Burr-Brown OPA2827 Low-noise, high-precision, jfet-input, operational amplifier Datasheet

OPA827
OPA2827
SBOS376A − NOVEMBER 2006
Low-Noise, High-Precision, JFET-Input,
OPERATIONAL AMPLIFIER
FEATURES
DESCRIPTION
OFFSET: 250µV (max)
DRIFT: 1µV/°C
LOW NOISE: 4.5nV//Hz at 1kHz
BANDWIDTH: 18MHz
SLEW RATE: 22V/µs
BIAS CURRENT: 3pA
QUIESCENT CURRENT: 4.5mA/Ch
WIDE SUPPLY RANGE: +4V to +18V
SINGLE PACKAGES: MSOP-8, SO-8
DUAL PACKAGES: TSSOP-8, SO-8
The OPA827 series of JFET operational amplifiers
combines outstanding dc precision with excellent ac
performance. It offers 100µV of offset, very low drift
(1µV/°C) over temperature, low bias currents, and very low
flicker noise of 400nVPP (0.1Hz to 10Hz). It operates over
a very wide supply voltage range of ±4V to ±18V on a low
4.5mA supply current. A dual version is also available for
the OPA827 family.
APPLICATIONS
D
D
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PRECISION +10V INPUT FRONT-ENDS
TRANSIMPEDANCE AMPLIFIERS
INTEGRATORS
ACTIVE FILTERS
A/D CONVERTER DRIVERS
DAC OUTPUT BUFFERS
HIGH-PERFORMANCE AUDIO
PROCESS CONTROL
TEST EQUIPMENT
MEDICAL EQUIPMENT
Excellent ac characteristics, such as 18MHz gain
bandwidth (GBW) and 22V/µs slew rate, and precision dc
characteristics make the OPA827 series well-suited for a
wide range of applications such as 16- to 18-bit data
acquisition systems, transimpedance (I/V−conversion)
amplifiers, filters, precision ±10V front-ends, and
professional audio applications.
The single version (OPA827) is available in both MSOP-8
and standard SO-8 surface-mount packages. The dual
version (OPA2827) is available in the small TSSOP-8 and
in the standard SO-8 packages. All versions are specified
from −40°C to +125°C.
+15V
2.2µF
100nF
100pF
500Ω
ADS8505
200Ω
VIN
33.2kΩ
500Ω
REF
VIN
100pF
OPA827
2.2µF
AGND1
2.2µF
CAP
100nF
2.2µF
DGND
AGND2
−15V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
! Copyright  2006, Texas Instruments Incorporated
www.ti.com
PRODUCT PREVIEW
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SBOS376A − NOVEMBER 2006
ABSOLUTE MAXIMUM RATINGS(1)
PRODUCT PREVIEW
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20V
Signal Input Terminals, Voltage(2) . . . . . . . . (V−)−0.7 to (V+)+0.7V
Current(2) . . . . . . . . . . . . . . . . . . . . ±10mA
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD V
Output Short-Circuit(3) . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.7V beyond the supply
rails should be current-limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
OPA827A
Low Grade
OPA827A
OPA2827A
SO-8
D
MSOP-8
DGK
TBD
SO-8
D
OPA2827A
TSSOP-8
PW
TBD
OPA827
High Grade
OPA827I
OPA2827I
SO-8
D
MSOP-8
DGK
TBD
SO-8
D
OPA2827
TSSOP-8
PW
TBD
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
TOP VIEW
OPA827
(1)
NC
−IN
+IN
V−
1
OPA2827
8
2
7
3
6
4
5
(1)
NC
−IN A
V+
OUT
(1)
NC
SO−8, MSOP−8
(1) NC denotes no internal connection.
2
OUT A
1
2
+IN A
3
V−
4
A
B
TSSOP−8, SO−8
8
V+
7
OUT B
6
−IN B
5
+IN B
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SBOS376A − NOVEMBER 2006
ELECTRICAL CHARACTERISTICS: VS = +4V to +18V
BOLDFACE limits apply over the specified temperature range, TA = −405C to +1255C.
At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
OPA827A, OPA2827A
PARAMETER
CONDITIONS
MIN
TYP
MAX
TBD
1
TBD
OPA827I, OPA2827I
MIN
TYP
MAX
UNIT
250
TBD
TBD
µV
3.5
TBD
TBD
µV/5C
10
TBD
TBD
µV/V
TBD
µV/V
OFFSET VOLTAGE
Input Offset Voltage
Drift
vs Power Supply
VOS
dVOS/dT
PSRR
Over Temperature
VCM = 0V, VS = ±15V
VS = ±4V to ±18V, VCM = 0V
VS = +4V to +18V, VCM = 0V
30
Channel Separation, dc
TBD
µV/V
TBD
INPUT BIAS CURRENT
Input Bias Current
IB
Over Temperature
Input Offset Current
IOS
±3
TBD
*
TBD
pA
TBD
TBD
TBD
TBD
pA
±3
TBD
*
TBD
pA
NOISE
Input Voltage Noise f=0.1 to 10Hz
en
VS = ±18V, VCM = 0V
0.4
*
µVPP
en
en
VS = ±18V, VCM = 0V
VS = ±18V, VCM = 0V
4.5
*
nV/√Hz
4.5
*
nV/√Hz
in
VS = ±18V, VCM = 0V
TBD
*
fA/√Hz
f = 1kHz
f = 10kHz
PRODUCT PREVIEW
Input Voltage Noise Density
Input Current Noise Density
f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
(V−)+2.5
VCM
Common-Mode Rejection Ratio
CMRR
(V−)+2.5V < VCM < (V+)−2.5V
(V+)−2.5
108
Over Temperature
*
*
TBD
V
dB
TBD
TBD
dB
1013 || TBD
*
Ω || pF
1013 ||7
*
Ω || pF
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
AOL
Open-Loop Voltage Gain
Over Temperature
FREQUENCY RESPONSE
114
120
TBD
TBD
dB
108
TBD
TBD
TBD
dB
CL = 100pF
Gain-Bandwidth Product
GBW
Slew Rate
Settling Time, 0.1%
18
*
MHz
SR
G = +1
22
*
V/µs
tS
4V Step, G = +1
TBD
*
ns
4V Step, G = +1
TBD
*
ns
VIN • Gain > VS
G = +1, f = 1kHz
TBD
*
µs
TBD
*
%
0.01% (16-bit)
Overload Recovery Time
Total Harmonic Distortion
+ Noise
RL = 1kΩ,
(V−)+2.75V<VO<(V+)−2.1V
RL = 1kW,
(V−)+2.75V<VO<(V+)−2.1V
THD+N
OUTPUT
Voltage Output Swing from Rail
Over Temperature
Output Current
Short-Circuit Current
Capacitive Load Drive
IOUT
ISC
RL = 1kΩ, AOL > 114dB
RL = 1kW, AOL > 108dB
|VS − VOUT| < 1.5V
(V−)+2.75
(V+)−2.1
*
*
(V−)+2.75
(V+)−2.1
*
*
CLOAD
30
V
V
*
mA
±40
*
mA
TBD
TBD
pF
NOTE: * indicates same specifications as for low-grade version of device.
3
"#$%
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SBOS376A − NOVEMBER 2006
ELECTRICAL CHARACTERISTICS: VS = +4V to +18V (continued)
BOLDFACE limits apply over the specified temperature range, TA = −405C to +1255C.
At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
OPA827A, OPA2827A
PARAMETER
CONDITIONS
MIN
OPA827I, OPA2827I
TYP
MAX
MIN
±18
*
4.5
TBD
TYP
MAX
UNIT
POWER SUPPLY
Specified Voltage
Quiescent Current
(per amp.)
VS
IQ
±4
IO = 0
Over Temperature
*
TBD
*
V
*
mA
*
mA
TEMPERATURE RANGE
Specified Range
−40
+125
*
*
°C
Operating Range
−55
+125
*
*
°C
Thermal Resistance
qJA
SO-8, MSOP-8, TSSOP-8
PRODUCT PREVIEW
NOTE: * indicates same specifications as for low-grade version of device.
4
150
*
°C/W
PACKAGE OPTION ADDENDUM
www.ti.com
22-Nov-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
OPA827AID
PREVIEW
SOIC
D
8
75
TBD
Call TI
Call TI
POPA827AID
PREVIEW
SOIC
D
8
1500
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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