TI CD4023BMT The cd4011b, cd4012b, and cd4023b types are supplied in 14-lead hermetic dual-in-line ceramic package Datasheet

Data sheet acquired from Harris Semiconductor
SCHS021D – Revised September 2003
The CD4011B, CD4012B, and CD4023B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PWR suffix). The CD4011B and
CD4023B types also are supplied in 14-lead thin
shrink small-outline packages (PW suffix).
Copyright  2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
89265AKB3T
OBSOLETE
CFP
WR
14
None
Call TI
Call TI
89266AKB3T
OBSOLETE
CFP
WR
16
None
Call TI
Call TI
89273AKB3T
OBSOLETE
CFP
WR
14
None
Call TI
Call TI
CD4011BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
Lead/Ball Finish
MSL Peak Temp (3)
CD4011BF
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4011BF3A
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4011BM
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4011BM96
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4011BMT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4011BNSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4011BPW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4011BPWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4012BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4012BF3A
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4012BM
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4012BM96
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4012BMT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4012BNSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4012BPWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4023BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4023BF
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4023BF3A
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4023BM
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4023BM96
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4023BMT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4023BNSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4023BPW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4023BPWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
JM38510/05051BCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
JM38510/05052BCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
JM38510/05053BCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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