ON MC74AC139 Dual 1−of−4 decoder/demultiplexer Datasheet

MC74AC139, MC74ACT139
Dual 1−of−4
Decoder/Demultiplexer
The MC74AC139/74ACT139 is a high−speed, dual 1−of−4
decoder/demultiplexer. The device has two independent decoders,
each accepting two inputs and providing four mutually−exclusive
active−LOW outputs. Each decoder has an active−LOW Enable input
which can be used as a data input for a 4−output demultiplexer. Each
half of the MC74AC139/74ACT139 can be used as a function
generator providing four minterms of two variables.
•
•
•
•
•
w
Multifunctional Capability
Two Completely Independent 1−of−4 Decoders
Active LOW Mutually Exclusive Outputs
Outputs Source/Sink 24 mA
′ACT139 Has TTL Compatible Inputs
Eb
A0b
A1b
O0b
O1b
O2b
O3b
16
15
14
13
12
11
10
9
DIP−16
N SUFFIX
CASE 648
16
1
These devices are available in Pb−free package(s). Specifications herein
apply to both standard and Pb−free devices. Please see our website at
www.onsemi.com for specific Pb−free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
VCC
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16
16
16
1
Ea
2
A0a
3
A1a
4
O0a
5
O1a
6
O2a
7
O3a
1
8
GND
1
1
SO−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
EIAJ−16
M SUFFIX
CASE 966
ORDERING INFORMATION
Device
Package
Shipping
MC74AC139N
PDIP−16
25 Units/Rail
MC74ACT139N
PDIP−16
25 Units/Rail
PIN ASSIGNMENT
MC74AC139D
SOIC−16
48 Units/Rail
PIN
FUNCTION
MC74ACT139D
SOIC−16
48 Units/Rail
A0, A1
Address Inputs
MC74AC139DR2
SOIC−16
2500 Tape & Reel
E
Enable Inputs
MC74ACT139DR2
SOIC−16
2500 Tape & Reel
O0−O3
Outputs
MC74AC139DT
TSSOP−16
96 Units/Rail
MC74ACT139DT
TSSOP−16
96 Units/Rail
MC74AC139DTR2
TSSOP−16 2500 Tape & Reel
Figure 1. Pinout: 16−Lead Packages Conductors
(Top View)
TRUTH TABLE
Inputs
Outputs
E
A0
A1
O0
O1
O2
O3
H
L
L
L
L
X
L
H
L
H
X
L
L
H
H
H
L
H
H
H
H
H
L
H
H
H
H
H
L
H
H
H
H
H
L
March, 2006 − Rev. 7
EIAJ−16
50 Units/Rail
MC74ACT139M
EIAJ−16
50 Units/Rail
MC74AC139MEL
EIAJ−16
2000 Tape & Reel
MC74ACT139MEL
EIAJ−16
2000 Tape & Reel
DEVICE MARKING INFORMATION
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
© Semiconductor Components Industries, LLC, 2006
MC74AC139M
See general marking information in the device marking
section on page 6 of this data sheet.
1
Publication Order Number:
MC74AC139/D
MC74AC139, MC74ACT139
E A0 A1
DECODER a
O0 O1 O2 O3
E A0 A1
DECODER b
O0 O1 O2 O3
Figure 2. Logic Symbol
Ea
00a
NOTE:
A0a
01a
02a
A1a
Eb
03a
A0b
00b
01b
02b
A1b
03b
This diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation
delays.
Figure 3. Logic Diagram
FUNCTIONAL DESCRIPTION
E
E
A0
The MC74AC139/74ACT139 is a high−speed dual
1−of−4 decoder/demultiplexer. The device has two
independent decoders, each of which accepts two binary
weighted inputs (A0−A1) and provides four mutually
exclusive active−LOW outputs (O0−O3). Each decoder has
an active−LOW enable (E). When E is HIGH all outputs are
forced HIGH. The enable can be used as the data input for
a 4−output demultiplexer application. Each half of the
MC74AC139/74ACT139 generates all four minterms of
two variables. These four minterms are useful in some
applications, replacing multiple gate functions as shown in
Figure 4, and thereby reducing the number of packages
required in a logic network.
O0
A1
E
A0
O1
A0
2
O2
A1
E
O3
A0
A1
Figure 4. Gate Functions (Each Half)
http://onsemi.com
O1
E
O2
E
A1
E
A0
A1
A1
A0
O0
A1
A1
E
A0
A0
O3
MC74AC139, MC74ACT139
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
VOUT
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
IIN
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VIN, VOUT
DC Input Voltage, Output Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Min
Typ
Max
Unit
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
°C
−40
25
85
°C
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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3
ns/V
MC74AC139, MC74ACT139
DC CHARACTERISTICS
Symbol
Parameter
74AC
74AC
TA = +25°C
TA =
−40°C to
+85°C
VCC
(V)
Typ
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
5.5
−
±0.1
5.5
−
5.5
5.5
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
IOLD
†Minimum Dynamic
Output Current
IOHD
ICC
Maximum Quiescent
Supply Current
IOUT = −50 mA
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
V
IOUT = 50 mA
V
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
±1.0
mA
VI = VCC, GND
−
75
mA
VOLD = 1.65 V Max
−
−
−75
mA
VOHD = 3.85 V Min
−
8.0
80
mA
VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Parameter
Symbol
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
VCC*
(V)
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
An to On
3.3
5.0
4.0
3.0
8.0
6.5
11.5
8.5
3.5
2.5
13
9.5
ns
3−6
tPHL
Propagation Delay
An to On
3.3
5.0
3.0
2.5
7.0
5.5
10
7.5
2.5
2.0
11
8.5
ns
3−6
tPLH
Propagation Delay
En to On
3.3
5.0
4.5
3.5
9.5
7.0
12
8.5
3.5
3.0
13
10
ns
3−6
tPHL
Propagation Delay
En to On
3.3
5.0
4.0
2.5
8.0
6.0
10
7.5
3.0
2.5
11
8.5
ns
3−6
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
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4
MC74AC139, MC74ACT139
DC CHARACTERISTICS
VCC
(V)
74ACT
74ACT
TA = +25°C
TA =
−40°C to
+85°C
Typ
Guaranteed Limits
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
Symbol
VOL
Parameter
Maximum Low Level
Output Voltage
Unit
Conditions
IOUT = −50 mA
*VIN = VIL or VIH
−24 mA
IOH
−24 mA
V
IOUT = 50 mA
V
IIN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
DICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
IOHD
ICC
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
Parameter
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
VCC*
(V)
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
An to On
5.0
1.5
6.0
8.5
1.5
9.5
ns
3−6
tPHL
Propagation Delay
An to On
5.0
1.5
6.0
9.5
1.5
10.5
ns
3−6
tPLH
Propagation Delay
En to On
5.0
2.5
7.0
10.0
2.0
11.0
ns
3−6
tPHL
Propagation Delay
En to On
5.0
2.0
7.0
9.5
1.5
10.5
ns
3−6
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
40
pF
VCC = 5.0 V
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5
MC74AC139, MC74ACT139
MARKING DIAGRAMS
DIP−16
SO−16
MC74AC139N
AWLYYWW
AC139
AWLYWW
MC74ACT139N
AWLYYWW
ACT139
AWLYWW
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
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6
TSSOP−16
EIAJ−16
AC
139
ALYW
74AC139
ALYW
ACT
139
ALYW
74ACT139
ALYW
MC74AC139, MC74ACT139
PACKAGE DIMENSIONS
PDIP−16
N SUFFIX
16 PIN PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
−A−
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
SEATING
PLANE
−T−
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SO−16
D SUFFIX
16 PIN PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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7
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74AC139, MC74ACT139
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
16 PIN PLASTIC TSSOP PACKAGE
CASE948F−01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
8
1
N
0.15 (0.006) T U
S
0.25 (0.010)
A
−V−
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
DETAIL E
H
G
EIAJ−16
M SUFFIX
16 PIN PLASTIC EIAJ PACKAGE
CASE966−01
ISSUE O
16
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
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8
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
−−−
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.031
MC74AC139, MC74ACT139
Notes
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9
MC74AC139, MC74ACT139
Notes
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10
MC74AC139, MC74ACT139
Notes
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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