206483
20206487
Spectral Response at fIN = 248 MHz
FULL POWER BANDWIDTH
20206486
20206488
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The ADC08500 is a versatile A/D Converter with an innovative architecture permitting very high speed operation. The
controls available ease the application of the device to circuit
solutions. Optimum performance requires adherence to the
provisions discussed here and in the Applications Information
Section.
While it is generally poor practice to allow an active pin to float,
pins 4 and 14 of the ADC08500 are designed to be left floating
without jeopardy. In all discussions throughout this data
sheet, whenever a function is called by allowing a pin to float,
connecting that pin to a potential of one half the VA supply
voltage will have the same effect as allowing it to float.
1.1 OVERVIEW
The ADC08500 uses a calibrated folding and interpolating
architecture that achieves 7.5 effective bits. The use of folding
amplifiers greatly reduces the number of comparators and
power consumption. Interpolation reduces the number of
front-end amplifiers required, minimizing the load on the input
signal and further reducing power requirements. In addition
to other things, on-chip calibration reduces the INL bow often
seen with folding architectures. The result is an extremely
fast, high performance, low power converter.
The analog input signal that is within the converter's input
voltage range is digitized to eight bits at speeds of 200 MSPS
to 500 MSPS, typical. Differential input voltages below negative full-scale will cause the output word to consist of all
zeroes. Differential input voltages above positive full-scale
will cause the output word to consist of all ones. Either of
these conditions at the input will cause the OR (Out of Range)
output to be activated. This single OR output indicates when
the output code from one or both of the channels is below
negative full scale or above positive full scale.
The converter has a 1:2 demultiplexer that feeds two LVDS
output buses. The data on these buses provide an output
word rate on each bus at half the ADC sampling rate and must
be interleaved by the user to provide output words at the full
conversion rate.
The output levels may be selected to be normal or reduced.
Using reduced levels saves power but could result in erroneous data capture of some or all of the bits, especially at
higher sample rates and in marginally designed systems.
Calibration Operation Notes:
• During the calibration cycle, the OR output may be active
as a result of the calibration algorithm. All data on the
output pins and the OR output are invalid during the
calibration cycle.
• During the power-up calibration and during the oncommand calibration, all clocks are halted on chip,
including internal clocks and DCLK, while the input
termination resistor is trimmed to a value that is equal to
REXT / 33. This is to reduce noise during the input resistor
calibration portion of the calibration cycle.
This external resistor is located between pin 32 and
ground. REXT must be 3300 Ω ±0.1%. With this value, the
input termination resistor is trimmed to be 100 Ω. Because
REXT is also used to set the proper current for the Track
and Hold amplifier, for the preamplifiers and for the
comparators, other values of REXT should not be used.
• The CalRun output is high whenever the calibration
procedure is running. This is true whether the calibration
is done at power-up or on-command.
1.1.2 Acquiring the Input
Data is acquired at the falling edge of CLK+ (pin 18) and the
digital equivalent of that data is available at the digital outputs
13 clock cycles later for the D output bus and 14 clock cycles
later for the Dd output bus. There is an additional internal delay called tOD before the data is available at the outputs. See
the Timing Diagram. The ADC08500 will convert as long as
the clock signal is present. The fully differential comparator
design and the innovative design of the sample-and-hold amplifier, together with self calibration, enables a very flat
SINAD/ENOB response beyond 500 MHz. The ADC08500
output data signaling is LVDS and the output format is offset
binary.
1.1.1 Self-Calibration
A self-calibration is performed upon power-up and can also
be invoked by the user upon command. Calibration trims the
100Ω analog input differential termination resistor and minimizes full-scale error, offset error, DNL and INL, resulting in
maximizing SNR, THD, SINAD (SNDR) and ENOB. Internal
bias currents are also set with the calibration process. All of
this is true whether the calibration is performed upon power
up or is performed upon command. Running the self calibration is an important part of this chip's functionality and is
required in order to obtain adequate performance. In addition
to the requirement to be run at power-up, self calibration must
be re-run whenever the sense of the FSR pin is changed. For
best performance, we recommend that self calibration be run
20 seconds or more after application of power and whenever
the operating temperature changes significantly, according to
the particular system design requirements. See 2.4.2.2 OnCommand Calibration for more information. Calibration can
not be initiated or run while the device is in the power-down
mode. See 1.1.7 Power Down for information on the interaction between Power Down and Calibration.
1.1.3 Control Modes
Much of the user control can be accomplished with several
control pins that are provided. Examples include initiation of
the calibration cycle, power down mode and full scale range
setting. However, the ADC08500 also provides an Extended
Control mode whereby a serial interface is used to access
register-based control of several advanced features. The Extended Control mode is not intended to be enabled and
disabled dynamically. Rather, the user is expected to employ
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ADC08500
In normal operation, calibration is performed just after application of power and whenever a valid calibration command is
given, which is holding the CAL pin low for at least tCAL_L clock
cycles, then hold it high for at least another tCAL_H clock cycles
as defined in the Converter Electrical Characteristics. The
time taken by the calibration procedure is specified as tCALin
Converter Electrical Characteristics. Holding the CAL pin high
upon power up will prevent the calibration process from running until the CAL pin experiences the above-mentioned
tCAL_L clock cycles followed by tCAL_H clock cycles.
CalDly (pin 127) is used to select one of two delay times after
the application of power before the start of calibration. This
calibration delay time is depedent on the setting of the CalDly
pin and is specified as tCalDly in the Converter Electrical Characteristics. These delay values allow the power supply to
come up and stabilize before calibration takes place. If the PD
pin is high upon power-up, the calibration delay counter will
be disabled until the PD pin is brought low. Therefore, holding
the PD pin high during power up will further delay the start of
the power-up calibration cycle. The best setting of the CalDly
pin depends upon the power-on settling time of the power
supply.
1.0 Functional Description
ADC08500
either the normal control mode or the Extended Control mode
at all times. When the device is in the Extended Control mode,
pin-based control of several features is replaced with registerbased control and those pin-based controls are disabled.
These pins are OutV (pin 3), OutEdge/DDR (pin 4), FSR (pin
14) and CalDly (pin 127). See 1.2 NORMAL/EXTENDED
CONTROL for details on the Extended Control mode.
the same as the data rate of the two output buses. With double
data rate the DCLK frequency is half the data rate and data
is sent to the outputs on both DCLK edges. DDR clocking is
enabled in non-Extended Control mode by allowing pin 4 to
float.
1.1.6 The LVDS Outputs
The data outputs, the Out Of Range (OR) and DCLK, are
LVDS. Output current sources provide 3 mA of output current
to a differential 100 Ohm load when the OutV input (pin 14) is
high or 2.2 mA when the OutV input is low. For short LVDS
lines and low noise systems, satisfactory performance may
be realized with the OutV input low, which results in lower
power consumption. If the LVDS lines are long and/or the
system in which the ADC08500 is used is noisy, it may be
necessary to tie the OutV pin high. The LVDS data output
have a typical common mode voltage of 800 mV when the
VBG pin is unconnected and floating. This common mode voltage can be increased to 1.2V by tying the VBG pin to VA if a
higher common mode is required.
IMPORTANT NOTE: Tying the VBG pin to VA will also increase the differential LVDS output voltage by up to 40 mV.
1.1.4 The Analog Inputs
The ADC08500 must be driven with a differential input signal.
Operation with a single-ended signal is not recommended. It
is important that the inputs either be a.c. coupled to the inputs
with the VCMO pin grounded, or d.c. coupled with the VCMO pin
left floating. An input common mode voltage equal to the
VCMO output must be provided when d.c. coupling is used.
The input full-scale range is programmable in the normal
mode by setting a level on pin 14 (FSR) as defined in by the
specification VIN in the Converter Electrical Characteristics.
The full-scale range setting operates equally on both ADCs.
In the Extended Control mode, programming the Input FullScale Voltage Adjust register allows the input full-scale range
to be adjusted as described in 1.4 REGISTER DESCRIPTION and 2.2 THE ANALOG INPUT.
1.1.7 Power Down
The ADC08500 is in the active state when the Power Down
pin (PD) is low. When the PD pin is high, the device is in the
power down mode, the output pins are put into a high
impedance state and the device power consumption is reduced to a minimual level. Upon return to normal operation,
the pipeline will contain meaningless information.
If the PD input is brought high while a calibration is running,
the device will not go into power down until the calibration
sequence is complete. However, if power is applied and PD
is already high, the device will not begin the calibration sequence until the PD input goes low. If a manual calibration is
requested while the device is powered down, the calibration
will not begin at all. That is, the manual calibration input is
completely ignored in the power down state.
1.1.5 Clocking
The ADC08500 must be driven with an a.c. coupled, differential clock signal. 2.3 THE CLOCK INPUTS describes the
use of the clock input pins. A differential LVDS output clock is
available for use in latching the ADC output data into whatever
receives that data.
The ADC08500 offers two options for output clocking. These
options include a choice of which DCLK edge the output data
transitions on and a choice of Single Data Rate (SDR) or
Double Data Rate (DDR) outputs.
The ADC08500 also has the option to use a duty cycle corrected clock receiver as part of the input clock circuit. This
feature is enabled by default and provides improved ADC
clocking. This circuitry allows the ADC to be clocked with a
signal source having a duty cycle ratio of 20 / 80 % (worst
case).
1.2 NORMAL/EXTENDED CONTROL
The ADC08500 may be operated in one of two modes. In the
simpler "normal" control mode, the user affects available configuration and control of the device through several control
pins. The "extended control mode" provides additional configuration and control options through a serial interface and a
set of 3 registers. The two control modes are selected with
pin 14 (FSR/ECE: Extended Control Enable). The choice of
control modes is required to be a fixed selection and is not
intended to be switched dynamically while the device is operational.
Table 1 shows how several of the device features are affected
by the control mode chosen.
1.1.5.1 OutEdge Setting
To help ease data capture in the SDR mode, the output data
may be caused to transition on either the positive or the negative edge of the output data clock (DCLK). This is chosen
with the OutEdge input (pin 4). A high on the OutEdge input
causes the output data to transition on the rising edge of
DCLK, while grounding this input causes the output to transition on the falling edge of DCLK. See 2.4.3 Output Edge
Synchronization.
1.1.5.2 Double Data Rate
A choice of single data rate (SDR) or double data rate (DDR)
output is offered. With single data rate the DCLK frequency is
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Feature
Normal Control Mode
Extended Control Mode
SDR or DDR Clocking
Selected with nDE in the Configuration
DDR Clocking selected with pin 4
Register (Addr-1h; bit-10). When the
floating. SDR clocking selected when pin
device is in DDR mode, address 1h, bit-8
4 not floating.
must be set to 0b.
DDR Clock Phase
Not Selectable (0° Phase Only)
Selected with DCP in the Configuration
Register (Addr- 1h; bit-11).
SDR Data transitions with rising edge of
SDR Data transitions with rising or falling
Selected with OE in the Configuration
DCLK+ when pin 4 is high and on falling
DCLK edge
Register (Addr- 1h; bit-8).
edge when low.
LVDS output level
Normal differential data and DCLK
amplitude selected when pin 3 is high
and reduced amplitude selected when
low.
Power-On Calibration Delay
Short delay selected when pin 127 is low
Short delay only.
and longer delay selected when high.
Full-Scale Range
Up to 512 step adjustments over a
Normal input full-scale range selected
nominal range specified in 1.4
when pin 14 is high and reduced range
REGISTER DESCRIPTION. Selected
when low. Selected range applies to both
using the Input Full-Scale Adjust register
channels.
(Addr- 3h; bits-7 thru 15).
Input Offset Adjust
512 steps of adjustment using the Input
Offset register (Addr- 2h; bits-7 thru 15)
as specified in 1.4 REGISTER
DESCRIPTION.
Not possible
SDATA: Each register access requires a specific 32-bit pattern at this input. This pattern consists of a header, register
address and register value. The data is shifted in MSB first.
Setup and hold times with respect to the SCLK must be observed. See Figure 5.
Each Register access consists of 32 bits, as shown in Figure
5 of the Timing Diagrams. The fixed header pattern is 0000
0000 0001 (eleven zeros followed by a 1). The loading sequence is such that a "0" is loaded first. These 12 bits form
the header. The next 4 bits are the address of the register that
is to be written to and the last 16 bits are the data written to
the addressed register. The addresses of the various registers are indicated in Table 3.
Refer to 1.4 REGISTER DESCRIPTION for information on
the data to be written to the registers.
Subsequent register accesses may be performed immediately, starting with the 33rd SCLK. This means that the SCS input
does not have to be de-asserted and asserted again between
register addresses. It is possible, although not recommended,
to keep the SCS input permanently enabled (at a logic low)
when using extended control.
IMPORTANT NOTE: The Serial Interface should not be written to when calibrating the ADC. Doing so will impair the
performance of the device until it is re-calibrated correctly.
Programming the serial registers will also reduce dynamic
performance of the ADC for the duration of the register access
time.
The default state of the Extended Control Mode is set upon
power-on reset (internally performed by the device) and is
shown in Table 2.
TABLE 2. Extended Control Mode Operation
(Pin 14 Floating)
Feature
Extended Control Mode
Default State
SDR or DDR Clocking
DDR Clocking
DDR Clock Phase
Data changes with DCLK
edge (0° phase)
LVDS Output Amplitude
Normal amplitude
(710 mVP-P)
Calibration Delay
Short Delay
Full-Scale Range
700 mV nominal for both
channels
Input Offset Adjust
No adjustment for either
channel
Selected with the OV in the
Configuration Register (Addr- 1h; bit-9).
1.3 THE SERIAL INTERFACE
The 3-pin serial interface is enabled only when the device is
in the Extended Control mode. The pins of this interface are
Serial Clock (SCLK), Serial Data (SDATA) and Serial Interface Chip Select (SCS). Three write only registers are accessible through this serial interface.
SCS: This signal should be asserted low while accessing a
register through the serial interface. Setup and hold times with
respect to the SCLK must be observed.
SCLK: Serial data input is accepted at the rising edge of this
signal.
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ADC08500
TABLE 1. Features and Modes
ADC08500
TABLE 3. Register Addresses
Bit 10
4-Bit Address
Loading Sequence:
A3 loaded after H0, A0 loaded last
A3
A2
A1
A0
Hex
Register Addressed
0
0
0
0
0h
Reserved
0
0
0
1
1h
Configuration
0
0
1
0
2h
Input Offset
0
0
1
1
3h
Input Full-Scale
Voltage Adjust
0
1
0
0
4h
Reserved
0
1
0
1
5h
Reserved
0
1
1
0
6h
Reserved
0
1
1
1
7h
Reserved
1
0
0
0
8h
Reserved
1
0
0
1
9h
Reserved
1
0
1
0
Ah
Reserved
1
0
1
1
Bh
Reserved
1
1
0
0
Ch
Reserved
1
1
0
1
Dh
Reserved
1
1
1
0
Eh
Reserved
1
1
1
1
Fh
Reserved
Bit 9
Bit 8
1.4 REGISTER DESCRIPTION
Three write-only registers provide several control and configuration options in the Extended Control Mode. These registers have no effect when the device is in the Normal Control
Mode. Each register description below also shows the PowerOn Reset (POR) state of each control bit.
Bits 7:0
Input Offset
Addr: 2h (0010b)
Configuration Register
Addr: 1h (0001b)
D15
D14
D13
1
0
1
W only (0xB2FF)
D12
D15
D12
D11
D10
D9
Offset Value
D8
(LSB)
D11
D10
D9
D8
nDE
OV
OE
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Bits 15:8
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D13
W only (0x007F)
DCS DCP
D7
Bit 11
D14
(MSB)
Sign
Bit 15
Bit 14
Bit 13
Bit 12
nDE: DDR Enable. When this bit is set to 0b,
data bus clocking follows the DDR (Dual Data
Rate) mode whereby a data word is output
with each rising and falling edge of DCLK.
When this bit is set to a 1b, data bus clocking
follows the SDR (single data rate) mode
whereby each data word is output with either
the rising or falling edge of DCLK , as
determined by the OutEdge bit.
POR State: 0b
OV: Output Voltage. This bit determines the
LVDS outputs' voltage amplitude and has the
same function as the OutV pin that is used in
the normal control mode. When this bit is set
to 1b, the standard output amplitude of 710
mVP-P is used. When this bit is set to 0b, the
reduced output amplitude of 510 mVP-P is
used.
POR State: 1b
OE: Output Edge. This bit selects the DCLK
edge with which the data words transition in
the SDR mode and has the same effect as the
OutEdge pin in the normal control mode.
When this bit is 1b, the data outputs change
with the rising edge of DCLK+. When this bit is
0b, the data output change with the falling
edge of DCLK+.
POR State: 0b
Must be set to 1b.
Must be set to 1b
Must be set to 0b
Must be set to 1b
DCS: Duty Cycle Stabilizer. When this bit is set
to 1b, a duty cycle stabilization circuit is
applied to the clock input. When this bit is set
to 0b the stabilization circuit is disbaled.
DCP: DDR Clock Phase. This bit only has an
effect in the DDR mode. When this bit is set to
0b, the DCLK edges are time-aligned with the
data bus edges ("0° Phase"). When this bit is
set to 1b, the DCLK edges are placed in the
middle of the data bit-cells ("90° Phase"),
using the one-half speed DCLK shown in
Figure 4 as the phase reference.
POR State: 0b
Bit 7
Bit 6:0
24
Offset Value. The input offset of the I-Channel
ADC is adjusted linearly and monotonically by
the value in this field. 00h provides a nominal
zero offset, while FFh provides a nominal 45
mV of offset. Thus, each code step provides
0.176 mV of offset.
POR State: 0000 0000b
Sign bit. 0b gives positive offset, 1b gives
negative offset resulting in total offset
adjustment of ±45 mV.
POR State: 0b
Must be set to 1b
D15
D14
D13
W only (0x807F)
D12
(MSB)
D11
D10
D9
D8
Adjust Value
D7
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
Bit 15:7
Bits 6:0
Full Scale Voltage Adjust Value. The input fullscale voltage of the I-Channel ADC is adjusted
linearly and monotonically from the nominal
700 mVP-P differential by the value in this field.
0000 0000 0
560 mVP-P
1000 0000 0
700 mVP-P
1111 1111 1
840 mVP-P
For best performance, it is recommended that
the value in this field be limited to the range of
0110 0000 0b to 1110 0000 0b. i.e., limit the
amount of adjustment to ±15%. The remaining
±5% headroom allows for the ADC's own full
scale variation. A gain adjustment does not
require ADC re-calibration.
POR State: 1000 0000 0b (no adjustment)
Must be set to 1b
1.4.1 Note Regarding Extended Mode Offset Correction
When using the Input channel Offset Adjust register, the following information should be noted.
For offset values of +0000 0000 and -0000 0000, the actual
offset is not the same. By changing only the sign bit in this
case, an offset step in the digital output code of about 1/10th
of an LSB is experienced. This is shown more clearly in the
Figure below.
20206430
FIGURE 10. Extended Mode Offset Behavior
25
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ADC08500
1.5 MULTIPLE ADC SYNCHRONIZATION
The ADC08500 has the capability to precisely reset its sampling clock input to DCLK output relationship as determined
by the user-supplied DCLK_RST pulse. This allows multiple
ADCs in a system to have their DCLK (and data) outputs
transition at the same time with respect to the shared CLK
input that all the ADCs use for sampling.
The DCLK_RST signal must observe some timing requirements that are shown in Figure 6, Figure 7, and Figure 8 of
the Timing Diagrams. The DCLK_RST pulse must be of a
minimum width and its deassertion edge must observe setup
and hold times with respect to the CLK input rising edge.
These timing specifications are listed as tRH, tRS, and tRPW in
the Converter Electrical Characteristics.
The DCLK_RST signal can be asserted asynchronous to the
input clock. If DCLK_RST is asserted, the DCLK output is held
in a designated state. The state in which DCLK is held during
the reset period is determined by the mode of operation (SDR/
DDR) and the setting of the Output Edge configuration pin or
bit. (Refer to Figure 6, Figure 7, and Figure 8 for the DCLK
reset conditions). Therefore, depending upon when the
DCLK_RST signal is asserted, there may be a narrow pulse
on the DCLK line during this reset event. When the
DCLK_RST signal is de-asserted in synchronization with the
CLK rising edge, the next CLK falling edge synchronizes the
DCLK output with those of other ADC08500s in the system.
The DCLK output is enabled again after a constant delay
which is equal to the CLK input to DCLK output delay (tAD).
The device always exhibits this delay characteristic in normal
operation.
The DCLK_RST pin should NOT be brought high while the
calibration process is running (while CalRun is high). Doing
so could cause a digital glitch in the digital circuitry, resulting
in corruption and invalidation of the calibration.
Input Full-Scale Voltage Adjust
Addr: 3h (0011b)
ADC08500
VCMO, is provided on-chip when a.c. input coupling is used
and the input signal is a.c. coupled to the ADC.
When the inputs are a.c. coupled, the VCMO output must be
grounded, as shown in Figure 11. This causes the on-chip
VCMO voltage to be connected to the inputs through on-chip
50k-Ohm resistors.
2.0 Applications Information
2.1 THE REFERENCE VOLTAGE
The voltage reference for the ADC08500 is derived from a
1.254V bandgap reference which is made available at pin 31,
VBG, for user convenience. This output has an output current
capability of ±100 μA and should be buffered if more current
than this is required.
The internal bandgap-derived reference voltage has a nominal value of VIN, as determined by the FSR pin and described
in 1.1.4 The Analog Inputs.
There is no provision for the use of an external reference voltage, but the full-scale input voltage can be adjusted through
a Configuration Register in the Extended Control mode, as
explained in 1.2 NORMAL/EXTENDED CONTROL.
Differential input signals up to the chosen full-scale level will
be digitized to 8 bits. Signal excursions beyond the full-scale
range will be clipped at the output. These large signal excursions will also activate the OR output for the time that the
signal is out of range. See 2.2.2 Out Of Range (OR) Indication.
One extra feature of the VBG pin is that it can be used to raise
the common mode voltage level of the LVDS outputs. The
output offset voltage (V OS) is typically 800 mV when the VBG
pin is used as an output or left unconnected. To raise the
LVDS offset voltage to a typical value of 1200 mV the VBG pin
can be connected directly to the supply rails.
20206444
FIGURE 11. Differential Input Drive
When the d.c. coupled mode is used, a common mode voltage must be provided at the differential inputs. This common
mode voltage should track the VCMO output pin. Note that the
VCMO output potential will change with temperature. The common mode output of the driving device should track this
change.
Full-scale distortion performance falls off rapidly as the
input common mode voltage deviates from VCMO. This is
a direct result of using a very low supply voltage to minimize power. Keep the input common voltage within 50
mV of VCMO.
Performance is as good in the d.c. coupled mode as it is in
the a.c. coupled mode, provided the input common mode
voltage at both analog inputs remain within 50 mV of VCMO.
2.2 THE ANALOG INPUT
The analog input is a differential one to which the signal
source may be a.c. coupled or d.c. coupled. In the normal
mode, the full-scale input range is selected using the FSR pin
as specified in the Converter Electrical Characteristics. In the
Extended Control mode, the full-scale input range is selected
by programming the Full-Scale Voltage Adjust register
through the Serial Interface. For best performance when adjusting the input full-scale range in the Extended Control, refer
to 1.4 REGISTER DESCRIPTION for guidelines on limiting
the amount of adjustment.
Table 4 gives the input to output relationship with the FSR pin
high when the normal (non-extended) mode is used. With the
FSR pin grounded, the millivolt values in Table 4 are reduced
to 75% of the values indicated. In the Extended Control Mode,
these values will be determined by the full scale range and
offset settings in the Control Registers.
2.2.1 Handling Single-Ended Input Signals
There is no provision for the ADC08500 to adequately process single-ended input signals. The best way to handle
single-ended signals is to convert them to differential signals
before presenting them to the ADC.
2.2.1.1 a.c. Coupled Input
The easiest way to accomplish single-ended a.c. input to differential a.c. signal is by using an appropriate balun, as shown
in Figure 12.
TABLE 4. DIFFERENTIAL INPUT TO OUTPUT
RELATIONSHIP (Non-Extended Control Mode, FSR High)
VIN+
VIN−
Output Code
VCM − 217.5 mV
VCM + 217.5 mV
0000 0000
VCM − 109 mV
VCM + 109 mV
0100 0000
VCM
VCM
0111 1111 /
1000 0000
VCM + 109 mV
VCM − 109 mV
1100 0000
20206443
VCM + 217.5 mV
VCM − 217.5 mV
1111 1111
FIGURE 12. Single-Ended to Differential signal
conversion using a balun
The buffered analog inputs simplify the task of driving these
inputs and the RC pole that is generally used at sampling ADC
inputs is not required. If it is desired to use an amplifier circuit
before the ADC, use care in choosing an amplifier with adequate noise and distortion performance and adequate gain at
the frequencies used for the application.
Note that a precise d.c. common mode voltage must be
present at the ADC inputs. This common mode voltage,
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Figure 12 is a generic depiction of a single-ended to differential signal conversion using a balun. The circuitry specific to
the balun will depend upon the type of balun selected and the
overall board layout. It is recommended that the system designer contact the manufacturer of the balun they have se-
26
TABLE 5. D.C. Coupled Offset Adjustment
Unadjusted Offset
Reading
Resistor Value
0mV to 10mV
no resistor needed
11mV to 30mV
20.0kΩ
31mV to 50mV
10.0kΩ
51mV to 70mV
6.81kΩ
71mV to 90mV
4.75kΩ
91mV to 110mV
3.92kΩ
2.2.2 Out Of Range (OR) Indication
When the conversion result is clipped the Out of Range output
is activated such that OR+ goes high and OR- goes low. This
output is active as long as accurate data on either or both of
the buses would be outside the range of 00h to FFh.
2.2.3 Full-Scale Input Range
As with all A/D Converters, the input range is determined by
the value of the ADC's reference voltage. The reference voltage of the ADC08500 is derived from an internal band-gap
reference. The FSR pin controls the effective reference voltage of the ADC08500 such that the differential full-scale input
range at the analog inputs is a normal amplitude with the FSR
pin high, or a reduced amplitude with FSR pin low as defined
by the specification VIN in the Converter Electrical Characteristics. Best SNR is obtained with FSR high, but better distortion and SFDR are obtained with the FSR pin low.
2.2.1.2 d.c. Coupled Input
When d.c. coupling to the ADC08500 analog inputs is required, single-ended to differential conversion may be easily
accomplished with the LMH6555. An example of this type of
circuit is shown in Figure 13. In such applications, the
LMH6555 performs the task of single-ended to differential
conversion while delivering low distortion and noise, as well
as output balance, that supports the operation of the
ADC08500. Connecting the ADC08500 VCMO pin to the
VCM_REF pin of the LMH6555, through an appropriate buffer,
will ensure that the common mode input voltage is as needed
for optimum performance of the ADC08500. The LMV321
was chosen to buffer VCMO for its low voltage operation and
reasonable offset voltage.
Be sure that the current drawn from the VCMO output does not
exceed 100 μA.
2.3 THE CLOCK INPUTS
The ADC08500 has differential LVDS clock inputs, CLK+ and
CLK-, which must be driven with an a.c. coupled, differential
clock signal. Although the ADC08500 is tested and its performance is guaranteed with a differential 500 MHz clock, it
typically will function well with clock frequencies indicated in
the Converter Electrical Characteristics. The clock inputs are
internally terminated and biased. The clock signal must be
capacitively coupled to the clock pins as indicated in Figure
14.
Operation up to the sample rates indicated in the Converter
Electrical Characteristics is typically possible if the maximum
ambient temperatures indicated are not exceeded. Operating
at higher sample rates than indicated for the given ambient
temperature may result in reduced device reliability and product lifetime. This is because of the higher power consumption
and die temperatures at high sample rates. Important also for
reliability is proper thermal management . See 2.6.2 Thermal
Management.
20206455
FIGURE 13. Example of Servicing the Analog Input with
VCMO
In Figure 13, RADJ- and RADJ+ are used to adjust the differential
offset that can be measured at the ADC inputs VIN+ / VIN-. An
unadjusted positive offset with reference to VIN- greater than
|15mV| should be reduced with a resistor in the RADJ- position.
Likewise, an unadjusted negative offset with reference to
VIN- greater than |15mV| should be reduced with a resistor in
the RADJ+ position. Table 5 gives suggested RADJ- and RADJ+
values for various unadjusted differential offsets to bring the
VIN+ / VIN- offset back to within |15mV|.
20206447
FIGURE 14. Differential (LVDS) Clock Connection
The differential Clock line pair should have a characteristic
impedance of 100Ω and be terminated at the clock source in
27
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ADC08500
lected to aid in designing the best performing single-ended to
differential conversion circuit using that particular balun.
When selecting a balun, it is important to understand the input
architecture of the ADC. There are specific balun parameters
of which the system designer should be mindful. A designer
should match the impedance of their analog source to the
ADC08500's on-chip 100Ω differential input termination resistor. The range of this input termination resistor is described
in the electrical table as the specification RIN.
Also, the phase and amplitude balance are important. The
lowest possible phase and amplitude imbalance is desired
when selecting a balun. The phase imbalance should be no
more than ±2.5° and the amplitude imbalance should be limited to less than 1dB at the desired input frequency range.
Finally, when selecting a balun, the VSWR (Voltage Standing
Wave Ratio), bandwidth and insertion loss of the balun should
also be considered. The VSWR aids in determining the overall
transmission line termination capability of the balun when interfacing to the ADC input. The insertion loss should be
considered so that the signal at the balun output is within the
specified input range of the ADC as described in the Converter Electrical Characteristics as the specification VIN.
ADC08500
that (100Ω) characteristic impedance. The clock line should
be as short and as direct as possible. The ADC08500 clock
input is internally terminated with an untrimmed 100Ω resistor.
Insufficient clock levels will result in poor dynamic performance. Excessively high clock levels could cause a change
in the analog input offset voltage. To avoid these problems,
keep the clock level within the range specified as VID in the
Converter Electrical Characteristics.
The low and high times of the input clock signal can affect the
performance of any A/D Converter. The ADC08500 features
a duty cycle clock correction circuit which can maintain performance over temperature. The ADC will meet its performance specification if the input clock high and low times are
maintained within the duty cycle range as specified in the
Converter Electrical Characteristics.
High speed, high performance ADCs such as the ADC08500
require a very stable clock signal with minimum phase noise
or jitter. ADC jitter requirements are defined by the ADC resolution (number of bits), maximum ADC input frequency and
the input signal amplitude relative to the ADC input full scale
range. The maximum jitter (the sum of the jitter from all
sources) allowed to prevent a jitter-induced reduction in SNR
is found to be
present upon power up or if the clock begins some time after
application of power. The CalRun output indicator is high
while a calibration is in progress.
2.4.2.1 Power-On Calibration
Power-on calibration begins after a time delay following the
application of power. This time delay is determined by the
setting of CalDly, as described in the Calibration Delay Section, below.
The calibration process will be not be performed if the CAL
pin is high at power up. In this case, the calibration cycle will
not begin until the on-command calibration conditions are
met. The ADC08500 will function with the CAL pin held high
at power up, but no calibration will be done and performance
will be impaired. A manual calibration, however, may be performed after powering up with the CAL pin high. See 2.4.2.2
On-Command Calibration.
The internal power-on calibration circuitry comes up in an unknown logic state. If the clock is not running at power up and
the power on calibration circuitry is active, it will hold the analog circuitry in power down and the power consumption will
typically be less than 200 mW. The power consumption will
be normal after the clock starts.
2.4.2.2 On-Command Calibration
To initiate an on-command calibration, bring the CAL pin high
for a minimum of tCAL_H input clock cycles after it has been
low for a minimum of tCAL_L input clock cycles. Holding the
CAL pin high upon power up will prevent execution of poweron calibration until the CAL pin is low for a minimum of
tCAL_L input clock cycles, then brought high for a minimum of
another tCAL_H input clock cycles. The calibration cycle will
begin tCAL_H input clock cycles after the CAL pin is thus
brought high. The CalRun signal should be monitored to determine when the calibration cycle has completed.
The minimum tCAL_H and tCAL_L input clock cycle sequences
are required to ensure that random noise does not cause a
calibration to begin when it is not desired. As mentioned in
1.1.1 Self-Calibration for best performance, a self calibration
should be performed 20 seconds or more after power up and
repeated when the operating temperature changes significantly according to the particular system performance requirements. ENOB drops slightly as junction temperature
increases and executing a new self calibration cycle will essentially eliminate the change.
During a Power-On calibration cycle, both the ADC and the
input termination resistor are calibrated. As dyanamic performance changes slightly with junction temperature, an OnCommand calibration can be executed to bring the performance of the ADC in line.
tJ(MAX) = (VIN(P-P)/VINFSR) x (1/(2(N+1) x π x fIN))
where tJ(MAX) is the rms total of all jitter sources in seconds,
VIN(P-P) is the peak-to-peak analog input signal, VINFSR is the
full-scale range of the ADC, "N" is the ADC resolution in bits
and fIN is the maximum input frequency, in Hertz, at the ADC
analog input.
Note that the maximum jitter described above is the RSS sum
of the jitter from all sources, including that in the ADC clock,
that added by the system to the ADC clock and input signals
and that added by the ADC itself. Since the effective jitter
added by the ADC is beyond user control, the best the user
can do is to keep the sum of the externally added clock jitter
and the jitter added by the analog circuitry to the analog signal
to a minimum.
Input clock amplitudes above those specified in the Converter
Electrical Characteristics may result in increased input offset
voltage. This would cause the converter to produce an output
code other than the expected 127/128 when both input pins
are at the same potential.
2.4 CONTROL PINS
Six control pins (without the use of the serial interface) provide
a wide range of possibilities in the operation of the ADC08500
and facilitate its use. These control pins provide Full-Scale
Input Range setting, Self Calibration, Calibration Delay, Output Edge Synchronization choice, LVDS Output Level choice
and a Power Down feature.
2.4.2.3 Calibration Delay
The CalDly input (pin 127) is used to select one of two delay
times after the application of power to the start of calibration,
as described in 1.1.1 Self-Calibration. The calibration delay
values allow the power supply to come up and stabilize before
calibration takes place. With no delay or insufficient delay,
calibration would begin before the power supply is stabilized
at its operating value and result in non-optimal calibration coefficients. If the PD pin is high upon power-up, the calibration
delay counter will be disabled until the PD pin is brought low.
Therefore, holding the PD pin high during power up will further
delay the start of the power-up calibration cycle. The best
setting of the CalDly pin depends upon the power-on settling
time of the power supply.
2.4.1 Full-Scale Input Range Setting
The input full-scale range can be selected with the FSR control input (pin 14) in the normal mode of operation. The is
specified as VIN in the Converter Electrical Characteristics. In
the extended control mode, the input full-scale range may be
programmed using the Full-Scale Adjust Voltage register.
See 2.2 THE ANALOG INPUT for more information.
2.4.2 Self Calibration
The ADC08500 self-calibration must be run to achieve specified performance. The calibration procedure is run upon power-up and can be run any time on command. The calibration
procedure is exactly the same whether there is a clock
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28
There is one LVDS output clock pair (DCLK+/-) available for
use to latch the LVDS outputs on all buses. Whether the data
is sent at the rising or falling edge of DCLK is determined by
the sense of the OutEdge pin, as described in 2.4.3 Output
Edge Synchronization.
DDR (Double Data Rate) clocking can also be used. In this
mode a word of data is presented with each edge of DCLK,
reducing the DCLK frequency to 1/4 the input clock frequency.
See the Timing Diagram section for details.
The OutV pin is used to set the LVDS differential output levels.
See 2.4.4 LVDS Output Level Control.
The output format is Offset Binary. Accordingly, a full-scale
input level with VIN+ positive with respect to VIN− will produce
an output code of all ones, a full-scale input level with VIN−
positive with respect to VIN+ will produce an output code of all
zeros and when VIN+ and VIN− are equal, the output code will
vary between codes 127 and 128.
2.4.3 Output Edge Synchronization
DCLK signals are available to help latch the converter output
data into external circuitry. The output data can be synchronized with either edge of these clock signals. That is, the
output data transition can be set to occur with either the rising
edge or the falling edge of the DCLK signal, so that either
edge of that clock signal can be used to latch the output data
into the receiving circuit.
When OutEdge (pin 4) is high, the output data is synchronized
with (changes with) the rising edge of the DCLK+ (pin 82).
When OutEdge is low, the output data is synchronized with
the falling edge of DCLK+.
At the very high speeds of which the ADC08500 is capable,
slight differences in the lengths of the clock and data lines can
mean the difference between successful and erroneous data
capture. The OutEdge pin is used to capture data on the
DCLK edge that best suits the application circuit and layout.
2.6 POWER CONSIDERATIONS
A/D converters draw sufficient transient current to corrupt
their own power supplies if not adequately bypassed. A 33 µF
capacitor should be placed within an inch (2.5 cm) of the A/D
converter power pins. A 0.1 µF capacitor should be placed as
close as possible to each VA pin, preferably within one-half
centimeter. Leadless chip capacitors are preferred because
they have low lead inductance.
The VA and VDR supply pins should be isolated from each
other to prevent any digital noise from being coupled into the
analog portions of the ADC. A ferrite choke, such as the JW
Miller FB20009-3B, is recommended between these supply
lines when a common source is used for them.
As is the case with all high speed converters, the ADC08500
should be assumed to have little power supply noise rejection.
Any power supply used for digital circuitry in a syatem where
a lot of digital power is being consumed should not be used
to supply power to the ADC08500. The ADC supplies should
be the same supply used for other analog circuitry, if not a
dedicated supply.
2.4.4 LVDS Output Level Control
The output level can be set to one of two levels with OutV
(pin3). The strength of the output drivers is greater with OutV
high. With OutV low there is less power consumption in the
output drivers, but the lower output level means decreased
noise immunity.
For short LVDS lines and low noise systems, satisfactory performance may be realized with the FSR input low. If the LVDS
lines are long and/or the system in which the ADC08500 is
used is noisy, it may be necessary to tie the FSR pin high.
2.4.5 Power Down Feature
The Power Down pin (PD) suspends device operation and
puts the ADC08500 into a minimum power consumption
state. See 1.1.7 Power Down for details on the power down
feature.
The digital data (+/-) output pins are put into a high impedance
state when the PD pin is high. Upon return to normal operation, the pipeline will contain meaningless information and
must be flushed.
If the PD input is brought high while a calibration is running,
the device will not go into power down until the calibration
sequence is complete. However, if power is applied and PD
is already high, the device will not begin the calibration sequence until the PD input goes low. If a manual calibration is
requested while the device is powered down, the calibration
will not begin at all. That is, the manual calibration input is
completely ignored in the power down state.
2.6.1 Supply Voltage
The ADC08500 is specified to operate with a supply voltage
of 1.9V ±0.1V. It is very important to note that, while this device will function with slightly higher supply voltages, these
higher supply voltages may reduce product lifetime.
No pin should ever have a voltage on it that is in excess of the
supply voltage or below ground by more than 150 mV, not
even on a transient basis. This can be a problem upon application of power and power shut-down. Be sure that the supplies to circuits driving any of the input pins, analog or digital,
do not come up any faster than does the voltage at the
ADC08500 power pins.
The Absolute Maximum Ratings should be strictly observed,
even during power up and power down. A power supply that
produces a voltage spike at turn-on and/or turn-off of power
can destroy the ADC08500. The circuit of Figure 15 will provide supply overshoot protection.
Many linear regulators will produce output spiking at poweron unless there is a minimum load provided. Active devices
draw very little current until their supply voltages reach a few
hundred millivolts. The result can be a turn-on spike that can
destroy the ADC08500, unless a minimum load is provided
for the supply. The 100Ω resistor at the regulator output provides a minimum output current during power-up to ensure
there is no turn-on spiking.
2.5 THE DIGITAL OUTPUTS
The ADC08500 demultiplexes the output data of the ADC onto two LVDS output buses. The results of successive conversions started on the odd falling edges of the CLK+ pin are
available on one of the two LVDS buses, while the results of
conversions started on the even falling edges of the CLK+ pin
are available on the other LVDS bus. This means that, the
word rate at each LVDS bus is 1/2 the ADC08500 input clock
rate and the two buses must be multiplexed to obtain the entire 0.5 GSPS conversion result.
Since the minimum recommended input clock rate for this
device is 200 MSPS, the effective rate can be reduced to as
low as 100 MSPS by using the results available on just one
of the the two LVDS buses and a 200 MHz input clock, decimating the 200 MSPS data by two.
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ADC08500
Note that the calibration delay selection is not possible in the
Extended Control mode and the short delay time is used.
ADC08500
In the circuit of Figure 15, an LM317 linear regulator is satisfactory if its input supply voltage is 4V to 5V . If a 3.3V supply
is used, an LM1086 linear regulator is recommended.
20206454
FIGURE 15. Non-Spiking Power Supply
20206421
FIGURE 16. Recommended Package Land Pattern
The output drivers should have a supply voltage, VDR, that is
within the range specified in the Operating Ratings table. This
voltage should not exceed the VA supply voltage.
If the power is applied to the device without a clock signal
present, the current drawn by the device might be below 200
mA. This is because the ADC08500 gets reset through
clocked logic and its initial state is random. If the reset logic
comes up in the "on" state, it will cause most of the analog
circuitry to be powered down, resulting in less than 100 mA
of current draw. This current is greater than the power down
current because not all of the ADC is powered down. The device current will be normal after the clock is established.
Since a large aperture opening may result in poor release, the
aperture opening should be subdivided into an array of smaller openings, similar to the land pattern of Figure 16.
To minimize junction temperature, it is recommended that a
simple heat sink be built into the PCB. This is done by including a copper area of about 2 square inches (6.5 square cm)
on the opposite side of the PCB. This copper area may be
plated or solder coated to prevent corrosion, but should not
have a conformal coating, which could provide some thermal
insulation. Thermal vias should be used to connect these top
and bottom copper areas. These thermal vias act as "heat
pipes" to carry the thermal energy from the device side of the
board to the opposite side of the board where it can be more
effectively dissipated. The use of 9 to 16 thermal vias is recommended.
The thermal vias should be placed on a 1.2 mm grid spacing
and have a diameter of 0.30 to 0.33 mm. These vias should
be barrel plated to avoid solder wicking into the vias during
the soldering process as this wicking could cause voids in the
solder between the package exposed pad and the thermal
land on the PCB. Such voids could increase the thermal resistance between the device and the thermal land on the
board, which would cause the device to run hotter.
If it is desired to monitor die temperature, a temperature sensor may be mounted on the heat sink area of the board near
the thermal vias. .Allow for a thermal gradient between the
temperature sensor and the ADC08500 die of θJ-PAD times
typical power consumption = 2.8 x 1.6 = 4.5°C. Allowing for a
5.5°C (including an extra 1°C) temperature drop from the die
to the temperature sensor, then, would mean that maintaining
a maximum pad temperature reading of 124.5°C will ensure
that the die temperature does not exceed 130°C, assuming
that the exposed pad of the ADC08500 is properly soldered
down and the thermal vias are adequate. (The inaccuracy of
the temperature sensor is addtional to the above calculation).
2.6.2 Thermal Management
The ADC08500 is capable of impressive speeds and performance at very low power levels for its speed. However, the
power consumption is still high enough to require attention to
thermal management. For reliability reasons, the die temperature should be kept to a maximum of 130°C. That is, TA
(ambient temperature) plus ADC power consumption times
θJA (junction to ambient thermal resistance) should not exceed 130°C. This is not a problem if the ambient temperature
is kept to a maximum of +85°C as specified in the Operating
Ratings section.
Please note that the following are general recommendations
for mounting exposed pad devices onto a PCB. This should
be considered the starting point in PCB and assembly process development. It is recommended that the process be
developed based upon past experience in package mounting.
The package of the ADC08500 has an exposed pad on its
back that provides the primary heat removal path as well as
excellent electrical grounding to the printed circuit board. The
land pattern design for lead attachment to the PCB should be
the same as for a conventional LQFP, but the exposed pad
must be attached to the board to remove the maximum
amount of heat from the package, as well as to ensure best
product parametric performance.
To maximize the removal of heat from the package, a thermal
land pattern must be incorporated on the PC board within the
footprint of the package. The exposed pad of the device must
be soldered down to ensure adequate heat conduction out of
the package. The land pattern for this exposed pad should be
at least as large as the 5 x 5 mm of the exposed pad of the
package and be located such that the exposed pad of the
device is entirely over that thermal land pattern. This thermal
land pattern should be electrically connected to ground. A
clearance of at least 0.5 mm should separate this land pattern
from the mounting pads for the package pins.
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2.7 LAYOUT AND GROUNDING
Proper grounding and routing of all signals are essential to
ensure accurate conversion. A single ground plane should be
used instead of splitting the ground plane into analog and
digital areas.
Since digital switching transients are composed largely of
high frequency components, the skin effect tells us that total
ground plane copper weight will have little effect upon the
logic-generated noise. Total surface area is more important
than is total ground plane volume. Coupling between the typically noisy digital circuitry and the sensitive analog circuitry
can lead to poor performance that may seem impossible to
30
TABLE 6. Non-Extended Control Mode Operation
(Pin 14 High or Low)
Pin
Low
High
Floating
3
Reduced
VOD
Normal VOD
n/a
4
OutEdge =
Neg
OutEdge =
Pos
DDR
127
14
CalDly Short CalDly Long
Reduced VIN
Normal VIN
n/a
Extended
Control Mode
Pin 3 can be either high or low in the non-extended control
mode. Pin 14 must not be left floating to select this mode. See
1.2 NORMAL/EXTENDED CONTROL for more information.
Pin 4 can be high or low or can be left floating in the nonextended control mode. In the non-extended control mode,
pin 4 high or low defines the edge at which the output data
transitions. See 2.4.3 Output Edge Synchronization for more
information. If this pin is floating, the output clock (DCLK) is a
DDR (Double Data Rate) clock (see 1.1.5.2 Double Data
Rate) and the output edge synchronization is irrelevant since
data is clocked out on both DCLK edges.
Pin 127 in the non-extended control mode sets the calibration
delay. Pin 127 is not designed to remain floating.
2.8 DYNAMIC PERFORMANCE
The ADC08500 is a.c. tested and its dynamic performance is
guaranteed. To meet the published specifications and avoid
jitter-induced noise, the clock source driving the CLK input
must exhibit low rms jitter. The allowable jitter is a function of
the input frequency and the input signal level, as described in
Section 2.3.
It is good practice to keep the ADC clock line as short as possible, to keep it well away from any other signals and to treat
it as a transmission line. Other signals can introduce jitter into
the clock signal. The clock signal can also introduce noise into
the analog path if not isolated from that path.
Best dynamic performance is obtained when the exposed pad
at the back of the package has a good connection to ground.
This is because this path from the die to ground is a lower
impedance than offered by the package pins.
TABLE 7. Extended Control Mode Operation
(Pin 14 Floating)
Pin
Function
3
SCLK (Serial Clock)
4
SDATA (Serial Data)
127
SCS (Serial Interface Chip Select)
2.10 COMMON APPLICATION PITFALLS
Driving the inputs (analog or digital) beyond the power
supply rails. For device reliability, no input should go more
than 150 mV below the ground pins or 150 mV above the
supply pins. Exceeding these limits on even a transient basis
may not only cause faulty or erratic operation, but may impair
device reliability. It is not uncommon for high speed digital
circuits to exhibit undershoot that goes more than a volt below
ground. Controlling the impedance of high speed lines and
terminating these lines in their characteristic impedance
should control overshoot.
Care should be taken not to overdrive the inputs of the
ADC08500. Such practice may lead to conversion inaccuracies and even to device damage.
Incorrect analog input common mode voltage in the d.c.
coupled mode. As discussed in 1.1.4 The Analog Inputs and
2.2 THE ANALOG INPUT, the Input common mode voltage
must remain within 50 mV of the VCMO output , which has a
variability with temperature that must also be tracked. Distortion performance will be degraded if the input common mode
voltage is more than 50 mV from VCMO .
Using an inadequate amplifier to drive the analog input.
Use care when choosing a high frequency amplifier to drive
the ADC08500 as many high speed amplifiers will have higher
distortion than will the ADC08500, resulting in overall system
performance degradation.
Driving the VBG pin to change the reference voltage. As
mentioned in 2.1 THE REFERENCE VOLTAGE, the reference voltage is intended to be fixed by FSR pin or Full-Scale
Voltage Adjust register settings. Over driving this pin will not
2.9 USING THE SERIAL INTERFACE
The ADC08500 may be operated in the non-extended control
(non-Serial Interface) mode or in the extended control mode.
Table 6 and Table 7 describe the functions of pins 3, 4, 14
and 127 in the non-extended control mode and the extended
control mode, respectively.
2.9.1 Non-Extended Control Mode Operation
Non-extended control mode operation means that the Serial
Interface is not active and all controllable functions are controlled with various pin settings. That is, the full-scale range,
the power on calibration delay, the output voltage and the input coupling (a.c. or d.c.). The non-extended control mode is
used by setting pin 14 high or low, as opposed to letting it float.
Table 6 indicates the pin functions of the ADC08500 in the
non-extended control mode.
31
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ADC08500
isolate and remedy. The solution is to keep the analog circuitry well separated from the digital circuitry.
High power digital components should not be located on or
near any linear component or power supply trace or plane that
services analog or mixed signal components as the resulting
common return current path could cause fluctuation in the
analog input “ground” return of the ADC, causing excessive
noise in the conversion result.
Generally, we assume that analog and digital lines should
cross each other at 90° to avoid getting digital noise into the
analog path. In high frequency systems, however, avoid
crossing analog and digital lines altogether. Clock lines
should be isolated from ALL other lines, analog AND digital.
The generally accepted 90° crossing should be avoided as
even a little coupling can cause problems at high frequencies.
Best performance at high frequencies is obtained with a
straight signal path.
The analog input should be isolated from noisy signal traces
to avoid coupling of spurious signals into the input. This is
especially important with the low level drive required of the
ADC08500. Any external component (e.g., a filter capacitor)
connected between the converter's input and ground should
be connected to a very clean point in the analog ground plane.
All analog circuitry (input amplifiers, filters, etc.) should be
separated from any digital components.
ADC08500
change the full scale value, but can otherwise upset operation.
Driving the clock input with an excessively high level
signal. The ADC clock level should not exceed the level described in the Operating Ratings Table or the input offset
could change.
Inadequate clock levels. As described in 2.3 THE CLOCK
INPUTS, insufficient clock levels can result in poor performance. Excessive clock levels could result in the introduction
of an input offset.
Using a clock source with excessive jitter, using an excessively long clock signal trace, or having other signals
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coupled to the clock signal trace. This will cause the sampling interval to vary, causing excessive output noise and a
reduction in SNR performance.
Failure to provide adequate heat removal. As described in
2.6.2 Thermal Management, it is important to provide adequate heat removal to ensure device reliability. This can be
done either with adequate air flow or the use of a simple heat
sink built into the board. The backside pad should be grounded for best performance.
32
ADC08500
Physical Dimensions inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
REFERENCE JEDEC REGISTRATION MS-026, VARIATION BFB.
128-Lead Exposed Pad LQFP
Order Number ADC08500CIYB
NS Package Number VNX128A
33
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ADC08500 High Performance, Low Power 8-Bit, 500 MSPS A/D Converter
Notes
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