TI1 LMK04803BISQ Low-noise clock jitter cleaner Datasheet

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LMK04803, LMK04805, LMK04806, LMK04808
SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
LMK0480x Low-Noise Clock Jitter Cleaner with Dual Loop PLLs
1 Features
3 Description
•
The LMK0480x family is the industry's highest
performance clock conditioner with superior clock
jitter cleaning, generation, and distribution with
advanced features to meet next generation system
requirements.
The
dual
loop
PLLatinum™
architecture is capable of 111 fs rms jitter (12 kHz to
20 MHz) using a low noise VCXO module or sub-200
fs rms jitter (12 kHz to 20 MHz) using a low cost
external crystal and varactor diode.
1
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2
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Ultra-Low RMS Jitter Performance
– 111 fs RMS Jitter (12 kHz to 20 MHz)
– 123 fs RMS Jitter (100 Hz to 20 MHz)
Dual Loop PLLatinum™ PLL Architecture
PLL1
– Integrated Low-Noise Crystal Oscillator Circuit
– Holdover Mode when Input Clocks are Lost
– Automatic or Manual Triggering/Recovery
PLL2
– Normalized PLL Noise Floor of –227 dBc/Hz
– Phase Detector Rate up to 155 MHz
– OSCin Frequency-Doubler
– Integrated Low-Noise VCO
2 Redundant Input Clocks with LOS
– Automatic and Manual Switch-Over Modes
50 % Duty Cycle Output Divides, 1 to 1045 (Even
and Odd)
12 LVPECL, LVDS, or LVCMOS Programmable
Outputs
Digital Delay: Fixed or Dynamically Adjustable
25 ps Step Analog Delay Control.
14 Differential Outputs. Up to 26 Single Ended.
– Up to 6 VCXO/Crystal Buffered Outputs
Clock Rates of up to 1536 MHz
0-Delay Mode
Three Default Clock Outputs at Power Up
Multi-Mode: Dual PLL, Single PLL, and Clock
Distribution
Industrial Temperature Range: –40 to 85°C
3.15-V to 3.45-V Operation
2 Dedicated Buffered/Divided OSCin Clocks
Package: 64-Pin WQFN (9.0 × 9.0 × 0.8 mm)
The dual loop architecture consists of two highperformance phase-locked loops (PLL), a low-noise
crystal oscillator circuit, and a high-performance
voltage controlled oscillator (VCO). The first PLL
(PLL1) provides low-noise jitter cleaner functionality
while the second PLL (PLL2) performs the clock
generation. PLL1 can be configured to either work
with an external VCXO module or the integrated
crystal oscillator with an external tunable crystal and
varactor diode. When paired with a very narrow loop
bandwidth, PLL1 uses the superior close-in phase
noise (offsets below 50 kHz) of the VCXO module or
the tunable crystal to clean the input clock. The
output of PLL1 is used as the clean input reference to
PLL2 where it locks the integrated VCO. The loop
bandwidth of PLL2 can be optimized to clean the farout phase noise (offsets above 50 kHz) where the
integrated VCO outperforms the VCXO module or
tunable crystal used in PLL1.
Device Information
PART NUMBER
VCO FREQUENCY
LMK04803
1840 to 2030 MHz
LMK04805
2148 to 2370 MHz
LMK04806
2370 to 2600 MHz
LMK04808
2750 to 3072 MHz
2
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
Applications
Data Converter Clocking
Wireless Infrastructure
Networking, SONET/SDH, DSLAM
Medical / Video / Military / Aerospace
Test and Measurement
REFERENCE
INPUTS
Recovered
³GLUW\´FORFNRU
clean clock
Crystal or
VCXO
OSCout0/
OSCout1
LMX2541
PLL+VCO
CLKin0
Backup
Reference
Clock
CLKin1
CLKout0, 1
LMK0480x
CLKout2
CLKout3
Precision Clock
Conditioner
FPGA
FPGA
Serializer/
Deserializer
CLKout4, 5, 6, 7
I
CLKout11
0XOWLSOH³FOHDQ´
clocks at different
frequencies
CLKout8A
IF
CLKout9
Q
CPLD
ADC
DAC
DAC
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMK04803, LMK04805, LMK04806, LMK04808
SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7
1
1
1
2
4
6
Absolute Maximum Ratings ...................................... 6
ESD Ratings.............................................................. 6
Recommended Operating Conditions....................... 6
Thermal Information .................................................. 7
Electrical Characteristics........................................... 7
Timing Requirements .............................................. 13
Typical Characteristics: Clock Output AC
Characteristics ......................................................... 14
Parameter Measurement Information ................ 15
7.1 Charge Pump Current Specification Definitions...... 15
7.2 Differential Voltage Measurement Terminology...... 16
8
Detailed Description ............................................ 17
8.1
8.2
8.3
8.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
17
21
22
43
8.5 Programming........................................................... 47
8.6 Register Maps ......................................................... 51
9
Application and Implementation ........................ 97
9.1
9.2
9.3
9.4
Application Information............................................ 97
Typical Applications .............................................. 114
System Examples ................................................. 122
Do's and Don'ts ..................................................... 124
10 Power Supply Recommendations ................... 125
10.1 Pin Connection Recommendations..................... 125
10.2 Current Consumption and Power Dissipation
Calculations............................................................ 126
11 Layout................................................................. 129
11.1 Layout Guidelines ............................................... 129
11.2 Layout Example .................................................. 130
12 Device and Documentation Support ............... 131
12.1
12.2
12.3
12.4
12.5
12.6
Device Support....................................................
Documentation Support ......................................
Related Links ......................................................
Trademarks .........................................................
Electrostatic Discharge Caution ..........................
Glossary ..............................................................
131
131
131
131
131
131
13 Mechanical, Packaging, and Orderable
Information ......................................................... 131
4 Revision History
Changes from Revision J (March 2013) to Revision K
Page
•
Changed 90 to 80 and 80 to 90 for fCLKout-startup parameter in Electrical Characteristics....................................................... 11
•
Added "Specification is not valid for CLKoutX or CLKoutY in analog delay mode" in table note for Electrical
Characteristics ..................................................................................................................................................................... 11
•
Changed "Temperature" to "Ambient Temperature" in heading titled "Charge Pump Output Current Magnitude
Variation vs. Ambient Temperature" .................................................................................................................................... 15
•
Added "temporarily" in VCXO/CRYSTAL Buffered Outputs ................................................................................................ 18
•
Changed from "n possible" to "D possible" in 0-Delay ......................................................................................................... 20
•
Changed "can" to "cannot" in Input Clock Switching - Pin Select Mode .............................................................................. 24
•
Deleted Clock Switch Event without Holdover in Clock Switch Event with Holdover .......................................................... 25
•
Added paragraph beginning "For applications ..." in PLL2 Frequency Doubler ................................................................... 29
•
Changed 5 to15 in Table 11 ................................................................................................................................................. 42
•
Deleted Mode 5 row in Table 12 .......................................................................................................................................... 43
•
Added Mode 15 Additional Configurations section .............................................................................................................. 46
•
In Table 16, added [27:26], [23:22], and [21:20] for Register 27 row. Added [31:20] for R28. Added [26:24] for R30.
Added [7:6]. .......................................................................................................................................................................... 51
•
In Table 18, changed "Actual PLL2 N divider value used in calibration routine". Added footnote "Inversion for Status
0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06" ............................................................................................ 56
•
In Table 28, added "to reduce supply..." footnote for 9 through 14. Added footnote "To reduce supply switching and
crosstalk noise, it is recommended to use a complementary LVCMOS output type such as 6 or 7". ................................. 64
•
Added footnote "To reduce supply" for 8 through 14 in Table 32 ....................................................................................... 66
•
Changed "Divide" to "Definition" in Table 39, Table 40, Table 61, and Table 62 ................................................................ 68
•
Changed to "MUX OUTPUT" in Table header row in Table 42............................................................................................ 69
•
In Table 43, added footnote, "Contact TI Applications for more information on using this mode". Changed to "Dual
2
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Copyright © 2011–2014, Texas Instruments Incorporated
Product Folder Links: LMK04803 LMK04805 LMK04806 LMK04808
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www.ti.com
SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
Revision History (continued)
PLL, External VCO (Fin), 0-Delay" for 15 (0x0F) ................................................................................................................. 70
•
Added "Inversion for Status 0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06" in CLKin_Sel_INV ................. 78
•
In FORCE_HOLDOVER, added "(EN_TRACK = 0 or 1, EN_MAN_DAC =1)". Added "(EN_TRACK = 1,
EN_MAN_DAC = 0, EN_VTUNE_RAIL_DET = 0)".............................................................................................................. 82
•
Changed to R[23:14] in DAC_CNT....................................................................................................................................... 83
•
In Table 90, added (0x0000), (0x0001), (0x0002), (0x0003). Changed "Divide" to "Value" in the header row. .................. 87
•
Added (0x00) through (0x04) in Table 91............................................................................................................................. 88
•
Added PLL2 Frequency Doubler .......................................................................................................................................... 88
•
Changed from "Divide" to "Value" in Table 95 ..................................................................................................................... 89
•
Added PLL2 Frequency Doubler reference in Table 103 ..................................................................................................... 92
•
Added note "Unless in 0-delay..." in PLL2_N_CAL, PLL2 N Calibration Divider ................................................................ 93
•
Changed "Mode_MUX1" to "VCO_MUX" in PLL2_P, PLL2 N Prescaler Divider................................................................. 94
•
Changed "register" to "Defintion" in table header row for Table 110 ................................................................................... 95
•
Updated Minimum Digital Lock Detect Time Calculation Example ................................................................................... 107
•
Added "Performance of other LMK0480x devices will be similar" in Optional Crystal Oscillator Implementation
(OSCin/OSCin*).................................................................................................................................................................. 110
•
Changed to "(fs rms)" in Table 125 ................................................................................................................................... 111
•
Added text in red for Figure 40 .......................................................................................................................................... 123
•
In Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs), added bullet point starting with "It is recommended..."
Changed ≤ 10 MHz to ≤ 30 MHz ........................................................................................................................................ 125
•
Added paragraph "It is recommended..." in Vcc5 (CLKin and OSCout1), Vcc7 (OSCin and OSCout0) ........................... 126
•
Added Mode = 15. Removed Mode = 5 in Table 127 ........................................................................................................ 127
•
Deleted "of about 2 square inches" in Layout Guidelines .................................................................................................. 129
Changes from Revision I (March 2013) to Revision J
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................. 1
Copyright © 2011–2014, Texas Instruments Incorporated
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3
LMK04803, LMK04805, LMK04806, LMK04808
SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
www.ti.com
5 Pin Configuration and Functions
53
52
CLKout6*
54
CLKout7
Vcc11
55
CLKout7*
CLKout8
56
CLKout9*
57
CLKout8*
58
Vcc12
59
CLKout9
60
CLKout10*
61
CLKout10
62
CLKout11
63
CLKout11*
Status_CLKin1
64
Status_CLKin0
Vcc13
64-Pin WQFN with Exposed Pad
NKD Package
(Top View)
51
50
49
CLKout0
1
48
CLKout6
CLKout0*
2
47
Vcc10
CLKout1*
3
46
DATAuWire
CLKout1
4
45
CLKuWire
NC
5
44
LEuWire
SYNC
6
43
Vcc9
NC
7
42
CPout2
NC
8
41
Vcc8
Top Down View
NC
9
40
OSCout0*
Vcc1
10
39
OSCout0
LDObyp1
11
38
Vcc7
LDObyp2
12
37
OSCin*
CLKout2
13
36
OSCin
CLKout2*
14
35
Vcc6
34
CPout1
33
Status_LD
25
26
27
28
29
30
31
32
Vcc5
OSCout1
OSCout1*
CLKout5
24
CLKin0
CLKout4*
23
CLKin0*
22
Status_Holdover
21
FBCLKin*/Fin*/CLKin1*
20
Vcc4
19
FBCLKin/Fin/CLKin1
18
GND
17
CLKout5*
DAP
Vcc3
16
CLKout4
15
CLKout3
Vcc2
CLKout3*
Pin Functions (1)
PIN
NUMBER
I/O
NAME
1, 2
CLKout0, CLKout0*
3, 4
6
5, 7, 8, 9
NC
10
11
TYPE
DESCRIPTION
O
Programmable
Clock output 0 (clock group 0).
CLKout1*, CLKout1
O
Programmable
Clock output 1 (clock group 0).
SYNC
I/O
Programmable
CLKout Synchronization input or programmable status pin.
–
No Connection. These pins must be left floating.
Vcc1
PWR
Power supply for VCO LDO.
LDObyp1
ANLG
LDO Bypass, bypassed to ground with 10 µF capacitor.
12
LDObyp2
ANLG
LDO Bypass, bypassed to ground with a 0.1 µF capacitor.
13, 14
CLKout2, CLKout2*
O
Programmable
Clock output 2 (clock group 1).
15, 16
CLKout3*, CLKout3
O
Programmable
Clock output 3 (clock group 1).
17
Vcc2
PWR
Power supply for clock group 1: CLKout2 and CLKout3.
18
Vcc3
PWR
Power supply for clock group 2: CLKout4 and CLKout5.
(1)
4
–
See Pin Connection Recommendations.
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Product Folder Links: LMK04803 LMK04805 LMK04806 LMK04808
LMK04803, LMK04805, LMK04806, LMK04808
www.ti.com
SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
Pin Functions(1) (continued)
PIN
NUMBER
I/O
NAME
TYPE
DESCRIPTION
19, 20
CLKout4, CLKout4*
O
Programmable
Clock output 4 (clock group 2).
21, 22
CLKout5*, CLKout5
O
Programmable
Clock output 5 (clock group 2).
23
GND
PWR
Ground.
24
Vcc4
PWR
Power supply for digital.
CLKin1, CLKin1*
25, 26
FBCLKin, FBCLKin*
Reference Clock Input Port 1 for PLL1. AC or DC Coupled.
I
ANLG
Feedback input for external clock feedback input (0-delay
mode). AC or DC Coupled.
External VCO input (External VCO mode). AC or DC
Coupled.
Fin/Fin*
Programmable
Programmable status pin, default readback output.
Programmable to holdover mode indicator. Other options
available by programming.
ANLG
Reference Clock Input Port 0 for PLL1.
AC or DC Coupled.
PWR
Power supply for clock inputs and OSCout1.
LVPECL
Buffered output 1 of OSCin port.
I/O
Programmable
Programmable status pin, default lock detect for PLL1 and
PLL2. Other options available by programming.
O
ANLG
Charge pump 1 output.
PWR
Power supply for PLL1, charge pump 1.
ANLG
Feedback to PLL1, Reference input to PLL2.
AC Coupled.
PWR
Power supply for OSCin, OSCout0, and PLL2 circuitry. (2)
Programmable
Buffered output 0 of OSCin port. (2)
PWR
Power supply for PLL2, charge pump 2.
ANLG
Charge pump 2 output.
PWR
Power supply for PLL2.
I
CMOS
MICROWIRE Latch Enable Input.
I
CMOS
MICROWIRE Clock Input.
I
CMOS
MICROWIRE Data Input.
PWR
Power supply for clock group 3: CLKout6 and CLKout7.
O
Programmable
Clock output 6 (clock group 3).
O
Programmable
Clock output 7 (clock group 3).
PWR
Power supply for clock group 4: CLKout8 and CLKout9.
O
Programmable
Clock output 8 (clock group 4).
O
Programmable
Clock output 9 (clock group 4).
PWR
Power supply for clock group 5: CLKout10 and CLKout11.
O
Programmable
Clock output 10 (clock group 5).
CLKout11*,
CLKout11
O
Programmable
Clock output 11 (clock group 5).
62
Status_CLKin0
I/O
Programmable
Programmable status pin. Default is input for pin control of
PLL1 reference clock selection. CLKin0 LOS status and
other options available by programming.
63
Status_CLKin1
I/O
Programmable
Programmable status pin. Default is input for pin control of
PLL1 reference clock selection. CLKin1 LOS status and
other options available by programming.
64
Vcc13
PWR
Power supply for clock group 0: CLKout0 and CLKout1.
DAP
DAP
GND
DIE ATTACH PAD, connect to GND.
27
Status_Holdover
I/O
28, 29
CLKin0, CLKin0*
I
30
Vcc5
31, 32
OSCout1, OSCout1*
O
33
Status_LD
34
CPout1
35
Vcc6
36, 37
OSCin, OSCin*
38
Vcc7
39, 40
OSCout0, OSCout0*
41
Vcc8
42
CPout2
43
Vcc9
44
LEuWire
45
CLKuWire
46
DATAuWire
47
Vcc10
48, 49
CLKout6, CLKout6*
50, 51
CLKout7*, CLKout7
52
Vcc11
53, 54
CLKout8, CLKout8*
55, 56
CLKout9*, CLKout9
57
Vcc12
58, 59
CLKout10,
CLKout10*
60, 61
(2)
I
O
O
–
See Vcc5 (CLKin and OSCout1), Vcc7 (OSCin and OSCout0) for information on configuring device for optimum performance.
Copyright © 2011–2014, Texas Instruments Incorporated
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LMK04803, LMK04805, LMK04806, LMK04808
SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
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6 Specifications
6.1 Absolute Maximum Ratings (1) (2) (3)
over operating free-air temperature range (unless otherwise noted)
(4)
MIN
MAX
UNIT
–0.3
3.6
V
–0.3
(VCC +
0.3)
V
Lead Temperature (solder 4 seconds)
+260
°C
TJ
Junction Temperature
150
°C
IIN
Differential Input Current (CLKinX/X*,
OSCin/OSCin*, FBCLKin/FBCLKin*, Fin/Fin*)
±5
mA
MSL
Moisture Sensitivity Level
Tstg
Storage temperature range
VCC
Supply Voltage
VIN
Input Voltage
TL
(1)
(2)
(3)
(4)
(5)
(5)
3
-65
150
°C
"Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only to the test conditions listed.
Stresses in excess of the absolute maximum ratings can cause permanent or latent damage to the device. These are absolute stress
ratings only. Functional operation of the device is only implied at these or any other conditions in excess of those given in the operation
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability.
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Never to exceed 3.6 V.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Machine model (MM)
±150
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±750
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance.
6.3 Recommended Operating Conditions
MIN
TJ
Junction Temperature
TA
Ambient Temperature
VCC
Supply Voltage
6
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VCC = 3.3 V
NOM
MAX
UNIT
125
°C
-40
25
85
°C
3.15
3.3
3.45
V
Copyright © 2011–2014, Texas Instruments Incorporated
Product Folder Links: LMK04803 LMK04805 LMK04806 LMK04808
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SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
6.4 Thermal Information
LMK0480x
THERMAL METRIC (1)
NKD
UNIT
64 PINS
Junction-to-ambient thermal resistance on 4-layer JEDEC PCB (2) (3)
RθJA
25.2
(4) (5)
RθJC(top)
Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance (6)
4.0
ψJT
Junction-to-top characterization parameter (7)
0.1
ψJB
Junction-to-board characterization parameter (8)
4.0
RθJC(bot)
Junction-to-case (bottom) thermal resistance (9)
0.8
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
6.9
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
Specification assumes 32 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC PCB. These
vias play a key role in improving the thermal performance of the WQFN. Note that the JEDEC PCB is a standard thermal measurement
PCB and does not represent best performance a PCB can achieve. It is recommended that the maximum number of vias be used in the
board layout. R θJA is unique for each PCB.
The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC standard
test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Case is defined as the DAP (die attach pad)
The junction-to-board thermal resistance is obtained by simulating an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
6.5 Electrical Characteristics
3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25°C,
at the Recommended Operating Conditions at the time of product characterization and are not specified. (1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1
3
mA
505
590
mA
500
MHz
CURRENT CONSUMPTION
ICC_PD
Power down supply current
No DC path to ground on
OSCout1/1* (2)
ICC_CLKS
Supply current with all clocks enabled (3)
All clock delays disabled,
CLKoutX_Y_DIV = 1045,
CLKoutX_TYPE = 1 (LVDS),
PLL1 and PLL2 locked.
CLKin0/0* and CLKin1/1* INPUT CLOCK SPECIFICATIONS
Clock input frequency (4)
fCLKin
SLEWCLKin
(1)
Clock input slew rate
0.001
(5)
VIDCLKin
VSSCLKin
VIDCLKin
Clock input
Differential input voltage (see
Figure 4)
(6)
VSSCLKin
(1)
(2)
(3)
(4)
(5)
(6)
20% to 80%
0.15
AC coupled
CLKinX_BUF_TYPE = 0 (Bipolar)
0.25
1.55
|V|
0.5
3.1
Vpp
AC coupled
CLKinX_BUF_TYPE = 1 (MOS)
0.25
1.55
|V|
0.5
3.1
Vpp
and
0.5
V/ns
In order to meet the jitter performance listed in the subsequent sections of this data sheet, the minimum recommended slew rate for all
input clocks is 0.5 V/ns. This is especially true for single-ended clocks. Phase noise performance will begin to degrade as the clock input
slew rate is reduced. However, the device will function at slew rates down to the minimum listed. When compared to single-ended
clocks, differential clocks (LVDS, LVPECL) will be less susceptible to degradation in phase noise performance at lower slew rates due to
their common mode noise rejection. However, it is also recommended to use the highest possible slew rate for differential clocks to
achieve optimal phase noise performance at the device outputs.
If emitter resistors are placed on the OSCout1/1* pins, there will be a DC current to ground which will cause powerdown Icc to increase.
Load conditions for output clocks: LVDS: 100-Ω differential. See Current Consumption and Power Dissipation Calculations for Icc for
specific part configuration and how to calculate Icc for a specific design.
CLKin0, CLKin1 maximum is specified by characterization, production tested at 200 MHz.
Specified by characterization.
See Differential Voltage Measurement Terminology for definition of VID and VOD voltages.
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Electrical Characteristics (continued)
3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25°C,
at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)
PARAMETER
Clock input
Single-ended input voltage (5)
VCLKin
VCLKin0-offset
DC offset voltage between
CLKin0/CLKin0*
CLKin0* - CLKin0
VCLKin1-offset
DC offset voltage between
CLKin1/CLKin1*
CLKin1* - CLKin1
VCLKinX-offset
DC offset voltage between
CLKinX/CLKinX*
CLKinX* - CLKinX
VCLKin- VIH
High input voltage
VCLKin- VIL
Low input voltage
TEST CONDITIONS
AC coupled to CLKinX; CLKinX* AC
coupled to Ground
CLKinX_BUF_TYPE = 0 (Bipolar)
AC coupled to CLKinX; CLKinX* AC
coupled to Ground
CLKinX_BUF_TYPE = 1 (MOS)
MIN
TYP
MAX
UNIT
0.25
2.4
Vpp
0.25
2.4
Vpp
20
mV
0
mV
55
mV
Each pin AC coupled
CLKin0_BUF_TYPE = 0 (Bipolar)
Each pin AC coupled
CLKinX_BUF_TYPE = 1 (MOS)
DC coupled to CLKinX; CLKinX* AC
coupled to Ground
CLKinX_BUF_TYPE = 1 (MOS)
2.0
VCC
V
0.0
0.4
V
AC coupled
(CLKinX_BUF_TYPE = 0)
MODE = 2 or 8; FEEDBACK_MUX =
6
0.001
1000
MHz
FBCLKin/FBCLKin* and Fin/Fin* INPUT SPECIFICATIONS
(5)
fFBCLKin
Clock input frequency
fFin
Clock input frequency (5)
AC coupled
(CLKinX_BUF_TYPE = 0)
MODE = 3 or 11
0.001
3100
MHz
VFBCLKin/Fin
Single Ended
Clock input voltage (5)
AC coupled;
(CLKinX_BUF_TYPE = 0)
0.25
2.0
Vpp
SLEWFBCLKin/Fin
Slew rate on CLKin (5)
AC coupled; 20% to 80%;
(CLKinX_BUF_TYPE = 0)
0.15
0.5
V/ns
PLL1 SPECIFICATIONS
fPD1
PLL1 phase detector frequency
ICPout1SOURCE
PLL1 charge
Pump source current (7)
40
VCPout1 = VCC/2, PLL1_CP_GAIN = 0
100
VCPout1 = VCC/2, PLL1_CP_GAIN = 1
200
VCPout1 = VCC/2, PLL1_CP_GAIN = 2
400
VCPout1 = VCC/2, PLL1_CP_GAIN = 3
1600
VCPout1=VCC/2, PLL1_CP_GAIN = 0
-100
VCPout1=VCC/2, PLL1_CP_GAIN = 1
-200
VCPout1=VCC/2, PLL1_CP_GAIN = 2
-400
VCPout1=VCC/2, PLL1_CP_GAIN = 3
-1600
ICPout1SINK
PLL1 charge
Pump sink current (7)
ICPout1%MIS
Charge pump
Sink/source mismatch
VCPout1 = VCC/2, T = 25 °C
3%
ICPout1VTUNE
Magnitude of charge pump current
variation vs. charge pump voltage
0.5 V < VCPout1 < VCC - 0.5 V
TA = 25 °C
4%
ICPout1%TEMP
Charge pump current vs.
temperature variation
ICPout1 TRI
Charge Pump TRI-STATE leakage
current
(7)
8
MHz
µA
µA
10%
4%
0.5 V < VCPout < VCC - 0.5 V
5
nA
This parameter is programmable
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SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
Electrical Characteristics (continued)
3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25°C,
at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)
PARAMETER
TEST CONDITIONS
(8)
PN10kHz
PLL 1/f noise at 10 kHz offset.
Normalized to 1 GHz Output Frequency
PN1Hz
Normalized phase noise contribution (9)
MIN
TYP
PLL1_CP_GAIN = 400 µA
-117
PLL1_CP_GAIN = 1600 µA
-118
PLL1_CP_GAIN = 400 µA
MAX
dBc/Hz
-221.5
PLL1_CP_GAIN = 1600 µA
UNIT
dBc/Hz
-223
PLL2 REFERENCE INPUT (OSCin) SPECIFICATIONS
fOSCin
PLL2 reference input (10)
SLEWOSCin
PLL2 reference clock minimum slew rate
20% to 80%
on OSCin (5)
VOSCin
Input voltage for OSCin or OSCin* (5)
AC coupled; Single-ended (Unused
pin AC coupled to GND)
Differential voltage swing (see Figure 4)
AC coupled
VOSCin-offset
DC offset voltage between
OSCin/OSCin*
OSCinX* - OSCinX
Each pin AC coupled
fdoubler_max
Doubler input frequency (5)
EN_PLL2_REF_2X = 1; (11)
OSCin Duty Cycle 40% to 60%
VIDOSCin
VSSOSCin
500
0.15
0.5
MHz
V/ns
0.2
2.4
Vpp
0.2
1.55
|V|
0.4
3.1
Vpp
20
mV
155
MHz
20.5
MHz
CRYSTAL OSCILLATOR MODE SPECIFICATIONS
Crystal frequency range (5)
RESR < 40 Ω
PXTAL
Crystal power dissipation (12)
Vectron VXB1 crystal, 20.48 MHz,
RESR < 40 Ω
XTAL_LVL = 0
CIN
Input capacitance of
LMK0480x OSCin port
-40 to +85 °C
fXTAL
6
100
µW
6
pF
PLL2 PHASE DETECTOR and CHARGE PUMP SPECIFICATIONS
fPD2
Phase detector frequency
155
VCPout2=VCC/2, PLL2_CP_GAIN = 0
ICPoutSOURCE
PLL2 charge pump source current (7)
MHz
100
VCPout2=VCC/2, PLL2_CP_GAIN = 1
400
VCPout2=VCC/2, PLL2_CP_GAIN = 2
1600
VCPout2=VCC/2, PLL2_CP_GAIN = 3
3200
VCPout2=VCC/2, PLL2_CP_GAIN = 0
-100
VCPout2=VCC/2, PLL2_CP_GAIN = 1
-400
VCPout2=VCC/2, PLL2_CP_GAIN = 2
-1600
VCPout2=VCC/2, PLL2_CP_GAIN = 3
-3200
ICPoutSINK
PLL2 charge pump sink current (7)
ICPout2%MIS
Charge pump sink/source mismatch
VCPout2=VCC/2, TA = 25 °C
3%
ICPout2VTUNE
Magnitude of charge pump current vs.
charge pump voltage variation
0.5 V < VCPout2 < VCC - 0.5 V
TA = 25 °C
4%
µA
µA
10%
(8)
A specification in modeling PLL in-band phase noise is the 1/f flicker noise, LPLL_flicker(f), which is dominant close to the carrier. Flicker
noise has a 10 dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = LPLL_flicker(10
kHz) - 20log(Fout / 1 GHz), where LPLL_flicker(f) is the single side band phase noise of only the flicker noise's contribution to total noise,
L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade slope close to the carrier. A high compare frequency and a clean
crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f) can be masked by the reference
oscillator performance if a low power or noisy source is used. The total PLL in-band phase noise performance is the sum of LPLL_flicker(f)
and LPLL_flat(f).
(9) A specification modeling PLL in-band phase noise. The normalized phase noise contribution of the PLL, LPLL_flat(f), is defined as:
PN1HZ=LPLL_flat(f) - 20log(N) - 10log(fPDX). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz
bandwidth and fPDX is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f).
(10) FOSCin maximum frequency specified by characterization. Production tested at 200 MHz.
(11) The EN_PLL2_REF_2X bit (Register 13) enables/disables a frequency doubler mode for the PLL2 OSCin path.
(12) See Application Section discussion of Optional Crystal Oscillator Implementation (OSCin/OSCin*).
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Electrical Characteristics (continued)
3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25°C,
at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
ICPout2%TEMP
Charge pump current vs.
Temperature variation
ICPout2TRI
Charge pump leakage
0.5 V < VCPout2 < VCC - 0.5 V
PLL2_CP_GAIN = 400 µA
-118
PN10kHz
PLL 1/f Noise at 10 kHz offset (8)
Normalized to
1 GHz output frequency
PLL2_CP_GAIN = 3200 µA
-121
PN1Hz
Normalized Phase Noise Contribution (9)
MAX
UNIT
4%
10
PLL2_CP_GAIN = 400 µA
dBc/Hz
-222.5
PLL2_CP_GAIN = 3200 µA
nA
dBc/Hz
-227
INTERNAL VCO SPECIFICATIONS
LMK04803
1840
2030
LMK04805
2148
2370
LMK04806
2370
2600
LMK04808
2750
3072
fVCO
VCO tuning range
KVCO
Fine tuning sensitivity
(The range displayed in the typical
column indicates the lower sensitivity is
typical at the lower end of the tuning
LMK04808
range, and the higher tuning sensitivity is
typical at the higher end of the tuning
range).
|ΔTCL|
Allowable Temperature Drift for
Continuous Lock (13) (5)
20 to 36
After programming R30 for lock, no
changes to output configuration are
permitted to ensure continuous lock
MHz
MHz/V
125
°C
CLKout CLOSED LOOP JITTER SPECIFICATIONS USING a COMMERCIAL QUALITY VCXO (14)
L(f)CLKout
LMK04808
fCLKout = 245.76 MHz
SSB Phase noise
Measured at clock outputs
Value is average for all output types (15)
LMK04803 (15)
fCLKout = 245.76 MHz
Integrated RMS jitter
(15)
JCLKout
LVDS/LVPECL/
LVCMOS
LMK04805
fCLKout = 245.76 MHz
Integrated RMS jitter
(15)
LMK04806
fCLKout = 245.76 MHz
Integrated RMS jitter
(15)
LMK04808
fCLKout = 245.76 MHz
Integrated RMS jitter
Offset = 1 kHz
-122.5
Offset = 10 kHz
-132.9
Offset = 100 kHz
-135.2
Offset = 800 kHz
-143.9
Offset = 10 MHz; LVDS
-156.0
Offset = 10 MHz; LVPECL 1600
mVpp
-157.5
Offset = 10 MHz; LVCMOS
-157.1
BW = 12 kHz to 20 MHz
112
BW = 100 Hz to 20 MHz
121
BW = 12 kHz to 20 MHz
113
BW = 100 Hz to 20 MHz
122
BW = 12 kHz to 20 MHz
115
BW = 100 Hz to 20 MHz
123
BW = 12 kHz to 20 MHz
111
BW = 100 Hz to 20 MHz
123
dBc/Hz
fs rms
(13) Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was
at the time that the R30 register was last programmed, and still have the part stay in lock. The action of programming the R30 register,
even to the same value, activates a frequency calibration routine. This implies the part will work over the entire frequency range, but if
the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the R30 register to
ensure it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the
frequency range of -40 °C to 85 °C without violating specifications.
(14) VCXO used is a 122.88 MHz Crystek CVHD-950-122.880.
(15) fVCO = 2949.12 MHz, PLL1 parameters: FPD1 = 1.024 MHz, ICP1 = 100 μA, loop bandwidth = 10 Hz. 122.88 MHz Crystek CVHD950–122.880. PLL2 parameters: PLL2_R = 1, FPD2 = 122.88 MHz, ICP2 = 3200 μA, C1 = 47 pF, C2 = 3.9 nF, R2 = 620 Ω, PLL2_C3_LF
= 0, PLL2_R3_LF = 0, PLL2_C4_LF = 0, PLL2_R4_LF = 0, CLKoutX_Y_DIV = 12, and CLKoutX_ADLY_SEL = 0.
10
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SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
Electrical Characteristics (continued)
3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25°C,
at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
CLKout CLOSED LOOP JITTER SPECIFICATIONS USING THE INTEGRATED LOW NOISE CRYSTAL OSCILLATOR CIRCUIT
LMK04808
fCLKout = 245.76 MHz
Integrated RMS jitter
BW = 12 kHz to 20 MHz
XTAL_LVL = 3
192
BW = 100 Hz to 20 MHz
XTAL_LVL = 3
450
UNIT
(16)
fs rms
DEFAULT POWER ON RESET CLOCK OUTPUT FREQUENCY
fCLKout-startup
Default output clock frequency at device
power on (17)
CLKout8, LVDS, LMK04803
69
77
87
CLKout8, LVDS, LMK04805
80
90
99
CLKout8, LVDS, LMK04806
90
98
110
CLKout8, LVDS, LMK04808
90
110
130
MHz
CLOCK SKEW and DELAY
LVDS-to-LVDS, T = 25 °C,
FCLK = 800 MHz, RL= 100 Ω
AC coupled
30
LVPECL-to-LVPECL,
T = 25 °C,
FCLK = 800 MHz, RL= 100 Ω
emitter resistors =
240 Ω to GND
AC coupled
30
Maximum skew between any two
LVCMOS outputs, same CLKout or
different CLKout (5) (18)
RL = 50 Ω, CL = 5 pF,
T = 25 °C, FCLK = 100 MHz.
100
LVDS or LVPECL to LVCMOS
Same device, T = 25 °C,
250 MHz
750
Maximum CLKoutX to CLKoutY (5) (18)
|TSKEW|
MixedTSKEW
td0-DELAY
CLKin to CLKoutX delay (18)
MODE = 2
PLL1_R_DLY = 0; PLL1_N_DLY = 0
1850
MODE = 2
PLL1_R_DLY = 0; PLL1_N_DLY = 0;
VCO Frequency = 2949.12 MHz
Analog delay select = 0;
Feedback clock digital delay = 11;
Feedback clock half step = 1;
Output clock digital delay = 5;
Output clock half step = 0;
0
ps
ps
ps
(16) Crystal used is a 20.48 MHz Vectron VXB1-1150-20M480 and Skyworks varactor diode, SMV-1249-074LF.
(17) CLKout6 and OSCout0 also oscillate at start-up at the frequency of the VCXO attached to OSCin port.
(18) Equal loading and identical clock output configuration on each clock output is required for specification to be valid. Specification is not
valid for CLKoutX or CLKoutY in analog delay mode.
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Electrical Characteristics (continued)
3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25°C,
at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
250
400
450
|mV|
500
800
900
mVpp
50
mV
LVDS CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 1
fCLKout
VOD
VSS
Maximum frequency (5) (19)
RL = 100 Ω
1536
Differential output voltage (see Figure 5)
ΔVOD
Change in magnitude of VOD for
complementary output states
VOS
Output offset voltage
ΔVOS
Change in VOS for complementary output
states
T = 25 °C, DC measurement
AC coupled to receiver input
R = 100-Ω differential termination
MHz
-50
1.125
1.25
1.375
V
35
|mV|
Output rise time
20% to 80%, RL = 100 Ω
Output fall time
80% to 20%, RL = 100 Ω
ISA
ISB
Output short circuit current
single ended
Single-ended output shorted to GND
T = 25 °C
-24
24
mA
ISAB
Output short circuit current - differential
Complimentary outputs tied together
-12
12
mA
TR / TF
200
ps
LVPECL CLOCK OUTPUTS (CLKoutX)
fCLKout
Maximum frequency (5) (19)
20% to 80% output rise
TR / TF
80% to 20% output fall time
1536
RL = 100 Ω, emitter resistors = 240 Ω
to GND
CLKoutX_TYPE = 4 or 5
(1600 or 2000 mVpp)
MHz
150
ps
VCC 1.03
V
VCC 1.41
V
700 mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 2
VOH
Output high voltage
VOL
Output low voltage
VOD
VSS
T = 25 °C, DC measurement
Termination = 50 Ω to
VCC - 1.4 V
Output voltage (see Figure 5)
305
380
440
|mV|
610
760
880
mVpp
1200 mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 3
VOH
Output high voltage
VOL
Output low voltage
VOD
VSS
T = 25 °C, DC measurement
Termination = 50 Ω to
VCC - 1.7 V
Output voltage (see Figure 5)
VCC 1.07
V
VCC 1.69
V
545
625
705
|mV|
1090
1250
1410
mVpp
1600 mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 4
VOH
Output high voltage
VOL
Output low voltage
VOD
VSS
T = 25 °C, DC Measurement
Termination = 50 Ω to
VCC - 2.0 V
Output voltage (see Figure 5)
VCC 1.10
V
VCC 1.97
V
660
870
965
|mV|
1320
1740
1930
mVpp
2000 mVpp LVPECL (2VPECL) CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 5
VOH
Output high voltage
VOL
Output low voltage
VOD
VSS
T = 25 °C, DC Measurement
Termination = 50 Ω to
VCC - 2.3 V
Output voltage Figure 5
VCC 1.13
V
VCC 2.20
V
800
1070
1200
|mV|
1600
2140
2400
mVpp
(19) Refer to Typical Characteristics: Clock Output AC Characteristics for output operation performance at higher frequencies than the
minimum maximum output frequency.
12
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SNAS489K – MARCH 2011 – REVISED DECEMBER 2014
Electrical Characteristics (continued)
3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25°C,
at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LVCMOS CLOCK OUTPUTS (CLKoutX)
fCLKout
Maximum frequency (5) (19)
5 pF Load
250
MHz
VCC 0.1
VOH
Output high voltage
1 mA Load
V
VOL
Output low voltage
1 mA Load
IOH
Output high current (source)
VCC = 3.3 V, VO = 1.65 V
28
mA
IOL
Output low current (sink)
VCC = 3.3 V, VO = 1.65 V
28
mA
DUTYCLK
Output duty cycle (5)
VCC/2 to VCC/2, FCLK = 100 MHz
T = 25 °C
TR
Output rise time
20% to 80%, RL = 50 Ω,
CL = 5 pF
400
ps
TF
Output fall time
80% to 20%, RL = 50 Ω,
CL = 5 pF
400
ps
0.1
45%
50%
V
55%
DIGITAL OUTPUTS (Status_CLKinX, Status_LD, Status_Holdover, SYNC)
VOH
High-Level output voltage
IOH = -500 µA
VOL
Low-Level output voltage
IOL = 500 µA
VCC 0.4
V
0.4
V
VCC
V
0.4
V
DIGITAL INPUTS (Status_CLKinX, SYNC)
VIH
High-Level input voltage
VIL
Low-Level input voltage
IIH
IIL
High-Level input current
VIH = VCC
Low-Level input current
VIL = 0 V
1.6
Status_CLKinX_TYPE = 0
(High Impedance)
-5
5
Status_CLKinX_TYPE = 1
(Pull-up)
-5
5
Status_CLKinX_TYPE = 2
(Pull-down)
10
80
Status_CLKinX_TYPE = 0
(High Impedance)
-5
5
Status_CLKinX_TYPE = 1
(Pull-up)
-40
-5
Status_CLKinX_TYPE = 2
(Pull-down)
-5
5
1.6
VCC
µA
µA
DIGITAL INPUTS (CLKuWire, DATAuWire, LEuWire)
VIH
High-Level input voltage
VIL
Low-Level input voltage
IIH
High-Level input current
VIH = VCC
IIL
Low-Level input current
VIL = 0
V
0.4
V
5
25
µA
-5
5
µA
6.6 Timing Requirements
See Serial MICROWIRE Timing Diagram and Advanced MICROWIRE Timing Diagrams for additional information
MIN
NOM
MAX
UNIT
TECS
LE to Clock Set Up Time
See Figure 6
25
ns
TDCS
Data to Clock Set Up Time
See Figure 6
25
ns
TCDH
Clock to Data Hold Time
See Figure 6
8
ns
TCWH
Clock Pulse Width High
See Figure 6
25
ns
TCWL
Clock Pulse Width Low
See Figure 6
25
ns
TCES
Clock to LE Set Up Time
See Figure 6
25
ns
TEWH
LE Pulse Width
See Figure 6
25
ns
TCR
Falling Clock to Readback Time
See Figure 9
25
ns
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6.7 Typical Characteristics: Clock Output AC Characteristics
1200
500
2000 mVpp
1600 mVpp
1200 mVpp
700 mVpp
450
1000
400
VOD(mV)
VOD(mV)
350
300
250
200
800
600
400
150
100
200
50
0
0
0
500
1000 1500 2000 2500 3000
FREQUENCY (MHz)
0
Figure 1. LVDS VOD vs. Frequency
500 1000 1500 2000 2500 3000
FREQUENCY (MHz)
Figure 2. LVPECL /w 240-Ω Emitter Resistors VOD vs.
Frequency
1200
VOD(mV)
1000
2000 mVpp
800
600
1600 mVpp
400
200
0
0
500 1000 1500 2000 2500 3000
FREQUENCY (MHz)
Figure 3. LVPECL /w 120-Ω Emitter Resistors VOD vs. Frequency
14
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7 Parameter Measurement Information
7.1 Charge Pump Current Specification Definitions
I1 = Charge Pump Sink Current at VCPout = VCC - ΔV
I2 = Charge Pump Sink Current at VCPout = VCC/2
I3 = Charge Pump Sink Current at VCPout = ΔV
I4 = Charge Pump Source Current at VCPout = VCC - ΔV
I5 = Charge Pump Source Current at VCPout = VCC/2
I6 = Charge Pump Source Current at VCPout = ΔV
ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device.
7.1.1 Charge Pump Output Current Magnitude Variation Vs. Charge Pump Output Voltage
7.1.2 Charge Pump Sink Current Vs. Charge Pump Output Source Current Mismatch
7.1.3 Charge Pump Output Current Magnitude Variation vs. Ambient Temperature
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7.2 Differential Voltage Measurement Terminology
The differential voltage of a differential signal can be described by two different definitions causing confusion
when reading datasheets or communicating with other engineers. This section will address the measurement and
description of a differential signal so that the reader will be able to understand and discern between the two
different definitions when used.
The first definition used to describe a differential signal is the absolute value of the voltage potential between the
inverting and non-inverting signal. The symbol for this first measurement is typically VID or VOD depending on if
an input or output voltage is being described.
The second definition used to describe a differential signal is to measure the potential of the non-inverting signal
with respect to the inverting signal. The symbol for this second measurement is VSS and is a calculated
parameter. Nowhere in the IC does this signal exist with respect to ground, it only exists in reference to its
differential pair. VSS can be measured directly by oscilloscopes with floating references, otherwise this value can
be calculated as twice the value of VOD as described in the first description.
Figure 4 illustrates the two different definitions side-by-side for inputs and Figure 5 illustrates the two different
definitions side-by-side for outputs. The VID and VOD definitions show VA and VB DC levels that the non-inverting
and inverting signals toggle between with respect to ground. VSS input and output definitions show that if the
inverting signal is considered the voltage potential reference, the non-inverting signal voltage potential is now
increasing and decreasing above and below the non-inverting reference. Thus the peak-to-peak voltage of the
differential signal can be measured.
VID and VOD are often defined as volts (V) and VSS is often defined as volts peak-to-peak (VPP).
VID Definition
VSS Definition for Input
Non-Inverting Clock
VA
2· VID
VID
VB
Inverting Clock
VSS = 2· VID
VID = | VA - VB |
GND
Figure 4. Two Different Definitions for Differential Input Signals
VOD Definition
VSS Definition for Output
Non-Inverting Clock
VA
2· VOD
VOD
VB
Inverting Clock
VOD = | VA - VB |
VSS = 2· VOD
GND
Figure 5. Two Different Definitions for Differential Output Signals
Refer to Application Note AN-912, Common Data Transmission Parameters and their Definitions (SNLA036) for
more information.
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8 Detailed Description
8.1 Overview
In default mode of operation, dual PLL mode with internal VCO, the Phase Frequency Detector in PLL1
compares the active CLKinX reference divided by CLKinX_PreR_DIV and PLL1 R divider with the external
VCXO or crystal attached to the PLL2 OSCin port divided by PLL1 N divider. The external loop filter for PLL1
should be narrow to provide an ultra clean reference clock from the external VCXO or crystal to the
OSCin/OSCin* pins for PLL2.
The Phase Frequency Detector in PLL2 compares the external VCXO or crystal to the internal VCO after the
reference and feedback dividers. The VCXO or crystal on the OSCin input is divided by PLL2 R divider. The
feedback from the internal VCO is divided by the PLL2 Prescaler, the PLL2 N divider, and optionally the VCO
divider.
The bandwidth of the external loop filter for PLL2 should be designed to be wide enough to take advantage of
the low in-band phase noise of PLL2 and the low high offset phase noise of the internal VCO. The VCO output is
also placed on the distribution path for the Clock Distribution section. The clock distribution consists of 6 groups
of dividers and delays which drive 12 outputs. Each clock group allows the user to select a divide value, a digital
delay value, and an analog delay. The 6 groups drive programmable output buffers. Two groups allow their input
signal to be from the OSCin port directly.
When a 0-delay mode is used, a clock output will be passed through the feedback mux to the PLL1 N Divider for
synchronization and 0-delay.
When an external VCO mode is used, the Fin port will be used to input an external VCO signal. PLL2 Phase
comparison will now be with this signal divided by the PLL2 N divider and N2 pre-scaler. The VCO divider may
not be used. One less clock input is available when using an external VCO mode.
When a single PLL mode is used, PLL1 is powered down. OSCin is used as a reference to PLL2.
8.1.1 System Architecture
The dual loop PLL architecture of the LMK0480x provides the lowest jitter performance over the widest range of
output frequencies and phase noise integration bandwidths. The first stage PLL (PLL1) is driven by an external
reference clock and uses an external VCXO or tunable crystal to provide a frequency accurate, low phase noise
reference clock for the second stage frequency multiplication PLL (PLL2). PLL1 typically uses a narrow loop
bandwidth (10 Hz to 200 Hz) to retain the frequency accuracy of the reference clock input signal while at the
same time suppressing the higher offset frequency phase noise that the reference clock may have accumulated
along its path or from other circuits. This “cleaned” reference clock provides the reference input to PLL2.
The low phase noise reference provided to PLL2 allows PLL2 to operate with a wide loop bandwidth (50 kHz to
200 kHz). The loop bandwidth for PLL2 is chosen to take advantage of the superior high offset frequency phase
noise profile of the internal VCO and the good low offset frequency phase noise of the reference VCXO or
tunable crystal.
Ultra low jitter is achieved by allowing the external VCXO or crystal’s phase noise to dominate the final output
phase noise at low offset frequencies and the internal (or external) VCO’s phase noise to dominate the final
output phase noise at high offset frequencies. This results in best overall phase noise and jitter performance.
The LMK0480x allows subsets of the device to be used to increase the flexibility of device. These different
modes are selected using MODE: Device Mode. For instance:
• Dual Loop Mode - Typical use case of LMK04808. CLKinX used as reference input to PLL1, OSCin port is
connected to VCXO or tunable crystal.
• Single Loop Mode - Powers down PLL1. OSCin port is used as reference input.
• Clock Distribution Mode - Allows input of CLKin1 to be distributed to output with division, digital delay, and
analog delay.
See Device Functional Modes for more information on these modes.
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Overview (continued)
8.1.2 PLL1 Redundant Reference Inputs (CLKin0/CLKin0* and CLKin1/CLKin1*)
The LMK0480x has two reference clock inputs for PLL1: CLKin0 and CLKin1. Ref Mux selects CLKin0 or
CLKin1. Automatic or manual switching occurs between the inputs.
CLKin0 and CLKin1 each have input dividers. The input divider allows different clock input frequencies to be
normalized so that the frequency input to the PLL1 R divider remains constant during automatic switching. By
programming these dividers such that the frequency presented to the input of the PLL1_R divider is the same
prevents the user from needing to reprogram the PLL1 R divider when the input reference is changed to another
CLKin port with a different frequency.
CLKin1 is shared for use as an external 0-delay feedback (FBCLKin), or for use with an external VCO (Fin).
Fast manual switching between reference clocks is possible with external pins Status_CLKin0 and
Status_CLKin1.
8.1.3 PLL1 Tunable Crystal Support
The LMK0480x integrates a crystal oscillator on PLL1 for use with an external crystal and varactor diode to
perform jitter cleaning.
The LMK0480x must be programmed to enable Crystal mode.
8.1.4 VCXO/CRYSTAL Buffered Outputs
The LMK0480x provides 2 dedicated outputs which are a buffered copy of the PLL2 reference input. This
reference input is typically a low noise VCXO or Crystal. When using a VCXO, this output can be used to clock
external devices such as microcontrollers, FPGAs, CPLDs, and so forth, before the LMK0480x is programmed.
The OSCout0 buffer output type is programmable to LVDS, LVPECL, or LVCMOS. The OSCout1 buffer is fixed
to LVPECL.
The dedicated output buffers OSCout0 and OSCout1 can output frequency lower than the VCXO or Crystal
frequency by programming the OSC Divider. The OSC Divider value range is 2 to 8. Each OSCoutX can
individually choose to use the OSC Divider output or to bypass the OSC Divider.
Two clock output groups can also be programmed to be driven by OSCin. This allows a total of 4 additional
differential outputs to be buffered outputs of OSCin. When programmed in this way, a total of 6 differential
outputs can be driven by a buffered copy of OSCin.
VCXO/Crystal buffered outputs cannot be synchronized to the VCO clock distribution outputs. The assertion of
SYNC will still cause these outputs to become low temporarily. Since these outputs will turn off and on
asynchronously with respect to the VCO sourced clock outputs during a SYNC, it is possible for glitches to occur
on the buffered clock outputs when SYNC is asserted and unasserted. If the NO_SYNC_CLKoutX_Y bits are set
these outputs will not be affected by the SYNC event except that the phase relationship will change with the
other synchronized clocks unless a buffered clock output is used as a qualification clock during SYNC.
8.1.5 Frequency Holdover
The LMK0480x supports holdover operation to keep the clock outputs on frequency with minimum drift when the
reference is lost until a valid reference clock signal is re-established.
8.1.6 Integrated Loop Filter Poles
The LMK0480x features programmable 3rd and 4th order loop filter poles for PLL2. These internal resistors and
capacitor values may be selected from a fixed range of values to achieve either a 3rd or 4th order loop filter
response. The integrated programmable resistors and capacitors compliment external components mounted near
the chip.
These integrated components can be effectively disabled by programming the integrated resistors and capacitors
to their minimum values.
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Overview (continued)
8.1.7 Internal VCO
The output of the internal VCO is routed to a mux which allows the user to select either the direct VCO output or
a divided version of the VCO for the Clock Distribution Path. This same selection is also fed back to the PLL2
phase detector through a prescaler and N-divider.
The mux selectable VCO divider has a divide range of 2 to 8 with 50% output duty cycle for both even and odd
divide values.
The primary use of the VCO divider is to achieve divides greater than the clock output divider supports alone.
8.1.8 External VCO Mode
The Fin/Fin* input allows an external VCO to be used with PLL2 of the LMK0480x.
Using an external VCO reduces the number of available clock inputs by one.
8.1.9 Clock Distribution
The LMK0480x features a total of 12 outputs driven from the internal or external VCO.
All VCO driven outputs have programmable output types. They can be programmed to LVPECL, LVDS, or
LVCMOS. When all distribution outputs are configured for LVCMOS or single ended LVPECL a total of 24
outputs are available.
If the buffered OSCin outputs OSCout0 and OSCout1 are included in the total number of clock outputs the
LMK0480x is able to distribute, then up to 14 differential clocks or up to 28 single ended clocks may be
generated with the LMK0480x.
The following sections discuss specific features of the clock distribution channels that allow the user to control
various aspects of the output clocks.
8.1.9.1 CLKout DIVIDER
Each clock group, which is a pair of outputs such as CLKout0 and CLKout1, has a single clock output divider.
The divider supports a divide range of 1 to 1045 (even and odd) with 50% output duty cycle. When divides of 26
or greater are used, the divider/delay block uses extended mode.
The VCO Divider may be used to reduce the divide needed by the clock group divider so that it may operate in
normal mode instead of extended mode. This can result in a small current saving if enabling the VCO Divider
allows 3 or more clock output divides to change from extended to normal mode.
8.1.9.2 CLKout Delay
See Clock Distribution section for details on both a fine (analog) and coarse (digital) delay for phase adjustment
of the clock outputs.
The fine (analog) delay allows a nominal 25 ps step size and range from 0 to 475 ps of total delay. Enabling the
analog delay adds a nominal 500 ps of delay in addition to the programmed value. When adjusting analog delay,
glitches may occur on the clock outputs being adjusted. Analog delay may not operate at frequencies above the
minimum-ensured maximum output frequency of 1536 MHz.
The coarse (digital) delay allows a group of outputs to be delayed by 4.5 to 12 clock distribution path cycles in
normal mode, or from 12.5 to 522 VCO cycles in extended mode. The delay step can be as small as half the
period of the clock distribution path by using the CLKoutX_Y_HS bit provided the output divide value is greater
than 1. For example, a 2-GHz VCO frequency without the use of the VCO divider results in 250 ps coarse tuning
steps.. The coarse (digital) delay value takes effect on the clock outputs after a SYNC event.
There are 3 different ways to use the digital (coarse) delay:
1. Fixed Digital Delay
2. Absolute Dynamic Digital Delay
3. Relative Dynamic Digital Delay
These are further discussed in Clock Distribution.
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Overview (continued)
8.1.9.3 Programmable Output Type
For increased flexibility all LMK0480x clock outputs (CLKoutX) and OSCout0 can be programmed to an LVDS,
LVPECL, or LVCMOS output type. OSCout1 is fixed as LVPECL.
Any LVPECL output type can be programmed to 700, 1200, 1600, or 2000 mVpp amplitude levels. The 2000
mVpp LVPECL output type is a Texas Instruments proprietary configuration that produces a 2000 mVpp
differential swing for compatibility with many data converters and is also known as 2VPECL.
8.1.9.4 Clock Output Synchronization
Using the SYNC input causes all active clock outputs to share a rising edge. See Clock Output Synchronization
(SYNC) for more information.
The SYNC event also causes the digital delay values to take effect.
8.1.10 0-Delay
The 0-delay mode synchronizes the input clock phase to the output clock phase. The 0-delay feedback may be
performed with an internal feedback loop from any of the clock groups or with an external feedback loop into the
FBCLKin port as selected by the FEEDBACK_MUX.
Without using 0-delay mode there will be D possible fixed phase relationships from clock input to clock output
depending on the clock output divide value.
Using an external 0-delay feedback reduces the number of available clock inputs by one.
8.1.11 Default Startup Clocks
Before the LMK0480x is programmed, CLKout8 is enabled and operating at a nominal frequency and CLKout6
and OSCout0 are enabled and operating at the OSCin frequency. These clocks can be used to clock external
devices such as microcontrollers, FPGAs, CPLDs, and so forth, before the LMK0480x is programmed.
For CLKout6 and OSCout0 to work before the LMK0480x is programmed, the device must not be using Crystal
mode.
8.1.12 Status Pins
The LMK0480x provides status pins which can be monitored for feedback or in some cases used for input
depending upon device programming. For example:
• The Status_Holdover pin may indicate if the device is in hold-over mode.
• The Status_CLKin0 pin may indicate the LOS (loss-of-signal) for CLKin0.
• The Status_CLKin0 pin may be an input for selecting the active clock input.
• The Status_LD pin may indicate if the device is locked.
The status pins can be programmed to a variety of other outputs including analog lock detect, PLL divider
outputs, combined PLL lock detect signals, PLL1 Vtune railing, readback, and so forth. Refer to the Programming
of this datasheet for more information. Default pin programming is captured in Table 18.
8.1.13 Register Readback
Programmed registers may be read back using the MICROWIRE interface. For readback, one of the status pins
must be programmed for readback mode.
At no time may registers be programed to values other than the valid states defined in the datasheet.
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CLKin1*/Fin*
FBCLKin*
CLKin1/
Fin/FBCLKin
Ref
Mux
R Delay
CLKin1 Divider
(1, 2, 4, or 8)
Fin/Fin*
CLKout0
CLKout2
CLKout4
CLKout6
CLKout8
CLKout10
OSCout0
OSCout0*
OSCout0
_MUX
OSCout1
OSCout1*
OSCout1
_MUX
Mode
Mux2
2X
Mux
OSC Divider
(2 to 8)
Mux
Delay
Mux
CLKout2
CLKout2*
Mux
Control
Registers
R2 Divider
(1 to 4,095)
N2 Divider
(1 to 262,143)
Mode
Mux3
Divider
(1 to 1045)
Digital
Delay
Phase
Detector
PLL2
Clock Distribution Path
Osc
Mux1
Partially
Integrated
Loop Filter
VCO
Mux
Mode
Mux1
Internal VCO
VCO Divider
(2 to 8)
Mux
Digital
Delay
Divider
(1 to 1045)
Clock Group 1
Delay
Mux
CLKout4
CLKout4*
Mux
Divider
(1 to 1045)
Digital
Delay
Osc
Mux2
Digital
Delay
Divider
(1 to 1045)
Mux
CLKout7
CLKout7*
Mux
CLKout8
CLKout8*
Clock Group 4
Delay
Mux
CLKout9
CLKout9*
Mux
CLKout10
CLKout10*
Clock Buffer 3
Clock Group 2
Delay
Divider
(1 to 1045)
Digital
Delay
Digital
Delay
Divider
(1 to 1045)
Clock Group 5
Delay
Mux
Mux
Clock Buffer 2
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Fin/Fin*
CLKout6
CLKout6*
Clock Group 3
Delay
Clock Buffer 1
CLKout3
CLKout3*
Status_CLKin0
LEuWire
N2 Prescaler
(2 to 8)
CLKout1
CLKout1*
PWire
Port
DATAuWire
2X
Clock Group 0
Status_Holdover
CLKuWire
Holdover
FB
Mux
Status_LD
Device
Control
SYNC
Status_CLKin1
FBMux
OSCin*
OSCin
CLKout5
CLKout5*
Phase
Detector
PLL1
N1 Divider
(1 to 16,383)
N Delay
FBMux
CLKout0
CLKout0*
R1 Divider
(1 to 16,383)
CPout2
CLKin0 Divider
(1, 2, 4, or 8)
CLKin0*
CLKin0
CPout1
8.2 Functional Block Diagram
Clock Buffer 1
CLKout11
CLKout11*
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8.3 Feature Description
8.3.1 Serial MICROWIRE Timing Diagram
For timing specifications, see Timing Requirements. Register programming information on the DATAuWire pin is
clocked into a shift register on each rising edge of the CLKuWire signal. On the rising edge of the LEuWire
signal, the register is sent from the shift register to the register addressed. A slew rate of at least 30 V/µs is
recommended for these signals. After programming is complete the CLKuWire, DATAuWire, and LEuWire
signals should be returned to a low state. If the CLKuWire or DATAuWire lines are toggled while the VCO is in
lock, as is sometimes the case when these lines are shared with other parts, the phase noise may be degraded
during this programming.
MSB
DATAuWire
D26
LSB
D25
D24
D23
D22
D0
A4
A1
A0
CLKuWire
tECS
tCES
tDCS
tCDH
tCWH
tECS
tCWL
LEuWire
tEWH
Figure 6. MICROWIRE Input Timing Diagram
8.3.2 Advanced MICROWIRE Timing Diagrams
8.3.2.1 Three Extra Clocks or Double Program
For timing specifications, see Timing Requirements. Figure 7 shows the timing for the programming sequence for
loading CLKoutX_Y_DIV > 25 or CLKoutX_Y_DDLY > 12 as described in Special Programming Case for R0 to
R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY.
DATAuWire
MSB
LSB
D26
A0
CLKuWire
tCES
tECS
tCWL
LEuWire
tCWH
tEWH
Figure 7. MICROWIRE Timing Diagram: Extra CLKuWire Pulses for R0 to R5
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Feature Description (continued)
8.3.2.2 Three Extra Clocks with LEuWire High
For timing specifications, see Timing Requirements. Figure 8 shows the timing for the programming sequence
which allows SYNC_EN_AUTO = 1 when loading CLKoutX_Y_DIV > 25 or CLKoutX_Y_DDLY > 12. When
SYNC_EN_AUTO = 1, a SYNC event is automatically generated on the falling edge of LEuWire. See Special
Programming Case for R0 to R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY.
DATAuWire
MSB
LSB
D26
A0
CLKuWire
tECS
tCES
tCES
LEuWire
Figure 8. MICROWIRE Timing Diagram: Extra CLKuWire Pulses for R0 to R5 with LEuWire Asserted
8.3.2.3 Readback
For timing specifications, see Timing Requirements. See Readback for more information on performing a
readback operation. Figure 9 shows timing for LEuWire for both READBACK_LE = 1 and 0.
The rising edges of CLKuWire during MICROWIRE readback continue to clock data on DATAuWire into the
device during readback. If after the readback, LEuWire transitions from low to high, this data will be latched to
the decoded register. The decoded register address consists of the last 5 bits clocked on DATAuWire as shown
in Figure 9.
DATAuWire
MSB
LSB
D26
A0
CLKuWire
tCR
tECS
tCWH
tCR
tCWL
LEuWire
READBACK_LE = 0
tCES
tEWH
tECS
LEuWire
READBACK_LE = 1
Readback Pin
RD26
Register Write
RD25
RD24
RD23
RD0
Register Read
Figure 9. MICROWIRE Readback Timing Diagram
8.3.3 Inputs / Outputs
8.3.3.1 PLL1 Reference Inputs (CLKin0 and CLKin1)
The reference clock inputs for PLL1 may be selected from either CLKin0 or CLKin1. The user has the capability
to manually select one of the inputs or to configure an automatic switching mode of operation. See Input Clock
Switching for more info.
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Feature Description (continued)
CLKin0 and CLKin1 have dividers which allow the device to switch between reference inputs of different
frequencies automatically without needing to reprogram the PLL1 R divider. The CLKin pre-divider values are 1,
2, 4, and 8.
CLKin1 input can alternatively be used for external feedback in 0-delay mode (FBCLKin) or for an external VCO
input port (Fin).
8.3.3.2 PLL2 OSCin / OSCin* Port
The feedback from the external oscillator being locked with PLL1 drives the OSCin/OSCin* pins. Internally this
signal is routed to the PLL1 N Divider and to the reference input for PLL2.
This input may be driven with either a single-ended or differential signal and must be AC coupled. If operated in
single ended mode, the unused input must be connected to GND with a 0.1 µF capacitor.
8.3.3.3 Crystal Oscillator
The internal circuitry of the OSCin port also supports the optional implementation of a crystal based oscillator
circuit. A crystal, a varactor diode, and a small number of other external components may be used to implement
the oscillator. The internal oscillator circuit is enabled by setting the EN_PLL2_XTAL bit. See EN_PLL2_XTAL.
8.3.4 Input Clock Switching
Manual, pin select, and automatic are three different kinds clock input switching modes can be set with the
CLKin_SELECT_MODE register.
Below is information about how the active input clock is selected and what causes a switching event in the
various clock input selection modes.
8.3.4.1 Input Clock Switching - Manual Mode
When CLKin_SELECT_MODE is 0 or 1 then CLKin0 or CLKin1 respectively is always selected as the active
input clock. Manual mode will also override the EN_CLKinX bits such that the CLKinX buffer will operate even if
CLKinX is disabled with EN_CLKinX = 0.
• Entering Holdover: If holdover mode is enabled, then holdover mode is entered if Digital lock detect of PLL1
goes low and DISABLE_DLD1_DET = 0.
• Exiting Holdover: The active clock for automatic exit of holdover mode is the manually selected clock input.
8.3.4.2 Input Clock Switching - Pin Select Mode
When CLKin_SELECT_MODE is 3, the pins Status_CLKin0 and Status_CLKin1 select which clock input is
active.
• Clock Switch Event: Pins: Changing the state of Status_CLKin0 or Status_CLKin1 pins causes an input
clock switch event.
• Clock Switch Event: PLL1 DLD: To prevent PLL1 DLD high to low transition from causing a input clock
switch event and causing the device to enter holdover mode, disable the PLL1 DLD detect by setting
DISABLE_DLD1_DET = 1. This is the preferred behavior for Pin Select Mode.
• Configuring Pin Select Mode:
– The Status_CLKin0_TYPE must be programmed to an input value for the Status_CLKin0 pin to function
as an input for pin select mode.
– The Status_CLKin1_TYPE must be programmed to an input value for the Status_CLKin1 pin to function
as an input for pin select mode.
– If the Status_CLKinX_TYPE is set as output, the input value is considered 0.
– The polarity of Status_CLKin1 and Status_CLKin0 input pins cannot be inverted with the CLKin_SEL_INV
bit.
– Table 1 defines which input clock is active depending on Status_CLKin0 and Status_CLKin1 state.
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Feature Description (continued)
Table 1. Active Clock Input - Pin Select Mode
STATUS_CLKin1
STATUS_CLKin0
ACTIVE CLOCK
0
0
CLKin0
0
1
CLKin1
1
0
Reserved
1
1
Holdover
The pin select mode will override the EN_CLKinX bits such that the CLKinX buffer will operate even if CLKinX is
disabled with EN_CLKinX = 0. To switch as fast as possible, keep the clock input buffers enabled (EN_CLKinX =
1) that could be switched to.
8.3.4.2.1 Pin Select Mode and Host
When in the pin select mode, the host can monitor conditions of the clocking system which could cause the host
to switch the active clock input. The LMK0480x device can also provide indicators on the Status_LD and
Status_HOLDOVER like "DAC Rail," "PLL1 DLD", "PLL1 and PLL2 DLD" which the host can use in determining
which clock input to use as active clock input.
8.3.4.2.2 Switch Event without Holdover
When an input clock switch event is triggered and holdover mode is disabled, the active clock input immediately
switches to the selected clock. When PLL1 is designed with a narrow loop bandwidth, the switching transient is
minimized.
8.3.4.2.3 Switch Event with Holdover
When an input clock switch event is triggered and holdover mode is enabled, the device will enter holdover mode
and remain in holdover until a holdover exit condition is met as described in Holdover Mode. Then the device will
complete the reference switch to the pin selected clock input.
8.3.4.3 Input Clock Switching - Automatic Mode
When CLKin_SELECT_MODE is 4, the active clock is selected in priority order of enabled clock inputs starting
upon an input clock switch event. The priority order of the clocks is CLKin0 → CLKin1 → CLKin0, and so forth.
For a clock input to be eligible to be switched through, it must be enabled using EN_CLKinX.
8.3.4.3.1 Starting Active Clock
Upon programming this mode, the currently active clock remains active if PLL1 lock detect is high. To ensure a
particular clock input is the active clock when starting this mode, program CLKin_SELECT_MODE to the manual
mode which selects the desired clock input (CLKin0 or 1). Wait for PLL1 to lock PLL1_DLD = 1, then select this
mode with CLKin_SELECT_MODE = 4.
8.3.4.3.2 Clock Switch Event: PLL1 DLD
A loss of lock as indicated by PLL1’s DLD signal (PLL1_DLD = 0) will cause an input clock switch event if
DISABLE_DLD1_DET = 0. PLL1 DLD must go high (PLL1_DLD = 1) in between input clock switching events.
8.3.4.3.3 Clock Switch Event: PLL1 Vtune Rail
If Vtune_RAIL_DET_EN is set and the PLL1 Vtune voltage crosses the DAC high or low threshold, holdover
mode will be entered. Since PLL1_DLD = 0 in holdover a clock input switching event will occur.
8.3.4.3.4 Clock Switch Event with Holdover
Clock switch event with holdover enabled is recommended in this input clock switching mode. When an input
clock switch event occurs, holdover mode is entered and the active clock is set to the clock input defined by the
Status_CLKinX pins. When the new active clock meets the holdover exit conditions, holdover is exited and the
active clock will continue to be used as a reference until another input clock switch event. PLL1 DLD must go
high in between input clock switching events.
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8.3.4.4 Input Clock Switching - Automatic Mode with Pin Select
When CLKin_SELECT_MODE is 6, the active clock is selected using the Status_CLKinX pins upon an input
clock switch event according to Table 2.
8.3.4.4.1 Starting Active Clock
Upon programming this mode, the currently active clock remains active if PLL1 lock detect is high. To ensure a
particular clock input is the active clock when starting this mode, program CLKin_SELECT_MODE to the manual
mode which selects the desired clock input (CLKin0 or 1). Wait for PLL1 to lock PLL1_DLD = 1, then select this
mode with CLKin_SELECT_MODE = 6.
8.3.4.4.2 Clock Switch Event: PLL1 DLD
An input clock switch event is generated by a loss of lock as indicated by PLL1's DLD signal (PLL1 DLD = 0).
8.3.4.4.3 Clock Switch Event: PLL1 Vtune Rail
If Vtune_RAIL_DET_EN is set and the PLL1 Vtune voltage crosses the DAC threshold, holdover mode will be
entered. Since PLL1_DLD = 0 in holdover, a clock input switching event will occur.
8.3.4.4.4 Clock Switch Event with Holdover
Clock switch event with holdover enabled is recommended in this input clock switching mode. When an input
clock switch event occurs, holdover mode is entered and the active clock is set to the clock input defined by the
Status_CLKinX pins. When the new active clock meets the holdover exit conditions, holdover is exited and the
active clock will continue to be used as a reference until another input clock switch event. PLL1 DLD must go
high in between input clock switching events."
Table 2. Active Clock Input - Auto Pin Mode
STATUS_CLKin1
(1)
(1)
STATUS_CLKin0
ACTIVE CLOCK
X
1
CLKin0
1
0
CLKin1
0
0
Reserved
The polarity of Status_CLKin1 and Status_CLKin0 input pins can be inverted with the CLKin_SEL_INV bit.
8.3.5 Holdover Mode
Holdover mode causes PLL2 to stay locked on frequency with minimal frequency drift when an input clock
reference to PLL1 becomes invalid. While in holdover mode, the PLL1 charge pump is TRI-STATED and a fixed
tuning voltage is set on CPout1 to operate PLL1 in open loop.
8.3.5.1 Enable Holdover
Program HOLDOVER_MODE to enable holdover mode. Holdover mode can be manually enabled by
programming the FORCE_HOLDOVER bit.
The holdover mode can be set to operate in 2 different sub-modes.
• Fixed CPout1 (EN_TRACK = 0 or 1, EN_MAN_DAC = 1).
• Tracked CPout1 (EN_TRACK = 1, EN_MAN_DAC = 0).
– Not valid when EN_VTUNE_RAIL_DET = 1.
Updates to the DAC value for the Tracked CPout1 sub-mode occurs at the rate of the PLL1 phase detector
frequency divided by DAC_CLK_DIV. These updates occur any time EN_TRACK = 1.
The DAC update rate should be programmed for <= 100 kHz to ensure DAC holdover accuracy.
When tracking is enabled the current voltage of DAC can be readback, see DAC_CNT.
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8.3.5.2 Entering Holdover
The holdover mode is entered as described in Input Clock Switching. Typically this is because:
• FORCE_HOLDOVER bit is set.
• PLL1 loses lock according to PLL1_DLD, and
– HOLDOVER_MODE = 2
– DISABLE_DLD1_DET = 0
• CPout1 voltage crosses DAC high or low threshold, and
– HOLDOVER_MODE = 2
– EN_VTUNE_RAIL_DET = 1
– EN_TRACK = 1
– DAC_HIGH_TRIP = User Value
– DAC_LOW_TRIP = User Value
– EN_MAN_DAC = 1
– MAN_DAC = User Value
8.3.5.3 During Holdover
PLL1 is run in open loop mode.
• PLL1 charge pump is set to TRI-STATE.
• PLL1 DLD will be unasserted.
• The HOLDOVER status is asserted
• During holdover If PLL2 was locked prior to entry of holdover mode, PLL2 DLD will continue to be asserted.
• CPout1 voltage will be set to:
– a voltage set in the MAN_DAC register (fixed CPout1).
– a voltage determined to be the last valid CPout1 voltage (tracked CPout1).
• PLL1 DLD will attempt to lock with the active clock input.
The HOLDOVER status signal can be monitored on the Status_HOLDOVER or Status_LD pin by programming
the HOLDOVER_MUX or LD_MUX register to "Holdover Status."
8.3.5.4 Exiting Holdover
Holdover mode can be exited in one of two ways.
• Manually, by programming the device from the host.
• Automatically, By a clock operating within a specified ppm of the current PLL1 frequency on the active clock
input. See Input Clock Switching for more detail on which clock input is active.
To exit holdover by programming, set HOLDOVER_MODE = Disabled. HOLDOVER_MODE can then be reenabled by programming HOLDOVER_MODE = Enabled. Care should be taken to ensure that the active clock
upon exiting holdover is as expected, otherwise the CLKin_SELECT_MODE register may need to be reprogrammed.
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8.3.5.5 Holdover Frequency Accuracy and DAC Performance
When in holdover mode PLL1 will run in open loop and the DAC will set the CPout1 voltage. If Fixed CPout1
mode is used, then the output of the DAC will be a voltage dependant upon the MAN_DAC register. If Tracked
CPout1 mode is used, then the output of the DAC will be the voltage at the CPout1 pin before holdover mode
was entered. When using Tracked mode and EN_MAN_DAC = 1, during holdover the DAC value is loaded with
the programmed value in MAN_DAC, not the tracked value.
When in Tracked CPout1 mode the DAC has a worst case tracking error of ±2 LSBs once PLL1 tuning voltage is
acquired. The step size is approximately 3.2 mV, therefore the VCXO frequency error during holdover mode
caused by the DAC tracking accuracy is ±6.4 mV × Kv, where Kv is the tuning sensitivity of the VCXO in use.
Therefore the accuracy of the system when in holdover mode in ppm is:
Holdover accuracy (ppm) =
± 6.4 mV × Kv × 1e6
VCXO Frequency
(1)
Example: consider a system with a 19.2-MHz clock input, a 153.6-MHz VCXO with a Kv of 17 kHz/V. The
accuracy of the system in holdover in ppm is:
±0.71ppm =
±6.4mV ´ 17kHz / V ´ 1e6
153.6 MHz
(2)
It is important to account for this frequency error when determining the allowable frequency error window to
cause holdover mode to exit.
8.3.5.6 Holdover Mode - Automatic Exit of Holdover
The LMK0480x device can be programmed to automatically exit holdover mode when the accuracy of the
frequency on the active clock input achieves a specified accuracy. The programmable variables include
PLL1_WND_SIZE and DLD_HOLD_CNT.
See Digital Lock Detect Frequency Accuracy to calculate the register values to cause holdover to automatically
exit upon reference signal recovery to within a user specified ppm error of the holdover frequency.
It is possible for the time to exit holdover to vary because the condition for automatic holdover exit is for the
reference and feedback signals to have a time/phase error less than a programmable value. Because it is
possible for two clock signals to be very close in frequency but not close in phase, it may take a long time for the
phases of the clocks to align themselves within the allowable time/phase error before holdover exits.
8.3.6 PLLs
8.3.6.1 PLL1
The maximum phase detector frequency (fPD1) of PLL1 is 40 MHz. Since a narrow loop bandwidth should be
used for PLL1, the need to operate at high phase detector rate to lower the in-band phase noise becomes
unnecessary. The maximum values for the PLL1 R and N dividers is 16,383. Charge pump current ranges from
100 to 1600 µA. PLL1 N divider may be driven by OSCin port at the OSCout0_MUX output (default) or by
internal or external feedback as selected by Feedback Mux in 0-delay mode.
Low charge pump currents and phase detector frequencies aid design of low loop bandwidth loop filters with
reasonably sized components to allow the VCXO or PLL2 to dominate phase noise inside of PLL2 loop
bandwidth. High charge pump currents may be used by PLL1 when using VCXOs with leaky tuning voltage
inputs to improve system performance.
8.3.6.2 PLL2
PLL2's maximum phase detector frequency (fPD2) is 155 MHz. Operating at highest possible phase detector rate
will ensure low in-band phase noise for PLL2 which in turn produces lower total jitter. The in-band phase noise
from the reference input and PLL is proportional to N2. The maximum value for the PLL2 R divider is 4,095. The
maximum value for the PLL2 N divider is 262,143. The N2 Prescaler in the total N feedback path can be
programmed for values 2 to 8 (all divides even and odd). Charge pump current ranges from 100 to 3200 µA.
High charge pump currents help to widen the PLL2 loop bandwidth to optimize PLL2 performance.
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8.3.6.2.1 PLL2 Frequency Doubler
The PLL2 reference input at the OSCin port may be routed through a frequency doubler before the PLL2 R
Divider. The frequency doubler feature allows the phase comparison frequency to be increased when a relatively
low frequency oscillator is driving the OSCin port. By doubling the PLL2 phase detector frequency, the in-band
PLL2 noise is reduced by about 3 dB.
When using the doubler, PLL2 R Divider may be used to reduce the phase detector frequency to the limit of the
PLL2 maximum phase detector frequency.
For applications in which the OSCin frequency and PLL2 phase detector frequency are equal, the best PLL2 inband noise can be achieved when the doubler is enabled (EN_PLL2_REF_2X = 1) and the PLL2 R divide value
is 2. Do not use doubler disabled (EN_PLL2_REF_2X = 0) and PLL2 R divide value of 1.
8.3.6.3 Digital Lock Detect
Both PLL1 and PLL2 support digital lock detect. Digital lock detect compares the phase between the reference
path (R) and the feedback path (N) of the PLL. When the time error, which is phase error, between the two
signals is less than a specified window size (ε) a lock detect count increments. When the lock detect count
reaches a user specified value lock detect is asserted true. Once digital lock detect is true, a single phase
comparison outside the specified window will cause digital lock detect to be asserted false. This is illustrated in
Figure 10.
The incremental lock detect count feature functions as a digital filter to ensure that lock detect isn't asserted for
only a brief time when the phases of R and N are within the specified tolerance for only a brief time during initial
phase lock.
The digital lock detect signal can be monitored on the Status_LD or Status_Holdover pin. The pin may be
programmed to output the status of lock detect for PLL1, PLL2, or both PLL1 and PLL2.
See Digital Lock Detect Frequency Accuracy for more detailed information on programming the registers to
achieve a specified frequency accuracy in ppm with lock detect.
The digital lock detect feature can also be used with holdover to automatically exit holdover mode. See Holdover
Mode for more info.
NO
START
PLLX
Lock Detected = False
Lock Count = 0
NO
YES
Phase Error < g
Increment
PLLX Lock Count
PLLX Lock Count =
PLLX_DLD_CNT
YES
PLLX
Lock Detected = True
Phase Error < g
YES
NO
Figure 10. Digital Lock Detect Flowchart
8.3.7 Status Pins
The Status_LD, Status_HOLDOVER, Status_CLKin0, Status_CLKin1, and SYNC pins can be programmed to
output a variety of signals for indicating various statuses like digital lock detect, holdover, several DAC indicators,
and several PLL divider outputs.
8.3.7.1 Logic Low
This is a vary simple output. In combination with the output _MUX register, this output can be toggled between
high and low. Useful to confirm MICROWIRE programming or as a general purpose IO.
8.3.7.2 Digital Lock Detect
PLL1 DLD, PLL2 DLD, and PLL1 + PLL2 are selectable on certain output pins. See Digital Lock Detect for more
information.
8.3.7.3 Holdover Status
Indicates if the device is in Holdover mode. See HOLDOVER_MODE for more information.
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8.3.7.4 DAC
Various flags for the DAC can be monitored including DAC Locked, DAC Rail, DAC Low, and DAC High.
When the PLL1 tuning voltage crosses the low threshold, DAC Low is asserted. When PLL1 tuning voltage
crosses the high threshold, DAC High is asserted. When either DAC Low or DAC High is asserted, DAC Rail will
also be asserted.
DAC Locked is asserted when EN_Track = 1 and DAC is closely tracking the PLL1 tuning voltage.
8.3.7.5 PLL Divider Outputs
The PLL divider outputs are useful for debugging failure to lock issues. It allows the user to measure the
frequency the PLL inputs are receiving. The settings of PLL1_R, PLL1_N, PLL2_R, and PLL2_N output pulses at
the phase detector rate. The settings of PLL1_R / 2, PLL1_N / 2, PLL2_R / 2, and PLL2_N / 2 output a 50% duty
cycle waveform at half the phase detector rate.
8.3.7.6 CLKinX_LOS
The clock input loss of signal indicator is asserted when LOS is enabled (EN_LOS) and the clock no longer
detects an input as defined by the time-out threshold, LOS_TIMEOUT.
8.3.7.7 CLKinX Selected
If this clock is the currently selected/active clock, this pin will be asserted.
8.3.7.8 MICROWIRE Readback
The readback data can be output on any pin programmable to readback mode. For more information on
readback see Readback.
8.3.8 VCO
The integrated VCO uses a frequency calibration routine when register R30 is programmed to lock VCO to target
frequency. Register R30 contains the PLL2_N register.
During the frequency calibration the PLL2_N_CAL value is used instead of PLL2_N, this allows 0-delay modes to
have a separate PLL2 N value for VCO frequency calibration and regular operation. See Register 29, Register
30, and PLL Programming for more information.
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8.3.9 Clock Distribution
8.3.9.1 Fixed Digital Delay
This section discussing Fixed Digital delay and associated registers is fundamental to understanding digital delay
and dynamic digital delay.
Clock outputs may be delayed or advanced from one another by up to 517.5 clock distribution path periods. By
programming a digital delay value from 4.5 to 522 clock distribution path periods, a relative clock output delay
from 0 to 517.5 periods is achieved. The CLKoutX_Y_DDLY (5 to 522) and CLKoutX_Y_HS (-0.5 or 0) registers
set the digital delay as shown in Table 3.
Table 3. Possible Digital Delay Values
CLKoutX_Y_DDLY
CLKoutX_Y_HS
DIGITAL DELAY
5
1
4.5
5
0
5
6
1
5.5
6
0
6
7
1
6.5
7
0
7
...
...
...
520
0
520
521
1
520.5
521
0
521
522
1
521.5
522
0
522
Note: Digital delay values only take effect during a SYNC event and if the NO_SYNC_CLKoutX_Y bit is cleared
for this clock group. See Clock Output Synchronization (SYNC) for more information.
The resolution of digital delay is determined by the frequency of the clock distribution path. The clock distribution
path is the output of Mode Mux1 (Functional Block Diagram). The best resolution of digital delay is achieved by
bypassing the VCO divider.
VCO_DIV
Digital Delay Resolution
=
(with VCO Divider) 2 × VCO Frequency
(3)
Digital Delay Resolution
1
(VCO Divider bypassed or external VCO) = 2 × VCO Frequency
(4)
The digital delay between clock outputs can be dynamically adjusted with no or minimum disruption of the output
clocks. See Dynamically Programming Digital Delay for more information.
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8.3.9.2 Fixed Digital Delay - Example
Given a VCO frequency of 2949.12 MHz and no VCO divider, by using digital delay the outputs can be adjusted
in 1 / (2 * 2949.12 MHz) = ~169.54 ps steps.
To achieve quadrature (90 degree shift) between the 122.88-MHz outputs on CLKout4 and CLKout6 from a VCO
frequency of 2949.12 MHz and bypassing the VCO divider, consider the following:
1. The frequency of 122.88 MHz has a period of ~8.14 ns.
2. To delay 90 degrees of a 122.88-MHz clock period requires a ~2.03 ns delay.
3. Given a digital delay step of ~169.54 ps, this requires a digital delay value of 12 steps (2.03 ns / 169.54 ps =
12).
4. Since the 12 steps are half period steps, CLKout6_7_DDLY is programmed 6 full periods beyond 5 for a total
of 11.
This result in the following programming:
• Clock output dividers to 24. CLKout4_5_DIV = 24 and CLKout6_7_DIV = 24.
• Set first clock digital delay value. CLKout4_5_DDLY = 5, CLKout4_5_HS = 0.
• Set second 90 degree shifted clock digital delay value. CLKout6_7_DDLY = 11, CLKout6_7_HS = 0.
Table 4 shows some of the possible phase delays in degrees achievable in the above example.
Table 4. Relative Phase Shift from CLKout4 and 5 to CLKout6 and 7 (1)
(1)
CLKout6_7_DDLY
CLKout6_7_HS
RELATIVE DIGITAL DELAY
DEGREES of 122.88 MHz
5
1
-0.5
-7.5°
5
0
0.0
0°
6
1
0.5
7.5°
6
0
1.0
15.0°
7
1
1.5
22.5°
7
0
2.0
30.0°
8
1
2.5
37.5°
8
0
3.0
45.0°
9
1
3.5
52.5°
9
0
4.0
60.0°
10
1
4.5
67.5°
10
0
5.0
75.0°
11
1
5.5
82.5°
11
0
6.0
90.0°
12
1
6.5
97.5°
12
0
7.0
105.0°
13
1
7.5
112.5°
13
0
8.0
120.0°
14
1
8.5
127.5°
...
...
...
...
CLKout4_5_DDLY = 5 and CLKout4_5_HS = 0
Figure 12 illustrates clock outputs programmed with different digital delay values during a SYNC event.
Refer to Dynamically Programming Digital Delay for more information on dynamically adjusting digital delay.
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8.3.9.3 Clock Output Synchronization (SYNC)
The purpose of the SYNC function is to synchronize the clock outputs with a fixed and known phase relationship
between each clock output selected for SYNC. SYNC can also be used to hold the outputs in a low or 0 state.
The NO_SYNC_CLKoutX_Y bits can be set to disable synchronization for a clock group.
To enable SYNC, EN_SYNC must be set. See EN_SYNC, Enable Synchronization.
The digital delay value set by CLKoutX_Y_DDLY takes effect only upon a SYNC event. The digital delay due to
CLKoutX_Y_HS takes effect immediately upon programming. See Dynamically Programming Digital Delay for
more information on dynamically changing digital delay.
During a SYNC event, clock outputs driven by the VCO are not synchronized to clock outputs driven by OSCin.
OSCout0 and OSCout1 are always driven by OSCin. CLKout6, 7, 8, or 9 may be driven by OSCin depending on
the CLKoutX_Y_OSCin_Sel bit value. While SYNC is asserted, NO_SYNC_CLKoutX_Y operates normally for
CLKout6, 7, 8, and 9 under all circumstances. SYNC operates normally for CLKout6, 7, 8, and 9 when driven by
VCO.
8.3.9.3.1 Effect of SYNC
When SYNC is asserted, the outputs to be synchronized are held in a logic low state. When SYNC is
unasserted, the clock outputs to be synchronized are activated and will transition to a high state simultaneously
with one another except where different digital delay values have been programmed.
Refer to Dynamically Programming Digital Delay for SYNC functionality when SYNC_QUAL = 1.
Table 5. Steady State Clock Output Condition Given Specified Inputs
SYNC_TYPE
SYNC_POL
_INV
SYNC PIN
CLOCK OUTPUT STATE
0,1,2 (Input)
0
0
Active
0,1,2 (Input)
0
1
Low
0,1,2 (Input)
1
0
Low
0,1,2 (Input)
1
1
Active
3, 4, 5, 6 (Output)
0
0 or 1
Active
3, 4, 5, 6 (Output)
1
0 or 1
Low
8.3.9.3.2 Methods of Generating SYNC
There are five methods to generate a SYNC event:
• Manual:
– Asserting the SYNC pin according to the polarity set by SYNC_POL_INV.
– Toggling the SYNC_POL_INV bit though MICROWIRE will cause a SYNC to be asserted.
• Automatic:
– If PLL1_SYNC_DLD or PLL2_SYNC_DLD is set, the SYNC pin will be asserted while DLD (digital lock
detect) is false for PLL1 or PLL2 respectively.
– Programming Register R30, which contains PLL2_N will generate a SYNC event when using the internal
VCO.
– Programming Register R0 through R5 when SYNC_EN_AUTO = 1.
Note: Due to the speed of the clock distribution path (as fast as ~325 ps period) and the slow slew rate of the
SYNC, the exact VCO cycle at which the SYNC is asserted or unasserted by the SYNC is undefined. The timing
diagrams show a sharp transition of the SYNC to clarify functionality.
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8.3.9.3.3 Avoiding Clock Output Interruption Due to Sync
Any CLKout groups that have their NO_SYNC_CLKoutX_Y bits set will be unaffected by the SYNC event. It is
possible to perform a SYNC operation with the NO_SYNC_CLKoutX_Y bits cleared, then set the
NO_SYNC_CLKoutX_Y bits so that the selected clocks will not be affected by a future SYNC. Future SYNC
events will not effect these clocks but will still cause the newly synchronized clocks to be re-synchronized using
the currently programmed digital delay values. When this happens, the phase relationship between the first
group of synchronized clocks and the second group of synchronized clocks will be undefined unless the SYNC
pulse is qualified by an output clock. See Dynamically Programming Digital Delay .
8.3.9.3.4 SYNC Timing
When discussing the timing of the SYNC function, one cycle refers to one period of the clock distribution path.
6 cycles
6 cycles
CLKoutX_Y_DDLY &
CLKoutX_Y_HS
Distribution
Path
SYNC
(SYNC_POL
_INV=1)
CLKout0
CLKout2
CLKout4
A
B
D
C
CLKout0_1_DIV = 1 (valid only for external VCO mode)
CLKout2_3_DIV = 2
CLKout4_5_DIV = 4
The digital delay for all clock outputs is 5
The digital delay half step for all clock outputs is 0
SYNC_QUAL = 0 (No qualification)
Figure 11. Clock Output Synchronization Using the SYNC Pin (Active Low)
Refer to Figure 11 during this discussion on the timing of SYNC. SYNC must be asserted for greater than one
clock cycle of the clock distribution path to latch the SYNC event. After SYNC is asserted, the SYNC event is
latched on the rising edge of the distribution path clock, at time A. After this event has been latched, the outputs
will not reflect the low state for 6 cycles, at time B. Due to the asynchronous nature of SYNC with respect to the
output clocks, it is possible that a glitch pulse could be created when the clock output goes low from the SYNC
event. This is shown by CLKout4 in Figure 11 and CLKout2 in Figure 12. See Relative Dynamic Digital Delay for
more information on synchronizing relative to an output clock to eliminate or minimize this glitch pulse.
After SYNC becomes unasserted the event is latched on the following rising edge of the distribution path clock,
time C. The clock outputs will rise at time D, coincident with a rising distribution clock edge that occurs after 6
cycles plus as many more cycles as programmed by the digital delay for that clock output. Therefore, the
soonest a clock output will become high is 11 cycles after the SYNC unassertion event registration, time C, when
the smallest digital delay value of 5 is set. If CLKoutX_Y_HS = 1 and CLKoutX_Y_DDLY = 5, then the clock
output will rise 10.5 cycles after SYNC is unassertion event registration.
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6 cycles
CLKoutX_Y_DDLY & CLKoutX_Y_HS
Distribution
Path
4.5
cycles
6 cycles
2.5
cycles
1 cycle
SYNC
(SYNC_POL
_INV=1)
CLKout0
CLKout2
CLKout4
CLKout5
A
B
C
D
E F
CLKout0_1_DIV = 2, CLKout0_1_DDLY = 5
CLKout2_3_DIV = 4, CLKout2_3_DDLY = 7
CLKout4_5_DIV = 4, CLKout4_5_DDLY = 8
CLKout0_1_HS = 1
CLKout2_3_HS = 0
CLKout4_5_HS = 0
SYNC_QUAL = 0 (No qualification)
Figure 12. Clock Output Synchronization using the SYNC Pin (Active Low)
Figure 12 illustrates the timing with different digital delays programmed.
• Time A) SYNC assertion event is latched.
• Time B) SYNC unassertion latched.
• Time C) All outputs toggle and remain low. A glitch pulse can occur at this time as shown by CLKout2.
• Time D) After 6 + 4.5 = 10.5 cycles CLKout0 rises. This is the shortest time from SYNC unassertion
registration to clock rising edge possible.
• Time E) After 6 + 7 = 13 cycles CLKout2 rises. CLKout2 and CLKout4, 5 are programmed for quadrature
operation.
• Time F) After 6 + 8 = 14 cycles CLKout4 and 5 rise. Since CLKout4 and 5 are driven by the same clock
divider and delay circuit, their timing is always the same.
8.3.9.3.5 Dynamically Programming Digital Delay
To use dynamic digital delay synchronization qualification set SYNC_QUAL = 1. This causes the SYNC pulse to
be qualified by a clock output so that the SYNC event occurs after a specified time from a clock output transition.
This allows the relative adjustment of clock output phase in real-time with no or minimum interruption of clock
outputs. Hence the term "dynamic digital delay".
Note that changing the phase of a clock output requires momentarily altering in the rate of change of the clock
output phase and therefore by definition results in a frequency distortion of the signal.
Without qualifying the SYNC with an output clock, the newly synchronized clocks would have a random and
unknown digital delay (or phase) with respect to clock outputs not currently being synchronized.
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8.3.9.3.5.1 Absolute vs. Relative Dynamic Digital Delay
The clock used for qualification of SYNC is selected with the feedback mux (FEEDBACK_MUX).
If the clock selected by the feedback mux has its NO_SYNC_CLKoutX_Y = 1, then an absolute dynamic digital
delay adjustment will be performed during a SYNC event and the digital delay of the feedback clock will not be
adjusted.
If the clock selected by the feedback mux has its NO_SYNC_CLKoutX_Y = 0, then a self-referenced or relative
dynamic digital delay adjustment will be performed during a SYNC event and the digital delay of the feedback
clock will be adjusted.
Clocks with NO_SYNC_CLKoutX_Y = 1 always operate without interruption.
8.3.9.3.5.2 Dynamic Digital Delay and 0-Delay Mode
When using a 0-delay mode absolute dynamic digital delay is recommended. Using relative dynamic digital
delay with a 0-delay mode may result in a momentary clock loss on the adjusted clock also being used for 0delay feedback that may result in PLL1 DLD becoming low. This may result in HOLDOVER mode being activated
depending upon device configuration.
8.3.9.3.5.3 SYNC and Minimum Step Size
The minimum step size adjustment for digital delay is half a clock distribution path cycle. This is achieved by
using the CLKoutX_Y_HS bit. The CLKoutX_Y_HS bit change effect is immediate without the need for SYNC. To
shift digital delay using CLKoutX_Y_DDLY a SYNC signal must be generated for the change to take effect.
8.3.9.3.5.4 Programming Overview
To dynamically adjust the digital delay with respect to an existing clock output the device should be programmed
as follows:
• Set SYNC_QUAL = 1 for clock output qualification.
• Set CLKout4_5_PD = 0. Required for proper operation of SYNC_QUAL = 1.
• Set EN_FEEDBACK_MUX = 1 to enable the feedback buffer.
• Set FEEDBACK_MUX to the clock output that the newly synchronized clocks will be qualified by.
• Set NO_SYNC_CLKoutX_Y = 1 for the output clocks that will continue to operate during the SYNC event.
There is no interruption of output on these clocks.
– If FEEDBACK_MUX selects a clock output with NO_SYNC_CLKoutX_Y = 1, then absolute dynamic
digital delay is performed.
– If FEEDBACK_MUX selects a clock output with NO_SYNC_CLKoutX_Y = 0, then self-referenced or
relative dynamic digital delay is performed.
• The SYNC_EN_AUTO bit may be set to cause a SYNC event to begin when register R0 to R5 is
programmed. The auto SYNC feature is a convenience since does not require the application to manually
assert SYNC by toggling the SYNC_POL_INV bit or the SYNC pin when changing digital delay. However,
under the following condition a special programming sequence is required if SYNC_EN_AUTO = 1:
– The CLKoutX_Y_DDLY value being set in the programmed register is 13 or more.
• Under the following condition a SYNC_EN_AUTO must = 0:
– If the application requires a digital delay resolution of half a clock distribution path cycle in relative
dynamic digital delay mode because the HS bit must be fixed per Table 6 for a qualifying clock.
8.3.9.3.5.5 Internal Dynamic Digital Delay Timing
To dynamically adjust digital delay a SYNC must occur. Once the SYNC is qualified by an output clock, 3 cycles
later an internal one shot pulse will occur. The width of the one shot pulse is 3 cycles. This internal one shot
pulse will cause the outputs to turn off and then back on with a fixed delay with respect to the falling edge of the
qualification clock. This allows for dynamic adjustments of digital delay with respect to an output clock.
The qualified SYNC timing is shown in Figure 13 for absolute dynamic digital delay and Figure 14 for relative
dynamic digital delay.
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8.3.9.3.5.6 Other Timing Requirements
When adjusting digital delay dynamically, the falling edge of the qualifying clock selected by the
FEEDBACK_MUX must coincide with the falling edge of the clock distribution path. For this requirement to be
met, program the CLKoutX_Y_HS value of the qualifying clock group according to Table 6.
Table 6. Half Step Programming Requirement of Qualifying Clock During Sync Event
DISTRIBUTION PATH FREQUENCY
CLKoutX_Y_DIV VALUE
CLKoutX_Y_HS
Even
Must = 1 during SYNC event.
Odd
Must = 0 during SYNC event.
Even
Must = 0 during SYNC event.
Odd
Must = 1 during SYNC event.
≥ 1.8 GHz
< 1.8 GHz
8.3.9.3.5.7 Absolute Dynamic Digital Delay
Absolute dynamic digital delay can be used to program a clock output to a specific phase offset from another
clock output.
Pros:
• Simple direct phase adjustment with respect to another clock output.
• CLKoutX_Y_HS will remain constant for qualifying clock.
– Can easily use auto sync feature (SYNC_EN_AUTO = 1) when digital delay adjustment requires half step
digital delay requirements.
• Can be used with 0-delay mode.
Cons:
• For some phase adjustments there may be a glitch pulse due to SYNC assertion.
– For example see CLKout4 in Figure 11 and CLKout2 in Figure 12.
8.3.9.3.5.7.1 Absolute Dynamic Digital Delay - Example
To illustrate the absolute dynamic digital delay adjust procedure, consider the following example.
System Requirements:
• VCO Frequency = 2949.12 MHz
• CLKout0 = 983.04 MHz (CLKout0_1_DIV = 3)
• CLKout2 = 491.52 MHz (CLKout2_3_DIV = 6)
• CLKout4 = 245.76 MHz (CLKout4_5_DIV = 12)
• For all clock outputs during initial programming:
– CLKoutX_Y_DDLY = 5
– CLKoutX_Y_HS = 1
– NO_SYNC_CLKoutX_Y = 0
The application requires the 491.52 MHz clock to be stepped in 30 degree steps (~169.5 ps), which is the
minimum step resolution allowable by the clock distribution path requiring use of the half step bit
(CLKoutX_Y_HS). That is 1 / 2949.52 MHz / 2 = ~169.5 ps. During the stepping of the 491.52-MHz clock, the
983.04-MHz and 245.76-MHz clock must not be interrupted.
Step 1: The device is programmed from register R0 to R30 with values that result in the device being locked and
operating as desired, see the system requirements above. The phase of all the output clocks are aligned
because all the digital delay and half step values were the same when the SYNC was generated by
programming register R30. The timing of this is as shown in Figure 11.
Step 2: Now the registers will be programmed to prepare for changing digital delay (or phase) dynamically.
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Table 7. Register Setup for Absolute Dynamic Digital Delay Example
REGISTER
PURPOSE
SYNC_QUAL = 1
Use a clock output for qualifying the SYNC pulse for dynamically
adjusting digital delay.
EN_SYNC = 1 (default)
Required for SYNC functionality.
CLKout4_5_PD = 0
Required when SYNC_QUAL = 1.
CLKout4 and/or CLKout5 outputs may be powered down or in use.
EN_FEEDBACK_MUX = 1
Enable the feedback mux for SYNC operation for dynamically
adjusting digital delay.
FEEDBACK_MUX = 2 (CLKout4)
Use the fixed 245.76-MHz clock as the SYNC qualification clock.
NO_SYNC_CLKout0_1 = 1
This clock output (983.04 MHz) won't be affected by SYNC. It will
always operate without interruption.
NO_SYNC_CLKout4_5 = 1
This clock output (245.76 MHz) won't be affected by SYNC. It will
always operate without interruption.
This clock will also be the qualifying clock in this example.
CLKout4_5_HS = 1
Since CLKout4 is the qualifying clock and CLKoutX_Y_DIV is even,
the half step bit must be set to 1. See Table 6.
SYNC_EN_AUTO = 1
Automatic generation of SYNC is allowed for this case.
After the registers in Table 7 have been programmed, the application may now dynamically adjust the digital
delay of CLKout2 (491.52 MHz).
Step 3: Adjust digital delay of CLKout2.
Refer to Table 8 for the programming values to set a specified phase offset from the absolute reference clock.
Table 8 is dependant upon the qualifying clock divide value of 12, refer to Calculating Dynamic Digital Delay
Values for any Divide for information on creating tables for any divide value.
Table 8. Programming for Absolute Digital Delay Adjustment
DEGREES OF ADJUSTMENT FROM INITIAL 491.52 MHz PHASE
+/-0 or +/-360 degrees
PROGRAMMING
CLKout2_3_DDLY = 7; CLKout2_3_HS = 1
30 degrees
-330 degrees
CLKout2_3_DDLY = 7; CLKout2_3_HS = 0
60 degrees
-300 degrees
CLKout2_3_DDLY = 8; CLKout2_3_HS = 1
90 degrees
-270 degrees
CLKout2_3_DDLY = 8; CLKout2_3_HS = 0
120 degrees
-240 degrees
CLKout2_3_DDLY = 9; CLKout2_3_HS = 1
150 degrees
-210 degrees
CLKout2_3_DDLY = 9; CLKout2_3_HS = 0
180 degrees
-180 degrees
CLKout2_3_DDLY = 10; CLKout2_3_HS = 1
210 degrees
-150 degrees
CLKout2_3_DDLY = 10; CLKout2_3_HS = 0
240 degrees
-120 degrees
CLKout2_3_DDLY = 5; CLKout2_3_HS = 1
270 degrees
-90 degrees
CLKout2_3_DDLY = 5; CLKout2_3_HS = 0
300 degrees
-60 degrees
CLKout2_3_DDLY = 6; CLKout2_3_HS = 1
330 degrees
-30 degrees
CLKout2_3_DDLY = 6; CLKout2_3_HS = 0
After setting the new digital delay values, the act of programming R1 will start a SYNC automatically because
SYNC_EN_AUTO = 1.
If the user elects to reduce the number of SYNCs because they are not required when only CLKout2_3_HS is
set, then SYNC_EN_AUTO is = 0 and the SYNC may now be generated by toggling the SYNC pin or by toggling
the SYNC_POL_INV bit. Because of the internal one shot pulse, no strict timing of the SYNC pin or
SYNC_POL_INV bit is required.
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After the SYNC event, the clock output will adjust according to Table 8. See Figure 13 for a detailed view of the
timing diagram. The timing diagram critical points are:
• Time A) SYNC assertion event is latched.
• Time B) First qualifying falling clock output edge.
• Time C) Second qualifying falling clock output edge.
• Time D) Internal one shot pulse begins. 5 cycles later clock outputs will be forced low
• Time E) Internal one shot pulse ends. 5 cycles + digital delay cycles later the synced clock outputs rise.
• Time F) Clock outputs are forced low. (CLKout2 is already low).
• Time G) Beginning of digital delay cycles.
• Time H) For CLKout2_3_DDLY = 6; the clock output rises now.
CLKoutX_Y_DDLY and
CLKoutX_Y_HS
5 cycles
Distribution
Path
3 cycles 3 cycles
5.5 cycles
5.5 cycles
SYNC
Internal One
Shot Pulse
CLKout0 /6
HS = 1
CLKout2 /6
HS = 1
CLKout4 /12
HS = 1
1
2
AB
C
D
E
F
G
H
Figure 13. Absolute Dynamic Digital Delay Programming Example
(SYNC_QUAL = 1, Qualify with Clock Output)
8.3.9.3.5.8 Relative Dynamic Digital Delay
Relative dynamic digital delay can be used to program a clock output to a specific phase offset from another
clock output.
Pros:
• Simple direct phase adjustment with respect to same clock output.
• The clock output will always behave the same during digital delay adjustment transient. For some divide
values there will be no glitch pulse.
Cons:
• For some clock divide values there may be a glitch pulse due to SYNC assertion.
• Adjustments of digital delay requiring the half step bit (CLKoutX_Y_HS) for finer digital delay adjust is
complicated.
• Use with 0-delay mode may result in PLL1 DLD becoming low and HOLDOVER mode becoming activated.
– DISABLE_DLD1_DET can be set to prevent HOLDOVER from becoming activated due to PLL1 DLD
becoming low.
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8.3.9.3.5.8.1 Relative Dynamic Digital Delay - Example
To illustrate the relative dynamic digital delay adjust procedure, consider the following example.
System Requirements:
• VCO Frequency = 2949.12 MHz
• CLKout0 = 983.04 MHz (CLKout0_1_DIV = 3)
• CLKout2 = 491.52 MHz (CLKout2_3_DIV = 6)
• CLKout4 = 491.52 MHz (CLKout4_5_DIV = 6)
• For all clock outputs during initial programming:
– CLKoutX_Y_DDLY = 5
– CLKoutX_Y_HS = 0
– NO_SYNC_CLKoutX_Y = 0
The application requires the 491.52-MHz clock to be stepped in 30 degree steps (~169.5 ps), which is the
minimum step resolution allowable by the clock distribution path. That is 1 / 2949.52 MHz / 2 = ~169.5 ps. During
the stepping of the 491.52 MHz clocks the 983.04 MHz clock must not be interrupted.
Step 1: The device is programmed from register R0 to R30 with values that result in the device being locked and
operating as desired, see the system requirements above. The phase of all the output clocks are aligned
because all the digital delay and half step values were the same when the SYNC was generated by
programming register R30. The timing of this is as shown in Figure 11.
Step 2: Now the registers will be programmed to prepare for changing digital delay (or phase) dynamically.
Table 9. Register Setup for Relative Dynamic Digital Delay Adjustment
REGISTER
PURPOSE
SYNC_QUAL = 1
Use clock output for qualifying the SYNC pulse for dynamically adjusting digital delay.
EN_SYNC = 1 (default)
Required for SYNC functionality.
CLKout4_5_PD = 0
Required when SYNC_QUAL = 1.
CLKout4 and/or CLKout5 outputs may be powered down or in use.
EN_FEEDBACK_MUX = 1
Enable the feedback mux for SYNC operation for dynamically adjusting digital delay.
FEEDBACK_MUX = 1 (CLKout2)
Use the clock itself as the SYNC qualification clock.
NO_SYNC_CLKout0_1 = 1
This clock output (983.04 MHz) won't be affected by SYNC. It will always operate without
interruption.
NO_SYNC_CLKout4_5 = 1
CLKout3’s phase is not to change with respect to CLKout0.
SYNC_EN_AUTO = 0 (default)
Automatic generation of SYNC is not allowed because of the half step requirement in relative
dynamic digital delay mode.
SYNC must be generated manually by toggling the SYNC_POL_INV bit or the SYNC pin.
After the above registers have been programmed, the application may now dynamically adjust the digital delay of
the 491.52 MHz clocks.
Step 3: Adjust digital delay of CLKout2 by one step which is 30 degrees or ~169.5 ps.
Refer to Table 10 for the programming sequence to step one half clock distribution period forward or backwards.
Refer to Calculating Dynamic Digital Delay Values for any Divide for more information on how to calculate digital
delay and half step values for other cases.
To fulfill the qualifying clock output half step requirement in Table 6 when dynamically adjusting digital delay, the
CLKoutX_Y_HS bit must be cleared for clocks with even divides. So before any dynamic digital delay
adjustment, CLKoutX_Y_HS must be clear because the clock divide value is even. To achieve the final required
digital delay adjustment, the CLKoutX_Y_HS bit may set after SYNC.
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Table 10. Programming Sequence for One Step Adjust
STEP DIRECTION and CURRENT HS STATE
PROGRAMMING SEQUENCE
Adjust clock output one step forward.
CLKout2_3_HS is 0.
1. CLKout2_3_HS = 1.
Adjust clock output one step forward.
CLKout2_3_HS is 1.
1. CLKout2_3_DDLY = 9.
2. Perform SYNC event.
3. CLKout2_3_HS = 0.
Adjust clock output one step backward.
CLKout2_3_HS is 0.
1. CLKout2_3_HS = 1.
2. CLKout2_3_DDLY = 5.
3. Perform SYNC event.
Adjust clock output one step backward.
CLKout2_3_HS is 1.
1. CLKout2_3_HS = 0.
After programing the updated CLKout2_3_DDLY and CLKout2_3_HS values, perform a SYNC event. The SYNC
may be generated by toggling the SYNC pin or by toggling the SYNC_POL_INV bit. Because of the internal one
shot pulse, no strict timing of the SYNC pin or SYNC_POL_INV bit is required. After the SYNC event, the clock
output will be at the specified phase. See Figure 14 for a detailed view of the timing diagram. The timing diagram
critical points are:
• Time A) SYNC assertion event is latched.
• Time B) First qualifying falling clock output edge.
• Time C) Second qualifying falling clock output edge.
• Time D) Internal one shot pulse begins. 5 cycles later clock outputs will be forced low.
• Time E) Internal one shot pulse ends. 5 cycles + digital delay cycles later the synced clock outputs rise.
• Time F) Clock outputs are forced low. (CLKouts are already low).
• Time G) Beginning of digital delay cycles.
• Time H) For CLKout2_3_DDLY = 9; the clock output rises now.
CLKoutX_Y_DDLY
and CLKoutX_Y_HS
5 cycles
Distribution
Path
3 cycles 3 cycles
5.5 cycles
8.5 cycles
SYNC
Internal One
Shot Pulse
CLKout0 /3
HS = 1
CLKout2 /6
HS = 1
1
2
CLKout4 /6
HS = 1
AB
C
D
E
F
G
H
(SYNC_QUAL = 1, Qualify with clock output)
Starting condition is after half step is removed (CLKout2_3_HS = 0).
Figure 14. Relative Dynamic Digital Delay Programming Example, 2nd Adjust
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8.3.10 0-Delay Mode
When 0-delay mode is enabled the clock output selected by the Feedback Mux is connected to the PLL1 N
counter to ensure a fixed phase relationship between the selected CLKin and the fed back CLKout. When all the
clock outputs are synced together, all the clock outputs will share the same fixed phase relationship between the
selected CLKin and the fed back CLKout. The feedback can be internal or external using FBCLKin port.
When 0-delay mode is enabled the lowest frequency clock output is fed back to the Feedback Mux to ensure a
repeatable fixed CLKin to CLKout phase relationship between all clock outputs.
If a clock output that is not the lowest frequency output is selected for feedback, then clocks with lower
frequencies will have an unknown phase relationship with respect the other clocks and clock input. There will be
a number of possible phase relationships equal to Feedback_Clock_Frequency / Lower_Clock_Frequency that
may occur.
The Feedback Mux selects the even clock output of any clock group for internal feedback or the FBCLKin port for
external 0-delay feedback. The even clock can remain powered down as long as the CLKoutX_Y_PD bit is = 0
for its clock group.
To use 0-delay mode, the bit EN_FEEDBACK_MUX must be set (=1) to power up the feedback mux.
See PLL Programming for more information on programming PLL1_N for 0-delay mode.
When using an external VCO mode, internal 0-delay feedback must be used since the FBCLKin port is shared
with the Fin input.
Table 11 outlines several registers to program for 0-delay mode.
Table 11. Programming 0-Delay Mode
42
REGISTER
PURPOSE
MODE = 2 or 15
Select one of the 0-delay modes for device.
EN_FEEDBACK_MUX = 1
Enable feedback mux.
FEEDBACK_MUX = Application Specific
Select CLKout or FBCLKin for 0-delay feedback.
CLKoutX_Y_DIV
The divide value of the clock selected by FEEDBACK_MUX is
important for PLL2 N value calculation
PLL1_N
PLL1_N value used with CLKoutX_Y_DIV in loop.
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8.4 Device Functional Modes
8.4.1 Mode Selection
The LMK0480x family is capable of operating in several different modes as programmed by MODE: Device
Mode.
Table 12. Device Mode Selection
MODE
R11[31:27]
PLL1
PLL2
PLL2 VCO
0
X
X
Internal
2
X
X
Internal
3
X
X
External
6
X
Internal
8
X
Internal
11
X
External
X
External
15
16
(1)
X
0-DELAY
CLOCK DIST
X
X
X
X
X
X
X
X
X
X
(1)
X
See Mode 15 Additional Configurations
In addition to selecting the device's mode of operation above, some modes require additional configuration. Also
there are other features including holdover and dynamic digital delay that can also be enabled.
Table 13. Registers to Further Configure Device Mode of Operation
HOLDOVER
0-DELAY
DYNAMIC DIGITAL
DELAY
HOLDOVER_MODE
2
—
—
EN_TRACK
User
—
—
DAC_CLK_DIV
User
—
—
REGISTER
EN_MAN_DAC
User
—
—
DISABLE_DLD1_DET
User
—
—
EN_VTUNE_RAIL_
DET
User
—
—
DAC_HIGH_TRIP
User
—
—
DAC_LOW_TRIP
User
—
—
FORCE_HOLDOVER
0
—
—
SYNC_EN_AUTO
—
—
User
SYNC_QUAL
—
—
1
EN_SYNC
—
—
1
CLKout4_5_PD
—
—
0
EN_
FEEDBACK_MUX
—
1
1
FEEDBACK_MUX
—
Feedback Clock
Qualifying Clock
NO_SYNC_
CLKoutX_Y
—
—
User
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8.4.2 Operating Modes
The LMK0480x is a flexible device that can be configured for many different use cases. The following simplified
block diagrams help show the user the different use cases of the device.
8.4.2.1 Dual PLL
Figure 15 illustrates the typical use case of the LMK0480x in dual loop mode. In dual loop mode the reference to
PLL1 is either CLKin0 or CLKin1. An external VCXO or tunable crystal will be used to provide feedback for the
first PLL and a reference to the second PLL. This first PLL cleans the jitter with the VCXO or low cost tunable
crystal by using a narrow loop bandwidth. The VCXO or tunable crystal output may be buffered through the two
OSCout ports and optionally on up to 4 of the CLKouts. The VCXO or tunable crystal is used as the reference to
PLL2 and may be doubled using the frequency doubler. The internal VCO drives up to six divide/delay blocks
which drive 12 clock outputs.
Holdover functionality is optionally available when the input reference clock is lost. Holdover works by fixing the
tuning voltage of PLL1 to the VCXO or tunable crystal.
It is also possible to use an external VCO in place of PLL2's internal VCO.
R
Phase
Detector
PLL1
N
PLL2
External VCXO
or Tunable
Crystal
External
Loop Filter
OSCoutX
OSCoutX*
2 outputs
OSCin
CLKinX
CLKinX*
2 inputs
CPout1
PLL1
External
Loop Filter
CPout2
R
Input
Buffer
N
Phase
Detector
PLL2
Divider
Digital Delay
Analog Delay
Partially
Integrated
Loop Filter
Internal
VCO
CLKoutY
CLKoutY*
CLKoutX
CLKoutX*
12 outputs
6 blocks
LMK0480x
Figure 15. Simplified Functional Block Diagram for Dual Loop Mode
8.4.2.2 0-Delay Dual PLL
Figure 16 illustrates the use case of 0-delay dual loop mode. This configuration is very similar to Dual PLL except
that the feedback to the first PLL is driven by a clock output. This causes the clock outputs to have deterministic
phase with respect to the clock input. Since all the clock outputs can be synchronized together, all the clock
outputs can be in phase with the clock input signal. The feedback to PLL1 can be connected internally as shown,
or externally using FBCLKin (CLKin1) as an input port.
It is also possible to use an external VCO in place of PLL2's internal VCO.
R
Phase
Detector
PLL1
2 inputs
N
PLL2
External VCXO
or Tunable
Crystal
External
Loop Filter
OSCoutX
OSCoutX*
2 outputs
OSCin
CLKinX
CLKinX*
CPout1
PLL1
External
Loop Filter
CPout2
R
Input
Buffer
N
Phase
Detector
PLL2
Divider
Digital Delay
Analog Delay
Partially
Integrated
Loop Filter
Internal
VCO
CLKoutY
CLKoutY*
CLKoutX
CLKoutX*
12 outputs
6 blocks
Internal or external loopback, user programmable
LMK0480x
Figure 16. Simplified Functional Block Diagram for 0-delay Dual Loop Mode
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8.4.2.3 Single PLL
Figure 17 illustrates the use case of single PLL mode. In single PLL mode only PLL2 is used and PLL1 is
powered down. OSCin is used as the reference input. The internal VCO drives up to 6 divide/delay blocks which
drive 12 clock outputs. The reference at OSCin can be used to drive up to 2 OSCout ports. OSCin can also
optionally drive up to 4 of the clock outputs.
It is also possible to use an external VCO in place of PLL2's internal VCO.
PLL2
OSCoutX
OSCoutX*
2 outputs
External
Loop Filter
CPout2
OSCin
OSCin*
R
Phase
Detector
PLL2
N
Divider
Digital Delay
Analog Delay
Partially
Integrated
Loop Filter
Internal
VCO
CLKoutY
CLKoutY*
CLKoutX
CLKoutX*
12 outputs
6 blocks
LMK0480x
Figure 17. Simplified Functional Block Diagram for Single Loop Mode
8.4.2.4 0-Delay Single PLL
Figure 18 illustrates the use case of 0-delay single PLL mode. This configuration is very similar to Single PLL
except that the feedback to PLL2 comes from a clock output. This causes the clock outputs to be in phase with
the reference input. Since all the clock outputs can be synchronized together, all the clock outputs can be in
phase with the clock input signal. The feedback to PLL2 can be performed internally as shown, or externally
using FBCLKin (CLKin1) as an input port.
It is also possible to use an external VCO in place of PLL2's internal VCO.
PLL2
OSCoutX
OSCoutX*
2 outputs
External
Loop Filter
CPout2
OSCin
OSCin*
R
N
Phase
Detector
PLL2
Divider
Digital Delay
Analog Delay
Partially
Integrated
Loop Filter
Internal
VCO
CLKoutY
CLKoutY*
CLKoutX
CLKoutX*
12 outputs
6 blocks
Internal or external loopback, user programmable
LMK0480x
Figure 18. Simplified Functional Block Diagram for 0-delay Single Loop Mode
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8.4.2.5 Clock Distribution
Figure 19 illustrates the LMK0480x used for clock distribution. CLKin1 is used to drive up to 6 divide/delay blocks
which drive 12 outputs. OSCin can be used to drive up to 2 OSCout ports. OSCin can also optionally drive up to
4 of the clock outputs.
Divider
Digital Delay
Analog Delay
CLKin1
CLKin1*
CLKoutY
CLKoutY*
CLKoutX
CLKoutX*
12 outputs
6 blocks
OSCoutX
OSCoutX*
2 outputs
OSCin
OSCin*
LMK0480x
Figure 19. Simplified Functional Block Diagram for Mode Clock Distribution
8.4.2.6 Mode 15 Additional Configurations
Special considerations must be made when configuring the LMK0480x device in Dual PLL, 0-delay, External
VCO mode (Mode 15). These additional registers can be programmed in sequential order as recommended or
before R11 to ensure OSCoutX operation state is as desired when MODE register is programmed to 15 (0x0F).
• Program register R20 to 0x0784 E854 (This results in OSCout0 and 1 powered off. Program as desired).
• Program register R22 to 0x0000 0456
Additionally, OSCoutX power down functions are relocated to different register locations. Table 14 describes the
reconfiguration of these control bits.
Table 14. Mode 15 Reconfiguration of Control Bits
DUAL PLL, 0-DELAY, EXTERNAL VCO, MODE 15
OSCout0
OSCout1
46
ALL OTHER MODES
PD_OSCout0 R20[23]
EN_OSCout0 R10[22]
0 = OSCout0 is enabled (POR Default)
0 = OSCout0 is disabled
1 = OSCout0 is disabled
1 = OSCout0 is enabled (POR Default)
PD_OSCout1 R20[24]
EN_OSCout1 R10[23]
0 = OSCout1 is enabled (POR Default)
0 = OSCout1 is disabled (POR Default)
1 = OSCout1 is disabled
1 = OSCout1 is enabled
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8.5 Programming
LMK0480x devices are programmed using 32-bit registers. Each register consists of a 5-bit address field and 27bit data field. The address field is formed by bits 0 through 4 (LSBs) and the data field is formed by bits 5 through
31 (MSBs). The contents of each register is clocked in MSB first (bit 31), and the LSB (bit 0) last. During
programming, the LEuWire signal should be held low. The serial data is clocked in on the rising edge of the
CLKuWire signal. After the LSB (bit 0) is clocked in the LEuWire signal should be toggled low-to-high-to-low to
latch the contents into the register selected in the address field. It is recommended to program registers in
numeric order, for example R0 to R16, and R24 to R31 to achieve proper device operation. Figure 6 illustrates
the serial data timing sequence.
To achieve proper frequency calibration, the OSCin port must be driven with a valid signal before programming
register R30. Changes to PLL2 R divider or the OSCin port frequency require register R30 to be reloaded in
order to activate the frequency calibration process.
8.5.1 Special Programming Case for R0 to R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY
In some cases when programming register R0 to R5 to change the CLKoutX_Y_DIV divide value or
CLKoutX_Y_DDLY delay value, 3 additional CLKuWire cycles must occur after loading the register for the newly
programmed divide or delay value to take effect. These special cases include:
• When CLKoutX_Y_DIV is > 25.
• When CLKoutX_Y_DDLY is > 12. Note: loading the digital delay value only prepares for a future SYNC
event.
Also, since SYNC_EN_AUTO bit = 1 automatically generates a SYNC on the falling edge of LE when R0 to R5 is
programmed, further programming considerations must be made when SYNC_EN_AUTO = 1.
These special programming cases requiring the additional three clock cycles may be properly programmed by
one of the following methods shown in Table 15.
Table 15. R0 to R5 Special Case
•
•
•
•
CLKoutX_Y_DIV and
CLKoutX_Y_DDLY
SYNC
_EN_
AUTO
PROGRAMMING METHOD
CLKoutX_Y_DIV ≤ 25 and
CLKoutX_Y_DDLY ≤ 12
0 or 1
No Additional Clocks Required (Normal)
CLKoutX_Y_DIV > 25 or
CLKoutX_Y_DDLY > 12
0
Three Extra CLKuWire Clocks (Or program another
register)
CLKoutX_Y_DIV > 25 or
CLKoutX_Y_DDLY > 12
1
Three Extra CLKuWire Clocks while LEuWire is
High
Method: No Additional Clocks Required (Normal) No special consideration to CLKuWire is required when
changing divide value to ≤ 25, digital delay value to ≤ 12, or when the digital delay and divide value do not
change. See MICROWIRE timing Figure 6.
Method: Three Extra CLKuWire Clocks Three extra clocks must be provided before CLKoutX_Y_DIV > 25
or CLKoutX_Y_DDLY > 12 take effect. See MICROWIRE timing Figure 7. Also, by programming another
register the three clock requirement can be satisfied.
Method: Three Extra CLKuWire Clocks with LEuWire Asserted When SYNC_EN_AUTO = 1 the falling
edge of LEuWire will generate a SYNC event. CLKoutX_Y_DIV and CLKoutX_Y_DDLY values must be
updated before the SYNC event occurs. So 3 CLKuWire rising edges must occur before LEuWire goes low.
See MICROWIRE timing Figure 8.
Initial Programming Sequence During the recommended programming sequence the device is programmed
in order from R0 to R31, so it is expected at least one additional register will be programmed after
programming the last CLKoutX_Y_DIV or CLKoutX_Y_DDLY value in R0 to R5. This will result in the extra
needed CLKuWire rising edges, so this special note is of little concern. If programming R0 to R5 to change
CLKout frequency or digital delay or dynamic digital delay at a later time in the application, take care to
provide these extra CLKuWire cycles to properly load the new divide and/or delay values.
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8.5.1.1 Example
In this example, all registers have been programmed, the PLLs are locked. An LMK04808 has been generating a
clock output frequency of 61.44 MHz on CLKout4 using a VCO frequency of 2949.12 MHz and a divide value of
48. SYNC_EN_AUTO = 0. At a later time the application requires a 30.72-MHz output on CLKout4. By
reprogramming register R4 with CLKout4_5_DIV = 96 twice, the divide value of 96 is set for clock outputs 4 and
5 which results in an output frequency of 30.72 MHz (2949.12 MHz / 96 = 30.72 MHz) on CLKout4.
In this example the required 3 CLKuWire cycles were achieved by reprogramming the R4 register with the same
value twice.
8.5.2 Recommended Programming Sequence
Registers are programmed in numeric order with R0 being the first and R31 being the last register programmed.
The recommended programming sequence involves programming R0 with the reset bit (b17) set to 1 to ensure
the device is in a default state. If R0 is programmed again, the reset bit must be cleared to 0 during the
programming of R0.
8.5.2.1 Overview
• Program R0 with RESET bit = 1. This ensures that the device is configured with default settings. When
RESET = 1, all other R0 bits are ignored.
– If R0 is programmed again during the initial configuration of the device, the RESET bit must be cleared.
• R0 through R5: CLKouts.
– Program as necessary to configure the clock outputs, CLKout0 to CLKout11 as desired. These registers
configure clock output controls such as powerdown, digital delay and divider value, analog delay select,
and clock source select.
• R6 through R8: CLKouts.
– Program as necessary to configure the clock outputs, CLKout0 to CLKout11 as desired. These registers
configure the output format for each clock outputs and the analog delay for the clock output groups.
• R9: Required programming
– Program this register as shown in the register map for proper operation.
• R10: OSCouts, VCO divider, and 0-delay.
– Enable and configure clock outputs OSCout0/1.
– Set and select VCO divider (VCO bypass is recommended).
– Set 0-delay feedback source if used.
• R11: Part mode, SYNC, and XTAL.
– Program to configure the mode of the part, to configure SYNC functionality and pin, and to enable crystal
mode.
• R12: Pins, SYNC, and holdover mode.
– Status_LD pin, more SYNC options to generate a SYNC upon PLL1 and/or PLL2 lock detect.
– Enable clock features such as holdover.
• R13: Pins, holdover mode, and CLKins.
– Status_HOLDOVER, Status_CLKin0, and Status_CLKin1 pin controls.
– Enable clock inputs for use in specific part modes.
• R14: Pins, LOS, CLKins, and DAC.
– Status_CLKin1 pin control.
– Loss of signal detection, CLKin type, DAC rail detect enable and high and low trip points.
• R15: DAC and holdover mode.
– Program to enable and set the manual DAC value.
– HOLDOVER mode options.
• R16: Crystal amplitude.
– Increasing XTAL_LVL can improve tunable crystal phase noise performance.
• R24: PLL1 and PLL2.
– PLL1 N and R delay and PLL1 digital lock delay value.
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•
•
•
•
•
•
•
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– PLL2 integrated loop filter.
R25: DAC and PLL1.
– Program to configure DAC update clock divider and PLL1 digital lock detect count.
R26: PLL2.
– Program to configure PLL2 options.
R27: CLKins and PLL1.
– Clock input pre-dividers.
– Program to configure PLL1 options.
R28: PLL1 and PLL2.
– Program to configure PLL2 R and PLL1 N.
R29: OSCin and PLL2.
– Program to configure oscillator input frequency, PLL2 fast phase detector frequency mode, and PLL2 N
calibration value.
R30: PLL2.
– Program to configure PLL2 prescaler and PLL2 N value.
R31: uWire lock.
– Program to set the uWire_LOCK bit.
8.5.3 Readback
At no time should the MICROWIRE registers be programmed to any value other than what is specified in the
datasheet.
For debug of the MICROWIRE interface, it is recommended to simply program an output pin mux to active low
and then toggle the output type register between output and inverting output while observing the output pin for a
low to high transition. For example, to verify MICROWIRE programming, set the LD_MUX = 0 (Low) and then
toggle the LD_TYPE register between 3 (Output, push-pull) and 4 (Output inverted, push-pull). The result will be
that the Status_LD pin will toggle from low to high.
Readback from the MICROWIRE programming registers is available. The MICROWIRE readback function can
be enabled on the Status_LD, Status_HOLDOVER, Status_CLKin0, Status_CLKin1, or SYNC pin by
programming the corresponding MUX register to “uWire Readback” and the corresponding TYPE register to
"Output (push-pull)." Power on reset defaults the Status_HOLDOVER pin to “uWire Readback.”
Figure 9 illustrates the serial data timing sequence for a readback operation for both cases of READBACK_LE =
0 (POR default) and READBACK_LE = 1.
To perform a readback operation first set the register to be read back by programming the READBACK_ADDR
register. Then after any MICROWIRE write operation, with the LEuWire pin held low continue to clock the
CLKuWire pin. On every rising edge of the CLKuWire pin a new data bit is clocked onto the any pins
programmed for uWire Readback. If the READBACK_LE bit is set, the LEuWire pin should be left high after
LEuWire rising edge while continuing to clock the CLKuWire pin.
It is allowable to perform a register read back in the same MICROWIRE operation which set the
READBACK_ADDR register value.
Data is clocked out MSB first. After 27 clocks all the data values will have been read and the read operation is
complete. If READBACK_LE = 1, the LEuWire line may now be lowered. It is allowable for the CLKuWire pin to
be clocked additional cycles, but the data on the readback pin will be invalid.
CLKuWire must be low before the falling edge of LEuWire.
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8.5.3.1 Readback - Example
To readback register R3 perform the following steps:
• Write R31 with READBACK_ADDR = 3; READBACK_LE = 0. DATAuWire and CLKuWire are toggled as
shown in Figure 6 with new data being clocked in on rising edges of CLKuWire
• Toggle LEuWire high and then low as shown in Figure 6 and Figure 9. LEuWire is returned low because
READBACK_LE = 0.
• Toggle CLKuWire high and then low 27 times to read back all 27 bits of register R3. Data is read MSB first.
Data is valid on falling edge of CLKuWire.
• Read operation is complete.
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8.6 Register Maps
8.6.1 Register Map and Readback Register Map
Table 16 provides the register map for device programming. Normally any register can be read from the same data address it is written to. However,
READBACK_LE has a different readback address. Also, the DAC_CNT register is a read only register. Table 17 shows the address for
READBACK_LE and DAC_CNT. Bits marked as reserved are undefined upon readback.
Observe that only the DATA bits are readback during a readback which can result in an offset of 5 bits between the two register tables.
Table 16. Register Map
REGISTER
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
1
0
CLKout6_7_DDLY [27:18]
0
CLKout 0_1_HS
0
0
0
0
0
CLKout 2_3_HS
POWERDOWN
CLKout4_5_DDLY [27:18]
0
CLKout2_3_DIV [15:5]
0
0
0
0
1
CLKout 4_5_HS
RESET
CLKout2_3_DDLY [27:18]
CLKout0_1_DIV [15:5]
CLKout4_5_DIV [15:5]
0
0
0
1
0
CLKout 6_7_HS
CLKout0_ ADLY_SEL
CLKout2_ ADLY_SEL
CLKout5_ ADLY_SEL
CLKout7_ ADLY_SEL
CLKout0_1_DDLY [27:18]
CLKout4_ ADLY_SEL
CLKout3_ ADLY_SEL
0
2
Address [4:0]
CLKout6_ ADLY_SEL
CLKout1_ ADLY_SEL
0
CLKout6_7_ OSCin_Sel
R3
CLKout 0_1_PD
R2
CLKout 2_3_PD
R1
0
CLKout 4_5_PD
R0
CLKout 6_7_PD
Data [26:0]
3
CLKout6_7_DIV [15:5]
0
0
0
1
1
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Register Maps (continued)
Table 16. Register Map (continued)
REGISTER
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
0
CLKout8_9_DDLY [27:18]
0
CLKout10_11_DDLY [27:18]
0
CLKout 8_9_HS
CLKout9_ ADLY_SEL
CLKout11_ ADLY_SEL
1
CLKout8_9_DIV [15:5]
0
0
1
0
0
CLKout10_11_DIV [15:5]
0
0
1
0
1
CLKout2_TYPE [27:24]
CLKout1_TYPE [23:20]
CLKout0_TYPE [19:16]
CLKout2_3_ADLY
[15:11]
0
CLKout0_1_ADLY
[9:5]
0
0
1
1
0
R7
CLKout7_TYPE [31:28]
CLKout6_TYPE [27:24]
CLKout5_TYPE [23:20]
CLKout4_TYPE [19:16]
CLKout6_7_ADLY
[15:11]
0
CLKout4_5_ADLY
[9:5]
0
0
1
1
1
CLKout10_11_ADLY
[15:11]
0
CLKout8_9_ADLY
[9:5]
0
1
0
0
0
0
1
0
0
1
0
1
0
1
0
0
1
0
1
1
0
1
0
0
1
OSCout0_TYPE [27:24]
PD_OSCin
1
0
1
OSCout_DIV
[18:16]
SYNC_MUX
[19:18]
0
1
0
1
0
0
1
0
SYNC_TYPE
[14:12]
0
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1
0
1
0
VCO_DIV
[10:8]
0
0
1
0
FEEDBACK
_MUX [7:5]
0
0
0
EN_PLL2_XTAL
1
SYNC_EN_AUTO
0
OSCout0_MUX
0
SYNC_POL_INV
1
MODE [31:27]
1
SYNC_QUAL
0
NO_SYNC_CLKout8_9
1
NO_SYNC_CLKout10_11
OSCout1_
LVPECL_
AMP
[31:30]
0
EN_SYNC
R11
1
NO_SYNC_CLKout0_1
0
OSCout1_MUX
R9
NO_SYNC_CLKout2_3
CLKout8_TYPE [19:16]
EN_OSCout0
CLKout9_TYPE [23:20]
NO_SYNC_CLKout4_5
CLKout10_TYPE [27:24]
EN_OSCout1
CLKout11_TYPE [31:28]
NO_SYNC_CLKout6_7
R8
EN_ FEEDBACK_MUX
CLKout3_TYPE [31:28]
VCO_MUX
R6
R10
52
2
CLKout 10_11_HS
CLKout8_9_ OSCin_Sel
0
CLKout8_ ADLY_SEL
CLKout 8_9_PD
R5
3
Address [4:0]
CLKout10_ ADLY_SEL
R4
CLKout 10_11_PD
Data [26:0]
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Register Maps (continued)
Table 16. Register Map (continued)
REGISTER
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
(1)
0
0
1
0
Status_
CLKin0
_TYPE
[18:16]
DAC_HIGH_TRIP
[19:14]
0
0
0
0
Status_
CLKin0
_MUX
[14:12]
0
0
0
0
CLKin
_Select
_MODE
[11:8]
0
DAC_LOW_TRIP
[11:6]
HOLDOVER
_MODE
[7:6]
0
1
0
1
1
0
0
EN_CLKin0
0
2
0
1
1
0
1
EN_VTUNE_ RAIL_DET
0
LOS_
TIMEOUT
[31:30]
0
0
EN_CLKin1
Status_
CLKin1
_TYPE
[26:24]
R14
Status_
CLKin1
_MUX
[22:20]
0
EN_TRACK
0
1
CLKin_Sel_INV
HOLDOVER
_TYPE
[26:24]
1
3
Address [4:0]
DISABLE_ DLD1_DET
HOLDOVER_MUX
[31:27]
0
CLKin0_BUF_TYPE
R13
0
(1)
CLKin1_BUF_TYPE
LD_TYPE [26:24]
SYNC_PLL1 _DLD
LD_MUX [31:27]
EN_LOS
R12
SYNC_PLL2 _DLD
Data [26:0]
0
1
1
1
0
Although the value of 0 is written here, during readback the value of READBACK_LE will be read at this location. See Register Map and Readback Register Map.
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Register Maps (continued)
Table 16. Register Map (continued)
REGISTER
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
0
1
PLL2_C3_LF
[27:24]
0
1
0
PLL2_ CP_POL
0
PLL2_CP
_GAIN
[27:26]
0
PLL1_CP_POL
PLL2_
WND_SIZE
[31:30]
PLL1_CP
_GAIN
[27:26]
0
1
PLL2_R4_LF
[22:20]
0
DAC_CLK_DIV [31:22]
1
1
1
0
0
0
CLKin1_
PreR_DIV
[23: 22]
HOLDOVER_DLD_CNT
[19:6]
0
0
1
0
PLL2_R3_LF
[18:16]
1
0
0
0
0
0
0
PLL1_
WND_
SIZE
[7:6]
PLL1_R_DLY
[10:8]
0
0
1
1
1
0
1
0
0
0
0
0
1
1
0
0
0
PLL1_DLD_CNT [19:6]
0
1
1
0
0
1
1
0
PLL2_DLD_CNT
[19:6]
1
1
0
1
0
PLL1_R
[19:6]
1
1
0
1
1
PLL1_N [19:6]
0
1
1
1
0
0
1
1
1
0
1
1
1
1
1
0
1
1
1
1
1
CLKin0_
PreR_DIV
[21: 20]
0
0
0
0
OSCin_FREQ
[26:24]
PLL2_N_CAL [22:5]
R30
0
0
0
0
0
PLL2_P [26:24]
0
PLL2_N [22:5]
R31
0
0
0
0
0
0
0
READBACK _LE
0
0
1
1
0
R29
0
0
0
0
PLL2_R [31: 20]
0
0
PLL1_N_DLY
[14:12]
0
PLL2_ FAST_PDF
R28
54
0
EN_PLL2_ REF_2X
R25
R27
0
PLL2_C4_LF
[31:28]
R24
R26
0
0
FORCE_ HOLDOVER
0
1
PLL2_CP_TRI
XTAL_
LVL
2
PLL1_CP_TRI
R16
0
3
Address [4:0]
READBACK_ADDR [20:16]
0
0
0
0
0
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0
0
0
0
0
uWire_LOCK
MAN_DAC
[31:22]
R15
EN_MAN_DAC
Data [26:0]
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REGISTER
RD
26
RD
25
RD
24
RD
23
RD
22
RD
21
RD
20
RD
19
RD
18
RD
17
RD
16
RD
15
RD
14
RD
13
RD
12
RD
11
RD
10
RD
9
RD
8
RD
7
RD
6
RD
5
RD
4
RD
3
0
0
0
0
0
0
0
0
0
EN_TRACK
Table 17. Readback Register Map
RD
2
RD
1
RD
0
RESERVED [26:24]
RD
R31
READBACK_LE
LD_TYPE [21:19]
0
1
1
DAC_CNT [23:14]
HOLDOVER_
MODE
[2:1]
1
RESERVED [13:0]
uWire_LOCK
RD
R23
LD_MUX [26:22]
SYNC_PLL1_DLD
RD
R12
SYNC_PLL2_DLD
Data [26:0]
RESERVED [26:10]
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8.6.2 Default Device Register Settings After Power On Reset
Table 18 illustrates the default register settings programmed in silicon for the LMK0480x after power on or
asserting the reset bit. Capital X and Y represent numeric values.
GROUP
Table 18. Default Device Register Settings after Power On/Reset
DEFAULT
VALUE
(DECIMAL)
DEFAULT STATE
CLKout0_1_PD
1
PD
CLKout2_3_PD
1
PD
CLKout4_5_PD
1
PD
CLKout6_7_PD
0
Normal
CLKout8_9_PD
0
Normal
CLKout10_11_PD
1
PD
CLKout6_7_OSCin_Sel
1
OSCin
CLKout8_9_OSCin_Sel
0
VCO
Selects the clock source for a clock group from
internal VCO or external OSCin
CLKoutX_ADLY_SEL
0
None
CLKoutX_Y_DDLY
0
5
RESET
0
Not in reset
0
Disabled
(device is active)
FIELD NAME
Clock Output Control
POWERDOWN
Osc Buffer Control
REGISTER
R1
Powerdown control for analog and digital delay,
divider, and both output buffers
R2
R3
31
R4
R5
R3
30
R4
30
Add analog delay for clock output
R0 to R5
28, 29
Digital delay value
R0 to R5
27:18 [10]
Performs power on reset for device
R0
17
Device power down control
R1
17
R0 to R5
16
0
No shift
CLKout0_1_DIV
25
Divide-by-25
R0
CLKout2_3_DIV
25
Divide-by-25
R1
CLKout4_5_DIV
25
Divide-by-25
CLKout6_7_DIV
1
Divide-by-1
CLKout8_9_DIV
25
Divide-by-25
R4
CLKout10_11_DIV
25
Divide-by-25
R5
CLKout3_TYPE
0
Powerdown
R6
CLKout7_TYPE
0
Powerdown
R7
CLKout11_TYPE
0
Powerdown
R8
CLKout2_TYPE
0
Powerdown
R6
8
LVCMOS
(Norm/Norm)
Half shift for digital delay
R2
Divide for clock outputs
R3
R7
Individual clock output format. Select from
LVDS/LVPECL/LVCMOS.
CLKout10_TYPE
0
Powerdown
CLKout1_TYPE
0
Powerdown
CLKout5_TYPE
0
Powerdown
R7
CLKout9_TYPE
0
Powerdown
R8
CLKout0_TYPE
0
Powerdown
R6
CLKout4_TYPE
0
Powerdown
R7
CLKout8_TYPE
1
LVDS
R8
CLKoutX_Y_ADLY
0
No delay
OSCout1_LVPECL_AMP
2
1600 mVpp
LVPECL
OSCout0_TYPE
1
LVDS
EN_OSCout1
0
Disabled
EN_OSCout0
1
Enabled
OSCout1_MUX
0
OSCout0_MUX
0
31:28 [4]
27:24 [4]
R8
R6
23:20 [4]
19:16 [4]
15:11, 9:5 [5]
Set LVPECL amplitude
R10
31:30 [2]
OSCout0 default clock output
R10
27:24 [4]
Disable OSCout1 output buffer
R10
23
Enable OSCout0 output buffer
R10
22
Bypass Divider
Select OSCout divider for OSCout1 or bypass
R10
21
Bypass Divider
Select OSCout divider for OSCout0 or bypass
R10
20
Allows OSCin to be powered down. For use in clock
distribution mode.
R10
19
OSCout divider value
R10
18:16 [3]
0
OSCin powered
OSCout_DIV
0
Divide-by-8
Analog delay setting for clock group
15:5 [11]
R6 to R8
PD_OSCin
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BIT
LOCATION
(MSB:LSB)
R0
CLKoutX_Y_HS
CLKout6_TYPE
56
FIELD DESCRIPTION
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CLKin Control
Other Mode Control
Clock Synchronization
Mode
GROUP
Table 18. Default Device Register Settings after Power On/Reset (continued)
(1)
FIELD NAME
DEFAULT
VALUE
(DECIMAL)
DEFAULT STATE
FIELD DESCRIPTION
REGISTER
BIT
LOCATION
(MSB:LSB)
12
VCO_MUX
0
VCO
Select VCO or VCO Divider output
R10
EN_FEEDBACK_MUX
0
Disabled
Feedback MUX is powered down.
R10
11
VCO_DIV
2
Divide-by-2
VCO Divide value
R10
10:8 [3]
FEEDBACK_MUX
0
CLKout0
Selects CLKout to feedback into the PLL1 N divider
R10
7:5 [3]
MODE
0
Internal VCO
Device mode
R11
31:27 [5]
EN_SYNC
1
Enabled
Enables synchronization circuitry.
R11
26
NO_SYNC_CLKout10_11
0
Will sync
R11
25
NO_SYNC_CLKout8_9
1
Will not sync
R11
24
NO_SYNC_CLKout6_7
1
Will not sync
R11
23
NO_SYNC_CLKout4_5
0
Will sync
R11
22
NO_SYNC_CLKout2_3
0
Will sync
R11
21
NO_SYNC_CLKout0_1
0
Will sync
R11
20
SYNC_MUX
0
Logic Low
Mux controlling SYNC pin when set to output
R11
19:18 [2]
SYNC_QUAL
0
Not qualified
Allows SYNC operations to be qualified by a clock
output.
R11
17
SYNC_POL_INV
1
Logic Low
Sets the polarity of the SYNC pin when input
R11
16
R11
15
14:12 [3]
Disable individual clock groups from becoming
synchronized.
SYNC_EN_AUTO
0
Manual
SYNC is not started by programming a register R0 to
R5.
SYNC_TYPE
1
Input /w
Pull-up
SYNC IO pin type
R11
EN_PLL2_XTAL
0
Disabled
Enable Crystal oscillator for OSCin
R11
5
LD_MUX
3
PLL1 and 2 DLD
Lock detect mux selection when output
R12
31:27 [5]
LD_TYPE
3
Output
(Push-Pull)
LD IO pin type
R12
26:24 [3]
SYNC_PLL2_DLD
0
Normal
Force synchronization mode until PLL2 locks
R12
23
SYNC_PLL1_DLD
0
Normal
Force synchronization mode until PLL1 locks
R12
22
EN_TRACK
1
Enable Tracking
DAC tracking of the PLL1 tuning voltage
R12
8
HOLDOVER_MODE
2
Enable Holdover
Causes holdover to activate when lock is lost
R12
7:6 [2]
HOLDOVER_MUX
7
uWire Readback
Holdover mux selection
R13
31:27 [5]
HOLDOVER_TYPE
3
Output
(Push-Pull)
HOLDOVER IO pin type
R13
26:24 [3]
Status_CLKin1_MUX
0
Logic Low
Status_CLKin1 pin MUX selection
R13
22:20 [3]
Status_CLKin0_TYPE
2
Input /w Pull-down
Status_CLKin0 IO pin type
R13
18:16 [3]
Disables PLL1 DLD falling edge from causing
HOLDOVER mode to be entered
R13
15
Status_CLKin0 pin MUX selection
R13
14:12 [3]
Mode to use in determining reference CLKin for PLL1
R13
11:9 [3]
Invert Status 0 and 1 pin polarity for input (1)
R13
8
6
DISABLE_DLD1_DET
0
Not Disabled
Status_CLKin0_MUX
0
Logic Low
CLKin_SELECT_MODE
3
Manual Select
CLKin_Sel_INV
0
Active High
EN_CLKin1
1
Usable
Set CLKin1 to be usable
R13
EN_CLKin0
1
Usable
Set CLKin0 to be usable
R13
5
LOS_TIMEOUT
0
1200 ns, 420 kHz
Time until no activity on CLKin asserts LOS
R14
31:30 [2]
EN_LOS
1
Enabled
Loss of Signal Detect at CLKin
R14
28
Status_CLKin1_TYPE
2
Input /w Pull-down
Status_CLKin1 pin IO pin type
R14
26:24 [3]
CLKin1_BUF_TYPE
0
Bipolar
CLKin1 Buffer Type
R14
21
CLKin0_BUF_TYPE
0
Bipolar
CLKin0 Buffer Type
R14
20
Inversion for Status 0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06
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DAC Control
GROUP
Table 18. Default Device Register Settings after Power On/Reset (continued)
DEFAULT
VALUE
(DECIMAL)
DEFAULT STATE
FIELD DESCRIPTION
REGISTER
BIT
LOCATION
(MSB:LSB)
DAC_HIGH_TRIP
0
~50 mV from Vcc
Voltage from Vcc at which holdover mode is entered if
EN_VTUNE_RAIL_DAC is enabled.
R14
19:14 [6]
DAC_LOW_TRIP
0
~50 mV from GND
Voltage from GND at which holdover mode is entered
if EN_VTUNE_RAIL_DAC is enabled.
R14
11:6 [6]
EN_VTUNE_RAIL_DET
0
Disabled
Enable PLL1 unlock state when DAC trip points are
achieved
R14
5
512
3V/2
Writing to this register will set the value for DAC when
in manual override.
Readback from this register is DAC value.
R15
31:22 [10]
0
Disabled
Set manual DAC override
R15
20
Lock must be valid n many clocks of PLL1 PDF before
holdover mode is exited.
R15
19:6 [14]
Forces holdover mode.
R15
5
FIELD NAME
MAN_DAC
EN_MAN_DAC
HOLDOVER_DLD_CNT
512
512 counts
FORCE_HOLDOVER
0
Holdover not
forced
XTAL_LVL
0
1.65 Vpp
Sets drive power level of Crystal
R16
31:30 [2]
PLL2_C4_LF
0
10 pF
PLL2 integrated capacitor C4 value
R24
31:28 [4]
PLL2_C3_LF
0
10 pF
PLL2 integrated capacitor C3 value
R24
27:24 [4]
PLL2_R4_LF
0
200 Ω
PLL2 integrated resistor R4 value
R24
22:20 [3]
PLL2_R3_LF
0
200 Ω
PLL2 integrated resistor R3 value
R24
18:16 [3]
R24
14:12 [3]
PLL1_N_DLY
0
No delay
Delay in PLL1 feedback path to decrease lag from
input to output
PLL1_R_DLY
0
No delay
Delay in PLL1 reference path to increase lag from
input to output
R24
10:8 [3]
PLL1_WND_SIZE
3
40 ns
Window size used for digital lock detect for PLL1
R24
7:6 [2]
R25
31:22 [10]
4
Divide-by-4
DAC update clock divisor. Divides PLL1 phase
detector frequency.
PLL1_DLD_CNT
1024
1024 cycles
Lock must be valid n many cycles before LD is
asserted
R25
19:6 [14]
PLL2_WND_SIZE
0
Window size used for digital lock detect for PLL2
R26
31:30 [2]
EN_PLL2_REF_2X
0
Disabled, 1x
Doubles reference frequency of PLL2.
R26
29
PLL2_CP_POL
0
Negative
Polarity of PLL2 Charge Pump
R26
28
PLL2_CP_GAIN
3
3.2 mA
PLL2 Charge Pump Gain
R26
27:26 [2]
PLL2_DLD_CNT
8192
8192 Counts
Number of PDF cycles which phase error must be
within DLD window before LD state is asserted.
R26
19:6 [14]
PLL Control
DAC_CLK_DIV
58
(2)
PLL2_CP_TRI
0
Active
PLL2 Charge Pump Active
R26
5
PLL1_CP_POL
1
Positive
Polarity of PLL1 Charge Pump
R27
28
PLL1_CP_GAIN
0
100 uA
PLL1 Charge Pump Gain
R27
27:26 [2]
CLKin1_PreR_DIV
0
Divide-by-1
CLKin1 Pre-R divide value (1, 2, 4, or 8)
R27
23:22 [2]
CLKin0_PreR_DIV
0
Divide-by-1
CLKin0 Pre-R divide value (1, 2, 4, or 8)
R27
21:20 [2]
PLL1_R
96
Divide-by-96
PLL1 R Divider (1 to 16383)
R27
19:6 [14]
PLL1_CP_TRI
0
Active
PLL1 Charge Pump Active
R27
5
PLL2_R
4
Divide-by-4
PLL2 R Divider (1 to 4095)
R28
31:20 [12]
PLL1_N
192
Divide-by-192
PLL1 N Divider (1 to 16383)
R28
19:6 [14]
7
448 to 511 MHz
OSCin frequency range
R29
26:24 [3]
PLL2_FAST_PDF
1
PLL2 PDF > 100
MHz
When set, PLL2 PDF of greater than 100 MHz may be
used
R29
23
PLL2_N_CAL
48
Divide-by-48
Actual PLL2 N divider value used in calibration
routine.
R29
22:5 [18]
OSCin_FREQ
(2)
Reserved
PLL2_P
2
Divide-by-2
PLL2 N Divider Prescaler (2 to 8)
R30
26:24 [3]
PLL2_N
48
Divide-by-48
PLL2 N Divider (1 to 262143)
R30
22:5 [18]
This register must be reprogrammed to a value of 2 (3.7 ns) during user programming.
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GROUP
Table 18. Default Device Register Settings after Power On/Reset (continued)
DEFAULT
VALUE
(DECIMAL)
DEFAULT STATE
READBACK_LE
0
LEuWire Low for
Readback
READBACK_ADDR
31
Register 31
uWire_LOCK
0
Writable
FIELD NAME
Copyright © 2011–2014, Texas Instruments Incorporated
REGISTER
BIT
LOCATION
(MSB:LSB)
State LEuWire pin must be in for readback
R31
21
Register to read back
R31
20:16 [5]
The values of registers R0 to R30 are lockable
R31
5
FIELD DESCRIPTION
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8.6.3 Register Descriptions
8.6.3.1 Register R0 TO R5
Registers R0 through R5 control the 12 clock outputs CLKout0 to CLKout11. Register R0 controls CLKout0 and
CLKout1, Register R1 controls CLKout2 and CLKout3, and so on. All functions of the bits in these six registers
are identical except the different registers control different clock outputs. The X and Y in CLKoutX_Y_PD,
CLKoutX_ADLY_SEL, CLKoutY_ADLY_SEL, CLKoutX_Y_DDLY, CLKoutX_Y_HS, CLKoutX_Y_DIV denote the
actual clock output which may be from 0 to 11 where X is even and Y is odd. Two clock outputs CLKoutX and
CLKoutY form a clock output group and are often run together in bit names as CLKoutX_Y.
The RESET bit is only in register R0.
The POWERDOWN bit is only in register R1.
The CLKoutX_Y_OSCin_Sel bit is only in registers R3 and R4.
8.6.3.1.1 CLKoutX_Y_PD, Powerdown CLKoutX_Y Output Path
This bit powers down the clock group as specified by CLKoutX and CLKoutY. This includes the divider, digital
delay, analog delay, and output buffers.
Table 19. CLKoutX_Y_PD
R0-R5[31]
STATE
0
Power up clock group
1
Power down clock group
8.6.3.1.2 CLKoutX_Y_OSCin_Sel, Clock Group Source
This bit sets the source for the clock output group CLKoutX_Y. The selected source will be either from a VCO via
Mode Mux1 or from the OSCin buffer.
This bit is valid only for registers R3 and R4, clock groups CLKout6_7 and CLKout8_9 respectively. All other
clock output groups are driven by a VCO via Mode Mux1.
Table 20. CLKoutX_Y_OSCin_Sel
R3-R4[30]
60
CLOCK GROUP SOURCE
0
VCO
1
OSCin
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8.6.3.1.3 CLKoutY_ADLY_SEL[29], CLKoutX_ADLY_SEL[28], Select Analog Delay
These bits individually select the analog delay block (CLKoutX_Y_ADLY) for use with CLKoutX or CLKoutY. It is
not required for both outputs of a clock output group to use analog delay, but if both outputs do select the analog
delay block, then the analog delay will be the same for each output, CLKoutX and CLKoutY. When neither clock
output uses analog delay, the analog delay block is powered down. Analog delay may not operate at frequencies
above the minimum-ensured maximum output frequency of 1536 MHz.
Table 21. CLKoutY_ADLY_SEL[29], CLKoutX_ADLY_SEL[28]
R0-R5[29]
R0-R5[28]
STATE
0
0
Analog delay powered down
0
1
Analog delay on even CLKoutX
1
0
Analog delay on odd CLKoutY
1
1
Analog delay on both CLKouts
8.6.3.1.4 CLKoutX_Y_DDLY, Clock Channel Digital Delay
CLKoutX_Y_DDLY and CLKoutX_Y_HS sets the digital delay used for CLKoutX and CLKoutY. This value only
takes effect during a SYNC event and if the NO_SYNC_CLKoutX_Y bit is cleared for this clock group. See Clock
Output Synchronization (SYNC).
Programming CLKoutX_Y_DDLY can require special attention. See section Special Programming Case for R0 to
R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY for more details.
Using a CLKoutX_Y_DDLY value of 13 or greater will cause the clock group to operate in extended mode
regardless of the clock group's divide value or the half step value.
One clock cycle is equal to the period of the clock distribution path. The period of the clock distribution path is
equal to VCO Divider value divided by the frequency of the VCO. If the VCO divider is disabled or an external
VCO is used, the VCO divide value is treated as 1.
tclock distribution path = VCO divide value / fVCO
Table 22. CLKoutX_Y_DDLY, 10 Bits
R0-R5[27:18]
DELAY
0 (0x00)
5 clock cycles
1 (0x01)
5 clock cycles
2 (0x02)
5 clock cycles
3 (0x03)
5 clock cycles
4 (0x04)
5 clock cycles
5 (0x05)
5 clock cycles
6 (0x06)
6 clock cycles
7 (0x07)
7 clock cycles
...
...
12 (0x0C)
12 clock cycles
13 (0x0D)
13 clock cycles
...
...
520 (0x208)
520 clock cycles
521 (0x209)
521 clock cycles
522 (0x20A)
522 clock cycles
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POWER MODE
Normal Mode
Extended Mode
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8.6.3.1.5 Reset
The RESET bit is located in register R0 only. Setting this bit will cause the silicon default values to be loaded.
When programming register R0 with the RESET bit set, all other programmed values are ignored. After resetting
the device, the register R0 must be programmed again (with RESET = 0) to set non-default values in register R0.
The reset occurs on the falling edge of the LEuWire pin which loaded R0 with RESET = 1.
The RESET bit is automatically cleared upon writing any other register. For instance, when R0 is written to again
with default values.
Table 23. RESET
R0[17]
STATE
0
Normal operation
1
Reset (automatically cleared)
8.6.3.1.6 POWERDOWN
The POWERDOWN bit is located in register R1 only. Setting the bit causes the device to enter powerdown
mode. Normal operation is resumed by clearing this bit via MICROWIRE.
Table 24. POWERDOWN
R1[17]
STATE
0
Normal operation
1
Powerdown
8.6.3.1.7 CLKoutX_Y_HS, Digital Delay Half Shift
This bit subtracts a half clock cycle of the clock distribution path period to the digital delay of CLKoutX and
CLKoutY. CLKoutX_Y_HS is used together with CLKoutX_Y_DDLY to set the digital delay value.
When changing CLKoutX_Y_HS, the digital delay immediately takes effect without a SYNC event.
Table 25. CLKoutX_Y_HS
R0-R5[16]
62
STATE
0
Normal
1
Subtract half of a clock distribution path period from the total digital
delay
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8.6.3.1.8 CLKoutX_Y_DIV, Clock Output Divide
CLKoutX_Y_DIV sets the divide value for the clock group. The divide may be even or odd. Both even and odd
divides output a 50% duty cycle clock.
Using a divide value of 26 or greater will cause the clock group to operate in extended mode regardless of the
clock group's digital delay value.
Programming CLKoutX_Y_DIV can require special attention. See section Special Programming Case for R0 to
R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY for more details.
Table 26. CLKoutX_Y_DIV, 11 Bits
R0-R5[15:5]
DIVIDE VALUE
0 (0x00)
Reserved
1 (0x01)
1
(1)
2 (0x02)
2
(2)
3 (0x03)
(1)
(2)
POWER MODE
3
4 (0x04)
4
(2)
5 (0x05)
5
(2)
6 (0x06)
6
...
...
24 (0x18)
24
25 (0x19)
25
26 (0x1A)
26
27 (0x1B)
27
...
...
1044 (0x414)
1044
1045 (0x415)
1045
Normal Mode
Extended Mode
CLKoutX_Y_HS must = 0 for divide by 1.
After programming PLL2_N value, a SYNC must occur on channels using this divide value. Programming PLL2_N does generate a
SYNC event automatically which satisfies this requirement, but NO_SYNC_CLKoutX_Y must be set to 0 for these clock groups.
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8.6.3.2 Registers R6 TO R8
Registers R6 to R8 set the clock output types and analog delays.
8.6.3.2.1 CLKoutX_TYPE
The clock output types of the LMK0480x are individually programmable. The CLKoutX_TYPE registers set the
output type of an individual clock output to LVDS, LVPECL, LVCMOS, or powers down the output buffer. Note
that LVPECL supports four different amplitude levels and LVCMOS supports single LVCMOS outputs, inverted,
and normal polarity of each output pin for maximum flexibility.
Table 27 shows at what register and address the specified clock output CLKoutX_TYPE register is located.
The CLKoutX_TYPE table shows the programming definition for these registers.
Table 27. CLKoutX_TYPE Programming Addresses
CLKoutX
PROGRAMMING ADDRESS
CLKout0
R6[19:16]
CLKout1
R6[23:20]
CLKout2
R6[27:24]
CLKout3
R6[31:28]
CLKout4
R7[19:16]
CLKout5
R7[23:20]
CLKout6
R7[27:24]
CLKout7
R7[31:28]
CLKout8
R8[19:16]
CLKout9
R8[23:20]
CLKout10
R8[27:24]
CLKout11
R8[31:28]
Table 28. CLKoutX_TYPE, 4 Bits
(1)
64
R6-R8[31:28, 27:24, 23:20]
DEFINITION
0 (0x00)
Power down
1 (0x01)
LVDS
2 (0x02)
LVPECL (700 mVpp)
3 (0x03)
LVPECL (1200 mVpp)
4 (0x04)
LVPECL (1600 mVpp)
5 (0x05)
LVPECL (2000 mVpp)
6 (0x06)
LVCMOS (Norm/Inv)
7 (0x07)
LVCMOS (Inv/Norm)
8 (0x08)
LVCMOS (Norm/Norm)
9 (0x09)
LVCMOS (Inv/Inv) (1)
10 (0x0A)
LVCMOS (Low/Norm) (1)
11 (0x0A)
LVCMOS (Low/Inv) (1)
12 (0x0C)
LVCMOS (Norm/Low) (1)
13 (0x0D)
LVCMOS (Inv/Low) (1)
14 (0x0E)
LVCMOS (Low/Low) (1)
To reduce supply switching and crosstalk noise, it is recommended to use a complementary LVCMOS output type such as 6 or 7. See
Section Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs) for more information
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8.6.3.2.2 CLKoutX_Y_ADLY
These registers control the analog delay of the clock group CLKoutX_Y. Adding analog delay to the output will
increase the noise floor of the output. For this analog delay to be active for a clock output, it must be selected
with CLKout(X or Y)_ADL_SEL. If neither clock output in a clock group selects the analog delay, then the analog
delay block is powered down. Analog delay may not operate at frequencies above the minimum-ensured
maximum output frequency of 1536 MHz.
In addition to the programmed delay, a fixed 500 ps of delay will be added by engaging the delay block.
The programming addresses table shows at what register and address the specified clock output
CLKoutX_Y_ADLY register is located.
The CLKoutX_Y_ADLY table shows the programming definition for these registers.
Table 29. CLKoutX_Y_ADLY Programming Addresses
CLKoutX_Y_ADLY
PROGRAMMING ADDRESS
CLKout0_1_ADLY
R6[9:5]
CLKout2_3_ADLY
R6[15:11]
CLKout4_5_ADLY
R7[9:5]
CLKout6_7_ADLY
R7[15:11]
CLKout8_9_ADLY
R8[9:5]
CLKout10_11_ADLY
R8[15:11]
Table 30. CLKoutX_Y_ADLY, 5 Bits
R6-R8[15:11, 9:5]
DEFINITION
0 (0x00)
500 ps + No delay
1 (0x01)
500 ps + 25 ps
2 (0x02)
500 ps + 50 ps
3 (0x03)
500 ps + 75 ps
4 (0x04)
500 ps + 100 ps
5 (0x05)
500 ps + 125 ps
6 (0x06)
500 ps + 150 ps
7 (0x07)
500 ps + 175 ps
8 (0x08)
500 ps + 200 ps
9 (0x09)
500 ps + 225 ps
10 (0x0A)
500 ps + 250 ps
11 (0x0B)
500 ps + 275 ps
12 (0x0C)
500 ps + 300 ps
13 (0x0D)
500 ps + 325 ps
14 (0x0E)
500 ps + 350 ps
15 (0x0F)
500 ps + 375 ps
16 (0x10)
500 ps + 400 ps
17 (0x11)
500 ps + 425 ps
18 (0x12)
500 ps + 450 ps
19 (0x13)
500 ps + 475 ps
20 (0x14)
500 ps + 500 ps
21 (0x15)
500 ps + 525 ps
22 (0x16)
500 ps + 550 ps
23 (0x17)
500 ps + 575 ps
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8.6.3.3 Register R10
8.6.3.3.1 OSCout1_LVPECL_AMP, LVPECL Output Amplitude Control
The OSCout1 clock output can only be used as an LVPECL output type. OSCout1_LVPECL_AMP sets the
LVPECL output amplitude of the OSCout1 clock output.
Table 31. OSCout1_LVPECL_AMP, 2 Bits
R10[31:30]
OUTPUT FORMAT
0 (0x00)
LVPECL (700 mVpp)
1 (0x01)
LVPECL (1200 mVpp)
2 (0x02)
LVPECL (1600 mVpp)
3 (0x03)
LVPECL (2000 mVpp)
8.6.3.3.2 OSCout0_TYPE
The OSCout0 clock output has a programmable output type. The OSCout0_TYPE register sets the output type to
LVDS, LVPECL, LVCMOS, or powers down the output buffer. Note that LVPECL supports four different
amplitude levels and LVCMOS supports dual and single LVCMOS outputs with inverted, and normal polarity of
each output pin for maximum flexibility.
To turn on the output, the OSCout0_TYPE must be set to a non-power down setting and enabled with
EN_OSCoutX, OSCout Output Enable.
Table 32. OSCout0_TYPE, 4 Bits
(1)
66
R10[27:24]
DEFINITION
0 (0x00)
Powerdown
1 (0x01)
LVDS
2 (0x02)
LVPECL (700 mVpp)
3 (0x03)
LVPECL (1200 mVpp)
4 (0x04)
LVPECL (1600 mVpp)
5 (0x05)
LVPECL (2000 mVpp)
6 (0x06)
LVCMOS (Norm/Inv)
7 (0x07)
LVCMOS (Inv/Norm)
8 (0x08)
LVCMOS (Norm/Norm) (1)
9 (0x09)
LVCMOS (Inv/Inv) (1)
10 (0x0A)
LVCMOS (Low/Norm) (1)
11 (0x0B)
LVCMOS (Low/Inv) (1)
12 (0x0C)
LVCMOS (Norm/Low) (1)
13 (0x0D)
LVCMOS (Inv/Low) (1)
14 (0x0E)
LVCMOS (Low/Low) (1)
To reduce supply switching and crosstalk noise, it is recommended to use a complementary LVCMOS output type such as 6 or 7. See
Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs) for more information"
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8.6.3.3.3 EN_OSCoutX, OSCout Output Enable
EN_OSCoutX is used to enable an oscillator buffered output.
Table 33. EN_OSCout1
R10[23]
OUTPUT STATE
0
OSCout1 Disabled
1
OSCout1 Enabled
Table 34. EN_OSCout0
R10[22]
OUTPUT STATE
0
OSCout0 Disabled
1
OSCout0 Enabled
OSCout0 note: In addition to enabling the output with EN_OSCout0. The OSCout0_TYPE must be programmed
to a non-power down value for the output buffer to power up.
8.6.3.3.4 OSCoutX_MUX, Clock Output Mux
Sets OSCoutX buffer to output a divided or bypassed OSCin signal. The divisor is set by OSCout_DIV, Oscillator
Output Divide.
Table 35. OSCout1_MUX
R10[21]
MUX OUTPUT
0
Bypass divider
1
Divided
Table 36. OSCout0_MUX
R10[20]
MUX OUTPUT
0
Bypass divider
1
Divided
8.6.3.3.5 PD_OSCin, OSCin Powerdown Control
Except in clock distribution mode, the OSCin buffer must always be powered up.
In clock distribution mode, the OSCin buffer must be powered down if not used.
Table 37. PD_OSCin
R10[19]
OSCin BUFFER
0
Normal Operation
1
Powerdown
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8.6.3.3.6 OSCout_DIV, Oscillator Output Divide
The OSCout divider can be programmed from 2 to 8. Divide by 1 is achieved by bypassing the divider with
OSCoutX_MUX, Clock Output Mux.
Note that OSCout_DIV will be in the PLL1 N feedback path if OSCout0_MUX selects divided as an output. When
OSCout_DIV is in the PLL1 N feedback path, the OSCout_DIV divide value must be accounted for when
programming PLL1 N.
See PLL Programming for more information on programming PLL1 to lock.
Table 38. OSCout_DIV, 3 Bits
R10[18:16]
DIVIDE
0 (0x00)
8
1 (0x01)
2
2 (0x02)
2
3 (0x03)
3
4 (0x04)
4
5 (0x05)
5
6 (0x06)
6
7 (0x07)
7
8.6.3.3.7 VCO_MUX
When the internal VCO is used, the VCO divider can be selected to divide the VCO output frequency to reduce
the frequency on the clock distribution path. It is recommended to use the VCO directly unless:
• Very low output frequencies are required.
• If using the VCO divider results in three or more clock output divider/delays changing from extended to
normal power mode, a small power savings may be achieved by using the VCO divider.
A consequence of using the VCO divider is a small degradation in phase noise.
Table 39. VCO_MUX
R10[12]
DEFINITION
0
VCO selected
1
VCO divider selected
8.6.3.3.8 EN_FEEDBACK_MUX
When using 0-delay or dynamic digital delay (SYNC_QUAL = 1), EN_FEEDBACK_MUX must be set to 1 to
power up the feedback mux.
Table 40. EN_FEEDBACK_MUX
68
R10[11]
DEFINITION
0
Feedback mux powered down
1
Feedback mux enabled
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8.6.3.3.9 VCO_DIV, VCO Divider
Divide value of the VCO Divider.
See PLL Programming for more information on programming PLL2 to lock.
Table 41. VCO_DIV, 3 Bits
R10[10:8]
DIVIDE
0 (0x00)
8
1 (0x01)
2
2 (0x02)
2
3 (0x03)
3
4 (0x04)
4
5 (0x05)
5
6 (0x06)
6
7 (0x07)
7
8.6.3.3.10 FEEDBACK_MUX
When in 0-delay mode, the feedback mux selects the clock output to be fed back into the PLL1 N Divider.
Table 42. FEEDBACK_MUX, 3 Bits
R10[7:5]
MUX OUTPUT
0 (0x00)
CLKout0
1 (0x01)
CLKout2
2 (0x02)
CLKout4
3 (0x03)
CLKout6
4 (0x04)
CLKout8
5 (0x05)
CLKout10
6 (0x06)
FBCLKin/FBCLKin*
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8.6.3.4 Register R11
8.6.3.4.1 MODE: Device Mode
MODE determines how the LMK0480x operates from a high level. Different blocks of the device can be powered
up and down for specific application requirements from a dual loop architecture to clock distribution.
The LMK0480x can operate in:
• Dual PLL mode with the internal VCO or an external VCO.
• Single PLL mode uses PLL2 and powers down PLL1. OSCin is used for PLL reference input.
• Clock Distribution mode allows use of CLKin1 to distribute to clock outputs CLKout0 through CLKout11, and
OSCin to distribute to OSCout0, OSCout1, and optionally CLKout6 through CLKout9.
For the PLL modes, deterministic phase delay with respect to the input can be achieved with the 0-delay mode.
For the PLL modes it is also possible to use an external VCO.
Table 43. MODE, 5 Bits
(1)
(2)
70
R11[31:27]
VALUE
0 (0x00)
Dual PLL, Internal VCO
1 (0x01)
Reserved
2 (0x02)
Dual PLL, Internal VCO,
0-Delay
3 (0x03)
Dual PLL, External VCO (Fin)
4 (0x04)
Reserved
5 (0x05)
Dual PLL, External VCO (Fin),
0-Delay (1)
6 (0x06)
PLL2, Internal VCO
7 (0x07)
Reserved
8 (0x08)
PLL2, Internal VCO,
0–Delay
9 (0x09)
Reserved
10 (0x0A)
Reserved
11 (0x0B)
PLL2, External VCO (Fin)
12 (0x0C)
Reserved
13 (0x0D)
Reserved
14 (0x0E)
Reserved
15 (0x0F)
Dual PLL, External VCO (Fin), 0-Delay (2)
16 (0x10)
Clock Distribution
Contact TI Applications for more information on using this mode.
See Mode 15 Additional Configurations for additional configuration steps required.
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8.6.3.4.2 EN_SYNC, Enable Synchronization
The EN_SYNC bit (default on) must be enabled for synchronization to work. Synchronization is required for
dynamic digital delay.
The synchronization enable may be turned off once the clocks are operating to save current. If EN_SYNC is set
after it has been cleared (a transition from 0 to 1), a SYNC is generated that can disrupt the active clock outputs.
Setting the NO_SYNC_CLKoutX_Y bits will prevent this SYNC pulse from affecting the output clocks. Setting the
EN_SYNC bit is not a valid method for synchronizing the clock outputs. See the Clock Output Synchronization
section for more information on synchronization.
Table 44. EN_SYNC
R11[26]
DEFINITION
0
Synchronization disabled
1
Synchronization enabled
8.6.3.4.3 NO_SYNC_CLKoutX_Y
The NO_SYNC_CLKoutX_Y bits prevent individual clock groups from becoming synchronized during a SYNC
event. A reason to prevent individual clock groups from becoming synchronized is that during synchronization,
the clock output is in a fixed low state or can have a glitch pulse.
By disabling SYNC on a clock group, it will continue to operate normally during a SYNC event.
Digital delay requires a SYNC operation to take effect. If NO_SYNC_CLKoutX_Y is set before a SYNC event, the
digital delay value will be unused.
Setting the NO_SYNC_CLKoutX_Y bit has no effect on clocks already synchronized together.
Table 45. NO_SYNC_CLKoutX_Y Programming Addresses
NO_SYNC_CLKoutX_Y
PROGRAMMING ADDRESS
CLKout0 and 1
R11:20
CLKout2 and 3
R11:21
CLKout4 and 5
R11:22
CLKout6 and 7
R11:23
CLKout8 and 9
R11:24
CLKout10 and 11
R11:25
Table 46. NO_SYNC_CLKoutX_Y
R11[25, 24, 23, 22, 21, 20]
DEFINITION
0
CLKoutX_Y will synchronize
1
CLKoutX_Y will not synchronize
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8.6.3.4.4 SYNC_MUX
Mux controlling SYNC pin when type is an output.
All the outputs logic is active high when SYNC_TYPE = 3 (Output). All the outputs logic is active low when
SYNC_TYPE = 4 (Output Inverted). For example, when SYNC_MUX = 0 (Logic Low) and SYNC_TYPE = 3
(Output) then SYNC outputs a logic low. When SYNC_MUX = 0 (Logic Low) and SYNC_TYPE = 4 (Output
Inverted) then SYNC outputs a logic high.
Table 47. SYNC_MUX, 2 Bits
R11[19:18]
SYNC PIN OUTPUT
0 (0x00)
Logic Low
1 (0x01)
Reserved
2 (0x02)
Reserved
3 (0x03)
uWire Readback
8.6.3.4.5 SYNC_QUAL
When SYNC_QUAL is set, clock outputs will be synchronized to an existing clock output selected by
FEEDBACK_MUX. By using the NO_SYNC_CLKoutX_Y bits, selected clock outputs will not be interrupted
during the SYNC event.
Qualifying the SYNC by an output clock means that the pulse which turns the clock outputs off and on will have a
fixed time relationship to the qualifying output clock.
SYNC_QUAL = 1 requires CLKout4_5_PD = 0 for proper operation. CLKout4_TYPE and CLKout5_TYPE may be
set to Powerdown mode.
See Clock Output Synchronization (SYNC) for more information.
Table 48. SYNC_QUAL
R11[17]
MODE
0
No qualification
1
Qualification by clock output from feedback mux
(Must set
CLKout4_5_PD = 0)
8.6.3.4.6 SYNC_POL_INV
Sets the polarity of the SYNC pin when input. When SYNC is asserted the clock outputs will transition to a low
state.
See Clock Output Synchronization (SYNC) for more information on SYNC. A SYNC event can be generated by
toggling this bit through the MICROWIRE interface.
Table 49. SYNC_POL_INV
72
R11[16]
POLARITY
0
SYNC is active high
1
SYNC is active low
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8.6.3.4.7 SYNC_EN_AUTO
When set, causes a SYNC event to occur when programming register R0 to R5 to adjust digital delay values.
The SYNC event will coincide with the LEuWire pin falling edge.
Refer to Special Programming Case for R0 to R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY for more
information on possible special programming considerations when SYNC_EN_AUTO = 1.
Table 50. SYNC_EN_AUTO
R11[15]
MODE
0
Manual SYNC
1
SYNC Internally Generated
8.6.3.4.8 SYNC_TYPE
Sets the IO type of the SYNC pin.
Table 51. SYNC_TYPE, 3 Bits
R11[14:12]
POLARITY
0 (0x00)
Input
1 (0x01)
Input /w pull-up resistor
2 (0x02)
Input /w pull-down resistor
3 (0x03)
Output (push-pull)
4 (0x04)
Output inverted (push-pull)
5 (0x05)
Output (open source)
6 (0x06)
Output (open drain)
When in output mode, the SYNC input is forced to 0 regardless of the SYNC_MUX setting. A synchronization
can then be activated by uWire by programming the SYNC_POL_INV register to active low to assert SYNC.
SYNC can then be released by programming SYNC_POL_INV to active high. Using this uWire programming
method to create a SYNC event saves the need for an IO pin from another device.
8.6.3.4.9 EN_PLL2_XTAL
If an external crystal is being used to implement a discrete VCXO, the internal feedback amplifier must be
enabled with this bit in order to complete the oscillator circuit.
Table 52. EN_PLL2_XTAL
R11[5]
OSCILLATOR AMPLIFIER STATE
0
Disabled
1
Enabled
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8.6.3.5 Register R12
8.6.3.5.1 LD_MUX
LD_MUX sets the output value of the LD pin.
All the outputs logic is active high when LD_TYPE = 3 (Output). All the outputs logic is active low when
LD_TYPE = 4 (Output Inverted). For example, when LD_MUX = 0 (Logic Low) and LD_TYPE = 3 (Output) then
Status_LD outputs a logic low. When LD_MUX = 0 (Logic Low) and LD_TYPE = 4 (Output Inverted) then
Status_LD outputs a logic high.
Table 53. LD_MUX, 5 Bits
R12[31:27]
(1)
MODE
0 (0x00)
Logic Low
1 (0x01)
PLL1 DLD
2 (0x02)
PLL2 DLD
3 (0x03)
PLL1 and PLL2 DLD
4 (0x04)
Holdover Status
5 (0x05)
DAC Locked
6 (0x06)
Reserved
7 (0x07)
uWire Readback
8 (0x08)
DAC Rail
9 (0x09)
DAC Low
10 (0x0A)
DAC High
11 (0x0B)
PLL1_N
12 (0x0C)
PLL1_N/2
13 (0x0D)
PLL2 N
14 (0x0E)
PLL2 N/2
15 (0x0F)
PLL1_R
16 (0x10)
PLL1_R/2
17 (0x11)
PLL2 R
18 (0x12)
PLL2 R/2
(1)
(1)
Only valid when HOLDOVER_MUX is not set to 2 (PLL2_DLD) or 3 (PLL1 and PLL2 DLD).
8.6.3.5.2 LD_TYPE
Sets the IO type of the LD pin.
Table 54. LD_TYPE, 3 Bits
74
R12[26:24]
POLARITY
0 (0x00)
Reserved
1 (0x01)
Reserved
2 (0x02)
Reserved
3 (0x03)
Output (push-pull)
4 (0x04)
Output inverted (push-pull)
5 (0x05)
Output (open source)
6 (0x06)
Output (open drain)
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8.6.3.5.3 SYNC_PLLX_DLD
By setting SYNC_PLLX_DLD a SYNC mode will be engaged (asserted SYNC) until PLL1 and/or PLL2 locks.
SYNC_QUAL must be 0 to use this functionality.
Table 55. SYNC_PLL2_DLD
R12[23]
SYNC MODE FORCED
0
No
1
Yes
Table 56. SYNC_PLL1_DLD
R12[22]
SYNC MODE FORCED
0
No
1
Yes
8.6.3.5.4 EN_TRACK
Enable the DAC to track the PLL1 tuning voltage. For optional use in in holdover mode.
Tracking can be used to monitor PLL1 voltage by readback of DAC_CNT register in any mode.
Table 57. EN_TRACK
R12[8]
DAC TRACKING
0
Disabled
1
Enabled
8.6.3.5.5 HOLDOVER_MODE
Enable the holdover mode.
Table 58. HOLDOVER_MODE, 2 Bits
R12[7:6]
HOLDOVER MODE
0
Reserved
1
Disabled
2
Enabled
3
Reserved
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8.6.3.6 Register R13
8.6.3.6.1 HOLDOVER_MUX
HOLDOVER_MUX sets the output value of the Status_Holdover pin.
The outputs are active high when HOLDOVER_TYPE = 3 (Output). The outputs are active low when
HOLDOVER_TYPE = 4 (Output Inverted).
Table 59. HOLDOVER_MUX, 5 Bits
R13[31:27]
(1)
DEFINITION
0 (0x00)
Logic Low
1 (0x01)
PLL1 DLD
2 (0x02)
PLL2 DLD
3 (0x03)
PLL1 and PLL2 DLD
4 (0x04)
Holdover Status
5 (0x05)
DAC Locked
6 (0x06)
Reserved
7 (0x07)
uWire Readback
8 (0x08)
DAC Rail
9 (0x09)
DAC Low
10 (0x0A)
DAC High
11 (0x0B)
PLL1 N
12 (0x0C)
PLL1 N/2
13 (0x0D)
PLL2 N
14 (0x0E)
PLL2 N/2
15 (0x0F)
PLL1 R
16 (0x10)
PLL1 R/2
17 (0x11)
PLL2 R
18 (0x12)
PLL2 R/2
(1)
(1)
Only valid when LD_MUX is not set to 2 (PLL2_DLD) or 3 (PLL1 and PLL2 DLD).
8.6.3.6.2 HOLDOVER_TYPE
Sets the IO mode of the Status_Holdover pin.
Table 60. HOLDOVER_TYPE, 3 Bits
76
R13[26:24]
POLARITY
0 (0x00)
Reserved
1 (0x01)
Reserved
2 (0x02)
Reserved
3 (0x03)
Output (push-pull)
4 (0x04)
Output inverted (push-pull)
5 (0x05)
Output (open source)
6 (0x06)
Output (open drain)
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8.6.3.6.3 Status_CLKin1_MUX
Status_CLKin1_MUX sets the output value of the Status_CLKin1 pin. If Status_CLKin1_TYPE is set to an input
type, this register has no effect. This MUX register only sets the output signal.
The outputs are active high when Status_CLKin1_TYPE = 3 (Output). The outputs are active low when
Status_CLKin1_TYPE = 4 (Output Inverted).
Table 61. Status_CLKin1_MUX, 3 Bits
R13[22:20]
DEFINITION
0 (0x00)
Logic Low
1 (0x01)
CLKin1 LOS
2 (0x02)
CLKin1 Selected
3 (0x03)
DAC Locked
4 (0x04)
DAC Low
5 (0x05)
DAC High
6 (0x06)
uWire Readback
8.6.3.6.4 Status_CLKin0_TYPE
Status_CLKin0_TYPE sets the IO type of the Status_CLKin0 pin.
Table 62. Status_CLKin0_TYPE, 3 Bits
R13[18:16]
DEFINITION
0 (0x00)
Input
1 (0x01)
Input /w pull-up resistor
2 (0x02)
Input /w pull-down resistor
3 (0x03)
Output (push-pull)
4 (0x04)
Output inverted (push-pull)
5 (0x05)
Output (open source)
6 (0x06)
Output (open drain)
8.6.3.6.5 DISABLE_DLD1_DET
DISABLE_DLD1_DET disables the HOLDOVER mode from being activated when PLL1 lock detect signal
transitions from high to low.
When using Pin Select Mode as the input clock switch mode, this bit should normally be set.
Table 63. DISABLE_DLD1_DET
R13[15]
HOLDOVER DLD1 DETECT
0
PLL1 DLD causes clock switch event
1
PLL1 DLD does not cause clock switch event
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8.6.3.6.6 Status_CLKin0_MUX
CLKin0_MUX sets the output value of the Status_CLKin0 pin. If Status_CLKin0_TYPE is set to an input type, this
register has no effect. This MUX register only sets the output signal.
The outputs logic is active high when Status_CLKin0_TYPE = 3 (Output). The outputs logic is active low when
Status_CLKin0_TYPE = 4 (Output Inverted).
Table 64. Status_CLKin0_MUX, 3 Bits
R13[14:12]
DIVIDE
0 (0x00)
Logic Low
1 (0x01)
CLKin0 LOS
2 (0x02)
CLKin0 Selected
3 (0x03)
DAC Locked
4 (0x04)
DAC Low
5 (0x05)
DAC High
6 (0x06)
uWire Readback
8.6.3.6.7 CLKin_SELECT_MODE
CLKin_SELECT_MODE sets the mode used in determining reference CLKin for PLL1.
Table 65. CLKin_SELECT_MODE, 3 Bits
R13[11:9]
MODE
0 (0x00)
CLKin0 Manual
1 (0x01)
CLKin1 Manual
2 (0x02)
Reserved
3 (0x03)
Pin Select Mode
4 (0x04)
Auto Mode
5 (0x05)
Reserved
6 (0x06)
Auto mode and next clock pin select
7 (0x07)
Reserved
8.6.3.6.8 CLKin_Sel_INV
CLKin_Sel_INV sets the input polarity of Status_CLKin0 and Status_CLKin1 pins.
Inversion for Status 0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06.
Table 66. CLKin_Sel_INV
78
R13[8]
INPUT
0
Active High
1
Active Low
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8.6.3.6.9 EN_CLKinX
Each clock input can individually be enabled to be used during auto-switching CLKin_SELECT_MODE. Clock
input switching priority is always CLKin0 → CLKin1.
Table 67. EN_CLKin1
R13[6]
ENABLED
0
No
1
Yes
Table 68. EN_CLKin0
R13[5]
ENABLED
0
No
1
Yes
8.6.3.7 Register 14
8.6.3.7.1 LOS_TIMEOUT
This bit controls the amount of time in which no activity on a CLKin causes LOS (Loss-of-Signal) to be asserted.
Table 69. LOS_TIMEOUT, 2 Bits
R14[31:30]
TIMEOUT
0 (0x00)
1200 ns, 420 kHz
1 (0x01)
206 ns, 2.5 MHz
2 (0x02)
52.9 ns, 10 MHz
3 (0x03)
23.7 ns, 22 MHz
8.6.3.7.2 EN_LOS
Enables the LOS (Loss-of-Signal) timeout control.
Table 70. EN_LOS
R14[28]
LOS
0
Disabled
1
Enabled
8.6.3.7.3 Status_CLKin1_TYPE
Sets the IO type of the Status_CLKin1 pin.
Table 71. Status_CLKin1_TYPE, 3 Bits
R14[26:24]
POLARITY
0 (0x00)
Input
1 (0x01)
Input /w pull-up resistor
2 (0x02)
Input /w pull-down resistor
3 (0x03)
Output (push-pull)
4 (0x04)
Output inverted (push-pull)
5 (0x05)
Output (open source)
6 (0x06)
Output (open drain)
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8.6.3.7.4 CLKinX_BUF_TYPE, PLL1 CLKinX/CLKinX* Buffer Type
There are two input buffer types for the PLL1 reference clock inputs: either bipolar or CMOS. Bipolar is
recommended for differential inputs such as LVDS and LVPECL. CMOS is recommended for DC coupled single
ended inputs.
When using bipolar, CLKinX and CLKinX* input pins must be AC coupled when using a differential or single
ended input.
When using CMOS, CLKinX and CLKinX* input pins may be AC or DC coupled with a differential input.
When using CMOS in single ended mode, the unused clock input pin (CLKinX or CLKinX*) must be AC
grounded. The used clock input pin (CLKinX* or CLKinX) may be AC or DC coupled to the signal source.
The programming addresses table shows at what register and address the specified CLKinX_BUF_TYPE bit is
located.
The CLKinX_BUF_TYPE table shows the programming definition for these registers.
Table 72. CLKinX_BUF_TYPE Programming Addresses
CLKinX_BUF_TYPE
PROGRAMMING ADDRESS
CLKin1_BUF_TYPE
R14[21]
CLKin0_BUF_TYPE
R14[20]
Table 73. CLKinX_BUF_TYPE
R14[21, 20]
CLKinX BUFFER TYPE
0
Bipolar
1
CMOS
8.6.3.7.5 DAC_HIGH_TRIP
Voltage from Vcc at which holdover mode is entered if EN_VTUNE_RAIL_DAC is enabled. This will also set flags
which can be monitored out Status_LD/Status_Holdover pins.
Step size is ~51 mV
Table 74. DAC_HIGH_TRIP, 6 Bits
80
R14[19:14]
TRIP VOLTAGE FROM VCC (V)
0 (0x00)
1 × Vcc / 64
1 (0x01)
2 × Vcc / 64
2 (0x02)
3 × Vcc / 64
3 (0x03)
4 × Vcc / 64
4 (0x04)
5 × Vcc / 64
...
...
61 (0x3D)
62 × Vcc / 64
62 (0x3E)
63 × Vcc / 64
63 (0x3F)
64 × Vcc / 64
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8.6.3.7.6 DAC_LOW_TRIP
Voltage from GND at which holdover mode is entered if EN_VTUNE_RAIL_DAC is enabled. This will also set
flags which can be monitored out Status_LD/Status_Holdover pins.
Step size is ~51 mV
Table 75. DAC_LOW_TRIP, 6 Bits
R14[11:6]
TRIP VOLTAGE from GND (V)
0 (0x00)
1 × Vcc / 64
1 (0x01)
2 × Vcc / 64
2 (0x02)
3 × Vcc / 64
3 (0x03)
4 × Vcc / 64
4 (0x04)
5 × Vcc / 64
...
...
61 (0x3D)
62 × Vcc / 64
62 (0x3E)
63 × Vcc / 64
63 (0x3F)
64 × Vcc / 64
8.6.3.7.7 EN_VTUNE_RAIL_DET
Enables the DAC Vtune rail detection. When the DAC achieves a specified Vtune, if this bit is enabled, the
current clock input is considered invalid and an input clock switch event is generated.
Table 76. EN_VTUNE_RAIL_DET
R14[5]
STATE
0
Disabled
1
Enabled
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8.6.3.8 REGISTER 15
8.6.3.8.1 MAN_DAC
Sets the DAC value when in manual DAC mode in ~3.2 mV steps.
Table 77. MAN_DAC, 10 Bits
R15[31:22]
DAC VOLTAGE
0 (0x00)
0 × Vcc / 1023
1 (0x01)
1 × Vcc / 1023
2 (0x02)
2 × Vcc / 1023
...
...
1023 (0x3FF)
1023 × Vcc / 1023
8.6.3.8.2 EN_MAN_DAC
This bit enables the manual DAC mode.
Table 78. EN_MAN_DAC
R15[20]
DAC MODE
0
Automatic
1
Manual
8.6.3.8.3 HOLDOVER_DLD_CNT
Lock must be valid for this many clocks of PLL1 PDF before holdover mode is exited.
Table 79. HOLDOVER_DLD_CNT, 14 Bits
R15[19:6]
EXIT COUNTS
0 (0x00)
Reserved
1 (0x01)
1
2 (0x02)
2
...
...
16,383 (0x3FFF)
16,383
8.6.3.8.4 FORCE_HOLDOVER
This bit forces the holdover mode.
When holdover is forced, if in fixed CPout1 mode (EN_TRACK = 0 or 1, EN_MAN_DAC =1) , then the DAC will
set the programmed MAN_DAC value. If in tracked CPout1 mode (EN_TRACK = 1, EN_MAN_DAC = 0,
EN_VTUNE_RAIL_DET = 0), then the DAC will set the current tracked DAC value.
Setting FORCE_HOLDOVER does not constitute a clock input switch event unless DISABLE_DLD1_DET = 0,
since when in holdover mode, PLL1_DLD = 0 will trigger the clock input switch event.
Table 80. FORCE_HOLDOVER
82
R15[5]
HOLDOVER
0
Disabled
1
Enabled
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8.6.3.9 Register 16
8.6.3.9.1 XTAL_LVL
Sets the peak amplitude on the tunable crystal.
Increasing this value can improve the crystal oscillator phase noise performance at the cost of increased current
and higher crystal power dissipation levels.
Table 81. XTAL_LVL, 2 Bits
(1)
R15[31:22]
PEAK AMPLITUDE (1)
0 (0x00)
1.65 Vpp
1 (0x01)
1.75 Vpp
2 (0x02)
1.90 Vpp
3 (0x03)
2.05 Vpp
At crystal frequency of 20.48 MHz
8.6.3.10 Register 23
This register must not be programmed, it is a readback only register.
8.6.3.10.1 DAC_CNT
The DAC_CNT register is 10 bits in size and located at readback bit position R[23:14]. When using tracking
mode for holdover, the DAC value can be readback at this address.
8.6.3.11 Register 24
8.6.3.11.1 PLL2_C4_LF, PLL2 Integrated Loop Filter Component
Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without
requiring external components.
Internal loop filter capacitor C4 can be set according to Table 82.
Table 82. PLL2_C4_LF, 4 Bits
R24[31:28]
LOOP FILTER CAPACITANCE (pF)
0 (0x00)
10 pF
1 (0x01)
15 pF
2 (0x02)
29 pF
3 (0x03)
34 pF
4 (0x04)
47 pF
5 (0x05)
52 pF
6 (0x06)
66 pF
7 (0x07)
71 pF
8 (0x08)
103 pF
9 (0x09)
108 pF
10 (0x0A)
122 pF
11 (0x0B)
126 pF
12 (0x0C)
141 pF
13 (0x0D)
146 pF
14 (0x0E)
Reserved
15 (0x0F)
Reserved
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8.6.3.11.2 PLL2_C3_LF, PLL2 Integrated Loop Filter Component
Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without
requiring external components.
Internal loop filter capacitor C3 can be set according to Table 83.
Table 83. PLL2_C3_LF, 4 Bits
R24[27:24]
LOOP FILTER CAPACITANCE (pF)
0 (0x00)
10 pF
1 (0x01)
11 pF
2 (0x02)
15 pF
3 (0x03)
16 pF
4 (0x04)
19 pF
5 (0x05)
20 pF
6 (0x06)
24 pF
7 (0x07)
25 pF
8 (0x08)
29 pF
9 (0x09)
30 pF
10 (0x0A)
33 pF
11 (0x0B)
34 pF
12 (0x0C)
38 pF
13 (0x0D)
39 pF
14 (0x0E)
Reserved
15 (0x0F)
Reserved
8.6.3.11.3 PLL2_R4_LF, PLL2 Integrated Loop Filter Component
Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without
requiring external components.
Internal loop filter resistor R4 can be set according to Table 84.
Table 84. PLL2_R4_LF, 3 Bits
84
R24[22:20]
RESISTANCE
0 (0x00)
200 Ω
1 (0x01)
1 kΩ
2 (0x02)
2 kΩ
3 (0x03)
4 kΩ
4 (0x04)
16 kΩ
5 (0x05)
Reserved
6 (0x06)
Reserved
7 (0x07)
Reserved
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8.6.3.11.4 PLL2_R3_LF, PLL2 Integrated Loop Filter Component
Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without
requiring external components.
Internal loop filter resistor R3 can be set according to Table 85.
Table 85. PLL2_R3_LF, 3 Bits
R24[18:16]
RESISTANCE
0 (0x00)
200 Ω
1 (0x01)
1 kΩ
2 (0x02)
2 kΩ
3 (0x03)
4 kΩ
4 (0x04)
16 kΩ
5 (0x05)
Reserved
6 (0x06)
Reserved
7 (0x07)
Reserved
8.6.3.11.5 PLL1_N_DLY
Increasing delay of PLL1_N_DLY will cause the outputs to lead from CLKinX. For use in 0-delay mode.
Table 86. PLL1_N_DLY, 3 Bits
R24[14:12]
DEFINITION
0 (0x00)
0 ps
1 (0x01)
205 ps
2 (0x02)
410 ps
3 (0x03)
615 ps
4 (0x04)
820 ps
5 (0x05)
1025 ps
6 (0x06)
1230 ps
7 (0x07)
1435 ps
8.6.3.11.6 PLL1_R_DLY
Increasing delay of PLL1_R_DLY will cause the outputs to lag from CLKinX. For use in 0-delay mode.
Table 87. PLL1_R_DLY, 3 Bits
R24[10:8]
DEFINITION
0 (0x00)
0 ps
1 (0x01)
205 ps
2 (0x02)
410 ps
3 (0x03)
615 ps
4 (0x04)
820 ps
5 (0x05)
1025 ps
6 (0x06)
1230 ps
7 (0x07)
1435 ps
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8.6.3.11.7 PLL1_WND_SIZE
PLL1_WND_SIZE sets the window size used for digital lock detect for PLL1. If the phase error between the
reference and feedback of PLL1 is less than specified time, then the PLL1 lock counter increments.
Refer to Digital Lock Detect Frequency Accuracy for more information.
Table 88. PLL1_WND_SIZE, 2 Bits
86
R24[7:6]
DEFINITION
0
5.5 ns
1
10 ns
2
18.6 ns
3
40 ns
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8.6.3.12 Register 25
8.6.3.12.1 DAC_CLK_DIV
The DAC update clock frequency is the PLL1 phase detector frequency divided by the divisor listed in Table 89.
Table 89. DAC_CLK_DIV, 10 Bits
R25[31:22]
DIVIDE
0 (0x00)
Reserved
1 (0x01)
1
2 (0x02)
2
3 (0x03)
3
...
...
1,022 (0x3FE)
1022
1,023 (0x3FF)
1023
8.6.3.12.2 PLL1_DLD_CNT
The reference and feedback of PLL1 must be within the window of phase error as specified by PLL1_WND_SIZE
for this many phase detector cycles before PLL1 digital lock detect is asserted.
Refer to Digital Lock Detect Frequency Accuracy for more information.
Table 90. PLL1_DLD_CNT, 14 Bits
R25[19:6]
VALUE
0 (0x0000)
Reserved
1 (0x0001)
1
2 (0x0002)
2
3 (0x0003)
3
...
...
16,382 (0x3FFE)
16,382
16,383 (0x3FFF)
16,383
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8.6.3.13 Register 26
8.6.3.13.1 PLL2_WND_SIZE
PLL2_WND_SIZE sets the window size used for digital lock detect for PLL2. If the phase error between the
reference and feedback of PLL2 is less than specified time, then the PLL2 lock counter increments. This value
must be programmed to 2 (3.7 ns).
Refer to Digital Lock Detect Frequency Accuracy for more information.
Table 91. PLL2_WND_SIZE, 2 Bits
R26[31:30]
DEFINITION
0 (0x00)
Reserved
1 (0x01)
Reserved
2 (0x02)
3.7 ns
3 (0x03)
Reserved
8.6.3.13.2 EN_PLL2_REF_2X, PLL2 Reference Frequency Doubler
Enabling the PLL2 reference frequency doubler allows for higher phase detector frequencies on PLL2 than would
normally be allowed with the given VCXO or Crystal frequency.
Higher phase detector frequencies reduces the PLL N values which makes the design of wider loop bandwidth
filters possible.
Table 92. EN_PLL2_REF_2X
R26[29]
DESCRIPTION
0
Reference frequency normal
1
Reference frequency doubled (2x). See PLL2 Frequency Doubler
8.6.3.13.3 PLL2_CP_POL, PLL2 Charge Pump Polarity
PLL2_CP_POL sets the charge pump polarity for PLL2. The internal VCO requires the negative charge pump
polarity to be selected. Many VCOs use positive slope.
A positive slope VCO increases output frequency with increasing voltage. A negative slope VCO decreases
output frequency with increasing voltage.
Table 93. PLL2_CP_POL
88
R26[28]
DESCRIPTION
0
Negative Slope VCO/VCXO
1
Positive Slope VCO/VCXO
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8.6.3.13.4 PLL2_CP_GAIN, PLL2 Charge Pump Current
This bit programs the PLL2 charge pump output current level. Table 94 also illustrates the impact of the PLL2
TRI-STATE bit in conjunction with PLL2_CP_GAIN.
Table 94. PLL2_CP_GAIN, 2 Bits
R26[27:26]
PLL2_CP_TRI
R26[5]
CHARGE PUMP CURRENT (µA)
X
1
Hi-Z
0 (0x00)
0
100
1 (0x01)
0
400
2 (0x02)
0
1600
3 (0x03)
0
3200
8.6.3.13.5 PLL2_DLD_CNT
The reference and feedback of PLL2 must be within the window of phase error as specified by PLL2_WND_SIZE
for PLL2_DLD_CNT cycles before PLL2 digital lock detect is asserted.
Refer to Digital Lock Detect Frequency Accuracy for more information
Table 95. PLL2_DLD_CNT, 14 Bits
R26[19:6]
VALUE
0 (0x00)
Reserved
1 (0x01)
1
2 (0x02)
2
3 (0x003)
3
...
...
16,382 (0x3FFE)
16,382
16,383 (0x3FFF)
16,383
8.6.3.13.6 PLL2_CP_TRI, PLL2 Charge Pump TRI-STATE
This bit allows for the PLL2 charge pump output pin, CPout2, to be placed into TRI-STATE.
Table 96. PLL2_CP_TRI
R26[5]
DESCRIPTION
0
PLL2 CPout2 is active
1
PLL2 CPout2 is at TRI-STATE
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8.6.3.14 REGISTER 27
8.6.3.14.1 PLL1_CP_POL, PLL1 Charge Pump Polarity
PLL1_CP_POL sets the charge pump polarity for PLL1. Many VCXOs use positive slope.
A positive slope VCXO increases output frequency with increasing voltage. A negative slope VCXO decreases
output frequency with increasing voltage.
Table 97. PLL1_CP_POL
R27[28]
DESCRIPTION
0
Negative Slope VCO/VCXO
1
Positive Slope VCO/VCXO
8.6.3.14.2 PLL1_CP_GAIN, PLL1 Charge Pump Current
This bit programs the PLL1 charge pump output current level. Table 98 also illustrates the impact of the PLL1
TRI-STATE bit in conjunction with PLL1_CP_GAIN.
Table 98. PLL1_CP_GAIN, 2 Bits
R26[27:26]
PLL1_CP_TRI
R27[5]
CHARGE PUMP CURRENT (µA)
X
1
Hi-Z
0 (0x00)
0
100
1 (0x01)
0
200
2 (0x02)
0
400
3 (0x03)
0
1600
8.6.3.14.3 CLKinX_PreR_DIV
The pre-R dividers before the PLL1 R divider can be programmed such that when the active clock input is
switched, the frequency at the input of the PLL1 R divider will be the same. This allows PLL1 to stay in lock
without needing to re-program the PLL1 R register when different clock input frequencies are used. This is
especially useful in the auto CLKin switching modes.
Table 99. CLKinX_PreR_DIV Programming Addresses
CLKinX_PreR_DIV
PROGRAMMING ADDRESS
CLKin1_PreR_DIV
R27[23:22]
CLKin0_PreR_DIV
R27[21:20]
Table 100. CLKinX_PreR_DIV, 2 Bits
90
R27[23:22, 21:20]
DIVIDE
0 (0x00)
1
1 (0x01)
2
2 (0x02)
4
3 (0x03)
8
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8.6.3.14.4 PLL1_R, PLL1 R Divider
The reference path into the PLL1 phase detector includes the PLL1 R divider. Refer to PLL Programming for
more information on how to program the PLL dividers to lock the PLL.
The valid values for PLL1_R are shown in Table 101.
Table 101. PLL1_R, 14 Bits
R27[19:6]
DIVIDE
0 (0x00)
Reserved
1 (0x01)
1
2 (0x02)
2
3 (0x03)
3
...
...
16,382 (0x3FFE)
16,382
16,383 (0x3FFF)
16,383
8.6.3.14.5 PLL1_CP_TRI, PLL1 Charge Pump TRI-STATE
This bit allows for the PLL1 charge pump output pin, CPout1, to be placed into TRI-STATE.
Table 102. PLL1_CP_TRI
R27[5]
DESCRIPTION
0
PLL1 CPout1 is active
1
PLL1 CPout1 is at TRI-STATE
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8.6.3.15 Register 28
8.6.3.15.1 PLL2_R, PLL2 R Divider
The reference path into the PLL2 phase detector includes the PLL2 R divider.
Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.
The valid values for PLL2_R are shown in Table 103.
Table 103. PLL2_R, 12 Bits
(1)
R28[31:20]
DIVIDE
0 (0x00)
Not Valid
1 (0x01)
1 (1).
See PLL2 Frequency Doubler
2 (0x02)
2
3 (0x03)
3
...
...
4,094 (0xFFE)
4,094
4,095 (0xFFF)
4,095
When using PLL2_R divide value of 1, the PLL2 reference doubler should be used (EN_PLL2_REF_2X = 1).
8.6.3.15.2 PLL1_N, PLL1 N Divider
The feedback path into the PLL1 phase detector includes the PLL1 N divider.
Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.
The valid values for PLL1_N are shown in Table 104.
Table 104. PLL1_N, 14 Bits
92
R28[19:6]
DIVIDE
0 (0x00)
Not Valid
1 (0x01)
1
2 (0x02)
2
...
...
4,095 (0xFFF)
4,095
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8.6.3.16 Register 29
8.6.3.16.1 OSCin_FREQ, PLL2 Oscillator Input Frequency Register
The frequency of the PLL2 reference input to the PLL2 Phase Detector (OSCin/OSCin* port) must be
programmed in order to support proper operation of the frequency calibration routine which locks the internal
VCO to the target frequency.
Table 105. OSCin_FREQ, 3 Bits
R29[26:24]
OSCin FREQUENCY
0 (0x00)
0 to 63 MHz
1 (0x01)
>63 MHz to 127 MHz
2 (0x02)
>127 MHz to 255 MHz
3 (0x03)
Reserved
4 (0x04)
>255 MHz to 400 MHz
8.6.3.16.2 PLL2_FAST_PDF, High PLL2 Phase Detector Frequency
When PLL2 phase detector frequency is greater than 100 MHz, set the PLL2_FAST_PDF to ensure proper
operation of device.
Table 106. PLL2_FAST_PDF
R29[23]
PLL2 PDF
0
Less than or
equal to 100 MHz
1
Greater than 100 MHz
8.6.3.16.3 PLL2_N_CAL, PLL2 N Calibration Divider
During the frequency calibration routine, the PLL uses the divide value of the PLL2_N_CAL register instead of
the divide value of the PLL2_N register to lock the VCO to the target frequency.
NOTE: Unless in 0-delay mode, PLL2_N_CAL should be set equal to PLL2_N
Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.
Table 107. PLL2_N_CAL, 18 Bits
R29[22:5]
DIVIDE
0 (0x00)
Not Valid
1 (0x01)
1
2 (0x02)
2
...
...
262,143 (0x3FFFF)
262,143
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8.6.3.17 Register 30
If an internal VCO mode is used, programming Register 30 triggers the frequency calibration routine. This
calibration routine will also generate a SYNC event. See Clock Output Synchronization (SYNC) for more details
on a SYNC.
8.6.3.17.1 PLL2_P, PLL2 N Prescaler Divider
The PLL2 N Prescaler divides the output of the VCO as selected by VCO_MUX and is connected to the PLL2 N
divider.
Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.
Table 108. PLL2_P, 3 Bits
R30[26:24]
DIVIDE VALUE
0 (0x00)
8
1 (0x01)
2
2 (0x02)
2
3 (0x03)
3
4 (0x04)
4
5 (0x05)
5
6 (0x06)
6
7 (0x07)
7
8.6.3.17.2 PLL2_N, PLL2 N Divider
The feeback path into the PLL2 phase detector includes the PLL2 N divider.
Each time register 30 is updated via the MICROWIRE interface, a frequency calibration routine runs to lock the
VCO to the target frequency. During this calibration PLL2_N is substituted with PLL2_N_CAL.
Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.
The valid values for PLL2_N are shown in Table 109.
Table 109. PLL2_N, 18 Bits
R30[22:5]
DIVIDE
0 (0x00)
Not Valid
1 (0x01)
1
2 (0x02)
2
...
262,143 (0x3FFFF)
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8.6.3.18 Register 31
8.6.3.18.1 READBACK_LE
Sets the required state of the LEuWire pin when performing register readback.
Refer to Readback.
Table 110. READBACK_LE
R31[21]
DEFINITION
0
LE must be low for readback
1
LE must be high for readback
8.6.3.18.2 READBACK_ADDR
Sets the address of the register to read back when performing readback.
When reading register 12, the READBACK_ADDR will be read back at R12[20:16].
When reading back from R31 bits 6 to 31 should be ignored. Only uWire_LOCK is valid.
Refer to Register Readback for more information on readback.
Table 111. READBACK_ADDR, 5 Bits
R31[20:16]
REGISTER
0 (0x00)
R0
1 (0x01)
R1
2 (0x02)
R2
3 (0x03)
R3
4 (0x04)
R4
5 (0x05)
R5
6 (0x06)
R6
7 (0x07)
R7
8 (0x08)
R8
9 (0x09)
Reserved
10 (0x0A)
R10
11 (0x0B)
R11
12 (0x0C)
R12
13 (0x0D)
R13
14 (0x0E)
R14
15 (0x0F)
R15
16 (0x10)
Reserved
17 (0x11)
Reserved
...
...
22 (0x16)
Reserved
23 (0x17)
Reserved
24 (0x18)
R24
25 (0x19)
R25
26 (0x1A)
R26
27 (0x1B)
R27
28 (0x1C)
R28
29 (0x1D)
R29
30 (0x1E)
R30
31 (0x1F)
R31
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8.6.3.18.3 uWire_LOCK
Setting uWire_LOCK will prevent any changes to uWire registers R0 to R30. Only by clearing the uWire_LOCK
bit in R31 can the uWire registers be unlocked and written to once more.
It is not necessary to lock the registers to perform a readback operation.
Table 112. uWire_LOCK
R31[5]
96
STATE
0
Registers unlocked
1
Registers locked, Write-protect
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
To assist customers in frequency planning and design of loop filters, Texas Instruments provides the Clock
Design Tool and Clock Architect.
9.1.1 Loop Filter
Each PLL of the LMK0480x family requires a dedicated loop filter.
9.1.1.1 PLL1
The loop filter for PLL1 must be connected to the CPout1 pin. Figure 20 shows a simple 2-pole loop filter. The
output of the filter drives an external VCXO module or discrete implementation of a VCXO using a crystal
resonator and external varactor diode. Higher order loop filters may be implemented using additional external R
and C components. It is recommended the loop filter for PLL1 result in a total closed loop bandwidth in the range
of 10 Hz to 200 Hz. The design of the loop filter is application specific and highly dependent on parameters such
as the phase noise of the reference clock, VCXO phase noise, and phase detector frequency for PLL1. TI's
Clock Conditioner Owner’s Manual covers this topic in detail and Texas Instruments Clock Design Tool can be
used to simulate loop filter designs for both PLLs. These resources may be found at:
http://www.ti.com/lsds/ti/analog/clocksandtimers/clocks_and_timers.page
9.1.1.2 PLL2
As shown in Figure 20, the charge pump for PLL2 is directly connected to the optional internal loop filter
components, which are normally used only if either a third or fourth pole is needed. The first and second poles
are implemented with external components. The loop must be designed to be stable over the entire applicationspecific tuning range of the VCO. The designer should note the range of KVCO listed in the table of Electrical
Characteristics and how this value can change over the expected range of VCO tuning frequencies. Because
loop bandwidth is directly proportional to KVCO, the designer should model and simulate the loop at the expected
extremes of the desired tuning range, using the appropriate values for KVCO.
When designing with the integrated loop filter of the LMK0480x family, considerations for minimum resistor
thermal noise often lead one to the decision to design for the minimum value for integrated resistors, R3 and R4.
Both the integrated loop filter resistors (R3 and R4) and capacitors (C3 and C4) also restrict the maximum loop
bandwidth. However, these integrated components do have the advantage that they are closer to the VCO and
can therefore filter out some noise and spurs better than external components. For this reason, a common
strategy is to minimize the internal loop filter resistors and then design for the largest internal capacitor values
that permit a wide enough loop bandwidth. In situations where spur requirements are very stringent and there is
margin on phase noise, a feasible strategy would be to design a loop filter with integrated resistor values larger
than their minimum value.
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Application Information (continued)
LMK0480x PLL1
LMK0480x PLL2
PLL2 Internal Loop Filter
R3
PLL2
Phase
Detector
PLL1
Phase
Detector
Internal VCO
R4
C3
C4
CPout2
CPout1
External VCXO
PLL1 External Loop
Filter
LF1_C2
LF1_C1
LF2_C2
LF2_C1
LF1_R2
PLL2 External Loop
Filter
LF2_R2
Figure 20. PLL1 and PLL2 Loop Filters
9.1.2 Driving CLKin and OSCin Inputs
9.1.2.1 Driving CLKin Pins with a Differential Source
Both CLKin ports can be driven by differential signals. It is recommended that the input mode be set to bipolar
(CLKinX_BUF_TYPE = 0) when using differential reference clocks. The LMK0480x family internally biases the
input pins so the differential interface should be AC coupled. The recommended circuits for driving the CLKin
pins with either LVDS or LVPECL are shown in Figure 21 and Figure 22.
100:Trace
(Differential)
LVDS
100:
CLKinX
0.1 PF
LMK0480x
Input
0.1 PF
CLKinX*
240:
Figure 21. CLKinX/X* Termination for an LVDS Reference Clock Source
LVPECL
Ref Clk
0.1 PF
0.1 PF
100:Trace
(Differential)
100:
CLKinX
0.1 PF
0.1 PF
LMK0480x
Input
240:
CLKinX*
Figure 22. CLKinX/X* Termination for an LVPECL Reference Clock Source
Finally, a reference clock source that produces a differential sine wave output can drive the CLKin pins using the
following circuit. Note: the signal level must conform to the requirements for the CLKin pins listed in Electrical
Characteristics.
98
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Application Information (continued)
CLKinX
0.1 PF
100:
100:Trace
(Differential)
0.1 PF
Differential
Sinewave Clock
Source
LMK0480x
Input
CLKinX*
Figure 23. CLKinX/X* Termination for a Differential Sinewave Reference Clock Source
9.1.2.2 Driving CLKin Pins with a Single-Ended Source
The CLKin pins of the LMK0480x family can be driven using a single-ended reference clock source, for example,
either a sine wave source or an LVCMOS/LVTTL source. Either AC coupling or DC coupling may be used. In the
case of the sine wave source that is expecting a 50-Ω load, it is recommended that AC coupling be used as
shown in Figure 24 with a 50-Ω termination.
NOTE
The signal level must conform to the requirements for the CLKin pins listed in Electrical
Characteristics. CLKinX_BUF_TYPE in Register 11 is recommended to be set to bipolar
mode (CLKinX_BUF_TYPE = 0).
0.1 PF
50:Trace
Clock Source
CLKinX
50:
0.1 PF
LMK0480x
CLKinX*
Figure 24. CLKinX/X* Single-Ended Termination
If the CLKin pins are being driven with a single-ended LVCMOS/LVTTL source, either DC coupling or AC
coupling may be used. If DC coupling is used, the CLKinX_BUF_TYPE should be set to MOS buffer mode
(CLKinX_BUF_TYPE = 1) and the voltage swing of the source must meet the specifications for DC coupled,
MOS-mode clock inputs given in the table of Electrical Characteristics. If AC coupling is used, the
CLKinX_BUF_TYPE should be set to the bipolar buffer mode (CLKinX_BUF_TYPE = 0). The voltage swing at
the input pins must meet the specifications for AC coupled, bipolar mode clock inputs given in the table of
Electrical Characteristics. In this case, some attenuation of the clock input level may be required. A simple
resistive divider circuit before the AC coupling capacitor is sufficient.
Figure 25. DC Coupled LVCMOS/LVTTL Reference Clock
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Application Information (continued)
9.1.3 Termination and Use of Clock Output (Drivers)
When terminating clock drivers keep in mind these guidelines for optimum phase noise and jitter performance:
• Transmission line theory should be followed for good impedance matching to prevent reflections.
• Clock drivers should be presented with the proper loads. For example:
– LVDS drivers are current drivers and require a closed current loop.
– LVPECL drivers are open emitters and require a DC path to ground.
• Receivers should be presented with a signal biased to their specified DC bias level (common mode voltage)
for proper operation. Some receivers have self-biasing inputs that automatically bias to the proper voltage
level. In this case, the signal should normally be AC coupled.
It is possible to drive a non-LVPECL or non-LVDS receiver with an LVDS or LVPECL driver as long as the above
guidelines are followed. Check the datasheet of the receiver or input being driven to determine the best
termination and coupling method to be sure that the receiver is biased at its optimum DC voltage (common mode
voltage). For example, when driving the OSCin/OSCin* input of the LMK0480x family, OSCin/OSCin* should be
AC coupled because OSCin/OSCin* biases the signal to the proper DC level (See Figure 39) This is only slightly
different from the AC coupled cases described in Driving CLKin Pins with a Single-Ended Source because the
DC blocking capacitors are placed between the termination and the OSCin/OSCin* pins, but the concept remains
the same. The receiver (OSCin/OSCin*) sets the input to the optimum DC bias voltage (common mode voltage),
not the driver.
9.1.3.1 Termination for DC Coupled Differential Operation
For DC coupled operation of an LVDS driver, terminate with 100 Ω as close as possible to the LVDS receiver as
shown in Figure 26.
100:Trace
(Differential)
LVDS
Driver
100:
CLKoutX
LVDS
Receiver
CLKoutX*
Figure 26. Differential LVDS Operation, DC Coupling, No Biasing of the Receiver
For DC coupled operation of an LVPECL driver, terminate with 50 Ω to VCC - 2 V as shown in Figure 27.
Alternatively, terminate with a Thevenin equivalent circuit (120-Ω resistor connected to VCC and an 82-Ω resistor
connected to ground with the driver connected to the junction of the 120-Ω and 82-Ω resistors) as shown in
Figure 28 for VCC = 3.3 V.
50:
Vcc - 2 V
CLKoutX
100:Trace
(Differential)
LVPECL
Driver
LVPECL
Receiver
50:
CLKoutX*
Vcc - 2 V
Figure 27. Differential LVPECL Operation, DC Coupling
100
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Application Information (continued)
82:
120:
Vcc
CLKoutX
100:Trace
(Differential)
LVPECL
Driver
LVPECL
Receiver
82:
120:
CLKoutX*
Vcc
Figure 28. Differential LVPECL Operation, DC Coupling, Thevenin Equivalent
9.1.3.2 Termination for AC Coupled Differential Operation
AC coupling allows for shifting the DC bias level (common mode voltage) when driving different receiver
standards. Since AC coupling prevents the driver from providing a DC bias voltage at the receiver it is important
to ensure the receiver is biased to its ideal DC level.
When driving non-biased LVDS receivers with an LVDS driver, the signal may be AC coupled by adding DC
blocking capacitors, however the proper DC bias point needs to be established at the receiver. One way to do
this is with the termination circuitry in Figure 29.
0.1 PF
LVDS
Driver
100:Trace
(Differential)
50:
CLKoutX
LVDS
Receiver
CLKoutX*
50:
Vbias
0.1 PF
Figure 29. Differential LVDS Operation, AC Coupling,
External Biasing at the Receiver
Some LVDS receivers may have internal biasing on the inputs. In this case, the circuit shown in Figure 29 is
modified by replacing the 50-Ω terminations to Vbias with a single 100-Ω resistor across the input pins of the
receiver, as shown in Figure 30. When using AC coupling with LVDS outputs, there may be a startup delay
observed in the clock output due to capacitor charging. The previous figures employ a 0.1 µF capacitor. This
value may need to be adjusted to meet the startup requirements for a particular application.
LVDS
Driver
100:Trace
(Differential)
100:
0.1 PF
LVDS
Receiver
0.1 PF
Figure 30. LVDS Termination for a Self-Biased Receiver
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Application Information (continued)
LVPECL drivers require a DC path to ground. When AC coupling an LVPECL signal use 120-Ω emitter resistors
close to the LVPECL driver to provide a DC path to ground as shown in Figure 31. For proper receiver operation,
the signal should be biased to the DC bias level (common mode voltage) specified by the receiver. The typical
DC bias voltage for LVPECL receivers is 2 V. A Thevenin equivalent circuit (82-Ω resistor connected to VCC and
a 120-Ω resistor connected to ground with the driver connected to the junction of the 82-Ω and 120-Ω resistors)
is a valid termination as shown in Figure 31 for VCC = 3.3 V. Note this Thevenin circuit is different from the DC
coupled example in Figure 28.
82:
120:
0.1 PF
LVPECL
Driver
LVPECL
Receiver
82:
CLKoutX*
100:Trace
(Differential)
120:
0.1 PF
120:
CLKoutX
120:
Vcc
Vcc
Figure 31. Differential LVPECL Operation, AC Coupling, Thevenin Equivalent,
External Biasing at the Receiver
9.1.3.3 Termination for Single-Ended Operation
A balun can be used with either LVDS or LVPECL drivers to convert the balanced, differential signal into an
unbalanced, single-ended signal.
It is possible to use an LVPECL driver as one or two separate 800 mVpp signals. When using only one LVPECL
driver of a CLKoutX/CLKoutX* pair, be sure to properly terminate the unused driver. When DC coupling one of
the LMK0480x family clock LVPECL drivers, the termination should be 50 Ω to VCC - 2 V as shown in Figure 32.
The Thevenin equivalent circuit is also a valid termination as shown in Figure 33 for Vcc = 3.3 V.
50:
Vcc - 2V
CLKoutX
LVPECL
Driver
CLKoutX*
50:Trace
Vcc - 2V
Load
50:
Figure 32. Single-Ended LVPECL Operation, DC Coupling
CLKoutX
Vcc
CLKoutX*
120:
50:Trace
82 :
LVPECL
Driver
82:
120:
Vcc
Load
Figure 33. Single-Ended LVPECL Operation, DC Coupling,
Thevenin Equivalent
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Application Information (continued)
0.1 PF
120:
CLKoutX*
50:Trace
50:
0.1 PF
LVPECL
Driver
50:
CLKoutX
120:
When AC coupling an LVPECL driver use a 120-Ω emitter resistor to provide a DC path to ground and ensure a
50-Ω termination with the proper DC bias level for the receiver. The typical DC bias voltage for LVPECL
receivers is 2 V (See Driving CLKin Pins with a Single-Ended Source). If the companion driver is not used it
should be terminated with either a proper AC or DC termination. This latter example of AC coupling a singleended LVPECL signal can be used to measure single-ended LVPECL performance using a spectrum analyzer or
phase noise analyzer. When using most RF test equipment no DC bias point (0 VDC) is required for safe and
proper operation. The internal 50-Ω termination of the test equipment correctly terminates the LVPECL driver
being measured as shown in Figure 34.
Load
Figure 34. Single-Ended LVPECL Operation, AC Coupling
9.1.4 Frequency Planning with the LMK0480x Family
Calculating the value of the output dividers for use with the LMK0480x family is simple due to the architecture of
the LMK0480x. That is, the VCO divider may be bypassed and the clock output dividers allow for even and odd
output divide values from 2 to 1045. For most applications it is recommended to bypass the VCO divider.
The procedure for determining the needed LMK0480x device and clock output divider values for a set of clock
output frequencies is straightforward.
1. Calculate the least common multiple (LCM) of the clock output frequencies.
2. Determine which VCO ranges will support the target clock output frequencies given the LCM.
3. Determine the clock output divide values based on VCO frequency.
4. Determine the PLL2_P, PLL2_N, and PLL2_R divider values given the OSCin VCXO or crystal frequency
and VCO frequency.
For example, given the following target output frequencies: 200 MHz, 120 MHz, and 25 MHz with a VCXO
frequency of 40 MHz:
• First determine the LCM of the three frequencies. LCM(200 MHz, 120 MHz, 25 MHz) = 600 MHz. The LCM
frequency is the lowest frequency for which all of the target output frequencies are integer divisors of the
LCM. Note: if there is one frequency which causes the LCM to be very large, greater than 3 GHz for
example, determine if there is a single frequency requirement which causes this. It may be possible to select
the VCXO/crystal frequency to satisfy this frequency requirement through OSCout or CLKout6/7/8/9 driven by
OSCin. In this way it is possible to get non-integer related frequencies at the outputs.
• Second, since the LCM is not in a VCO frequency range supported by the LMK0480x family, multiply the
LCM frequency by an integer which causes it to fall into a valid VCO frequency range of an LMK0480x
device. In this case 600 MHz * 5 = 3000 MHz which is valid for the LMK04808.
• Third, continuing the example by using a VCO frequency of 3000 MHz and the LMK04808, the CLKout
dividers can be calculated by simply dividing the VCO frequency by the output frequency. To output 200 MHz,
120 MHz, and 25 MHz the output dividers will be 12, 20, and 96 respectively.
– 3000 MHz / 200 MHz = 15
– 3000 MHz / 120 MHz = 25
– 3000 MHz / 25 MHz = 120
• Fourth, PLL2 must be locked to its input reference. Refer to PLL Programming for more information on this
topic. By programming the clock output dividers and the PLL2 dividers the VCO can lock to the frequency of
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Application Information (continued)
3000 MHz and the clock outputs dividers will each divide the VCO frequency down to the target output
frequencies of 200 MHz, 120 MHz, and 25 MHz.
Refer to Application Note AN-1865, Frequency Synthesis and Planning for PLL Architectures (SNAA061) for
more information on this topic and LCM calculations.
9.1.5 PLL Programming
To lock a PLL the divided reference and divided feedback from VCO or VCXO must result in the same phase
detector frequency. The tables below illustrate how the divides are structured for the reference path (R) and
feedback path (N) depending on the MODE of the device.
Table 113. PLL1 Phase Detector Frequency — Reference Path (R)
MODE
PLL1 PDF (R) =
All
CLKinX Frequency / (CLKinX_PreR_DIV * PLL1_R)
Table 114. PLL1 Phase Detector Frequency — Feedback Path (N)
MODE
Dual PLL, Internal VCO
Dual PLL, Internal VCO, 0-Delay
Dual PLL, External VCO, 0-Delay
(1)
VCO_MUX
OSCout0
—
Bypass
VCXO Frequency / PLL1_N
PLL1 PDF (N) =
—
Divided
VCXO Frequency / (OSCin_DIV * PLL1_N)
Bypass
—
VCO Frequency / (CLKoutX_Y_DIV * PLL1_N)
Divided
—
VCO Frequency / (VCO_DIV * CLKoutX_Y_DIV * PLL1_N)
—
—
VCO Frequency / (CLKoutX_Y_DIV * PLL1_N)
(1)
(1)
(1)
The actual CLKoutX_Y_DIV used is selected by the feedback mux. See EN_FEEDBACK_MUX.
Table 115. PLL2 Phase Detector Frequency — Reference Path (R)
EN_PLL2_REF_2X
(1)
(2)
PLL2 PDF (R) =
Disabled
OSCin Frequency / PLL2_R (1) (2)
Enabled
OSCin Frequency * 2 / PLL2_R (1) (2)
For applications in which the OSCin frequency and PLL2 phase detector frequency are equal, the best PLL2 in-band noise can be
achieved when the doubler is enabled (EN_PLL2_REF_2X = 1) and the PLL2 R divide value is 2. Do not use doubler disabled
(EN_PLL2_REF_2X = 0) and PLL2 R divide value of 1.
See PLL2 Frequency Doubler
Table 116. PLL2 Phase Detector Frequency — Feedback Path (N)
MODE
VCO_MUX
PLL2 PDF (N) =
Dual PLL, Internal VCO
Dual PLL, Internal VCO, 0-Delay
VCO
VCO Frequency / (PLL2_P * PLL2_N)
Single PLL, Internal VCO
Dual PLL, Internal VCO
Dual PLL, Internal VCO, 0-Delay
VCO Divider
VCO Frequency / (VCO_DIV * PLL2_P * PLL2_N)
Single PLL, Internal VCO
Dual PLL, External VCO
Dual PLL External VCO, 0-Delay
—
VCO Frequency / (PLL2_P * PLL2_N)
Single PLL, External VCO
Single PLL, Internal VCO, 0-Delay
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VCO
VCO Divider
VCO Frequency / (CLKoutX_Y_DIV * PLL2_N)
VCO Frequency / (VCO_DIV * CLKoutX_Y_DIV * PLL2_N)
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Table 117. PLL2 Phase Detector Frequency — Feedback Path (N) during VCO Frequency Calibration
MODE
VCO_MUX
All Internal VCO
Modes
VCO
VCO Divider
PLL2 PDF (N_CAL) =
VCO Frequency / (PLL2_P * PLL2_N_CAL)
VCO Frequency / (VCO_DIV * PLL2_P * PLL2_N_CAL)
9.1.5.1 Example PLL2 N Divider Programming
To program PLL2 to lock an LMK04808 using Dual PLL mode to a VCO frequency of 3000 MHz using a 40 MHz
VCXO reference, first determine the total PLL2 N divide value. This is VCO Frequency / PLL2 phase detector
frequency. This example assumes the PLL2 reference frequency doubler is enabled and a PLL2 R divide value
of 2 (see Note 1 in Table 115) which results in PLL2 phase detector frequency the same as PLL2 reference
frequency (40 MHz). 3000 MHz / 40 MHz = 75, so the total PLL2 N divide value is 75.
The dividers in the PLL2 N feedback path for Dual PLL mode include PLL2_P and PLL2_N. PLL2_P can be
programmed from 2 to 8 including both even and odd values. PLL2_N can be programmed from 1 to 263,143
including both even and odd values. Since the total PLL2 N divide value of 75 contains the factors 3, 5, and 5, it
would be allowable to program PLL2_P to 3 or 5. It is simplest to use the smallest divide, so PLL2_P = 3, and
PLL2_N = 25 which results in a Total PLL2 N = 75.
For this example and in most cases, PLL2_N_CAL will have the same value as PLL2_N. However when using
Single PLL mode with 0-delay, the values will differ. When using an external VCO, PLL2_N_CAL value is
unused.
To lock a PLL the divided reference and divided feedback from VCO or VCXO must result in the same phase
detector frequency. The following tables illustrate how the divides are structured for the reference path (R) and
feedback path (N) depending on the MODE of the device.
Table 118. PLL1 Phase Detector Frequency — Reference Path (R)
MODE
(R) PLL1 PDF =
All
CLKinX Frequency / CLKinX_PreR_DIV / PLL1_R
Table 119. PLL1 Phase Detector Frequency — Feedback Path (N)
MODE
VCO_MUX
OSCout0
—
Bypass
VCXO Frequency / PLL1_N
—
Divided
VCXO Frequency / OSCin_DIV / PLL1_N
Bypass
—
VCO Frequency / CLKoutX_Y_DIV / PLL1_N
Divided
—
VCO Frequency / VCO_DIV / CLKoutX_Y_DIV / PLL1_N
Internal VCO Dual PLL
Internal VCO /w 0-delay
(1)
PLL1 PDF (N) =
(1)
(1)
The actual CLKoutX_Y_DIV used is selected by FEEDBACK_MUX.
Table 120. PLL2 Phase Detector Frequency — Reference Path (R)
EN_PLL2_REF_2X
(1)
PLL2 PDF (R) =
(1)
Disabled
OSCin Frequency / PLL2_R
Enabled
OSCin Frequency * 2 / PLL2_R (1)
For applications in which the OSCin frequency and PLL2 phase detector frequency are equal, the best PLL2 in-band noise can be
achieved when the doubler is enabled (EN_PLL2_REF_2X = 1) and the PLL2 R divide value is 2. Do not use doubler disabled
(EN_PLL2_REF_2X = 0) and PLL2 R divide value of 1.
Table 121. PLL2 Phase Detector Frequency — Feedback Path (N)
MODE
VCO_MUX
PLL2 PDF (N) =
Dual PLL
Dual PLL /w 0-delay
VCO
VCO Frequency / PLL2_P / PLL2_N
Single PLL
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Table 121. PLL2 Phase Detector Frequency — Feedback Path (N) (continued)
MODE
VCO_MUX
PLL2 PDF (N) =
Dual PLL
Dual PLL /w 0-delay
VCO Divider
VCO Frequency / VCO_DIV / PLL2_P / PLL2_N
—
VCO Frequency / VCO_DIV / PLL2_P / PLL2_N
Single PLL
Dual PLL External VCO
Dual PLL External VCO /w 0-delay
VCO
Single PLL /w 0-delay
VCO Divider
VCO Frequency / CLKoutX_Y_DIV / PLL2_N
VCO Frequency / VCO_DIV / CLKoutX_Y_DIV / PLL2_N
Table 122. PLL2 Phase Detector Frequency — Feedback Path (N) during VCO Frequency Calibration
MODE
VCO_MUX
VCO
All Internal VCO Modes
VCO Divider
PLL2 PDF (N_CAL) =
VCO Frequency / PLL2_P / PLL2_N_CAL
VCO Frequency / VCO_DIV / PLL2_P / PLL2_N_CAL
9.1.5.1.1 Example PLL2 N Divider Programming
To program PLL2 to lock an LMK04808 using Dual PLL mode to a VCO frequency of 3000 MHz using a 40-MHz
VCXO reference, first determine the total PLL2 N divide value. This is VCO Frequency / PLL2 phase detector
frequency. This example assumes a PLL2 R divide value of 1 which results in PLL2 phase detector frequency
the same as PLL2 reference frequency (40 MHz). 3000 MHz / 40 MHz = 75, so the total PLL2 N divide value is
75.
The dividers in the PLL2 N feedback path for Dual PLL mode include PLL2_P and PLL2_N. PLL2_P can be
programmed from 2 to 8, including both even and odd values. PLL2_N can be programmed from 1 to 263,143,
including both even and odd values. Since the total PLL2 N divide value of 75 contains the factors 3, 5, and 5, it
would be allowable to program PLL2_P to 3 or 5. It is simplest to use the smallest divide, so PLL2_P = 3, and
PLL2_N = 25 which results in a Total PLL2 N = 75.
For this example and in most cases, PLL2_N_CAL will have the same value as PLL2_N. However when using
Single PLL mode with 0-delay, the values will differ. When using an external VCO, PLL2_N_CAL value is
unused.
9.1.6 Digital Lock Detect Frequency Accuracy
The digital lock detect circuit is used to determine PLL1 locked, PLL2 locked, and holdover exit events. A window
size and lock count register are programmed to set a ppm frequency accuracy of reference to feedback signals
of the PLL for each event to occur. When a PLL digital lock event occurs the PLL's digital lock detect is asserted
true. When the holdover exit event occurs, the device will exit holdover mode.
Table 123. Digital Lock Detect Frequency Accuracy Table
EVENT
PLL
WINDOW SIZE
LOCK COUNT
PLL1 Locked
PLL1
PLL1_WND_SIZE
PLL1_DLD_CNT
PLL2 Locked
PLL2
PLL2_WND_SIZE
PLL2_DLD_CNT
Holdover exit
PLL1
PLL1_WND_SIZE
HOLDOVER_DLD_CNT
For a digital lock detect event to occur there must be a “lock count” number of phase detector cycles of PLLX
during which the time/phase error of the PLLX_R reference and PLLX_N feedback signal edges are within the
user programmable "window size." Since there must be at least "lock count" phase detector events before a lock
event occurs, a minimum digital lock event time can be calculated as "lock count" / fPDX where X = 1 for PLL1 or
2 for PLL2.
By using Equation 5, values for a "lock count" and "window size" can be chosen to set the frequency accuracy
required by the system in ppm before the digital lock detect event occurs:
ppm =
106
2e6 × PLLX_WND_SIZE × fPDX
PLLX_DLD_CNT
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The effect of the "lock count" value is that it shortens the effective lock window size by dividing the "window size"
by "lock count".
If at any time the PLLX_R reference and PLLX_N feedback signals are outside the time window set by "window
size", then the “lock count” value is reset to 0.
9.1.6.1 Minimum Digital Lock Detect Time Calculation Example
Given a PLL2 phase detector frequency of 40 MHz and PLL2_DLD_CNT value of 10,000, the minimum digital
lock detect time of PLL2 will be 10,000 / 40 MHz = 250 μs.
9.1.7 Calculating Dynamic Digital Delay Values for any Divide
This section explains how to calculate the dynamic digital delay for any divide value.
Dynamic digital delay allows the time offset between two or more clock outputs to be adjusted with no or minimal
interruption of clock outputs. Since the clock outputs are operating at a known frequency, the time offset can also
be expressed as a phase shift. When dynamically adjusting the digital delay of clock outputs with different
frequencies the phase shift should be expressed in terms of the higher frequency clock. The step size of the
smallest time adjustment possible is equal to half the period of the Clock Distribution Path, which is the VCO
frequency (Equation 3) or the VCO frequency divided by the VCO divider (Equation 4) if not bypassed. The
smallest degree phase adjustment with respect to a clock frequency will be 360 * the smallest time adjustment *
the clock frequency. The total number of phase offsets that the LMK0480x family is able to achieve using
dynamic digital delay is equal 1 / (higher clock frequency * the smallest phase adjustment).
Equation 6 calculates the digital delay value that must be programmed for a synchronizing clock to achieve a 0
time/phase offset from the qualifying clock. Once this digital delay value is known, it is possible to calculate the
digital delay value for any phase offset. The qualifying clock for dynamic digital delay is selected by the
FEEDBACK_MUX. When dynamic digital delay is engaged with same clock output used for the qualifying clock
and the new synchronized clock, it is termed relative dynamic digital delay since causing another SYNC event
with the same digital delay value will offset the clock by the same phase once again. The important part of
relative dynamic digital delay is that the CLKoutX_Y_HS must be programmed correctly when the SYNC event
occurs (Table 6). This can result in needing to program the device twice. Once to set the new CLKoutX_Y_DDLY
with CLKoutX_Y_HS as required for the SYNC event, and again to set the CLKoutX_Y_HS to its desired value.
Digital delay values are programmed using the CLKoutX_Y_DDLY and CLKoutX_Y_HS registers as shown in
Equation 7. For example, to achieve a digital delay of 13.5, program CLKoutX_Y_DDLY = 14 and
CLKoutX_Y_HS = 1.
§§ ª
·
·
º
16
+ 0.5¸ u CLKoutX_Y_DIV¸ - 11.5
CLKoutX_Y_DIV»
«
»
¹
©© «
¹
0 digital delay = ¨ ¨
(6)
Equation 6 uses the ceiling operator. To find the ceiling of a fractional number round up. An integer remains the
same value.
Digital delay = CLKoutX_Y_DDLY - (0.5 * CLKoutX_Y_HS)
(7)
Note: since the digital delay value for 0 time/phase offset is a function of the qualifying clock's divide value, the
resulting digital delay value can be used for any clock output operating at any frequency to achieve a 0
time/phase offset from the qualifying clock. Therefore the calculated time shift table will also be the same as in
Table 124.
9.1.7.1 Example
Consider a system with:
• A VCO frequency of 2000 MHz.
• The VCO divider is bypassed, therefore the clock distribution path frequency is 2000 MHz.
• CLKout0_1_DIV = 10 resulting in a 200 MHz frequency on CLKout0.
• CLKout2_3_DIV = 20 resulting in a 100 MHz frequency on CLKout2.
For this system the minimum time adjustment is 0.25 ns, which is 0.5 / (2000 MHz). Since the higher frequency
is 200 MHz, phase adjustments will be calculated with respect to the 200 MHz frequency. The 0.25 ns minimum
time adjustment results in a minimum phase adjustment of 18 degrees, which is 360 degrees / 200 MHz * 0.25
ns.
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To calculate the digital delay value to achieve a 0 time/phase shift of CLKout2 when CLKout0 is the qualifying
clock. Solve Equation 6 using the divide value of 10. To solve the equation 16/10 = 1.6, the ceiling of 1.6 is 2.
Then to finish solving the equation solve (2 + 0.5) * 10 - 11.5 = 13.5. A digital delay value of 13.5 is programmed
by setting CLKout2_3_DDLY = 14 and CLKout2_3_HS = 1.
To calculate the digital delay value to achieve a 0 time/phase shift of CLKout0 when CLKout2 is the qualifying
clock, solve Equation 6 using the divide value of CLKout2, which is 20. This results in a digital delay of 18.5
which is programmed as CLKout0_1_DDLY = 19 and CLKout0_1_HS = 1.
Once the 0 time/phase shift digital delay programming value is known a table can be constructed with the digital
delay value to be programmed for any time/phase offset by decrementing or incrementing the digital delay value
by 0.5 for the minimum time/phase adjustment.
A complete filled out table for use of CLKout0 as the qualifying clock is shown in Table 124. It was created by
entering a digital delay of 13.5 for 0 degree phase shift, then decrementing the digital delay down to the minimum
value of 4.5. Since this did not result in all the possible phase shifts, the digital delay was then incremented from
13.5 to 14.0 to complete all possible phase shifts.
Table 124. Example Digital Delay Calculation
DIGITAL DELAY
CALCULATED TIME SHIFT
(ns)
RELATIVE TIME SHIFT
to 200 MHz (ns)
PHASE SHIFT
of 200 MHz (Degrees)
4.5
-4.5
0.5
36
5
-4.25
0.75
54
5.5
-4.0
1.0
72
6
-3.75
1.25
90
6.5
-3.5
1.5
108
7
-3.25
1.75
126
7.5
-3.0
2.0
144
8
-2.75
2.25
162
8.5
-2.5
2.5
180
9
-2.25
2.75
198
9.5
-2.0
3.0
216
10
-1.75
3.25
234
10.5
-1.5
3.5
252
11
-1.25
3.75
270
11.5
-1.0
4.0
288
12
-0.75
4.25
306
12.5
-0.5
4.5
324
13
-0.25
4.75
342
13.5
0
0
0
14
0.25
0.25
18
14.5
0.5
0.5
36
Observe that the digital delay value of 4.5 and 14.5 will achieve the same relative time shift/phase delay.
However programming a digital delay of 14.5 will result in a clock off time for the synchronizing clock to achieve
the same phase time shift/phase delay.
Digital delay value is programmed as CLKoutX_Y_DDLY - (0.5 * CLKoutX_Y_HS). So to achieve a digital delay
of 13.5, program CLKoutX_Y_DDLY = 14 and CLKoutX_Y_HS = 1. To achieve a digital delay of 14, program
CLKoutX_Y_DDLY = 14 and CLKoutX_Y_HS = 0.
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9.1.8 Optional Crystal Oscillator Implementation (OSCin/OSCin*)
The LMK0480x family features supporting circuitry for a discretely implemented oscillator driving the OSCin port
pins. Figure 35 illustrates a reference design circuit for a crystal oscillator:
OSCin*
Copt
CC1 = 2.2 nF
R1 = 4.7k
SMV1249-074LF
R3 = 10k
LMK0480x
XTAL
1 nF
R2 = 4.7k
CC2 = 2.2 nF
OSCin
CPout1
Copt
PLL1 Loop Filter
Figure 35. Reference Design Circuit for Crystal Oscillator Option
This circuit topology represents a parallel resonant mode oscillator design. When selecting a crystal for parallel
resonance, the total load capacitance, CL, must be specified. The load capacitance is the sum of the tuning
capacitance (CTUNE), the capacitance seen looking into the OSCin port (CIN), and stray capacitance due to PCB
parasitics (CSTRAY), and is given by Equation 8.
CL = CTUNE + CIN +
CSTRAY
2
(8)
CTUNE is provided by the varactor diode shown in Figure 35, Skyworks model SMV1249-074LF. A dual diode
package with common cathode provides the variable capacitance for tuning. The single diode capacitance
ranges from approximately 31 pF at 0.3 V to 3.4 pF at 3 V. The capacitance range of the dual package (anode to
anode) is approximately 15.5 pF at 3 V to 1.7 pF at 0.3 V. The desired value of VTUNE applied to the diode should
be VCC/2, or 1.65 V for VCC = 3.3 V. The typical performance curve from the data sheet for the SMV1249-074LF
indicates that the capacitance at this voltage is approximately 6 pF (12 pF / 2).
The nominal input capacitance (CIN) of the LMK0480x family OSCin pins is 6 pF. The stray capacitance (CSTRAY)
of the PCB should be minimized by arranging the oscillator circuit layout to achieve trace lengths as short as
possible and as narrow as possible trace width (50 Ω characteristic impedance is not required).
As an example, assume that CSTRAY is 4 pF. The total load capacitance is nominally:
CL = 6 + 6 +
4
= 14 pF
2
(9)
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Consequently the load capacitance specification for the crystal in this case should be nominally 14 pF.
The 2.2-nF capacitors shown in the circuit are coupling capacitors that block the DC tuning voltage applied by
the 4.7-kΩ and 10-kΩ resistors. The value of these coupling capacitors should be large, relative to the value of
CTUNE (CC1 = CC2 >> CTUNE), so that CTUNE becomes the dominant capacitance.
For a specific value of CL, the corresponding resonant frequency (FL) of the parallel resonant mode circuit is:
1
FL = FS À
C1
2(C0 + CL1)
+ 1 = FS À
§C0
2¨
© C1
+
CL ·
+1
¸
C1 ¹
where
•
•
•
•
FS = Series resonant frequency
C1 = Motional capacitance of the crystal
CL = Load capacitance
C0 = Shunt capacitance of the crystal, specified on the crystal datasheet
(10)
The normalized tuning range of the circuit is closely approximated by:
1
'F FCL1 - FCL2 C1
=
=
F
2
FFCL1
À
1
1
1
=
(C0 + CL1) (C0 + CL2)
2
À
§C0
¨ C1
©
+
CL1·
-
1
§C0
¸ ¨
C1 ¹ © C1
+
CL2·
¸
C1 ¹
(11)
CL1, CL2 = The endpoints of the circuit’s load capacitance range, assuming a variable capacitance element is one
component of the load. FCL1, FCL2 = parallel resonant frequencies at the extremes of the circuit’s load
capacitance range.
A common range for the pullability ratio, C0/C1, is 250 to 280. The ratio of the load capacitance to the shunt
capacitance is ~(n * 1000), n < 10. Hence, picking a crystal with a smaller pullability ratio supports a wider tuning
range because this allows the scale factors related to the load capacitance to dominate.
Examples of the phase noise and jitter performance of the LMK04808 with a crystal oscillator are shown in
Table 125. This table illustrates the clock output phase noise when a 20.48-MHz crystal is paired with PLL1.
Performance of other LMK0480x devices will be similar.
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Table 125. Example RMS Jitter and Clock Output Phase Noise for LMK04808
with a 20.48 MHz Crystal Driving OSCin (T = 25 °C, VCC = 3.3 V) (1)
INTEGRATION
BANDWIDTH
CLOCK OUTPUT TYPE
PLL2 PDF = 20.48 MHz
(EN_PLL2_REF2X = 0,
XTAL_LVL = 3)
PLL2 PDF = 40.96 MHz
(EN_PLL2_REF2X = 1, XTAL_LVL = 3)
fCLK = 245.76 MHz
fCLK = 122.88 MHz
fCLK = 245.76 MHz
LVCMOS
374
412
382
LVDS
419
421
372
LVPECL 1.6 Vpp
460
448
440
LVCMOS
226
195
190
LVDS
231
205
194
LVPECL 1.6 Vpp
226
191
188
Clock Output Type
PLL2 PDF = 20.48 MHz
(EN_PLL2_REF2X = 0,
XTAL_LVL = 3)
RMS JITTER (fs rms)
100 Hz – 20 MHz
10 kHz – 20 MHz
PHASE NOISE (dBc/Hz)
Offset
100 Hz
1 kHz
10 kHz
100 kHz
1 MHz
40 MHz
(1)
PLL2 PDF = 40.96 MHz
(EN_PLL2_REF2X = 1, XTAL_LVL = 3)
fCLK = 245.76 MHz
fCLK = 122.88 MHz
fCLK = 245.76 MHz
LVCMOS
-87
-93
-87
LVDS
-86
-91
-86
LVPECL 1.6 Vpp
-86
-92
-85
LVCMOS
-115
-121
-115
LVDS
-115
-123
-116
LVPECL 1.6 Vpp
-114
-122
-116
LVCMOS
-117
-128
-122
LVDS
-117
-128
-122
LVPECL 1.6 Vpp
-117
-128
-122
LVCMOS
-130
-135
-129
LVDS
-130
-135
-129
LVPECL 1.6 Vpp
-129
-135
-129
LVCMOS
-150
-154
-148
LVDS
-149
-153
-148
LVPECL 1.6 Vpp
-150
-154
-148
LVCMOS
-159
-162
-159
LVDS
-157
-159
-157
LVPECL 1.6 Vpp
-159
-161
-159
Performance data and crystal specifications contained in this section are based on Vectron model VXB1-1150-20M480, 20.48 MHz.
PLL1 has a narrow loop bandwidth, PLL2 loop parameters are: C1 = 150 pF, C2 = 120 nF, R2 = 470 Ω, Charge Pump current = 3.2 mA,
Phase detector frequency = 20.48 MHz or 40.96 MHz, VCO frequency = 2949.12 MHz. Loop filter was optimized for 40.96 MHz phase
detector performance.
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Example crystal specifications are presented in Table 126.
Table 126. Example Crystal Specifications
PARAMETER
VALUE
Nominal Frequency (MHz)
20.48
Frequency Stability, T = 25 °C
± 10 ppm
Operating temperature range
-40 °C to +85 °C
Frequency Stability, -40 °C to +85 °C
± 15 ppm
Load Capacitance
14 pF
Shunt Capacitance (C0)
5 pF Maximum
Motional Capacitance (C1)
20 fF ± 30%
Equivalent Series Resistance
25 Ω Maximum
Drive level
2 mWatts Maximum
C0/C1 ratio
225 typical, 250 Maximum
See Figure 36 for a representative tuning curve.
180
140
100
PPM
60
20
-20
-60
-100
-140
-180
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
VTUNE(V)
Figure 36. Example Tuning Curve, 20.48 MHz Crystal
The tuning curve achieved in the user's application may differ from the curve shown above due to differences in
PCB layout and component selection.
This data is measured on the bench with the crystal integrated with the LMK0480x family. Using a voltmeter to
monitor the VTUNE node for the crystal, the PLL1 reference clock input frequency is swept in frequency and the
resulting tuning voltage generated by PLL1 is measured at each frequency. At each value of the reference clock
frequency, the lock state of PLL1 should be monitored to ensure that the tuning voltage applied to the crystal is
valid.
The curve shows over the tuning voltage range of 0.3 VDC to 3.0 VDC, the frequency range is -140 to +91 ppm;
or equivalently, a tuning range of -2850 Hz to +1850 Hz. The measured tuning voltage at the nominal crystal
frequency (20.48 MHz) is 1.7 V. Using the diode data sheet tuning characteristics, this voltage results in a tuning
capacitance of approximately 6.5 pF.
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The tuning curve data can be used to calculate the gain of the oscillator (KVCO). The data used in the calculations
is taken from the most linear portion of the curve, a region centered on the crossover point at the nominal
frequency (20.48 MHz). For a well designed circuit, this is the most likely operating range. In this case, the tuning
range used for the calculations is ± 1000 Hz (± 0.001 MHz), or ± 81.4 ppm. The simplest method is to calculate
the ratio:
KVCO =
'F
=
'V
§ 'F2 - 'F1 · MHz
¨ VTUNE2 - VTUNE1¸ , V
©
¹
(12)
ΔF2 and ΔF1 are in units of MHz. Using data from the curve this becomes:
0.001 - (-0.001)
MHz
= 0.00164
2.03 - 0.814
V
(13)
A second method uses the tuning data in units of ppm:
KVCO =
FNOM À ('ppm2 - 'ppm1)
'V À 10
6
(14)
FNOM is the nominal frequency of the crystal and is in units of MHz. Using the data, this becomes:
12.288 À (81.4 - (-81.4))
(2.03 - 0.814) À 10
6
= 0.00164,
MHz
V
(15)
In order to ensure startup of the oscillator circuit, the equivalent series resistance (ESR) of the selected crystal
should conform to the specifications listed in the table of Electrical Characteristics.
It is also important to select a crystal with adequate power dissipation capability, or drive level. If the drive level
supplied by the oscillator exceeds the maximum specified by the crystal manufacturer, the crystal will undergo
excessive aging and possibly become damaged. Drive level is directly proportional to resonant frequency,
capacitive load seen by the crystal, voltage and equivalent series resistance (ESR).
For more complete coverage of crystal oscillator design, see:
http://www.ti.com/lsds/ti/analog/clocksandtimers/tools.page or Application Note AN-1939, Crystal Based Oscillator
Design with the LMK04000 Family (SNAA065).
9.1.9 Application Curves
See Figure 36 for a representative tuning curve.
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9.2 Typical Applications
Normal use case of the LMK0480x device is as a dual loop jitter cleaner. This section will discuss a design
example to illustrate the various functional aspects of the LMK0480x device.
PLL1
N
Phase
Detector
PLL1
External
Loop Filter
OSCoutX
OSCoutX*
2 outputs
OSCin
R
External VCXO
or Tunable
Crystal
CPout1
CLKinX
CLKinX*
2 inputs
PLL2
External
Loop Filter
CPout2
R
Input
Buffer
N
Phase
Detector
PLL2
Divider
Digital Delay
Analog Delay
Partially
Integrated
Loop Filter
Internal
VCO
CLKoutY
CLKoutY*
CLKoutX
CLKoutX*
12 outputs
6 blocks
LMK0480x
Figure 37. Simplified Functional Block Diagram for Dual Loop Mode
9.2.1 Design Requirements
Given a remote radio head (RRU) type application which needs to clock some ADCs, DACs, FPGA, SERDES,
and an LO. The input clock will be a recovered clock which needs jitter cleaning. The FPGA clock should have a
clock output on power up. A summary of clock input and output requirements are as follows:
Clock Input:
• 30.72 MHz recovered clock.
Clock Outputs:
• 2x 245.76 MHz
• 4x 983.04 MHz
• 1x 122.88 MHz
• 1x 122.88 MHz
• 2x 122.88 MHz
clock
clock
clock
clock
clock
for ADC, LVPECL
for DAC, LVPECL
for FPGA, LVPECL. POR clock
for SERDES, LVPECL
for LO, LVCMOS
It is also desirable to have the holdover feature engage if the recovered clock reference is ever lost. The
following information reviews the steps to produce this design.
9.2.2 Detailed Design Procedure
Design of all aspects of the LMK0480x are quite involved and software has been written to assist in part
selection, part programming, loop filter design, and simulation. This design procedure will give a quick outline of
the process.
Note that this information is current as of the date of the release of this datasheet. Design tools receive
continuous improvements to add features and improve model accuracy. Refer to software instructions or training
for latest features.
1. Device Selection
– the key to device selection is required VCO frequency given required output frequencies. The device
must be able to produce the VCO frequency that can be divided down to required output frequencies.
– The software design tools will take inot account VCO frequency range for specific devices based on the
application's required output frequencies. Using an external VCO provides increased flexibility regarding
valid designs.
– To understand the process better, refer to Frequency Planning with the LMK0480x Family for more detail
on calculating valid VCO frequency when using integer dividers using the least common multiple (LCM) of
the output frequencies.
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Typical Applications (continued)
2. Device Configuration
– There are many possible permutations of dividers and other registers to get same input and output
frequencies from a device. However there are some optimizations and trade-offs to be considered.
– If more than one divider is in series, for instance VCO divider to CLKout divider, or VCO divider to PLL
prescaler to PLL N. It is possible although not assured that some crosstalk/mixing could be created
when using some divides.
– The design software normally attempts to maximize phase detector frequency, use smallest dividers, and
maximizes PLL charge pump current.
– When an external VCXO or crystal is used for jitter cleaning, the design software will choose the
maximum frequency value, depending on design software options, this max frequency may be limited to
standard value VCXOs/Crystals. Note, depending on application, different frequency VCXOs may be
chosen to generate some of the required output frequencies.
– Refer to PLL Programming for divider equations need to ensure PLL is locked. The design software is
able to configure the device for most cases, but at this time for advanced features like 0-delay, the
user must take care to ensure proper PLL programming.
– These guidelines may be followed when configuring PLL related dividers or other related registers:
– For lowest possible in-band PLL flat noise, maximize phase detector frequency to minimize N divide
value.
– For lowest possible in-band PLL flat noise, maximize charge pump current. The highest value charge
pump currents often have similar performance due to diminishing returns.
– To reduce loop filter component sizes, increase N value and/or reduce charge pump current.
– Large capacitors help reduce phase detector spurs at phase detector frequency caused by external
VCOs/VCXOs with low input impedance.
– As rule of thumb, keeping the phase detector frequency approximately between 10 * PLL loop
bandwidth and 100 * PLL loop bandwidth. A phase detector frequency less than 5 * PLL bandwidth
may be unstable and a phase detector frequency > 100 * loop bandwidth may experience increased
lock time due to cycle slipping.
3. PLL Loop Filter Design
– It is recommended to use Clock Design Tool or Clock Architect to design your loop filter.
– Best loop filter design and simulation can be achieved when:
– Custom reference and VCXO phase noise profiles are loaded into the software.
– VCO gain of the external VCXO or possible external VCO device are entered.
– The Clock Design Tool will return solutions with high reference/phase detector frequencies by default. In
the Clock Design Tool the user may increase the reference divider to reduce the frequency if desired.
Due to the narrow loop bandwidth used on PLL1, it is common to lower the phase detector frequency on
PLL1 to reduce component size.
– While designing loop filter, adjusting the charge pump current or N value can help with loop filter
component selection. Lower charge pump currents and larger N values result in smaller component
values but may increase impacts of leakage and reduce PLL phase noise performance.
– More detailed understanding of loop filter design can found in Dean Banerjee's PLL Performance,
Simulation, and Design (www.ti.com/tool/pll_book).
4. Clock Output Assignment
– At this time the design software does not take into account frequency assignment to specific outputs
except to ensure that the output frequencies can be achieved. It is best to consider proximity of each
clock output to each other and other PLL circuitry when choosing final clock output locations. Here are
some guidelines to help achieve best performance when assigning outputs to specific CLKout/OSCout
pins.
– Group common frequencies together.
– PLL charge pump circuitry can cause crosstalk at charge pump frequency. Place outputs sharing
charge pump frequency or lower priority outputs not sensitive to charge pump frequency spurs
together.
– Muxes can create a path for noise coupling. Consider all frequencies which may have some bleed
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Typical Applications (continued)
through from non-selected mux inputs.
– For example, LMK0480x CLKout6/7 and CLKout8/9 share a mux with OSCin.
– Some clock targets require low close-in phase noise. If possible, use a VCXO based PLL1 output for
such a clock target. An example is a clock to a PLL reference.
– Some clock targets require excellent noise floor performance. Outputs driven by the internal VCO have
the best noise floor performance. An example is an ADC or DAC.
5. Other device specific configuration. For LMK0480x, consider the following:
– PLL lock time based on programming:
– In addition to the time it takes the device to lock to frequency, there is a digital filter to avoid false lock
time detects which can also be used to ensure a specific PPM frequency accuracy. This also impacts
the time it takes for the digital lock detect (DLD) pin to be asserted. Refer to Digital Lock Detect
Frequency Accuracy for more information.
– Holdover configuration:
– Specific PPM frequency accuracy required to exit holdover can be programmed. Refer to Digital Lock
Detect Frequency Accuracy for more information.
– Digital delay: phase alignment of the output clocks.
– Analog delay: another method to shift phases of clocks with finer resolution with the penalty of increase
noise floor. Clock Design Tool can simulate analog delay impact on phase noise floor.
– Dynamic digital delay: ability to shift phase alignment of clocks with minimum disruption during operation.
6. Device Programming
– The software tool CodeLoader for EVM programming can be used to setup the device in the desired
configuration, then export a hex register map suitable for use in application.
Some additional information on each part of the design procedure for the RRU example is below.
9.2.2.1 Device Selection
Use the WEBENCH Clock Architect Tool or Clock Design Tool. Enter the required frequencies and formats into
the tool. To use this device, find a solution using the LMK04808B.
9.2.2.1.1 Clock Architect
When viewing resulting solutions, it is possible to narrow the parts used in the solution by setting a filter.
Under advanced tab, filtering of specific parts can be done using regular expressions in the Part Filter box.
"LMK04808B" will filter for only the LMK04808B devices (without quotes).
9.2.2.1.2 Clock Design Tool
In wizard-mode, select Dual Loop PLL to find the LMK04808B device. If a high frequency and clean reference is
available, Although dual loop mode is selected as a customer requirement, it is not required to use dual loop;
PLL1 can be powered down and input is then provided via the OSCin port. When simulating single loop
solutions, set PLL1 loop filter block to "0 Hz LBW" and use VCXO as the reference block.
9.2.2.1.3 Calculation Using LCM
In this example, the LCM(245.76 MHz, 983.04 MHz, 122.88 MHz) = 983.04 MHz. A valid VCO frequency for
LMK0480x is 2949.12 MHz = 3 * 983.04 MHz. Therefore the LMK0480B may be used to produce these output
frequencies.
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Typical Applications (continued)
9.2.2.2 Device Configuration
The tools automatically configure the simulation to meet the input and output frequency requirements given and
make assumptions about other parameters to give some default simulations. The assumptions made are to
maximize input frequencies, phase detector frequencies, and charge pump currents while minimizing VCO
frequency and divider values.
For this example, when using the clock design tool, the reference would have been manually entered as 30.72
MHz according to input frequency requirements, but the tool allows VCXO1 frequency either to be set manually,
auto-selected according to standard frequencies, or auto-selected for best frequency. With the best frequency
option, the highest possible VCXO frequency which gives the highest possible PLL2 PDF frequency is
recommended first. In this case: 421 + 53/175 MHz VCXO resulting in a 140 + 76/175 MHz phase detector
frequency. This is a high phase detector frequency, but the VCXO is likely going to be a custom order. The
select configuration page just before simulation shows before some different configurations possible with different
VCO divider values. For example, a more common 491.52 MHz frequency provides a 122.88 MHz PDF. This is a
more logical configuration.
From the simulation page of clock design tool, it can be seen that the VCXO frequency of 491.52 MHz is too high
for feedback into the PLL1_N divider. Reducing the VCXO frequency to 245.76 MHz resolves the PLL1_N divider
max input frequency problem. The PLL2 R divider must be updated to 2 so that the VCO of PLL2 is still at
2949.12 MHz.
At this point the design meets all input and output frequency requirements and it is possible to design a loop filter
for system and simulate performance on CLKouts. However, consider also the following:
• At this time the clock design tool doesn't assign outputs strategically for jitter, such as PLL1 vs PLL2. If PLL1
output frequency is high enough, it may have improved jitter performance depending on the noise floor and
application required integration range.
• The clock design tool does not consider power on reset clocks in the clock requirements or assignments.
• The clock design tool simplifies the LMK0480x architecture not showing the mux complexity around
OSCout0/1 and not showing OSCout1. Simulation of OSCout0 is equivalent to OSCout1.
The next section addresses how the user may alter the design when considering these items.
9.2.2.2.1 PLL LO Reference
PLL1 outputs have the best phase noise performance for LO references. As such OSCout0 can be used to
provide the 122.88 MHz LO reference clock. To achieve this with the 245.76 MHz VCXO the OSCout_DIV can
be set to 2 to provide 122.88 MHz at OSCout0. However in the next section it is determined that for the POR
clock, a 122.88 MHz VCXO will be chosen which results not needing to change this parameter.
9.2.2.2.2 POR Clock
If OSCout1 is to be used for LVPECL POR 122.88 MHz clock, the POR value of the OSCout_DIV is 1, so a
122.88 MHz VCXO frequency must be chosen. This may be desired anyway since the phase detector frequency
is limited to 122.88 MHz and lower frequency VCXOs tend to cost less. With this change the OSCin frequency
and phase detector frequency are the same, so the doubler must be enabled and the PLL2 R divider
programmed = 2 to follow the rule stated in PLL2 Frequency Doubler. Since the clock design tool does not show
the doubler, PLL2_R will still reflect the value 1 one for the simulation purposes.
If LVDS was required for POR clock, a voltage divider could be used to convert from LVPECL to LVDS.
Note: it is possible to set the PLL2 R = 0.5 to simulate the doubler in-case lower frequency VCXOs would like to
be simulated. For example a 61.44 MHz VCXO could be used while retaining a 122.88 MHz phase detector
frequency. However, it would reduce the LO reference frequency and POR clock frequency to 61.44 MHz.
At this time the main design updates have been made to support the POR clock and loop filter design may begin.
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Typical Applications (continued)
9.2.2.3 PLL Loop Filter Design
The PLL structure for the LMK0480x is illustrated in Loop Filter.
At this time the user may choose to make adjustments to the simulation tools for more accurate simulations to
their application. For example:
• Clock Design Tool allows loading a custom phase noise plot for any block. Typically, a custom phase noise
plot is entered for CLKin to match the reference phase noise to the device; a phase noise plot for the VCXO
can additionally be provided to match the performance of VCXO used. For improved accuracy in simulation
and optimum loop filter design, be sure to load these custom noise profiles for use in application. After
loading a phase noise plot, user should recalculate the recommended loop filter design.
• The Clock Design Tool will return solutions with high reference/phase detector frequencies by default. In the
Clock Design Tool the user may increase the reference divider to reduce the frequency if desired. Due to the
narrow loop bandwidth used on PLL1, it is common to reduce the phase detector frequency on PLL1 by
increasing PLL1 R.
For this example, for PLL1 to perform jitter cleaning and to minimize jitter from PLL2 used for frequency
multiplication:
• PLL1: A narrow loop bandwidth PLL1 filter was design by updating the loop bandwidth to 50 Hz and phase
margin to 50 degrees.
• PLL2:
– VCXO noise profile is measured, then loaded into VCXO block in clock design tool.
– The recommended loop filter is redesigned. Updates to the PLL1 loop filter and VCXO phase noise may
change the loop filter recommendation.
The next two sections will discuss PLL1 and PLL2 loop filter design specific to this example using default phase
noise profiles.
NOTE
Clock Design Tool provides some recommend loop filters upon first load of the simulation.
Anytime PLL related inputs change like an input phase noise, charge pump current,
divider values, and so forth. it is best to re-design the PLL1 loop filter to the recommended
design or your desired parameters. After PLL1, then update the PLL2 loop filter in the
same way to keep the loop filters designed and optimized for the application. Since PLL1
loop filter design may impact PLL2 loop filter design, be sure to update the designs in
order.
9.2.2.3.1 PLL1 Loop Filter Design
For this example, in the clock design tool simulator click on the PLL1 loop filter design button, then update the
loop bandwidth for 0.05 kHz and the phase margin for 50 degrees and press calculate. With the 30.72 MHz
phase detector frequency and 1.6 mA charge pump; the designed loop filter's largest capacitor, C2, is 27 µF.
Supposing a goal of < 10 µF; setting PLL1 R = 4 and pressing the calculate again shows that C2 is 6.8 µF.
Suppose that a reduction to < 1 µF is desired, continuing to increase the PLL1 R to 8 resulting in a phase
detector frequency of 3.84 MHz and reducing the charge pump current from 1.6 mA to 0.4 mA and calculating
again shows that C2 is 820 nF. As N was increased and charge pump decreased, this final design has R2 = 12
kΩ. The first design with low N value and high charge pump current result in R2 = 390 Ω. The impact of the
thermal resistance is calculated in the tool. Viewing the simulation of the loop filter with the 12-kΩ resistor shows
that the thermal noise in the loop is not impacting performance.
It may be desired to design a 3rd order loop filter for additional attenuation input noise and spurs
With the PLL1 loop filter design complete, PLL2's loop filter is ready to be designed.
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Typical Applications (continued)
9.2.2.3.2 PLL2 Loop Filter Design
In the clock design tool simulator, click on the PLL2 loop filter design button, then press recommend design. For
PLL2's loop filter maximum phase detector frequency and maximum charge pump current are typically used.
Typically the jitter integration bandwidth includes the loop filter bandwidth for PLL2. The recommended loop filter
by the tools are designed to minimize jitter. The integrated loop filter components are minimized with this
recommendation as to allow maximum flexibility in achieve wide loop bandwidths for low PLL noise. With the
recommended loop filter calculated, this loop filter is ready to be simulated.
If using integrated components is desired, open the bode plot for the PLL2 Loop Filter, then make adjustments to
the integrated components. The effective loop bandwidth and phase margin with these updates is calculated.
The integrated loop filter components are good to use when attempting to eliminate some spurs since they
provide filtering after the bond wires. The recommended procedure is to increase C3/C4 capacitance, then
R3/R4 resistance. Large R3/R4 resistance can result in degraded VCO phase noise performance.
9.2.2.4 Clock Output Assignment
At this time the Clock Design Tool and Clock Architect only assign outputs to specific clock outputs numerically;
not necessarily by optimum configuration. The user may wish to make some educated re-assignment of outputs.
During device configuration, some output assignment was discussed since it impacted the part's configuration
relating to loop filter design, such as:
• In this example, OSCout1 can be used to provide the power on reset (POR) start-up clock to the FPGA at
122.88 MHz since the VCXO frequency is the required output frequency.
• Since PLL1 outputs have best in-band noise, OSCout0 is used to provide LVCMOS output to the PLL
reference for the LO. LVCMOS (Norm/Inv) is used instead of LVCMOS (Norm/Norm) to reduce crosstalk. It is
also possible to use CLKout6/7 or CLKout8/9 for a PLL reference being driven from the VCXO. The noise
floor will be higher, but close-in noise is typically of more concern since noise above the loop bandwidth of the
LO will be dominated by the VCO of the LO. See Figure 38.
Since CLKout6/7 and CLKout8/9 have a mux allowing them to be driven by the VCXO and due there is a chance
for some 122.88 MHz crosstalk from the VCXO. The 122.88 MHz SERDES clock will be placed on CLKout6
since it will not be sensitive to crosstalk as it is operating at the same frequency.
The two 245.76 MHz clocks and four 983.04 MHz clocks for the converters need to be discussed. There is some
flexibility in assignment. For example CLKout0/1 could operate at 245.76 MHz for the ADCs and then CLKout2/3
and CLKout4/5 could operate at 983.04 MHz for the DAC. It is also possible to consider CLKout2/3 for the ADC
and position CLKout0/1 and CLKout10/11 for the DAC. The ADCs clock was placed as far as possible from other
clock which could result in sub-harmonic spurs since the ADC clock is often the most sensitive.
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Typical Applications (continued)
9.2.2.5 Other Device Specific Configuration
9.2.2.5.1 Digital Lock Detect
Digital lock time for PLL1 will ultimately depend upon the programming of the PLL1_DLD_CNT register as
discussed in Digital Lock Detect Frequency Accuracy. Since the PLL1 phase detector frequency in this example
is 3.84 MHz, the lock time will = 1 / (PLL1_DLD_CNT * 3.84 MHz)
Digital lock time for PLL1 if PLL1_DLD_CNT = 10000 is just over 2.6 ms. When using holdover, it is very
important to program the PLL1_DLD_CNT to a value large enough to prevent false digital lock detect signals.
If PLL1_DLD_CNT is too small, when the device exits holdover and is re-locking, the DLD will go high while the
phase of the reference and feedback are within the specified window size because the programmed
PLL1_DLD_CNT will be satisfied. However, if the loop has not yet settled to without the window size, when the
phases of the reference and feedback once again exceed the window size, the DLD will return low. Provided that
DISABLE_DLD1_DET = 0, the device once again enter holdover. Assuming that the reference clock is valid
because holdover was just exited, the exit criteria will again be met, holdover will exit, and PLL1 will start locking.
Unfortunately, the same sequence of events will repeat resulting in oscillation out-of and back-into holdover.
Setting the PLL1_DLD_CNT to an appropriately large value prevents chattering of the PLL1 DLD signal and
stable holdover operation can be achieved.
Refer to Digital Lock Detect Frequency Accuracy for more detail on calculating exit times and how the
PLL1_DLD_CNT and PLL1_WND_SIZE work together.
9.2.2.5.2 Holdover
For this example, when the recovered clock is lost, the goal is to set the VCXO to Vcc/2 until the recovered clock
returns. Holdover Mode contains detailed information on how to program holdover.
To
•
•
•
•
•
achieve the above goal, fixed holdover will be used. Program:
HOLDOVER_MODE = 2 (Holdover enabled)
EN_TRACK = 0 (Tracking disabled)
EN_MAN_DAC = 1 (Use manual DAC for holdover voltage value)
MAN_DAC = 512 (Approximately Vcc/2)
DISABLE_DLD1_DET = 0 (Use PLL1 DLD = Low to start holdover)
9.2.2.6 Device Programming
The CodeLoader software is used to program the LMK0480x evaluation board using the LMK04808B profile. It
also allows the exporting of a register map which can be used to program the device to the user’s desired
configuration.
Once a configuration of dividers has been achieved using the Clock Design Tool to meet the requested
input/output frequencies with the desired performance, the CodeLoader software is manually updated with this
information to meet the required application. At this time no automatic import exists.
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Typical Applications (continued)
9.2.3 Application Curve
-130
VCO CLKoutX
VCXO CLKout6/7/8/9
VCXO OSCout0/1
VCXO Direct
Phase Noise (dBc/Hz)
-135
-140
-145
-150
-155
-160
-165
-170
1k
10k
100k
1M
Frequency Offset (Hz)
10M
D001
Figure 38. LVPECL Phase Noise, 122.88 MHz
Illustration of Different Performance Depending on Signal Path.
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9.3 System Examples
9.3.1 System Level Diagram
Figure 39 and Figure 40 show an LMK0480x family device with external circuitry for clocking and for power
supply to serve as a guideline for good practices when designing with the LMK0480x family. Refer to Pin
Connection Recommendations for more details on the pin connections and bypassing recommendations. Also
refer to the evaluation board in LMK0480x Evaluation Board Instructions (SNAU076). PCB design will also play a
role in device performance.
Status_CLKin0
240Ö
Status_CLKin1
To Host
processor
0.1 PF
CLKout0, 1
Status_LD
CLKout0*,1*
Status_HOLDOVER
0.1 PF
SYNC
2x LVPECL
output clocks
to DAC
240Ö
LEuWire
CLKuWire
240Ö
DATAuWire
0.1 PF
CLKout2, 3, 4, 5
Recovered
Reference
Clock
0.1 PF
CLKout2*,3*,4*,5*
CLKin0
0.1 PF
CLKin0*
50Ö
4x LVPECL
output clocks
to ADC
240Ö
0.1 PF
LMK0480x
0.1 PF
CLKin1
3x LVDS clocks
to FPGAs and
microcontrollers
CLKout6, 7, 8
CLKout6*,7*,8*
CLKout 6 and 8 active at startup
100Ö
CLKout9
CLKin1*
CLKout9*
TCXO
0.1 PF
LVDS Low
Frequency
System
Synchronization
Clock
0.1 PF
OSCin*
CLKout10
CLKout10*
OSCin
VCXO
Rterm
CLKout11
0.1 PF
CLKout11*
240Ö
LDObyp1
0.1 PF
OSCout0, 1
LDObyp2
OSCout0*,1*
CPout2
0.1 PF
CPout1
0.1 PF
10 PF
LVPECL
OSCout clocks
to PLL
references
240Ö
OSCout0 on at startup
PLL1 Loop Filter
Up to 14 total differential clocks
2 clock outputs unused in above design
PLL2 External
Loop Filter
Figure 39. Example Application – System Schematic Except for Power
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System Examples (continued)
Figure 39 shows the primary reference clock input is at CLKin0/0*. A secondary reference clock is driving
CLKin1/1*. Both clocks are depicted as AC coupled drivers. The VCXO attached to the OSCin/OSCin* port is
configured as an AC coupled single-ended driver. Any of the input ports (CLKin0/0*, CLKin1/1*, or
OSCin/OSCin*) may be configured as either differential or single-ended. These options are discussed later in the
data sheet.
See Loop Filter for more information on PLL1 and PLL2 loop filters.
All the LVPECL clock outputs are AC coupled with 0.1 uF capacitors. The LVDS outputs are DC coupled.. Some
clock outputs are depicted as LVPECL with 240-Ω emitter resistors and some clock outputs as LVDS. The
appropriate output termination on each output should be implemented according to the output format to be
programmed by the user. Later sections of this data sheet illustrate alternative methods for AC coupling, DC
coupling and terminating the clock outputs.
PCB design will influence crosstalk performance. Tightly coupled clock traces will have less crosstalk than
loosely coupled clock traces. Also proximity to other clocks traces will influence crosstalk.
PLL Supply Plane
Vcc1
FB
Vcc4
Vcc5
10 µF, 1 µF, 0.1 µF
1 µF, 0.1 µF, 10 nF
Vcc7
Vcc9
LDO
LP3878-ADJ
Vcc6
FB
0.1 µF
0.1 µF
Digital
CLKin/OSCout1
OSCin/OSCout0/
PLL2 Circuitry
PLL2 N Divider
PLL1 CP
0.1 µF
PLL2 CP
FB
FB = Ferrite bead
VCO LDO
0.1 µF
Vcc8
LMK0480x
Clock Supply Plane
FB
FB
10 µF, 1 µF, 0.1 µF
FB
Do not directly copy schematic for
CLKout Vcc13/2/3/10/11/12. This
is for example frequency plan only.
Recommendation is to group
supplies by same frequency and
share a ferrite bead among outputs
of the same frequency.
Vcc13
Vcc2
Vcc3
FB
Vcc10
Vcc11
Vcc12
CLKout0/1
CLKout2/3
CLKout4/5
Example
Frequency 1
Example
Frequency 2
CLKout6/7
CLKout8/9
Example
Frequency 3
CLKout10/11
Figure 40. Example Application – Power System Schematic
Figure 40 shows an example decoupling and bypassing scheme for the LMK0480x, which could apply to
configurations shown in Figure 20 or Figure 39. Components drawn in dotted lines are optional (see Pin
Connection Recommendations). Two power planes are used in these example designs, one for the clock outputs
and one for PLL circuits. It is possible to reduce the number of decoupling components by tying together clock
output Vcc pins for CLKouts that share the same frequency or otherwise can tolerate potential crosstalk between
outputs with different frequencies. In the two examples, Vcc2 and Vcc3 can be tied together since CLKout2/3
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System Examples (continued)
and CLKout4/5 will operate at the same frequencies. Vcc10, Vcc11, and Vcc12 can be tied together since
potential crosstalk between the FPGA/SerDes clocks and low-frequency synchronization clocks will not impact
the performance of these digital interfaces, which typically have less stringent jitter requirements. PCB design will
influence impedance to the supply. Vias and traces will increase the impedance to the power supply. Ensure
good direct return current paths.
9.4 Do's and Don'ts
9.4.1 LVCMOS Complementary vs. Non-Complementary Operation
• It is recommended to use a complementary LVCMOS output format such as LVCMOS (Norm/Inv) to reduce
switching noise and crosstalk when using LVCMOS.
• If only a single LVCMOS output is required, the complementary LVCMOS output format can still be used by
leaving the unused LVCMOS output floating.
• A non-complimentary format such as LVCMOS (Norm/Norm) is not recommended as increased switching
noise is present.
9.4.2 LVPECL Outputs
When using an LVPECL output it is not recommended to place a capacitor to ground on the output as might be
done when using a capacitor input LC lowpass filter. The capacitor will appear as a short to the LVPECL output
drivers which are able to supply large amounts of switching current. The effect of the LVPECL sourcing large
switching currents can result in the following:
1. Large switching currents through the Vcc pin of the LVPECL power supply resulting in more Vcc noise and
possible Vcc spikes.
2. Large switching currents injected into the ground plane through the capacitor which could couple onto other
Vcc pins with bypass capacitors to ground resulting in more Vcc noise and possible Vcc spikes.
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10 Power Supply Recommendations
10.1 Pin Connection Recommendations
10.1.1 Vcc Pins and Decoupling
All Vcc pins must always be connected.
Integrated capacitance on the LMK0480x makes external high frequency decoupling capacitors (≤ 1 nF)
unnecessary. The internal capacitance is more effective at filtering high frequency noise than off device bypass
capacitance because there is no bond wire inductance between the LMK0480x circuit and the bypass capacitor.
10.1.1.1 Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs)
Each of these pins has an internal 200 pF of capacitance.
Ferrite beads may be used to reduce crosstalk between different clock output frequencies on the same
LMK0480x device. Ferrite beads placed between the power supply and a clock Vcc pin will reduce noise
between the Vcc pin and the power supply. When several output clocks share the same frequency a single ferrite
bead can be used between the power supply and each same frequency CLKout Vcc pin.
When using ferrite beads on CLKout Vcc pins, consider the following guidelines to ensure the power supply will
source the needed switching current:
• In most cases a ferrite bead may be placed and the internal capacitance is sufficient.
• If a ferrite bead is used with a low frequency output (typically ≤ 30 MHz) and a high current switching clock
output format such as non-complementary LVCMOS or high swing LVPECL is used, then:
– The ferrite bead can be removed to the lower impedance to the main power supply and bypass capacitors,
or
– Localized capacitance can be placed between the ferrite bead and Vcc pin to support the switching
current.
– Note: the decoupling capacitors used between the ferrite bead and a CLKout Vcc pin can permit high
frequency switching noise to couple through the capacitors into the ground plane and onto other
CLKout Vcc pins with decoupling capacitors. This can degrade crosstalk performance.
– It is recommended to use a complementary LVCMOS output format such as LVCMOS (Norm/Inv) to
reduce switching noise and crosstalk when using LVCMOS. If only a single LVCMOS output is required,
the complementary LVCMOS output format can still be used by leaving the unused LVCMOS output
floating.
10.1.1.2 Vcc1 (VCO), Vcc4 (Digital), and Vcc9 (PLL2)
Each of these pins has internal bypass capacitance.
Ferrite beads should not be used between these pins and the power supply/large bypass capacitors because
these Vcc pins don’t produce much noise and a ferrite bead can cause phase noise disturbances and
resonances.
The typical application diagram in Figure 40 shows all these Vccs connected to together to Vcc without a ferrite
bead.
10.1.1.3 Vcc6 (PLL1 Charge Pump) and Vcc8 (PLL2 Charge Pump)
Each of these pins has an internal bypass capacitor.
Use of a ferrite bead between the power supply/large bypass capacitors and PLL1 is optional. PLL1 charge
pump can be connected directly to Vcc along with Vcc1, Vcc4, and Vcc9. Depending on the application, a 0.1 uF
capacitor may be placed close to PLL1 charge pump Vcc pin.
A ferrite bead should be placed between the power supply/large bypass capacitors and Vcc8. Most applications
have high PLL2 phase detector frequencies and (> 50 MHz) such that the internal bypassing is sufficient and a
ferrite bead can be used to isolate this switching noise from other circuits. For lower phase detector frequencies
a ferrite bead is optional and depending on application a 0.1 uF capacitor may be added on Vcc8.
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Pin Connection Recommendations (continued)
10.1.1.4 Vcc5 (CLKin and OSCout1), Vcc7 (OSCin and OSCout0)
Each of these pins has an internal 100 pF of capacitance. No ferrite bead should be placed between the power
supply/large bypass capacitors and Vcc5 or Vcc7.
These pins are unique since they supply an output clock and other circuitry.
Vcc5 supplies CLKin and OSCout1.
Vcc7 supplies OSCin, OSCout0, and PLL2 circuitry.
Impacts of excessive noise on PLL2 circuitry may impact PLL2 DLD operation.
It is recommended to use a complementary LVCMOS output format such as LVCMOS (Norm/Inv) to reduce
switching noise and crosstalk when using LVCMOS. If only a single LVCMOS output is required, the
complementary LVCMOS output format can still be used by leaving the unused LVCMOS output floating.
10.1.2 LVPECL Outputs
When using an LVPECL output it is not recommended to place a capacitor to ground on the output as might be
done when using a capacitor input LC lowpass filter. The capacitor will appear as a short to the LVPECL output
drivers which are able to supply large amounts of switching current. The effect of the LVPECL sourcing large
switching currents can result in:
1. Large switching currents through the Vcc pin of the LVPECL power supply resulting in more Vcc noise and
possible Vcc spikes.
2. Large switching currents injected into the ground plane through the capacitor which could couple onto other
Vcc pins with bypass capacitors to ground resulting in more Vcc noise and possible Vcc spikes.
10.1.3 Unused Clock Outputs
Leave unused clock outputs floating and powered down.
10.1.4 Unused Clock Inputs
Unused clock inputs can be left floating.
10.1.5 LDO Bypass
The LDObyp1 and LDObyp2 pins should be connected to GND through external capacitors, as shown in
Figure 40.
10.2 Current Consumption and Power Dissipation Calculations
From Table 127 the current consumption can be calculated for any configuration.
For example, the current for the entire device with 1 LVDS (CLKout0) and 1 LVPECL 1.6 Vpp /w 240-Ω emitter
resistors (CLKout1) output active with a clock output divide = 1, and no other features enabled can be calculated
by adding up the following blocks: core current, clock buffer, one LVDS output buffer current, and one LVPECL
output buffer current. There will also be one LVPECL output drawing emitter current, which means some of the
power from the current draw of the device is dissipated in the external emitter resistors which doesn't add to the
power dissipation budget for the device but is important for LDO ICC calculations.
For total current consumption of the device, add up the significant functional blocks. In this example, 228.1 mA
equals the sum of the following:
• 140 mA (core current)
• 17.3 mA (base clock distribution)
• 25.5 mA (CLKout0 and 1 divider)
• 14.3 mA (LVDS buffer)
• 31 mA (LVPECL 1.6 Vpp buffer /w 240-Ω emitter resistors)
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Current Consumption and Power Dissipation Calculations (continued)
Once total current consumption has been calculated, power dissipated by the device can be calculated. The
power dissipation of the device is equation to the total current entering the device multiplied by the voltage at the
device minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no emitter
resistors are connected to the LVPECL outputs, this power will be 0 watts. Continuing the above example which
has 228.1 mA total Icc and one output with 240-Ω emitter resistors. Total IC power = 717.7 mW = 3.3 V * 228.1
mA - 35 mW.
Table 127. Typical Current Consumption for Selected Functional Blocks
(TA = 25 °C, VCC = 3.3 V)
BLOCK
CONDITION
TYPICAL
ICC
(mA)
POWER
POWER
DISSIPATED
DISSIPATED
EXTERNALL
in DEVICE
Y (1) (2) (3)
(mW)
(mW)
CORE and FUNCTIONAL BLOCKS
MODE = 0: Dual Loop, Internal
VCO
PLL1 and PLL2 locked
140
462
-
MODE = 2: Dual Loop, Internal
VCO, 0-Delay
PLL1 and PLL2 locked; Includes
EN_FEEDBACK_MUX = 1
155
512
-
MODE = 3: Dual Loop, External
VCO
PLL1 and PLL2 locked
127
419
-
MODE = 6: Single Loop (PLL2),
Internal VCO
PLL2 locked
116
383
-
MODE = 11: Single Loop (PLL2),
External VCO
PLL2 locked
103
340
-
144
475
PD_OSCin = 0
42
139
-
PD_OSCin = 1
34.5
114
-
2
6.6
-
17.3
57.1
-
Each CLKout group (CLKout0/1 and 10/11, CLKout2/3 and 4/5, CLKout
6/7 and 8/9)
2.8
9.2
-
Clock Divider/
Digital Delay
When a clock output is enabled, this contributes the divider/delay block
25.5
84.1
-
Divider / digital delay in extended mode
29.6
97.7
-
VCO Divider
VCO Divider current
7.7
25.4
-
HOLDOVER mode
When in holdover mode
2.2
7.2
-
Feedback Mux
Feedback mux must be enabled for 0-delay modes and digital delay
mode (SYNC_QUAL = 1)
4.9
16.1
-
SYNC Asserted
While SYNC is asserted, this extra current is drawn
1.7
5.6
-
EN_SYNC = 1
Required for SYNC functionality. May be turned off once SYNC is
complete to save power.
6
19.8
-
SYNC_QUAL = 1
Delay enabled, delay > 7 (CLKout_MUX = 2, 3)
Core
MODE = 15: Dual PLL, 0-DELAY,
External VCO
MODE = 16: Clock Distribution
EN_TRACK
Tracking is enabled (EN_TRACK = 1)
Base Clock
Distribution
At least 1 CLKoutX_Y_PD = 0
CLKout Group
Crystal Mode
OSCin Doubler
(1)
(2)
(3)
Enabling the Crystal Oscillator
EN_PLL2_REF_2X = 1
8.7
28.7
-
XTAL_LVL = 0
1.8
5.9
-
XTAL_LVL = 1
2.7
9
-
XTAL_LVL = 2
3.6
12
-
XTAL_LVL = 3
4.5
15
-
2.8
9.2
-
Power is dissipated externally in LVPECL emitter resistors. The externally dissipated power is calculated as twice the DC voltage level
of one LVPECL clock output pin squared over the emitter resistance. That is to say power dissipated in emitter resistors = 2 * Vem2 /
Rem.
Assuming R θJA = 15 °C/W, the total power dissipated on chip must be less than (125 °C – 85 °C) / 16 °C/W = 2.5 W to ensure a
junction temperature is less than 125 °C.
Worst case power dissipation can be estimated by multiplying typical power dissipation with a factor of 1.15.
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Current Consumption and Power Dissipation Calculations (continued)
Table 127. Typical Current Consumption for Selected Functional Blocks
(TA = 25 °C, VCC = 3.3 V) (continued)
BLOCK
TYPICAL
ICC
(mA)
CONDITION
Analog Delay Value
Analog Delay
POWER
POWER
DISSIPATED
DISSIPATED
EXTERNALL
in DEVICE
Y (1) (2) (3)
(mW)
(mW)
CLKoutX_Y_ANLG_DLY = 0 to 3
3.4
11.2
-
CLKoutX_Y_ANLG_DLY = 4 to 7
3.8
12.5
-
CLKoutX_Y_ANLG_DLY = 8 to 11
4.2
13.9
-
CLKoutX_Y_ANLG_DLY = 12 to
15
4.7
15.5
-
CLKoutX_Y_ANLG_DLY = 16 to
23
5.2
17.2
-
2.8
9.2
-
Only Single Output Of Clock Pair Has Analog Delay Selected. Example:
CLKout0_ADLY_SEL = 1 and CLKout1_ADLY_SEL = 0, or
CLKout0_ADLY_SEL = 0 and CLKout1_ADLY_SEL = 1.
CLOCK OUTPUT BUFFERS
LVDS
100-Ω differential termination
LVPECL
LVCMOS
128
14.3
47.2
-
LVPECL 2.0 Vpp, AC coupled using 240-Ω emitter resistors
32
70.6
35
LVPECL 1.6 Vpp, AC coupled using 240-Ω emitter resistors
31
67.3
35
LVPECL 1.6 Vpp, AC coupled using 120-Ω emitter resistors
46
91.8
60
LVPECL 1.2 Vpp, AC coupled using 240-Ω emitter resistors
30
59
40
LVPECL 0.7 Vpp, AC coupled using 240-Ω emitter resistors
29
55.7
40
LVCMOS Pair (CLKoutX_TYPE
= 6 to 9)
CL = 5 pF
3 MHz
24
79.2
-
30 MHz
26.5
87.5
-
150 MHz
36.5
120.5
-
LVCMOS Single (CLKoutX_TYPE
= 10 to 13)
CL = 5 pF
3 MHz
15
49.5
-
30 MHz
16
52.8
-
150 MHz
21.5
71
-
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11 Layout
11.1 Layout Guidelines
Power consumption of the LMK0480x family of devices can be high enough to require attention to thermal
management. For reliability and performance reasons the die temperature should be limited to a maximum of
125 °C. That is, as an estimate, TA (ambient temperature) plus device power consumption times RθJA should not
exceed 125 °C.
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent
electrical grounding to a printed circuit board. To maximize the removal of heat from the package a thermal land
pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the
package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package.
A recommended land and via pattern is shown in Figure 41. More information on soldering WQFN packages can
be obtained from www.ti.com/packaging/. See also the packaging information in Mechanical, Packaging, and
Orderable Information.
To minimize junction temperature, it is recommended that a simple heat sink be built into the PCB (if the ground
plane layer is not exposed). This is done by including a copper area on the opposite side of the PCB from the
device. This copper area may be plated or solder coated to prevent corrosion, but should not have conformal
coating (if possible), which could provide thermal insulation. The vias shown in Figure 41 should connect these
top and bottom copper layers and to the ground layer. These vias act as “heat pipes” to carry the thermal energy
away from the device side of the board to where it can be more effectively dissipated. Avoid routing traces close
to exposed ground pad to ensure proper thermal flow on the PCB.
7.2 mm
0.2 mm
1.46 mm
1.15 mm
Figure 41. Recommended Land and Via Pattern
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11.2 Layout Example
CLKin and OSCin path ± if differential input (preferred) route trace
tightly coupled like clock outputs. If single ended, have at least 3 trace
width (of CLKin/OSCin trace) separation from other RF traces.
Example shown is hybrid for both differential and single ended ± not
tightly couple to compromise for both configurations. RF Terminations
should be placed as close to IC as possible. When using CLKin1 for
high frequency input for external VCO or distribution, a 3 dB pi pad is
suggested for termination.
)RU&/.RXW9FF¶VSODFHIHUULWHEHDGVRQWRSOD\HUFORVHWRSLQVWRFKRNH
high frequency noise from via.
Charge pump output ± shorter traces are better.
Place all resistors and caps closer to IC except for
a single capacitor next to VCXO. In a 2nd order
filter place C1 close to VCXO Vtune pin. In a 3rd
and 4th order filter place C3 or C4 respectively
close to VCXO.
Clock outputs ± differential signals, should be
routed tightly coupled to minimize PCB crosstalk.
Trace impedance and terminations should be
designed according to output type being used (i.e.
LVDS, LVPECL...)
Figure 42. LMK0480x Layout Example
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
For additional support, see the following:
• Clock Design Tool: http://www.ti.com/tool/clockdesigntool
• Clock Architect: http://www.ti.com/lsds/ti/analog/webench/clock-architect.page
12.2 Documentation Support
12.2.1 Related Documentation
For additional information, see the following:
• Common Data Transmission Parameters and their Definitions, Application Note AN-912 (SNLA036)
• Crystal Based Oscillator Design with the LMK04000 Family, Application Note AN-1939 (SNAA065)
• Frequency Synthesis and Planning for PLL Architectures, Application Note AN-1865 (SNAA061)
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 128. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMK04803
Click here
Click here
Click here
Click here
Click here
LMK04805
Click here
Click here
Click here
Click here
Click here
LMK04806
Click here
Click here
Click here
Click here
Click here
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12.4 Trademarks
PLLatinum is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2011–2014, Texas Instruments Incorporated
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Product Folder Links: LMK04803 LMK04805 LMK04806 LMK04808
131
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jul-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMK04803BISQ/NOPB
ACTIVE
WQFN
NKD
64
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04803BISQ
LMK04803BISQE/NOPB
ACTIVE
WQFN
NKD
64
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04803BISQ
LMK04803BISQX/NOPB
ACTIVE
WQFN
NKD
64
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04803BISQ
LMK04805BISQ/NOPB
ACTIVE
WQFN
NKD
64
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04805BISQ
LMK04805BISQE/NOPB
ACTIVE
WQFN
NKD
64
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04805BISQ
LMK04805BISQX/NOPB
ACTIVE
WQFN
NKD
64
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04805BISQ
LMK04806BISQ/NOPB
ACTIVE
WQFN
NKD
64
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04806BISQ
LMK04806BISQE/NOPB
ACTIVE
WQFN
NKD
64
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04806BISQ
LMK04806BISQX/NOPB
ACTIVE
WQFN
NKD
64
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04806BISQ
LMK04808BISQ/NOPB
ACTIVE
WQFN
NKD
64
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04808BISQ
LMK04808BISQE/NOPB
ACTIVE
WQFN
NKD
64
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04808BISQ
LMK04808BISQX/NOPB
ACTIVE
WQFN
NKD
64
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
K04808BISQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jul-2014
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMK04803BISQ/NOPB
WQFN
NKD
64
LMK04803BISQE/NOPB
WQFN
NKD
LMK04803BISQX/NOPB
WQFN
NKD
LMK04805BISQ/NOPB
WQFN
LMK04805BISQE/NOPB
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
64
250
178.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
64
2000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
NKD
64
1000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
WQFN
NKD
64
250
178.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
LMK04805BISQX/NOPB
WQFN
NKD
64
2000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
LMK04806BISQ/NOPB
WQFN
NKD
64
1000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
LMK04806BISQE/NOPB
WQFN
NKD
64
250
178.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
LMK04806BISQX/NOPB
WQFN
NKD
64
2000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
LMK04808BISQ/NOPB
WQFN
NKD
64
1000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
LMK04808BISQE/NOPB
WQFN
NKD
64
250
178.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
LMK04808BISQX/NOPB
WQFN
NKD
64
2000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMK04803BISQ/NOPB
WQFN
NKD
64
1000
367.0
367.0
38.0
LMK04803BISQE/NOPB
WQFN
NKD
64
250
213.0
191.0
55.0
LMK04803BISQX/NOPB
WQFN
NKD
64
2000
367.0
367.0
38.0
LMK04805BISQ/NOPB
WQFN
NKD
64
1000
367.0
367.0
38.0
LMK04805BISQE/NOPB
WQFN
NKD
64
250
213.0
191.0
55.0
LMK04805BISQX/NOPB
WQFN
NKD
64
2000
367.0
367.0
38.0
LMK04806BISQ/NOPB
WQFN
NKD
64
1000
367.0
367.0
38.0
LMK04806BISQE/NOPB
WQFN
NKD
64
250
213.0
191.0
55.0
LMK04806BISQX/NOPB
WQFN
NKD
64
2000
367.0
367.0
38.0
LMK04808BISQ/NOPB
WQFN
NKD
64
1000
367.0
367.0
38.0
LMK04808BISQE/NOPB
WQFN
NKD
64
250
213.0
191.0
55.0
LMK04808BISQX/NOPB
WQFN
NKD
64
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
NKD0064A
WQFN - 0.8 mm max height
SCALE 1.600
WQFN
9.1
8.9
B
A
PIN 1 INDEX AREA
0.5
0.3
9.1
8.9
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
0.8 MAX
C
SEATING PLANE
(0.1)
TYP
7.2 0.1
SEE TERMINAL
DETAIL
32
17
60X 0.5
33
16
4X
7.5
1
PIN 1 ID
(OPTIONAL)
48
64
49
64X
0.5
0.3
64X
0.3
0.2
0.1
0.05
C A
C
B
4214996/A 08/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
NKD0064A
WQFN - 0.8 mm max height
WQFN
(
7.2)
SYMM
64X (0.6)
64X (0.25)
64
SEE DETAILS
49
1
48
60X (0.5)
SYMM
(8.8)
(1.36)
TYP
( 0.2) VIA
TYP
8X (1.31)
16
33
32
17
(1.36) TYP
8X (1.31)
(8.8)
LAND PATTERN EXAMPLE
SCALE:8X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214996/A 08/2013
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note
in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
NKD0064A
WQFN - 0.8 mm max height
WQFN
SYMM
64X (0.6)
64X (0.25)
(1.36) TYP
64
49
1
48
(1.36)
TYP
60X (0.5)
SYMM
(8.8)
METAL
TYP
33
16
32
17
25X
(1.16)
(8.8)
SOLDERPASTE EXAMPLE
BASED ON 0.125mm THICK STENCIL
EXPOSED PAD
65% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
4214996/A 08/2013
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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