Microchip C1411EPA 1a high-speed mosfet driver Datasheet

TC1411/TC1411N
1A High-Speed MOSFET Drivers
Features
Description
• Latch-Up Protected: Will Withstand 500 mA
Reverse Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 1A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1000 pF in 25 nsec
• Short Delay Time: 30 nsec Typ.
• Matched Delay Times
• Low Supply Current
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 8Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1410/TC1412/TC1413
The TC1411/TC1411N are 1A CMOS buffers/drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
As MOSFET drivers, the TC1411/TC1411N can easily
charge a 1000 pF gate capacitance in 25 nsec with
matched rise and fall times, and provide low enough
impedance in both the ON and the OFF states to
ensure the MOSFET’s intended state will not be
affected, even by large transients. The leading and
trailing edge propagation delay times are also matched
to allow driving short-duration inputs with greater
accuracy.
Package Types
Applications
•
•
•
•
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Relay Driver
8-Pin MSOP/PDIP/SOIC
VDD 1
8 VDD
VDD 1
IN 2
7 OUT
IN 2
6 OUT
NC 3
TC1411
NC 3
GND 4
8 VDD
TC1411N
5 GND GND 4
2
6,7
Inverting
7 OUT
6 OUT
5 GND
2
6,7
Non-Inverting
NC = No Internal Connection
Note:
© 2006 Microchip Technology Inc.
Duplicate pins must be connected
together for proper operation.
DS21390D-page 1
TC1411/TC1411N
Functional Block Diagram
TC1411
VDD
Inverting
Outputs
300 mV
Output
Non-Inverting
Outputs
Input
Effective
Input C = 10 pF
4.7V
TC1411N
GND
DS21390D-page 2
© 2006 Microchip Technology Inc.
TC1411/TC1411N
1.0
ELECTRICAL
CHARACTERISTICS
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings †
Supply Voltage ..................................................... +20V
Input Voltage ...................... VDD + 0.3V to GND – 5.0V
Power Dissipation (TA ≤ 70°C)
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range .............. -65°C to +150°C
Maximum Junction Temperature ...................... +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.0
Logic ‘0’, Low Input Voltage
VIL
—
—
—
V
—
0.8
V
Input Current
IIN
-1.0
—
1.0
µA
-10
—
10
Conditions
Input
0V ≤ VIN ≤ VDD, TA = +25°C
-40°C ≤ TA ≤ +85°C
Output
High Output Voltage
VOH
VDD – 0.025
—
—
Low Output Voltage
VOL
—
—
Output Resistance
RO
—
8
V
DC Test
0.025
V
DC Test
11
Ω
VDD = 16V, IO = 10 mA, TA = +25°C
—
10
14
0°C ≤ TA ≤ +70°C
—
10
14
-40°C ≤ TA ≤ +85°C
VDD = 16V
Peak Output Current
IPK
—
1.0
—
A
Latch-Up Protection
Withstand Reverse Current
IREV
—
0.5
—
A
Duty cycle ≤ 2%, t ≤ 300 µs,
VDD = 16V
tR
—
25
35
ns
TA = +25°C
—
27
40
—
29
40
—
25
35
ns
TA = +25°C
—
27
40
0°C ≤ TA ≤ +70°C
—
29
40
—
30
40
ns
-40°C ≤ TA ≤ +85°C, Figure 4-1
TA = +25°C,
—
33
45
—
35
45
—
30
40
—
33
45
—
35
45
—
0.5
1.0
—
0.1
0.15
Switching Time (Note 1)
Rise Time
Fall Time
tF
Delay Time
Delay Time
tD1
tD2
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
Power Supply
Power Supply Current
Note 1:
IS
mA
VIN = 3V, VDD = 16V
VIN = 0V
Switching times ensured by design.
© 2006 Microchip Technology Inc.
DS21390D-page 3
TC1411/TC1411N
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range (C)
TA
0
—
+70
ºC
Specified Temperature Range (E)
TA
-40
—
+85
ºC
Specified Temperature Range (V)
TA
-40
—
+125
ºC
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
Thermal Resistance, 8L-MSOP
θJA
—
206
—
ºC/W
Thermal Resistance, 8L-PDIP
θJA
—
125
—
ºC/W
Thermal Resistance, 8L-SOIC
θJA
—
155
—
ºC/W
Conditions
Temperature Ranges
Package Thermal Resistances
DS21390D-page 4
© 2006 Microchip Technology Inc.
TC1411/TC1411N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
500
500
TA = +25°C
400
VIN = 3V
ISUPPLY (µA)
ISUPPLY (µA)
400
300
200
100
0
VSUPPLY = 16V
VIN = 3V
6
8
10
12
14
200
100
VIN = 0V
4
300
VIN = 0V
0
16
-40
-20
VDD (V)
FIGURE 2-1:
Quiescent Supply Current
vs. Supply Voltage.
1.6
FIGURE 2-4:
vs. Temperature.
1.6
TA = +25°C
1.4
1.3
VIL
1.2
40
60
80
Quiescent Supply Current
VSUPPLY = 16V
4
VIH
1.4
1.3
VIL
1.2
6
8
10
12
14
16
1.1
-40
-20
VDD (V)
FIGURE 2-2:
Voltage.
Input Threshold vs. Supply
FIGURE 2-5:
Temperature.
TA = +85°C
40
60
80
Input Threshold vs.
20
TA = +25°C
15
10
TA = -40°C
TA = +85°C
15
TA = +25°C
10
5
5
0 4
20
25
RDS-ON (Ohms)
20
0
TEMPERATURE (°C)
25
RDS-ON (Ohms)
20
1.5
VIH
VTHRESHOLD (V)
VTHRESHOLD (V)
1.5
1.1
0
TEMPERATURE (°C)
6
8
10
VDD (V)
12
14
FIGURE 2-3:
High-State Output
Resistance vs. Supply Voltage.
© 2006 Microchip Technology Inc.
16
0
TA = -40°C
4
6
8
10
VDD (V)
12
14
16
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage.
DS21390D-page 5
TC1411/TC1411N
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
100
100
CLOAD = 1000 pF
80
TA = +85°C
tFALL (nsec)
tRISE (nsec)
80
60
TA = +25°C
40
20
0
4
6
8
100
10
VDD (V)
60
TA = +85°C
TA = +25°C
40
20
TA = -40°C
FIGURE 2-7:
Voltage.
TA = -40°C
12
14
0
16
4
6
8
10
Rise Time vs. Supply
FIGURE 2-10:
Voltage.
100
CLOAD = 1000 pF
tD2 (nsec)
TA = +85°C
TA = +25°C
40
20
CLOAD = 1000 pF
TA = +85°C
60
TA = +25°C
40
TA = -40°C
20
4
6
8
FIGURE 2-8:
Supply Voltage.
100
10
VDD (V)
12
14
0
16
Propagation Delay vs.
4
6
8
FIGURE 2-11:
Supply Voltage.
10
VDD (V)
12
14
16
Propagation Delay vs.
36
TA = +25°C
VDD = 16V
Propagation Delays (nsec)
TA = +25°C
VDD = 16V
80
tRISE, tFALL (nsec)
16
Fall Time vs. Supply
TA = -40°C
tRISE
60
tFALL
40
20
0
14
80
60
0
12
VDD (V)
80
tD1 (nsec)
CLOAD = 1000 pF
tD2
34
32
tD1
30
28
26
0
500
1000
1500
2000
2500
3000
3500
0
500
FIGURE 2-9:
Capacitive Load.
DS21390D-page 6
Rise and Fall Times vs.
1000
1500
2000
2500
3000
3500
CLOAD (pF)
CLOAD (pF)
FIGURE 2-12:
Capacitive Load.
Propagation Delays vs.
© 2006 Microchip Technology Inc.
TC1411/TC1411N
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin
No.
PIN FUNCTION TABLE
Symbol
Description
Supply input, 4.5V to 16V
1
VDD
2
INPUT
3
NC
4
GND
Ground
5
GND
Ground
6
OUTPUT
CMOS push-pull output, common to pin 7
7
OUTPUT
CMOS push-pull output, common to pin 6
8
VDD
3.1
Control input
No connection
Supply input, 4.5V to 16V
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2
Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds that
prevents output glitching even when the rise and fall
time of the input signal is very slow.
© 2006 Microchip Technology Inc.
3.3
CMOS Push-pull Output (OUTPUT)
The MOSFET driver output is a low impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 1A peak currents.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents which discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.5
No Connect (NC)
No internal connection.
DS21390D-page 7
TC1411/TC1411N
4.0
APPLICATION INFORMATION
+5V
90%
Input
VDD = 16V
0V
4.7 µF
0.1 µF
1, 8
Input
10%
tD1
tD2
tF
VDD
tR
90%
90%
Output
2
6, 7
Output
10%
10%
0V
CL = 1000 pF
Inverting Driver
TC1411
TC1411N
TC1411
+5V
90%
Input
4, 5
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
0V
VDD
10%
tD1 90%
Output
0V
tR
10%
90%
tD2
tF
10%
Non-Inverting Driver
TC1411N
FIGURE 4-1:
DS21390D-page 8
Switching Time Test Circuit.
© 2006 Microchip Technology Inc.
TC1411/TC1411N
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Example:
8-Lead MSOP
1411NE
635256
XXXXXXX
YWWNNN
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example:
TC1411
e3
CPA^^256
0635
Example:
TC1411C
e3
OA^^0635
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS21390D-page 9
TC1411/TC1411N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
α
c
φ
L
F
A2
A
A1
β
Units
INCHES
MIN
Dimension Limits
MILLIMETERS*
NOM
MAX
NOM
MIN
MAX
Number of Pins
n
Pitch
p
Overall Height
A
-
-
.043
-
-
1.10
Molded Package Thickness
A2
.030
.033
.037
0.75
0.85
0.95
Standoff
A1
.000
-
.006
0.00
-
0.15
Overall Width
E
.193 BSC
4.90 BSC
Molded Package Width
E1
.118 BSC
3.00 BSC
Overall Length
D
.118 BSC
Foot Length
L
0.60
0.80
Footprint (Reference)
Foot Angle
F
φ
Lead Thickness
c
.003
.006
.009
0.08
Lead Width
B
α
.009
.012
.016
0.22
Mold Draft Angle Top
Mold Draft Angle Bottom
β
8
8
.026 BSC
.016
0.65 BSC
3.00 BSC
.024
.031
0.40
.037 REF
0°
0.95 REF
-
8°
0°
-
8°
-
0.23
-
0.40
5°
-
15°
5°
-
15°
5°
-
15°
5°
-
15°
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21390D-page 10
Revised 07-21-05
© 2006 Microchip Technology Inc.
TC1411/TC1411N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
INCHES*
NOM
8
.100
.155
.130
MAX
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
4.32
Molded Package Thickness
.115
.145
3.68
A2
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
8.26
Molded Package Width
E1
.240
.250
.260
6.60
Overall Length
D
.360
.373
.385
9.78
Tip to Seating Plane
L
.125
.130
.135
3.43
c
Lead Thickness
.008
.012
.015
0.38
Upper Lead Width
B1
.045
.058
.070
1.78
Lower Lead Width
B
.014
.018
.022
0.56
Overall Row Spacing
§
eB
.310
.370
.430
10.92
α
Mold Draft Angle Top
5
10
15
15
β
Mold Draft Angle Bottom
5
10
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
© 2006 Microchip Technology Inc.
MIN
MIN
DS21390D-page 11
TC1411/TC1411N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MAX
Number of Pins
Pitch
Overall Height
A
.053
.069
1.75
Molded Package Thickness
A2
.052
.061
1.55
Standoff
§
A1
.004
.010
0.25
Overall Width
E
.228
.244
6.20
Molded Package Width
.146
.157
3.99
E1
Overall Length
D
.189
.197
5.00
Chamfer Distance
h
.010
.020
0.51
Foot Length
L
.019
.030
0.76
φ
Foot Angle
0
8
8
c
Lead Thickness
.008
.010
0.25
Lead Width
B
.013
.020
0.51
α
Mold Draft Angle Top
0
15
15
β
Mold Draft Angle Bottom
0
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21390D-page 12
MIN
A1
MIN
© 2006 Microchip Technology Inc.
TC1411/TC1411N
APPENDIX A:
REVISION HISTORY
Revision D (September 2006)
• Added -40°C to +125°C temperature range to
Temperature Characteristics table and Product
Information System page.
• Added disclaimer to package outline drawings.
Revision C (March 2003)
• Added 8-Lead MSOP Package.
Revision B (May 2002)
• Converted TELCOM data sheet for Embedded
Control Handbook
Revision A (March 2001)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS21390D-page 13
TC1411/TC1411N
NOTES:
DS21390D-page 14
© 2006 Microchip Technology Inc.
TC1411/TC1411N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Examples:
a)
TC1411COA:
b)
TC1411CPA:
Device:
TC1411: 1 A Single MOSFET Driver, Inverting
TC1411N: 1 A Single MOSFET Driver, Non-Inverting
c)
TC1411EUA713:
Temperature Range:
C
E
V
d)
TC1411VOA713:
Package:
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
a)
TC1411NCPA:
b)
TC1411NEPA:
c)
TC1411NEUA:
d)
TC1411NVPA:
=
=
=
0°C to +70°C
-40°C to +85°C
-40°C to +125°C
* MSOP package is only available in E-Temp.
© 2006 Microchip Technology Inc.
1A Single MOSFET driver,
8LD SOIC pkg,
0°C to +70°C.
1A Single MOSFET driver,
8LD PDIP package,
0°C to +70°C.
Tape and Reel,
1A Single MOSFET driver,
8LD MSOP package,
-40°C to +85°C.
Tape and Reel,
1A Single MOSFET driver,
8LD SOIC pkg,
-40°C to +125°C.
1A Single MOSFET driver,
8LD PDIP package,
0°C to +70°C.
1A Single MOSFET driver,
8LD PDIP package,
-40°C to +85°C.
1A Single MOSFET driver,
8LD MSOP package,
-40°C to +85°C.
1A Single MOSFET driver,
8LD PDIP package,
-40°C to +125°C
DS21390D-page 15
TC1411/TC1411N
NOTES:
DS21390D-page 16
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21390D-page 17
WORLDWIDE SALES AND SERVICE
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08/29/06
DS21390D-page 18
© 2006 Microchip Technology Inc.