Hanbit HMN5128D-150I Non-volatile sram module 4mbit (512k x 8-bit),32pin-dip, 5v Datasheet

HANBit
HMN5128D
Non-Volatile SRAM MODULE 4Mbit (512K x 8-Bit),32Pin-DIP, 5V
Part No. HMN5128D
GENERAL DESCRIPTION
The HMN5128D Nonvolatile SRAM is a 4,194,304-bit static RAM organized as 524,288 bytes by 8 bits.
The HMN5128D has a self-contained lithium energy source provide reliable non-volatility coupled with the unlimited write
cycles of standard SRAM and integral control circuitry which constantly monitors the single 5V supply for an out-oftolerance condition. When such a condition occurs, the lithium energy source is automatically switched on to sustain the
memory until after Vcc returns valid and write protection is unconditionally enabled to prevent garbled data. In addition the
SRAM is unconditionally write-protected to prevent an inadvertent write operation. At this time the integral energy source is
switched on to sustain the memory until after VCC returns valid.
The HMN5128D uses extremely low standby current CMOS SRAM’s, coupled with small lithium coin cells to provide nonvolatility without long write-cycle times and the write-cycle limitations associated with EEPROM.
FEATURES
PIN ASSIGNMENT
w Access time : 70, 85,120, 150 ns
A18
w High-density design : 4Mbit Design
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
w Battery internally isolated until power is applied
w Industry-standard 32-pin 512K x 8 pinout
w Unlimited write cycles
w Data retention in the absence of VCC
w 10-years minimum data retention in absence of power
w Automatic write-protection during power-up/power-down
cycles
w Data is automatically protected during power loss
w Conventional SRAM operation; unlimited write cycles
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
A15
A17
/WE
A13
A8
A9
A11
/OE
A10
/CE
DQ7
DQ6
DQ5
DQ4
DQ3
32-pin Encapsulated Package
OPTIONS
MARKING
w Timing
70 ns
-70
85 ns
-85
120 ns
-120
150 ns
-150
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HANBit
HMN5128D
FUNCTIONAL DESCRIPTION
The HMN5128D executes a read cycle whenever /WE is inactive(high) and /CE is active(low). The address specified by
the address inputs(A0-A18) defines which of the 524,288 bytes of data is accessed. Valid data will be available to the eight
data output drivers within tACC (access time) after the last address input signal is stable.
When power is valid, the HMN5128D operates as a standard CMOS SRAM. During power-down and power-up cycles, the
HMN5128D acts as a nonvolatile memory, automatically protecting and preserving the memory contents.
The HMN5128D is in the write mode whenever the /WE and /CE signals are in the active (low) state after address inputs
are stable. The later occurring falling edge of /CE or /WE will determine the start of the write cycle. The write cycle is
terminated by the earlier rising edge of /CE or /WE. All address inputs must be kept valid throughout the write cycle. /WE
must return to the high state for a minimum recovery time (tWR) before another cycle can be initiated. The /OE control
signal should be kept inactive (high) during write cycles to avoid bus contention. However, if the output bus been enabled
(/CE and /OE active) then /WE will disable the outputs in tODW from its falling edge.
The HMN5128D provides full functional capability for Vcc greater than 4.5 V and write protects by 4.37 V nominal. Powerdown/power-up control circuitry constantly monitors the Vcc supply for a power-fail-detect threshold VPFD. When VCC falls
below the VPFD threshold, the SRAM automatically write-protects the data. All inputs to the RAM become “don’t care” and
all outputs are high impedance. As Vcc falls below approximately 3 V, the power switching circuit connects the lithium
energy soure to RAM to retain data. During power-up, when Vcc rises above approximately 3.0 volts, the power switching
circuit connects external Vcc to the RAM and disconnects the lithium energy source. Normal RAM operation can resume
after Vcc exceeds 4.5 volts.
BLOCK DIAGRAM
/OE
PIN DESCRIPTION
A0-A18
512K x 8
A0-A18 : Address Input
SRAM
/WE
/CE : Chip Enable
Block
DQ0-DQ7
Power
/CE
VSS : Ground
DQ0-DQ7 : Data In / Data Out
/CE CON
/WE : Write Enable
VCC
Power – Fail
/OE : Output Enable
Control
VCC: Power (+5V)
Lithium
Cell
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NC : No Connection
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HMN5128D
TRUTH TABLE
/OE
/CE
/WE
I/O OPERATION
POWER
Not selected
MODE
X
H
X
High Z
Standby
Output disable
H
L
H
High Z
Active
Read
L
L
H
DOUT
Active
Write
X
L
L
DIN
Active
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
VCC
-0.3V to 7.0V
VT
-0.3V to 7.0V
Operating temperature
TOPR
0 to 70°C
Storage temperature
TSTG
-40°C to 70°C
Temperature under bias
TBIAS
-10°C to 70°C
TSOLDER
260°C
DC voltage applied on VCC relative to VSS
DC Voltage applied on any pin excluding VCC
relative to VSS
Soldering temperature
CONDITIONS
VT≤ VCC+0.3
For 10 second
NOTE: Permanent device damage may occur if Absolute Maximum Ratings are exceeded.
Functional operation should be restricted to the Recommended DC Operating Conditions detailed in this data sheet.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS ( TA= TOPR )
PARAMETER
SYMBOL
MIN
TYPICAL
MAX
Supply Voltage
VCC
4.5V
5.0V
5.5V
Ground
VSS
0
0
0
Input high voltage
VIH
2.2
-
Vcc+0.3V
Input low voltage
VIL
-0.3
-
0.8V
NOTE: Typical values indicate operation at TA = 25℃
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HMN5128D
DC ELECTRICAL CHARACTERISTICS (TA= TOPR, VCCmin £ VCC ≤ VCCmax )
PARAMETER
Input Leakage Current
Output Leakage Current
CONDITIONS
SYMBOL
VIN=VSS to VCC
/CE=VIH or /OE=VIH
or /WE=VIL
MIN
TYP.
MAX
UNIT
mA
ILI
-
-
± 1
ILO
-
-
± 1
mA
Output high voltage
IOH=-1.0mA
VOH
2.4
-
-
V
Output low voltage
IOL= 2.1mA
VOL
-
-
0.4
V
Standby supply current
/CE=VIH
ISB
-
3
3
㎃
ISB1
-
0.1
100
mA
ICC
-
-
90
㎃
Power-fail-detect voltage
VPFD
4.30
4.37
4.50
V
Supply switch-over voltage
VSO
-
3
-
V
/CE≥ VCC-0.2V,
Standby supply current
0V≤ VIN≤ 0.2V,
or VIN≥ VCC-0.2V
Min.cycle,duty=100%,
Operating supply current
/CE=VIL, II/O=0㎃ ,
A17< VIL or A17> VIH,
A18< VIL or A18> VIH
NOTE: Typical values indicate operation at TA = 25℃ .
CAPACITANCE (TA=25℃ , f=1MHz, VCC=5.0V)
DESCRIPTION
Input Capacitance
Input/Output Capacitance
CONDITIONS
SYMBOL
MAX
MIN
UNIT
Input voltage = 0V
CIN
10
-
pF
Output voltage = 0V
CI/O
8
-
pF
CHARACTERISTICS (Test Conditions)
PARAMETER
Input pulse levels
0 to 3V
Input rise and fall times
5 ns
Input and output timing
1.5V
reference levels
Output load
(including scope and jig)
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Rev. 0.0 (April, 2002)
+5V
VALUE
1.9KΩ
DOUT
+5V
100㎊
1KΩ
1.9KΩ
DOUT
5㎊
1KΩ
( unless otherwise specified)
See Figures 1and 2
4
Figure 1.
Figure 2.
Output Load A
Output Load B
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HANBit
HMN5128D
READ CYCLE (TA= TOPR, VCCmin £ VCC≤ VCCmax )
PARAMETER
SYMBOL
-70
CONDITIONS
-85
-120
-150
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
70
-
85
-
120
-
150
-
ns
Read Cycle Time
tRC
Address Access Time
tACC
Output load A
-
70
-
85
-
120
-
150
ns
Chip enable access time
tACE
Output load A
-
70
-
85
-
120
-
150
ns
Output enable to Output valid
tOE
Output load A
-
35
-
45
-
60
-
70
ns
Chip enable to output in low Z
tCLZ
Output load B
5
-
5
-
5
-
10
-
ns
Output enable to output in low Z
tOLZ
Output load B
5
-
0
-
0
-
5
-
ns
Chip disable to output in high Z
tCHZ
Output load B
0
25
0
35
0
45
0
60
ns
Output disable to output high Z
tOHZ
Output load B
0
25
0
25
0
35
0
50
ns
Output hold from address change
tOH
Output load A
10
-
10
-
10
-
10
-
ns
WRITE CYCLE (TA= TOPR, Vccmin £ Vcc ≤ Vccmax )
PARAMETER
SYMBOL
Write Cycle Time
tWC
Chip enable to end of write
tCW
Address setup time
tAS
Address valid to end of write
tAW
Write pulse width
Write recovery time (write cycle 1)
Write recovery time (write cycle 2)
tWP
tWR1
tWR2
Data valid to end of write
Data hold time (write cycle 1)
Data hold time (write cycle 2)
Write enabled to output in high Z
Output active from end of write
Note 1
Note 2
tDH2
tWZ
tOW
MIN
MAX
Min
Max
T
70
-
85
-
120
-
150
-
ns
-
100
-
ns
-
0
-
ns
-
90
-
ns
-
90
-
ns
-
5
-
ns
-
15
-
ns
-
50
-
ns
-
0
-
ns
-
0
-
ns
40
0
50
ns
-
5
-
ns
5
Note 3
15
30
Note 4
0
Note 4
10
Note 5
0
Note 5
UNI
MAX
55
Note 3
-150
MIN
65
Note 1
-120
MAX
0
Note 1
-85
MIN
65
tDW
tDH1
-70
CONDITIONS
5
25
-
75
0
75
65
5
15
35
0
10
0
0
30
-
100
0
100
85
5
15
45
0
10
0
0
NOTE: 1. A write ends at the earlier transition of /CE going high and /WE going high.
2. A write occurs during the overlap of allow /CE and a low /WE. A write begins at the later transition of /CE
going low and /WE going low.
3. Either tWR1 or tWR2 must be met.
4. Either tDH1 or tDH2 must be met.
5. If /CE goes low simultaneously with /WE going low or after /WE going low, the outputs remain in highimpedance state.
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HMN5128D
POWER-DOWN/POWER-UP CYCLE (TA= TOPR, VCC=5V)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP.
MAX
UNIT
VCC slew, 4.75 to 4.25V
tPF
300
-
-
㎲
VCC slew, 4.75 to VSO
tFS
10
-
-
㎲
tPU
0
-
-
㎲
40
80
120
ms
10
-
-
years
40
100
150
㎲
VCC slew, VSO to VPFD
(max)
Time during which SRAM
Chip enable recovery time
tCER
is
write-protected
after
VCC
passes VPFD on power-up.
Data-retention time in
TA = 25℃
tDR
Absence of VCC
Delay after VCC slews
Write-protect time
tWPT
down
past VPFD before SRAM is
Write-protected.
TIMING WAVEFORM
- READ CYCLE NO.1 (Address Access)*1,2
tRC
Address
tACC
tOH
Previous Data Valid
DOUT
Data Valid
- READ CYCLE NO.2 (/CE Access)*1,3,4
tRC
/CE
tACE
tCHZ
tCLZ
DOUT
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High-Z
High-Z
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HMN5128D
- READ CYCLE NO.3 (/OE Access)*1,5
tRC
Address
tACC
/OE
tOE
DOUT
NOTES:
tOHZ
tOLZ
Data Valid
High-Z
High-Z
1. /WE is held high for a read cycle.
2. Device is continuously selected: /CE = /OE =VIL.
3. Address is valid prior to or coincident with /CE transition low.
4. /OE = VIL.
5. Device is continuously selected: /CE = VIL
- WRITE CYCLE NO.1 (/WE-Controlled)*1,2,3
tWC
Address
tAW
tWR1
tCW
/CE
tAS
tWP
/WE
tDW
DIN
Data-in Valid
tWZ
DOUT
Rev. 0.0 (April, 2002)
tOW
High-Z
Data Undefined (1)
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tDH1
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HMN5128D
- WRITE CYCLE NO.2 (/CE-Controlled)*1,2,3,4,5
tWC
Address
tAW
tAS
tWR2
tCW
/CE
tWP
/WE
tDH2
tDW
Data-in Valid
DIN
tWZ
DOUT
High-Z
Data Undefined (2)
NOTE:
1. /CE or /WE must be high during address transition.
2. Because I/O may be active (/OE low) during this period, data input signals of opposite
polarity to the outputs must not be applied.
3. If /OE is high, the I/O pins remain in a state of high impedance.
4. Either tWR1 or tWR2 must be met.
5. Either tDH1 or tDH2 must be met.
- POWER-DOWN/POWER-UP TIMING
VCC
4.75
VPFD
tPF
VPFD
4.25
VSO
tFS
tWPT
tPU
tDR
tCER
VSO
/CE
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HMN5128D
PACKAGE DIMENSION
Dimension
Min
Max
A
1.470
1.500
B
0.710
0.740
C
0.365
0.375
D
0.012
-
E
0.008
0.013
F
0.590
0.630
G
0.017
0.023
H
0.090
0.110
I
0.075
0.110
J
0.120
0.150
J
A
I
H
G
B
C
D
E
F
ORDERING INFORMATION
H M N 5128 D – 70 I
Operating Temp. : Blank = Commercial (0 to 70 °C )
I = Industrial (-40 to 85°C)
Speed options : 70 = 70 ns
85 = 85 ns
120 = 120 ns
150 = 150 ns
Dip type package
Device : 512K x 8 bit
Nonvolatile SRAM
HANBit Memory Module
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