NE5532, NE5532A SA5532, SA5532A www.ti.com................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009 DUAL LOW-NOISE OPERATIONAL AMPLIFIERS FEATURES 1 • • • • • • NE5532, NE5532A . . . D, P, OR PS PACKAGE SA5532, SA5532A . . . D OR P PACKAGE (TOP VIEW) Equivalent Input Noise Voltage: 5 nV/√Hz Typ at 1 kHz Unity-Gain Bandwidth: 10 MHz Typ Common-Mode Rejection Ratio: 100 dB Typ High DC Voltage Gain: 100 V/mV Typ Peak-to-Peak Output Voltage Swing 26 V Typ With VCC± = ±15 V and RL = 600 Ω High Slew Rate: 9 V/µs Typ 1OUT 1 8 VCC+ 1IN– 2 7 2OUT 1IN+ 3 6 2IN– VCC– 4 5 2IN+ DESCRIPTION/ORDERING INFORMATION The NE5532, NE5532A, SA5532, and SA5532A are high-performance operational amplifiers combining excellent dc and ac characteristics. They feature very low noise, high output-drive capability, high unity-gain and maximum-output-swing bandwidths, low distortion, high slew rate, input-protection diodes, and output short-circuit protection. These operational amplifiers are compensated internally for unity-gain operation. These devices have specified maximum limits for equivalent input noise voltage. ORDERING INFORMATION (1) PACKAGE (2) TA PDIP – P 0°C to 70°C SOIC – D (2) NE5532AP Reel of 2500 NE5532DR Tube of 75 NE5532AD Reel of 2500 NE5532ADR PDIP – P Tube of 50 SOIC – D NE5532AP NE5532D Reel of 2000 TOP-SIDE MARKING NE5532P Tube of 75 SOP – PS –40°C to 85°C (1) Tube of 50 ORDERABLE PART NUMBER NE5532P N5532 N5532A NE5532PSR N5532 NE5532APSR N5532A SA5532P SA5532P SA5532AP SA5532AP Tube of 75 SA5532D Reel of 2500 SA5532DR Tube of 75 SA5532AD Reel of 2500 SA5532ADR SA5532 SA5532A For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1979–2009, Texas Instruments Incorporated NE5532, NE5532A SA5532, SA5532A SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009................................................................................................................................................... www.ti.com SCHEMATIC (EACH AMPLIFIER) VCC+ 36 pF IN+ 37 pF 14 pF 15 W OUT 7 pF IN– 15 W 460 W VCC– Component values shown are nominal. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage (2) VCC+ 22 V VCC– –22 V Input voltage, either input (2) (3) Input current VCC± (4) ±10 mA Duration of output short circuit (5) θJA Package thermal impedance (6) (7) TJ Operating virtual-junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) (7) 2 Unlimited D package 97°C/W P package 85°C/W PS package 95°C/W 150°C –65°C to 150°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–. The magnitude of the input voltage must never exceed the magnitude of the supply voltage. Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some limiting resistance is used. The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the maximum dissipation rating is not exceeded. The package thermal impedance is calculated in accordance with JESD 51-7. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. Submit Documentation Feedback Copyright © 1979–2009, Texas Instruments Incorporated Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A NE5532, NE5532A SA5532, SA5532A www.ti.com................................................................................................................................................... SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009 RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT VCC+ Supply voltage 5 15 V VCC– Supply voltage –5 –15 V NE5532, NE5532A 0 70 SA5532, SA5532A –40 85 TYP MAX 0.5 4 TA Operating free-air temperature °C ELECTRICAL CHARACTERISTICS VCC± = ±15 V, TA = 25°C (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIO Input offset voltage IIO Input offset current IIB Input bias current VICR Common-mode input-voltage range VOPP Maximum peak-to-peak output-voltage swing AVD Large-signal differential-voltage amplification MIN TA = 25°C VO = 0 TA = Full range (2) 5 TA = 25°C TA = Full range 10 (2) 200 TA = 25°C 200 TA = Full range (2) RL ≥ 2 kΩ, VO±10 V 800 1000 mV nA nA ±12 ±13 V 24 26 V TA = 25°C 15 50 TA = Full range (2) 10 TA = 25°C 25 TA = Full range (2) 15 RL ≥ 600 Ω, VCC± = ±15 V RL ≥ 600 Ω, VO = ±10 V 150 UNIT V/mV 100 Avd Small-signal differential-voltage amplification f = 10 kHz 2.2 V/mV BOM Maximum output-swing bandwidth RL = 600 Ω, VO = ±10 V 140 kHz B1 Unity-gain bandwidth RL = 600 Ω, CL = 100 pF 10 MHz ri Input resistance 300 kΩ zo Output impedance 30 AVD = 30 dB, RL = 600 Ω, f = 10 kHz CMRR Common-mode rejection ratio Ω VIC = VICR min 70 100 dB VCC± = ±9 V to ±15 V, VO = 0 80 100 dB 10 38 60 mA 8 16 mA kSVR Supply-voltage rejection ratio (ΔVCC±/ΔVIO) IOS Output short-circuit current ICC Total supply curent VO = 0, No load Crosstalk attenuation (VO1/VO2) V01 = 10 V peak, f = 1 kHz (1) (2) 0.3 110 dB All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Full temperature ranges are: –40°C to 85°C for the SA5532 and SA5532A, and 0°C to 70°C for the NE5532 and NE5532A. Copyright © 1979–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A 3 NE5532, NE5532A SA5532, SA5532A SLOS075I – NOVEMBER 1979 – REVISED APRIL 2009................................................................................................................................................... www.ti.com OPERATING CHARACTERISTICS VCC± = ±15 V, TA = 25°C (unless otherwise noted) PARAMETER SR TEST CONDITIONS Slew rate at unity gain Vn Equivalent input noise voltage In Equivalent input noise current 4 Submit Documentation Feedback TYP MAX NE5532A, SA5532A MIN TYP MAX UNIT 9 9 V/µs 10 10 % f = 30 Hz 8 8 10 f = 1 kHz 5 5 6 f = 30 Hz 2.7 2.7 f = 1 kHz 0.7 0.7 VI = 100 mV, RL = 600 Ω, AVD = 1, CL = 100 pF Overshoot factor NE5532, SA5532 MIN nV/√Hz pA/√Hz Copyright © 1979–2009, Texas Instruments Incorporated Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty NE5532AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532AIP OBSOLETE PDIP P 8 TBD Call TI NE5532AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE5532APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE5532APSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532APSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532APSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5532IP OBSOLETE PDIP P 8 NE5532P ACTIVE PDIP P 8 NE5532PE4 ACTIVE PDIP P 8 NE5532PSR ACTIVE SO PS 8 NE5532PSRE4 ACTIVE SO PS NE5532PSRG4 ACTIVE SO SA5532AD ACTIVE SA5532ADE4 ACTIVE Lead/Ball Finish MSL Peak Temp (3) Call TI TBD Call TI 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SA5532ADG4 ACTIVE SOIC D 8 SA5532ADR ACTIVE SOIC D SA5532ADRE4 ACTIVE SOIC SA5532ADRG4 ACTIVE SA5532AP Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SA5532APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SA5532D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5532DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5532DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5532DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5532DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5532DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5532P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SA5532PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2009 accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 4-Feb-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device NE5532ADR Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 NE5532APSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 NE5532DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 NE5532PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SA5532ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SA5532DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Feb-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) NE5532ADR SOIC D 8 2500 340.5 338.1 20.6 NE5532APSR SO PS 8 2000 346.0 346.0 33.0 NE5532DR SOIC D 8 2500 340.5 338.1 20.6 NE5532PSR SO PS 8 2000 346.0 346.0 33.0 SA5532ADR SOIC D 8 2500 340.5 338.1 20.6 SA5532DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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