NL17SZ04 Single Inverter The NL17SZ04 is an inverter in two tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. Features • • • • • • • Tiny SOT−353 and SOT−553 Packages 24 mA Sink and Source Output Capability Over−Voltage Tolerant Inputs and Outputs Pin For Pin with NC7SZ04P5X, TC7SZ04FU and TC7SZ04AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb−Free Packages are Available http://onsemi.com MARKING DIAGRAMS 5 5 L5d 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A 5 1 d = Date Code 5 1 NC 1 IN A 2 GND 3 5 SOT−553 XV5 SUFFIX CASE 463B VCC L5 D 4 OUT Y 1 1 = Device Marking = One Digit Date Code PIN ASSIGNMENT Figure 1. Pinout (Top View) IN A L5 D Pin Function 1 NC 2 IN A 3 GND 4 OUT Y 5 VCC OUT Y FUNCTION TABLE Figure 2. Logic Symbol A Input Y Output L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 6 1 Publication Order Number: NL17SZ04/D NL17SZ04 MAXIMUM RATINGS Symbol VCC Parameter Value Unit 0.5 to 7.0 V 0.5 VI +7.0 V 0.5 VO +7.0 V VI < GND 50 mA VO < GND 50 mA DC Supply Voltage VI DC Input Voltage VO DC Output Voltage Output in Higher or Low State (Note 1) IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Supply Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias JA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification 260 °C 150 °C SOT−353 (Note 2) SOT−553 350 496 °C/W SOT−353 SOT−553 186 135 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Class IC Class A N/A Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 3. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 4. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage TA Operating Temperature Range tr, tf Input Rise and Fall Time Operating Data Retention (High or Low State) VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V −40 +85 °C 0 0 0 20 10 5 ns/V NL17SZ04 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL VOL IIN Low−Level Output Voltage VIN = VIH Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current −40C ≤ TA ≤ 85C TA = 25C VCC (V) Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Unit V 0.25 VCC 0.3 VCC IOH = −100 A 1.65 to 5.5 VCC − 0.1 VCC VCC − 0.1 IOH = −3 mA 1.65 1.29 1.52 1.29 IOH = −8 mA 2.3 1.9 2.1 1.9 IOH = −12 mA 2.7 2.2 2.4 2.2 IOH = −16 mA 3.0 2.4 2.7 2.4 IOH = −24 mA 3.0 2.3 2.5 2.3 IOH = −32 mA 4.5 3.8 4.0 IOL = 100 A 1.65 to 5.5 0.0 0.1 0.1 IOH = 3 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN = VCC or GND 0 to 5.5 1.0 VOUT = 5.5 V or VIN = 5.5 V 0 VIN = VCC or GND 1.65 to 5.5 V V 3.8 V 10.0 A 1 10 A 1 10 A ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 −40C ≤ TA ≤ 85C TA = 25C Symbol tPLH tPHL7 Condition VCC (V) Min Typ Max Min Max Unit RL = 1 M CL = 15 pF 1.65 1.8 2.0 2.0 5.3 4.4 11.4 9.5 2.0 2.0 12.0 10.0 ns RL = 1 M CL = 15 pF 2.5 0.2 0.2 3.5 6.5 0.8 7.0 RL = 1 M CL = 15 pF 3.3 0.3 0.8 2.1 4.5 0.5 4.7 1.2 2.9 5.5 1.5 5.2 0.5 1.8 3.9 0.5 4.1 0.8 2.4 4.3 0.8 4.5 Parameter Propagation Delay (Figure 3 and 4) RL = 500 CL = 50 pF RL = 1 M CL = 15 pF 5.0 0.5 RL = 500 CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance (Note 6) Condition Typical Unit VCC = 5.5 V, VI = 0 V or VCC 2.5 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL17SZ04 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% 10% 10% tPHL OUTPUT GND tPLH RL INPUT CL VOH OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL17SZ04DFT2 NL 1 NL17SZ04DFT2G NL NL17SZ04XV5T2 NL Device Order Number Technology Device Function Package Suffix Tape and Reel Suffix 7 SZ 04 DF 1 7 SZ 04 1 7 SZ 04 Package Type Tape and Reel Size† T2 SC−88A/ SOT−353/ SC70−5 178 mm, 3000 Unit DF T2 SC−88A/ SOT−353/ SC70−5 (Pb−Free) 178 mm, 3000 Unit XV5 T2 SOT−553* 178 mm, 4000 Unit †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb−Free. http://onsemi.com 4 NL17SZ04 PACKAGE DIMENSIONS SOT−353 DF SUFFIX 5−LEAD PACKAGE CASE 419A−02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ04 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX 5−LEAD PACKAGE CASE 463B−01 ISSUE A A −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. C K 4 1 2 B −Y− 3 D G S DIM A B C D G J K S J 5 PL 0.08 (0.003) M X Y MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 STYLE 1: PIN 1. 2. 3. 4. 5. INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 BASE 1 EMITTER 1/2 BASE 2 COLLECTOR 2 COLLECTOR 1 STYLE 2: PIN 1. 2. 3. 4. 5. CATHODE ANODE CATHODE CATHODE CATHODE SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 For additional information, please contact your local Sales Representative. NL17SZ04/D