General Features • Complete Key Fob IC Consisting of an AVR® Microcontroller and RF Transmitter PLL in • • • • • • • • • • • • • • a Single QFN24 5 mm x 5 mm Package (Pitch 0.65 mm) – f0 = 310 MHz to 350 MHz (ATA5773) – f0 = 429 MHz to 439 MHz (ATA5774) – f0 = 868 MHz to 928 MHz (ATA5771) Automotive Qualified Temperature Range –40° C to +85° C ESD Protection: HBM 2500V, MM 100V, CDM 1000V Supply voltage 2.0V to 4.0V for Single Li-cell Power Supply Low Power Consumption – Active Mode: Typical 9.6 mA at 3.0V and 1 MHz Microcontroller-clock – Power-down Mode: Typical 200 nA at 3.0V Modulation Scheme ASK/FSK Integrated PLL Loop Filter High Output Power (8 dBm at 315 MHz/7.5 dBm at 433 MHz/ 5.5 dBm at 868 MHz) High Performance, Low Power AVR 8-bit Microcontroller Advanced RISC Architecture Non-volatile Program and Data Memories – 4KByte of In-system Programmable Program Memory Flash – 256 Bytes In-system Programmable EEPROM – 256 Bytes Internal SRAM Peripheral Features – Two Timer/Counter, 8- and 16-bit Counters with Two PWM Channels on Both – 10-bit ADC – Programmable Watchdog Timer with Separate On-chip Oscillator – Universal Serial Interface (USI) Special Microcontroller Features – debugWIRE On-chip Debug System – In-system Programmable via SPI Port – External and Internal Interrupt Sources – Pin Change Interrupt on 12 Pins – Enhanced Power-on Reset Circuit – Programmable Brown-out Detection Circuit – Internal Calibrated Oscillator – On-chip Temperature Sensor 12 Programmable I/O Lines Microcontroller with UHF ASK/FSK Transmitter ATA5771 ATA5773 ATA5774 1. General Description The ATA5771/ATA5773/ATA5774 is a single key fob IC containing the AVR microcontroller ATtiny44V and the UHF PLL transmitters T5750/53/54 build-up using a stacked die technique supplied in a QFN24 5 mm x 5 mm package. These devices have been specially developed for the demands of RF low-cost data transmission systems with data rates of up to 32 kBit/s. Its main applications are in the areas of Remote Keyless-Entry (RKE), Passive Entry Go (PEG), and Remote Start. It can be used in the frequency range of f 0 = 310 MHz to 350 MHz, f 0 = 429 MHz to 439 MHz or f0 = 868 MHz to 928 MHz for ASK or FSK data transmission. 9137A–RKE–10/08 Figure 1-1. ASK System Block Diagram UHF ASK/FSK Remote Control Transmitter ATA5771/73/74 S1 PXY S1 PXY GND S1 PXY PXY PXY PXY PXY PXY PXY PXY PXY PXY ATtiny44 T5750 T5753 T5754 CLK f/4 XTO VDD Power up/down PLL VCO VS ENABLE UHF ASK/FSK Remote Control Receiver ATA5760 ATA5761 ATA5723 ATA5724 ATA5728 ATA5745 ATA5746 GND_RF VCC_RF VS 1 to 6 Demod Control Microcontroller Antenna PA_ENABLE PLL XTO ANT2 PA Loop Antenna LNA ANT1 VCO VS 2 ATA5771/ATA5773/ATA5774 9137A–RKE–10/08 ATA5771/ATA5773/ATA5774 Figure 1-2. FSK System Block Diagram UHF ASK/FSK Remote Control Transmitter ATA5771/73/74 S1 PXY S1 PXY GND S1 PXY PXY PXY PXY PXY PXY PXY PXY PXY PXY ATtiny44 T5750 T5753 T5754 CLK f/4 XTO VDD Power up/down PLL VCO VS ENABLE UHF ASK/FSK Remote Control Receiver ATA5760 ATA5761 ATA5723 ATA5724 ATA5728 ATA5745 ATA5746 GND_RF VCC_RF VS 1 to 6 Demod Control Microcontroller Antenna PA_ENABLE PLL XTO ANT2 PA Loop Antenna LNA ANT1 VCO VS 3 9137A–RKE–10/08 2. Pin Configuration ENABLE GND_RF VS_RF XTAL GND Pinning QFN24 5 mm x 5 mm GND 24 23 22 21 20 19 18 2 17 PA1 PB1 3 16 PA2 PB3/RESET 4 15 PA3/T0 PB2 5 14 PA4/USCK PA7 6 PA5/MISO PA6/MOSI 7 Table 2-1. 4 8 9 10 11 13 12 GND PB0 ANT1 PA0 ANT2 1 CLK VCC PA_ENABLE Figure 2-1. Pin Description Pin Symbol Function 1 VCC Microcontroller supply voltage 2 PB0 Port B is a 4-bit bi-directional I/O port with internal pull-up resistor 3 PB1 4 PB3/RESET Port B is a 4-bit bi-directional I/O port with internal pull-up resistor 5 PB2 Port B is a 4-bit bi-directional I/O port with internal pull-up resistor 6 PA7 Port A is a 4-bit bi-directional I/O port with internal pull-up resistor 7 PA6 / MOSI Port A is a 4-bit bi-directional I/O port with internal pull-up resistor 8 CLK Port B is a 4-bit bi-directional I/O port with internal pull-up resistor/reset input Clock output signal for microcontroller. The clock output frequency is set by the crystal to fXTAL/4 9 PA_ENABLE 10 ANT2 Switches on power amplifier, used for ASK modulation 11 ANT1 Open collector antenna output 12 GND Ground 13 PA5/MISO Port A is a 4-bit bi-directional I/O port with internal pull-up resistor 14 PA4/SCK Port A is a 4-bit bi-directional I/O port with internal pull-up resistor 15 PA3/T0 Port A is a 4-bit bi-directional I/O port with internal pull-up resistor 16 PA2 Port A is a 4-bit bi-directional I/O port with internal pull-up resistor 17 PA1 Port A is a 4-bit bi-directional I/O port with internal pull-up resistor 18 PA0 Port A is a 4-bit bi-directional I/O port with internal pull-up resistor Emitter of antenna output stage 19 GND Microcontroller ground 20 XTAL Connection for crystal 21 VS_RF 22 GND_RF Transmitter ground Transmitter supply voltage 23 ENABLE Enable input 24 GND Ground GND Ground/backplane (exposed die pad) ATA5771/ATA5773/ATA5774 9137A–RKE–10/08 ATA5771/ATA5773/ATA5774 3. Functional Description For a typical key fob application 3-4 interconnections between the microcontroller and the transmitter are required (see Figure 1-1 on page 2 and Figure 1-2 on page 3). The CLK line is used to allow the microcontroller to generate an XTAL-based transmitter signal. The ENABLE line is used to start the XTO, PLL, and clock output of the transmitter. The PA_ENABLE line is used to enable the power amplifier in ASK and FSK mode. In FSK mode a 4th line is necessary to modulate the load capacity of the XTAL. To wake-up the system from standby mode at least one key input is required. After pressing the key, the microcontroller starts up with the internal RC oscillator. For TX operation user software must control ENABLE, PA_ENABLE and XTAL load capacity as described in the following section. If ENABLE = L and PA_ENABLE = L the transmitter and the microcontroller (MCU) are in standby mode, reducing the power consumption so that a lithium cell can be used as power supply for several years. If ENABLE = H and PA_ENABLE = L, the XTO, PLL and the CLK driver from the transmitter are activated. The crystal oscillator together with the PLL from the RF transmitter typically requires < 1 ms (ATA5774 < 3 ms) until the PLL is locked and the clock output (Pin 8) is stable. If ENABLE = H and PA_ENABLE = H, the XTO, PLL, CLK driver and the Power Amplifier (PA) are switched on. The ASK modulation is done by switching on/off the power amplifier via PA_ENABLE. The FSK modulation is done by switching on/off an additional capacitor between the XTAL load capacitor and GND, thus changing the reference frequency of the PLL. This is done using a MOS switch controlled by a microcontroller output. The power amplifier is switched on via PA_ENABLE = H. The MCU has to wait at least > 1 ms ATA5774 (> 3 ms ATA5773, > 4 ms ATA5771) after setting ENABLE = H, before the external clock can be used. The external clock is connected via the timer0 input pin that clocks the USI from the MCU to achieve an accurate data transfer. The frequency of the internal RC oscillator is affected by ambient temperature and operating voltage. The USI provides 2 two serial synchronous data transfer modes, with different physical I/O ports for the data output. The two wire mode is used for ASK and the three wire mode is used for FSK. Table 3-1. Typical Current Consumption in Active Mode at 3.0V and 25°C Type Transmitter Microcontroller (1 MHz Internal RC Oscillator) Total ATA5771 8.5 mA 0.6 mA 9.1 mA ATA5773 9.0 mA 0.6 mA 9.6 mA ATA5774 9.0 mA 0.6 mA 9.6 mA Table 3-2. Current Consumption in Power-down Mode at 3.0V and –40°C to +85°C Type Transmitter Microcontroller (Watchdog Timer Disabled) Total Typ. < 10 nA Max. 350 nA Typ. 150 nA Max. 1.0 µA Typ. < 160 nA Max. 1.35 µA ATA5771 ATA5773 ATA5774 5 9137A–RKE–10/08 4. UHF ASK/FSK Transmitter Block • Integrated PLL Loop Filter • Maximum Output Power (ATA5771: 5.5 dBm, ATA5773: 8.0 dBm, ATA5774: 7.5 dBm) with Low Supply Current • Modulation Scheme ASK/FSK • • • • – FSK Modulation is Achieved by Switching on/off an Additional Capacitor Between the XTAL Load Capacitor and GND. This is Done Using a MOS Switch Controlled by a Microcontroller Output. Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply Supply Voltage 2.0V to 4.0V in the Temperature Range of –40° C to +85° C Single-ended Antenna Output with High Efficient Power Amplifier External CLK Output for Clocking the Microcontroller More detailed information about the UHF ASK/FSK Transmitter Block can be found in Appendix 1, 2 and 3. ATA5771 see Appendix 1: Data sheet T5750 (868 MHz band) ATA5773 see Appendix 2: Data sheet T5753 (315 MHz band) ATA5774 see Appendix 3: Data sheet T5754 (433 MHz band) Table 4-1. Transmitter Pin Cross Reference List Note: 6 Pin Name Pin Number T5750/53/54 Pin Number ATA5771/73/74 CLK 1 8 PA_ENABLE 2 9 ANT2 3 10 ANT1 4 11 XTAL 5 20 VS 6 21 GND 7 22 ENABLE 8 23 For the ATA5771/ATA5773/ATA5774 following points differs in the data sheets: - The temperature range is limited to –40° C to +85° C - ESD protection: HBM 3000V, MM 100V, CDM 1000V - Figure 4-1 on page 7: Two output power measurement - For FSK modulation an additional MOS switch is required ATA5771/ATA5773/ATA5774 9137A–RKE–10/08 ATA5771/ATA5773/ATA5774 Figure 4-1. Output Power Measurement ATA5771/ATA5773/ATA5774 VS C1 = 1 nF L1 Power meter ANT1 Z = 50Ω ZLopt C2 Rin 50Ω ANT2 Table 4-2. Output Power Measurement ATA5771/ATA5773/ATA5774 Device L1 C2 ATA5771 10 nH 0.5 pF ATA5773 47 nH 3.3 pF ATA5774 33 nH 2.4 pF 7 9137A–RKE–10/08 5. Microcontroller Block • High-performance Low-power AVR 8-bit Microcontroller • Advanced Risc Architecture • Non-volatile Program and Data Memory • • • • • • • • • • – 4KByte of In-system Programmable Program Flash – Endurance: 10.000 Write/Erase Cycles – 256 Bytes In-system Programmable EEPROM – Endurance: 100.000 Write/Erase Cycles – 256 Bytes Internal SRAM Programming Lock for Self-programming Flash Program and EEPROM Data Security Peripheral Features – Two Timer/Counter, 8- and 16-bit Counters with Two PWM Channels on Both Programmable Watchdog Timer with Separate On-chip Oscillator On-chip Analog Comparator – Universal Serial Interface Special Microcontroller Features – Debug Wire On-chip Debug System – In-system Programmable via SPI Port – External and Internal Interrupt Sources – Pin Change Interrupt on 12 Pins – Low Power Idle, ADC Noise Reduction, Standby and Power-down Modes – Enhanced Power-on Reset Circuit – Programmable Brown-out Detection Circuit – Internal Calibrated Oscillator – On-chip Temperature Sensor 12 Programmable I/O Lines Operating Voltage – 1.8V to 5.5V Speed Grade – 0 to 4 MHz at 1.8V to 5.5V Temperature Range – –40° C to +85° C Low Power Consumption – Active Mode: 1 MHz, 1.8V, 380 µA – Power Down Mode: 1.8V, 100 nA More detailed information about the Microcontroller Block can be found in Appendix 4. ATA5771, ATA5773, ATA5774 8 see Appendix 4: Datasheet ATtiny44V ATA5771/ATA5773/ATA5774 9137A–RKE–10/08 ATA5771/ATA5773/ATA5774 Table 5-1. Note: Microcontroller Cross Reference List Pin Name Pin Number ATtiny44V Pin Number ATA5771/ATA5773/ATA5774 VCC 1 1 PB0 2 2 PB1 3 3 PB3/NRESET 4 4 PB2 5 5 PA7 6 6 PA6/MOSI 7 7 PA5/MISO 8 13 PA4/USCK 9 14 PA3/T0 10 15 PA2 11 16 PA1 12 17 PA0 13 18 GND 14 19 For the ATA5771/ATA5773/ATA5774 following points differs in the data sheet ATtiny44V: - The temperature range is limited to –40° C to +85° C - The supply voltage range is limited from 2.0V to 4.0V 9 9137A–RKE–10/08 6. Application Figure 6-1. Typical ASK Application ATA5771/ATA5773/ATA5774 VCC 68 nF VCC 20 19 SW1 GND 21 XTAL 22 VS_RF 1 23 GND_RF GND 24 ENABLE VCC 18 PA0 2 SW2 17 PB0 PA1 PB1 PA2 3 16 ATA577x 4 SW3 15 PA3/T0 PB3/RESET 5 14 PA4/SCK 7 8 9 13 10 GND ANT1 PA5/MISO ANT2 PA_ENABLE PA7 CLK 6 PA6/MOSI PB2 11 12 VCC RF Choke 10 ATA5771/ATA5773/ATA5774 9137A–RKE–10/08 ATA5771/ATA5773/ATA5774 Figure 6-2. Typical FSK Application ATA5771/ATA5773/ATA5774 VCC 68 nF VCC 20 19 SW1 GND 21 XTAL 22 VS_RF 1 23 GND_RF GND 24 ENABLE VCC 18 PA0 2 SW2 17 PB0 PA1 PB1 PA2 3 16 ATA577x 4 SW3 15 PA3/T0 PB3/RESET 5 14 PA4/SCK 7 8 9 13 10 GND ANT1 PA5/MISO ANT2 PA_ENABLE PA7 CLK 6 PA6/MOSI PB2 11 12 VCC RF Choke 11 9137A–RKE–10/08 7. Ordering Information Extended Type Number Package Remarks ATA5771-PXQW QFN24 5 mm x 5 mm Microcontroller with UHF Tx for 868 MHz to 928 MHz ATA5773-PXQW QFN24 5 mm x 5 mm Microcontroller with UHF Tx for 310 MHz to 350 MHz ATA5774-PXQW QFN24 5 mm x 5 mm Microcontroller with UHF Tx for 429 MHZ to 439 MHz 8. Package Information Package: QFN 24 - 5 x 5 Exposed pad 3.6 x 3.6 (acc. JEDEC OUTLINE No. MO-220) Dimensions in mm Not indicated tolerances ±0.05 5 0.9±0.1 +0 3.6 0.05-0.05 24 19 1 24 0.4 18 0.3 6 1 technical drawings according to DIN specifications 13 6 12 7 0.65 nom. Drawing-No.: 6.543-5122.01-4 Issue: 1; 15.11.05 12 3.25 ATA5771/ATA5773/ATA5774 9137A–RKE–10/08 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-en-Yvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2008 Atmel Corporation. All rights reserved. Atmel®, Atmel logo and combinations thereof, AVR® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 9137A–RKE–10/08 Features • Integrated PLL Loop Filter • ESD Protection also at ANT1/ANT2 (4 kV HBM/200V MM; Except Pin 2: 4 kV HBM/100V MM) • High Output Power (5.5 dBm) with Low Supply Current (8.5 mA) • Modulation Scheme ASK/FSK • • • • • • • • – FSK Modulation is Achieved by Connecting an Additional Capacitor Between the XTAL Load Capacitor and the Open Drain Output of the Modulating Microcontroller Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply Single Li-cell for Power Supply Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to +85°C/+125°C Package TSSOP8L Single-ended Antenna Output with High Efficient Power Amplifier CLK Output for Clocking the Microcontroller One-chip Solution with Minimum External Circuitry 125°C Operation for Tire Pressure Systems UHF ASK/FSK Transmitter T5750 1. Description The T5750 is a PLL transmitter IC which has been developed for the demands of RF low-cost transmission systems at data rates up to 32 kBaud. The transmitting frequency range is 868 MHz to 928 MHz. It can be used in both FSK and ASK systems. Figure 1-1. System Block Diagram UHF ASK/FSK Remote control transmitter UHF ASK/FSK Remote control receiver 1 Li cell T5750 T5760/ T5761 1 to 3 Demod Keys Encoder ATARx9x Control Microcontroller PLL Antenna XTO Antenna VCO LNA PLL LNA XTO VCO 4546E–RKE–02/07 2. Pin Configuration Figure 2-1. Pinning TSSOP8L CLK PA_ENABLE ANT2 ANT1 Table 2-1. Pin 1 2 3 4 8 7 6 5 ENABLE GND VS XTAL Pin Description Symbol Function Configuration VS 1 CLK Clock output signal for micro con roller The clock output frequency is set by the crystal to fXTAL/4 100Ω CLK 100Ω PA_ENABLE 2 PA_ENABLE 50 kΩ UREF = 1.1V Switches on power amplifier, used for ASK modulation 20 µA ANT1 3 ANT2 Emitter of antenna output stage 4 ANT1 Open collector antenna output ANT2 2 T5750 4546E–RKE–02/07 T5750 Table 2-1. Pin Pin Description (Continued) Symbol Function Configuration VS 1.5 kΩ 5 XTAL VS 1.2 kΩ Connection for crystal XTAL 182 µA 6 VS 7 GND 8 ENABLE Supply voltage See ESD protection circuitry (see Figure 4-5 on page 9) Ground See ESD protection circuitry (see Figure 4-5 on page 9) ENABLE Figure 2-2. 200 kΩ Enable input Block Diagram T5750 Power up/down f CLK ENABLE 4 1 8 f 64 PA_ENABLE GND 2 7 PDF CP ANT2 VS 6 3 LF ANT1 4 PA VCO XTO 5 XTAL PLL 3 4546E–RKE–02/07 3. General Description This fully integrated PLL transmitter allows particularly simple, low-cost RF miniature transmitters to be assembled. The VCO is locked to 64 × fXTAL hence a 13.5672 MHz crystal is needed for a 868.3 MHz transmitter and a 14.2969 MHz crystal for a 915 MHz transmitter. All other PLL and VCO peripheral elements are integrated. The XTO is a series resonance oscillator so that only one capacitor together with a crystal connected in series to GND are needed as external elements. The crystal oscillator together with the PLL needs typically < 1 ms until the PLL is locked and the CLK output is stable. There is a wait time of ≥ 4 ms must be used until the CLK is used for the microcontroller and the PA is switched on. The power amplifier is an open-collector output delivering a current pulse which is nearly independent from the load impedance. The delivered output power is hence controllable via the connected load impedance. This output configuration enables a simple matching to any kind of antenna or to 50Ω. A high power efficiency of η= Pout/(IS,PA × VS) of 24% for the power amplifier at 868.3 MHz results when an optimized load impedance of ZLoad = (166 + j226)Ω is used at 3V supply voltage. 4. Functional Description If ENABLE = L and the PA_ENABLE = L, the circuit is in standby mode consuming only a very small amount of current, so that a lithium cell used as power supply can work for several years. With ENABLE = H the XTO, PLL and the CLK driver are switched on. If PA_ENABLE remains L only the PLL and the XTO is running and the CLK signal is delivered to the microcontroller. The VCO locks to 64 times the XTO frequency. With ENABLE = H and PA_ENABLE = H the PLL, XTO, CLK driver and the power amplifier are on. With PA_ENABLE the power amplifier can be switched on and off, which is used to perform the ASK modulation. 4.1 ASK Transmission The T5750 is activated by ENABLE = H. PA_ENABLE must remain L for t ≥ 4 ms, then the CLK signal can be taken to clock the microcontroller and the output power can be modulated by means of pin PA_ENABLE. After transmission PA_ENABLE is switched to L and the microcontroller switches back to internal clocking. The T5750 is switched back to standby mode with ENABLE = L. 4.2 FSK Transmission The T5750 is activated by ENABLE = H. PA_ENABLE must remain L for t ≥ 4 ms, then the CLK signal can be taken to clock the microcontroller and the power amplifier is switched on with PA_ENABLE = H. The chip is then ready for FSK modulation. The microcontroller starts to switch on and off the capacitor between the XTAL load capacitor and GND with an open-drain output port, thus changing the reference frequency of the PLL. If the switch is closed, the output frequency is lower than if the switch is open. After transmission PA_ENABLE is switched to L and the microcontroller switches back to internal clocking. The T5750 is switched back to standby mode with ENABLE = L. The accuracy of the frequency deviation with XTAL pulling method is about ±25% when the following tolerances are considered. 4 T5750 4546E–RKE–02/07 T5750 Figure 4-1. Tolerances of Frequency Modulation VS CStray1 CStray2 LM C4 XTAL CM RS C0 C5 CSwitch Using C4 = 9.2 pF ±2%, C5 = 6.8 pF ±5%, a switch port with CSwitch = 3 pF ±10%, stray capacitances on each side of the crystal of CStray1 = CStray2 = 1 pF ±10%, a parallel capacitance of the crystal of C0 = 3.2 pF ±10% and a crystal with CM = 13 fF ±10%, an FSK deviation of ±21.5 kHz typical with worst case tolerances of ±16.8 kHz to ±28.0 kHz results. 4.3 CLK Output An output CLK signal is provided for a connected microcontroller, the delivered signal is CMOS compatible if the load capacitance is lower than 10 pF. 4.3.1 Clock Pulse Take-over The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel ® ’s ATARx9x has the special feature of starting with an integrated RC-oscillator to switch on the T5750 with ENABLE = H, and after 4 ms to assume the clock signal of the transmission IC, so that the message can be sent with crystal accuracy. 4.3.2 Output Matching and Power Setting The output power is set by the load impedance of the antenna. The maximum output power is achieved with a load impedance of ZLoad,opt = (166 + j226)Ω at 868.3 MHz. There must be a low resistive path to VS to deliver the DC current. The delivered current pulse of the power amplifier is 7.7 mA and the maximum output power is delivered to a resistive load of 475Ω if the 0.53 pF output capacitance of the power amplifier is compensated by the load impedance. An optimum load impedance of: Z Load = 475Ω || j/(2 × p × f × 0.53 pF) = (166 + j226)Ω thus results for the maximum output power of 5.5 dBm. The load impedance is defined as the impedance seen from the T5750’s ANT1, ANT2 into the matching network. Do not confuse this large signal load impedance with a small signal input impedance delivered as input characteristic of RF amplifiers and measured from the application into the IC instead of from the IC into the application for a power amplifier. Less output power is achieved by lowering the real parallel part of 475Ω where the parallel imaginary part should be kept constant. Output power measurement can be done with the circuit of Figure 4-2 on page 6. Note that the component values must be changed to compensate the individual board parasitics until the T5750 has the right load impedance ZLoad,opt = (166 + j226)Ω at 868.3 MHz. Also the damping of the cable used to measure the output power must be calibrated out. 5 4546E–RKE–02/07 Figure 4-2. Output Power Measurement VS C1 1 nF L1 C2 ANT1 ZLopt ANT2 4.4 10 nH 1.5 pF C3 Z = 50Ω Power meter Rin 2.7 pF 50Ω Application Circuit For the supply-voltage blocking capacitor C3 a value of 68 nF/X7R is recommended (see Figure 4-3 on page 7 and Figure 4-4 on page 8). C1 and C2 are used to match the loop antenna to the power amplifier where C1 typically is 3.9 pF/NP0 and C2 is 1 pF/NP0; for C2 two capacitors in series should be used to achieve a better tolerance value and to have the possibility to realize the ZLoad,opt by using standard valued capacitors. C1 forms together with the pins of T5750 and the PCB board wires a series resonance loop that suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally the best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and ANT2. The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop antenna is too high. L1 (≈ 50 nH to 100 nH) can be printed on PCB. C4 should be selected so that the XTO runs on the load resonance frequency of the crystal. Normally, a value of 12 pF results for a 15 pF load-capacitance crystal. 6 T5750 4546E–RKE–02/07 T5750 Figure 4-3. ASK Application Circuit S1 BPXY VDD ATARx9x VS 1 S2 VSS BPXY 20 BPXY BPXY OSC1 7 T5750 Power up/down CLK ENABLE f 4 1 8 f 64 GND PA_ENABLE 2 7 PDF C3 C2 CP VS ANT2 3 6 VS Loop Antenna LF C1 XTAL ANT1 4 PA VCO PLL L1 XTO XTAL 5 C4 VS 7 4546E–RKE–02/07 Figure 4-4. FSK Application Circuit S1 BPXY VDD ATARx9x VS 1 S2 VSS BPXY 20 BP42/T2O BPXY 18 BPXY OSC1 7 T5750 Power up/down CLK ENABLE f 4 1 8 f 64 PA_ENABLE GND 2 7 PDF C3 C2 CP ANT2 VS 3 Loop Antenna 6 VS LF C1 C5 ANT1 XTAL 4 PA VCO PLL L1 XTO XTAL 5 C4 VS 8 T5750 4546E–RKE–02/07 T5750 Figure 4-5. ESD Protection Circuit VS ANT1 CLK PA_ENABLE ANT2 XTAL ENABLE GND 5. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Maximum Unit Supply voltage Symbol VS 5 V Power dissipation Ptot 100 mW Tj 150 °C °C Junction temperature Minimum Storage temperature Tstg –55 125 Ambient temperature Tamb –55 125 Input voltage Note: VmaxPA_ENABLE –0.3 °C (VS + 0.3) (1) V 1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V. 6. Thermal Resistance Parameters Junction ambient Symbol Value Unit RthJA 170 K/W 7. Electrical Characteristics VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified. Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7). Parameters Test Conditions Supply current Power down, VENABLE < 0.25V, –40°C to 85°C VPA_ENABLE < 0.25V, –85°C to +125°C VPA_ENABLE < 0.25V, 25°C (100% correlation tested) Supply current Output power Note: Symbol Min. Typ. IS_Off Max. Unit 350 7 nA µA nA <10 Power up, PA off, VS = 3V, VENABLE > 1.7V, VPA_ENABLE < 0.25V IS 3.6 4.6 mA Power up, VS = 3.0, VENABLE > 1.7V, VPA_ENABLE > 1.7V IS_Transmit 8.5 11 mA 5.5 8 dBm VS = 3.0V, Tamb = 25°C, f = 868.3 MHz, ZLoad = (166 + j226)Ω PRef 3.5 1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V. 9 4546E–RKE–02/07 7. Electrical Characteristics (Continued) VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified. Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7). Parameters Test Conditions Output power variation for the full temperature range Tamb = –40°C to +85°C, VS = 3.0V VS = 2.0V Output power variation for the full temperature range Tamb = –40°C to +125°C, VS = 3.0V VS = 2.0V, POut = PRef + ∆PRef Achievable output-power range Selectable by load impedance Spurious emission fCLK = f0/128 Load capacitance at pin CLK = 10 pF fO ±1 × fCLK fO ±4 × fCLK other spurious are lower Oscillator frequency XTO (= phase comparator frequency) fXTO = f0/32 fXTAL = resonant frequency of the XTAL, CM ≤ 10 fF, load capacitance selected accordingly Tamb = –40°C to +85°C, Tamb = –40°C to +125°C Symbol Max. Unit ∆PRef ∆PRef –1.5 –4.0 dB dB ∆PRef ∆PRef –2.0 –4.5 dB dB +5.5 dBm POut_typ Min. Typ. –3 –52 –52 dBc dBc fXTO –30 –40 PLL loop bandwidth fXTAL +30 +40 250 ppm ppm kHz Phase noise of phase comparator Referred to fPC = fXT0, 25 kHz distance to carrier –116 –110 dBc/Hz In loop phase noise PLL 25 kHz distance to carrier –80 –74 dBc/Hz Phase noise VCO at 1 MHz at 36 MHz –89 –120 –86 –117 dBc/Hz dBc/Hz 928 MHz Frequency range of VCO fVCO 868 Clock output frequency (CMOS microcontroller compatible) Voltage swing at pin CLK f0/256 CLoad ≤ 10 pF Series resonance R of the crystal V0h V0l VS × 0.8 Rs Capacitive load at pin XT0 MHz VS × 0.2 V V 110 Ω 7 pF FSK modulation frequency rate Duty cycle of the modulation signal = 50% 0 32 kHz ASK modulation frequency rate Duty cycle of the modulation signal = 50% 0 32 kHz Low level input voltage High level input voltage Input current high 0.25 ENABLE input 20 V V µA 0.25 VS(1) 5 V V µA PA_ENABLE input Note: 10 Low level input voltage High level input voltage Input current high VIl VIh IIn VIl VIh IIn 1.7 1.7 1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V. T5750 4546E–RKE–02/07 T5750 8. Ordering Information Extended Type Number Package Remarks T5750-6AQJ TSSOP8L Taped and reeled, Marking: T570, Pb-free 9. Package Information 3±0.1 +0.06 0.31-0.07 0.65 nom. 3.8±0.3 4.9±0.1 +0.0 0.1±0.05 3±0.1 0.15-0.025 0.85±0.05 +0.05 1-0.15 Package: TSSOP 8L Dimensions in mm 3 x 0.65 = 1.95 nom. 8 5 technical drawings according to DIN specifications Drawing-No.: 6.543-5083.01-4 1 4 Issue: 2; 15.03.04 11 4546E–RKE–02/07 10. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. 12 Revision No. History 4546E-RKE-02/07 • Put datasheet in a new template • Pb-free logo on page 1 deleted 4546D-RKE-09/05 • Pb-free logo on page 1 added • Ordering Information on page 11 changed 4546C-RKE-05/05 • Put datasheet in a new template • Rename M4xCx9x in ATARx9x • Table “Absolute Maximum Ratings” on page 9: New heading rows added 4546B-RKE-07/04 • Table “Absolute Maximum Ratings” on page 9: row “Input voltage” added • Table “Absolute Maximum Ratings” on page 9: table note 1 added • Table “Electrical Characteristics” on pages 9 to 10: row “PA_ENABLE input” changed • Table “Electrical Characteristics” on pages 9 to 10: table note 1 added • Table “Ordering Informations” on page 11: Remarks changed T5750 4546E–RKE–02/07 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Biometrics Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-47-50 Fax: (33) 4-76-58-47-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2007 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, Everywhere You Are® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 4546E–RKE–02/07 Features • Integrated PLL Loop Filter • ESD Protection also at ANT1/ANT2 (4 kV HBM/200 V MM; Except Pin 2: 4 kV HBM/100 V MM) • High Output Power (8.0 dBm) with Low Supply Current (9.0 mA) • Modulation Scheme ASK/FSK • • • • • • • • – FSK Modulation is Achieved by Connecting an Additional Capacitor Between the XTAL Load Capacitor and the Open Drain Output of the Modulating Microcontroller Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply Single Li-cell for Power Supply Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to +85°C/125°C Package TSSOP8L Single-ended Antenna Output with High Efficient Power Amplifier CLK Output for Clocking the Microcontroller One-chip Solution with Minimum External Circuitry 125°C Operation for Tire Pressure Systems UHF ASK/FSK Transmitter T5753 1. Description The T5753 is a PLL transmitter IC which has been developed for the demands of RF low-cost transmission systems at data rates up to 32 kBaud. The transmitting frequency range is 310 MHz to 350 MHz. It can be used in both FSK and ASK systems. Figure 1-1. System Block Diagram UHF ASK/FSK Remote control transmitter UHF ASK/FSK Remote control receiver 1 Li cell T5753 Keys Encoder ATARx9x U3741B/ U3745B/ T5743/ T5744 1 to 3 Demod Control Microcontroller PLL Antenna XTO IF Amp Antenna VCO LNA PLL LNA XTO VCO 4510I–RKE–02/07 2. Pin Configuration Figure 2-1. Pinning TSSOP8L CLK PA_ENABLE ANT2 ANT1 Table 2-1. Pin 1 2 3 4 T5753 8 7 6 5 ENABLE GND VS XTAL Pin Description Symbol Function Configuration VS 1 CLK Clock output signal for microcontroller The clock output frequency is set by the crystal to fXTAL/4 100Ω CLK 100Ω PA_ENABLE 2 PA_ENABLE 50 kΩ UREF = 1.1V Switches on power amplifier, used for ASK modulation 20 µA ANT1 3 ANT2 Emitter of antenna output stage 4 ANT1 Open collector antenna output ANT2 2 T5753 4510I–RKE–02/07 T5753 Table 2-1. Pin Pin Description (Continued) Symbol Function Configuration VS 1.5 kΩ 5 XTAL VS 1.2 kΩ Connection for crystal XTAL 182 µA 6 7 VS GND 8 ENABLE Supply voltage Ground See ESD protection circuitry (see Figure 4-5 on page 9) See ESD protection circuitry (see Figure 4-5 on page 9) ENABLE Figure 2-2. 200 kΩ Enable input Block Diagram T5753 Power up/down f CLK ENABLE 4 1 8 f 32 PA_ENABLE GND 2 7 PDF CP ANT2 VS 6 3 LF ANT1 4 PA VCO XTO 5 XTAL PLL 3 4510I–RKE–02/07 3. General Description This fully integrated PLL transmitter allows particularly simple, low-cost RF miniature transmitters to be assembled. The VCO is locked to 32 fXTAL hence a 9.8438 MHz crystal is needed for a 315 MHz transmitter. All other PLL and VCO peripheral elements are integrated. The XTO is a series resonance oscillator so that only one capacitor together with a crystal connected in series to GND are needed as external elements. The crystal oscillator together with the PLL needs typically < 3 ms until the PLL is locked and the CLK output is stable. There is a wait time of ≥ 3 ms until the CLK is used for the microcontroller and the PA is switched on. The power amplifier is an open-collector output delivering a current pulse which is nearly independent from the load impedance. The delivered output power is hence controllable via the connected load impedance. This output configuration enables a simple matching to any kind of antenna or to 50 Ω. A high power efficiency of η= Pout/(IS,PA VS) of 40% for the power amplifier results when an optimized load impedance of ZLoad = (255 + j192) Ω is used at 3 V supply voltage. 4. Functional Description If ENABLE = L and the PA_ENABLE = L, the circuit is in standby mode consuming only a very small amount of current so that a lithium cell used as power supply can work for several years. With ENABLE = H the XTO, PLL and the CLK driver are switched on. If PA_ENABLE remains L only the PLL and the XTO is running and the CLK signal is delivered to the microcontroller. The VCO locks to 32 times the XTO frequency. With ENABLE = H and PA_ENABLE = H the PLL, XTO, CLK driver and the power amplifier are on. With PA_ENABLE the power amplifier can be switched on and off, which is used to perform the ASK modulation. 4.1 ASK Transmission The T5753 is activated by ENABLE = H. PA_ENABLE must remain L for typically ≥ 3 ms, then the CLK signal can be taken to clock the microcontroller and the output power can be modulated by means of Pin PA_ENABLE. After transmission PA_ENABLE is switched to L and the microcontroller switches back to internal clocking. The T5753 is switched back to standby mode with ENABLE = L. 4.2 FSK Transmission The T5753 is activated by ENABLE = H. PA_ENABLE must remain L for typically ≥ 3 ms, then the CLK signal can be taken to clock the microcontroller and the power amplifier is switched on with PA_ENABLE = H. The chip is then ready for FSK modulation. The microcontroller starts to switch on and off the capacitor between the XTAL load capacitor and GND with an open-drain output port, thus changing the reference frequency of the PLL. If the switch is closed, the output frequency is lower than if the switch is open. After transmission PA_ENABLE is switched to L and the microcontroller switches back to internal clocking. The T5753 is switched back to standby mode with ENABLE = L. The accuracy of the frequency deviation with XTAL pulling method is about ±25% when the following tolerances are considered. 4 T5753 4510I–RKE–02/07 T5753 Figure 4-1. Tolerances of Frequency Modulation VS CStray1 CStray2 LM C4 XTAL CM RS C0 Crystal equivalent circuit C5 CSwitch Using C4 = 8.2 pF ±5%, C5 = 10 pF ±5%, a switch port with CSwitch = 3 pF ±10%, stray capacitances on each side of the crystal of CStray1 = CStray2 = 1 pF ±10%, a parallel capacitance of the crystal of C0 = 3.2 pF ±10% and a crystal with CM = 13 fF ±10%, an FSK deviation of ±21.5 kHz typical with worst case tolerances of ±16.25 kHz to ±28.01 kHz results. 4.3 CLK Output An output CLK signal is provided for a connected microcontroller, the delivered signal is CMOS compatible if the load capacitance is lower than 10 pF. 4.3.1 Clock Pulse Take-over The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel ® ’s ATARx9x has the special feature of starting with an integrated RC-oscillator to switch on the T5753 with ENABLE = H, and after 1 ms to assume the clock signal of the transmission IC, so that the message can be sent with crystal accuracy. 4.3.2 Output Matching and Power Setting The output power is set by the load impedance of the antenna. The maximum output power is achieved with a load impedance of ZLoad,opt = (255 + j192)Ω. There must be a low resistive path to VS to deliver the DC current. The delivered current pulse of the power amplifier is 9 mA and the maximum output power is delivered to a resistive load of 400Ω if the 1.0 pF output capacitance of the power amplifier is compensated by the load impedance. An optimum load impedance of: ZLoad = 400Ω || j/(2 × π 1.0 pF) = (255 + j192)Ω thus results for the maximum output power of 8 dBm. The load impedance is defined as the impedance seen from the T5753’s ANT1, ANT2 into the matching network. Do not confuse this large signal load impedance with a small signal input impedance delivered as input characteristic of RF amplifiers and measured from the application into the IC instead of from the IC into the application for a power amplifier. Less output power is achieved by lowering the real parallel part of 400Ω where the parallel imaginary part should be kept constant. Output power measurement can be done with the circuit of Figure 4-2. Note that the component values must be changed to compensate the individual board parasitics until the T5753 has the right load impedance ZLoad,opt = (255 + j192)Ω. Also the damping of the cable used to measure the output power must be calibrated out. 5 4510I–RKE–02/07 Figure 4-2. Output Power Measurement at f = 315 MHz VS C1 1 nF L1 56 nH C2 ANT1 ZLopt 3.3 pF ANT2 Note: 4.4 Z = 50Ω Power meter Rin 50Ω For 345 MHz C2 has to be changed to 2.7 pF Application Circuit For the blocking of the supply voltage a capacitor value of C3 = 68 nF/X7R is recommended (see Figure 4-3 on page 7 and Figure 4-4 on page 8). C1 and C2 are used to match the loop antenna to the power amplifier where C 1 typically is 22 pF/NP0 and C 2 is 10.8 pF/NP0 (18 pF + 27 pF in series); for C2 two capacitors in series should be used to achieve a better tolerance value and to have the possibility to realize the Z Load,opt by using standard valued capacitors. C1 forms together with the pins of T5753 and the PCB board wires a series resonance loop that suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally the best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and ANT2. The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop antenna is too high. L1 ([50 nH to 100 nH) can be printed on PCB. C4 should be selected that the XTO runs on the load resonance frequency of the crystal. Normally, a value of 12 pF results for a 15 pF load-capacitance crystal. 6 T5753 4510I–RKE–02/07 T5753 Figure 4-3. ASK Application Circuit S1 BPXY VDD ATARx9x VS 1 S2 VSS BPXY 20 BPXY BPXY OSC1 7 T5753 Power up/down CLK ENABLE f 4 1 8 f 32 GND PA_ENABLE 2 7 PDF C3 C2 CP VS ANT2 3 6 VS Loop Antenna LF C1 XTAL ANT1 4 PA VCO PLL L1 XTO XTAL 5 C4 VS 7 4510I–RKE–02/07 Figure 4-4. FSK Application Circuit S1 BPXY VDD ATARx9x VS 1 S2 VSS BPXY 20 BP42/T2O BPXY 18 BPXY OSC1 7 T5753 Power up/down CLK ENABLE f 4 1 8 f 32 PA_ENABLE GND 2 7 PDF C3 C2 CP ANT2 VS 3 Loop Antenna 6 VS LF C1 C5 ANT1 XTAL 4 PA VCO PLL L1 XTO XTAL 5 C4 VS 8 T5753 4510I–RKE–02/07 T5753 Figure 4-5. ESD Protection Circuit VS ANT1 CLK PA_ENABLE ANT2 XTAL ENABLE GND 5. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Maximum Unit Supply voltage Symbol VS 5 V Power dissipation Ptot 100 mW Tj 150 °C °C Junction temperature Minimum Storage temperature Tstg –55 125 Ambient temperature Tamb –55 125 Input voltage VmaxPA_ENABLE –0.3 Note: 1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V. °C (VS + 0.3) (1) V 6. Thermal Resistance Parameters Junction ambient Symbol Value Unit RthJA 170 K/W 7. Electrical Characteristics VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified. Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7). Parameters Test Conditions Supply current Power down, VENABLE < 0.25 V, -40°C to 85°C VPA-ENABLE < 0.25 V, -40°C to +125°C VPA-ENABLE < 0.25 V, 25°C (100% correlation tested) IS_Off Supply current Power up, PA off, VS = 3 V, VENABLE > 1.7 V, VPA-ENABLE < 0.25 V IS Supply current Power up, VS = 3.0 V, VENABLE > 1.7 V, VPA-ENABLE > 1.7 V IS_Transmit Min. Typ. Max. Unit 350 7 nA µA nA 3.7 4.8 mA 9 11.6 mA 8.0 10.5 dBm < 10 VS = 3.0V, Tamb = 25°C, PRef f = 315 MHz, ZLoad = (255 + j192)W 1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V. Output power Note: Symbol 6.0 9 4510I–RKE–02/07 7. Electrical Characteristics (Continued) VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified. Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7). Parameters Test Conditions Output power variation for the full temperature range Tamb = –40°C to +85°C, VS = 3.0V VS = 2.0V Output power variation for the full temperature range Tamb = –40°C to +125°C, VS = 3.0V VS = 2.0V, POut = PRef + ∆PRef Achievable output-power range Selectable by load impedance Spurious emission fCLK = f0/128 Load capacitance at pin CLK = 10 pF fO ±1 × fCLK fO ±4 × fCLK other spurious are lower Oscillator frequency XTO (= phase comparator frequency) fXTO = f0/32 fXTAL = resonant frequency of the XTAL, CM ≤ 10 fF, load capacitance selected accordingly Tamb = –40°C to +85°C, Tamb = –40°C to +125°C Symbol Max. Unit ∆PRef ∆PRef –1.5 –4.0 dB dB ∆PRef ∆PRef –2.0 –4.5 dB dB 8.0 dBm POut_typ Min. Typ. 0 –55 –52 dBc dBc fXTO –30 –40 PLL loop bandwidth fXTAL +30 +40 250 ppm ppm kHz Phase noise of phase comparator Referred to fPC = fXT0, 25 kHz distance to carrier –116 –110 dBc/Hz In loop phase noise PLL 25 kHz distance to carrier –86 –80 dBc/Hz Phase noise VCO at 1 MHz at 36 MHz –94 –125 –90 –121 dBc/Hz dBc/Hz 350 MHz Frequency range of VCO fVCO 310 Clock output frequency (CMOS microcontroller compatible) Voltage swing at pin CLK f0/128 CLoad ≤ 10 pF Series resonance R of the crystal V0h V0l VS × 0.8 Rs Capacitive load at pin XT0 MHz VS × 0.2 V V 110 Ω 7 pF FSK modulation frequency rate Duty cycle of the modulation signal = 50% 0 32 kHz ASK modulation frequency rate Duty cycle of the modulation signal = 50% 0 32 kHz Low level input voltage High level input voltage Input current high 0.25 ENABLE input 20 V V µA 0.25 VS(1) 5 V V µA Low level input voltage VIl VIh High level input voltage IIn Input current high 1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V. PA_ENABLE input Note: 10 VIl VIh IIn 1.7 1.7 T5753 4510I–RKE–02/07 T5753 8. Ordering Information Extended Type Number Package Remarks T5753-6AQJ TSSOP8L Taped and reeled, Marking: T573, Pb-free T5753-6APJ Note: 1. J TSSOP8L = –40°C to +125°C + lead-free Taped and reeled, Marking: T573, small reel, Pb-free 9. Package Information 3±0.1 +0.06 0.31-0.07 0.65 nom. 3.8±0.3 4.9±0.1 +0.0 0.1±0.05 3±0.1 0.15-0.025 0.85±0.05 +0.05 1-0.15 Package: TSSOP 8L Dimensions in mm 3 x 0.65 = 1.95 nom. 8 5 technical drawings according to DIN specifications Drawing-No.: 6.543-5083.01-4 1 4 Issue: 2; 15.03.04 11 4510I–RKE–02/07 10. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. 12 Revision No. History 4510I-RKE-02/07 • Put datasheet in a new template • Pb-free Logo on page 1 deleted 4510H-RKE-09/05 • Pb-free Logo on page 1 added 4510G-RKE-02/05 • • • • • Put datasheet in a new template Section 1 “Description” on page 1 changed Figure title Figure 4-2 on page 6 changed Table “Electrical Characteristics” on pages 9 to 10 changed Table “Ordering Information” on page 11 changed 4510F-RKE-02/05 • • • • • Table “Absolute Maximum Ratings” (page 8): row “Input voltage” added Table “Absolute Maximum Ratings” (page 8): table note 1 added Table “Electrical Characteristics” (page 10): row “PA_ENABLE input“ changed Table “Electrical Characteristics” (page 10): table note 1 added Table “Ordering Information” (page 11): Remarks changed T5753 4510I–RKE–02/07 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Biometrics Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-47-50 Fax: (33) 4-76-58-47-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2007 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, Everywhere You Are® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 4510I–RKE–02/07 Features • Integrated PLL Loop Filter • ESD Protection also at ANT1/ANT2 (4 kV HBM/200V MM; Except Pin 2: 4 kV HBM/100V MM) • High Output Power (7.5 dBm) with Low Supply Current (9.0 mA) • Modulation Scheme ASK/ FSK • • • • • • • • – FSK Modulation is Achieved by Connecting an Additional Capacitor Between the XTAL Load Capacitor and the Open Drain Output of the Modulating Microcontroller Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply Single Li-cell for Power Supply Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to 85°C/125°C Package TSSOP8L Single-ended Antenna Output with High Efficient Power Amplifier CLK Output for Clocking the Microcontroller One-chip Solution with Minimum External Circuitry 125° C Operation for Tire Pressure Systems UHF ASK/FSK Transmitter T5754 1. Description The T5754 is a PLL transmitter IC which has been developed for the demands of RF low-cost transmission systems at data rates up to 32 kBaud. The transmitting frequency range is 429 MHz to 439 MHz. It can be used in both FSK and ASK systems. Figure 1-1. System Block Diagram UHF ASK/FSK Remote control transmitter UHF ASK/FSK Remote control receiver 1 Li cell T5754 Keys Encoder ATARx9x U3741B/ U3745B/ T5743/ T5744 1 to 3 Demod Control Microcontroller PLL Antenna XTO Antenna VCO Power amp. PLL LNA XTO VCO 4511I–RKE–02/07 2. Pin Configuration Figure 2-1. Pinning TSSOP8L CLK PA_ENABLE ANT2 ANT1 Table 2-1. Pin 1 2 3 4 8 7 6 5 ENABLE GND VS XTAL Pin Description Symbol Function Configuration VS 1 CLK Clock output signal for micro con roller The clock output frequency is set by the crystal to fXTAL/4 100Ω CLK 100Ω PA_ENABLE 2 PA_ENABLE 50 kΩ UREF = 1.1V Switches on power amplifier, used for ASK modulation 20 µA ANT1 3 ANT2 Emitter of antenna output stage 4 ANT1 Open collector antenna output ANT2 2 T5754 4511I–RKE–02/07 T5754 Table 2-1. Pin Pin Description (Continued) Symbol Function Configuration VS 1.5 kΩ 5 XTAL VS 1.2 kΩ Connection for crystal XTAL 182 µA 6 7 VS GND 8 ENABLE Supply voltage Ground See ESD protection circuitry (see Figure 4-5 on page 9) See ESD protection circuitry (see Figure 4-5 on page 9) ENABLE Figure 2-2. 200 kΩ Enable input Block Diagram T5754 Power up/down f CLK ENABLE 4 1 8 f 32 PA_ENABLE GND 2 7 PDF CP ANT2 VS 6 3 LF ANT1 4 PA VCO XTO 5 XTAL PLL 3 4511I–RKE–02/07 3. General Description This fully integrated PLL transmitter allows particularly simple, low-cost RF miniature transmitters to be assembled. The VCO is locked to 32 fXTAL hence a 13.56 MHz crystal is needed for a 433.92 MHz transmitter. All other PLL and VCO peripheral elements are integrated. The XTO is a series resonance oscillator so that only one capacitor together with a crystal connected in series to GND are needed as external elements. The crystal oscillator together with the PLL needs typically < 1 ms until the PLL is locked and the CLK output is stable. There is a wait time of ≥ 1 ms until the CLK is used for the microcontroller and the PA is switched on. The power amplifier is an open-collector output delivering a current pulse which is nearly independent from the load impedance. The delivered output power is hence controllable via the connected load impedance. This output configuration enables a simple matching to any kind of antenna or to 50Ω. A high power efficiency of η= Pout/(IS,PA VS) of 36% for the power amplifier results when an optimized load impedance of ZLoad = (166 + j223)Ω is used at 3V supply voltage. 4. Functional Description If ENABLE = L and the PA_ENABLE = L, the circuit is in standby mode consuming only a very small amount of current so that a lithium cell used as power supply can work for several years. With ENABLE = H the XTO, PLL and the CLK driver are switched on. If PA_ENABLE remains L only the PLL and the XTO is running and the CLK signal is delivered to the microcontroller. The VCO locks to 32 times the XTO frequency. With ENABLE = H and PA_ENABLE = H the PLL, XTO, CLK driver and the power amplifier are on. With PA_ENABLE the power amplifier can be switched on and off, which is used to perform the ASK modulation. 4.1 ASK Transmission The T5754 is activated by ENABLE = H. PA_ENABLE must remain L for t ≥1 ms, then the CLK signal can be taken to clock the microcontroller and the output power can be modulated by means of pin PA_ENABLE. After transmission PA_ENABLE is switched to L and the microcontroller switches back to internal clocking. The T5754 is switched back to standby mode with ENABLE = L. 4.2 FSK Transmission The T5754 is activated by ENABLE = H. PA_ENABLE must remain L for t ≥1 ms, then the CLK signal can be taken to clock the microcontroller and the power amplifier is switched on with PA_ENABLE = H. The chip is then ready for FSK modulation. The microcontroller starts to switch on and off the capacitor between the XTAL load capacitor and GND with an open-drain output port, thus changing the reference frequency of the PLL. If the switch is closed, the output frequency is lower than if the switch is open. After transmission PA_ENABLE is switched to L and the microcontroller switches back to internal clocking. The T5754 is switched back to standby mode with ENABLE = L. The accuracy of the frequency deviation with XTAL pulling method is about ±25% when the following tolerances are considered. 4 T5754 4511I–RKE–02/07 T5754 Figure 4-1. Tolerances of Frequency Modulation VS CStray1 CStray2 LM C4 XTAL CM RS C0 Crystal equivalent circuit C5 CSwitch Using C4 = 9.2 pF ±2%, C5 = 6.8 pF ±5%, a switch port with CSwitch = 3 pF ±10%, stray capacitances on each side of the crystal of CStray1 = CStray2 = 1 pF ±10%, a parallel capacitance of the crystal of C0 = 3.2 pF ±10% and a crystal with CM = 13 fF ±10%, an FSK deviation of ±21 kHz typical with worst case tolerances of ±16.3 kHz to ±28.8 kHz results. 4.3 CLK Output An output CLK signal is provided for a connected microcontroller, the delivered signal is CMOS compatible if the load capacitance is lower than 10 pF. 4.3.1 Clock Pulse Take-over The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel ® ’s ATARx9x has the special feature of starting with an integrated RC-oscillator to switch on the T5754 with ENABLE = H, and after 1 ms to assume the clock signal of the transmission IC, so that the message can be sent with crystal accuracy. 4.3.2 Output Matching and Power Setting The output power is set by the load impedance of the antenna. The maximum output power is achieved with a load impedance of ZLoad,opt = (166 + j223)Ω. There must be a low resistive path to VS to deliver the DC current. The delivered current pulse of the power amplifier is 9 mA and the maximum output power is delivered to a resistive load of 465Ω if the 1.0 pF output capacitance of the power amplifier is compensated by the load impedance. An optimum load impedance of: ZLoad = 465Ω || j/(2 × π 1.0 pF) = (166 + j223)Ω thus results for the maximum output power of 7.5 dBm. The load impedance is defined as the impedance seen from the T5754’s ANT1, ANT2 into the matching network. Do not confuse this large signal load impedance with a small signal input impedance delivered as input characteristic of RF amplifiers and measured from the application into the IC instead of from the IC into the application for a power amplifier. Less output power is achieved by lowering the real parallel part of 465Ω where the parallel imaginary part should be kept constant. Output power measurement can be done with the circuit of Figure 4-2 on page 6. Note that the component values must be changed to compensate the individual board parasitics until the T5754 has the right load impedance ZLoad,opt = (166 + j223)Ω. Also the damping of the cable used to measure the output power must be calibrated out. 5 4511I–RKE–02/07 Figure 4-2. Output Power Measurement VS C1 1 nF L1 C2 ANT1 ZLopt ANT2 4.4 33 nH 2.2 pF Z = 50Ω Power meter Rin 50Ω Application Circuit For the supply-voltage blocking capacitor C3 a value of 68 nF/X7R is recommended (see Figure 4-3 on page 7 and Figure 4-4 on page 8). C1 and C2 are used to match the loop antenna to the power amplifier where C1 typically is 8.2 pF/NP0 and C2 is 6 pF/NP0 (10 pF + 15 pF in series); for C2 two capacitors in series should be used to achieve a better tolerance value and to have the possibility to realize the ZLoad,opt by using standard valued capacitors. C1 forms together with the pins of T5754 and the PCB board wires a series resonance loop that suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally the best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and ANT2. The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop antenna is too high. L1 ([50 nH to 100 nH) can be printed on PCB. C4 should be selected that the XTO runs on the load resonance frequency of the crystal. Normally, a value of 12 pF results for a 15 pF load-capacitance crystal. 6 T5754 4511I–RKE–02/07 T5754 Figure 4-3. ASK Application Circuit S1 BPXY VDD ATARx9x VS 1 S2 VSS BPXY 20 BPXY BPXY OSC1 7 T5754 Power up/down CLK ENABLE f 4 1 8 f 32 GND PA_ENABLE 2 7 PDF C3 C2 CP VS ANT2 3 6 VS Loop Antenna LF C1 XTAL ANT1 4 PA VCO PLL L1 XTO XTAL 5 C4 VS 7 4511I–RKE–02/07 Figure 4-4. FSK Application Circuit S1 BPXY VDD ATARx9x VS 1 S2 VSS BPXY 20 BP42/T2O BPXY 18 BPXY OSC1 7 T5754 Power up/down CLK ENABLE f 4 1 8 f 32 PA_ENABLE GND 2 7 PDF C3 C2 CP ANT2 VS 3 Loop Antenna 6 VS LF C1 C5 ANT1 XTAL 4 PA VCO PLL L1 XTO XTAL 5 C4 VS 8 T5754 4511I–RKE–02/07 T5754 Figure 4-5. ESD Protection Circuit VS ANT1 CLK PA_ENABLE ANT2 XTAL ENABLE GND 5. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Maximum Unit Supply voltage Symbol VS 5 V Power dissipation Ptot 100 mW Tj 150 °C °C Junction temperature Minimum Storage temperature Tstg –55 125 Ambient temperature Tamb –55 125 Input voltage Note: VmaxPA_ENABLE –0.3 °C (VS + 0.3) (1) V 1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V. 6. Thermal Resistance Parameters Junction ambient Symbol Value Unit RthJA 170 K/W 7. Electrical Characteristics VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified. Typical values are given at VS = 3.0 V and Tamb = 25°C. All parameters are referred to GND (pin 7). Parameters Test Conditions Supply current Power down VENABLE < 0.25V, –40°C to 85°C VPA-ENABLE < 0.25V, –40°C to +125°C VPA-ENABLE < 0.25V, 25°C (100% correlation tested) Symbol Min. Typ. IS_Off Max. Unit 350 7 nA µA nA < 10 Supply current Power up, PA off, VS = 3V, VENABLE > 1.7V, VPA-ENABLE < 0.25V IS 3.7 4.8 mA Supply current Power up, VS = 3.0V, VENABLE > 1.7V, VPA-ENABLE > 1.7V IS_Transmit 9 11.6 mA Output power VS = 3.0V, Tamb = 25°C, f = 433.92 MHz, ZLoad = (166 + j233)Ω 7.5 10 dBm Note: PRef 5.5 1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V. 9 4511I–RKE–02/07 7. Electrical Characteristics (Continued) VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified. Typical values are given at VS = 3.0 V and Tamb = 25°C. All parameters are referred to GND (pin 7). Parameters Test Conditions Output power variation for the full temperature range Tamb = –40°C to +85°C, VS = 3.0V VS = 2.0V Output power variation for the full temperature range Tamb = –40°C to +125°C, VS = 3.0V VS = 2.0V POut = PRef + ∆PRef Achievable output-power range Selectable by load impedance Spurious emission fCLK = f0/128 Load capacitance at pin CLK = 10 pF fO ±1 × fCLK fO ±4 × fCLK other spurious are lower Oscillator frequency XTO (= phase comparator frequency) fXTO = f0/32 fXTAL = resonant frequency of the XTAL, CM ≤ 10 fF, load capacitance selected accordingly Tamb = –40°C to +85°C Tamb = –40°C to +125°C Symbol Max. Unit ∆PRef ∆PRef –1.5 –4.0 dB dB ∆PRef ∆PRef –2.0 –4.5 dB dB 7.5 dBm POut_typ Min. Typ. 0 –55 –52 dBc dBc fXTO –30 –40 PLL loop bandwidth fXTAL +30 +40 250 ppm ppm kHz Phase noise of phase comparator Referred to fPC = fXT0, 25 kHz distance to carrier –116 –110 dBc/Hz In loop phase noise PLL 25 kHz distance to carrier –86 –80 dBc/Hz Phase noise VCO at 1 MHz at 36 MHz –94 –125 –90 –121 dBc/Hz dBc/Hz 439 MHz Frequency range of VCO fVCO 429 Clock output frequency (CMOS microcontroller compatible) Voltage swing at pin CLK f0/128 CLoad ≤10 pF Series resonance R of the crystal V0h V0l VS × 0.8 Rs Capacitive load at pin XT0 MHz VS × 0.2 V V 110 Ω 7 pF FSK modulation frequency rate Duty cycle of the modulation signal = 50% 0 32 kHz ASK modulation frequency rate Duty cycle of the modulation signal = 50% 0 32 kHz Low level input voltage High level input voltage Input current high 0.25 ENABLE input 20 V V µA 0.25 VS(1) 5 V V µA PA_ENABLE input Note: 10 Low level input voltage High level input voltage Input current high VIl VIh IIn VIl VIh IIn 1.7 1.7 1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V. T5754 4511I–RKE–02/07 T5754 8. Ordering Information Extended Type Number Package Remarks T5754-6AQJ TSSOP8L Taped and reeled, Marking: T574, Pb-free T5754-6APJ TSSOP8L Taped and reeled, Marking: T574, small reel, Pb-free 9. Package Information 3±0.1 +0.06 0.31-0.07 0.65 nom. 3.8±0.3 4.9±0.1 +0.0 0.1±0.05 3±0.1 0.15-0.025 0.85±0.05 +0.05 1-0.15 Package: TSSOP 8L Dimensions in mm 3 x 0.65 = 1.95 nom. 8 5 technical drawings according to DIN specifications Drawing-No.: 6.543-5083.01-4 1 4 Issue: 2; 15.03.04 11 4511I–RKE–02/07 10. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. 12 Revision No. History 4711I-RKE-02/07 • Put datasheet in a new template • Pb-free logo on page 1 deleted 4711H-RKE-09/05 • Pb-free logo on page 1 added • Ordering Information on page 11 changed 4711G-RKE-05/05 • Put datasheet in a new template • Package Information (page 11): Replace old package drawing through current version 4711F-RKE-07/04 • • • • • Abs. Max. Ratings table (page 9): row “Input voltage” added Abs. Max. Ratings table (page 9): table note 1 added El. Char. table (pages 9 to 10): row “PA_ENABLE input“ changed El. Char. table (pages 9 to 10): table note 1 added Ordering Information table (page 11): Remarks changed T5754 4511I–RKE–02/07 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Biometrics Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-47-50 Fax: (33) 4-76-58-47-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2007 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, Everywhere You Are® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 4511I–RKE–02/07 Features • High Performance, Low Power AVR® 8-Bit Microcontroller • Advanced RISC Architecture • • • • • • • • – 120 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation Non-Volatile Program and Data Memories – 2/4/8K Bytes of In-System Programmable Program Memory Flash • Endurance: 10,000 Write/Erase Cycles – 128/256/512 Bytes of In-System Programmable EEPROM • Endurance: 100,000 Write/Erase Cycles – 128/256/512 Bytes of Internal SRAM – Data retention: 20 years at 85°C / 100 years at 25°C – Programming Lock for Self-Programming Flash & EEPROM Data Security Peripheral Features – One 8-Bit and One 16-Bit Timer/Counter with Two PWM Channels, Each – 10-bit ADC • 8 Single-Ended Channels • 12 Differential ADC Channel Pairs with Programmable Gain (1x / 20x) – Programmable Watchdog Timer with Separate On-chip Oscillator – On-Chip Analog Comparator – Universal Serial Interface Special Microcontroller Features – debugWIRE On-chip Debug System – In-System Programmable via SPI Port – Internal and External Interrupt Sources: Pin Change Interrupt on 12 Pins – Low Power Idle, ADC Noise Reduction, Standby and Power-Down Modes – Enhanced Power-on Reset Circuit – Programmable Brown-Out Detection Circuit – Internal Calibrated Oscillator – On-Chip Temperature Sensor I/O and Packages – Available in 20-Pin QFN/MLF & 14-Pin SOIC and PDIP – Twelve Programmable I/O Lines Operating Voltage: – 1.8 – 5.5V for ATtiny24V/44V/84V – 2.7 – 5.5V for ATtiny24/44/84 Speed Grade – ATtiny24V/44V/84V • 0 – 4 MHz @ 1.8 – 5.5V • 0 – 10 MHz @ 2.7 – 5.5V – ATtiny24/44/84 • 0 – 10 MHz @ 2.7 – 5.5V • 0 – 20 MHz @ 4.5 – 5.5V Industrial Temperature Range: -40°C to +85°C Low Power Consumption – Active Mode (1 MHz System Clock): 300 µA @ 1.8V – Power-down Mode: 0.1 µA @ 1.8V 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash ATtiny24/44/84 Preliminary Rev. 8006G–AVR–01/08 1. Pin Configurations Figure 1-1. Pinout ATtiny24/44/84 PDIP/SOIC VCC (PCINT8/XTAL1/CLKI) PB0 (PCINT9/XTAL2) PB1 (PCINT11/RESET/dW) PB3 (PCINT10/INT0/OC0A/CKOUT) PB2 (PCINT7/ICP/OC0B/ADC7) PA7 (PCINT6/OC1A/SDA/MOSI/DI/ADC6) PA6 1 2 3 4 5 6 7 14 13 12 11 10 9 8 GND PA0 (ADC0/AREF/PCINT0) PA1 (ADC1/AIN0/PCINT1) PA2 (ADC2/AIN1/PCINT2) PA3 (ADC3/T0/PCINT3) PA4 (ADC4/USCK/SCL/T1/PCINT4) PA5 (ADC5/DO/MISO/OC1B/PCINT5) NOTE Bottom pad should be soldered to ground. DNC: Do Not Connect 1.1 1.1.1 15 14 13 12 11 6 7 8 9 10 1 2 3 4 5 Pin 16: PA6 (PCINT6/OC1A/SDA/MOSI/DI/ADC6) Pin 20: PA5 (ADC5/DO/MISO/OC1B/PCINT5) PA7 (PCINT7/ICP/OC0B/ADC7) PB2 (PCINT10/INT0/OC0A/CKOUT) PB3 (PCINT11/RESET/dW) PB1 (PCINT9/XTAL2) PB0 (PCINT8/XTAL1/CLKI) DNC DNC GND VCC DNC (ADC4/USCK/SCL/T1/PCINT4) PA4 (ADC3/T0/PCINT3) PA3 (ADC2/AIN1/PCINT2) PA2 (ADC1/AIN0/PCINT1) PA1 (ADC0/AREF/PCINT0) PA0 20 19 18 17 16 PA5 DNC DNC DNC PA6 QFN/MLF Pin Descriptions VCC Supply voltage. 1.1.2 GND Ground. 1.1.3 2 Port B (PB3...PB0) Port B is a 4-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability except PB3 which has the RESET capability. To use pin PB3 as an I/O pin, instead of RESET pin, program (‘0’) RSTDISBL fuse. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Port B also serves the functions of various special features of the ATtiny24/44/84 as listed in Section 10.3 “Alternate Port Functions” on page 57. 1.1.4 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 20-4 on page 179. Shorter pulses are not guaranteed to generate a reset. The reset pin can also be used as a (weak) I/O pin. 1.1.5 Port A (PA7...PA0) Port A is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A has alternate functions as analog inputs for the ADC, analog comparator, timer/counter, SPI and pin change interrupt as described in “Alternate Port Functions” on page 57. 3 8006G–AVR–01/08 2. Overview The ATtiny24/44/84 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny24/44/84 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. Figure 2-1. Block Diagram VCC 8-BIT DATABUS INTERNAL OSCILLATOR INTERNAL CALIBRATED OSCILLATOR TIMING AND CONTROL GND PROGRAM COUNTER STACK POINTER WATCHDOG TIMER PROGRAM FLASH SRAM MCU CONTROL REGISTER INSTRUCTION REGISTER MCU STATUS REGISTER GENERAL PURPOSE REGISTERS TIMER/ COUNTER0 X Y Z INSTRUCTION DECODER TIMER/ COUNTER1 CONTROL LINES ALU STATUS REGISTER INTERRUPT UNIT ANALOG COMPARATOR + - PROGRAMMING LOGIC EEPROM ISP INTERFACE DATA REGISTER PORT A DATA DIR. REG.PORT A PORT A DRIVERS PA7-PA0 ADC OSCILLATORS DATA REGISTER PORT B DATA DIR. REG.PORT B PORT B DRIVERS PB3-PB0 The AVR core combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. 4 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 The ATtiny24/44/84 provides the following features: 2/4/8K byte of In-System Programmable Flash, 128/256/512 bytes EEPROM, 128/256/512 bytes SRAM, 12 general purpose I/O lines, 32 general purpose working registers, a 8-bit Timer/Counter with two PWM channels, a 16-bit timer/counter with two PWM channels, Internal and External Interrupts, a 8-channel 10-bit ADC, programmable gain stage (1x, 20x) for 12 differential ADC channel pairs, a programmable Watchdog Timer with internal Oscillator, internal calibrated oscillator, and four software selectable power saving modes. Idle mode stops the CPU while allowing the SRAM, Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. ADC Noise Reduction mode minimizes switching noise during ADC conversions by stopping the CPU and all I/O modules except the ADC. In Power-down mode registers keep their contents and all chip functions are disbaled until the next interrupt or hardware reset. In Standby mode, the crystal/resonator oscillator is running while the rest of the device is sleeping, allowing very fast start-up combined with low power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The onchip ISP Flash allows the Program memory to be re-programmed in-system through an SPI serial interface, by a conventional non-volatile memory programmer or by an on-chip boot code running on the AVR core. The ATtiny24/44/84 AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators and Evaluation kits. 5 8006G–AVR–01/08 3. About 3.1 Resources A comprehensive set of drivers, application notes, data sheets and descriptions on development tools are available for download at http://www.atmel.com/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. For I/O Registers located in the extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI” instructions must be replaced with instructions that allow access to extended I/O. Typically, this means “LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”. Note that not all AVR devices include an extended I/O map. 3.3 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 3.4 Disclaimer Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. 6 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 4. CPU Core 4.1 Overview This section discusses the AVR core architecture in general. The main function of the CPU core is to ensure correct program execution. The CPU must therefore be able to access memories, perform calculations, control peripherals, and handle interrupts. 4.2 Architectural Overview Figure 4-1. Block Diagram of the AVR Architecture Data Bus 8-bit Flash Program Memory Program Counter Status and Control 32 x 8 General Purpose Registrers Control Lines Direct Addressing Instruction Decoder Indirect Addressing Instruction Register Interrupt Unit Watchdog Timer ALU Analog Comparator Timer/Counter 0 Data SRAM Timer/Counter 1 Universal Serial Interface EEPROM I/O Lines In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with separate memories and buses for program and data. Instructions in the Program memory are executed with a single level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the Program memory. This concept enables instructions to be executed in every clock cycle. The Program memory is In-System Reprogrammable Flash memory. 7 8006G–AVR–01/08 The fast-access Register File contains 32 x 8-bit general purpose working registers with a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU operation, two operands are output from the Register File, the operation is executed, and the result is stored back in the Register File – in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data Space addressing – enabling efficient address calculations. One of the these address pointers can also be used as an address pointer for look up tables in Flash Program memory. These added function registers are the 16-bit X-, Y-, and Z-register, described later in this section. The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the Status Register is updated to reflect information about the result of the operation. Program flow is provided by conditional and unconditional jump and call instructions, able to directly address the whole address space. Most AVR instructions have a single 16-bit word format, but there are also 32-bit instructions. During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack size is only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as Control Registers, SPI, and other I/O functions. The I/O memory can be accessed directly, or as the Data Space locations following those of the Register File, 0x20 - 0x5F. 4.3 ALU – Arithmetic Logic Unit The high-performance AVR ALU operates in direct connection with all the 32 general purpose working registers. Within a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed. The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Some implementations of the architecture also provide a powerful multiplier supporting both signed/unsigned multiplication and fractional format. See the “Instruction Set” section for a detailed description. 4.4 Status Register The Status Register contains information about the result of the most recently executed arithmetic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the Status Register is updated after all ALU operations, as specified in the Instruction Set Reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The Status Register is not automatically stored when entering an interrupt routine and restored when returning from an interrupt. This must be handled by software. 8 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 4.4.1 SREG – AVR Status Register Bit 7 6 5 4 3 2 1 0 0x3F (0x5F) I T H S V N Z C Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 SREG • Bit 7 – I: Global Interrupt Enable The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual interrupt enable control is then performed in separate control registers. If the Global Interrupt Enable Register is cleared, none of the interrupts are enabled independent of the individual interrupt enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by the application with the SEI and CLI instructions, as described in the instruction set reference. • Bit 6 – T: Bit Copy Storage The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or destination for the operated bit. A bit from a register in the Register File can be copied into T by the BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the BLD instruction. • Bit 5 – H: Half Carry Flag The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry is useful in BCD arithmetic. See the “Instruction Set Description” for detailed information. • Bit 4 – S: Sign Bit, S = N ⊕ V The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement Overflow Flag V. See the “Instruction Set Description” for detailed information. • Bit 3 – V: Two’s Complement Overflow Flag The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the “Instruction Set Description” for detailed information. • Bit 2 – N: Negative Flag The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 1 – Z: Zero Flag The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. • Bit 0 – C: Carry Flag The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set Description” for detailed information. 9 8006G–AVR–01/08 4.5 General Purpose Register File The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve the required performance and flexibility, the following input/output schemes are supported by the Register File: • One 8-bit output operand and one 8-bit result input • Two 8-bit output operands and one 8-bit result input • Two 8-bit output operands and one 16-bit result input • One 16-bit output operand and one 16-bit result input Figure 4-2 below shows the structure of the 32 general purpose working registers in the CPU. Figure 4-2. AVR CPU General Purpose Working Registers 7 0 Addr. R0 0x00 R1 0x01 R2 0x02 … R13 0x0D General R14 0x0E Purpose R15 0x0F Working R16 0x10 Registers R17 0x11 … R26 0x1A X-register Low Byte R27 0x1B X-register High Byte R28 0x1C Y-register Low Byte R29 0x1D Y-register High Byte R30 0x1E Z-register Low Byte R31 0x1F Z-register High Byte Most of the instructions operating on the Register File have direct access to all registers, and most of them are single cycle instructions. As shown in Figure 4-2, each register is also assigned a Data memory address, mapping them directly into the first 32 locations of the user Data Space. Although not being physically implemented as SRAM locations, this memory organization provides great flexibility in access of the registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file. 4.5.1 10 The X-register, Y-register, and Z-register The registers R26..R31 have some added functions to their general purpose usage. These registers are 16-bit address pointers for indirect addressing of the data space. The three indirect address registers X, Y, and Z are defined as described in Figure 4-3 below. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 4-3. The X-, Y-, and Z-registers 15 X-register XH XL 7 0 R27 (0x1B) YH YL 7 0 R29 (0x1D) Z-register 0 R26 (0x1A) 15 Y-register 0 7 0 7 0 R28 (0x1C) 15 ZH 7 0 ZL 7 R31 (0x1F) 0 0 R30 (0x1E) In the different addressing modes these address registers have functions as fixed displacement, automatic increment, and automatic decrement (see the instruction set reference for details). 4.6 Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always points to the top of the Stack. Note that the Stack is implemented as growing from higher memory locations to lower memory locations. This implies that a Stack PUSH command decreases the Stack Pointer. The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt Stacks are located. This Stack space in the data SRAM must be defined by the program before any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack with the PUSH instruction, and it is decremented by two when the return address is pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is popped from the Stack with the POP instruction, and it is incremented by two when data is popped from the Stack with return from subroutine RET or return from interrupt RETI. The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of bits actually used is implementation dependent. Note that the data space in some implementations of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register will not be present. 4.6.1 SPH and SPL — Stack Pointer Register Bit 15 14 13 12 11 10 9 8 0x3E (0x5E) SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH 0x3D (0x5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL 7 6 5 4 3 2 1 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND Initial Value RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND RAMEND 11 8006G–AVR–01/08 4.7 Instruction Execution Timing This section describes the general access timing concepts for instruction execution. The AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the chip. No internal clock division is used. Figure 4-4 shows the parallel instruction fetches and instruction executions enabled by the Harvard architecture and the fast access Register File concept. This is the basic pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost, functions per clocks, and functions per power-unit. Figure 4-4. The Parallel Instruction Fetches and Instruction Executions T1 T2 T3 T4 clkCPU 1st Instruction Fetch 1st Instruction Execute 2nd Instruction Fetch 2nd Instruction Execute 3rd Instruction Fetch 3rd Instruction Execute 4th Instruction Fetch Figure 4-5 shows the internal timing concept for the Register File. In a single clock cycle an ALU operation using two register operands is executed, and the result is stored back to the destination register. Figure 4-5. Single Cycle ALU Operation T1 T2 T3 T4 clkCPU Total Execution Time Register Operands Fetch ALU Operation Execute Result Write Back 4.8 Reset and Interrupt Handling The AVR provides several different interrupt sources. These interrupts and the separate Reset Vector each have a separate Program Vector in the Program memory space. All interrupts are assigned individual enable bits which must be written logic one together with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt. The lowest addresses in the Program memory space are by default defined as the Reset and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 47. The list also determines the priority levels of the different interrupts. The lower the address the higher is the priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request 0. 12 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are disabled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a Return from Interrupt instruction – RETI – is executed. There are basically two types of interrupts. The first type is triggered by an event that sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vector in order to execute the interrupt handling routine, and hardware clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the Global Interrupt Enable bit is set, and will then be executed by order of priority. The second type of interrupts will trigger as long as the interrupt condition is present. These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the interrupt is enabled, the interrupt will not be triggered. When the AVR exits from an interrupt, it will always return to the main program and execute one more instruction before any pending interrupt is served. Note that the Status Register is not automatically stored when entering an interrupt routine, nor restored when returning from an interrupt routine. This must be handled by software. When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled. No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the CLI instruction. The following example shows how this can be used to avoid interrupts during the timed EEPROM write sequence.. Assembly Code Example in r16, SREG cli ; store SREG value ; disable interrupts during timed sequence sbi EECR, EEMPE ; start EEPROM write sbi EECR, EEPE out SREG, r16 ; restore SREG value (I-bit) C Code Example char cSREG; cSREG = SREG; /* store SREG value */ /* disable interrupts during timed sequence */ _CLI(); EECR |= (1<<EEMPE); /* start EEPROM write */ EECR |= (1<<EEPE); SREG = cSREG; /* restore SREG value (I-bit) */ 13 8006G–AVR–01/08 When using the SEI instruction to enable interrupts, the instruction following SEI will be executed before any pending interrupts, as shown in this example. Assembly Code Example sei ; set Global Interrupt Enable sleep; enter sleep, waiting for interrupt ; note: will enter sleep before any pending ; interrupt(s) C Code Example _SEI(); /* set Global Interrupt Enable */ _SLEEP(); /* enter sleep, waiting for interrupt */ /* note: will enter sleep before any pending interrupt(s) */ 4.8.1 Interrupt Response Time The interrupt execution response for all the enabled AVR interrupts is four clock cycles minimum. After four clock cycles the Program Vector address for the actual interrupt handling routine is executed. During this four clock cycle period, the Program Counter is pushed onto the Stack. The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. If an interrupt occurs during execution of a multi-cycle instruction, this instruction is completed before the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interrupt execution response time is increased by four clock cycles. This increase comes in addition to the start-up time from the selected sleep mode. A return from an interrupt handling routine takes four clock cycles. During these four clock cycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer is incremented by two, and the I-bit in SREG is set. 14 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 5. Memories This section describes the different memories in the ATtiny24/44/84. The AVR architecture has two main memory spaces, the Data memory and the Program memory space. In addition, the ATtiny24/44/84 features an EEPROM Memory for data storage. All three memory spaces are linear and regular. 5.1 In-System Re-programmable Flash Program Memory The ATtiny24/44/84 contains 2/4/8K byte On-chip In-System Reprogrammable Flash memory for program storage. Since all AVR instructions are 16 or 32 bits wide, the Flash is organized as 1024/2048/4096 x 16. The Flash memory has an endurance of at least 10,000 write/erase cycles. The ATtiny24/44/84 Program Counter (PC) is 10/11/12 bits wide, thus addressing the 1024/2048/4096 Program memory locations. “Memory Programming” on page 159 contains a detailed description on Flash data serial downloading using the SPI pins. Constant tables can be allocated within the entire Program memory address space (see instructions LPM – Load Program Memory and SPM – Store Program Memory). Timing diagrams for instruction fetch and execution are presented in “Instruction Execution Timing” on page 12. Figure 5-1. Program Memory Map Program Memory 0x0000 0x03FF/0x07FF/0xFFF 5.2 SRAM Data Memory Figure 5-2 on page 16 shows how the ATtiny24/44/84 SRAM Memory is organized. The lower data memory locations address both the Register File, the I/O memory and the internal data SRAM. The first 32 locations address the Register File, the next 64 locations the standard I/O memory, and the last 128/256/512 locations address the internal data SRAM. The five different addressing modes for the Data memory cover: Direct, Indirect with Displacement, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In the Register File, registers R26 to R31 feature the indirect addressing pointer registers. The direct addressing reaches the entire data space. The Indirect with Displacement mode reaches 63 address locations from the base address given by the Y- or Z-register. 15 8006G–AVR–01/08 When using register indirect addressing modes with automatic pre-decrement and post-increment, the address registers X, Y, and Z are decremented or incremented. The 32 general purpose working registers, 64 I/O Registers, and the 128/256/512 bytes of internal data SRAM in the ATtiny24/44/84 are all accessible through all these addressing modes. The Register File is described in “General Purpose Register File” on page 10. Figure 5-2. Data Memory Map Data Memory 32 Registers 64 I/O Registers 0x0000 - 0x001F 0x0020 - 0x005F 0x0060 Internal SRAM (128/256/512 x 8) 0x0DF/0x015F/0x025F 5.2.1 Data Memory Access Times This section describes the general access timing concepts for internal memory access. The internal data SRAM access is performed in two clkCPU cycles as described in Figure 5-3 on page 16. Figure 5-3. On-chip Data SRAM Access Cycles T1 T2 T3 clkCPU Address Compute Address Address valid Write Data WR Read Data RD Memory Access Instruction 5.3 Next Instruction EEPROM Data Memory The ATtiny24/44/84 contains 128/256/512 bytes of data EEPROM memory. It is organized as a separate data space, in which single bytes can be read and written. The EEPROM has an endurance of at least 100,000 write/erase cycles. The access between the EEPROM and the CPU is described in the following, specifying the EEPROM Address Registers, the EEPROM Data Register, and the EEPROM Control Register. For a detailed description of Serial data downloading to the EEPROM, see “Serial Downloading” on page 163. 16 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 5.3.1 EEPROM Read/Write Access The EEPROM Access Registers are accessible in the I/O space. The write access times for the EEPROM are given in Table 5-1 on page 21. A self-timing function, however, lets the user software detect when the next byte can be written. If the user code contains instructions that write the EEPROM, some precautions must be taken. In heavily filtered power supplies, VCC is likely to rise or fall slowly on Power-up/down. This causes the device for some period of time to run at a voltage lower than specified as minimum for the clock frequency used. See “Preventing EEPROM Corruption” on page 19 for details on how to avoid problems in these situations. In order to prevent unintentional EEPROM writes, a specific write procedure must be followed. See “Atomic Byte Programming” on page 17 and “Split Byte Programming” on page 17 for details on this. When the EEPROM is read, the CPU is halted for four clock cycles before the next instruction is executed. When the EEPROM is written, the CPU is halted for two clock cycles before the next instruction is executed. 5.3.2 Atomic Byte Programming Using Atomic Byte Programming is the simplest mode. When writing a byte to the EEPROM, the user must write the address into register EEAR and data into register EEDR. If the EEPMn bits are zero, writing EEPE (within four cycles after EEMPE is written) will trigger the erase/write operation. Both the erase and write cycle are done in one operation and the total programming time is given in Figure 5-1 on page 21. The EEPE bit remains set until the erase and write operations are completed. While the device is busy with programming, it is not possible to do any other EEPROM operations. 5.3.3 Split Byte Programming It is possible to split the erase and write cycle in two different operations. This may be useful if the system requires short access time for some limited period of time (typically if the power supply voltage falls). In order to take advantage of this method, it is required that the locations to be written have been erased before the write operation. But since the erase and write operations are split, it is possible to do the erase operations when the system allows doing time-critical operations (typically after Power-up). 5.3.4 Erase To erase a byte, the address must be written to EEAR. If the EEPMn bits are 0b01, writing the EEPE (within four cycles after EEMPE is written) will trigger the erase operation only (programming time is given in Figure 5-1 on page 21). The EEPE bit remains set until the erase operation completes. While the device is busy programming, it is not possible to do any other EEPROM operations. 5.3.5 Write To write a location, the user must write the address into EEAR and the data into EEDR. If the EEPMn bits are 0b10, writing the EEPE (within four cycles after EEMPE is written) will trigger the write operation only (programming time is given in Figure 5-1 on page 21). The EEPE bit remains set until the write operation completes. If the location to be written has not been erased before write, the data that is stored must be considered as lost. While the device is busy with programming, it is not possible to do any other EEPROM operations. 17 8006G–AVR–01/08 The calibrated Oscillator is used to time the EEPROM accesses. Make sure the Oscillator frequency is within the requirements described in “OSCCAL – Oscillator Calibration Register” on page 29. The following code examples show one assembly and one C function for erase, write, or atomic write of the EEPROM. The examples assume that interrupts are controlled (e.g., by disabling interrupts globally) so that no interrupts will occur during execution of these functions. Assembly Code Example EEPROM_write: ; Wait for completion of previous write sbic EECR, EEPE rjmp EEPROM_write ; Set Programming mode ldi r16, (0<<EEPM1)|(0<<EEPM0) out EECR, r16 ; Set up address (r18:r17) in address registers out EEARH, r18 out EEARL, r17 ; Write data (r19) to data register out EEDR, r19 ; Write logical one to EEMPE sbi EECR, EEMPE ; Start eeprom write by setting EEPE sbi EECR, EEPE ret C Code Example void EEPROM_write(unsigned int ucAddress, unsigned char ucData) { /* Wait for completion of previous write */ while(EECR & (1<<EEPE)) ; /* Set Programming mode */ EECR = (0<<EEPM1)|(0<<EEPM0) /* Set up address and data registers */ EEAR = ucAddress; EEDR = ucData; /* Write logical one to EEMPE */ EECR |= (1<<EEMPE); /* Start eeprom write by setting EEPE */ EECR |= (1<<EEPE); } 18 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 The next code examples show assembly and C functions for reading the EEPROM. The examples assume that interrupts are controlled so that no interrupts will occur during execution of these functions. Assembly Code Example EEPROM_read: ; Wait for completion of previous write sbic EECR, EEPE rjmp EEPROM_read ; Set up address (r18:r17) in address registers out EEARH, r18 out EEARL, r17 ; Start eeprom read by writing EERE sbi EECR, EERE ; Read data from data register in r16, EEDR ret C Code Example unsigned char EEPROM_read(unsigned int ucAddress) { /* Wait for completion of previous write */ while(EECR & (1<<EEPE)) ; /* Set up address register */ EEAR = ucAddress; /* Start eeprom read by writing EERE */ EECR |= (1<<EERE); /* Return data from data register */ return EEDR; } 5.3.6 Preventing EEPROM Corruption During periods of low VCC, the EEPROM data can be corrupted because the supply voltage is too low for the CPU and the EEPROM to operate properly. These issues are the same as for board level systems using EEPROM, and the same design solutions should be applied. An EEPROM data corruption can be caused by two situations when the voltage is too low. First, a regular write sequence to the EEPROM requires a minimum voltage to operate correctly. Secondly, the CPU itself can execute instructions incorrectly, if the supply voltage is too low. EEPROM data corruption can easily be avoided by following this design recommendation: Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be done by enabling the internal Brown-out Detector (BOD). If the detection level of the internal BOD does not match the needed detection level, an external low VCC reset protection circuit can be used. If a reset occurs while a write operation is in progress, the write operation will be completed provided that the power supply voltage is sufficient. 19 8006G–AVR–01/08 5.4 I/O Memory The I/O space definition of the ATtiny24/44/84 is shown in “Register Summary” on page 214. All ATtiny24/44/84 I/Os and peripherals are placed in the I/O space. All I/O locations may be accessed by the LD/LDS/LDD and ST/STS/STD instructions, transferring data between the 32 general purpose working registers and the I/O space. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. See the instruction set section for more details. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using LD and ST instructions, 0x20 must be added to these addresses. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. Some of the Status Flags are cleared by writing a logical one to them. Note that CBI and SBI instructions will only operate on the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. The I/O and Peripherals Control Registers are explained in later sections. 5.4.1 5.5 5.5.1 General Purpose I/O Registers The ATtiny24/44/84 contains three General Purpose I/O Registers. These registers can be used for storing any information, and they are particularly useful for storing global variables and status flags. General Purpose I/O Registers within the address range 0x00 - 0x1F are directly bitaccessible using the SBI, CBI, SBIS, and SBIC instructions. Register Description EEARH – EEPROM Address Register Bit 7 6 5 4 3 2 1 0 0x1F (0x3F) – – – – – – – EEAR8 Read/Write R R R R R R R R/W Initial Value 0 0 0 0 0 0 0 X EEARH • Bits 7..1 – Res: Reserved Bits These bits are reserved bits in ATtiny24/44/84 and will always read as zero. • Bit 0 – EEAR8: EEPROM Address The EEPROM Address Register – EEARH – specifies the most significant bit for EEPROM address in the 512 bytes EEPROM space for Tiny84. This bit is reserved bit in the ATtiny24/44 and will always read as zero. The initial value of EEAR is undefined. A proper value must be written before the EEPROM may be accessed. 5.5.2 EEARL – EEPROM Address Register Bit 20 7 6 5 4 3 2 1 0 0x1E (0x3E) EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value X X X X X X X X EEARL ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Bits 7..0 – EEAR7..0: EEPROM Address The EEPROM Address Register – EEARL – specifies the EEPROM address. In the 128 bytes EEPROM space in ATiny24 bit 7 is reserved and always read as zero. The EEPROM data bytes are addressed linearly between 0 and 128/256/512. The initial value of EEAR is undefined. A proper value must be written before the EEPROM may be accessed. 5.5.3 EEDR – EEPROM Data Register Bit 7 6 5 4 3 2 1 0 EEDR7 EEDR6 EEDR5 EEDR4 EEDR3 EEDR2 EEDR1 EEDR0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 0x1D (0x3D) EEDR • Bits 7..0 – EEDR7..0: EEPROM Data For the EEPROM write operation the EEDR Register contains the data to be written to the EEPROM in the address given by the EEAR Register. For the EEPROM read operation, the EEDR contains the data read out from the EEPROM at the address given by EEAR. 5.5.4 EECR – EEPROM Control Register Bit 7 6 5 4 3 2 1 0 0x1C (0x3C) – – EEPM1 EEPM0 EERIE EEMPE EEPE EERE Read/Write R R R/W R/W R/W R/W R/W R/W Initial Value 0 0 X X 0 0 X 0 EECR • Bit 7 – Res: Reserved Bit This bit is reserved for future use and will always read as 0 in ATtiny24/44/84. For compatibility with future AVR devices, always write this bit to zero. After reading, mask out this bit. • Bit 6 – Res: Reserved Bit This bit is reserved in the ATtiny24/44/84 and will always read as zero. • Bits 5, 4 – EEPM1 and EEPM0: EEPROM Programming Mode Bits The EEPROM Programming mode bits setting defines which programming action that will be triggered when writing EEPE. It is possible to program data in one atomic operation (erase the old value and program the new value) or to split the Erase and Write operations in two different operations. The Programming times for the different modes are shown in Table 5-1. Table 5-1. EEPROM Programming Mode Bits and Programming Times EEPM1 EEPM0 Programming Time Operation 0 0 3.4 ms Erase and Write in one operation (Atomic Operation) 0 1 1.8 ms Erase Only 1 0 1.8 ms Write Only 1 1 – Reserved for future use When EEPE is set any write to EEPMn will be ignored. During reset, the EEPMn bits will be reset to 0b00 unless the EEPROM is busy programming. 21 8006G–AVR–01/08 • Bit 3 – EERIE: EEPROM Ready Interrupt Enable Writing EERIE to one enables the EEPROM Ready Interrupt if the I-bit in SREG is set. Writing EERIE to zero disables the interrupt. The EEPROM Ready Interrupt generates a constant interrupt when Non-volatile memory is ready for programming. • Bit 2 – EEMPE: EEPROM Master Program Enable The EEMPE bit determines whether writing EEPE to one will have effect or not. When EEMPE is set, setting EEPE within four clock cycles will program the EEPROM at the selected address. If EEMPE is zero, setting EEPE will have no effect. When EEMPE has been written to one by software, hardware clears the bit to zero after four clock cycles. • Bit 1 – EEPE: EEPROM Program Enable The EEPROM Program Enable Signal EEPE is the programming enable signal to the EEPROM. When EEPE is written, the EEPROM will be programmed according to the EEPMn bits setting. The EEMPE bit must be written to one before a logical one is written to EEPE, otherwise no EEPROM write takes place. When the write access time has elapsed, the EEPE bit is cleared by hardware. When EEPE has been set, the CPU is halted for two cycles before the next instruction is executed. • Bit 0 – EERE: EEPROM Read Enable The EEPROM Read Enable Signal – EERE – is the read strobe to the EEPROM. When the correct address is set up in the EEAR Register, the EERE bit must be written to one to trigger the EEPROM read. The EEPROM read access takes one instruction, and the requested data is available immediately. When the EEPROM is read, the CPU is halted for four cycles before the next instruction is executed. The user should poll the EEPE bit before starting the read operation. If a write operation is in progress, it is neither possible to read the EEPROM, nor to change the EEAR Register. 5.5.5 GPIOR2 – General Purpose I/O Register 2 Bit 5.5.6 5 4 3 2 1 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 LSB 5 4 3 2 1 GPIOR2 GPIOR1 – General Purpose I/O Register 1 7 6 0 0x14 (0x34) MSB Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 LSB 5 4 3 2 1 GPIOR1 GPIOR0 – General Purpose I/O Register 0 Bit 22 6 MSB Bit 5.5.7 7 0x15 (0x35) 7 6 0 0x13 (0x33) MSB LSB Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 GPIOR0 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 6. System Clock and Clock Options 6.1 Clock Systems and their Distribution Figure 6-1 on page 23 presents the principal clock systems in the AVR and their distribution. All of the clocks need not be active at a given time. In order to reduce power consumption, the clocks to modules not being used can be halted by using different sleep modes, as described in “Power Management and Sleep Modes” on page 32. The clock systems are detailed below. Figure 6-1. Clock Distribution General I/O Modules ADC clkI/O CPU Core RAM Flash and EEPROM clkCPU AVR Clock Control Unit clkADC clkFLASH Reset Logic Watchdog Timer Source clock Watchdog clock System Clock Prescaler Clock Multiplexer External Clock Calibrated Crystal RC Oscillator Watchdog Oscillator Low-Frequency Crystal Oscillator Calibrated RC Oscillator 6.1.1 CPU Clock – clkCPU The CPU clock is routed to parts of the system concerned with operation of the AVR core. Examples of such modules are the General Purpose Register File, the Status Register and the Data memory holding the Stack Pointer. Halting the CPU clock inhibits the core from performing general operations and calculations. 6.1.2 I/O Clock – clkI/O The I/O clock is used by the majority of the I/O modules, like Timer/Counter. The I/O clock is also used by the External Interrupt module, but note that some external interrupts are detected by asynchronous logic, allowing such interrupts to be detected even if the I/O clock is halted. 23 8006G–AVR–01/08 6.1.3 Flash Clock – clkFLASH The Flash clock controls operation of the Flash interface. The Flash clock is usually active simultaneously with the CPU clock. 6.1.4 ADC Clock – clkADC The ADC is provided with a dedicated clock domain. This allows halting the CPU and I/O clocks in order to reduce noise generated by digital circuitry. This gives more accurate ADC conversion results. 6.2 Clock Sources The device has the following clock source options, selectable by Flash Fuse bits as shown below. The clock from the selected source is input to the AVR clock generator, and routed to the appropriate modules. Table 6-1. Device Clocking Options Select CKSEL3:0(1) Device Clocking Option External Clock (see page 24) 0000 Reserved 0001 Calibrated Internal 8 MHz Oscillator (see page 25) 0010 Reserved 0011 Internal 128 kHz Oscillator (see page 26) 0100 Reserved 0101 Low-Frequency Crystal Oscillator (see page 27) 0110 Reserved 0111 Crystal Oscillator / Ceramic Resonator (see page 27) Note: 1000-1111 1. For all fuses “1” means unprogrammed while “0” means programmed. The various choices for each clocking option is given in the following sections. When the CPU wakes up from Power-down the selected clock source is used to time the start-up, ensuring stable Oscillator operation before instruction execution starts. When the CPU starts from reset, there is an additional delay allowing the power to reach a stable level before commencing normal operation. The Watchdog Oscillator is used for timing this real-time part of the start-up time. The number of WDT Oscillator cycles used for each time-out is shown in Table 6-2. Table 6-2. 6.2.1 Number of Watchdog Oscillator Cycles Typ Time-out Number of Cycles 4 ms 512 64 ms 8K (8,192) External Clock To drive the device from an external clock source, CLKI should be driven as shown in Figure 6-2 on page 25. To run the device on an external clock, the CKSEL Fuses must be programmed to “0000”. 24 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 6-2. External Clock Drive Configuration EXTERNAL CLOCK SIGNAL CLKI GND When this clock source is selected, start-up times are determined by the SUT Fuses as shown in Table 6-3. Table 6-3. Start-up Times for the External Clock Selection SUT1..0 Start-up Time from Power-down Additional Delay from Reset 00 6 CK 14CK 01 6 CK 14CK + 4 ms Fast rising power 10 6 CK 14CK + 64 ms Slowly rising power 11 Recommended Usage BOD enabled Reserved When applying an external clock, it is required to avoid sudden changes in the applied clock frequency to ensure stable operation of the MCU. A variation in frequency of more than 2% from one clock cycle to the next can lead to unpredictable behavior. It is required to ensure that the MCU is kept in Reset during such changes in the clock frequency. Note that the System Clock Prescaler can be used to implement run-time changes of the internal clock frequency while still ensuring stable operation. See “System Clock Prescaler” on page 29 for details. 6.2.2 Calibrated Internal 8 MHz Oscillator By default, the Internal RC Oscillator provides an approximate 8 MHz clock. Though voltage and temperature dependent, this clock can be very accurately calibrated by the user. See Table 20-2 on page 178 and “Internal Oscillator Speed” on page 206 for more details. The device is shipped with the CKDIV8 Fuse programmed. See “System Clock Prescaler” on page 29 for more details. This clock may be selected as the system clock by programming the CKSEL Fuses as shown in Table 6-4. If selected, it will operate with no external components. During reset, hardware loads the pre-programmed calibration value into the OSCCAL Register and thereby automatically calibrates the RC Oscillator. The accuracy of this calibration is shown as Factory calibration in Table 20-2 on page 178. By changing the OSCCAL register from SW, see “OSCCAL – Oscillator Calibration Register” on page 29, it is possible to get a higher calibration accuracy than by using the factory calibration. The accuracy of this calibration is shown as User calibration in Table 20-2 on page 178. 25 8006G–AVR–01/08 When this Oscillator is used as the chip clock, the Watchdog Oscillator will still be used for the Watchdog Timer and for the Reset Time-out. For more information on the pre-programmed calibration value, see the section “Calibration Byte” on page 162. Table 6-4. Note: Internal Calibrated RC Oscillator Operating Modes CKSEL3..0 Nominal Frequency 0010(1) 8.0 MHz 1. The device is shipped with this option selected. When this oscillator is selected, start-up times are determined by the SUT Fuses as shown in Table 6-5.. Table 6-5. SUT1..0 Start-up Times for the Internal Calibrated RC Oscillator Clock Selection Start-up Time from Power-down Additional Delay from Reset (VCC = 5.0V) (2) 00 6 CK 01 6 CK 14CK + 4 ms Fast rising power 6 CK 14CK + 64 ms Slowly rising power 10 (1) 11 Note: 14CK Recommended Usage BOD enabled Reserved 1. The device is shipped with this option selected. 2. If the RSTDISBL fuse is programmed, this start-up time will be increased to 14CK + 4 ms to ensure programming mode can be entered. 6.2.3 Internal 128 kHz Oscillator The 128 kHz internal Oscillator is a low power Oscillator providing a clock of 128 kHz. The frequency depends on supply voltage, temperature and batch variations. This clock may be selected as the system clock by programming the CKSEL Fuses to “0100”. When this clock source is selected, start-up times are determined by the SUT Fuses as shown in Table 6-6. Table 6-6. SUT1..0 Start-up Time from Power-down Additional Delay from Reset 00 6 CK 14CK(1) 01 6 CK 14CK + 4 ms Fast rising power 10 6 CK 14CK + 64 ms Slowly rising power 11 Note: 26 Start-up Times for the 128 kHz Internal Oscillator Recommended Usage BOD enabled Reserved 1. If the RSTDISBL fuse is programmed, this start-up time will be increased to 14CK + 4 ms to ensure programming mode can be entered. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 6.2.4 Low-Frequency Crystal Oscillator To use a 32.768 kHz watch crystal as the clock source for the device, the low-frequency crystal oscillator must be selected by setting CKSEL fuses to ‘0110’. The crystal should be connected as shown in Figure 6-3. To find suitable capacitors please consult the manufacturer’s datasheet. For this oscillator start-up times can be set with the SUT fuses, as shown in Table 6-7. Table 6-7. Start-up Times for the Low Frequency Crystal Oscillator Clock Selection SUT1..0 Start-up Time from Power Down Additional Delay from Reset 00 1K CK(1) 4 ms Fast rising power or BOD enabled 01 (1) 1K CK 64 ms Slowly rising power 10 32K CK 64 ms Stable frequency at start-up 11 Notes: 6.2.5 Recommended usage Reserved 1. These options should be used only if frequency stability at start-up is not important Crystal Oscillator / Ceramic Resonator XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which can be configured for use as an On-chip Oscillator, as shown in Figure 6-3 Either a quartz crystal or a ceramic resonator may be used. Figure 6-3. Crystal Oscillator Connections C2 C1 XTAL2 XTAL1 GND C1 and C2 should always be equal for both crystals and resonators. The optimal value of the capacitors depends on the crystal or resonator in use, the amount of stray capacitance, and the electromagnetic noise of the environment. Some initial guidelines for choosing capacitors for use with crystals are given in Table 6-8 below. For ceramic resonators, the capacitor values given by the manufacturer should be used. Table 6-8. Crystal Oscillator Operating Modes CKSEL3..1 Frequency Range (MHz) Recommended C1 and C2 Value (pF) 100(1) 0.4 - 0.9 – 101 0.9 - 3.0 12 - 22 110 3.0 - 8.0 12 - 22 111 8.0 - 12 - 22 Notes: 1. This option should not be used with crystals, only with ceramic resonators. 27 8006G–AVR–01/08 The Oscillator can operate in three different modes, each optimized for a specific frequency range. The operating mode is selected by the fuses CKSEL3..1 as shown in Table 6-8. The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown in Table 6-9 on page 28. Table 6-9. Start-up Times for the Crystal Oscillator Clock Selection CKSEL0 SUT1..0 Start-up Time from Power-down(1) Additional Delay from Reset 0 00 258 CK(2) 14CK + 4 ms Ceramic resonator, fast rising power 0 01 258 CK(2) 14CK + 64 ms Ceramic resonator, slowly rising power 0 10 1K CK(3) 14CK Ceramic resonator, BOD enabled 0 11 1K CK(3) 14CK + 4 ms Ceramic resonator, fast rising power 1 00 1K CK(3) 14CK + 64 ms Ceramic resonator, slowly rising power 1 01 16K CK 14CK Crystal Oscillator, BOD enabled 1 10 16K CK 14CK + 4 ms Crystal Oscillator, fast rising power 1 11 16K CK 14CK + 64 ms Crystal Oscillator, slowly rising power Notes: Recommended Usage 1. When the BOD has been disabled by software, the wake-up time from sleep mode will be approximately 60µs to ensure that the BOD is working correctly before the MCU continues executing code. 2. These options should only be used when not operating close to the maximum frequency of the device, and only if frequency stability at start-up is not important for the application. These options are not suitable for crystals. 3. These options are intended for use with ceramic resonators and will ensure frequency stability at start-up. They can also be used with crystals when not operating close to the maximum frequency of the device, and if frequency stability at start-up is not important for the application. 6.2.6 Default Clock Source The device is shipped with CKSEL = “0010”, SUT = “10”, and CKDIV8 programmed. The default clock source setting is therefore the Internal RC Oscillator running at 8.0 MHz with longest startup time and an initial system clock prescaling of 8, resulting in 1.0 MHz system clock. This default setting ensures that all users can make their desired clock source setting using an in-system or high-voltage programmer. For low-voltage devices (ATtiny24V/44V/84V) it should be noted that unprogramming the CKDIV8 fuse may result in overclocking. At low voltages (below 2.7V) the devices are rated for maximum 4 MHz operation (see Section 20.3 on page 177), but routing the clock signal from the internal RC oscillator directly to the system clock line will run the device at 8 MHz. 28 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 6.3 System Clock Prescaler The ATtiny24/44/84 system clock can be divided by setting the “CLKPR – Clock Prescale Register” on page 30. This feature can be used to decrease power consumption when the requirement for processing power is low. This can be used with all clock source options, and it will affect the clock frequency of the CPU and all synchronous peripherals. clkI/O, clkADC, clkCPU, and clkFLASH are divided by a factor as shown in Table 6-11 on page 31. 6.3.1 Switching Time When switching between prescaler settings, the System Clock Prescaler ensures that no glitches occur in the clock system and that no intermediate frequency is higher than neither the clock frequency corresponding to the previous setting, nor the clock frequency corresponding to the new setting. The ripple counter that implements the prescaler runs at the frequency of the undivided clock, which may be faster than the CPU’s clock frequency. Hence, it is not possible to determine the state of the prescaler – even if it were readable, and the exact time it takes to switch from one clock division to another cannot be exactly predicted. From the time the CLKPS values are written, it takes between T1 + T2 and T1 + 2*T2 before the new clock frequency is active. In this interval, 2 active clock edges are produced. Here, T1 is the previous clock period, and T2 is the period corresponding to the new prescaler setting. 6.4 Clock Output Buffer The device can output the system clock on the CLKO pin. To enable the output, the CKOUT fuse has to be programmed. This mode is suitable when the chip clock is used to drive other circuits on the system. Note that the clock will not be output during reset and that the normal operation of the I/O pin will be overridden when the fuse is programmed. Any clock source, including the internal RC Oscillator, can be selected when the clock is output on CLKO. If the System Clock Prescaler is used, it is the divided system clock that is output. 6.5 6.5.1 Register Description OSCCAL – Oscillator Calibration Register Bit 7 6 5 4 3 2 1 0 0x31 (0x51) CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value OSCCAL Device Specific Calibration Value • Bits 7:0 – CAL7:0: Oscillator Calibration Value The Oscillator Calibration Register is used to trim the Calibrated Internal RC Oscillator to remove process variations from the oscillator frequency. A pre-programmed calibration value is automatically written to this register during chip reset, giving the Factory calibrated frequency as specified in Table 20-2 on page 178. The application software can write this register to change the oscillator frequency. The oscillator can be calibrated to frequencies as specified in Table 202 on page 178. Calibration outside that range is not guaranteed. Note that this oscillator is used to time EEPROM and Flash write accesses, and these write times will be affected accordingly. If the EEPROM or Flash are written, do not calibrate to more than 8.8 MHz. Otherwise, the EEPROM or Flash write may fail. 29 8006G–AVR–01/08 The CAL7 bit determines the range of operation for the oscillator. Setting this bit to 0 gives the lowest frequency range, setting this bit to 1 gives the highest frequency range. The two frequency ranges are overlapping, in other words a setting of OSCCAL = 0x7F gives a higher frequency than OSCCAL = 0x80. The CAL6..0 bits are used to tune the frequency within the selected range. A setting of 0x00 gives the lowest frequency in that range, and a setting of 0x7F gives the highest frequency in the range. To ensure stable operation of the MCU the calibration value should be changed in small. A variation in frequency of more than 2% from one cycle to the next can lead to unpredicatble behavior. Changes in OSCCAL should not exceed 0x20 for each calibration. It is required to ensure that the MCU is kept in Reset during such changes in the clock frequency Table 6-10. 6.5.2 Internal RC Oscillator Frequency Range OSCCAL Value Typical Lowest Frequency with Respect to Nominal Frequency Typical Highest Frequency with Respect to Nominal Frequency 0x00 50% 100% 0x3F 75% 150% 0x7F 100% 200% CLKPR – Clock Prescale Register Bit 7 6 5 4 3 2 1 0 0x26 (0x46) CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 Read/Write R/W R R R R/W R/W R/W R/W Initial Value 0 0 0 0 CLKPR See Bit Description • Bit 7 – CLKPCE: Clock Prescaler Change Enable The CLKPCE bit must be written to logic one to enable change of the CLKPS bits. The CLKPCE bit is only updated when the other bits in CLKPR are simultaniosly written to zero. CLKPCE is cleared by hardware four cycles after it is written or when the CLKPS bits are written. Rewriting the CLKPCE bit within this time-out period does neither extend the time-out period, nor clear the CLKPCE bit. • Bits 6..4 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bits 3..0 – CLKPS3..0: Clock Prescaler Select Bits 3 - 0 These bits define the division factor between the selected clock source and the internal system clock. These bits can be written run-time to vary the clock frequency to suit the application requirements. As the divider divides the master clock input to the MCU, the speed of all synchronous peripherals is reduced when a division factor is used. The division factors are given in Table 6-11 on page 31. To avoid unintentional changes of clock frequency, a special write procedure must be followed to change the CLKPS bits: 1. Write the Clock Prescaler Change Enable (CLKPCE) bit to one and all other bits in CLKPR to zero. 2. Within four cycles, write the desired value to CLKPS while writing a zero to CLKPCE. 30 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Interrupts must be disabled when changing prescaler setting to make sure the write procedure is not interrupted. The CKDIV8 Fuse determines the initial value of the CLKPS bits. If CKDIV8 is unprogrammed, the CLKPS bits will be reset to “0000”. If CKDIV8 is programmed, CLKPS bits are reset to “0011”, giving a division factor of eight at start up. This feature should be used if the selected clock source has a higher frequency than the maximum frequency of the device at the present operating conditions. Note that any value can be written to the CLKPS bits regardless of the CKDIV8 Fuse setting. The Application software must ensure that a sufficient division factor is chosen if the selcted clock source has a higher frequency than the maximum frequency of the device at the present operating conditions. The device is shipped with the CKDIV8 Fuse programmed. Table 6-11. Clock Prescaler Select CLKPS3 CLKPS2 CLKPS1 CLKPS0 Clock Division Factor 0 0 0 0 1 0 0 0 1 2 0 0 1 0 4 0 0 1 1 8 0 1 0 0 16 0 1 0 1 32 0 1 1 0 64 0 1 1 1 128 1 0 0 0 256 1 0 0 1 Reserved 1 0 1 0 Reserved 1 0 1 1 Reserved 1 1 0 0 Reserved 1 1 0 1 Reserved 1 1 1 0 Reserved 1 1 1 1 Reserved 31 8006G–AVR–01/08 7. Power Management and Sleep Modes The high performance and industry leading code efficiency makes the AVR microcontrollers an ideal choise for low power applications. In addition, sleep modes enable the application to shut down unused modules in the MCU, thereby saving power. The AVR provides various sleep modes allowing the user to tailor the power consumption to the application’s requirements. 7.1 Sleep Modes Figure 6-1 on page 23 presents the different clock systems and their distribution in ATtiny24/44/84. The figure is helpful in selecting an appropriate sleep mode. Table 7-1 shows the different sleep modes and their wake up sources. Table 7-1. Active Clock Domains and Wake-up Sources in the Different Sleep Modes clkADC Main Clock Source Enabled INT0 and Pin Change SPM/ EEPROM Ready ADC Other I/O Watchdog Interrupt Wake-up Sources X X X X X X X X ADC Noise Reduction Power-down Stand-by Note: Oscillators clkIO Idle clkFLASH Sleep Mode clkCPU Active Clock Domains X X X (1) X X X X(1) X X (2) X 1. For INT0, only level interrupt. 2. Only recommended with external crystal or resonator selected as clock source To enter any of the three sleep modes, the SE bit in MCUCR must be written to logic one and a SLEEP instruction must be executed. The SM1..0 bits in the MCUCR Register select which sleep mode (Idle, ADC Noise Reduction, Standby or Power-down) will be activated by the SLEEP instruction. See Table 7-2 on page 36 for a summary. If an enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up. The MCU is then halted for four cycles in addition to the start-up time, executes the interrupt routine, and resumes execution from the instruction following SLEEP. The contents of the Register File and SRAM are unaltered when the device wakes up from sleep. If a reset occurs during sleep mode, the MCU wakes up and executes from the Reset Vector. Note that if a level triggered interrupt is used for wake-up the changed level must be held for some time to wake up the MCU (and for the MCU to enter the interrupt service routine). See “External Interrupts” on page 48 for details. 7.1.1 Idle Mode When the SM1..0 bits are written to 00, the SLEEP instruction makes the MCU enter Idle mode, stopping the CPU but allowing Analog Comparator, ADC, Timer/Counter, Watchdog, and the interrupt system to continue operating. This sleep mode basically halts clkCPU and clkFLASH, while allowing the other clocks to run. 32 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Idle mode enables the MCU to wake up from external triggered interrupts as well as internal ones like the Timer Overflow. If wake-up from the Analog Comparator interrupt is not required, the Analog Comparator can be powered down by setting the ACD bit in “ACSR – Analog Comparator Control and Status Register” on page 130. This will reduce power consumption in Idle mode. If the ADC is enabled, a conversion starts automatically when this mode is entered. 7.1.2 ADC Noise Reduction Mode When the SM1..0 bits are written to 01, the SLEEP instruction makes the MCU enter ADC Noise Reduction mode, stopping the CPU but allowing the ADC, the external interrupts, and the Watchdog to continue operating (if enabled). This sleep mode halts clkI/O, clkCPU, and clkFLASH, while allowing the other clocks to run. This improves the noise environment for the ADC, enabling higher resolution measurements. If the ADC is enabled, a conversion starts automatically when this mode is entered. Apart form the ADC Conversion Complete interrupt, only an External Reset, a Watchdog Reset, a Brown-out Reset, an SPM/EEPROM ready interrupt, an external level interrupt on INT0 or a pin change interrupt can wake up the MCU from ADC Noise Reduction mode. 7.1.3 Power-Down Mode When the SM1:0 bits are written to 10, the SLEEP instruction makes the MCU enter Powerdown mode. In this mode, the Oscillator is stopped, while the external interrupts, and the Watchdog continue operating (if enabled). Only an External Reset, a Watchdog Reset, a Brown-out Reset, an external level interrupt on INT0, or a pin change interrupt can wake up the MCU. This sleep mode halts all generated clocks, allowing operation of asynchronous modules only. 7.1.4 Standby Mode When the SM1..0 bits are 11 and an external crystal/resonator clock option is selected, the SLEEP instruction makes the MCU enter Standby mode. This mode is identical to Power-down with the exception that the Oscillator is kept running. From Standby mode, the device wakes up in six clock cycles. 7.2 Software BOD Disable When the Brown-out Detector (BOD) is enabled by BODLEVEL fuses (see Table 19-4 on page 160), the BOD is actively monitoring the supply voltage during a sleep period. In some devices it is possible to save power by disabling the BOD by software in Power-Down and Stand-By sleep modes. The sleep mode power consumption will then be at the same level as when BOD is globally disabled by fuses. If BOD is disabled by software, the BOD function is turned off immediately after entering the sleep mode. Upon wake-up from sleep, BOD is automatically enabled again. This ensures safe operation in case the VCC level has dropped during the sleep period. When the BOD has been disabled, the wake-up time from sleep mode will be approximately 60µs to ensure that the BOD is working correctly before the MCU continues executing code. BOD disable is controlled by the BODS (BOD Sleep) bit of MCU Control Register, see “MCUCR – MCU Control Register” on page 35. Writing this bit to one turns off BOD in Power-Down and Stand-By, while writing a zero keeps the BOD active. The default setting is zero, i.e. BOD active. Writing to the BODS bit is controlled by a timed sequence and an enable bit, see “MCUCR – MCU Control Register” on page 35. 33 8006G–AVR–01/08 7.2.1 Limitations BOD disable functionality has been implemented in the following devices, only: • ATtiny24, revision E, and newer • ATtiny44, revision D, and newer • ATtiny84, revision B, and newer Revisions are marked on the device package and can be located as follows: • Bottom side of packages 14P3 and 14S1 • Top side of package 20M1 7.3 Power Reduction Register The Power Reduction Register (PRR), see “PRR – Power Reduction Register” on page 36, provides a method to reduce power consumption by stopping the clock to individual peripherals. The current state of the peripheral is frozen and the I/O registers can not be read or written. Resources used by the peripheral when stopping the clock will remain occupied, hence the peripheral should in most cases be disabled before stopping the clock. Waking up a module, which is done by clearing the bit in PRR, puts the module in the same state as before shutdown. Module shutdown can be used in Idle mode and Active mode to significantly reduce the overall power consumption. In all other sleep modes, the clock is already stopped. See “Supply Current of I/O Modules” on page 186 for examples. 7.4 Minimizing Power Consumption There are several issues to consider when trying to minimize the power consumption in an AVR controlled system. In general, sleep modes should be used as much as possible, and the sleep mode should be selected so that as few as possible of the device’s functions are operating. All functions not needed should be disabled. In particular, the following modules may need special consideration when trying to achieve the lowest possible power consumption. 7.4.1 Analog to Digital Converter If enabled, the ADC will be enabled in all sleep modes. To save power, the ADC should be disabled before entering any sleep mode. When the ADC is turned off and on again, the next conversion will be an extended conversion. See “Analog to Digital Converter” on page 132 for details on ADC operation. 7.4.2 Analog Comparator When entering Idle mode, the Analog Comparator should be disabled if not used. When entering ADC Noise Reduction mode, the Analog Comparator should be disabled. In the other sleep modes, the Analog Comparator is automatically disabled. However, if the Analog Comparator is set up to use the Internal Voltage Reference as input, the Analog Comparator should be disabled in all sleep modes. Otherwise, the Internal Voltage Reference will be enabled, independent of sleep mode. See “Analog Comparator” on page 129 for details on how to configure the Analog Comparator. 34 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 7.4.3 Brown-out Detector If the Brown-out Detector is not needed in the application, this module should be turned off. If the Brown-out Detector is enabled by the BODLEVEL Fuses, it will be enabled in all sleep modes, and hence, always consume power. In the deeper sleep modes, this will contribute significantly to the total current consumption. See “Brown-out Detection” on page 40 and “Software BOD Disable” on page 33 for details on how to configure the Brown-out Detector. 7.4.4 Internal Voltage Reference The Internal Voltage Reference will be enabled when needed by the Brown-out Detection, the Analog Comparator or the ADC. If these modules are disabled as described in the sections above, the internal voltage reference will be disabled and it will not be consuming power. When turned on again, the user must allow the reference to start up before the output is used. If the reference is kept on in sleep mode, the output can be used immediately. See “Internal Voltage Reference” on page 41 for details on the start-up time. 7.4.5 Watchdog Timer If the Watchdog Timer is not needed in the application, this module should be turned off. If the Watchdog Timer is enabled, it will be enabled in all sleep modes, and hence, always consume power. In the deeper sleep modes, this will contribute significantly to the total current consumption. See “Watchdog Timer” on page 41 for details on how to configure the Watchdog Timer. 7.4.6 Port Pins When entering a sleep mode, all port pins should be configured to use minimum power. The most important thing is then to ensure that no pins drive resistive loads. In sleep modes where both the I/O clock (clkI/O) and the ADC clock (clkADC) are stopped, the input buffers of the device will be disabled. This ensures that no power is consumed by the input logic when not needed. In some cases, the input logic is needed for detecting wake-up conditions, and it will then be enabled. See the section “Digital Input Enable and Sleep Modes” on page 57 for details on which pins are enabled. If the input buffer is enabled and the input signal is left floating or has an analog signal level close to VCC/2, the input buffer will use excessive power. For analog input pins, the digital input buffer should be disabled at all times. An analog signal level close to VCC/2 on an input pin can cause significant current even in active mode. Digital input buffers can be disabled by writing to the Digital Input Disable Register (DIDR0). See “DIDR0 – Digital Input Disable Register 0” on page 150 for details. 7.5 7.5.1 Register Description MCUCR – MCU Control Register The MCU Control Register contains control bits for power management. Bit 7 6 5 4 3 2 1 0 BODS PUD SE SM1 SM0 BODSE ISC01 ISC00 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 MCUCR • Bit 7 – BODS: BOD Sleep BOD disable functionality is available in some devices, only. See “Limitations” on page 34. In order to disable BOD during sleep (see Table 7-1 on page 32) the BODS bit must be written to logic one. This is controlled by a timed sequence and the enable bit, BODSE in MCUCR. First, 35 8006G–AVR–01/08 both BODS and BODSE must be set to one. Second, within four clock cycles, BODS must be set to one and BODSE must be set to zero. The BODS bit is active three clock cycles after it is set. A sleep instruction must be executed while BODS is active in order to turn off the BOD for the actual sleep mode. The BODS bit is automatically cleared after three clock cycles. In devices where Sleeping BOD has not been implemented this bit is unused and will always read zero. • Bit 5 – SE: Sleep Enable The SE bit must be written to logic one to make the MCU enter the sleep mode when the SLEEP instruction is executed. To avoid the MCU entering the sleep mode unless it is the programmer’s purpose, it is recommended to write the Sleep Enable (SE) bit to one just before the execution of the SLEEP instruction and to clear it immediately after waking up. • Bits 4, 3 – SM1..0: Sleep Mode Select Bits 2..0 These bits select between the three available sleep modes as shown in Table 7-2 on page 36. Table 7-2. Note: Sleep Mode Select SM1 SM0 Sleep Mode 0 0 Idle 0 1 ADC Noise Reduction 1 0 Power-down 1 1 Standby(1) 1. Only recommended with external crystal or resonator selected as clock source • Bit 2 – BODSE: BOD Sleep Enable BOD disable functionality is available in some devices, only. See “Limitations” on page 34. The BODSE bit enables setting of BODS control bit, as explained on BODS bit description. BOD disable is controlled by a timed sequence. This bit is unused in devices where software BOD disable has not been implemented and will read as zero in those devices. 7.5.2 PRR – Power Reduction Register The Power Reduction Register provides a method to reduce power consumption by allowing peripheral clock signals to be disabled. Bit 7 6 5 4 3 2 1 0 – – – – PRTIM1 PRTIM0 PRUSI PRADC Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 PRR • Bits 7, 6, 5, 4 - Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bit 3- PRTIM1: Power Reduction Timer/Counter1 Writing a logic one to this bit shuts down the Timer/Counter1 module. When the Timer/Counter1 is enabled, operation will continue like before the shutdown. 36 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Bit 2- PRTIM0: Power Reduction Timer/Counter0 Writing a logic one to this bit shuts down the Timer/Counter0 module. When the Timer/Counter0 is enabled, operation will continue like before the shutdown. • Bit 1 - PRUSI: Power Reduction USI Writing a logic one to this bit shuts down the USI by stopping the clock to the module. When waking up the USI again, the USI should be re initialized to ensure proper operation. • Bit 0 - PRADC: Power Reduction ADC Writing a logic one to this bit shuts down the ADC. The ADC must be disabled before shut down. The analog comparator cannot be used when the ADC is shut down. 37 8006G–AVR–01/08 8. System Control and Reset 8.1 Resetting the AVR During reset, all I/O Registers are set to their initial values, and the program starts execution from the Reset Vector. The instruction placed at the Reset Vector must be a RJMP – Relative Jump – instruction to the reset handling routine. If the program never enables an interrupt source, the Interrupt Vectors are not used, and regular program code can be placed at these locations. The circuit diagram in Figure 8-1 shows the reset logic. Electrical parameters of the reset circuitry are given in Table 20-4 on page 179. Figure 8-1. Reset Logic DATA BUS PORF BORF EXTRF WDRF MCU Status Register (MCUSR) Power-on Reset Circuit Brown-out Reset Circuit BODLEVEL [2..0] Pull-up Resistor SPIKE FILTER Watchdog Oscillator Clock Generator CK Delay Counters TIMEOUT CKSEL[3:0] SUT[1:0] The I/O ports of the AVR are immediately reset to their initial state when a reset source goes active. This does not require any clock source to be running. After all reset sources have gone inactive, a delay counter is invoked, stretching the internal reset. This allows the power to reach a stable level before normal operation starts. The time-out period of the delay counter is defined by the user through the SUT and CKSEL Fuses. The different selections for the delay period are presented in “Clock Sources” on page 24. 38 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 8.2 Reset Sources The ATtiny24/44/84 has four sources of reset: • Power-on Reset. The MCU is reset when the supply voltage is below the Power-on Reset threshold (VPOT). • External Reset. The MCU is reset when a low level is present on the RESET pin for longer than the minimum pulse length when RESET function is enabled. • Watchdog Reset. The MCU is reset when the Watchdog Timer period expires and the Watchdog is enabled. • Brown-out Reset. The MCU is reset when the supply voltage VCC is below the Brown-out Reset threshold (VBOT) and the Brown-out Detector is enabled. 8.2.1 Power-on Reset A Power-on Reset (POR) pulse is generated by an On-chip detection circuit. The detection level is defined in “System and Reset Characteristics” on page 179. The POR is activated whenever VCC is below the detection level. The POR circuit can be used to trigger the Start-up Reset, as well as to detect a failure in supply voltage. A Power-on Reset (POR) circuit ensures that the device is reset from Power-on. Reaching the Power-on Reset threshold voltage invokes the delay counter, which determines how long the device is kept in RESET after VCC rise. The RESET signal is activated again, without any delay, when VCC decreases below the detection level. Figure 8-2. VCC RESET MCU Start-up, RESET Tied to VCC VPOT VRST tTOUT TIME-OUT INTERNAL RESET Figure 8-3. VCC RESET TIME-OUT MCU Start-up, RESET Extended Externally VPOT VRST tTOUT INTERNAL RESET 39 8006G–AVR–01/08 8.2.2 External Reset An External Reset is generated by a low level on the RESET pin if enabled. Reset pulses longer than the minimum pulse width (see “System and Reset Characteristics” on page 179) will generate a reset, even if the clock is not running. Shorter pulses are not guaranteed to generate a reset. When the applied signal reaches the Reset Threshold Voltage – VRST – on its positive edge, the delay counter starts the MCU after the Time-out period – tTOUT – has expired. Figure 8-4. External Reset During Operation CC 8.2.3 Brown-out Detection ATtiny24/44/84 has an On-chip Brown-out Detection (BOD) circuit for monitoring the VCC level during operation by comparing it to a fixed trigger level. The trigger level for the BOD can be selected by the BODLEVEL Fuses. The trigger level has a hysteresis to ensure spike free Brown-out Detection. The hysteresis on the detection level should be interpreted as VBOT+ = VBOT + VHYST/2 and VBOT- = VBOT - VHYST/2. When the BOD is enabled, and VCC decreases to a value below the trigger level (VBOT- in Figure 8-5 on page 40), the Brown-out Reset is immediately activated. When VCC increases above the trigger level (VBOT+ in Figure 8-5 on page 40), the delay counter starts the MCU after the Timeout period tTOUT has expired. The BOD circuit will only detect a drop in VCC if the voltage stays below the trigger level for longer than tBOD given in “System and Reset Characteristics” on page 179. Figure 8-5. Brown-out Reset During Operation VCC VBOT- VBOT+ RESET TIME-OUT tTOUT INTERNAL RESET 40 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 8.2.4 Watchdog Reset When the Watchdog times out, it will generate a short reset pulse of one CK cycle duration. On the falling edge of this pulse, the delay timer starts counting the Time-out period tTOUT. See “Watchdog Timer” on page 41 for details on operation of the Watchdog Timer. Figure 8-6. Watchdog Reset During Operation CC CK 8.3 Internal Voltage Reference ATtiny24/44/84 features an internal bandgap reference. This reference is used for Brown-out Detection, and it can be used as an input to the Analog Comparator or the ADC. 8.3.1 Voltage Reference Enable Signals and Start-up Time The voltage reference has a start-up time that may influence the way it should be used. The start-up time is given in “System and Reset Characteristics” on page 179. To save power, the reference is not always turned on. The reference is on during the following situations: 1. When the BOD is enabled (by programming the BODLEVEL [2..0] Fuse). 2. When the internal reference is connected to the Analog Comparator (by setting the ACBG bit in ACSR). 3. When the ADC is enabled. Thus, when the BOD is not enabled, after setting the ACBG bit or enabling the ADC, the user must always allow the reference to start up before the output from the Analog Comparator or ADC is used. To reduce power consumption in Power-down mode, the user can avoid the three conditions above to ensure that the reference is turned off before entering Power-down mode. 8.4 Watchdog Timer The Watchdog Timer is clocked from an On-chip Oscillator which runs at 128 kHz. By controlling the Watchdog Timer prescaler, the Watchdog Reset interval can be adjusted as shown in Table 8-3 on page 46. The WDR – Watchdog Reset – instruction resets the Watchdog Timer. The Watchdog Timer is also reset when it is disabled and when a Chip Reset occurs. Ten different clock cycle periods can be selected to determine the reset period. If the reset period expires without another Watchdog Reset, the ATtiny24/44/84 resets and executes from the Reset Vector. For timing details on the Watchdog Reset, refer to Table 8-3 on page 46. 41 8006G–AVR–01/08 The Wathdog Timer can also be configured to generate an interrupt instead of a reset. This can be very helpful when using the Watchdog to wake-up from Power-down. To prevent unintentional disabling of the Watchdog or unintentional change of time-out period, two different safety levels are selected by the fuse WDTON as shown in Table 8-1 See “Timed Sequences for Changing the Configuration of the Watchdog Timer” on page 42 for details. Table 8-1. WDT Configuration as a Function of the Fuse Settings of WDTON Safety Level WDTON WDT Initial State How to Disable the WDT How to Change Timeout Unprogrammed 1 Disabled Timed sequence No limitations Programmed 2 Enabled Always enabled Timed sequence Watchdog Timer WDP0 WDP1 WDP2 WDP3 OSC/512K OSC/1024K OSC/256K OSC/64K OSC/128K OSC/8K OSC/4K OSC/2K WATCHDOG RESET OSC/32K WATCHDOG PRESCALER 128 kHz OSCILLATOR OSC/16K Figure 8-7. MUX WDE MCU RESET 8.4.1 8.4.1.1 Timed Sequences for Changing the Configuration of the Watchdog Timer The sequence for changing configuration differs slightly between the two safety levels. Separate procedures are described for each level. Safety Level 1 In this mode, the Watchdog Timer is initially disabled, but can be enabled by writing the WDE bit to one without any restriction. A timed sequence is needed when disabling an enabled Watchdog Timer. To disable an enabled Watchdog Timer, the following procedure must be followed: 1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written to WDE regardless of the previous value of the WDE bit. 2. Within the next four clock cycles, in the same operation, write the WDE and WDP bits as desired, but with the WDCE bit cleared. 42 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 8.4.1.2 Safety Level 2 In this mode, the Watchdog Timer is always enabled, and the WDE bit will always read as one. A timed sequence is needed when changing the Watchdog Time-out period. To change the Watchdog Time-out, the following procedure must be followed: 1. In the same operation, write a logical one to WDCE and WDE. Even though the WDE always is set, the WDE must be written to one to start the timed sequence. 2. Within the next four clock cycles, in the same operation, write the WDP bits as desired, but with the WDCE bit cleared. The value written to the WDE bit is irrelevant. 8.4.2 Code Example The following code example shows one assembly and one C function for turning off the WDT. The example assumes that interrupts are controlled (e.g., by disabling interrupts globally) so that no interrupts will occur during execution of these functions. Assembly Code Example(1) WDT_off: wdr ; Clear WDRF in MCUSR ldi r16, (0<<WDRF) out MCUSR, r16 ; Write logical one to WDCE and WDE ; Keep old prescaler setting to prevent unintentional Watchdog Reset in r16, WDTCSR ori r16, (1<<WDCE)|(1<<WDE) out WDTCSR, r16 ; Turn off WDT ldi r16, (0<<WDE) out WDTCSR, r16 ret C Code Example(1) void WDT_off(void) { _WDR(); /* Clear WDRF in MCUSR */ MCUSR = 0x00 /* Write logical one to WDCE and WDE */ WDTCSR |= (1<<WDCE) | (1<<WDE); /* Turn off WDT */ WDTCSR = 0x00; } Note: 1. See “Code Examples” on page 6. 43 8006G–AVR–01/08 8.5 8.5.1 Register Description MCUSR – MCU Status Register The MCU Status Register provides information on which reset source caused an MCU Reset. Bit 7 6 5 4 3 2 1 0 0x34 (0x54) – – – – WDRF BORF EXTRF PORF Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 MCUSR See Bit Description • Bits 7..4 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bit 3 – WDRF: Watchdog Reset Flag This bit is set if a Watchdog Reset occurs. The bit is reset by a Power-on Reset, or by writing a logic zero to the flag. • Bit 2 – BORF: Brown-out Reset Flag This bit is set if a Brown-out Reset occurs. The bit is reset by a Power-on Reset, or by writing a logic zero to the flag. • Bit 1 – EXTRF: External Reset Flag This bit is set if an External Reset occurs. The bit is reset by a Power-on Reset, or by writing a logic zero to the flag. • Bit 0 – PORF: Power-on Reset Flag This bit is set if a Power-on Reset occurs. The bit is reset only by writing a logic zero to the flag. To make use of the Reset Flags to identify a reset condition, the user should read and then reset the MCUSR as early as possible in the program. If the register is cleared before another reset occurs, the source of the reset can be found by examining the Reset Flags. 8.5.2 WDTCSR – Watchdog Timer Control and Status Register Bit 7 6 5 4 3 2 1 0 0x21 (0x41) WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 X 0 0 0 WDTCSR • Bit 7 – WDIF: Watchdog Timeout Interrupt Flag This bit is set when a time-out occurs in the Watchdog Timer and the Watchdog Timer is configured for interrupt. WDIF is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, WDIF is cleared by writing a logic one to the flag. When the I-bit in SREG and WDIE are set, the Watchdog Time-out Interrupt is executed. • Bit 6 – WDIE: Watchdog Timeout Interrupt Enable When this bit is written to one, WDE is cleared, and the I-bit in the Status Register is set, the Watchdog Time-out Interrupt is enabled. In this mode the corresponding interrupt is executed instead of a reset if a timeout in the Watchdog Timer occurs. If WDE is set, WDIE is automatically cleared by hardware when a time-out occurs. This is useful for keeping the Watchdog Reset security while using the interrupt. After the WDIE bit is cleared, 44 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 the next time-out will generate a reset. To avoid the Watchdog Reset, WDIE must be set after each interrupt. Table 8-2. Watchdog Timer Configuration WDE WDIE Watchdog Timer State Action on Time-out 0 0 Stopped None 0 1 Running Interrupt 1 0 Running Reset 1 1 Running Interrupt • Bit 4 – WDCE: Watchdog Change Enable This bit must be set when the WDE bit is written to logic zero. Otherwise, the Watchdog will not be disabled. Once written to one, hardware will clear this bit after four clock cycles. See the description of the WDE bit for a Watchdog disable procedure. This bit must also be set when changing the prescaler bits. See “Timed Sequences for Changing the Configuration of the Watchdog Timer” on page 42. • Bit 3 – WDE: Watchdog Enable When the WDE is written to logic one, the Watchdog Timer is enabled, and if the WDE is written to logic zero, the Watchdog Timer function is disabled. WDE can only be cleared if the WDCE bit has logic level one. To disable an enabled Watchdog Timer, the following procedure must be followed: 1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written to WDE even though it is set to one before the disable operation starts. 2. Within the next four clock cycles, write a logic 0 to WDE. This disables the Watchdog. In safety level 2, it is not possible to disable the Watchdog Timer, even with the algorithm described above. See “Timed Sequences for Changing the Configuration of the Watchdog Timer” on page 42. In safety level 1, WDE is overridden by WDRF in MCUSR. See “MCUSR – MCU Status Register” on page 44 for description of WDRF. This means that WDE is always set when WDRF is set. To clear WDE, WDRF must be cleared before disabling the Watchdog with the procedure described above. This feature ensures multiple resets during conditions causing failure, and a safe start-up after the failure. Note: If the watchdog timer is not going to be used in the application, it is important to go through a watchdog disable procedure in the initialization of the device. If the Watchdog is accidentally enabled, for example by a runaway pointer or brown-out condition, the device will be reset, which in turn will lead to a new watchdog reset. To avoid this situation, the application software should always clear the WDRF flag and the WDE control bit in the initialization routine. 45 8006G–AVR–01/08 • Bits 5, 2..0 – WDP3..0: Watchdog Timer Prescaler 3, 2, 1, and 0 The WDP3..0 bits determine the Watchdog Timer prescaling when the Watchdog Timer is enabled. The different prescaling values and their corresponding Timeout Periods are shown in Table 8-3. Table 8-3. WDP3 WDP2 WDP1 WDP0 Number of WDT Oscillator Cycles Typical Time-out at VCC = 5.0V 0 0 0 0 2K cycles 16 ms 0 0 0 1 4K cycles 32 ms 0 0 1 0 8K cycles 64 ms 0 0 1 1 16K cycles 0.125 s 0 1 0 0 32K cycles 0.25 s 0 1 0 1 64K cycles 0.5 s 0 1 1 0 128K cycles 1.0 s 0 1 1 1 256K cycles 2.0 s 1 0 0 0 512K cycles 4.0 s 1 0 0 1 1024K cycles 8.0 s 1 0 1 0 1 0 1 1 1 1 0 0 1 1 0 1 1 1 1 0 1 1 1 1 Note: 46 Watchdog Timer Prescale Select Reserved(1) 1. If selected, one of the valid settings below 0b1010 will be used. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 9. Interrupts This section describes the specifics of the interrupt handling as performed in ATtiny24/44/84. For a general explanation of the AVR interrupt handling, see “Reset and Interrupt Handling” on page 12. 9.1 Interrupt Vectors The interrupt vectors of ATtiny24/44/84 are described in Table 9-1 below. Table 9-1. Reset and Interrupt Vectors Vector No. Program Address Source Interrupt Definition 1 0x0000 RESET External Pin, Power-on Reset, Brown-out Reset, Watchdog Reset 2 0x0001 INT0 External Interrupt Request 0 3 0x0002 PCINT0 Pin Change Interrupt Request 0 4 0x0003 PCINT1 Pin Change Interrupt Request 1 5 0x0004 WDT Watchdog Time-out 6 0x0005 TIM1_CAPT Timer/Counter1 Capture Event 7 0x0006 TIM1_COMPA Timer/Counter1 Compare Match A 8 0x0007 TIM1_COMPB Timer/Counter1 Compare Match B 9 0x0008 TIM1_OVF Timer/Counter1 Overflow 10 0x0009 TIM0_COMPA Timer/Counter0 Compare Match A 11 0x000A TIM0_COMPB Timer/Counter0 Compare Match B 12 0x000B TIM0_OVF Timer/Counter0 Overflow 13 0x000C ANA_COMP Analog Comparator 14 0x000D ADC ADC Conversion Complete 15 0x000E EE_RDY EEPROM Ready 16 0x000F USI_STR USI START 17 0x0010 USI_OVF USI Overflow If the program never enables an interrupt source, the Interrupt Vectors are not used, and regular program code can be placed at these locations. The most typical and general setup for Reset and Interrupt Vector Addresses in ATtiny24/44/84 is shown in the program example below. 47 8006G–AVR–01/08 Address Labels Code Comments 0x0000 rjmp RESET ; Reset Handler 0x0001 rjmp INT0 ; IRQ0 Handler 0x0002 rjmp PCINT0 ; PCINT0 Handler 0x0003 rjmp PCINT1 ; PCINT1 Handler 0x0004 rjmp WDT ; Watchdog Interrupt Handler 0x0005 rjmp TIM1_CAPT ; Timer1 Capture Handler 0x0006 rjmp TIM1_COMPA ; Timer1 Compare A Handler 0x0007 rjmp TIM1_COMPB ; Timer1 Compare B Handler 0x0008 rjmp TIM1_OVF ; Timer1 Overflow Handler 0x0009 rjmp TIM0_COMPA ; Timer0 Compare A Handler 0x000A rjmp TIM0_COMPB ; Timer0 Compare B Handler 0x000B rjmp TIM0_OVF ; Timer0 Overflow Handler 0x000C rjmp ANA_COMP ; Analog Comparator Handler 0x000D rjmp ADC ; ADC Conversion Handler 0x000E rjmp EE_RDY ; EEPROM Ready Handler 0x000F rjmp USI_STR ; USI STart Handler 0x0010 rjmp USI_OVF ; USI Overflow Handler ; 0x0011 RESET: ldi 0x0012 out SPH,r16 0x0013 ldi r16, low(RAMEND) 0x0014 out SPL,r16 0x0015 0x0016 ... 9.2 r16, high(RAMEND); Main program start sei <instr> ... ; Set Stack Pointer to top of RAM ; Enable interrupts xxx ... ... External Interrupts The External Interrupts are triggered by the INT0 pin or any of the PCINT11..0 pins. Observe that, if enabled, the interrupts will trigger even if the INT0 or PCINT11..0 pins are configured as outputs. This feature provides a way of generating a software interrupt. Pin change 0 interrupts PCI0 will trigger if any enabled PCINT7..0 pin toggles. Pin change 1 interrupts PCI1 will trigger if any enabled PCINT11..8 pin toggles. The PCMSK0 and PCMSK1 Registers control which pins contribute to the pin change interrupts. Pin change interrupts on PCINT11..0 are detected asynchronously. This implies that these interrupts can be used for waking the part also from sleep modes other than Idle mode. The INT0 interrupts can be triggered by a falling or rising edge or a low level. This is set up as indicated in the specification for the MCU Control Register – MCUCR. When the INT0 interrupt is enabled and is configured as level triggered, the interrupt will trigger as long as the pin is held low. Note that recognition of falling or rising edge interrupts on INT0 requires the presence of an I/O clock, as described in “Clock Systems and their Distribution” on page 23. 9.2.1 48 Low Level Interrupt A low level interrupt on INT0 is detected asynchronously. This means that the interrupt source can be used for waking the part also from sleep modes other than Idle (the I/O clock is halted in all sleep modes except Idle). ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Note that if a level triggered interrupt is used for wake-up from Power-down, the required level must be held long enough for the MCU to complete the wake-up to trigger the level interrupt. If the level disappears before the end of the Start-up Time, the MCU will still wake up, but no interrupt will be generated. The start-up time is defined by the SUT and CKSEL fuses, as described in “System Clock and Clock Options” on page 23. If the low level on the interrupt pin is removed before the device has woken up then program execution will not be diverted to the interrupt service routine but continue from the instruction following the SLEEP command. 9.2.2 Pin Change Interrupt Timing An example of timing of a pin change interrupt is shown in Figure 9-1. Figure 9-1. Timing of pin change interrupts pin_lat PCINT(0) LE clk D pcint_in_(0) Q pin_sync PCINT(0) in PCMSK(x) 0 pcint_syn pcint_setflag PCIF x clk clk PCINT(0) pin_lat pin_sync pcint_in_(0) pcint_syn pcint_setflag PCIF 49 8006G–AVR–01/08 9.3 9.3.1 Register Description MCUCR – MCU Control Register The External Interrupt Control Register A contains control bits for interrupt sense control. Bit 7 6 5 4 3 2 1 0 0x35 (0x55) BODS PUD SE SM1 SM0 BODSE ISC01 ISC00 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 MCUCR • Bits 1, 0 – ISC01, ISC00: Interrupt Sense Control 0 Bit 1 and Bit 0 The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corresponding interrupt mask are set. The level and edges on the external INT0 pin that activate the interrupt are defined in Table 9-2. The value on the INT0 pin is sampled before detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If low level interrupt is selected, the low level must be held until the completion of the currently executing instruction to generate an interrupt. Table 9-2. 9.3.2 Interrupt 0 Sense Control ISC01 ISC00 Description 0 0 The low level of INT0 generates an interrupt request. 0 1 Any logical change on INT0 generates an interrupt request. 1 0 The falling edge of INT0 generates an interrupt request. 1 1 The rising edge of INT0 generates an interrupt request. GIMSK – General Interrupt Mask Register Bit 7 6 5 4 3 2 1 0x3B (0x5B) – INT0 PCIE1 PCIE0 – – – 0 – Read/Write R R/W R/W R/w R R R R Initial Value 0 0 0 0 0 0 0 0 GIMSK • Bits 7, 3..0 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bit 6 – INT0: External Interrupt Request 0 Enable When the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the external pin interrupt is enabled. The Interrupt Sense Control bits (ISC01 and ISC00) in the External Interrupt Control Register A (EICRA) define whether the external interrupt is activated on rising and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an interrupt request even if INT0 is configured as an output. The corresponding interrupt of External Interrupt Request 0 is executed from the INT0 Interrupt Vector. • Bit 5 – PCIE1: Pin Change Interrupt Enable 1 When the PCIE1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 1 is enabled. Any change on any enabled PCINT11..8 pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI1 Interrupt Vector. PCINT11..8 pins are enabled individually by the PCMSK1 Register. 50 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Bit 4– PCIE0: Pin Change Interrupt Enable 0 When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin change interrupt 0 is enabled. Any change on any enabled PCINT7..0 pin will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI0 Interrupt Vector. PCINT7..0 pins are enabled individually by the PCMSK0 Register. 9.3.3 GIFR – General Interrupt Flag Register Bit 7 6 5 4 3 2 1 0x3A (0x5A – INTF0 PCIF1 PCIF0 – – – 0 – Read/Write R R/W R/W R/W R R R R Initial Value 0 0 0 0 0 0 0 0 GIFR • Bits 7, 3..0 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bit 6 – INTF0: External Interrupt Flag 0 When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set (one). If the I-bit in SREG and the INT0 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared when INT0 is configured as a level interrupt. • Bit 5 – PCIF1: Pin Change Interrupt Flag 1 When a logic change on any PCINT11..8 pin triggers an interrupt request, PCIF1 becomes set (one). If the I-bit in SREG and the PCIE1 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. • Bit 4– PCIF0: Pin Change Interrupt Flag 0 When a logic change on any PCINT7..0 pin triggers an interrupt request, PCIF becomes set (one). If the I-bit in SREG and the PCIE0 bit in GIMSK are set (one), the MCU will jump to the corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alternatively, the flag can be cleared by writing a logical one to it. 9.3.4 PCMSK1 – Pin Change Mask Register 1 Bit 7 6 5 4 3 2 1 0 0x20 (0x40) – – – – PCINT11 PCINT10 PCINT9 PCINT8 Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 PCMSK1 • Bits 7, 4– Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bits 3..0 – PCINT11..8: Pin Change Enable Mask 11..8 Each PCINT11..8 bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT11..8 is set and the PCIE1 bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT11..8 is cleared, pin change interrupt on the corresponding I/O pin is disabled. 51 8006G–AVR–01/08 9.3.5 PCMSK0 – Pin Change Mask Register 0 Bit 7 6 5 4 3 2 1 0 0x12 (0x32) PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 PCMSK0 • Bits 7..0 – PCINT7..0: Pin Change Enable Mask 7..0 Each PCINT7..0 bit selects whether pin change interrupt is enabled on the corresponding I/O pin. If PCINT7..0 is set and the PCIE0 bit in GIMSK is set, pin change interrupt is enabled on the corresponding I/O pin. If PCINT7..0 is cleared, pin change interrupt on the corresponding I/O pin is disabled. 52 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 10. I/O Ports 10.1 Overview All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports. This means that the direction of one port pin can be changed without unintentionally changing the direction of any other pin with the SBI and CBI instructions. The same applies when changing drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured as input). Each output buffer has symmetrical drive characteristics with both high sink and source capability. The pin driver is strong enough to drive LED displays directly. All port pins have individually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have protection diodes to both VCC and Ground as indicated in Figure 10-1 on page 53. See “Electrical Characteristics” on page 175 for a complete list of parameters. Figure 10-1. I/O Pin Equivalent Schematic Rpu Logic Pxn Cpin See Figure "General Digital I/O" for Details All registers and bit references in this section are written in general form. A lower case “x” represents the numbering letter for the port, and a lower case “n” represents the bit number. However, when using the register or bit defines in a program, the precise form must be used. For example, PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Registers and bit locations are listed in “Register Description” on page 66. Three I/O memory address locations are allocated for each port, one each for the Data Register – PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The Port Input Pins I/O location is read only, while the Data Register and the Data Direction Register are read/write. However, writing a logic one to a bit in the PINx Register, will result in a toggle in the corresponding bit in the Data Register. In addition, the Pull-up Disable – PUD bit in MCUCR disables the pull-up function for all pins in all ports when set. Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on page 54. Most port pins are multiplexed with alternate functions for the peripheral features on the device. How each alternate function interferes with the port pin is described in “Alternate Port Functions” on page 57. Refer to the individual module sections for a full description of the alternate functions. Note that enabling the alternate function of some of the port pins does not affect the use of the other pins in the port as general digital I/O. 53 8006G–AVR–01/08 10.2 Ports as General Digital I/O The ports are bi-directional I/O ports with optional internal pull-ups. Figure 10-2 shows a functional description of one I/O-port pin, here generically called Pxn. Figure 10-2. General Digital I/O(1) PUD Q D DDxn Q CLR WDx RESET DATA BUS RDx 1 Q Pxn D 0 PORTxn Q CLR RESET WRx WPx RRx SLEEP SYNCHRONIZER D Q L Q D RPx Q PINxn Q clk I/O PUD: SLEEP: clkI/O: Note: 10.2.1 PULLUP DISABLE SLEEP CONTROL I/O CLOCK WDx: RDx: WRx: RRx: RPx: WPx: WRITE DDRx READ DDRx WRITE PORTx READ PORTx REGISTER READ PORTx PIN WRITE PINx REGISTER 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP, and PUD are common to all ports. Configuring the Pin Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in “Register Description” on page 66, the DDxn bits are accessed at the DDRx I/O address, the PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O address. The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one, Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input pin. If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor is activated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has to be configured as an output pin. The port pins are tri-stated when reset condition becomes active, even if no clocks are running. If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port pin is driven low (zero). 54 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 10.2.2 Toggling the Pin Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn. Note that the SBI instruction can be used to toggle one single bit in a port. 10.2.3 Switching Between Input and Output When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn} = 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or output low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully acceptable, as a high-impedant environment will not notice the difference between a strong high driver and a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable all pull-ups in all ports. Switching between input with pull-up and output low generates the same problem. The user must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn} = 0b10) as an intermediate step. Table 10-1 on page 55 summarizes the control signals for the pin value. Table 10-1. 10.2.4 Port Pin Configurations DDxn PORTxn PUD (in MCUCR) I/O Pull-up 0 0 X Input No Tri-state (Hi-Z) 0 1 0 Input Yes Pxn will source current if ext. pulled low. 0 1 1 Input No Tri-state (Hi-Z) 1 0 X Output No Output Low (Sink) 1 1 X Output No Output High (Source) Comment Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through the PINxn Register bit. As shown in Figure 10-2 on page 54, the PINxn Register bit and the preceding latch constitute a synchronizer. This is needed to avoid metastability if the physical pin changes value near the edge of the internal clock, but it also introduces a delay. Figure 10-3 shows a timing diagram of the synchronization when reading an externally applied pin value. The maximum and minimum propagation delays are denoted tpd,max and tpd,min respectively. Figure 10-3. Synchronization when Reading an Externally Applied Pin value SYSTEM CLK INSTRUCTIONS XXX XXX in r17, PINx SYNC LATCH PINxn r17 0x00 0xFF t pd, max t pd, min 55 8006G–AVR–01/08 Consider the clock period starting shortly after the first falling edge of the system clock. The latch is closed when the clock is low, and goes transparent when the clock is high, as indicated by the shaded region of the “SYNC LATCH” signal. The signal value is latched when the system clock goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indicated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed between ½ and 1½ system clock period depending upon the time of assertion. When reading back a software assigned pin value, a nop instruction must be inserted as indicated in Figure 10-4 on page 56. The out instruction sets the “SYNC LATCH” signal at the positive edge of the clock. In this case, the delay tpd through the synchronizer is one system clock period. Figure 10-4. Synchronization when Reading a Software Assigned Pin Value SYSTEM CLK r16 INSTRUCTIONS 0xFF out PORTx, r16 nop in r17, PINx SYNC LATCH PINxn r17 0x00 0xFF t pd The following code example shows how to set port A pins 0 and 1 high, 2 and 3 low, and define the port pins from 4 to 5 as input with a pull-up assigned to port pin 4. The resulting pin values are read back again, but as previously discussed, a nop instruction is included to be able to read back the value recently assigned to some of the pins. Assembly Code Example(1) ... ; Define pull-ups and set outputs high ; Define directions for port pins ldi r16,(1<<PA4)|(1<<PA1)|(1<<PA0) ldi r17,(1<<DDA3)|(1<<DDA2)|(1<<DDA1)|(1<<DDA0) out PORTA,r16 out DDRA,r17 ; Insert nop for synchronization nop ; Read port pins in r16,PINA ... Note: 56 1. For the assembly program, two temporary registers are used to minimize the time from pullups are set on pins 0, 1 and 4, until the direction bits are correctly set, defining bit 2 and 3 as low and redefining bits 0 and 1 as strong high drivers. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 C Code Example unsigned char i; ... /* Define pull-ups and set outputs high */ /* Define directions for port pins */ PORTA = (1<<PA4)|(1<<PA1)|(1<<PA0); DDRA = (1<<DDA3)|(1<<DDA2)|(1<<DDA1)|(1<<DDA0); /* Insert nop for synchronization*/ _NOP(); /* Read port pins */ i = PINA; ... 10.2.5 Digital Input Enable and Sleep Modes As shown in Figure 10-2 on page 54, the digital input signal can be clamped to ground at the input of the schmitt-trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep Controller in Power-down and Standby modes to avoid high power consumption if some input signals are left floating, or have an analog signal level close to VCC/2. SLEEP is overridden for port pins enabled as external interrupt pins. If the external interrupt request is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by various other alternate functions as described in “Alternate Port Functions” on page 57. If a logic high level (“one”) is present on an asynchronous external interrupt pin configured as “Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interrupt is not enabled, the corresponding External Interrupt Flag will be set when resuming from the above mentioned Sleep mode, as the clamping in these sleep mode produces the requested logic change. 10.2.6 Unconnected Pins If some pins are unused, it is recommended to ensure that these pins have a defined level. Even though most of the digital inputs are disabled in the deep sleep modes as described above, floating inputs should be avoided to reduce current consumption in all other modes where the digital inputs are enabled (Reset, Active mode and Idle mode). The simplest method to ensure a defined level of an unused pin, is to enable the internal pull-up. In this case, the pull-up will be disabled during reset. If low power consumption during reset is important, it is recommended to use an external pull-up or pulldown. Connecting unused pins directly to VCC or GND is not recommended, since this may cause excessive currents if the pin is accidentally configured as an output. 10.3 Alternate Port Functions Most port pins have alternate functions in addition to being general digital I/Os. In Figure 10-5 below is shown how the port pin control signals from the simplified Figure 10-2 on page 54 can be overridden by alternate functions. 57 8006G–AVR–01/08 Figure 10-5. Alternate Port Functions(1) PUOExn PUOVxn 1 PUD 0 DDOExn DDOVxn 1 Q D DDxn 0 Q CLR WDx PVOExn RESET RDx 1 DATA BUS PVOVxn 1 Pxn Q 0 D 0 PORTxn PTOExn Q CLR DIEOExn WPx DIEOVxn RESET WRx 1 0 RRx SLEEP SYNCHRONIZER D SET Q D RPx Q PINxn L CLR Q CLR Q clk I/O DIxn AIOxn PUOExn: PUOVxn: DDOExn: DDOVxn: PVOExn: PVOVxn: DIEOExn: DIEOVxn: SLEEP: PTOExn: Note: Pxn PULL-UP OVERRIDE ENABLE Pxn PULL-UP OVERRIDE VALUE Pxn DATA DIRECTION OVERRIDE ENABLE Pxn DATA DIRECTION OVERRIDE VALUE Pxn PORT VALUE OVERRIDE ENABLE Pxn PORT VALUE OVERRIDE VALUE Pxn DIGITAL INPUT-ENABLE OVERRIDE ENABLE Pxn DIGITAL INPUT-ENABLE OVERRIDE VALUE SLEEP CONTROL Pxn, PORT TOGGLE OVERRIDE ENABLE PUD: WDx: RDx: RRx: WRx: RPx: WPx: clkI/O: DIxn: AIOxn: PULLUP DISABLE WRITE DDRx READ DDRx READ PORTx REGISTER WRITE PORTx READ PORTx PIN WRITE PINx I/O CLOCK DIGITAL INPUT PIN n ON PORTx ANALOG INPUT/OUTPUT PIN n ON PORTx 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP, and PUD are common to all ports. All other signals are unique for each pin. The overriding signals may not be present in all port pins, but the figure serves as a generic description applicable to all port pins in the AVR microcontroller family. 58 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 10-2 on page 59 summarizes the function of the overriding signals. The pin and port indexes from Figure 10-5 on page 58 are not shown in the succeeding tables. The overriding signals are generated internally in the modules having the alternate function. Table 10-2. Generic Description of Overriding Signals for Alternate Functions Signal Name Full Name Description PUOE Pull-up Override Enable If this signal is set, the pull-up enable is controlled by the PUOV signal. If this signal is cleared, the pull-up is enabled when {DDxn, PORTxn, PUD} = 0b010. PUOV Pull-up Override Value If PUOE is set, the pull-up is enabled/disabled when PUOV is set/cleared, regardless of the setting of the DDxn, PORTxn, and PUD Register bits. DDOE Data Direction Override Enable If this signal is set, the Output Driver Enable is controlled by the DDOV signal. If this signal is cleared, the Output driver is enabled by the DDxn Register bit. DDOV Data Direction Override Value If DDOE is set, the Output Driver is enabled/disabled when DDOV is set/cleared, regardless of the setting of the DDxn Register bit. PVOE Port Value Override Enable If this signal is set and the Output Driver is enabled, the port value is controlled by the PVOV signal. If PVOE is cleared, and the Output Driver is enabled, the port Value is controlled by the PORTxn Register bit. PVOV Port Value Override Value If PVOE is set, the port value is set to PVOV, regardless of the setting of the PORTxn Register bit. PTOE Port Toggle Override Enable If PTOE is set, the PORTxn Register bit is inverted. DIEOE Digital Input Enable Override Enable If this bit is set, the Digital Input Enable is controlled by the DIEOV signal. If this signal is cleared, the Digital Input Enable is determined by MCU state (Normal mode, sleep mode). DIEOV Digital Input Enable Override Value If DIEOE is set, the Digital Input is enabled/disabled when DIEOV is set/cleared, regardless of the MCU state (Normal mode, sleep mode). DI Digital Input This is the Digital Input to alternate functions. In the figure, the signal is connected to the output of the schmitt-trigger but before the synchronizer. Unless the Digital Input is used as a clock source, the module with the alternate function will use its own synchronizer. AIO Analog Input/Output This is the Analog Input/Output to/from alternate functions. The signal is connected directly to the pad, and can be used bidirectionally. The following subsections shortly describe the alternate functions for each port, and relate the overriding signals to the alternate function. Refer to the alternate function description for further details. 59 8006G–AVR–01/08 10.3.1 Alternate Functions of Port A The Port A pins with alternate function are shown in Table 10-7 on page 64. Table 10-3. Port A Pins Alternate Functions Port Pin Alternate Function PA0 ADC0: ADC Input Channel 0 AREF: External Analog Reference PCINT0: Pin Change Interrupt 0, Source 0 PA1 ADC1: ADC Input Channel 1 AIN0: Analog Comparator, Positive Input PCINT1:Pin Change Interrupt 0, Source 1 PA2 ADC2: ADC Input Channel 2 AIN1: Analog Comparator, Negative Input PCINT2: Pin Change Interrupt 0, Source 2 PA3 ADC3: ADC Input Channel 3 T0: Timer/Counter0 Clock Source. PCINT3: Pin Change Interrupt 0, Source 3 ADC4: PA4 ADC Input Channel 4 USCK: USI Clock (Three Wire Mode) SCL : USI Clock (Two Wire Mode) T1: Timer/Counter1 Clock Source PCINT4: Pin Change Interrupt 0, Source 4 PA5 ADC5: ADC Input Channel 5 DO: USI Data Output (Three Wire Mode) MISO: SPI Master Data Input / Slave Data Output OC1B: Timer/Counter1 Compare Match B Output PCINT5: Pin Change Interrupt 0, Source 5 PA6 ADC6: ADC Input Channel 6 DI: USI Data Input (Three Wire Mode) SDA: USI Data Input (Two Wire Mode) MOSI:: SPI Master Data Output / Slave Data Input OC1A: Timer/Counter1 Compare Match A Output PCINT6: Pin Change Interrupt 0, Source 6 PA7 ADC7: ADC Input Channel 7 OC0B: Timer/Counter0 Compare Match B Output ICP1: Timer/Counter1 Input Capture Pin PCINT7: Pin Change Interrupt 0, Source 7 • Port A, Bit 0 – ADC0/AREF/PCINT0 • ADC0: Analog to Digital Converter, Channel 0. • AREF: External Analog Reference for ADC. Pullup and output driver are disabled on PA0 when the pin is used as an external reference or Internal Voltage Reference with external capacitor at the AREF pin by setting (one) the bit REFS0 in the ADC Multiplexer Selection Register (ADMUX). • PCINT0: Pin Change Interrupt source 0. The PA0 pin can serve as an external interrupt source for pin change interrupt 0. 60 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Port A, Bit 1 – ADC1/AIN0/PCINT1 • ADC1: Analog to Digital Converter, Channel 1. • AIN0: Analog Comparator Positive Input. Configure the port pin as input with the internal pullup switched off to avoid the digital port function from interfering with the function of the Analog Comparator. • PCINT1: Pin Change Interrupt source 1. The PA1 pin can serve as an external interrupt source for pin change interrupt 0. • Port A, Bit 2 – ADC2/AIN1/PCINT2 • ADC2: Analog to Digital Converter, Channel 2. • AIN1: Analog Comparator Negative Input. Configure the port pin as input with the internal pull-up switched off to avoid the digital port function from interfering with the function of the Analog Comparator. • PCINT2: Pin Change Interrupt source 2. The PA2 pin can serve as an external interrupt source for pin change interrupt 0. • Port A, Bit 3 – ADC3/T0/PCINT3 • ADC3: Analog to Digital Converter, Channel 3. • T0: Timer/Counter0 counter source. • PCINT3: Pin Change Interrupt source 3. The PA3 pin can serve as an external interrupt source for pin change interrupt 0. • Port A, Bit 4 – ADC4/USCK/SCL/T1/PCINT4 • ADC4: Analog to Digital Converter, Channel 4. • USCK: Three-wire mode Universal Serial Interface Clock. • SCL: Two-wire mode Serial Clock for USI Two-wire mode. • T1: Timer/Counter1 counter source. • PCINT4: Pin Change Interrupt source 4. The PA4 pin can serve as an external interrupt source for pin change interrupt 0. • Port A, Bit 5 – ADC5/DO/MISO/OC1B/PCINT5 • ADC5: Analog to Digital Converter, Channel 5. • DO: Data Output in USI Three-wire mode. Data output (DO) overrides PORTA5 value and it is driven to the port when the data direction bit DDA5 is set (one). However the PORTA5 bit still controls the pullup, enabling pullup if direction is input and PORTA5 is set(one). • MISO: Master Data input, Slave Data output pin for SPI channel. When the SPI is enabled as a Master, this pin is configured as an input regardless of the setting of DDA5. When the SPI is enabled as a Slave, the data direction of this pin is controlled by DDA5. When the pin is forced by the SPI to be an input, the pull-up can still be controlled by the PORTA5 bit. • OC1B: Output Compare Match output: The PA5 pin can serve as an external output for the Timer/Counter1 Compare Match B. The PA5 pin has to be configured as an output (DDA5 set (one)) to serve this function. The OC1B pin is also the output pin for the PWM mode timer function. • PCINT5: Pin Change Interrupt source 5. The PA5 pin can serve as an external interrupt source for pin change interrupt 0. 61 8006G–AVR–01/08 • Port A, Bit 6 – ADC6/DI/SDA/MOSI/OC1A/PCINT6 • ADC6: Analog to Digital Converter, Channel 6. • SDA: Two-wire mode Serial Interface Data. • DI: Data Input in USI Three-wire mode. USI Three-wire mode does not override normal port functions, so pin must be configure as an input for DI function. • MOSI: Master Data output, Slave Data input for SPI channel. When the SPI is enabled as a Slave, this pin is configured as an input regardless of the setting of DDA6. When the SPI is enabled as a Master, the data direction of this pin is controlled by DDA6. When the pin is forced by the SPI to be an input, the pull-up can still be controlled by the PORTA6 bit. • OC1A, Output Compare Match output: The PA6 pin can serve as an external output for the Timer/Counter1 Compare Match A. The pin has to be configured as an output (DDA6 set (one)) to serve this function. This is also the output pin for the PWM mode timer function. • PCINT6: Pin Change Interrupt source 6. The PA6 pin can serve as an external interrupt source for pin change interrupt 0. • Port A, Bit 7 – ADC7/OC0B/ICP1/PCINT7 • ADC7: Analog to Digital Converter, Channel 7. • OC1B, Output Compare Match output: The PA7 pin can serve as an external output for the Timer/Counter1 Compare Match B. The pin has to be configured as an output (DDA7 set (one)) to serve this function. This is also the output pin for the PWM mode timer function. • ICP1, Input Capture Pin: The PA7 pin can act as an Input Capture Pin for Timer/Counter1. • PCINT7: Pin Change Interrupt source 7. The PA7 pin can serve as an external interrupt source for pin change interrupt 0. Table 10-4 on page 62 and Table 10-6 on page 63 relate the alternate functions of Port A to the overriding signals shown in Figure 10-5 on page 58. Table 10-4. 62 Overriding Signals for Alternate Functions in PA7..PA5 Signal Name PA7/ADC7/OC0B/ICP1/ PCINT7 PA6/ADC6/DI/SDA/MOSI/ OC1A/ PCINT6 PA5/ADC5/MISO/DO/ OC1B/ PCINT5 PUOE 0 0 0 PUOV 0 0 0 DDOE 0 USIWM1 0 DDOV 0 (SDA + PORTA6) • DDA6 0 PVOE OC0B enable (USIWM1 • DDA6) + OC1A enable (USIWM1 • USIWM0) + OC1B enable PVOV OC0B ( USIWM1• DDA6) • OC1A USIWM1 • USIWM0 • DO + (USIWM1 + USIWM0) • OC1B PTOE 0 0 0 DIEOE PCINT7 • PCIE0 + ADC7D USISIE + (PCINT6 • PCIE0) + ADC6D PCINT5 • PCIE + ADC5D DIEOV PCINT7 • PCIE0 USISIE + PCINT7 • PCIE0 PCINT5 • PCIE DI PCINT7/ICP1 Input DI/SDA/PCINT6 Input PCINT5 Input AIO ADC7 Input ADC6 Input ADC5 Input ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 10-5. Overriding Signals for Alternate Functions in PA4..PA2 Signal Name PA4/ADC4/USCK/SCL/T1/ PCINT4 PA3/ADC3/T0/PCINT3 PA2/ADC2/AIN1/PCINT2 PUOE 0 0 0 PUOV 0 0 0 DDOE USIWM1 0 0 DDOV USI_SCL_HOLD + PORTA4) • DDA4 0 0 PVOE USIWM1 • DDA4 0 0 PVOV 0 0 0 PTOE USI_PTOE 0 0 DIEOE USISIE + (PCINT4 • PCIE0) + ADC4D (PCINT3 • PCIE0) + ADC3D PCINT2 • PCIE + ADC2D DIEOV USISIE + (PCINT4 • PCIE0) PCINT3 • PCIE0 PCINT3 • PCIE0 DI USCK/SCL/T1/PCINT4 input PCINT1 Input PCINT0 Input AIO ADC4 Input ADC3 Input ADC2/Analog Comparator Negative Input Table 10-6. Overriding Signals for Alternate Functions in PA1..PA0 Signal Name PA1/ADC1/AIN0/PCINT1 PA0/ADC0/AREF/PCINT0 PUOE 0 RESET • (REFS1 • REFS0 + REFS1 • REFS0) PUOV 0 0 DDOE 0 RESET • (REFS1 • REFS0 + REFS1 • REFS0) DDOV 0 0 PVOE 0 RESET • (REFS1 • REFS0 + REFS1 • REFS0) PVOV 0 0 PTOE 0 0 DIEOE PCINT1 • PCIE0 + ADC1D PCINT0 • PCIE0 + ADC0D DIEOV PCINT1 • PCIE0 PCINT0 • PCIE0 DI PCINT1 Input PCINT0 Input AIO ADC1/Analog Comparator Positive Input ADC1 Input Analog reference 63 8006G–AVR–01/08 10.3.2 Alternate Functions of Port B The Port B pins with alternate function are shown in Table 10-7 on page 64. Table 10-7. Port B Pins Alternate Functions Port Pin Alternate Function PB0 XTAL1: Crystal Oscillator Input PCINT8: Pin Change Interrupt 1, Source 8 CLKI: External Clock Input PB1 XTAL2: Crystal Oscillator Output PCINT9: Pin Change Interrupt 1, Source 9 PB2 INT0: External Interrupt 0 Input OC0A: Timer/Counter0 Compare Match A output CKOUT: System Clock Output PCINT10:Pin Change Interrupt 1, Source 10 PB3 RESET: Reset pin dW: debugWire I/O PCINT11:Pin Change Interrupt 1, Source 11. • Port B, Bit 0 – XTAL1/PCINT8 • XTAL1: Chip Clock Oscillator pin 1. Used for all chip clock sources except internal calibrateble RC oscillator. When used as a clock pin, the pin can not be used as an I/O pin. When using internal calibratable RC Oscillator as a chip clock source, PB0 serves as an ordinary I/O pin. • PCINT8: Pin Change Interrupt source 8. The PB0 pin can serve as an external interrupt source for pin change interrupt 1. • CLKI: Clock Input from an external clock source, see “External Clock” on page 24. • Port B, Bit 1 – XTAL2/PCINT9 • XTAL2: Chip Clock Oscillator pin 2. Used as clock pin for all chip clock sources except internal calibrateble RC Oscillator and external clock. When used as a clock pin, the pin can not be used as an I/O pin. When using internal calibratable RC Oscillator or External clock as a Chip clock sources, PB1 serves as an ordinary I/O pin. • PCINT9: Pin Change Interrupt source 9. The PB1 pin can serve as an external interrupt source for pin change interrupt 1. • Port B, Bit 2 – INT0/OC0A/CKOUT/PCINT10 • INT0: External Interrupt Request 0. • OC0A: Output Compare Match output: The PB2 pin can serve as an external output for the Timer/Counter0 Compare Match A. The PB2 pin has to be configured as an output (DDB2 set (one)) to serve this function. The OC0A pin is also the output pin for the PWM mode timer function. • CKOUT - System Clock Output: The system clock can be output on the PB2 pin. The system clock will be output if the CKOUT Fuse is programmed, regardless of the PORTB2 and DDB2 settings. It will also be output during reset. • PCINT10: Pin Change Interrupt source 10. The PB2 pin can serve as an external interrupt source for pin change interrupt 1. 64 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Port B, Bit 3 – RESET/dW/PCINT11 • RESET: External Reset input is active low and enabled by unprogramming (“1”) the RSTDISBL Fuse. Pullup is activated and output driver and digital input are deactivated when the pin is used as the RESET pin. • dW: When the debugWIRE Enable (DWEN) Fuse is programmed and Lock bits are unprogrammed, the debugWIRE system within the target device is activated. The RESET port pin is configured as a wire-AND (open-drain) bi-directional I/O pin with pull-up enabled and becomes the communication gateway between target and emulator. • PCINT11: Pin Change Interrupt source 11. The PB3 pin can serve as an external interrupt source for pin change interrupt 1. Table 10-8 on page 65 and Table 10-9 on page 66 relate the alternate functions of Port B to the overriding signals shown in Figure 10-5 on page 58. Table 10-8. Signal Name Overriding Signals for Alternate Functions in PB3..PB2 PB3/RESET/dW/ PCINT11 PUOE RSTDISBL PUOV 1 (1) PB2/INT0/OC0A/CKOUT/PCINT10 (2) + DEBUGWIRE_ENABLE CKOUT 0 (1) (2) DDOE RSTDISBL DDOV DEBUGWIRE_ENABLE(2) • debugWire Transmit 1 PVOE RSTDISBL(1) + DEBUGWIRE_ENABLE(2) CKOUT + OC0A enable PVOV 0 CKOUT • System Clock + CKOUT • OC0A PTOE 0 + DEBUGWIRE_ENABLE CKOUT 0 (1) (2) DIEOE RSTDISBL + DEBUGWIRE_ENABLE PCINT11 • PCIE1 DIEOV DEBUGWIRE_ENABLE(2) + (RSTDISBL(1) • PCINT11 • PCIE1) PCINT10 • PCIE1 + INT0 DI dW/PCINT11 Input INT0/PCINT10 Input + PCINT10 • PCIE1 + INT0 AIO 1. RSTDISBL is 1 when the Fuse is “0” (Programmed). 2. DebugWIRE is enabled wheb DWEN Fuse is programmed and Lock bits are unprogrammed. 65 8006G–AVR–01/08 Table 10-9. Signal Name Overriding Signals for Alternate Functions in PB1..PB0 PB1/XTAL2/PCINT9 PB0/XTAL1/PCINT8 (1) EXT_CLOCK (2) + EXT_OSC(1) PUOE EXT_OSC PUOV 0 0 DDOE EXT_OSC(1) EXT_CLOCK(2) + EXT_OSC(1) DDOV 0 0 PVOE EXT_OSC PVOV 0 PTOE 0 (1) EXT_CLOCK(2) + EXT_OSC(1) 0 0 (1) 10.4 10.4.1 DIEOE EXT_OSC + PCINT9 • PCIE1 EXT_CLOCK(2) + EXT_OSC(1) + (PCINT8 • PCIE1) DIEOV EXT_OSC(1) • PCINT9 • PCIE1 ( EXT_CLOCK(2) • PWR_DOWN ) + (EXT_CLOCK(2) • EXT_OSC(1) • PCINT8 • PCIE1) DI PCINT9 Input CLOCK/PCINT8 Input AIO XTAL2 XTAL1 1. EXT_OSC = crystal oscillator or low frequency crystal oscillator is selected as system clock. 2. EXT_CLOCK = external clock is selected as system clock. Register Description MCUCR – MCU Control Register Bit 7 6 5 4 3 2 1 0 BODS PUD SE SM1 SM0 BODSE ISC01 ISC00 Read/Write R/W R/W R/W R/W R/W R/W R R Initial Value 0 0 0 0 0 0 0 0 MCUCR • Bit 6 – PUD: Pull-up Disable When this bit is written to one, the pull-ups in the I/O ports are disabled even if the DDxn and PORTxn Registers are configured to enable the pull-ups ({DDxn, PORTxn} = 0b01). See “Configuring the Pin” on page 54 for more details about this feature. 10.4.2 PORTA – Port A Data Register Bit 10.4.3 7 6 5 4 3 2 1 0 0x1B (0x3B) PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 DDRA – Port A Data Direction Register Bit 66 PORTA 7 6 5 4 3 2 1 0 0x1A (0x3A) DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 DDRB ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 10.4.4 PINA – Port A Input Pins Bit 10.4.5 10.4.6 10.4.7 7 6 5 4 3 2 1 0 0x19 (0x39) PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value N/A N/A N/A N/A N/A N/A N/A N/A PINB PORTB – Port B Data Register Bit 7 6 5 4 3 2 1 0 0x18 (0x38) – – – – PORTB3 PORTB2 PORTB1 PORTB0 Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 PORTB DDRB – Port B Data Direction Register Bit 7 6 5 4 3 2 1 0 0x17 (0x37) – – – – DDB3 DDB2 DDB1 DDB0 Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 0 0x16 (0x36) – – – – PINB3 PINB2 PINB1 PINB0 Read/Write R R R R R/W R/W R/W R/W Initial Value 0 0 0 0 N/A N/A N/A N/A DDRB PINB – Port B Input Pins PINB 67 8006G–AVR–01/08 11. 8-bit Timer/Counter0 with PWM 11.1 Features • • • • • • • 11.2 Two Independent Output Compare Units Double Buffered Output Compare Registers Clear Timer on Compare Match (Auto Reload) Glitch Free, Phase Correct Pulse Width Modulator (PWM) Variable PWM Period Frequency Generator Three Independent Interrupt Sources (TOV0, OCF0A, and OCF0B) Overview Timer/Counter0 is a general purpose 8-bit Timer/Counter module, with two independent Output Compare Units, and with PWM support. It allows accurate program execution timing (event management) and wave generation. A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 11-1 on page 68. For the actual placement of I/O pins, refer to Figure 1-1 on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “Register Description” on page 79. Figure 11-1. 8-bit Timer/Counter Block Diagram Count Clear Direction TOVn (Int.Req.) Control Logic clkTn Clock Select Edge Detector TOP Tn BOTTOM ( From Prescaler ) Timer/Counter TCNTn = =0 OCnA (Int.Req.) Waveform Generation = OCnA DATA BUS OCRnA Fixed TOP Value Waveform Generation = OCnB OCRnB TCCRnA 68 OCnB (Int.Req.) TCCRnB ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 11.2.1 Registers The Timer/Counter (TCNT0) and Output Compare Registers (OCR0A and OCR0B) are 8-bit registers. Interrupt request (abbreviated to Int.Req. in the figure) signals are all visible in the Timer Interrupt Flag Register (TIFR0). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK0). TIFR0 and TIMSK0 are not shown in the figure. The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on the T0 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the Clock Select logic is referred to as the timer clock (clkT0). The double buffered Output Compare Registers (OCR0A and OCR0B) is compared with the Timer/Counter value at all times. The result of the compare can be used by the Waveform Generator to generate a PWM or variable frequency output on the Output Compare pins (OC0A and OC0B). See “Output Compare Unit” on page 70 for details. The Compare Match event will also set the Compare Flag (OCF0A or OCF0B) which can be used to generate an Output Compare interrupt request. 11.2.2 Definitions Many register and bit references in this section are written in general form. A lower case “n” replaces the Timer/Counter number, in this case 0. A lower case “x” replaces the Output Compare Unit, in this case Compare Unit A or Compare Unit B. However, when using the register or bit defines in a program, the precise form must be used, i.e., TCNT0 for accessing Timer/Counter0 counter value and so on. The definitions in Table 11-1 are also used extensively throughout the document. Table 11-1. 11.3 Definitions Constant Description BOTTOM The counter reaches BOTTOM when it becomes 0x00 MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255) TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR0A Register. The assignment depends on the mode of operation Timer/Counter Clock Sources The Timer/Counter can be clocked by an internal or an external clock source. The clock source is selected by the Clock Select logic which is controlled by the Clock Select (CS02:0) bits located in the Timer/Counter Control Register (TCCR0B). For details on clock sources and prescaler, see “Timer/Counter Prescaler” on page 114. 11.4 Counter Unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure 11-2 on page 70 shows a block diagram of the counter and its surroundings. 69 8006G–AVR–01/08 Figure 11-2. Counter Unit Block Diagram TOVn (Int.Req.) DATA BUS Clock Select count clear TCNTn Control Logic clkTn Edge Detector Tn direction ( From Prescaler ) bottom top Signal description (internal signals): count direction clear clkTn top bottom Increment or decrement TCNT0 by 1. Select between increment and decrement. Clear TCNT0 (set all bits to zero). Timer/Counter clock, referred to as clkT0 in the following. Signalize that TCNT0 has reached maximum value. Signalize that TCNT0 has reached minimum value (zero). Depending of the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT0). clkT0 can be generated from an external or internal clock source, selected by the Clock Select bits (CS02:0). When no clock source is selected (CS02:0 = 0) the timer is stopped. However, the TCNT0 value can be accessed by the CPU, regardless of whether clkT0 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the WGM01 and WGM00 bits located in the Timer/Counter Control Register (TCCR0A) and the WGM02 bit located in the Timer/Counter Control Register B (TCCR0B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare output OC0A. For more details about advanced counting sequences and waveform generation, see “Modes of Operation” on page 73. The Timer/Counter Overflow Flag (TOV0) is set according to the mode of operation selected by the WGM01:0 bits. TOV0 can be used for generating a CPU interrupt. 11.5 Output Compare Unit The 8-bit comparator continuously compares TCNT0 with the Output Compare Registers (OCR0A and OCR0B). Whenever TCNT0 equals OCR0A or OCR0B, the comparator signals a match. A match will set the Output Compare Flag (OCF0A or OCF0B) at the next timer clock cycle. If the corresponding interrupt is enabled, the Output Compare Flag generates an Output Compare interrupt. The Output Compare Flag is automatically cleared when the interrupt is executed. Alternatively, the flag can be cleared by software by writing a logical one to its I/O bit location. The Waveform Generator uses the match signal to generate an output according to operating mode set by the WGM02:0 bits and Compare Output mode (COM0x1:0) bits. The max and bottom signals are used by the Waveform Generator for handling the special cases of the extreme values in some modes of operation. See “Modes of Operation” on page 73. 70 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 11-3 on page 71 shows a block diagram of the Output Compare unit. Figure 11-3. Output Compare Unit, Block Diagram DATA BUS OCRnx TCNTn = (8-bit Comparator ) OCFnx (Int.Req.) top bottom Waveform Generator OCnx FOCn WGMn1:0 COMnX1:0 The OCR0x Registers are double buffered when using any of the Pulse Width Modulation (PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buffering is disabled. The double buffering synchronizes the update of the OCR0x Compare Registers to either top or bottom of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR0x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR0x Buffer Register, and if double buffering is disabled the CPU will access the OCR0x directly. 11.5.1 Force Output Compare In non-PWM waveform generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (0x) bit. Forcing Compare Match will not set the OCF0x Flag or reload/clear the timer, but the OC0x pin will be updated as if a real Compare Match had occurred (the COM0x1:0 bits settings define whether the OC0x pin is set, cleared or toggled). 11.5.2 Compare Match Blocking by TCNT0 Write All CPU write operations to the TCNT0 Register will block any Compare Match that occur in the next timer clock cycle, even when the timer is stopped. This feature allows OCR0x to be initialized to the same value as TCNT0 without triggering an interrupt when the Timer/Counter clock is enabled. 11.5.3 Using the Output Compare Unit Since writing TCNT0 in any mode of operation will block all Compare Matches for one timer clock cycle, there are risks involved when changing TCNT0 when using the Output Compare Unit, independently of whether the Timer/Counter is running or not. If the value written to TCNT0 71 8006G–AVR–01/08 equals the OCR0x value, the Compare Match will be missed, resulting in incorrect waveform generation. Similarly, do not write the TCNT0 value equal to BOTTOM when the counter is down-counting. The setup of the OC0x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC0x value is to use the Force Output Compare (0x) strobe bits in Normal mode. The OC0x Registers keep their values even when changing between Waveform Generation modes. Be aware that the COM0x1:0 bits are not double buffered together with the compare value. Changing the COM0x1:0 bits will take effect immediately. 11.6 Compare Match Output Unit The Compare Output mode (COM0x1:0) bits have two functions. The Waveform Generator uses the COM0x1:0 bits for defining the Output Compare (OC0x) state at the next Compare Match. Also, the COM0x1:0 bits control the OC0x pin output source. Figure 11-4 on page 72 shows a simplified schematic of the logic affected by the COM0x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers (DDR and PORT) that are affected by the COM0x1:0 bits are shown. When referring to the OC0x state, the reference is for the internal OC0x Register, not the OC0x pin. If a system reset occur, the OC0x Register is reset to “0”. Figure 11-4. Compare Match Output Unit, Schematic COMnx1 COMnx0 FOCn Waveform Generator D Q 1 OCnx DATA BUS D 0 OCn Pin Q PORT D Q DDR clk I/O The general I/O port function is overridden by the Output Compare (OC0x) from the Waveform Generator if either of the COM0x1:0 bits are set. However, the OC0x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC0x pin (DDR_OC0x) must be set as output before the OC0x value is visible on the pin. The port override function is independent of the Waveform Generation mode. 72 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 The design of the Output Compare pin logic allows initialization of the OC0x state before the output is enabled. Note that some COM0x1:0 bit settings are reserved for certain modes of operation, see “Register Description” on page 79 11.6.1 Compare Output Mode and Waveform Generation The Waveform Generator uses the COM0x1:0 bits differently in Normal, CTC, and PWM modes. For all modes, setting the COM0x1:0 = 0 tells the Waveform Generator that no action on the OC0x Register is to be performed on the next Compare Match. For compare output actions in the non-PWM modes refer to Table 11-2 on page 79. For fast PWM mode, refer to Table 11-3 on page 80, and for phase correct PWM refer to Table 11-4 on page 80. A change of the COM0x1:0 bits state will have effect at the first Compare Match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the 0x strobe bits. 11.7 Modes of Operation The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is defined by the combination of the Waveform Generation mode (WGM02:0) and Compare Output mode (COM0x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM0x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM0x1:0 bits control whether the output should be set, cleared, or toggled at a Compare Match (See “Modes of Operation” on page 73). For detailed timing information refer to Figure 11-8 on page 78, Figure 11-9 on page 78, Figure 11-10 on page 78 and Figure 11-11 on page 79 in “Timer/Counter Timing Diagrams” on page 77. 11.7.1 Normal Mode The simplest mode of operation is the Normal mode (WGM02:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV0) will be set in the same timer clock cycle as the TCNT0 becomes zero. The TOV0 Flag in this case behaves like a ninth bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV0 Flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Output Compare Unit can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 11.7.2 Clear Timer on Compare Match (CTC) Mode In Clear Timer on Compare or CTC mode (WGM02:0 = 2), the OCR0A Register is used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT0) matches the OCR0A. The OCR0A defines the top value for the counter, hence also its resolution. This mode allows greater control of the Compare Match output frequency. It also simplifies the operation of counting external events. 73 8006G–AVR–01/08 The timing diagram for the CTC mode is shown in Figure 11-5 on page 74. The counter value (TCNT0) increases until a Compare Match occurs between TCNT0 and OCR0A, and then counter (TCNT0) is cleared. Figure 11-5. CTC Mode, Timing Diagram OCnx Interrupt Flag Set TCNTn OCn (Toggle) Period (COMnx1:0 = 1) 1 2 3 4 An interrupt can be generated each time the counter value reaches the TOP value by using the OCF0A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR0A is lower than the current value of TCNT0, the counter will miss the Compare Match. The counter will then have to count to its maximum value (0xFF) and wrap around starting at 0x00 before the Compare Match can occur. For generating a waveform output in CTC mode, the OC0A output can be set to toggle its logical level on each Compare Match by setting the Compare Output mode bits to toggle mode (COM0A1:0 = 1). The OC0A value will not be visible on the port pin unless the data direction for the pin is set to output. The waveform generated will have a maximum frequency of 0 = fclk_I/O/2 when OCR0A is set to zero (0x00). The waveform frequency is defined by the following equation: f clk_I/O f OCnx = ------------------------------------------------2 ⋅ N ⋅ ( 1 + OCRnx ) The N variable represents the prescale factor (1, 8, 64, 256, or 1024). As for the Normal mode of operation, the TOV0 Flag is set in the same timer clock cycle that the counter counts from MAX to 0x00. 11.7.3 74 Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM02:0 = 3 or 7) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM option by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. TOP is defined as 0xFF when WGM2:0 = 3, and OCR0A when WGM2:0 = 7. In noninverting Compare Output mode, the Output Compare (OC0x) is cleared on the Compare Match between TCNT0 and OCR0x, and set at BOTTOM. In inverting Compare Output mode, the output is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct PWM mode that use dual-slope operation. This high frequency makes the fast PWM mode well suited ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), and therefore reduces total system cost. In fast PWM mode, the counter is incremented until the counter value matches the TOP value. The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 11-6 on page 75. The TCNT0 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes noninverted and inverted PWM outputs. The small horizontal line marks on the TCNT0 slopes represent Compare Matches between OCR0x and TCNT0. Figure 11-6. Fast PWM Mode, Timing Diagram OCRnx Interrupt Flag Set OCRnx Update and TOVn Interrupt Flag Set TCNTn OCn (COMnx1:0 = 2) OCn (COMnx1:0 = 3) Period 1 2 3 4 5 6 7 The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches TOP. If the interrupt is enabled, the interrupt handler routine can be used for updating the compare value. In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC0x pins. Setting the COM0x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM0x1:0 to three: Setting the COM0A1:0 bits to one allowes the AC0A pin to toggle on Compare Matches if the WGM02 bit is set. This option is not available for the OC0B pin (See Table 11-3 on page 80). The actual OC0x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by setting (or clearing) the OC0x Register at the Compare Match between OCR0x and TCNT0, and clearing (or setting) the OC0x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: f clk_I/O f OCnxPWM = ----------------N ⋅ 256 The N variable represents the prescale factor (1, 8, 64, 256, or 1024). The extreme values for the OCR0A Register represents special cases when generating a PWM waveform output in the fast PWM mode. If the OCR0A is set equal to BOTTOM, the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR0A equal to MAX will result 75 8006G–AVR–01/08 in a constantly high or low output (depending on the polarity of the output set by the COM0A1:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC0x to toggle its logical level on each Compare Match (COM0x1:0 = 1). The waveform generated will have a maximum frequency of 0 = fclk_I/O/2 when OCR0A is set to zero. This feature is similar to the OC0A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 11.7.4 Phase Correct PWM Mode The phase correct PWM mode (WGM02:0 = 1 or 5) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is based on a dual-slope operation. The counter counts repeatedly from BOTTOM to TOP and then from TOP to BOTTOM. TOP is defined as 0xFF when WGM2:0 = 1, and OCR0A when WGM2:0 = 5. In noninverting Compare Output mode, the Output Compare (OC0x) is cleared on the Compare Match between TCNT0 and OCR0x while upcounting, and set on the Compare Match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. In phase correct PWM mode the counter is incremented until the counter value matches TOP. When the counter reaches TOP, it changes the count direction. The TCNT0 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 11-7 on page 76. The TCNT0 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT0 slopes represent Compare Matches between OCR0x and TCNT0. Figure 11-7. Phase Correct PWM Mode, Timing Diagram OCnx Interrupt Flag Set OCRnx Update TOVn Interrupt Flag Set TCNTn OCn (COMnx1:0 = 2) OCn (COMnx1:0 = 3) Period 76 1 2 3 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches BOTTOM. The Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM value. In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the OC0x pins. Setting the COM0x1:0 bits to two will produce a non-inverted PWM. An inverted PWM output can be generated by setting the COM0x1:0 to three: Setting the COM0A0 bits to one allows the OC0A pin to toggle on Compare Matches if the WGM02 bit is set. This option is not available for the OC0B pin (See Table 11-4 on page 80). The actual OC0x value will only be visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is generated by clearing (or setting) the OC0x Register at the Compare Match between OCR0x and TCNT0 when the counter increments, and setting (or clearing) the OC0x Register at Compare Match between OCR0x and TCNT0 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: f clk_I/O f OCnxPCPWM = ----------------N ⋅ 510 The N variable represents the prescale factor (1, 8, 64, 256, or 1024). The extreme values for the OCR0A Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR0A is set equal to BOTTOM, the output will be continuously low and if set equal to MAX the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. At the very start of period 2 in Figure 11-7 on page 76 OCn has a transition from high to low even though there is no Compare Match. The point of this transition is to guaratee symmetry around BOTTOM. There are two cases that give a transition without Compare Match. • OCR0A changes its value from MAX, like in Figure 11-7 on page 76. When the OCR0A value is MAX the OCn pin value is the same as the result of a down-counting Compare Match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match. • The timer starts counting from a value higher than the one in OCR0A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up. 11.8 Timer/Counter Timing Diagrams The Timer/Counter is a synchronous design and the timer clock (clkT0) is therefore shown as a clock enable signal in the following figures. The figures include information on when Interrupt Flags are set. Figure 11-8 on page 78 contains timing data for basic Timer/Counter operation. The figure shows the count sequence close to the MAX value in all modes other than phase correct PWM mode. 77 8006G–AVR–01/08 Figure 11-8. Timer/Counter Timing Diagram, no Prescaling clkI/O clkTn (clkI/O /1) TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 TOVn Figure 11-9 on page 78 shows the same timing data, but with the prescaler enabled. Figure 11-9. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8) clkI/O clkTn (clkI/O /8) TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1 TOVn Figure 11-10 on page 78 shows the setting of OCF0B in all modes and OCF0A in all modes except CTC mode and PWM mode, where OCR0A is TOP. Figure 11-10. Timer/Counter Timing Diagram, Setting of OCF0x, with Prescaler (fclk_I/O/8) clkI/O clkTn (clkI/O /8) TCNTn OCRnx OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 OCRnx Value OCFnx Figure 11-11 on page 79 shows the setting of OCF0A and the clearing of TCNT0 in CTC mode and fast PWM mode where OCR0A is TOP. 78 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 11-11. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with Prescaler (fclk_I/O/8) clkI/O clkTn (clkI/O /8) TCNTn (CTC) TOP - 1 TOP BOTTOM BOTTOM + 1 TOP OCRnx OCFnx 11.9 11.9.1 Register Description TCCR0A – Timer/Counter Control Register A Bit 7 6 5 4 3 2 1 0 0x30 (0x50) COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 Read/Write R/W R/W R/W R/W R R R/W R/W Initial Value 0 0 0 0 0 0 0 0 TCCR0A • Bits 7:6 – COM0A1:0: Compare Match Output A Mode These bits control the Output Compare pin (OC0A) behavior. If one or both of the COM0A1:0 bits are set, the OC0A output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC0A pin must be set in order to enable the output driver. When OC0A is connected to the pin, the function of the COM0A1:0 bits depends on the WGM02:0 bit setting. Table 11-2 shows the COM0A1:0 bit functionality when the WGM02:0 bits are set to a normal or CTC mode (non-PWM). Table 11-2. Compare Output Mode, non-PWM Mode COM0A1 COM0A0 Description 0 0 Normal port operation, OC0A disconnected. 0 1 Toggle OC0A on Compare Match 1 0 Clear OC0A on Compare Match 1 1 Set OC0A on Compare Match Table 11-3 shows COM0A1:0 bit functionality when WGM01:0 bits are set to fast PWM mode. 79 8006G–AVR–01/08 Table 11-3. Compare Output Mode, Fast PWM Mode(1) COM0A1 COM0A0 0 0 Normal port operation, OC0A disconnected 0 1 WGM02 = 0: Normal Port Operation, OC0A Disconnected WGM02 = 1: Toggle OC0A on Compare Match 1 0 Clear OC0A on Compare Match Set OC0A at BOTTOM (non-inverting mode) 1 1 Set OC0A on Compare Match Clear OC0A at BOTTOM (inverting mode) Note: Description 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 74 for more details. Table 11-4 shows the COM0A1:0 bit functionality when the WGM02:0 bits are set to phase correct PWM mode. Table 11-4. Compare Output Mode, Phase Correct PWM Mode(1) COM0A1 COM0A0 0 0 Normal port operation, OC0A disconnected. 0 1 WGM02 = 0: Normal Port Operation, OC0A Disconnected. WGM02 = 1: Toggle OC0A on Compare Match. 1 0 Clear OC0A on Compare Match when up-counting. Set OC0A on Compare Match when down-counting. 1 1 Set OC0A on Compare Match when up-counting. Clear OC0A on Compare Match when down-counting. Note: Description 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page 76 for more details. • Bits 5:4 – COM0B1:0: Compare Match Output B Mode These bits control the Output Compare pin (OC0B) behavior. If one or both of the COM0B1:0 bits are set, the OC0B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC0B pin must be set in order to enable the output driver. When OC0B is connected to the pin, the function of the COM0B1:0 bits depends on the WGM02:0 bit setting. Table 11-5 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to a normal or CTC mode (non-PWM). Table 11-5. 80 Compare Output Mode, non-PWM Mode COM0B1 COM0B0 Description 0 0 Normal port operation, OC0B disconnected. 0 1 Toggle OC0B on Compare Match 1 0 Clear OC0B on Compare Match 1 1 Set OC0B on Compare Match ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 11-6 shows COM0B1:0 bit functionality when WGM02:0 bits are set to fast PWM mode. Table 11-6. Compare Output Mode, Fast PWM Mode(1) COM0B1 COM0B0 0 0 Normal port operation, OC0B disconnected. 0 1 Reserved 1 0 Clear OC0B on Compare Match, set OC0B at BOTTOM (non-inverting mode) 1 1 Set OC0B on Compare Match, clear OC0B at BOTTOM (inverting mode) Note: Description 1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast PWM Mode” on page 74 for more details. Table 11-7 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to phase correct PWM mode. Table 11-7. Compare Output Mode, Phase Correct PWM Mode(1) COM0B1 COM0B0 0 0 Normal port operation, OC0B disconnected. 0 1 Reserved 1 0 Clear OC0B on Compare Match when up-counting. Set OC0B on Compare Match when down-counting. 1 1 Set OC0B on Compare Match when up-counting. Clear OC0B on Compare Match when down-counting. Note: Description 1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case, the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Correct PWM Mode” on page 76 for more details. • Bits 3, 2 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bits 1:0 – WGM01:0: Waveform Generation Mode Combined with the WGM02 bit found in the TCCR0B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 11-8. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode, and two types of Pulse Width Modulation (PWM) modes (see “Modes of Operation” on page 73). 81 8006G–AVR–01/08 Table 11-8. Timer/Counter Mode of Operation TOP Update of OCRx at TOV Flag Set on(1) 0 Normal 0xFF Immediate MAX 0 1 PWM, Phase Correct 0xFF TOP BOTTOM 0 1 0 CTC OCRA Immediate MAX 3 0 1 1 Fast PWM 0xFF BOTTOM MAX 4 1 0 0 Reserved – – – 5 1 0 1 PWM, Phase Correct OCRA TOP BOTTOM 6 1 1 0 Reserved – – – 7 1 1 1 Fast PWM OCRA BOTTOM TOP Mode WGM02 WGM01 WGM00 0 0 0 1 0 2 Note: 11.9.2 Waveform Generation Mode Bit Description 1. MAX = 0xFF BOTTOM = 0x00 TCCR0B – Timer/Counter Control Register B Bit 7 6 5 4 3 2 1 0 0x33 (0x53) FOC0A FOC0B – – WGM02 CS02 CS01 CS00 Read/Write W W R R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 TCCR0B • Bit 7 – FOC0A: Force Output Compare A The FOC0A bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR0B is written when operating in PWM mode. When writing a logical one to the FOC0A bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC0A output is changed according to its COM0A1:0 bits setting. Note that the FOC0A bit is implemented as a strobe. Therefore it is the value present in the COM0A1:0 bits that determines the effect of the forced compare. A FOC0A strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR0A as TOP. The FOC0A bit is always read as zero. • Bit 6 – FOC0B: Force Output Compare B The FOC0B bit is only active when the WGM bits specify a non-PWM mode. However, for ensuring compatibility with future devices, this bit must be set to zero when TCCR0B is written when operating in PWM mode. When writing a logical one to the FOC0B bit, an immediate Compare Match is forced on the Waveform Generation unit. The OC0B output is changed according to its COM0B1:0 bits setting. Note that the FOC0B bit is implemented as a strobe. Therefore it is the value present in the COM0B1:0 bits that determines the effect of the forced compare. 82 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 A FOC0B strobe will not generate any interrupt, nor will it clear the timer in CTC mode using OCR0B as TOP. The FOC0B bit is always read as zero. • Bits 5:4 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bit 3 – WGM02: Waveform Generation Mode See the description in the “TCCR0A – Timer/Counter Control Register A” on page 79. • Bits 2:0 – CS02:0: Clock Select The three Clock Select bits select the clock source to be used by the Timer/Counter. Table 11-9. Clock Select Bit Description CS02 CS01 CS00 Description 0 0 0 No clock source (Timer/Counter stopped) 0 0 1 clkI/O/(No prescaling) 0 1 0 clkI/O/8 (From prescaler) 0 1 1 clkI/O/64 (From prescaler) 1 0 0 clkI/O/256 (From prescaler) 1 0 1 clkI/O/1024 (From prescaler) 1 1 0 External clock source on T0 pin. Clock on falling edge. 1 1 1 External clock source on T0 pin. Clock on rising edge. If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. 11.9.3 TCNT0 – Timer/Counter Register Bit 7 6 5 0x32 (0x52) 4 3 2 1 0 TCNT0[7:0] TCNT0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The Timer/Counter Register gives direct access, both for read and write operations, to the Timer/Counter unit 8-bit counter. Writing to the TCNT0 Register blocks (removes) the Compare Match on the following timer clock. Modifying the counter (TCNT0) while the counter is running, introduces a risk of missing a Compare Match between TCNT0 and the OCR0x Registers. 11.9.4 OCR0A – Output Compare Register A Bit 7 6 5 0x36 (0x56) 4 3 2 1 0 OCR0A[7:0] OCR0A Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The Output Compare Register A contains an 8-bit value that is continuously compared with the counter value (TCNT0). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC0A pin. 83 8006G–AVR–01/08 11.9.5 OCR0B – Output Compare Register B Bit 7 6 5 0x3C (0x5C) 4 3 2 1 0 OCR0B[7:0] OCR0B Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The Output Compare Register B contains an 8-bit value that is continuously compared with the counter value (TCNT0). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC0B pin. 11.9.6 TIMSK0 – Timer/Counter 0 Interrupt Mask Register Bit 7 6 5 4 3 2 1 0 0x39 (0x59) – – – – – OCIE0B OCIE0A TOIE0 Read/Write R R R R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 TIMSK0 • Bits 7..3 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bit 2– OCIE0B: Timer/Counter Output Compare Match B Interrupt Enable When the OCIE0B bit is written to one, and the I-bit in the Status Register is set, the Timer/Counter Compare Match B interrupt is enabled. The corresponding interrupt is executed if a Compare Match in Timer/Counter occurs, i.e., when the OCF0B bit is set in the Timer/Counter Interrupt Flag Register – TIFR0. • Bit 1– OCIE0A: Timer/Counter0 Output Compare Match A Interrupt Enable When the OCIE0A bit is written to one, and the I-bit in the Status Register is set, the Timer/Counter0 Compare Match A interrupt is enabled. The corresponding interrupt is executed if a Compare Match in Timer/Counter0 occurs, i.e., when the OCF0A bit is set in the Timer/Counter 0 Interrupt Flag Register – TIFR0. • Bit 0– TOIE0: Timer/Counter0 Overflow Interrupt Enable When the TOIE0 bit is written to one, and the I-bit in the Status Register is set, the Timer/Counter0 Overflow interrupt is enabled. The corresponding interrupt is executed if an overflow in Timer/Counter0 occurs, i.e., when the TOV0 bit is set in the Timer/Counter 0 Interrupt Flag Register – TIFR0. 11.9.7 TIFR0 – Timer/Counter 0 Interrupt Flag Register Bit 7 6 5 4 3 2 1 0 0x38 (0x58) – – – – – OCF0B OCF0A TOV0 Read/Write R R R R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 TIFR0 • Bits 7..3 – Res: Reserved Bits These bits are reserved bits in the ATtiny24/44/84 and will always read as zero. • Bit 2– OCF0B: Output Compare Flag 0 B The OCF0B bit is set when a Compare Match occurs between the Timer/Counter and the data in OCR0B – Output Compare Register0 B. OCF0B is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF0B is cleared by writing a logic one to 84 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 the flag. When the I-bit in SREG, OCIE0B (Timer/Counter Compare B Match Interrupt Enable), and OCF0B are set, the Timer/Counter Compare Match Interrupt is executed. • Bit 1– OCF0A: Output Compare Flag 0 A The OCF0A bit is set when a Compare Match occurs between the Timer/Counter0 and the data in OCR0A – Output Compare Register0. OCF0A is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, OCF0A is cleared by writing a logic one to the flag. When the I-bit in SREG, OCIE0A (Timer/Counter0 Compare Match Interrupt Enable), and OCF0A are set, the Timer/Counter0 Compare Match Interrupt is executed. • Bit 0– TOV0: Timer/Counter0 Overflow Flag The bit TOV0 is set when an overflow occurs in Timer/Counter0. TOV0 is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, TOV0 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE0 (Timer/Counter0 Overflow Interrupt Enable), and TOV0 are set, the Timer/Counter0 Overflow interrupt is executed. The setting of this flag is dependent of the WGM02:0 bit setting. See Table 11-8 on page 82 and “Waveform Generation Mode Bit Description” on page 82. 85 8006G–AVR–01/08 12. 16-bit Timer/Counter1 12.1 Features • • • • • • • • • • • 12.2 True 16-bit Design (i.e., Allows 16-bit PWM) Two independent Output Compare Units Double Buffered Output Compare Registers One Input Capture Unit Input Capture Noise Canceler Clear Timer on Compare Match (Auto Reload) Glitch-free, Phase Correct Pulse Width Modulator (PWM) Variable PWM Period Frequency Generator External Event Counter Four independent interrupt Sources (TOV1, OCF1A, OCF1B, and ICF1) Overview The 16-bit Timer/Counter unit allows accurate program execution timing (event management), wave generation, and signal timing measurement. A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 12-1 on page 86. For actual placement of I/O pins, refer to “Pinout ATtiny24/44/84” on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listed in the “Register Description” on page 107. Figure 12-1. 16-bit Timer/Counter Block Diagram Count Clear Direction TOVn (Int.Req.) Control Logic clkTn Clock Select Edge Detector TOP Tn BOTTOM ( From Prescaler ) Timer/Counter TCNTn = =0 OCnA (Int.Req.) Waveform Generation = OCnA DATA BUS OCRnA OCnB (Int.Req.) Fixed TOP Values Waveform Generation = OCRnB OCnB ( From Analog Comparator Ouput ) ICFn (Int.Req.) Edge Detector ICRn Noise Canceler ICPn TCCRnA 86 TCCRnB ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Most register and bit references in this section are written in general form. A lower case “n” replaces the Timer/Counter number, and a lower case “x” replaces the Output Compare unit channel. However, when using the register or bit defines in a program, the precise form must be used, i.e., TCNT1 for accessing Timer/Counter1 counter value and so on. 12.2.1 Registers The Timer/Counter (TCNT1), Output Compare Registers (OCR1A/B), and Input Capture Register (ICR1) are all 16-bit registers. Special procedures must be followed when accessing the 16bit registers. These procedures are described in the section “Accessing 16-bit Registers” on page 88. The Timer/Counter Control Registers (TCCR1A/B) are 8-bit registers and have no CPU access restrictions. Interrupt requests (abbreviated to Int.Req. in the figure) signals are all visible in the Timer Interrupt Flag Register (TIFR). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK). TIFR and TIMSK are not shown in the figure. The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on the T1 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source is selected. The output from the Clock Select logic is referred to as the timer clock (clkT1). The double buffered Output Compare Registers (OCR1A/B) are compared with the Timer/Counter value at all time. The result of the compare can be used by the Waveform Generator to generate a PWM or variable frequency output on the Output Compare pin (OC1A/B). See “Output Compare Units” on page 95. The compare match event will also set the Compare Match Flag (OCF1A/B) which can be used to generate an Output Compare interrupt request. The Input Capture Register can capture the Timer/Counter value at a given external (edge triggered) event on either the Input Capture pin (ICP1) or on the Analog Comparator pins (See “Analog Comparator” on page 129). The Input Capture unit includes a digital filtering unit (Noise Canceler) for reducing the chance of capturing noise spikes. The TOP value, or maximum Timer/Counter value, can in some modes of operation be defined by either the OCR1A Register, the ICR1 Register, or by a set of fixed values. When using OCR1A as TOP value in a PWM mode, the OCR1A Register can not be used for generating a PWM output. However, the TOP value will in this case be double buffered allowing the TOP value to be changed in run time. If a fixed TOP value is required, the ICR1 Register can be used as an alternative, freeing the OCR1A to be used as PWM output. 12.2.2 Definitions The following definitions are used extensively throughout the section: Table 12-1. Definitions Constant Description BOTTOM The counter reaches BOTTOM when it becomes 0x00 MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255) TOP The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be the fixed value 0xFF (MAX) or the value stored in the OCR0A Register. The assignment depends on the mode of operation 87 8006G–AVR–01/08 12.2.3 Compatibility The 16-bit Timer/Counter has been updated and improved from previous versions of the 16-bit AVR Timer/Counter. This 16-bit Timer/Counter is fully compatible with the earlier version regarding: • All 16-bit Timer/Counter related I/O Register address locations, including Timer Interrupt Registers. • Bit locations inside all 16-bit Timer/Counter Registers, including Timer Interrupt Registers. • Interrupt Vectors. The following control bits have changed name, but have same functionality and register location: • PWM10 is changed to WGM10. • PWM11 is changed to WGM11. • CTC1 is changed to WGM12. The following bits are added to the 16-bit Timer/Counter Control Registers: • 1A and 1B are added to TCCR1A. • WGM13 is added to TCCR1B. The 16-bit Timer/Counter has improvements that will affect the compatibility in some special cases. 12.3 Accessing 16-bit Registers The TCNT1, OCR1A/B, and ICR1 are 16-bit registers that can be accessed by the AVR CPU via the 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations. Each 16-bit timer has a single 8-bit register for temporary storing of the high byte of the 16-bit access. The same temporary register is shared between all 16-bit registers within each 16-bit timer. Accessing the low byte triggers the 16-bit read or write operation. When the low byte of a 16-bit register is written by the CPU, the high byte stored in the temporary register, and the low byte written are both copied into the 16-bit register in the same clock cycle. When the low byte of a 16-bit register is read by the CPU, the high byte of the 16-bit register is copied into the temporary register in the same clock cycle as the low byte is read. Not all 16-bit accesses uses the temporary register for the high byte. Reading the OCR1A/B 16bit registers does not involve using the temporary register. To do a 16-bit write, the high byte must be written before the low byte. For a 16-bit read, the low byte must be read before the high byte. The following code examples show how to access the 16-bit timer registers assuming that no interrupts updates the temporary register. The same principle can be used directly for accessing the OCR1A/B and ICR1 Registers. Note that when using “C”, the compiler handles the 16-bit access. 88 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Assembly Code Examples(1) ... ; Set TCNT1 to 0x01FF ldi r17,0x01 ldi r16,0xFF out TCNT1H,r17 out TCNT1L,r16 ; Read TCNT1 into r17:r16 in r16,TCNT1L in r17,TCNT1H ... C Code Examples(1) unsigned int i; ... /* Set TCNT1 to 0x01FF */ TCNT1 = 0x1FF; /* Read TCNT1 into i */ i = TCNT1; ... Note: 1. See “Code Examples” on page 6. The assembly code example returns the TCNT1 value in the r17:r16 register pair. It is important to notice that accessing 16-bit registers are atomic operations. If an interrupt occurs between the two instructions accessing the 16-bit register, and the interrupt code updates the temporary register by accessing the same or any other of the 16-bit timer registers, then the result of the access outside the interrupt will be corrupted. Therefore, when both the main code and the interrupt code update the temporary register, the main code must disable the interrupts during the 16-bit access. The following code examples show how to do an atomic read of the TCNT1 Register contents. Reading any of the OCR1A/B or ICR1 Registers can be done by using the same principle. 89 8006G–AVR–01/08 Assembly Code Example(1) TIM16_ReadTCNT1: ; Save global interrupt flag in r18,SREG ; Disable interrupts cli ; Read TCNT1 into r17:r16 in r16,TCNT1L in r17,TCNT1H ; Restore global interrupt flag out SREG,r18 ret C Code Example(1) unsigned int TIM16_ReadTCNT1( void ) { unsigned char sreg; unsigned int i; /* Save global interrupt flag */ sreg = SREG; /* Disable interrupts */ _CLI(); /* Read TCNT1 into i */ i = TCNT1; /* Restore global interrupt flag */ SREG = sreg; return i; } Note: 1. See “Code Examples” on page 6. The assembly code example returns the TCNT1 value in the r17:r16 register pair. The following code examples show how to do an atomic write of the TCNT1 Register contents. Writing any of the OCR1A/B or ICR1 Registers can be done by using the same principle. 90 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Assembly Code Example(1) TIM16_WriteTCNT1: ; Save global interrupt flag in r18,SREG ; Disable interrupts cli ; Set TCNT1 to r17:r16 out TCNT1H,r17 out TCNT1L,r16 ; Restore global interrupt flag out SREG,r18 ret C Code Example(1) void TIM16_WriteTCNT1( unsigned int i ) { unsigned char sreg; unsigned int i; /* Save global interrupt flag */ sreg = SREG; /* Disable interrupts */ _CLI(); /* Set TCNT1 to i */ TCNT1 = i; /* Restore global interrupt flag */ SREG = sreg; } Note: 1. See “Code Examples” on page 6. The assembly code example requires that the r17:r16 register pair contains the value to be written to TCNT1. 12.3.1 12.4 Reusing the Temporary High Byte Register If writing to more than one 16-bit register where the high byte is the same for all registers written, then the high byte only needs to be written once. However, note that the same rule of atomic operation described previously also applies in this case. Timer/Counter Clock Sources The Timer/Counter can be clocked by an internal or an external clock source. The clock source is selected by the Clock Select logic which is controlled by the Clock Select (CS12:0) bits located in the Timer/Counter control Register B (TCCR1B). For details on clock sources and prescaler, see “Timer/Counter Prescaler” on page 114. 12.5 Counter Unit The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit. Figure 12-2 on page 92 shows a block diagram of the counter and its surroundings. 91 8006G–AVR–01/08 Figure 12-2. Counter Unit Block Diagram DATA BUS (8-bit) TOVn (Int.Req.) TEMP (8-bit) Clock Select Count TCNTnH (8-bit) TCNTnL (8-bit) Clear Direction TCNTn (16-bit Counter) Control Logic clkTn Edge Detector Tn ( From Prescaler ) TOP BOTTOM Signal description (internal signals): Count Direction Clear clkT1 TOP BOTTOM Increment or decrement TCNT1 by 1. Select between increment and decrement. Clear TCNT1 (set all bits to zero). Timer/Counter clock. Signalize that TCNT1 has reached maximum value. Signalize that TCNT1 has reached minimum value (zero). The 16-bit counter is mapped into two 8-bit I/O memory locations: Counter High (TCNT1H) containing the upper eight bits of the counter, and Counter Low (TCNT1L) containing the lower eight bits. The TCNT1H Register can only be indirectly accessed by the CPU. When the CPU does an access to the TCNT1H I/O location, the CPU accesses the high byte temporary register (TEMP). The temporary register is updated with the TCNT1H value when the TCNT1L is read, and TCNT1H is updated with the temporary register value when TCNT1L is written. This allows the CPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus. It is important to notice that there are special cases of writing to the TCNT1 Register when the counter is counting that will give unpredictable results. The special cases are described in the sections where they are of importance. Depending on the mode of operation used, the counter is cleared, incremented, or decremented at each timer clock (clkT1). The clkT1 can be generated from an external or internal clock source, selected by the Clock Select bits (CS12:0). When no clock source is selected (CS12:0 = 0) the timer is stopped. However, the TCNT1 value can be accessed by the CPU, independent of whether clkT1 is present or not. A CPU write overrides (has priority over) all counter clear or count operations. The counting sequence is determined by the setting of the Waveform Generation mode bits (WGM13:0) located in the Timer/Counter Control Registers A and B (TCCR1A and TCCR1B). There are close connections between how the counter behaves (counts) and how waveforms are generated on the Output Compare outputs OC1x. For more details about advanced counting sequences and waveform generation, see “Modes of Operation” on page 98. The Timer/Counter Overflow Flag (TOV1) is set according to the mode of operation selected by the WGM13:0 bits. TOV1 can be used for generating a CPU interrupt. 92 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 12.6 Input Capture Unit The Timer/Counter incorporates an Input Capture unit that can capture external events and give them a time-stamp indicating time of occurrence. The external signal indicating an event, or multiple events, can be applied via the ICP1 pin or alternatively, via the analog-comparator unit. The time-stamps can then be used to calculate frequency, duty-cycle, and other features of the signal applied. Alternatively the time-stamps can be used for creating a log of the events. The Input Capture unit is illustrated by the block diagram shown in Figure 12-3 on page 93. The elements of the block diagram that are not directly a part of the Input Capture unit are gray shaded. The small “n” in register and bit names indicates the Timer/Counter number. Figure 12-3. Input Capture Unit Block Diagram DATA BUS (8-bit) TEMP (8-bit) ICRnH (8-bit) WRITE ICRnL (8-bit) TCNTnH (8-bit) ICRn (16-bit Register) ACO* Analog Comparator ACIC* TCNTnL (8-bit) TCNTn (16-bit Counter) ICNC ICES Noise Canceler Edge Detector ICFn (Int.Req.) ICPn When a change of the logic level (an event) occurs on the Input Capture pin (ICP1), alternatively on the Analog Comparator output (ACO), and this change confirms to the setting of the edge detector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter (TCNT1) is written to the Input Capture Register (ICR1). The Input Capture Flag (ICF1) is set at the same system clock as the TCNT1 value is copied into ICR1 Register. If enabled (ICIE1 = 1), the Input Capture Flag generates an Input Capture interrupt. The ICF1 flag is automatically cleared when the interrupt is executed. Alternatively the ICF1 flag can be cleared by software by writing a logical one to its I/O bit location. Reading the 16-bit value in the Input Capture Register (ICR1) is done by first reading the low byte (ICR1L) and then the high byte (ICR1H). When the low byte is read the high byte is copied into the high byte temporary register (TEMP). When the CPU reads the ICR1H I/O location it will access the TEMP Register. The ICR1 Register can only be written when using a Waveform Generation mode that utilizes the ICR1 Register for defining the counter’s TOP value. In these cases the Waveform Genera- 93 8006G–AVR–01/08 tion mode (WGM13:0) bits must be set before the TOP value can be written to the ICR1 Register. When writing the ICR1 Register the high byte must be written to the ICR1H I/O location before the low byte is written to ICR1L. For more information on how to access the 16-bit registers refer to “Accessing 16-bit Registers” on page 88. 12.6.1 Input Capture Trigger Source The main trigger source for the Input Capture unit is the Input Capture pin (ICP1). Timer/Counter1 can alternatively use the Analog Comparator output as trigger source for the Input Capture unit. The Analog Comparator is selected as trigger source by setting the Analog Comparator Input Capture (ACIC) bit in the Analog Comparator Control and Status Register (ACSR). Be aware that changing trigger source can trigger a capture. The Input Capture Flag must therefore be cleared after the change. Both the Input Capture pin (ICP1) and the Analog Comparator output (ACO) inputs are sampled using the same technique as for the T1 pin (Figure 13-1 on page 114). The edge detector is also identical. However, when the noise canceler is enabled, additional logic is inserted before the edge detector, which increases the delay by four system clock cycles. Note that the input of the noise canceler and edge detector is always enabled unless the Timer/Counter is set in a Waveform Generation mode that uses ICR1 to define TOP. An Input Capture can be triggered by software by controlling the port of the ICP1 pin. 12.6.2 Noise Canceler The noise canceler improves noise immunity by using a simple digital filtering scheme. The noise canceler input is monitored over four samples, and all four must be equal for changing the output that in turn is used by the edge detector. The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNC1) bit in Timer/Counter Control Register B (TCCR1B). When enabled the noise canceler introduces additional four system clock cycles of delay from a change applied to the input, to the update of the ICR1 Register. The noise canceler uses the system clock and is therefore not affected by the prescaler. 12.6.3 Using the Input Capture Unit The main challenge when using the Input Capture unit is to assign enough processor capacity for handling the incoming events. The time between two events is critical. If the processor has not read the captured value in the ICR1 Register before the next event occurs, the ICR1 will be overwritten with a new value. In this case the result of the capture will be incorrect. When using the Input Capture interrupt, the ICR1 Register should be read as early in the interrupt handler routine as possible. Even though the Input Capture interrupt has relatively high priority, the maximum interrupt response time is dependent on the maximum number of clock cycles it takes to handle any of the other interrupt requests. Using the Input Capture unit in any mode of operation when the TOP value (resolution) is actively changed during operation, is not recommended. Measurement of an external signal’s duty cycle requires that the trigger edge is changed after each capture. Changing the edge sensing must be done as early as possible after the ICR1 Register has been read. After a change of the edge, the Input Capture Flag (ICF1) must be 94 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 cleared by software (writing a logical one to the I/O bit location). For measuring frequency only, the clearing of the ICF1 flag is not required (if an interrupt handler is used). 12.7 Output Compare Units The 16-bit comparator continuously compares TCNT1 with the Output Compare Register (OCR1x). If TCNT equals OCR1x the comparator signals a match. A match will set the Output Compare Flag (OCF1x) at the next timer clock cycle. If enabled (OCIE1x = 1), the Output Compare Flag generates an Output Compare interrupt. The OCF1x flag is automatically cleared when the interrupt is executed. Alternatively the OCF1x flag can be cleared by software by writing a logical one to its I/O bit location. The Waveform Generator uses the match signal to generate an output according to operating mode set by the Waveform Generation mode (WGM13:0) bits and Compare Output mode (COM1x1:0) bits. The TOP and BOTTOM signals are used by the Waveform Generator for handling the special cases of the extreme values in some modes of operation (“Modes of Operation” on page 98). A special feature of Output Compare unit A allows it to define the Timer/Counter TOP value (i.e., counter resolution). In addition to the counter resolution, the TOP value defines the period time for waveforms generated by the Waveform Generator. Figure 12-4 on page 95 shows a block diagram of the Output Compare unit. The small “n” in the register and bit names indicates the device number (n = 1 for Timer/Counter 1), and the “x” indicates Output Compare unit (A/B). The elements of the block diagram that are not directly a part of the Output Compare unit are gray shaded. Figure 12-4. Output Compare Unit, Block Diagram DATA BUS (8-bit) TEMP (8-bit) OCRnxH Buf. (8-bit) OCRnxL Buf. (8-bit) TCNTnH (8-bit) OCRnx Buffer (16-bit Register) OCRnxH (8-bit) TCNTnL (8-bit) TCNTn (16-bit Counter) OCRnxL (8-bit) OCRnx (16-bit Register) = (16-bit Comparator ) OCFnx (Int.Req.) TOP BOTTOM Waveform Generator WGMn3:0 OCnx COMnx1:0 The OCR1x Register is double buffered when using any of the twelve Pulse Width Modulation (PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the 95 8006G–AVR–01/08 double buffering is disabled. The double buffering synchronizes the update of the OCR1x Compare Register to either TOP or BOTTOM of the counting sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free. The OCR1x Register access may seem complex, but this is not case. When the double buffering is enabled, the CPU has access to the OCR1x Buffer Register, and if double buffering is disabled the CPU will access the OCR1x directly. The content of the OCR1x (Buffer or Compare) Register is only changed by a write operation (the Timer/Counter does not update this register automatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the high byte temporary register (TEMP). However, it is a good practice to read the low byte first as when accessing other 16-bit registers. Writing the OCR1x Registers must be done via the TEMP Register since the compare of all 16 bits is done continuously. The high byte (OCR1xH) has to be written first. When the high byte I/O location is written by the CPU, the TEMP Register will be updated by the value written. Then when the low byte (OCR1xL) is written to the lower eight bits, the high byte will be copied into the upper 8-bits of either the OCR1x buffer or OCR1x Compare Register in the same system clock cycle. For more information of how to access the 16-bit registers refer to “Accessing 16-bit Registers” on page 88. 12.7.1 Force Output Compare In non-PWM Waveform Generation modes, the match output of the comparator can be forced by writing a one to the Force Output Compare (1x) bit. Forcing compare match will not set the OCF1x flag or reload/clear the timer, but the OC1x pin will be updated as if a real compare match had occurred (the COM11:0 bits settings define whether the OC1x pin is set, cleared or toggled). 12.7.2 Compare Match Blocking by TCNT1 Write All CPU writes to the TCNT1 Register will block any compare match that occurs in the next timer clock cycle, even when the timer is stopped. This feature allows OCR1x to be initialized to the same value as TCNT1 without triggering an interrupt when the Timer/Counter clock is enabled. 12.7.3 Using the Output Compare Unit Since writing TCNT1 in any mode of operation will block all compare matches for one timer clock cycle, there are risks involved when changing TCNT1 when using any of the Output Compare channels, independent of whether the Timer/Counter is running or not. If the value written to TCNT1 equals the OCR1x value, the compare match will be missed, resulting in incorrect waveform generation. Do not write the TCNT1 equal to TOP in PWM modes with variable TOP values. The compare match for the TOP will be ignored and the counter will continue to 0xFFFF. Similarly, do not write the TCNT1 value equal to BOTTOM when the counter is downcounting. The setup of the OC1x should be performed before setting the Data Direction Register for the port pin to output. The easiest way of setting the OC1x value is to use the Force Output Compare (1x) strobe bits in Normal mode. The OC1x Register keeps its value even when changing between Waveform Generation modes. Be aware that the COM1x1:0 bits are not double buffered together with the compare value. Changing the COM1x1:0 bits will take effect immediately. 96 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 12.8 Compare Match Output Unit The Compare Output Mode (COM1x1:0) bits have two functions. The Waveform Generator uses the COM1x1:0 bits for defining the Output Compare (OC1x) state at the next compare match. Secondly the COM1x1:0 bits control the OC1x pin output source. Figure 12-5 on page 97 shows a simplified schematic of the logic affected by the COM1x1:0 bit setting. The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O port control registers (DDR and PORT) that are affected by the COM1x1:0 bits are shown. When referring to the OC1x state, the reference is for the internal OC1x Register, not the OC1x pin. If a system reset occur, the OC1x Register is reset to “0”. Figure 12-5. Compare Match Output Unit, Schematic (non-PWM Mode) COMnx1 COMnx0 FOCnx Waveform Generator D Q 1 OCnx DATA BUS D 0 OCnx Pin Q PORT D Q DDR clk I/O The general I/O port function is overridden by the Output Compare (OC1x) from the Waveform Generator if either of the COM1x1:0 bits are set. However, the OC1x pin direction (input or output) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction Register bit for the OC1x pin (DDR_OC1x) must be set as output before the OC1x value is visible on the pin. The port override function is generally independent of the Waveform Generation mode, but there are some exceptions. See Table 12-2 on page 107, Table 12-3 on page 108 and Table 12-4 on page 108 for details. The design of the Output Compare pin logic allows initialization of the OC1x state before the output is enabled. Note that some COM1x1:0 bit settings are reserved for certain modes of operation. See “Register Description” on page 107 The COM1x1:0 bits have no effect on the Input Capture unit. 97 8006G–AVR–01/08 12.8.1 Compare Output Mode and Waveform Generation The Waveform Generator uses the COM1x1:0 bits differently in normal, CTC, and PWM modes. For all modes, setting the COM1x1:0 = 0 tells the Waveform Generator that no action on the OC1x Register is to be performed on the next compare match. For compare output actions in the non-PWM modes refer to Table 12-2 on page 107. For fast PWM mode refer to Table 12-3 on page 108, and for phase correct and phase and frequency correct PWM refer to Table 12-4 on page 108. A change of the COM1x1:0 bits state will have effect at the first compare match after the bits are written. For non-PWM modes, the action can be forced to have immediate effect by using the 1x strobe bits. 12.9 Modes of Operation The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is defined by the combination of the Waveform Generation mode (WGM13:0) and Compare Output mode (COM1x1:0) bits. The Compare Output mode bits do not affect the counting sequence, while the Waveform Generation mode bits do. The COM1x1:0 bits control whether the PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM1x1:0 bits control whether the output should be set, cleared or toggle at a compare match (“Compare Match Output Unit” on page 97) For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 105. 12.9.1 Normal Mode The simplest mode of operation is the Normal mode (WGM13:0 = 0). In this mode the counting direction is always up (incrementing), and no counter clear is performed. The counter simply overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from the BOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOV1) will be set in the same timer clock cycle as the TCNT1 becomes zero. The TOV1 flag in this case behaves like a 17th bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt that automatically clears the TOV1 flag, the timer resolution can be increased by software. There are no special cases to consider in the Normal mode, a new counter value can be written anytime. The Input Capture unit is easy to use in Normal mode. However, observe that the maximum interval between the external events must not exceed the resolution of the counter. If the interval between events are too long, the timer overflow interrupt or the prescaler must be used to extend the resolution for the capture unit. The Output Compare units can be used to generate interrupts at some given time. Using the Output Compare to generate waveforms in Normal mode is not recommended, since this will occupy too much of the CPU time. 12.9.2 98 Clear Timer on Compare Match (CTC) Mode In Clear Timer on Compare or CTC mode (WGM13:0 = 4 or 12), the OCR1A or ICR1 Register are used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter value (TCNT1) matches either the OCR1A (WGM13:0 = 4) or the ICR1 (WGM13:0 = 12). The OCR1A or ICR1 define the top value for the counter, hence also its resolution. This mode allows greater control of the compare match output frequency. It also simplifies the operation of counting external events. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 The timing diagram for the CTC mode is shown in Figure 12-6 on page 99. The counter value (TCNT1) increases until a compare match occurs with either OCR1A or ICR1, and then counter (TCNT1) is cleared. Figure 12-6. CTC Mode, Timing Diagram OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) TCNTn OCnA (Toggle) Period (COMnA1:0 = 1) 1 2 3 4 An interrupt can be generated at each time the counter value reaches the TOP value by either using the OCF1A or ICF1 flag according to the register used to define the TOP value. If the interrupt is enabled, the interrupt handler routine can be used for updating the TOP value. However, changing the TOP to a value close to BOTTOM when the counter is running with none or a low prescaler value must be done with care since the CTC mode does not have the double buffering feature. If the new value written to OCR1A or ICR1 is lower than the current value of TCNT1, the counter will miss the compare match. The counter will then have to count to its maximum value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur. In many cases this feature is not desirable. An alternative will then be to use the fast PWM mode using OCR1A for defining TOP (WGM13:0 = 15) since the OCR1A then will be double buffered. For generating a waveform output in CTC mode, the OC1A output can be set to toggle its logical level on each compare match by setting the Compare Output mode bits to toggle mode (COM1A1:0 = 1). The OC1A value will not be visible on the port pin unless the data direction for the pin is set to output (DDR_OC1A = 1). The waveform generated will have a maximum frequency of 1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). The waveform frequency is defined by the following equation: f clk_I/O f OCnA = -------------------------------------------------2 ⋅ N ⋅ ( 1 + OCRnA ) The N variable represents the prescaler factor (1, 8, 64, 256, or 1024). As for the Normal mode of operation, the TOV1 flag is set in the same timer clock cycle that the counter counts from MAX to 0x0000. 12.9.3 Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM13:0 = 5, 6, 7, 14, or 15) provides a high frequency PWM waveform generation option. The fast PWM differs from the other PWM options by its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the compare match between TCNT1 and OCR1x, and set at BOTTOM. In inverting Compare Output mode output is set on compare match and cleared at BOTTOM. Due to the single-slope 99 8006G–AVR–01/08 operation, the operating frequency of the fast PWM mode can be twice as high as the phase correct and phase and frequency correct PWM modes that use dual-slope operation. This high frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC applications. High frequency allows physically small sized external components (coils, capacitors), hence reduces total system cost. The PWM resolution for fast PWM can be fixed to 8-, 9-, or 10-bit, or defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated by using the following equation: log ( TOP + 1 ) R FPWM = ----------------------------------log ( 2 ) In fast PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 5, 6, or 7), the value in ICR1 (WGM13:0 = 14), or the value in OCR1A (WGM13:0 = 15). The counter is then cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is shown in Figure 12-7 on page 100. The figure shows fast PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the single-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x interrupt flag will be set when a compare match occurs. Figure 12-7. Fast PWM Mode, Timing Diagram OCRnx/TOP Update and TOVn Interrupt Flag Set and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) TCNTn OCnx (COMnx1:0 = 2) OCnx (COMnx1:0 = 3) Period 1 2 3 4 5 6 7 8 The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches TOP. In addition the OC1A or ICF1 flag is set at the same timer clock cycle as TOV1 is set when either OCR1A or ICR1 is used for defining the TOP value. If one of the interrupts are enabled, the interrupt handler routine can be used for updating the TOP and compare values. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x. Note that when using fixed TOP values the unused bits are masked to zero when any of the OCR1x Registers are written. 100 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 The procedure for updating ICR1 differs from updating OCR1A when used for defining the TOP value. The ICR1 Register is not double buffered. This means that if ICR1 is changed to a low value when the counter is running with none or a low prescaler value, there is a risk that the new ICR1 value written is lower than the current value of TCNT1. The result will then be that the counter will miss the compare match at the TOP value. The counter will then have to count to the MAX value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur. The OCR1A Register however, is double buffered. This feature allows the OCR1A I/O location to be written anytime. When the OCR1A I/O location is written the value written will be put into the OCR1A Buffer Register. The OCR1A Compare Register will then be updated with the value in the Buffer Register at the next timer clock cycle the TCNT1 matches TOP. The update is done at the same timer clock cycle as the TCNT1 is cleared and the TOV1 flag is set. Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However, if the base PWM frequency is actively changed (by changing the TOP value), using the OCR1A as TOP is clearly a better choice due to its double buffer feature. In fast PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to three (see Table 12-3 on page 108). The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the compare match between OCR1x and TCNT1, and clearing (or setting) the OC1x Register at the timer clock cycle the counter is cleared (changes from TOP to BOTTOM). The PWM frequency for the output can be calculated by the following equation: f clk_I/O f OCnxPWM = ---------------------------------N ⋅ ( 1 + TOP ) The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represents special cases when generating a PWM waveform output in the fast PWM mode. If the OCR1x is set equal to BOTTOM (0x0000) the output will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCR1x equal to TOP will result in a constant high or low output (depending on the polarity of the output set by the COM1x1:0 bits.) A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by setting OC1A to toggle its logical level on each compare match (COM1A1:0 = 1). The waveform generated will have a maximum frequency of 1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). This feature is similar to the OC1A toggle in CTC mode, except the double buffer feature of the Output Compare unit is enabled in the fast PWM mode. 12.9.4 Phase Correct PWM Mode The phase correct Pulse Width Modulation or phase correct PWM mode (WGM13:0 = 1, 2, 3, 10, or 11) provides a high resolution phase correct PWM waveform generation option. The phase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dualslope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the compare match between TCNT1 and OCR1x while upcounting, and set on the compare match while downcounting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation has lower maximum operation frequency than single slope 101 8006G–AVR–01/08 operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The PWM resolution for the phase correct PWM mode can be fixed to 8-, 9-, or 10-bit, or defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated by using the following equation: log ( TOP + 1 ) R PCPWM = ----------------------------------log ( 2 ) In phase correct PWM mode the counter is incremented until the counter value matches either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 1, 2, or 3), the value in ICR1 (WGM13:0 = 10), or the value in OCR1A (WGM13:0 = 11). The counter has then reached the TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 12-8 on page 102. The figure shows phase correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x interrupt flag will be set when a compare match occurs. Figure 12-8. Phase Correct PWM Mode, Timing Diagram OCRnx/TOP Update and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) TOVn Interrupt Flag Set (Interrupt on Bottom) TCNTn OCnx (COMnx1:0 = 2) OCnx (COMnx1:0 = 3) Period 1 2 3 4 The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches BOTTOM. When either OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 flag is set accordingly at the same timer clock cycle as the OCR1x Registers are updated with the double buffer value (at TOP). The interrupt flags can be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the 102 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x. Note that when using fixed TOP values, the unused bits are masked to zero when any of the OCR1x Registers are written. As the third period shown in Figure 12-8 on page 102 illustrates, changing the TOP actively while the Timer/Counter is running in the phase correct mode can result in an unsymmetrical output. The reason for this can be found in the time of update of the OCR1x Register. Since the OCR1x update occurs at TOP, the PWM period starts and ends at TOP. This implies that the length of the falling slope is determined by the previous TOP value, while the length of the rising slope is determined by the new TOP value. When these two values differ the two slopes of the period will differ in length. The difference in length gives the unsymmetrical result on the output. It is recommended to use the phase and frequency correct mode instead of the phase correct mode when changing the TOP value while the Timer/Counter is running. When using a static TOP value there are practically no differences between the two modes of operation. In phase correct PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to three (See Table 12-4 on page 108). The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the compare match between OCR1x and TCNT1 when the counter increments, and clearing (or setting) the OC1x Register at compare match between OCR1x and TCNT1 when the counter decrements. The PWM frequency for the output when using phase correct PWM can be calculated by the following equation: f clk_I/O f OCnxPCPWM = --------------------------2 ⋅ N ⋅ TOP The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represent special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the output will be continuously low and if set equal to TOP the output will be continuously high for non-inverted PWM mode. For inverted PWM the output will have the opposite logic values. 12.9.5 Phase and Frequency Correct PWM Mode The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWM mode (WGM13:0 = 8 or 9) provides a high resolution phase and frequency correct PWM waveform generation option. The phase and frequency correct PWM mode is, like the phase correct PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared on the compare match between TCNT1 and OCR1x while upcounting, and set on the compare match while downcounting. In inverting Compare Output mode, the operation is inverted. The dual-slope operation gives a lower maximum operation frequency compared to the single-slope operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes are preferred for motor control applications. The main difference between the phase correct, and the phase and frequency correct PWM mode is the time the OCR1x Register is updated by the OCR1x Buffer Register, (see Figure 128 on page 102 and Figure 12-9 on page 104). The PWM resolution for the phase and frequency correct PWM mode can be defined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and 103 8006G–AVR–01/08 the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be calculated using the following equation: log ( TOP + 1 ) R PFCPWM = ----------------------------------log ( 2 ) In phase and frequency correct PWM mode the counter is incremented until the counter value matches either the value in ICR1 (WGM13:0 = 8), or the value in OCR1A (WGM13:0 = 9). The counter has then reached the TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequency correct PWM mode is shown on Figure 12-9 on page 104. The figure shows phase and frequency correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x interrupt flag will be set when a compare match occurs. Figure 12-9. Phase and Frequency Correct PWM Mode, Timing Diagram OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP) OCRnx/TOP Updateand TOVn Interrupt Flag Set (Interrupt on Bottom) TCNTn OCnx (COMnx1:0 = 2) OCnx (COMnx1:0 = 3) Period 1 2 3 4 The Timer/Counter Overflow Flag (TOV1) is set at the same timer clock cycle as the OCR1x Registers are updated with the double buffer value (at BOTTOM). When either OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 flag set when TCNT1 has reached TOP. The interrupt flags can then be used to generate an interrupt each time the counter reaches the TOP or BOTTOM value. When changing the TOP value the program must ensure that the new TOP value is higher or equal to the value of all of the Compare Registers. If the TOP value is lower than any of the Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x. As Figure 12-9 on page 104 shows the output generated is, in contrast to the phase correct mode, symmetrical in all periods. Since the OCR1x Registers are updated at BOTTOM, the length of the rising and the falling slopes will always be equal. This gives symmetrical output pulses and is therefore frequency correct. 104 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However, if the base PWM frequency is actively changed by changing the TOP value, using the OCR1A as TOP is clearly a better choice due to its double buffer feature. In phase and frequency correct PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output can be generated by setting the COM1x1:0 to three (See Table 12-4 on page 108). The actual OC1x value will only be visible on the port pin if the data direction for the port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at the compare match between OCR1x and TCNT1 when the counter increments, and clearing (or setting) the OC1x Register at compare match between OCR1x and TCNT1 when the counter decrements. The PWM frequency for the output when using phase and frequency correct PWM can be calculated by the following equation: f clk_I/O f OCnxPFCPWM = --------------------------2 ⋅ N ⋅ TOP The N variable represents the prescaler divider (1, 8, 64, 256, or 1024). The extreme values for the OCR1x Register represents special cases when generating a PWM waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the output will be continuously low and if set equal to TOP the output will be set to high for noninverted PWM mode. For inverted PWM the output will have the opposite logic values. 12.10 Timer/Counter Timing Diagrams The Timer/Counter is a synchronous design and the timer clock (clkT1) is therefore shown as a clock enable signal in the following figures. The figures include information on when interrupt flags are set, and when the OCR1x Register is updated with the OCR1x buffer value (only for modes utilizing double buffering). Figure 12-10 on page 105 shows a timing diagram for the setting of OCF1x. Figure 12-10. Timer/Counter Timing Diagram, Setting of OCF1x, no Prescaling clkI/O clkTn (clkI/O /1) TCNTn OCRnx OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2 OCRnx Value OCFnx 105 8006G–AVR–01/08 Figure 12-11 on page 106 shows the same timing data, but with the prescaler enabled. Figure 12-11. Timer/Counter Timing Diagram, Setting of OCF1x, with Prescaler (fclk_I/O/8) clkI/O clkTn (clkI/O /8) TCNTn OCRnx - 1 OCRnx OCRnx OCRnx + 1 OCRnx + 2 OCRnx Value OCFnx Figure 12-12 on page 106 shows the count sequence close to TOP in various modes. When using phase and frequency correct PWM mode the OCR1x Register is updated at BOTTOM. The timing diagrams will be the same, but TOP should be replaced by BOTTOM, TOP-1 by BOTTOM+1 and so on. The same renaming applies for modes that set the TOV1 flag at BOTTOM. Figure 12-12. Timer/Counter Timing Diagram, no Prescaling clkI/O clkTn (clkI/O /1) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP BOTTOM BOTTOM + 1 TOP - 1 TOP TOP - 1 TOP - 2 TOVn (FPWM) and ICFn (if used as TOP) OCRnx (Update at TOP) Old OCRnx Value New OCRnx Value Figure 12-13 on page 107 shows the same timing data, but with the prescaler enabled. 106 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 12-13. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8) clkI/O clkTn (clkI/O/8) TCNTn (CTC and FPWM) TCNTn (PC and PFC PWM) TOP - 1 TOP BOTTOM BOTTOM + 1 TOP - 1 TOP TOP - 1 TOP - 2 TOVn (FPWM) and ICF n (if used as TOP) OCRnx Old OCRnx Value (Update at TOP) New OCRnx Value 12.11 Register Description 12.11.1 TCCR1A – Timer/Counter1 Control Register A Bit 7 6 5 4 3 2 1 0 0x2F (0x4F) COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 Read/Write R/W R/W R/W R/W R R R/W R/W Initial Value 0 0 0 0 0 0 0 0 TCCR1A • Bit 7:6 – COM1A1:0: Compare Output Mode for Channel A • Bit 5:4 – COM1B1:0: Compare Output Mode for Channel B The COM1A1:0 and COM1B1:0 control the Output Compare pins (OC1A and OC1B respectively) behavior. If one or both of the COM1A1:0 bits are written to one, the OC1A output overrides the normal port functionality of the I/O pin it is connected to. If one or both of the COM1B1:0 bit are written to one, the OC1B output overrides the normal port functionality of the I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit corresponding to the OC1A or OC1B pin must be set in order to enable the output driver. When the OC1A or OC1B is connected to the pin, the function of the COM1x1:0 bits is dependent of the WGM13:0 bits setting. Table 12-2 on page 107 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to a Normal or a CTC mode (non-PWM). Table 12-2. Compare Output Mode, non-PWM COM1A1/COM1B1 COM1A0/COM1B0 Description 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 Toggle OC1A/OC1B on Compare Match. 1 0 Clear OC1A/OC1B on Compare Match (Set output to low level). 1 1 Set OC1A/OC1B on Compare Match (Set output to high level). 107 8006G–AVR–01/08 Table 12-3 on page 108 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the fast PWM mode. Table 12-3. Compare Output Mode, Fast PWM(1) COM1A1/COM1B1 COM1A0/COM1B0 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 WGM13=0: Normal port operation, OC1A/OC1B disconnected. WGM13=1: Toggle OC1A on Compare Match, OC1B reserved. 1 0 Clear OC1A/OC1B on Compare Match, set OC1A/OC1B at BOTTOM (non-inverting mode) 1 1 Set OC1A/OC1B on Compare Match, clear OC1A/OC1B at BOTTOM (inverting mode) Note: Description 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. In this case the compare match is ignored, but the set or clear is done at BOTTOM. “Fast PWM Mode” on page 99 for more details. Table 12-4 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the phase correct or the phase and frequency correct, PWM mode. Table 12-4. Compare Output Mode, Phase Correct and Phase & Frequency Correct PWM(1) COM1A1/COM1B1 COM1A0/COM1B0 0 0 Normal port operation, OC1A/OC1B disconnected. 0 1 WGM13=0: Normal port operation, OC1A/OC1B disconnected. WGM13=1: Toggle OC1A on Compare Match, OC1B reserved. 1 0 Clear OC1A/OC1B on Compare Match when upcounting. Set OC1A/OC1B on Compare Match when downcounting. 1 1 Set OC1A/OC1B on Compare Match when upcounting. Clear OC1A/OC1B on Compare Match when downcounting. Note: Description 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. “Phase Correct PWM Mode” on page 101 for more details. • Bit 1:0 – WGM11:0: Waveform Generation Mode Combined with the WGM13:2 bits found in the TCCR1B Register, these bits control the counting sequence of the counter, the source for maximum (TOP) counter value, and what type of waveform generation to be used, see Table 12-5 on page 109. Modes of operation supported by the Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare match (CTC) mode, and three types of Pulse Width Modulation (PWM) modes. (“Modes of Operation” on page 98). 108 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 12-5. Waveform Generation Modes Mode WGM 13 WGM 12 WGM 11 WGM 10 Mode of Operation TOP Update of OCR1x at TOV1 Flag Set on 0 0 0 0 0 Normal 0xFFFF Immediate MAX 1 0 0 0 1 PWM, Phase Correct, 8-bit 0x00FF TOP BOTTOM 2 0 0 1 0 PWM, Phase Correct, 9-bit 0x01FF TOP BOTTOM 3 0 0 1 1 PWM, Phase Correct, 10-bit 0x03FF TOP BOTTOM 4 0 1 0 0 CTC (Clear Timer on Compare) OCR1A Immediate MAX 5 0 1 0 1 Fast PWM, 8-bit 0x00FF TOP TOP 6 0 1 1 0 Fast PWM, 9-bit 0x01FF TOP TOP 7 0 1 1 1 Fast PWM, 10-bit 0x03FF TOP TOP 8 1 0 0 0 PWM, Phase & Freq. Correct ICR1 BOTTOM BOTTOM 9 1 0 0 1 PWM, Phase & Freq. Correct OCR1A BOTTOM BOTTOM 10 1 0 1 0 PWM, Phase Correct ICR1 TOP BOTTOM 11 1 0 1 1 PWM, Phase Correct OCR1A TOP BOTTOM 12 1 1 0 0 CTC (Clear Timer on Compare) ICR1 Immediate MAX 13 1 1 0 1 (Reserved) – – – 14 1 1 1 0 Fast PWM ICR1 TOP TOP 15 1 1 1 1 Fast PWM OCR1A TOP TOP 12.11.2 TCCR1B – Timer/Counter1 Control Register B Bit 7 6 5 4 3 2 1 0 0x2E (0x4E) ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 Read/Write R/W R/W R R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 TCCR1B • Bit 7 – ICNC1: Input Capture Noise Canceler Setting this bit (to one) activates the Input Capture Noise Canceler. When the noise canceler is activated, the input from the Input Capture pin (ICP1) is filtered. The filter function requires four successive equal valued samples of the ICP1 pin for changing its output. The Input Capture is therefore delayed by four Oscillator cycles when the noise canceler is enabled. • Bit 6 – ICES1: Input Capture Edge Select This bit selects which edge on the Input Capture pin (ICP1) that is used to trigger a capture event. When the ICES1 bit is written to zero, a falling (negative) edge is used as trigger, and when the ICES1 bit is written to one, a rising (positive) edge will trigger the capture. When a capture is triggered according to the ICES1 setting, the counter value is copied into the Input Capture Register (ICR1). The event will also set the Input Capture Flag (ICF1), and this can be used to cause an Input Capture Interrupt, if this interrupt is enabled. 109 8006G–AVR–01/08 When the ICR1 is used as TOP value (see description of the WGM13:0 bits located in the TCCR1A and the TCCR1B Register), the ICP1 is disconnected and consequently the Input Capture function is disabled. • Bit 5 – Reserved Bit This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be written to zero when TCCR1B is written. • Bit 4:3 – WGM13:2: Waveform Generation Mode See TCCR1A Register description. • Bit 2:0 – CS12:0: Clock Select The three Clock Select bits select the clock source to be used by the Timer/Counter, see Figure 12-10 and Figure 12-11. Table 12-6. Clock Select Bit Description CS12 CS11 CS10 Description 0 0 0 No clock source (Timer/Counter stopped). 0 0 1 clkI/O/1 (No prescaling) 0 1 0 clkI/O/8 (From prescaler) 0 1 1 clkI/O/64 (From prescaler) 1 0 0 clkI/O/256 (From prescaler) 1 0 1 clkI/O/1024 (From prescaler) 1 1 0 External clock source on T1 pin. Clock on falling edge. 1 1 1 External clock source on T1 pin. Clock on rising edge. If external pin modes are used for the Timer/Counter1, transitions on the T1 pin will clock the counter even if the pin is configured as an output. This feature allows software control of the counting. 12.11.3 TCCR1C – Timer/Counter1 Control Register C Bit 7 6 5 4 3 2 1 0 0x22 (0x42) FOC1A FOC1B – – – – – – Read/Write W W R R R R R R Initial Value 0 0 0 0 0 0 0 0 TCCR1C • Bit 7 – FOC1A: Force Output Compare for Channel A • Bit 6 – FOC1B: Force Output Compare for Channel B The FOC1A/FOC1B bits are only active when the WGM13:0 bits specifies a non-PWM mode. However, for ensuring compatibility with future devices, these bits must be set to zero when TCCR1A is written when operating in a PWM mode. When writing a logical one to the FOC1A/FOC1B bit, an immediate compare match is forced on the Waveform Generation unit. The OC1A/OC1B output is changed according to its COM1x1:0 bits setting. Note that the FOC1A/FOC1B bits are implemented as strobes. Therefore it is the value present in the COM1x1:0 bits that determine the effect of the forced compare. 110 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 A FOC1A/FOC1B strobe will not generate any interrupt nor will it clear the timer in Clear Timer on Compare match (CTC) mode using OCR1A as TOP. The FOC1A/FOC1B bits are always read as zero. • Bit 5..0 – Reserved Bit This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be written to zero when the register is written. 12.11.4 TCNT1H and TCNT1L – Timer/Counter1 Bit 7 6 5 4 3 0x2D (0x4D) TCNT1[15:8] 0x2C (0x4C) TCNT1[7:0] 2 1 0 TCNT1H TCNT1L Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The two Timer/Counter I/O locations (TCNT1H and TCNT1L, combined TCNT1) give direct access, both for read and for write operations, to the Timer/Counter unit 16-bit counter. To ensure that both the high and low bytes are read and written simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary high byte register (TEMP). This temporary register is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 88. Modifying the counter (TCNT1) while the counter is running introduces a risk of missing a compare match between TCNT1 and one of the OCR1x Registers. Writing to the TCNT1 Register blocks (removes) the compare match on the following timer clock for all compare units. 12.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A Bit 12.11.6 7 6 5 4 3 0x2B (0x4B) OCR1A[15:8] 0x2A (0x4A) OCR1A[7:0] 2 1 0 OCR1AH OCR1AL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 4 3 2 1 0 OCR1BH and OCR1BL – Output Compare Register 1 B Bit 7 6 5 0x29 (0x49) OCR1B[15:8] 0x28 (0x48) OCR1B[7:0] OCR1BH OCR1BL Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The Output Compare Registers contain a 16-bit value that is continuously compared with the counter value (TCNT1). A match can be used to generate an Output Compare interrupt, or to generate a waveform output on the OC1x pin. The Output Compare Registers are 16-bit in size. To ensure that both the high and low bytes are written simultaneously when the CPU writes to these registers, the access is performed using an 8-bit temporary high byte register (TEMP). This temporary register is shared by all the other 16bit registers. See “Accessing 16-bit Registers” on page 88. 111 8006G–AVR–01/08 12.11.7 ICR1H and ICR1L – Input Capture Register 1 Bit 7 6 5 4 3 0x25 (0x45) ICR1[15:8] 0x24 (0x44) ICR1[7:0] 2 1 0 ICR1H ICR1L Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The Input Capture is updated with the counter (TCNT1) value each time an event occurs on the ICP1 pin (or optionally on the Analog Comparator output for Timer/Counter1). The Input Capture can be used for defining the counter TOP value. The Input Capture Register is 16-bit in size. To ensure that both the high and low bytes are read simultaneously when the CPU accesses these registers, the access is performed using an 8-bit temporary high byte register (TEMP). This temporary register is shared by all the other 16-bit registers. “Accessing 16-bit Registers” on page 88. 12.11.8 TIMSK1 – Timer/Counter Interrupt Mask Register 1 Bit 7 6 5 4 3 2 1 0 0x0C (0x2C) – – ICIE1 – – OCIE1B OCIE1A TOIE1 Read/Write R R R/W R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 TIMSK1 • Bit 7,6,4,3 – Reserved Bit This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be written to zero when the register is written. • Bit 5 – ICIE1: Timer/Counter1, Input Capture Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Countern Input Capture interrupt is enabled. The corresponding Interrupt Vector (See “Interrupts” on page 66.) is executed when the ICF1 Flag, located in TIFR1, is set. • Bit 2– OCIE1B: Timer/Counter1, Output Compare B Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Output Compare B Match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 47) is executed when the OCF1B flag, located in TIFR1, is set. • Bit 1– OCIE1A: Timer/Counter1, Output Compare A Match Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Output Compare A Match interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 47) is executed when the OCF1A flag, located in TIFR1, is set. • Bit 0 – TOIE1: Timer/Counter1, Overflow Interrupt Enable When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally enabled), the Timer/Counter1 Overflow interrupt is enabled. The corresponding Interrupt Vector (see “Interrupts” on page 47) is executed when the TOV1 flag, located in TIFR1, is set. 112 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 12.11.9 TIFR1 – Timer/Counter Interrupt Flag Register 1 Bit 0x0B (0x2B) 7 – 6 – 5 ICF1 4 – 3 – 2 1 OCF1B OCF1A 0 TOV1 Read/Write R R R/W R R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 TIFR1 • Bit 7,6,4,3 – Reserved Bit This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be written to zero when the register is written. • Bit 5– ICF1: Timer/Counter1, Input Capture Flag This flag is set when a capture event occurs on the ICP1 pin. When the Input Capture Register (ICR1) is set by the WGM13:0 to be used as the TOP value, the ICF1 flag is set when the counter reaches the TOP value. ICF1 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively, ICF1 can be cleared by writing a logic one to its bit location. • Bit 2– OCF1B: Timer/Counter1, Output Compare B Match Flag This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output Compare Register B (OCR1B). Note that a Forced Output Compare (1B) strobe will not set the OCF1B flag. OCF1B is automatically cleared when the Output Compare Match B Interrupt Vector is executed. Alternatively, OCF1B can be cleared by writing a logic one to its bit location. • Bit 1– OCF1A: Timer/Counter1, Output Compare A Match Flag This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output Compare Register A (OCR1A). Note that a Forced Output Compare (1A) strobe will not set the OCF1A flag. OCF1A is automatically cleared when the Output Compare Match A Interrupt Vector is executed. Alternatively, OCF1A can be cleared by writing a logic one to its bit location. • Bit 0– TOV1: Timer/Counter1, Overflow Flag The setting of this flag is dependent of the WGM13:0 bits setting. In Normal and CTC modes, the TOV1 flag is set when the timer overflows. See Table 12-5 on page 109 for the TOV1 flag behavior when using another WGM13:0 bit setting. TOV1 is automatically cleared when the Timer/Counter1 Overflow Interrupt Vector is executed. Alternatively, TOV1 can be cleared by writing a logic one to its bit location. 113 8006G–AVR–01/08 13. Timer/Counter Prescaler Timer/Counter0 and Timer/Counter1 share the same prescaler module, but the Timer/Counters can have different prescaler settings. The description below applies to both Timer/Counters. Tn is used as a general name, n = 0, 1. The Timer/Counter can be clocked directly by the system clock (by setting the CSn2:0 = 1). This provides the fastest operation, with a maximum Timer/Counter clock frequency equal to system clock frequency (fCLK_I/O). Alternatively, one of four taps from the prescaler can be used as a clock source. The prescaled clock has a frequency of either fCLK_I/O/8, fCLK_I/O/64, fCLK_I/O/256, or fCLK_I/O/1024. 13.1 Prescaler Reset The prescaler is free running, i.e., operates independently of the Clock Select logic of the Timer/CounterCounter, and it is shared by the Timer/Counter Tn. Since the prescaler is not affected by the Timer/Counter’s clock select, the state of the prescaler will have implications for situations where a prescaled clock is used. One example of prescaling artifacts occurs when the timer is enabled and clocked by the prescaler (CSn2:0 = 2, 3, 4, or 5). The number of system clock cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024). It is possible to use the Prescaler Reset for synchronizing the Timer/Counter to program execution. 13.2 External Clock Source An external clock source applied to the Tn pin can be used as Timer/Counter clock (clkTn). The Tn pin is sampled once every system clock cycle by the pin synchronization logic. The synchronized (sampled) signal is then passed through the edge detector. Figure 13-1 on page 114 shows a functional equivalent block diagram of the Tn synchronization and edge detector logic. The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is transparent in the high period of the internal system clock. The edge detector generates one clkT0 pulse for each positive (CSn2:0 = 7) or negative (CSn2:0 = 6) edge it detects. Figure 13-1. T0 Pin Sampling Tn D Q D Q D Tn_sync (To Clock Select Logic) Q LE clk I/O Synchronization Edge Detector The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles from an edge has been applied to the Tn pin to the counter is updated. Enabling and disabling of the clock input must be done when Tn has been stable for at least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated. 114 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Each half period of the external clock applied must be longer than one system clock cycle to ensure correct sampling. The external clock must be guaranteed to have less than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses sampling, the maximum frequency of an external clock it can detect is half the sampling frequency (Nyquist sampling theorem). However, due to variation of the system clock frequency and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5. An external clock source can not be prescaled. Figure 13-2. Prescaler for Timer/Counter0 clk I/O Clear PSR10 T0 Synchronization clkT0 Note: 13.3 13.3.1 1. The synchronization logic on the input pins (T0) is shown in Figure 13-1 on page 114. Register Description GTCCR – General Timer/Counter Control Register Bit 7 6 5 4 3 2 1 0 0x23 (0x43) TSM – – – – – – PSR10 Read/Write R/W R R R R R R R/W Initial Value 0 0 0 0 0 0 0 0 GTCCR • Bit 7 – TSM: Timer/Counter Synchronization Mode Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the value that is written to the PSR10 bit is kept, hence keeping the Prescaler Reset signal asserted. This ensures that the Timer/Counter is halted and can be configured without the risk of advancing during configuration. When the TSM bit is written to zero, the PSR10 bit is cleared by hardware, and the Timer/Counter start counting. 115 8006G–AVR–01/08 • Bit 0 – PSR10: Prescaler 0 Reset Timer/Counter n When this bit is one, the Timer/Countern prescaler will be Reset. This bit is normally cleared immediately by hardware, except if the TSM bit is set. 116 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 14. USI – Universal Serial Interface 14.1 Features • • • • • • 14.2 Two-wire Synchronous Data Transfer (Master or Slave) Three-wire Synchronous Data Transfer (Master or Slave) Data Received Interrupt Wakeup from Idle Mode In Two-wire Mode: Wake-up from All Sleep Modes, Including Power-down Mode Two-wire Start Condition Detector with Interrupt Capability Overview The Universal Serial Interface (USI), provides the basic hardware resources needed for serial communication. Combined with a minimum of control software, the USI allows significantly higher transfer rates and uses less code space than solutions based on software only. Interrupts are included to minimize the processor load. A simplified block diagram of the USI is shown in Figure 14-1 For actual placement of I/O pins refer to “Pinout ATtiny24/44/84” on page 2. Device-specific I/O Register and bit locations are listed in the “Register Descriptions” on page 124. Figure 14-1. Universal Serial Interface, Block Diagram Bit7 Bit0 D Q LE DO (Output only) DI/SDA (Input/Open Drain) USCK/SCL (Input/Open Drain) 3 2 USIDR 1 0 TIM0 COMP USIPF 4-bit Counter USIDC USISIF USIOIF DATA BUS USIDB 3 2 0 1 1 0 CLOCK HOLD [1] Two-wire Clock Control Unit USISR USITC USICLK USICS0 USICS1 USIWM0 USIWM1 USISIE USIOIE 2 USICR The 8-bit USI Data Register (USIDR) contains the incoming and outgoing data. It is directly accessible via the data bus but a copy of the contents is also placed in the USI Buffer Register (USIBR) where it can be retrieved later. If reading the USI Data Register directly, the register must be read as quickly as possible to ensure that no data is lost. The most significant bit of the USI Data Register is connected to one of two output pins (depending on the mode configuration, see “USICR – USI Control Register” on page 126). There is a transparent latch between the output of the USI Data Register and the output pin, which delays 117 8006G–AVR–01/08 the change of data output to the opposite clock edge of the data input sampling. The serial input is always sampled from the Data Input (DI) pin independent of the configuration. The 4-bit counter can be both read and written via the data bus, and it can generate an overflow interrupt. Both the USI Data Register and the counter are clocked simultaneously by the same clock source. This allows the counter to count the number of bits received or transmitted and generate an interrupt when the transfer is complete. Note that when an external clock source is selected the counter counts both clock edges. This means the counter registers the number of clock edges and not the number of data bits. The clock can be selected from three different sources: The USCK pin, Timer/Counter0 Compare Match or from software. The two-wire clock control unit can be configured to generate an interrupt when a start condition has been detected on the two-wire bus. It can also be set to generate wait states by holding the clock pin low after a start condition is detected, or after the counter overflows. 14.3 14.3.1 Functional Descriptions Three-wire Mode The USI Three-wire mode is compliant to the Serial Peripheral Interface (SPI) mode 0 and 1, but does not have the slave select (SS) pin functionality. However, this feature can be implemented in software if necessary. Pin names used by this mode are: DI, DO, and USCK. Figure 14-2. Three-wire Mode Operation, Simplified Diagram DO Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 DI Bit0 USCK SLAVE DO Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 DI Bit0 USCK PORTxn MASTER Figure 14-2 shows two USI units operating in three-wire mode, one as Master and one as Slave. The two USI Data Registers are interconnected in such way that after eight USCK clocks, the data in each register has been interchanged. The same clock also increments the USI’s 4-bit counter. The Counter Overflow (interrupt) Flag, or USIOIF, can therefore be used to determine when a transfer is completed. The clock is generated by the Master device software by toggling the USCK pin via the PORTA register or by writing a one to bit USITC bit in USICR. 118 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 14-3. Three-wire Mode, Timing Diagram CYCLE ( Reference ) 1 2 3 4 5 6 7 8 USCK USCK DO MSB DI MSB A B C 6 5 4 3 2 1 LSB 6 5 4 3 2 1 LSB D E The three-wire mode timing is shown in Figure 14-3 At the top of the figure is a USCK cycle reference. One bit is shifted into the USI Data Register (USIDR) for each of these cycles. The USCK timing is shown for both external clock modes. In external clock mode 0 (USICS0 = 0), DI is sampled at positive edges, and DO is changed (USI Data Register is shifted by one) at negative edges. In external clock mode 1 (USICS0 = 1) the opposite edges with respect to mode 0 are used. In other words, data is sampled at negative and changes the output at positive edges. The USI clock modes corresponds to the SPI data mode 0 and 1. Referring to the timing diagram (Figure 14-3), a bus transfer involves the following steps: 1. The slave and master devices set up their data outputs and, depending on the protocol used, enable their output drivers (mark A and B). The output is set up by writing the data to be transmitted to the USI Data Register. The output is enabled by setting the corresponding bit in the Data Direction Register of Port A. Note that there is not a preferred order of points A and B in the figure, but both must be at least one half USCK cycle before point C, where the data is sampled. This is in order to ensure that the data setup requirement is satisfied. The 4-bit counter is reset to zero. 2. The master software generates a clock pulse by toggling the USCK line twice (C and D). The bit values on the data input (DI) pins are sampled by the USI on the first edge (C), and the data output is changed on the opposite edge (D). The 4-bit counter will count both edges. 3. Step 2. is repeated eight times for a complete register (byte) transfer. 4. After eight clock pulses (i.e., 16 clock edges) the counter will overflow and indicate that the transfer has been completed. If USI Buffer Registers are not used the data bytes that have been transferred must now be processed before a new transfer can be initiated. The overflow interrupt will wake up the processor if it is set to Idle mode. Depending of the protocol used the slave device can now set its output to high impedance. 14.3.2 SPI Master Operation Example The following code demonstrates how to use the USI module as a SPI Master: SPITransfer: out USIDR,r16 ldi r16,(1<<USIOIF) out USISR,r16 ldi r17,(1<<USIWM0)|(1<<USICS1)|(1<<USICLK)|(1<<USITC) SPITransfer_loop: out USICR,r17 in r16, USISR 119 8006G–AVR–01/08 sbrs r16, USIOIF rjmp SPITransfer_loop in r16,USIDR ret The code is size optimized using only eight instructions (plus return). The code example assumes that the DO and USCK pins have been enabled as outputs in DDRA. The value stored in register r16 prior to the function is called is transferred to the slave device, and when the transfer is completed the data received from the slave is stored back into the register r16. The second and third instructions clear the USI Counter Overflow Flag and the USI counter value. The fourth and fifth instructions set three-wire mode, positive edge clock, count at USITC strobe, and toggle USCK. The loop is repeated 16 times. The following code demonstrates how to use the USI as an SPI master with maximum speed (fSCK = fCK/2): SPITransfer_Fast: out USIDR,r16 ldi r16,(1<<USIWM0)|(0<<USICS0)|(1<<USITC) ldi r17,(1<<USIWM0)|(0<<USICS0)|(1<<USITC)|(1<<USICLK) out USICR,r16 ; MSB out USICR,r17 out USICR,r16 out USICR,r17 out USICR,r16 out USICR,r17 out USICR,r16 out USICR,r17 out USICR,r16 out USICR,r17 out USICR,r16 out USICR,r17 out USICR,r16 out USICR,r17 out USICR,r16 ; LSB out USICR,r17 in r16,USIDR ret 14.3.3 SPI Slave Operation Example The following code demonstrates how to use the USI module as a SPI Slave: init: 120 ldi r16,(1<<USIWM0)|(1<<USICS1) out USICR,r16 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 ... SlaveSPITransfer: out USIDR,r16 ldi r16,(1<<USIOIF) out USISR,r16 SlaveSPITransfer_loop: in r16, USISR sbrs r16, USIOIF rjmp SlaveSPITransfer_loop in r16,USIDR ret The code is size optimized using only eight instructions (plus return). The code example assumes that the DO and USCK pins have been enabled as outputs in DDRA. The value stored in register r16 prior to the function is called is transferred to the master device, and when the transfer is completed the data received from the master is stored back into the register r16. Note that the first two instructions is for initialization, only, and need only be executed once. These instructions set three-wire mode and positive edge clock. The loop is repeated until the USI Counter Overflow Flag is set. 14.3.4 Two-wire Mode The USI two-wire mode is compliant to the Inter IC (TWI) bus protocol, but without slew rate limiting on outputs and without input noise filtering. Pin names used in this mode are SCL and SDA. Figure 14-4. Two-wire Mode Operation, Simplified Diagram VCC Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 SDA Bit0 SCL HOLD SCL Two-wire Clock Control Unit SLAVE Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 SDA Bit0 SCL PORTxn MASTER 121 8006G–AVR–01/08 Figure 14-4 shows two USI units operating in two-wire mode, one as master and one as slave. It is only the physical layer that is shown since the system operation is highly dependent of the communication scheme used. The main differences between the master and slave operation at this level is the serial clock generation which is always done by the master. Only the slave uses the clock control unit. Clock generation must be implemented in software, but the shift operation is done automatically in both devices. Note that clocking only on negative edges for shifting data is of practical use in this mode. The slave can insert wait states at start or end of transfer by forcing the SCL clock low. This means that the master must always check if the SCL line was actually released after it has generated a positive edge. Since the clock also increments the counter, a counter overflow can be used to indicate that the transfer is completed. The clock is generated by the master by toggling the USCK pin via the PORTA register. The data direction is not given by the physical layer. A protocol, like the one used by the TWIbus, must be implemented to control the data flow. Figure 14-5. Two-wire Mode, Typical Timing Diagram SDA SCL S A B 1-7 8 9 1-8 9 1-8 9 ADDRESS R/W ACK DATA ACK DATA ACK C D E P F Referring to the timing diagram (Figure 14-5), a bus transfer involves the following steps: 1. The start condition is generated by the master by forcing the SDA low line while keeping the SCL line high (A). SDA can be forced low either by writing a zero to bit 7 of the USI Data Register, or by setting the corresponding bit in the PORTA register to zero. Note that the Data Direction Register bit must be set to one for the output to be enabled. The start detector logic of the slave device (see Figure 14-6 on page 123) detects the start condition and sets the USISIF Flag. The flag can generate an interrupt if necessary. 2. In addition, the start detector will hold the SCL line low after the master has forced a negative edge on this line (B). This allows the slave to wake up from sleep or complete other tasks before setting up the USI Data Register to receive the address. This is done by clearing the start condition flag and resetting the counter. 3. The master set the first bit to be transferred and releases the SCL line (C). The slave samples the data and shifts it into the USI Data Register at the positive edge of the SCL clock. 4. After eight bits containing slave address and data direction (read or write) have been transferred, the slave counter overflows and the SCL line is forced low (D). If the slave is not the one the master has addressed, it releases the SCL line and waits for a new start condition. 5. When the slave is addressed, it holds the SDA line low during the acknowledgment cycle before holding the SCL line low again (i.e., the USI Counter Register must be set to 14 before releasing SCL at (D)). Depending on the R/W bit the master or slave 122 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 enables its output. If the bit is set, a master read operation is in progress (i.e., the slave drives the SDA line) The slave can hold the SCL line low after the acknowledge (E). 6. Multiple bytes can now be transmitted, all in same direction, until a stop condition is given by the master (F), or a new start condition is given. If the slave is not able to receive more data it does not acknowledge the data byte it has last received. When the master does a read operation it must terminate the operation by forcing the acknowledge bit low after the last byte transmitted. 14.3.5 Start Condition Detector The start condition detector is shown in Figure 14-6. The SDA line is delayed (in the range of 50 to 300 ns) to ensure valid sampling of the SCL line. The start condition detector is only enabled in two-wire mode. Figure 14-6. Start Condition Detector, Logic Diagram USISIF D Q D Q CLR CLR SDA CLOCK HOLD SCL Write( USISIF) The start condition detector is working asynchronously and can therefore wake up the processor from power-down sleep mode. However, the protocol used might have restrictions on the SCL hold time. Therefore, when using this feature the oscillator start-up time (set by CKSEL fuses, see “Clock Systems and their Distribution” on page 23) must also be taken into consideration. Refer to the description of the USISIF bit on page 125 for further details. 14.3.6 14.4 Clock speed considerations Maximum frequency for SCL and SCK is fCK / 2. This is also the maximum data transmit and receive rate in both two- and three-wire mode. In two-wire slave mode the Two-wire Clock Control Unit will hold the SCL low until the slave is ready to receive more data. This may reduce the actual data rate in two-wire mode. Alternative USI Usage The flexible design of the USI allows it to be used for other tasks when serial communication is not needed. Below are some examples. 14.4.1 Half-Duplex Asynchronous Data Transfer Using the USI Data Register in three-wire mode it is possible to implement a more compact and higher performance UART than by software, only. 14.4.2 4-Bit Counter The 4-bit counter can be used as a stand-alone counter with overflow interrupt. Note that if the counter is clocked externally, both clock edges will increment the counter value. 14.4.3 12-Bit Timer/Counter Combining the 4-bit USI counter with one of the 8-bit timer/counters creates a 12-bit counter. 123 8006G–AVR–01/08 14.4.4 Edge Triggered External Interrupt By setting the counter to maximum value (F) it can function as an additional external interrupt. The Overflow Flag and Interrupt Enable bit are then used for the external interrupt. This feature is selected by the USICS1 bit. 14.4.5 Software Interrupt The counter overflow interrupt can be used as a software interrupt triggered by a clock strobe. 14.5 14.5.1 Register Descriptions USIDR – USI Data Register Bit 7 6 5 4 3 2 1 0 0x0F (0x2F) MSB LSB Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 USIDR The USI Data Register can be accessed directly but a copy of the data can also be found in the USI Buffer Register. Depending on the USICS1:0 bits of the USI Control Register a (left) shift operation may be performed. The shift operation can be synchronised to an external clock edge, to a Timer/Counter0 Compare Match, or directly to software via the USICLK bit. If a serial clock occurs at the same cycle the register is written, the register will contain the value written and no shift is performed. Note that even when no wire mode is selected (USIWM1:0 = 0) both the external data input (DI/SDA) and the external clock input (USCK/SCL) can still be used by the USI Data Register. The output pin (DO or SDA, depending on the wire mode) is connected via the output latch to the most significant bit (bit 7) of the USI Data Register. The output latch ensures that data input is sampled and data output is changed on opposite clock edges. The latch is open (transparent) during the first half of a serial clock cycle when an external clock source is selected (USICS1 = 1) and constantly open when an internal clock source is used (USICS1 = 0). The output will be changed immediately when a new MSB is written as long as the latch is open. Note that the Data Direction Register bit corresponding to the output pin must be set to one in order to enable data output from the USI Data Register. 14.5.2 USIBR – USI Data Buffer Bit 7 6 5 4 3 2 1 0 0x10 (0x30) MSB LSB Read/Write R R R R R R R R Initial Value 0 0 0 0 0 0 0 0 USIBR Instead of reading data from the USI Data Register the USI Buffer Register can be used. This makes controlling the USI less time critical and gives the CPU more time to handle other program tasks. USI flags as set similarly as when reading the USIDR register. The content of the USI Data Register is loaded to the USI Buffer Register when the transfer has been completed. 124 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 14.5.3 USISR – USI Status Register Bit 7 6 5 4 3 2 1 0 0x0E (0x2E) USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 Read/Write R/W R/W R/W R R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 USISR The Status Register contains interrupt flags, line status flags and the counter value. • Bit 7 – USISIF: Start Condition Interrupt Flag When two-wire mode is selected, the USISIF Flag is set (to one) when a start condition has been detected. When three-wire mode or output disable mode has been selected any edge on the SCK pin will set the flag. If USISIE bit in USICR and the Global Interrupt Enable Flag are set, an interrupt will be generated when this flag is set. The flag will only be cleared by writing a logical one to the USISIF bit. Clearing this bit will release the start detection hold of USCL in two-wire mode. A start condition interrupt will wakeup the processor from all sleep modes. • Bit 6 – USIOIF: Counter Overflow Interrupt Flag This flag is set (one) when the 4-bit counter overflows (i.e., at the transition from 15 to 0). If the USIOIE bit in USICR and the Global Interrupt Enable Flag are set an interrupt will also be generated when the flag is set. The flag will only be cleared if a one is written to the USIOIF bit. Clearing this bit will release the counter overflow hold of SCL in two-wire mode. A counter overflow interrupt will wakeup the processor from Idle sleep mode. • Bit 5 – USIPF: Stop Condition Flag When two-wire mode is selected, the USIPF Flag is set (one) when a stop condition has been detected. The flag is cleared by writing a one to this bit. Note that this is not an interrupt flag. This signal is useful when implementing two-wire bus master arbitration. • Bit 4 – USIDC: Data Output Collision This bit is logical one when bit 7 in the USI Data Register differs from the physical pin value. The flag is only valid when two-wire mode is used. This signal is useful when implementing Two-wire bus master arbitration. • Bits 3:0 – USICNT3:0: Counter Value These bits reflect the current 4-bit counter value. The 4-bit counter value can directly be read or written by the CPU. The 4-bit counter increments by one for each clock generated either by the external clock edge detector, by a Timer/Counter0 Compare Match, or by software using USICLK or USITC strobe bits. The clock source depends on the setting of the USICS1:0 bits. For external clock operation a special feature is added that allows the clock to be generated by writing to the USITC strobe bit. This feature is enabled by choosing an external clock source (USICS1 = 1) and writing a one to the USICLK bit. Note that even when no wire mode is selected (USIWM1..0 = 0) the external clock input (USCK/SCL) can still be used by the counter. 125 8006G–AVR–01/08 14.5.4 USICR – USI Control Register The USI Control Register includes bits for interrupt enable, setting the wire mode, selecting the clock and clock strobe. • Bit 7 – USISIE: Start Condition Interrupt Enable Setting this bit to one enables the start condition detector interrupt. If there is a pending interrupt and USISIE and the Global Interrupt Enable Flag are set to one the interrupt will be executed immediately. Refer to the USISIF bit description on page 125 for further details. • Bit 6 – USIOIE: Counter Overflow Interrupt Enable Setting this bit to one enables the counter overflow interrupt. If there is a pending interrupt and USIOIE and the Global Interrupt Enable Flag are set to one the interrupt will be executed immediately. Refer to the USIOIF bit description on page 125 for further details. • Bit 5:4 – USIWM1:0: Wire Mode These bits set the type of wire mode to be used, as shown in in Table 14-1 below. Table 14-1. USIWM1 USIWM0 0 0 Outputs, clock hold, and start detector disabled. Port pins operates as normal. 1 Three-wire mode. Uses DO, DI, and USCK pins. The Data Output (DO) pin overrides the corresponding bit in the PORTA register. However, the corresponding DDRA bit still controls the data direction. When the port pin is set as input the pin pull-up is controlled by the PORTA bit. The Data Input (DI) and Serial Clock (USCK) pins do not affect the normal port operation. When operating as master, clock pulses are software generated by toggling the PORTA register, while the data direction is set to output. The USITC bit in the USICR Register can be used for this purpose. 0 Two-wire mode. Uses SDA (DI) and SCL (USCK) pins(1). The Serial Data (SDA) and the Serial Clock (SCL) pins are bi-directional and use open-collector output drives. The output drivers are enabled by setting the corresponding bit for SDA and SCL in the DDRA register. When the output driver is enabled for the SDA pin, the output driver will force the line SDA low if the output of the USI Data Register or the corresponding bit in the PORTA register is zero. Otherwise, the SDA line will not be driven (i.e., it is released). When the SCL pin output driver is enabled the SCL line will be forced low if the corresponding bit in the PORTA register is zero, or by the start detector. Otherwise the SCL line will not be driven. The SCL line is held low when a start detector detects a start condition and the output is enabled. Clearing the Start Condition Flag (USISIF) releases the line. The SDA and SCL pin inputs is not affected by enabling this mode. Pull-ups on the SDA and SCL port pin are disabled in Two-wire mode. 1 Two-wire mode. Uses SDA and SCL pins. Same operation as in two-wire mode above, except that the SCL line is also held low when a counter overflow occurs, and is held low until the Counter Overflow Flag (USIOIF) is cleared. 0 1 1 Note: 126 Relationship between USIWM1..0 and USI Operation Description 1. The DI and USCK pins are renamed to Serial Data (SDA) and Serial Clock (SCL) respectively to avoid confusion between the modes of operation. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Basically only the function of the outputs are affected by these bits. Data and clock inputs are not affected by the mode selected and will always have the same function. The counter and USI Data Register can therefore be clocked externally and data input sampled, even when outputs are disabled. • Bit 3:2 – USICS1:0: Clock Source Select These bits set the clock source for the USI Data Register and counter. The data output latch ensures that the output is changed at the opposite edge of the sampling of the data input (DI/SDA) when using external clock source (USCK/SCL). When software strobe or Timer/Counter0 Compare Match clock option is selected, the output latch is transparent and therefore the output is changed immediately. Clearing the USICS1:0 bits enables software strobe option. When using this option, writing a one to the USICLK bit clocks both the USI Data Register and the counter. For external clock source (USICS1 = 1), the USICLK bit is no longer used as a strobe, but selects between external clocking and software clocking by the USITC strobe bit. Table 14-2 shows the relationship between the USICS1:0 and USICLK setting and clock source used for the USI Data Register and the 4-bit counter. Table 14-2. Relationship between the USICS1:0 and USICLK Setting USICS1 USICS0 USICLK Clock Source 4-bit Counter Clock Source 0 0 0 No Clock No Clock 0 0 1 Software clock strobe (USICLK) Software clock strobe (USICLK) 0 1 X Timer/Counter0 Compare Match Timer/Counter0 Compare Match 1 0 0 External, positive edge External, both edges 1 1 0 External, negative edge External, both edges 1 0 1 External, positive edge Software clock strobe (USITC) 1 1 1 External, negative edge Software clock strobe (USITC) • Bit 1 – USICLK: Clock Strobe Writing a one to this bit location strobes the USI Data Register to shift one step and the counter to increment by one, provided that the software clock strobe option has been selected by writing USICS1:0 bits to zero. The output will change immediately when the clock strobe is executed, i.e., during the same instruction cycle. The value shifted into the USI Data Register is sampled the previous instruction cycle. When an external clock source is selected (USICS1 = 1), the USICLK function is changed from a clock strobe to a Clock Select Register. Setting the USICLK bit in this case will select the USITC strobe bit as clock source for the 4-bit counter (see Table 14-2). The bit will be read as zero. • Bit 0 – USITC: Toggle Clock Port Pin Writing a one to this bit location toggles the USCK/SCL value either from 0 to 1, or from 1 to 0. The toggling is independent of the setting in the Data Direction Register, but if the PORT value is to be shown on the pin the corresponding DDR pin must be set as output (to one). This feature allows easy clock generation when implementing master devices. 127 8006G–AVR–01/08 When an external clock source is selected (USICS1 = 1) and the USICLK bit is set to one, writing to the USITC strobe bit will directly clock the 4-bit counter. This allows an early detection of when the transfer is done when operating as a master device. The bit will read as zero. 128 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 15. Analog Comparator The Analog Comparator compares the input values on the positive pin AIN0 and negative pin AIN1. When the voltage on the positive pin AIN0 is higher than the voltage on the negative pin AIN1, the Analog Comparator output, ACO, is set. The comparator can trigger a separate interrupt, exclusive to the Analog Comparator. The user can select Interrupt triggering on comparator output rise, fall or toggle. A block diagram of the comparator and its surrounding logic is shown in Figure 15-1. Figure 15-1. Analog Comparator Block Diagram BANDGAP REFERENCE ACBG ACME ADEN ACIC To T/C1 Capture Trigger MUX ADC MULTIPLEXER OUTPUT (1) Notes: 1. See Table 15-1 on page 129. See Figure 1-1 on page 2 and Table 10-9 on page 66 for Analog Comparator pin placement. 15.1 Analog Comparator Multiplexed Input When the Analog to Digital Converter (ADC) is configurated as single ended input channel, it is possible to select any of the ADC7..0 pins to replace the negative input to the Analog Comparator. The ADC multiplexer is used to select this input, and consequently, the ADC must be switched off to utilize this feature. If the Analog Comparator Multiplexer Enable bit (ACME in ADCSRB) is set and the ADC is switched off (ADEN in ADCSRA is zero), MUX1..0 in ADMUX select the input pin to replace the negative input to the Analog Comparator, as shown in Table 15-1. If ACME is cleared or ADEN is set, AIN1 is applied to the negative input to the Analog Comparator. Table 15-1. Analog Comparator Multiplexed Input ACME ADEN MUX4..0 Analog Comparator Negative Input 0 X XXXXX AIN1 1 1 XXXXX AIN1 1 0 00000 ADC0 1 0 00001 ADC1 1 0 00010 ADC2 1 0 00011 ADC3 129 8006G–AVR–01/08 Table 15-1. 15.2 15.2.1 Analog Comparator Multiplexed Input (Continued) ACME ADEN MUX4..0 Analog Comparator Negative Input 1 0 00100 ADC4 1 0 00101 ADC5 1 0 00110 ADC6 1 0 00111 ADC7 Register Description ADCSRB – ADC Control and Status Register B Bit 7 6 5 4 3 2 1 0 0x03 (0x23) BIN ACME – ADLAR – ADTS2 ADTS1 ADTS0 Read/Write R/W R/W R R/W R R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 ADCSRB • Bit 6 – ACME: Analog Comparator Multiplexer Enable When this bit is written logic one and the ADC is switched off (ADEN in ADCSRA is zero), the ADC multiplexer selects the negative input to the Analog Comparator. When this bit is written logic zero, AIN1 is applied to the negative input of the Analog Comparator. For a detailed description of this bit, see “Analog Comparator Multiplexed Input” on page 129. 15.2.2 ACSR – Analog Comparator Control and Status Register Bit 7 6 5 4 3 2 1 0 0x08 (0x28) ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 Read/Write R/W R/W R R/W R/W R/W R/W R/W Initial Value 0 0 N/A 0 0 0 0 0 ACSR • Bit 7 – ACD: Analog Comparator Disable When this bit is written logic one, the power to the Analog Comparator is switched off. This bit can be set at any time to turn off the Analog Comparator. This will reduce power consumption in Active and Idle mode. When changing the ACD bit, the Analog Comparator Interrupt must be disabled by clearing the ACIE bit in ACSR. Otherwise an interrupt can occur when the bit is changed. • Bit 6 – ACBG: Analog Comparator Bandgap Select When this bit is set, a fixed, internal bandgap reference voltage replaces the positive input to the Analog Comparator. When this bit is cleared, AIN0 is applied to the positive input of the Analog Comparator. • Bit 5 – ACO: Analog Comparator Output The output of the Analog Comparator is synchronized and then directly connected to ACO. The synchronization introduces a delay of 1 - 2 clock cycles. • Bit 4 – ACI: Analog Comparator Interrupt Flag This bit is set by hardware when a comparator output event triggers the interrupt mode defined by ACIS1 and ACIS0. The Analog Comparator interrupt routine is executed if the ACIE bit is set and the I-bit in SREG is set. ACI is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, ACI is cleared by writing a logic one to the flag. 130 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Bit 3 – ACIE: Analog Comparator Interrupt Enable When the ACIE bit is written logic one and the I-bit in the Status Register is set, the Analog Comparator interrupt is activated. When written logic zero, the interrupt is disabled. • Bit 2 – ACIC: Analog Comparator Input Capture Enable When written logic one, this bit enables the input capture function in Timer/Counter1 to be triggered by the Analog Comparator. The comparator output is in this case directly connected to the input capture front-end logic, making the comparator utilize the noise canceler and edge select features of the Timer/Counter1 Input Capture interrupt. When written logic zero, no connection between the Analog Comparator and the input capture function exists. To make the comparator trigger the Timer/Counter1 Input Capture inter-rupt, the ICIE1 bit in the Timer Interrupt Mask Register (TIMSK1) must be set. • Bits 1, 0 – ACIS1, ACIS0: Analog Comparator Interrupt Mode Select These bits determine which comparator events that trigger the Analog Comparator interrupt. The different settings are shown in Table 15-2. Table 15-2. ACIS1/ACIS0 Settings ACIS1 ACIS0 Interrupt Mode 0 0 Comparator Interrupt on Output Toggle. 0 1 Reserved 1 0 Comparator Interrupt on Falling Output Edge. 1 1 Comparator Interrupt on Rising Output Edge. When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be disabled by clearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt can occur when the bits are changed. 15.2.3 DIDR0 – Digital Input Disable Register 0 Bit 7 6 5 4 3 2 1 0 0x01 (0x21) ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 DIDR0 • Bits 2, 1– ADC2D, ADC1D: ADC 2/1 Digital input buffer disable When this bit is written logic one, the digital input buffer on the AIN1/0 pin is disabled. The corresponding PIN Register bit will always read as zero when this bit is set. When an analog signal is applied to the AIN1/0 pin and the digital input from this pin is not needed, this bit should be written logic one to reduce power consumption in the digital input buffer. 131 8006G–AVR–01/08 16. Analog to Digital Converter 16.1 Features • • • • • • • • • • • • • • • • • 16.2 10-bit Resolution 1.0 LSB Integral Non-linearity ± 2 LSB Absolute Accuracy 13µs Conversion Time 15 kSPS at Maximum Resolution Eight Multiplexed Single Ended Input Channels Twelve Differential Input Channels with Selectable Gain (1x, 20x) Temperature Sensor Input Channel Optional Left Adjustment for ADC Result Readout 0 - VCC ADC Input Voltage Range 1.1V ADC Reference Voltage Free Running or Single Conversion Mode ADC Start Conversion by Auto Triggering on Interrupt Sources Interrupt on ADC Conversion Complete Sleep Mode Noise Canceler Unipolar / Bipolar Input Mode Input Polarity Reversal channels Overview The ATtiny24/44/84 features a 10-bit successive approximation ADC. The ADC is connected to 8-pin port A for external sources. In addition to external sources internal temperature sensor can be measured by ADC. Analog Multiplexer allows eight single-ended channels or 12 differential channels from Port A. The programmable gain stage provides ampification steps 0 dB (1x) and 26 dB (20x) for 12 differential ADC channels. The ADC contains a Sample and Hold circuit which ensures that the input voltage to the ADC is held at a constant level during conversion. A block diagram of the ADC is shown in Figure 16-1 on page 133. Internal reference voltage of nominally 1.1V is provided On-chip. Alternatively, VCC can be used as reference voltage for single ended channels. There is also an option to use an external voltage reference and turn-off the internal voltage reference. 132 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 16-1. Analog to Digital Converter Block Schematic ADC CONVERSION COMPLETE IRQ INTERRUPT FLAGS ADTS2...ADTS0 AREF VCC INTERNAL REFERENCE 1.1V TRIGGER SELECT ADC[9:0] ADPS0 ADPS1 ADPS2 ADIF ADSC ADATE ADEN ADLAR MUX4...MUX0 0 ADC DATA REGISTER (ADCH/ADCL) MUX DECODER CHANNEL SELECTION REFS1..REFS0 BIN 15 ADC CTRL. & STATUS A REGISTER (ADCSRA) ADC MULTIPLEXER SELECT (ADMUX) PRESCALER START GAIN SELECTION ADC CTRL. & STATUS B REGISTER (ADCSRB) ADIE ADIF 8-BIT DATA BUS CONVERSION LOGIC TEMPERATURE SENSOR SAMPLE & HOLD COMPARATOR 10-BIT DAC ADC8 AGND + SINGLE ENDED / DIFFERENTIAL SELECTION ADC7 ADC MULTIPLEXER OUTPUT ADC6 ADC5 POS. INPUT MUX ADC4 + - ADC3 GAIN AMPLIFIER ADC2 ADC1 ADC0 NEG. INPUT MUX 16.3 ADC Operation The ADC converts an analog input voltage to a 10-bit digital value through successive approximation. The minimum value represents GND and the maximum value represents the reference voltage.The voltage reference for the ADC may be selected by writing to the REFS1..0 bits in ADMUX. The VCC supply, the AREF pin or an internal 1.1V voltage reference may be selected as the ADC voltage reference. The analog input channel and differential gain are selected by writing to the MUX5..0 bits in ADMUX. Any of the eight ADC input pins ADC7..0 can be selected as single ended inputs to the ADC. For differential measurements all analog inputs next to each other can be selected as a input pair. Every input is also possible to measure with ADC3. These pairs of differential inputs are measured by ADC trough the differential gain amplifier. 133 8006G–AVR–01/08 If differential channels are selected, the differential gain stage amplifies the voltage difference between the selected input pair by the selected gain factor, 1x or 20x, according to the setting of the MUX0 bit in ADMUX. This amplified value then becomes the analog input to the ADC. If single ended channels are used, the gain amplifier is bypassed altogether. The offset of the differential channels can be measure by selecting the same input for both negative and positive input. Offset calibration can be done for ADC0, ADC3 and ADC7. When ADC0 or ADC3 or ADC7 is selected as both the positive and negative input to the differential gain amplifier , the remaining offset in the gain stage and conversion circuitry can be measured directly as the result of the conversion. This figure can be subtracted from subsequent conversions with the same gain setting to reduce offset error to below 1 LSB. The on-chip temperature sensor is selected by writing the code “100010” to the MUX5..0 bits in ADMUX register. The ADC is enabled by setting the ADC Enable bit, ADEN in ADCSRA. Voltage reference and input channel selections will not go into effect until ADEN is set. The ADC does not consume power when ADEN is cleared, so it is recommended to switch off the ADC before entering power saving sleep modes. The ADC generates a 10-bit result which is presented in the ADC Data Registers, ADCH and ADCL. By default, the result is presented right adjusted, but can optionally be presented left adjusted by setting the ADLAR bit in ADCSRB. If the result is left adjusted and no more than 8-bit precision is required, it is sufficient to read ADCH. Otherwise, ADCL must be read first, then ADCH, to ensure that the content of the data registers belongs to the same conversion. Once ADCL is read, ADC access to data registers is blocked. This means that if ADCL has been read, and a conversion completes before ADCH is read, neither register is updated and the result from the conversion is lost. When ADCH is read, ADC access to the ADCH and ADCL Registers is re-enabled. The ADC has its own interrupt which can be triggered when a conversion completes. When ADC access to the data registers is prohibited between reading of ADCH and ADCL, the interrupt will trigger even if the result is lost. 16.4 Starting a Conversion A single conversion is started by writing a logical one to the ADC Start Conversion bit, ADSC. This bit stays high as long as the conversion is in progress and will be cleared by hardware when the conversion is completed. If a different data channel is selected while a conversion is in progress, the ADC will finish the current conversion before performing the channel change. Alternatively, a conversion can be triggered automatically by various sources. Auto Triggering is enabled by setting the ADC Auto Trigger Enable bit, ADATE in ADCSRA. The trigger source is selected by setting the ADC Trigger Select bits, ADTS in ADCSRB (see description of the ADTS bits for a list of the trigger sources). When a positive edge occurs on the selected trigger signal, the ADC prescaler is reset and a conversion is started. This provides a method of starting conversions at fixed intervals. If the trigger signal still is set when the conversion completes, a new conversion will not be started. If another positive edge occurs on the trigger signal during conversion, the edge will be ignored. Note that an Interrupt Flag will be set even if the specific interrupt is disabled or the Global Interrupt Enable bit in SREG is cleared. A conversion can thus be triggered without causing an interrupt. However, the Interrupt Flag must be cleared in order to trigger a new conversion at the next interrupt event. 134 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 16-2. ADC Auto Trigger Logic ADTS[2:0] PRESCALER START ADIF CLKADC ADATE SOURCE 1 . . . . CONVERSION LOGIC EDGE DETECTOR SOURCE n ADSC Using the ADC Interrupt Flag as a trigger source makes the ADC start a new conversion as soon as the ongoing conversion has finished. The ADC then operates in Free Running mode, constantly sampling and updating the ADC Data Register. The first conversion must be started by writing a logical one to the ADSC bit in ADCSRA. In this mode the ADC will perform successive conversions independently of whether the ADC Interrupt Flag, ADIF is cleared or not. If Auto Triggering is enabled, single conversions can be started by writing ADSC in ADCSRA to one. ADSC can also be used to determine if a conversion is in progress. The ADSC bit will be read as one during a conversion, independently of how the conversion was started. 16.5 Prescaling and Conversion Timing By default, the successive approximation circuitry requires an input clock frequency between 50 kHz and 200 kHz to get maximum resolution. If a lower resolution than 10 bits is needed, the input clock frequency to the ADC can be higher than 200 kHz to get a higher sample rate. It is not recommended to use a higher input clock frequency than 1 MHz. Figure 16-3. ADC Prescaler ADEN START Reset 7-BIT ADC PRESCALER CK/64 CK/128 CK/32 CK/8 CK/16 CK/4 CK/2 CK ADPS0 ADPS1 ADPS2 ADC CLOCK SOURCE 135 8006G–AVR–01/08 The ADC module contains a prescaler, which generates an acceptable ADC clock frequency from any CPU frequency above 100 kHz. The prescaling is set by the ADPS bits in ADCSRA. The prescaler starts counting from the moment the ADC is switched on by setting the ADEN bit in ADCSRA. The prescaler keeps running for as long as the ADEN bit is set, and is continuously reset when ADEN is low. When initiating a single ended conversion by setting the ADSC bit in ADCSRA, the conversion starts at the following rising edge of the ADC clock cycle. A normal conversion takes 13 ADC clock cycles. The first conversion after the ADC is switched on (ADEN in ADCSRA is set) takes 25 ADC clock cycles in order to initialize the analog circuitry, as shown in Figure 16-4 below. Figure 16-4. ADC Timing Diagram, First Conversion (Single Conversion Mode) Next Conversion First Conversion Cycle Number 1 2 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2 3 ADC Clock ADEN ADSC ADIF Sign and MSB of Result ADCH LSB of Result ADCL MUX and REFS Update Conversion Complete Sample & Hold MUX and REFS Update The actual sample-and-hold takes place 1.5 ADC clock cycles after the start of a normal conversion and 13.5 ADC clock cycles after the start of an first conversion. When a conversion is complete, the result is written to the ADC Data Registers, and ADIF is set. In Single Conversion mode, ADSC is cleared simultaneously. The software may then set ADSC again, and a new conversion will be initiated on the first rising ADC clock edge. Figure 16-5. ADC Timing Diagram, Single Conversion One Conversion Cycle Number 1 2 3 4 5 6 7 8 9 Next Conversion 10 11 12 13 1 2 3 ADC Clock ADSC ADIF ADCH Sign and MSB of Result ADCL LSB of Result Sample & Hold MUX and REFS Update 136 Conversion Complete MUX and REFS Update ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 When Auto Triggering is used, the prescaler is reset when the trigger event occurs, as shown in Figure 16-6 below. This assures a fixed delay from the trigger event to the start of conversion. In this mode, the sample-and-hold takes place two ADC clock cycles after the rising edge on the trigger source signal. Three additional CPU clock cycles are used for synchronization logic. Figure 16-6. ADC Timing Diagram, Auto Triggered Conversion One Conversion 1 Cycle Number 2 3 4 5 6 7 8 Next Conversion 10 9 11 12 13 1 2 ADC Clock Trigger Source ADATE ADIF ADCH Sign and MSB of Result ADCL LSB of Result Prescaler Reset Sample & Hold Prescaler Reset Conversion Complete MUX and REFS Update In Free Running mode, a new conversion will be started immediately after the conversion completes, while ADSC remains high. Figure 16-7. ADC Timing Diagram, Free Running Conversion One Conversion Cycle Number 12 13 Next Conversion 14 1 2 3 4 ADC Clock ADSC ADIF ADCH Sign and MSB of Result ADCL LSB of Result Conversion Complete Sample & Hold MUX and REFS Update 137 8006G–AVR–01/08 For a summary of conversion times, see Table 16-1. Table 16-1. ADC Conversion Time Condition Sample & Hold (Cycles from Start of Conversion) First conversion 13.5 25 Normal conversions 1.5 13 2 13.5 2.5 14 Auto Triggered conversions Free Running conversion 16.6 Conversion Time (Cycles) Changing Channel or Reference Selection The MUX5:0 and REFS1:0 bits in the ADMUX Register are single buffered through a temporary register to which the CPU has random access. This ensures that the channels and reference selection only takes place at a safe point during the conversion. The channel and reference selection is continuously updated until a conversion is started. Once the conversion starts, the channel and reference selection is locked to ensure a sufficient sampling time for the ADC. Continuous updating resumes in the last ADC clock cycle before the conversion completes (ADIF in ADCSRA is set). Note that the conversion starts on the following rising ADC clock edge after ADSC is written. The user is thus advised not to write new channel or reference selection values to ADMUX until one ADC clock cycle after ADSC is written. If Auto Triggering is used, the exact time of the triggering event can be indeterministic. Special care must be taken when updating the ADMUX Register, in order to control which conversion will be affected by the new settings. If both ADATE and ADEN is written to one, an interrupt event can occur at any time. If the ADMUX Register is changed in this period, the user cannot tell if the next conversion is based on the old or the new settings. ADMUX can be safely updated in the following ways: • When ADATE or ADEN is cleared. • During conversion, minimum one ADC clock cycle after the trigger event. • After a conversion, before the Interrupt Flag used as trigger source is cleared. When updating ADMUX in one of these conditions, the new settings will affect the next ADC conversion. 16.6.1 ADC Input Channels When changing channel selections, the user should observe the following guidelines to ensure that the correct channel is selected: In Single Conversion mode, always select the channel before starting the conversion. The channel selection may be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the conversion to complete before changing the channel selection. In Free Running mode, always select the channel before starting the first conversion. The channel selection may be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the first conversion to complete, and then change the channel 138 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 selection. Since the next conversion has already started automatically, the next result will reflect the previous channel selection. Subsequent conversions will reflect the new channel selection. 16.6.2 16.7 ADC Voltage Reference The reference voltage for the ADC (VREF) indicates the conversion range for the ADC. Single ended channels that exceed VREF will result in codes close to 0x3FF. VREF can be selected as either VCC, or internal 1.1V reference, or external AREF pin. The first ADC conversion result after switching reference voltage source may be inaccurate, and the user is advised to discard this result. ADC Noise Canceler The ADC features a noise canceler that enables conversion during sleep mode to reduce noise induced from the CPU core and other I/O peripherals. The noise canceler can be used with ADC Noise Reduction and Idle mode. To make use of this feature, the following procedure should be used: • Make sure that the ADC is enabled and is not busy converting. Single Conversion mode must be selected and the ADC conversion complete interrupt must be enabled. • Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conversion once the CPU has been halted. • If no other interrupts occur before the ADC conversion completes, the ADC interrupt will wake up the CPU and execute the ADC Conversion Complete interrupt routine. If another interrupt wakes up the CPU before the ADC conversion is complete, that interrupt will be executed, and an ADC Conversion Complete interrupt request will be generated when the ADC conversion completes. The CPU will remain in active mode until a new sleep command is executed. Note that the ADC will not automatically be turned off when entering other sleep modes than Idle mode and ADC Noise Reduction mode. The user is advised to write zero to ADEN before entering such sleep modes to avoid excessive power consumption. 16.8 Analog Input Circuitry The analog input circuitry for single ended channels is illustrated in Figure 16-8 on page 140. An analog source applied to ADCn is subjected to the pin capacitance and input leakage of that pin, regardless of whether that channel is selected as input for the ADC. When the channel is selected, the source must drive the S/H capacitor through the series resistance (combined resistance in the input path). The ADC is optimized for analog signals with an output impedance of approximately 10kΩ or less. If such a source is used, the sampling time will be negligible. If a source with higher impedance is used, the sampling time will depend on how long time the source needs to charge the S/H capacitor, which can vary widely. With slowly varying signals the user is recommended to use sources with low impedance, only, since this minimizes the required charge transfer to the S/H capacitor. Signal components higher than the Nyquist frequency (fADC/2) should not be present to avoid distortion from unpredictable signal convolution. The user is advised to remove high frequency components with a low-pass filter before applying the signals as inputs to the ADC. 139 8006G–AVR–01/08 Figure 16-8. Analog Input Circuitry IIH ADCn 1..100 kohm CS/H = 14 pF IIL VCC/2 Note: 16.9 The capacitor in the figure depicts the total capacitance, including the sample/hold capacitor and any stray or parasitic capacitance inside the device. The value given is worst case. Noise Canceling Techniques Digital circuitry inside and outside the device generates EMI which might affect the accuracy of analog measurements. When conversion accuracy is critical, the noise level can be reduced by applying the following techniques: • Keep analog signal paths as short as possible. • Make sure analog tracks run over the analog ground plane. • Keep analog tracks well away from high-speed switching digital tracks. • If any port pin is used as a digital output, it mustn’t switch while a conversion is in progress. • Place bypass capacitors as close to VCC and GND pins as possible. Where high ADC accuracy is required it is recommended to use ADC Noise Reduction Mode, as described in Section 16.7 on page 139. This is especially the case when system clock frequency is above 1 MHz, or when the ADC is used for reading the internal temperature sensor, as described in Section 16.12 on page 144. A good system design with properly placed, external bypass capacitors does reduce the need for using ADC Noise Reduction Mode 16.10 ADC Accuracy Definitions An n-bit single-ended ADC converts a voltage linearly between GND and V REF in 2 n steps (LSBs). The lowest code is read as 0, and the highest code is read as 2n-1. Several parameters describe the deviation from the ideal behavior: 140 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Offset: The deviation of the first transition (0x000 to 0x001) compared to the ideal transition (at 0.5 LSB). Ideal value: 0 LSB. Figure 16-9. Offset Error Output Code Ideal ADC Actual ADC Offset Error VREF Input Voltage • Gain Error: After adjusting for offset, the Gain Error is found as the deviation of the last transition (0x3FE to 0x3FF) compared to the ideal transition (at 1.5 LSB below maximum). Ideal value: 0 LSB Figure 16-10. Gain Error Output Code Gain Error Ideal ADC Actual ADC VREF Input Voltage 141 8006G–AVR–01/08 • Integral Non-linearity (INL): After adjusting for offset and gain error, the INL is the maximum deviation of an actual transition compared to an ideal transition for any code. Ideal value: 0 LSB. Figure 16-11. Integral Non-linearity (INL) Output Code INL Ideal ADC Actual ADC VREF Input Voltage • Differential Non-linearity (DNL): The maximum deviation of the actual code width (the interval between two adjacent transitions) from the ideal code width (1 LSB). Ideal value: 0 LSB. Figure 16-12. Differential Non-linearity (DNL) Output Code 0x3FF 1 LSB DNL 0x000 0 142 VREF Input Voltage ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 • Quantization Error: Due to the quantization of the input voltage into a finite number of codes, a range of input voltages (1 LSB wide) will code to the same value. Always ± 0.5 LSB. • Absolute Accuracy: The maximum deviation of an actual (unadjusted) transition compared to an ideal transition for any code. This is the compound effect of offset, gain error, differential error, non-linearity, and quantization error. Ideal value: ± 0.5 LSB. 16.11 ADC Conversion Result After the conversion is complete (ADIF is high), the conversion result can be found in the ADC Result Registers (ADCL, ADCH). The form of the conversion result depends on the type of the conversio as there are three types of conversions: single ended conversion, unipolar differential conversion and bipolar differential conversion. 16.11.1 Single Ended Conversion For single ended conversion, the result is V IN ⋅ 1024 ADC = -------------------------V REF where VIN is the voltage on the selected input pin and VREF the selected voltage reference (see Table 16-3 on page 145 and Table 16-4 on page 146). 0x000 represents analog ground, and 0x3FF represents the selected reference voltage minus one LSB. The result is presented in onesided form, from 0x3FF to 0x000. 16.11.2 Unipolar Differential Conversion If differential channels and an unipolar input mode are used, the result is ( V POS – V NEG ) ⋅ 1024 ADC = -------------------------------------------------------- ⋅ GAIN V REF where VPOS is the voltage on the positive input pin, VNEG the voltage on the negative input pin, and VREF the selected voltage reference. The voltage of the positive pin must always be larger than the voltage of the negative pin or otherwise the voltage difference is saturated to zero. The result is presented in one-sided form, from 0x000 (0d) through 0x3FF (+1023d). The GAIN is either 1x or 20x. 16.11.3 Bipolar Differential Conversion If differential channels and a bipolar input mode are used, the result is ( V POS – V NEG ) ⋅ 512 ADC = ----------------------------------------------------- ⋅ GAIN V REF where VPOS is the voltage on the positive input pin, VNEG the voltage on the negative input pin, and VREF the selected voltage reference. The result is presented in two’s complement form, from 0x200 (-512d) through 0x1FF (+511d). The GAIN is either 1x or 20x. Note that if the user wants to perform a quick polarity check of the result, it is sufficient to read the MSB of the result (ADC9 in ADCH). If the bit is one, the result is negative, and if this bit is zero, the result is positive. 143 8006G–AVR–01/08 As default the ADC converter operates in the unipolar input mode, but the bipolar input mode can be selected by writting the BIN bit in the ADCSRB to one. In the bipolar input mode twosided voltage differences are allowed and thus the voltage on the negative input pin can also be larger than the voltage on the positive input pin. 16.12 Temperature Measurement The temperature measurement is based on an on-chip temperature sensor that is coupled to a single ended ADC8 channel. Selecting the ADC8 channel by writing the MUX5:0 bits in ADMUX register to “100010” enables the temperature sensor. The internal 1.1V reference must also be selected for the ADC reference source in the temperature sensor measurement. When the temperature sensor is enabled, the ADC converter can be used in single conversion mode to measure the voltage over the temperature sensor. The measured voltage has a linear relationship to the temperature as described in Table 16-2 The sensitivity is approximately 1 LSB / °C and the accuracy depends on the method of user calibration. Typically, the measurement accuracy after a single temperature calibration is ±10°C, assuming calibration at room temperature. Better accuracies are achieved by using two temperature points for calibration. Table 16-2. Temperature ADC Temperature vs. Sensor Output Voltage (Typical Case) -40 °C +25 °C +85 °C 230 LSB 300 LSB 370 LSB The values described in Table 16-2 are typical values. However, due to process variation the temperature sensor output voltage varies from one chip to another. To be capable of achieving more accurate results the temperature measurement can be calibrated in the application software. The sofware calibration can be done using the formula: T = k * [(ADCH << 8) | ADCL] + TOS where ADCH and ADCL are the ADC data registers, k is the fixed slope coefficient and TOS is the temperature sensor offset. Typically, k is very close to 1.0 and in single-point calibration the coefficient may be omitted. Where higher accuracy is required the slope coefficient should be evaluated based on measurements at two temperatures. 144 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 16.13 Register Description 16.13.1 ADMUX – ADC Multiplexer Selection Register Bit 7 6 5 4 3 2 1 0 0x07 (0x27) REFS1 REFS0 MUX5 MUX4 MUX3 MUX2 MUX1 MUX0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 ADMUX • Bit 7:6 – REFS1:REFS0: Reference Selection Bits These bits select the voltage reference for the ADC, as shown in Table 16-3. Table 16-3. Voltage Reference Selections for ADC REFS1 REFS0 Voltage Reference Selection 0 0 VCC used as analog reference, disconnected from PA0 (AREF) 0 1 External voltage reference at PA0 (AREF) pin. Internal voltage reference turned off 1 0 Internal 1.1V voltage reference 1 1 Reserved If these bits are changed during a conversion, the change will not go in effect until this conversion is complete (ADIF in ADCSR is set). Special care should be taken when changing differential channels. Once a differential channel has been selected the input stage may take a while to stabilize. It is therefore recommended to force the ADC to perform a long conversion when changing multiplexer or voltage reference settings. This can be done by first turning off the ADC, then changing reference settings and then turn on the ADC. Alternatively, the first conversion results after changing reference settings should be discarded. If channels where differential gain is used ie. the gainstage, using VCC or an optional external AREF higher than (VCC - 1V) is not recommended, as this will affect ADC accuracy. • Bits 5:0 – MUX5:0: Analog Channel and Gain Selection Bits The value of these bits selects which combination of analog inputs are connected to the ADC. In case of differential input, gain selection is also made with these bits. Selections on Table 16-4 on page 146 show values for single endid channels and where the differential channels as well as the offset calibration selections are located. Selecting the single-ended channel ADC8 enables the temperature measurement. See Table 16-4 on page 146 for details. If these bits are changed during a conversion, the change will not go into effect until this conversion is complete (ADIF in ADCSRA is set). Special care should be taken when changing differential channels. Once a differential channel has been selected the input stage may take a while to stabilize. It is therefore recommended to force the ADC to perform a long conversion when changing multiplexer settings. This can be 145 8006G–AVR–01/08 done by first turning off the ADC, then changing multiplexer settings and then turn on the ADC. Alternatively, the first conversion results after changing multiplexer settings should be discarded. Table 16-4. Single-Ended Input channel Selections. Single Ended Input MUX5..0 ADC0 (PA0) 000000 ADC1 (PA1) 000001 ADC2 (PA2) 000010 ADC3 (PA3) 000011 ADC4 (PA4) 000100 ADC5 (PA5) 000101 ADC6 (PA6) 000110 ADC7 (PA7) 000111 Reserved for differential channels(1) 001000 - 011111 0V (AGND) 100000 1.1V (I Ref) 100001 ADC8 (2) 100010 Reserved for offset calibration(3) 100011 - 100111 Reserved for reversal differential channels Notes: (1) 101000 - 111111 1. See Table 16-5 on page 146 for details. 2. “Temperature Measurement” on page 144 3. For offset calibration only .See Table 16-5 on page 146 and “ADC Operation” on page 133 See Table 16-5 on page 146 for details of selections of differential input channel selections as well as selections of offset calibration channels. MUX0 bit works as a gain selection bit for differential channels shown in Table 16-5. When MUX0 bit is cleared (‘0’) 1x gain is selected and when it is set (‘1’) 20x gain is selected. For normal differential channel pairs MUX5 bit work as a polarity reversal bit. Toggling of the MUX5 bit exhanges the positive and negative channel other way a round. Table 16-5. Differential Input channel Selections. Positive Differential Input Negative Differential Input Gain 1x Gain 20x N/A 100011 ADC1 (PA1) 001000 001001 ADC3 (PA3) 001010 001011 ADC0 (PA0) 101000 101001 ADC2 (PA2) 001100 001101 ADC3 (PA3) 001110 001111 ADC1 (PA1) 101100 101101 ADC3 (PA3) 010000 010001 ADC0 (PA0) ADC0 (PA0) ADC1 (PA1) MUX5..0 (1) ADC2 (PA2) 146 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 16-5. Differential Input channel Selections. (Continued) Positive Differential Input MUX5..0 Negative Differential Input Gain 1x Gain 20x ADC0 (PA0) 101010 101011 ADC1 (PA1) 101110 101111 ADC2 (PA2) 110000 110001 ADC3 (PA3)(1) 100100 100101 ADC4 (PA4 010010 010011 ADC5 (PA5) 010100 010101 ADC6 (PA6) 010110 010111 ADC7 (PA7) 011000 011001 ADC3 (PA3) 110010 110011 ADC5 (PA5) 011010 011011 ADC3 (PA3) 110100 110101 ADC4 (PA4) 111010 111011 ADC6 (PA6) 011100 011101 ADC3 (PA3) 110110 110111 ADC5 (PA5) 111100 111101 ADC7 (PA7) 011110 011111 ADC3 (PA3) 111000 111001 ADC6 (PA6) 111110 111111 ADC7 (PA7)(1) 100110 100111 ADC3 (PA3) ADC4 (PA4) ADC5 (PA5) ADC6 (PA6) ADC7 (PA7) 1. For offset calibration only .See “ADC Operation” on page 133 For offset calibration purpose the offset of the certain differential channels can be measure by selecting the same input for both negative and positive input. This calibration can be done for ADC0, ADC3 and ADC7. “ADC Operation” on page 133 describes offset calibration in a more detailed level. 16.13.2 ADCSRA – ADC Control and Status Register A Bit 7 6 5 4 3 2 1 0 0x06 (0x26) ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 ADCSRA • Bit 7 – ADEN: ADC Enable Writing this bit to one enables the ADC. By writing it to zero, the ADC is turned off. Turning the ADC off while a conversion is in progress, will terminate this conversion. • Bit 6 – ADSC: ADC Start Conversion In Single Conversion mode, write this bit to one to start each conversion. In Free Running mode, write this bit to one to start the first conversion. The first conversion after ADSC has been written 147 8006G–AVR–01/08 after the ADC has been enabled, or if ADSC is written at the same time as the ADC is enabled, will take 25 ADC clock cycles instead of the normal 13. This first conversion performs initialization of the ADC. ADSC will read as one as long as a conversion is in progress. When the conversion is complete, it returns to zero. Writing zero to this bit has no effect. • Bit 5 – ADATE: ADC Auto Trigger Enable When this bit is written to one, Auto Triggering of the ADC is enabled. The ADC will start a conversion on a positive edge of the selected trigger signal. The trigger source is selected by setting the ADC Trigger Select bits, ADTS in ADCSRB. • Bit 4 – ADIF: ADC Interrupt Flag This bit is set when an ADC conversion completes and the data registers are updated. The ADC Conversion Complete Interrupt is executed if the ADIE bit and the I-bit in SREG are set. ADIF is cleared by hardware when executing the corresponding interrupt handling vector. Alternatively, ADIF is cleared by writing a logical one to the flag. Beware that if doing a Read-Modify-Write on ADCSRA, a pending interrupt can be disabled. This also applies if the SBI instruction is used. • Bit 3 – ADIE: ADC Interrupt Enable When this bit is written to one and the I-bit in SREG is set, the ADC Conversion Complete Interrupt is activated. • Bits 2:0 – ADPS2:0: ADC Prescaler Select Bits These bits determine the division factor between the system clock frequency and the input clock to the ADC. Table 16-6. 148 ADC Prescaler Selections ADPS2 ADPS1 ADPS0 Division Factor 0 0 0 2 0 0 1 2 0 1 0 4 0 1 1 8 1 0 0 16 1 0 1 32 1 1 0 64 1 1 1 128 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 16.13.3 16.13.3.1 ADCL and ADCH – ADC Data Register ADLAR = 0 Bit 15 14 13 12 11 10 9 8 0x05 (0x25) – – – – – – ADC9 ADC8 ADCH 0x04 (0x24) ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 ADCL 7 6 5 4 3 2 1 0 R R R R R R R R R R R R R R R R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write Initial Value 16.13.3.2 ADLAR = 1 Bit 15 14 13 12 11 10 9 8 0x05 (0x25) ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADCH 0x04 (0x24) ADC1 ADC0 – – – – – – ADCL 7 6 5 4 3 2 1 0 R R R R R R R R R R R R R R R R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write Initial Value When an ADC conversion is complete, the result is found in these two registers. When ADCL is read, the ADC Data Register is not updated until ADCH is read. Consequently, if the result is left adjusted and no more than 8-bit precision is required, it is sufficient to read ADCH. Otherwise, ADCL must be read first, then ADCH. The ADLAR bit in ADCSRB, and the MUXn bits in ADMUX affect the way the result is read from the registers. If ADLAR is set, the result is left adjusted. If ADLAR is cleared (default), the result is right adjusted. • ADC9:0: ADC Conversion Result These bits represent the result from the conversion, as detailed in “ADC Conversion Result” on page 143. 16.13.4 ADCSRB – ADC Control and Status Register B Bit 7 6 5 4 3 2 1 0 0x03 (0x23) BIN ACME – ADLAR – ADTS2 ADTS1 ADTS0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 ADCSRB • Bits 7 – BIN: Bipolar Input Mode The gain stage is working in the unipolar mode as default, but the bipolar mode can be selected by writing the BIN bit in the ADCSRB register. In the unipolar mode only one-sided conversions are supported and the voltage on the positive input must always be larger than the voltage on the negative input. Otherwise the result is saturated to the voltage reference. In the bipolar mode two-sided conversions are supported and the result is represented in the two’s complement form. In the unipolar mode the resolution is 10 bits and the bipolar mode the resolution is 9 bits + 1 sign bit. 149 8006G–AVR–01/08 • Bit 6 – ACME: Analog Comparator Multiplexer Enable See “ADCSRB – ADC Control and Status Register B” on page 130. • Bit 5 – Res: Reserved Bit This is a reserved bit in ATtiny24/44/84. For compatibility with future devices always write this bit to zero. • Bit 4 – ADLAR: ADC Left Adjust Result The ADLAR bit affects the presentation of the ADC conversion result in the ADC Data Register. Write one to ADLAR to left adjust the result. Otherwise, the result is right adjusted. Changing the ADLAR bit will affect the ADC Data Register immediately, regardless of any ongoing conversions. For a comple the description of this bit, see “ADCL and ADCH – ADC Data Register” on page 149. • Bit 3 – Res: Reserved Bit This bit is reserved bit in the ATtiny24/44/84 and will always read as what was wrote there. • Bits 2:0 – ADTS2:0: ADC Auto Trigger Source If ADATE in ADCSRA is written to one, the value of these bits selects which source will trigger an ADC conversion. If ADATE is cleared, the ADTS2:0 settings will have no effect. A conversion will be triggered by the rising edge of the selected Interrupt Flag. Note that switching from a trigger source that is cleared to a trigger source that is set, will generate a positive edge on the trigger signal. If ADEN in ADCSRA is set, this will start a conversion. Switching to Free Running mode (ADTS[2:0]=0) will not cause a trigger event, even if the ADC Interrupt Flag is set. Table 16-7. 16.13.5 ADC Auto Trigger Source Selections ADTS2 ADTS1 ADTS0 Trigger Source 0 0 0 Free Running mode 0 0 1 Analog Comparator 0 1 0 External Interrupt Request 0 0 1 1 Timer/Counter0 Compare Match A 1 0 0 Timer/Counter0 Overflow 1 0 1 Timer/Counter1 Compare Match B 1 1 0 Timer/Counter1 Overflow 1 1 1 Timer/Counter1 Capture Event DIDR0 – Digital Input Disable Register 0 Bit 7 6 5 4 3 2 1 0 0x01 (0x21) ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 DIDR0 • Bits 7..0 – ADC7D..ADC0D: ADC7..0 Digital Input Disable When a bit is written logic one, the digital input buffer on the corresponding ADC pin is disabled. The corresponding PIN register bit will always read as zero when this bit is set. When an analog signal is applied to the ADC7..0 pin and the digital input from this pin is not needed, this bit should be written logic one to reduce power consumption in the digital input buffer. 150 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 17. debugWIRE On-chip Debug System 17.1 Features • • • • • • • • • • 17.2 Complete Program Flow Control Emulates All On-chip Functions, Both Digital and Analog , except RESET Pin Real-time Operation Symbolic Debugging Support (Both at C and Assembler Source Level, or for Other HLLs) Unlimited Number of Program Break Points (Using Software Break Points) Non-intrusive Operation Electrical Characteristics Identical to Real Device Automatic Configuration System High-Speed Operation Programming of Non-volatile Memories Overview The debugWIRE On-chip debug system uses a One-wire, bi-directional interface to control the program flow, execute AVR instructions in the CPU and to program the different non-volatile memories. 17.3 Physical Interface When the debugWIRE Enable (DWEN) Fuse is programmed and Lock bits are unprogrammed, the debugWIRE system within the target device is activated. The RESET port pin is configured as a wire-AND (open-drain) bi-directional I/O pin with pull-up enabled and becomes the communication gateway between target and emulator. Figure 17-1 shows the schematic of a target MCU, with debugWIRE enabled, and the emulator connector. The system clock is not affected by debugWIRE and will always be the clock source selected by the CKSEL Fuses. Figure 17-1. The debugWIRE Setup 1.8 - 5.5V VCC dW dW(RESET) GND 151 8006G–AVR–01/08 When designing a system where debugWIRE will be used, the following must be observed: • Pull-Up resistor on the dW/(RESET) line must be in the range of 10k to 20 kΩ. However, the pull-up resistor is optional. • Connecting the RESET pin directly to VCC will not work. • Capacitors inserted on the RESET pin must be disconnected when using debugWire. • All external reset sources must be disconnected. 17.4 Software Break Points debugWIRE supports Program memory Break Points by the AVR Break instruction. Setting a Break Point in AVR Studio® will insert a BREAK instruction in the Program memory. The instruction replaced by the BREAK instruction will be stored. When program execution is continued, the stored instruction will be executed before continuing from the Program memory. A break can be inserted manually by putting the BREAK instruction in the program. The Flash must be re-programmed each time a Break Point is changed. This is automatically handled by AVR Studio through the debugWIRE interface. The use of Break Points will therefore reduce the Falsh Data retention. Devices used for debugging purposes should not be shipped to end customers. 17.5 Limitations of debugWIRE The debugWIRE communication pin (dW) is physically located on the same pin as External Reset (RESET). An External Reset source is therefore not supported when the debugWIRE is enabled. The debugWIRE system accurately emulates all I/O functions when running at full speed, i.e., when the program in the CPU is running. When the CPU is stopped, care must be taken while accessing some of the I/O Registers via the debugger (AVR Studio). See the debugWIRE documentation for detailed description of the limitations. The debugWIRE interface is asynchronous, which means that the debugger needs to synchronize to the system clock. If the system clock is changed by software (e.g. by writing CLKPS bits) communication via debugWIRE may fail. Also, clock frequencies below 100 kHz may cause communication problems. A programmed DWEN Fuse enables some parts of the clock system to be running in all sleep modes. This will increase the power consumption while in sleep. Thus, the DWEN Fuse should be disabled when debugWire is not used. 17.6 Register Description The following section describes the registers used with the debugWire. 17.6.1 DWDR – debugWire Data Register Bit 7 6 5 0x27 (0x47) 4 3 2 1 0 DWDR[7:0] DWDR Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 The DWDR Register provides a communication channel from the running program in the MCU to the debugger. This register is only accessible by the debugWIRE and can therefore not be used as a general purpose register in the normal operations. 152 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 18. Self-Programming the Flash The device provides a Self-Programming mechanism for downloading and uploading program code by the MCU itself. The Self-Programming can use any available data interface and associated protocol to read code and write (program) that code into the Program memory. The SPM instruction is disabled by default but it can be enabled by programming the SELFPRGEN fuse (to “0”). The Program memory is updated in a page by page fashion. Before programming a page with the data stored in the temporary page buffer, the page must be erased. The temporary page buffer is filled one word at a time using SPM and the buffer can be filled either before the Page Erase command or between a Page Erase and a Page Write operation: Alternative 1, fill the buffer before a Page Erase • Fill temporary page buffer • Perform a Page Erase • Perform a Page Write Alternative 2, fill the buffer after Page Erase • Perform a Page Erase • Fill temporary page buffer • Perform a Page Write If only a part of the page needs to be changed, the rest of the page must be stored (for example in the temporary page buffer) before the erase, and then be re-written. When using alternative 1, the Boot Loader provides an effective Read-Modify-Write feature which allows the user software to first read the page, do the necessary changes, and then write back the modified data. If alternative 2 is used, it is not possible to read the old data while loading since the page is already erased. The temporary page buffer can be accessed in a random sequence. It is essential that the page address used in both the Page Erase and Page Write operation is addressing the same page. 18.1 Performing Page Erase by SPM To execute Page Erase, set up the address in the Z-pointer, write “00000011” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored. The page address must be written to PCPAGE in the Z-register. Other bits in the Z-pointer will be ignored during this operation. Note: 18.2 The CPU is halted during the Page Erase operation. Filling the Temporary Buffer (Page Loading) To write an instruction word, set up the address in the Z-pointer and data in R1:R0, write “00000001” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The content of PCWORD in the Z-register is used to address the data in the temporary buffer. The temporary buffer will auto-erase after a Page Write operation or by writing the CTPB bit in SPMCSR. It is also erased after a system reset. Note that it is not possible to write more than one time to each address without erasing the temporary buffer. 153 8006G–AVR–01/08 If the EEPROM is written in the middle of an SPM Page Load operation, all data loaded will be lost. 18.3 Performing a Page Write To execute Page Write, set up the address in the Z-pointer, write “00000101” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored. The page address must be written to PCPAGE. Other bits in the Z-pointer must be written to zero during this operation. Note: 18.4 The CPU is halted during the Page Write operation. Addressing the Flash During Self-Programming The Z-pointer is used to address the SPM commands. Bit 15 14 13 12 11 10 9 8 ZH (R31) Z15 Z14 Z13 Z12 Z11 Z10 Z9 Z8 ZL (R30) Z7 Z6 Z5 Z4 Z3 Z2 Z1 Z0 7 6 5 4 3 2 1 0 Since the Flash is organized in pages (see Table 19-8 on page 162), the Program Counter can be treated as having two different sections. One section, consisting of the least significant bits, is addressing the words within a page, while the most significant bits are addressing the pages. This is shown in Figure 19-1 on page 163. Note that the Page Erase and Page Write operations are addressed independently. Therefore it is of major importance that the software addresses the same page in both the Page Erase and Page Write operation. The LPM instruction uses the Z-pointer to store the address. Since this instruction addresses the Flash byte-by-byte, also the LSB (bit Z0) of the Z-pointer is used. Figure 18-1. Addressing the Flash During SPM(1) BIT 15 ZPCMSB ZPAGEMSB Z - REGISTER 1 0 0 PCMSB PROGRAM COUNTER PAGEMSB PCPAGE PAGE ADDRESS WITHIN THE FLASH PROGRAM MEMORY PAGE PCWORD WORD ADDRESS WITHIN A PAGE PAGE INSTRUCTION WORD PCWORD[PAGEMSB:0]: 00 01 02 PAGEEND Note: 154 1. The variables used in Figure 18-1 are listed in Table 19-8 on page 162. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 18.5 EEPROM Write Prevents Writing to SPMCSR Note that an EEPROM write operation will block all software programming to Flash. Reading the Fuses and Lock bits from software will also be prevented during the EEPROM write operation. It is recommended that the user checks the status bit (EEPE) in the EECR Register and verifies that the bit is cleared before writing to the SPMCSR Register. 18.6 Reading Lock, Fuse and Signature Data from Software It is possible to read fuse and lock bits from firmware. In addition, firmware can also read data from the device signature imprint table (see page 161). Note: 18.6.1 Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that are unprogrammed, will be read as one. Reading Lock Bits from Firmware Issuing an LPM instruction within three CPU cycles after RFLB and SELFPRGEN bits have been set in SPMCSR will return lock bit values in the destination register. The RFLB and SELFPRGEN bits automatically clear upon completion of reading the lock bits, or if no LPM instruction is executed within three CPU cycles, or if no SPM instruction is executed within four CPU cycles. When RFLB and SELFPRGEN are cleared LPM functions normally. To read the lock bits, follow the below procedure: 1. Load the Z-pointer with 0x0001. 2. Set RFLB and SELFPRGEN bits in SPMCSR. 3. Issue an LPM instruction within three clock cycles. 4. Read the lock bits from the LPM destination register. If successful, the contents of the destination register are as follows. Bit 7 6 5 4 3 2 1 0 Rd – – – – – – LB2 LB1 See section “Program And Data Memory Lock Bits” on page 159 for more information. 18.6.2 Reading Fuse Bits from Firmware The algorithm for reading fuse bytes is similar to the one described above for reading lock bits, only the addresses are different. To read the Fuse Low Byte (FLB), follow the below procedure: 1. Load the Z-pointer with 0x0000. 2. Set RFLB and SELFPRGEN bits in SPMCSR. 3. Issue an LPM instruction within three clock cycles. 4. Read the FLB from the LPM destination register. If successful, the contents of the destination register are as follows. Bit 7 6 5 4 3 2 1 0 Rd FLB7 FLB6 FLB5 FLB4 FLB3 FLB2 FLB1 FLB0 Refer to Table 19-5 on page 161 for a detailed description and mapping of the Fuse Low Byte. 155 8006G–AVR–01/08 To read the Fuse High Byte (FHB), simply replace the address in the Z-pointer with 0x0003 and repeat the procedure above. If successful, the contents of the destination register are as follows. Bit 7 6 5 4 3 2 1 0 Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0 Refer to Table 19-4 on page 160 for detailed description and mapping of the Fuse High Byte. To read the Fuse Extended Byte (FEB), replace the address in the Z-pointer with 0x0002 and repeat the previous procedure. If successful, the contents of the destination register are as follows. Bit 7 6 5 4 3 2 1 0 Rd FEB7 FEB6 FEB5 FEB4 FEB3 FEB2 FEB1 FEB0 Refer to Table 19-3 on page 160 for detailed description and mapping of the Fuse Extended Byte. 18.6.3 Reading Device Signature Imprint Table from Firmware To read the contents of the device signature imprint table, follow the below procedure: 1. Load the Z-pointer with the table index. 2. Set RSIG and SPMEN bits in SPMCSR. 3. Issue an LPM instruction within three clock cycles. 4. Read table data from the LPM destination register. See program example below. Assembly Code Example(1) DSIT_read: ; Uses Z-pointer as table index ldi ZH, 0 ldi ZL, 1 ; Preload SPMCSR bits into R16, then write to SPMCSR ldi r16, (1<<RSIG)|(1<<SPMEN) out SPMCSR, r16 ; Issue LPM. Table data will be returned into r17 lpm r17, Z ret Note: 1. See “Code Examples” on page 6. If successful, the contents of the destination register are as described in section “Device Signature Imprint Table” on page 161. 156 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 18.7 Preventing Flash Corruption During periods of low VCC, the Flash program can be corrupted because the supply voltage is too low for the CPU and the Flash to operate properly. These issues are the same as for board level systems using the Flash, and the same design solutions should be applied. A Flash program corruption can be caused by two situations when the voltage is too low. First, a regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly, the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions is too low. Flash corruption can easily be avoided by following these design recommendations (one is sufficient): 1. Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be done by enabling the internal Brown-out Detector (BOD) if the operating voltage matches the detection level. If not, an external low VCC reset protection circuit can be used. If a reset occurs while a write operation is in progress, the write operation will be completed provided that the power supply voltage is sufficient. 2. Keep the AVR core in Power-down sleep mode during periods of low VCC. This will prevent the CPU from attempting to decode and execute instructions, effectively protecting the SPMCSR Register and thus the Flash from unintentional writes. 18.8 Programming Time for Flash when Using SPM The calibrated RC Oscillator is used to time Flash accesses. Table 18-1 shows the typical programming time for Flash accesses from the CPU. Table 18-1. Symbol Min Programming Time Max Programming Time Flash write (Page Erase, Page Write, and write Lock bits by SPM) 3.7 ms 4.5 ms Note: 18.9 18.9.1 SPM Programming Time(1) 1. The min and max programming times is per individual operation. Register Description SPMCSR – Store Program Memory Control and Status Register The Store Program Memory Control and Status Register contains the control bits needed to control the Program memory operations. Bit 7 6 5 4 3 2 1 0 0x37 (0x57) – – RSIG CTPB RFLB PGWRT PGERS SPMEN Read/Write R R R R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 SPMCSR • Bits 7..6 – Res: Reserved Bits These bits are reserved bits in ATtiny24/44/84 and always read as zero. • Bit 5 – RSIG: Read Device Signature Imprint Table Issuing an LPM instruction within three cycles after RSIG and SPMEN bits have been set in SPMCSR will return the selected data (depending on Z-pointer value) from the device signature 157 8006G–AVR–01/08 imprint table into the destination register. See “Device Signature Imprint Table” on page 161 for details. • Bit 4 – CTPB: Clear Temporary Page Buffer If the CTPB bit is written while filling the temporary page buffer, the temporary page buffer will be cleared and the data will be lost. • Bit 3 – RFLB: Read Fuse and Lock Bits An LPM instruction within three cycles after RFLB and SPMEN are set in the SPMCSR Register, will read either the Lock bits or the Fuse bits (depending on Z0 in the Z-pointer) into the destination register. See “EEPROM Write Prevents Writing to SPMCSR” on page 155 for details. • Bit 2 – PGWRT: Page Write If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock cycles executes Page Write, with the data stored in the temporary buffer. The page address is taken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGWRT bit will auto-clear upon completion of a Page Write, or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire Page Write operation. • Bit 1 – PGERS: Page Erase If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock cycles executes Page Erase. The page address is taken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGERS bit will auto-clear upon completion of a Page Erase, or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire Page Write operation. • Bit 0 – SPMEN: Store Program Memory Enable This bit enables the SPM instruction for the next four clock cycles. If set to one together with RSIG, CTPB, RFLB, PGWRT or PGERS, the following LPM/SPM instruction will have a special meaning, as described elsewhere. If only SPMEN is written, the following SPM instruction will store the value in R1:R0 in the temporary page buffer addressed by the Z-pointer. The LSB of the Z-pointer is ignored. The SPMEN bit will auto-clear upon completion of an SPM instruction, or if no SPM instruction is executed within four clock cycles. During Page Erase and Page Write, the SPMEN bit remains high until the operation is completed. 158 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 19. Memory Programming This section describes the different methods for Programming the ATtiny24/44/84 memories. 19.1 Program And Data Memory Lock Bits The ATtiny24/44/84 provides two Lock bits which can be left unprogrammed (“1”) or can be programmed (“0”) to obtain the additional security listed in Table 19-2 on page 159. The Lock bits can only be erased to “1” with the Chip Erase command. Program memory can be read out via the debugWIRE interface when the DWEN fuse is programmed, even if the Lock Bits are set. Thus, when Lock Bit security is required, should always debugWIRE be disabled by clearing the DWEN fuse. Table 19-1. Lock Bit Byte(1) Lock Bit Description Default Value 7 – 1 (unprogrammed) 6 – 1 (unprogrammed) 5 – 1 (unprogrammed) 4 – 1 (unprogrammed) 3 – 1 (unprogrammed) 2 – 1 (unprogrammed) LB2 1 Lock bit 1 (unprogrammed) LB1 0 Lock bit 1 (unprogrammed) Note: Bit No 1. “1” means unprogrammed, “0” means programmed Table 19-2. Lock Bit Protection Modes(1)(2) Memory Lock Bits Protection Type LB Mode LB2 LB1 1 1 1 No memory lock features enabled. 0 Further programming of the Flash and EEPROM is disabled in High-voltage and Serial Programming mode. The Fuse bits are locked in both Serial and High-voltage Programming mode.(1) debugWire is disabled. 0 Further programming and verification of the Flash and EEPROM is disabled in High-voltage and Serial Programming mode. The Fuse bits are locked in both Serial and High-voltage Programming mode.(1) debugWire is disabled. 2 3 Notes: 1 0 1. Program the Fuse bits before programming the LB1 and LB2. 2. “1” means unprogrammed, “0” means programmed Lock bits can also be read by device firmware. See section “Reading Lock, Fuse and Signature Data from Software” on page 155. 159 8006G–AVR–01/08 19.2 Fuse Bytes The ATtiny24/44/84 have three Fuse bytes. Table 19-3, Table 19-4 and Table 19-5 briefly describe the functionality of all the fuses and how they are mapped into the Fuse bytes. Note that the fuses are read as logical zero, “0”, if they are programmed.. Table 19-3. Fuse Extended Byte Fuse Extended Byte Bit No SELFPRGEN (1) Notes: Description Default Value 7 - 1 (unprogrammed) 6 - 1 (unprogrammed) 5 - 1 (unprogrammed) 4 - 1 (unprogrammed) 3 - 1 (unprogrammed) 2 - 1 (unprogrammed) 1 - 1 (unprogrammed) 0 Self-Programming Enable 1 (unprogrammed) 1. Enables SPM instruction. See “Self-Programming the Flash” on page 153. Table 19-4. Fuse High Byte Fuse High Byte Description Default Value 7 External Reset disable 1 (unprogrammed) DWEN (2) 6 DebugWIRE Enable 1 (unprogrammed) SPIEN (3) 6 Enable Serial Program and Data Downloading 0 (programmed, SPI prog. enabled) WDTON (4) 4 Watchdog Timer always on 1 (unprogrammed) EESAVE 3 EEPROM memory is preserved through the Chip Erase 1 (unprogrammed, EEPROM not preserved) BODLEVEL2 (5) 2 Brown-out Detector trigger level 1 (unprogrammed) BODLEVEL1 (5) 1 Brown-out Detector trigger level 1 (unprogrammed) BODLEVEL0 (5) 0 Brown-out Detector trigger level 1 (unprogrammed) RSTDISBL Notes: (1) Bit No 1. See “Alternate Functions of Port B” on page 64 for description of RSTDISBL and DWEN Fuses. When programming the RSTDISBL Fuse, High-voltage Serial programming has to be used to change fuses to perform further programming 2. DWEN must be unprogrammed when Lock Bit security is required. See “Program And Data Memory Lock Bits” on page 159. 3. The SPIEN Fuse is not accessible in SPI Programming mode. 4. Programming this fues will disable the Watchdog Timer Interrupt. See “WDT Configuration as a Function of the Fuse Settings of WDTON” on page 42 for details. 5. See Table 20-7 on page 180 for BODLEVEL Fuse decoding. 160 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 19-5. Fuse Low Byte Fuse Low Byte (1) CKOUT (2) CKDIV8 SUT1 (3) SUT0 (3) Bit No Description Default Value 7 Divide clock by 8 0 (programmed) 6 Clock Output Enable 1 (unprogrammed) 5 Select start-up time 1 (unprogrammed) 4 Select start-up time 0 (programmed) (4) 3 Select Clock source 0 (programmed) CKSEL2 (4) 2 Select Clock source 0 (programmed) CKSEL1 (4) 1 Select Clock source 1 (unprogrammed) (4) 0 Select Clock source 0 (programmed) CKSEL3 CKSEL0 Notes: 1. See “System Clock Prescaler” on page 29 for details. 2. Allows system clock to be output on pin. See “Clock Output Buffer” on page 29 for details. 3. The default value results in maximum start-up time for the default clock source. See Table 6-5 on page 26 for details. 4. The default setting results in internal RC Oscillator @ 8.0 MHz. See Table 6-4 on page 26 for details. Note that fuse bits are locked if Lock Bit 1 (LB1) is programmed. Fuse bits should be programmed before lock bits. The status of fuse bits is not affected by chip erase. Lock bits can also be read by device firmware. See section “Reading Lock, Fuse and Signature Data from Software” on page 155. 19.2.1 19.3 Latching of Fuses Fuse values are latched when the device enters programming mode and changes to fuse values have no effect until the part leaves programming mode. This does not apply to the EESAVE Fuse which will take effect once it is programmed. Fuses are also latched on power-up. Device Signature Imprint Table The device signature imprint table is a dedicated memory area used for storing miscellaneous device information, such as the device signature and oscillator calibaration data. Most of this memory segment is reserved for internal use, as outlined in Table 19-6. Table 19-6. Contents of Device Signature Imprint Table. Address High Byte 0x00 Signature byte 0 (1) 0x01 Calibration data for internal oscillator (2) 0x02 Signature byte 1 (1) 0x03 Reserved for internal use 0x04 Signature byte 2 (1) 0x05 ... 0x2A Reserved for internal use Notes: 1. See section “Signature Bytes” for more information. 2. See section “Calibration Byte” for more information. 161 8006G–AVR–01/08 19.3.1 Signature Bytes All Atmel microcontrollers have a three-byte signature code which identifies the device. This code can be read in both serial and High-voltage Programming mode, also when the device is locked. Signature bytes can also be read by the device firmware. See section “Reading Lock, Fuse and Signature Data from Software” on page 155. The three signature bytes reside in a separate address space called the device signature imprint table. The signature data for ATtiny24/44/84 is given in Table 19-7. Table 19-7. Device Signature Bytes Part 19.3.2 Signature Byte 0 Signature Byte 1 Signature Byte 0 ATtiny24 0x1E 0x91 0x0B ATtiny44 0x1E 0x92 0x07 ATtiny84 0x1E 0x93 0x0C Calibration Byte The device signature imprint table of ATtiny24/44/84 contains one byte of calibration data for the internal oscillator, as shown in Table 19-6 on page 161. During reset, this byte is automatically written into the OSCCAL register to ensure correct frequency of the calibrated oscillator. Calibration bytes can also be read by the device firmware. See section “Reading Lock, Fuse and Signature Data from Software” on page 155. 19.4 Page Size Table 19-8. Device Flash Size Page Size PCWORD No. of Pages PCPAGE PCMSB ATtiny24 1K words (2K bytes) 16 words PC[3:0] 64 PC[9:4] 9 ATtiny44 2K words (4K bytes) 32 words PC[4:0] 64 PC[10:5] 10 ATtiny84 4K words (8K bytes) 32 words PC[4:0] 128 PC[11:5] 11 Table 19-9. Device 162 No. of Words in a Page and No. of Pages in the Flash No. of Words in a Page and No. of Pages in the EEPROM EEPROM Size Page Size PCWORD No. of Pages PCPAGE EEAMSB ATtiny24 128 bytes 4 bytes EEA[1:0] 32 EEA[6:2] 6 ATtiny44 256 bytes 4 bytes EEA[1:0] 64 EEA[7:2] 7 ATtiny84 512 bytes 4 bytes EEA[1:0] 128 EEA[8:2] 8 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 19.5 Serial Downloading Both the Flash and EEPROM memory arrays can be programmed using the serial SPI bus while RESET is pulled to GND. The serial interface consists of pins SCK, MOSI (input) and MISO (output). See Figure 19-1 below. Figure 19-1. Serial Programming and Verify +1.8 - 5.5V VCC MOSI MISO SCK RESET GND Note: If clocked by internal oscillator there is no need to connect a clock source to the CLKI pin. After RESET is set low, the Programming Enable instruction needs to be executed first before program/erase operations can be executed. Table 19-10. Pin Mapping Serial Programming Note: Symbol Pins I/O Description MOSI PA6 I Serial Data in MISO PA5 O Serial Data out SCK PA4 I Serial Clock In Table 19-10 above, the pin mapping for SPI programming is listed. Not all parts use the SPI pins dedicated for the internal SPI interface. When programming the EEPROM, an auto-erase cycle is built into the self-timed programming operation (in the Serial mode ONLY) and there is no need to first execute the Chip Erase instruction. The Chip Erase operation turns the content of every memory location in both the Program and EEPROM arrays into 0xFF. Depending on CKSEL Fuses, a valid clock must be present. The minimum low and high periods for the serial clock (SCK) input are defined as follows: Low: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz High: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz 163 8006G–AVR–01/08 19.5.1 Serial Programming Algorithm When writing serial data to the ATtiny24/44/84, data is clocked on the rising edge of SCK. When reading data from the ATtiny24/44/84, data is clocked on the falling edge of SCK. See Figure 20-4 and Figure 20-5 for timing details. To program and verify the ATtiny24/44/84 in the Serial Programming mode, the following sequence is recommended (see four byte instruction formats in Table 19-12): 1. Power-up sequence: Apply power between VCC and GND while RESET and SCK are set to “0”. In some systems, the programmer can not guarantee that SCK is held low during power-up. In this case, RESET must be given a positive pulse of at least two CPU clock cycles duration after SCK has been set to “0”. 2. Wait for at least 20 ms and enable serial programming by sending the Programming Enable serial instruction to pin MOSI. 3. The serial programming instructions will not work if the communication is out of synchronization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command. 4. The Flash is programmed one page at a time. The memory page is loaded one byte at a time by supplying the 5 LSB of the address and data together with the Load Program memory Page instruction. To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address. The Program memory Page is stored by loading the Write Program memory Page instruction with the 3 MSB of the address. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page. (See Table 19-11 on page 165.) Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming. 5. A: The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next byte. (See Table 19-11 on page 165.) In a chip erased device, no 0xFFs in the data file(s) need to be programmed. B: The EEPROM array is programmed one page at a time. The Memory page is loaded one byte at a time by supplying the 2 LSB of the address and data together with the Load EEPROM Memory Page instruction. The EEPROM Memory Page is stored by loading the Write EEPROM Memory Page Instruction with the 4 MSB of the address. When using EEPROM page access only byte locations loaded with the Load EEPROM Memory Page instruction is altered. The remaining locations remain unchanged. If polling (RDY/BSY) is not used, the used must wait at least tWD_EEPROM before issuing the next page (See Table 19-11 on page 165). In a chip erased device, no 0xFF in the data file(s) need to be programmed. 6. Any memory location can be verified by using the Read instruction which returns the content at the selected address at serial output MISO. 7. At the end of the programming session, RESET can be set high to commence normal operation. 8. Power-off sequence (if needed): Set RESET to “1”. Turn VCC power off. 164 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 19-11. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location 19.5.2 Symbol Minimum Wait Delay tWD_FLASH 4.5 ms tWD_EEPROM 4.0 ms tWD_ERASE 4.0 ms tWD_FUSE 4.5 ms Serial Programming Instruction set The instruction set is described in Table 19-12 and Figure 19-2 on page 167. Table 19-12. Serial Programming Instruction Set Instruction Format Instruction/Operation(1) Byte 1 Byte 2 Byte 3 Byte4 Programming Enable $AC $53 $00 $00 Chip Erase (Program Memory/EEPROM) $AC $80 $00 $00 Poll RDY/BSY $F0 $00 $00 data byte out Load Extended Address byte $4D $00 Extended adr $00 Load Program Memory Page, High byte $48 adr MSB adr LSB high data byte in Load Program Memory Page, Low byte $40 adr MSB adr LSB low data byte in Load EEPROM Memory Page (page access) $C1 $00 adr LSB data byte in Read Program Memory, High byte $28 adr MSB adr LSB high data byte out Read Program Memory, Low byte $20 adr MSB adr LSB low data byte out Read EEPROM Memory $A0 $00 adr LSB data byte out Read Lock bits $58 $00 $00 data byte out Read Signature Byte $30 $00 adr LSB data byte out Read Fuse bits $50 $00 $00 data byte out Read Fuse High bits $58 $08 $00 data byte out Read Extended Fuse Bits $50 $08 $00 data byte out Read Calibration Byte $38 $00 $00 data byte out Write Program Memory Page $4C adr MSB adr LSB $00 Write EEPROM Memory $C0 $00 adr LSB data byte in Write EEPROM Memory Page (page access) $C2 $00 adr LSB $00 Write Lock bits $AC $E0 $00 data byte in Load Instructions Read Instructions Write Instructions (6) 165 8006G–AVR–01/08 Table 19-12. Serial Programming Instruction Set (Continued) Instruction Format (1) Instruction/Operation Byte 1 Byte 2 Byte 3 Byte4 Write Fuse bits $AC $A0 $00 data byte in Write Fuse High bits $AC $A8 $00 data byte in Write Extended Fuse Bits $AC $A4 $00 data byte in Notes: 1. Not all instructions are applicable for all parts. 2. a = address 3. Bits are programmed ‘0’, unprogrammed ‘1’. 4. To ensure future compatibility, unused Fuses and Lock bits should be unprogrammed (‘1’) . 5. Refer to the correspondig section for Fuse and Lock bits, Calibration and Signature bytes and Page size. 6. Instructions accessing program memory use a word address. This address may be random within the page range. 7. See htt://www.atmel.com/avr for Application Notes regarding programming and programmers. If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait until this bit returns ‘0’ before the next instruction is carried out. Within the same page, the low data byte must be loaded prior to the high data byte. After data is loaded to the page buffer, program the EEPROM page, see Figure 19-2 on page 167. 166 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 19-2. Serial Programming Instruction example Serial Programming Instruction Load Program Memory Page (High/Low Byte)/ Load EEPROM Memory Page (page access) Byte 1 Byte 2 Byte 3 Adr MSB A Bit 15 B Write Program Memory Page/ Write EEPROM Memory Page Byte 1 Byte 4 Byte 2 Adr LSB Adr MSB Byte 3 Adrr LSB B Bit 15 B 0 Byte 4 0 Page Buffer Page Offset Page 0 Page 1 Page 2 Page Number Page N-1 Program Memory/ EEPROM Memory 19.6 High-voltage Serial Programming This section describes how to program and verify Flash Program memory, EEPROM Data memory, Lock bits and Fuse bits in the ATtiny24/44/84. Figure 19-3. High-voltage Serial Programming +11.5 - 12.5V SCI +4.5 - 5.5V PB3 (RESET) VCC PB0 PA4 SDO PA2:0 PA5 SII GND PA6 SDI 167 8006G–AVR–01/08 Table 19-13. Pin Name Mapping Signal Name in High-voltage Serial Programming Mode Pin Name I/O Function SDI PA6 I Serial Data Input SII PA5 I Serial Instruction Input SDO PA4 O Serial Data Output SCI PB0 I Serial Clock Input (min. 220ns period) The minimum period for the Serial Clock Input (SCI) during High-voltage Serial Programming is 220 ns. Table 19-14. Pin Values Used to Enter Programming Mode 19.7 Pin Symbol Value PA0 Prog_enable[0] 0 PA1 Prog_enable[1] 0 PA2 Prog_enable[2] 0 High-Voltage Serial Programming Algorithm To program and verify the ATtiny24/44/84 in the High-voltage Serial Programming mode, the following sequence is recommended (See instruction formats in Table 19-16 on page 172): 19.7.1 Enter High-voltage Serial Programming Mode The following algorithm puts the device in High-voltage Serial Programming mode: 1. Set Prog_enable pins listed in Table 19-14 on page 168 to “000”, RESET pin and VCC to 0V. 2. Apply 4.5 - 5.5V between VCC and GND. Ensure that VCC reaches at least 1.8V within the next 20 µs. 3. Wait 20 - 60 µs, and apply 11.5 - 12.5V to RESET. 4. Keep the Prog_enable pins unchanged for at least 10 µs after the High-voltage has been applied to ensure the Prog_enable Signature has been latched. 5. Release the Prog_enable[2] pin after tHVRST has elapsed. 6. Wait at least 300 µs before giving any serial instructions on SDI/SII. 7. Exit Programming mode by power the device down or by bringing RESET pin to 0V. If the rise time of the VCC is unable to fulfill the requirements listed above, the following alternative algorithm can be used: 1. Set Prog_enable pins listed in Table 19-14 on page 168 to “000”, RESET pin and VCC to 0V. 2. Apply 4.5 - 5.5V between VCC and GND. 3. Monitor VCC, and as soon as VCC reaches 0.9 - 1.1V, apply 11.5 - 12.5V to RESET. 168 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 4. Keep the Prog_enable pins unchanged for at least 10 µs after the High-voltage has been applied to ensure the Prog_enable Signature has been latched. 5. Release the Prog_enable[2] pin to avoid drive contention on the Prog_enable[2]/SDO pin. 6. Wait until VCC actually reaches 4.5 - 5.5V before giving any serial instructions on SDI/SII. 7. Exit Programming mode by power the device down or by bringing RESET pin to 0V. Table 19-15. High-voltage Reset Characteristics RESET Pin High-voltage Threshold Minimum High-voltage Period for Latching Prog_enable VCC VHVRST tHVRST 4.5V 11.5V 100 ns 5.5V 11.5V 100 ns Supply Voltage 19.7.2 Considerations for Efficient Programming The loaded command and address are retained in the device during programming. For efficient programming, the following should be considered. • The command needs only be loaded once when writing or reading multiple memory locations. • Skip writing the data value 0xFF that is the contents of the entire EEPROM (unless the EESAVE Fuse is programmed) and Flash after a Chip Erase. • Address High byte needs only be loaded before programming or reading a new 256 word window in Flash or 256 byte EEPROM. This consideration also applies to Signature bytes reading. 19.7.3 Chip Erase The Chip Erase will erase the Flash and EEPROM(1) memories plus Lock bits. The Lock bits are not reset until the Program memory has been completely erased. The Fuse bits are not changed. A Chip Erase must be performed before the Flash and/or EEPROM are reprogrammed. 1. Load command “Chip Erase” (see Table 19-16 on page 172). 2. Wait after Instr. 3 until SDO goes high for the “Chip Erase” cycle to finish. 3. Load Command “No Operation”. Note: 19.7.4 1. The EEPROM memory is preserved during Chip Erase if the EESAVE Fuse is programmed. Programming the Flash The Flash is organized in pages, see “Page Size” on page 162. When programming the Flash, the program data is latched into a page buffer. This allows one page of program data to be programmed simultaneously. The following procedure describes how to program the entire Flash memory: 169 8006G–AVR–01/08 1. Load Command “Write Flash” (see Table 19-16 on page 172). 2. Load Flash Page Buffer. 3. Load Flash High Address and Program Page. Wait after Instr. 3 until SDO goes high for the “Page Programming” cycle to finish. 4. Repeat 2 through 3 until the entire Flash is programmed or until all data has been programmed. 5. End Page Programming by Loading Command “No Operation”. When writing or reading serial data to the ATtiny24/44/84, data is clocked on the rising edge of the serial clock, see Figure 20-6 on page 185, Figure 19-3 on page 167 and Table 20-12 on page 185 for details. Figure 19-4. Addressing the Flash which is Organized in Pages PCMSB PROGRAM COUNTER PAGEMSB PCPAGE PCWORD PAGE ADDRESS WITHIN THE FLASH WORD ADDRESS WITHIN A PAGE PROGRAM MEMORY PAGE PAGE PCWORD[PAGEMSB:0]: 00 INSTRUCTION WORD 01 02 PAGEEND Figure 19-5. High-voltage Serial Programming Waveforms SDI PB0 MSB LSB SII PB1 MSB LSB SDO PB2 SCI PB3 19.7.5 170 MSB 0 LSB 1 2 3 4 5 6 7 8 9 10 Programming the EEPROM The EEPROM is organized in pages, see Table 20-11 on page 184. When programming the EEPROM, the data is latched into a page buffer. This allows one page of data to be pro- ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 grammed simultaneously. The programming algorithm for the EEPROM Data memory is as follows (refer to Table 19-16 on page 172): 1. Load Command “Write EEPROM”. 2. Load EEPROM Page Buffer. 3. Program EEPROM Page. Wait after Instr. 2 until SDO goes high for the “Page Programming” cycle to finish. 4. Repeat 2 through 3 until the entire EEPROM is programmed or until all data has been programmed. 5. End Page Programming by Loading Command “No Operation”. 19.7.6 Reading the Flash The algorithm for reading the Flash memory is as follows (refer to Table 19-16 on page 172): 1. Load Command "Read Flash". 2. Read Flash Low and High Bytes. The contents at the selected address are available at serial output SDO. 19.7.7 Reading the EEPROM The algorithm for reading the EEPROM memory is as follows (refer to Table 19-16 on page 172): 1. Load Command “Read EEPROM”. 2. Read EEPROM Byte. The contents at the selected address are available at serial output SDO. 19.7.8 Programming and Reading the Fuse and Lock Bits The algorithms for programming and reading the Fuse Low/High bits and Lock bits are shown in Table 19-16 on page 172. 19.7.9 Reading the Signature Bytes and Calibration Byte The algorithms for reading the Signature bytes and Calibration byte are shown in Table 19-16 on page 172. 19.7.10 Power-off sequence Set SCI to “0”. Set RESET to “1”. Turn VCC power off. 171 8006G–AVR–01/08 Table 19-16. High-voltage Serial Programming Instruction Set for ATtiny24/44/84 Instruction Format Instruction Chip Erase Load “Write Flash” Command Load Flash Page Buffer Instr.1/5 Instr.2/6 Instr.3/7 Instr.4 SDI 0_1000_0000_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0001_0000_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx SDI 0_ bbbb_bbbb _00 0_eeee_eeee_00 0_0000_0000_00 0_0000_0000_00 SII 0_0000_1100_00 0_0010_1100_00 0_0110_1101_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_dddd_dddd_00 0_0000_0000_00 0_0000_0000_00 SII 0_0011_1100_00 0_0111_1101_00 0_0111_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx Wait after Instr.3 until SDO goes high for the Chip Erase cycle to finish. Enter Flash Programming code. Wait after Instr 3 until SDO goes high. Repeat Instr. 2 - 3 for each loaded Flash Page until the entire Flash or all data is programmed. Repeat Instr. 1 for a new 256 byte page. See Note 1. SDI 0_0000_000a_00 0_0000_0000_00 0_0000_0000_00 SII 0_0001_1100_00 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx Load “Read Flash” Command SDI 0_0000_0010_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx SDI 0_bbbb_bbbb_00 0_0000_000a_00 0_0000_0000_00 0_0000_0000_00 SII 0_0000_1100_00 0_0001_1100_00 0_0110_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx q_qqqq_qqqx_xx SDI 0_0000_0000_00 0_0000_0000_00 SII 0_0111_1000_00 0_0111_1100_00 SDO x_xxxx_xxxx_xx p_pppp_pppx_xx SDI 0_0001_0001_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx SDI 0_bbbb_bbbb_00 0_aaaa_aaaa_00 SII 0_0000_1100_00 0_0001_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0000_0000_00 SII 0_0110_1100_00 SDO x_xxxx_xxxx_xx SDI 0_0000_0000_00 0_0000_0000_00 SII 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx Load “Write EEPROM” Command Load EEPROM Page Buffer Program EEPROM Page 172 Repeat after Instr. 1 - 7until the entire page buffer is filled or until all data within the page is filled. See Note 1. Instr 5-7. Load Flash High Address and Program Page Read Flash Low and High Bytes Operation Remarks Enter Flash Read mode. Repeat Instr. 1, 3 - 6 for each new address. Repeat Instr. 2 for a new 256 byte page. Instr 5 - 6. Enter EEPROM Programming mode. 0_eeee_eeee_00 0_0010_1100_00 x_xxxx_xxxx_xx 0_0000_0000_00 0_0110_1101_00 x_xxxx_xxxx_xx Repeat Instr. 1 - 5 until the entire page buffer is filled or until all data within the page is filled. See Note 2. Wait after Instr. 2 until SDO goes high. Repeat Instr. 1 - 2 for each loaded EEPROM page until the entire EEPROM or all data is programmed. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 19-16. High-voltage Serial Programming Instruction Set for ATtiny24/44/84 (Continued) Instruction Format Instruction Instr.1/5 Instr.2/6 Instr.3/7 Instr.4 SDI 0_bbbb_bbbb_00 0_aaaa_aaaa_00 0_eeee_eeee_00 0_0000_0000_00 SII 0_0000_1100_00 0_0001_1100_00 0_0010_1100_00 0_0110_1101_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0000_0000_00 0_0000_0000_00 SII 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx Load “Read EEPROM” Command SDI 0_0000_0011_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx Read EEPROM Byte SDI 0_bbbb_bbbb_00 0_aaaa_aaaa_00 0_0000_0000_00 0_0000_0000_00 SII 0_0000_1100_00 0_0001_1100_00 0_0110_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx q_qqqq_qqq0_00 SDI 0_0100_0000_00 0_A987_6543_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0010_1100_00 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0100_0000_00 0_IHGF_EDCB_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0010_1100_00 0_0111_0100_00 0_0111_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx Write EEPROM Byte Write Fuse Low Bits Write Fuse High Bits Write Fuse Extended Bits Write Lock Bits Read Fuse Low Bits Read Fuse High Bits Enter EEPROM Read mode. 0_0100_0000_00 0_0000_000J_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0010_1100_00 0_0110_0110_00 0_0110_1110_00 x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0010_0000_00 0_0000_0021_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0010_1100_00 0_0110_0100_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx SDI 0_0000_0100_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0110_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx A_9876_543x_xx SDI 0_0000_0100_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0111_1010_00 0_0111_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx I_HGFE_DCBx_xx 0_0000_0100_00 0_0000_0000_00 0_0000_0000_00 0_0100_1100_00 0_0110_1010_00 0_0110_1110_00 x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxJx_xx SDI 0_0000_0100_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0111_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_x21x_xx Read Signature Bytes SDI 0_0000_1000_00 0_0000_00bb_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0000_1100_00 0_0110_1000_00 0_0110_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx q_qqqq_qqqx_xx Read Calibration Byte SDI 0_0000_1000_00 0_0000_0000_00 0_0000_0000_00 0_0000_0000_00 SII 0_0100_1100_00 0_0000_1100_00 0_0111_1000_00 0_0111_1100_00 SDO x_xxxx_xxxx_xx x_xxxx_xxxx_xx x_xxxx_xxxx_xx p_pppp_pppx_xx Load “No Operation” Command SDI 0_0000_0000_00 SII 0_0100_1100_00 SDO x_xxxx_xxxx_xx Read Lock Bits Wait after Instr. 4 until SDO goes high. Write A - 3 = “0” to program the Fuse bit. Wait after Instr. 4 until SDO goes high. Write F - B = “0” to program the Fuse bit. Wait after Instr. 4 until SDO goes high. Write J = “0” to program the Fuse bit. Wait after Instr. 4 until SDO goes high. Write 2 - 1 = “0” to program the Lock Bit. Reading F - B = “0” means the Fuse bit is programmed. SII SDO Repeat Instr. 1, 3 - 4 for each new address. Repeat Instr. 2 for a new 256 byte page. Reading A - 3 = “0” means the Fuse bit is programmed. SDI Read Fuse Extended Bits Repeat Instr. 1 - 6 for each new address. Wait after Instr. 6 until SDO goes high. See Note 3. Instr. 5-6 SDI SDO Operation Remarks Reading J = “0” means the Fuse bit is programmed. Reading 2, 1 = “0” means the Lock bit is programmed. Repeats Instr 2 4 for each signature byte address. 173 8006G–AVR–01/08 Note: a = address high bits, b = address low bits, d = data in high bits, e = data in low bits, p = data out high bits, q = data out low bits, x = don’t care, 1 = Lock Bit1, 2 = Lock Bit2, 3 = CKSEL0 Fuse, 4 = CKSEL1 Fuse, 5 = CKSEL2 Fuse, 6 = CKSEL3 Fuse, 7 = SUT0 Fuse, 8 = SUT1 Fuse, 9 = CKDIV8 Fuse, A = CKOUT Fuse, B = BODLEVEL0 Fuse, C = BODLEVEL1 Fuse, D= BODLEVEL2 Fuse, E = EESAVE Fuse, F = WDTON Fuse, G = SPIEN Fuse, H = DWEN Fuse, I = RSTDISBL Fuse Notes: 1. For page sizes less than 256 words, parts of the address (bbbb_bbbb) will be parts of the page address. 2. For page sizes less than 256 bytes, parts of the address (bbbb_bbbb) will be parts of the page address. 3. The EEPROM is written page-wise. But only the bytes that are loaded into the page are actually written to the EEPROM. Page-wise EEPROM access is more efficient when multiple bytes are to be written to the same page. Note that auto-erase of EEPROM is not available in High-voltage Serial Programming, only in SPI Programming. 174 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 20. Electrical Characteristics 20.1 Absolute Maximum Ratings* Operating Temperature.................................. -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C Voltage on any Pin except RESET with respect to Ground ................................-0.5V to VCC+0.5V Voltage on RESET with respect to Ground......-0.5V to +13.0V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum Operating Voltage ............................................ 6.0V DC Current per I/O Pin ............................................... 40.0 mA DC Current VCC and GND Pins................................ 200.0 mA 20.2 DC Characteristics DC Characteristics. TA = -40°C to +85°C (1) Table 20-1. Symbol Parameter Condition Min. VIL Input Low Voltage VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V VIH Input High-voltage Except RESET pin VIH1 Typ. Max. Units -0.5 0.2VCC 0.3VCC V VCC = 1.8V - 2.4V VCC = 2.4V - 5.5V 0.7VCC(2) 0.6VCC(2) VCC +0.5(3) V Input High-voltage RESET pin VCC = 1.8V to 5.5V 0.9VCC(2) VCC +0.5(3) V VOL Output Low Voltage(4) Except RESET pin(6) IOL = 10 mA, VCC = 5V IOL = 5 mA, VCC = 3V 0.6 0.5 V V VOH Output High-voltage(5) Except RESET pin(6) IOH = -10 mA, VCC = 5V IOH = -5 mA, VCC = 3V ILIL Input Leakage Current I/O Pin Vcc = 5.5V, pin low (absolute value) <0.05 1 µA ILIH Input Leakage Current I/O Pin Vcc = 5.5V, pin high (absolute value) <0.05 1 µA RRST Reset Pull-up Resistor Vcc = 5.5V, input low 30 60 kΩ RPU I/O Pin Pull-up Resistor Vcc = 5.5V, input low 20 50 kΩ IACLK Analog Comparator Input Leakage Current VCC = 5V Vin = VCC/2 -50 50 nA 4.3 2.5 V V 175 8006G–AVR–01/08 Table 20-1. Symbol DC Characteristics. TA = -40°C to +85°C (1) (Continued) Parameter Power Supply Current ICC Power-down mode Notes: Condition Min. Typ. Max. Units Active 1MHz, VCC = 2V 0.33 0.8 mA Active 4MHz, VCC = 3V 1.6 2.5 mA Active 8MHz, VCC = 5V 5 9 mA Idle 1MHz, VCC = 2V 0.11 0.4 mA Idle 4MHz, VCC = 3V 0.4 1.0 mA Idle 8MHz, VCC = 5V 1.5 3.5 mA WDT enabled, VCC = 3V 4.5 10 µA WDT disabled, VCC = 3V 0.15 2 µA 1. All DC Characteristics contained in this data sheet are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are preliminary values representing design targets, and will be updated after characterization of actual silicon. 2. “Min” means the lowest value where the pin is guaranteed to be read as high. 3. “Max” means the highest value where the pin is guaranteed to be read as low. 4. Although each I/O port can sink more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state conditions (non-transient), the sum of all IOL (for all ports) should not exceed 60 mA. If IOL exceeds the test conditions, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 5. Although each I/O port can source more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state conditions (non-transient), the sum of all IOH (for all ports) should not exceed 60 mA. If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 6. The RESET pin must tolerate high voltages when entering and operating in programming modes and, as a consequence, has a weak drive strength as compared to regular I/O pins. See Figure 21-24, Figure 21-25, Figure 21-26, and Figure 21-27 (starting on page 199). 176 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 20.3 Speed Grades The maximum operating frequency of the device depends on VCC. As shown in Figure 20-1 and Figure 20-2, the maximum frequency vs. VCC relationship is linear between 1.8V < VCC < 2.7V and between 2.7V < VCC < 4.5V. Figure 20-1. Maximum Frequency vs. VCC (ATtiny24V/44V/84V) 10 MHz Safe Operating Area 4 MHz 1.8V 2.7V 5.5V Figure 20-2. Maximum Frequency vs. VCC (ATtiny24/44/84) 20 MHz 10 MHz Safe Operating Area 2.7V 20.4 20.4.1 4.5V 5.5V Clock Characteristics Calibrated Internal RC Oscillator Accuracy It is possible to manually calibrate the internal oscillator to be more accurate than default factory calibration. Note that the oscillator frequency depends on temperature and voltage. Voltage and 177 8006G–AVR–01/08 temperature characteristics can be found in Figure 21-40 on page 207 and Figure 21-41 on page 207. Table 20-2. Calibration Accuracy of Internal RC Oscillator Calibration Method Target Frequency VCC Temperature Accuracy at given Voltage & Temperature(1) 8.0 MHz 3V 25°C ±10% Fixed frequency within: 7.3 – 8.1 MHz Fixed voltage within: 1.8V – 5.5V(2) 2.7V – 5.5V(3) Fixed temperature within: -40°C – 85°C ±1% Factory Calibration User Calibration Notes: 1. Accuracy of oscillator frequency at calibration point (fixed temperature and fixed voltage). 2. Voltage range for ATtiny24V/44V/84V. 3. Voltage range for ATtiny24/44/84. 20.4.2 External Clock Drive Figure 20-3. External Clock Drive Waveform V IH1 V IL1 Table 20-3. External Clock Drive Characteristics VCC = 1.8 - 5.5V VCC = 2.7 - 5.5V VCC = 4.5 - 5.5V Min. Max. Min. Max. Min. Max. Units 0 4 0 10 0 20 MHz Symbol Parameter 1/tCLCL Clock Frequency tCLCL Clock Period 250 100 50 ns tCHCX High Time 100 40 20 ns tCLCX Low Time 100 40 20 ns tCLCH Rise Time 2.0 1.6 0.5 μs tCHCL Fall Time 2.0 1.6 0.5 μs ΔtCLCL Change in period from one clock cycle to the next 2 2 2 % 178 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 20.5 System and Reset Characteristics Table 20-4. Symbol Reset, Brown-out, and Internal Voltage Characteristics Parameter VRST RESET Pin Threshold Voltage tRST Minimum pulse width on RESET Pin Condition Min(1) Typ(1) 0.2 VCC VCC = 1.8V VCC = 3V VCC = 5V Max(1) Units 0.9VCC V 2000 700 400 ns VHYST Brown-out Detector Hysteresis 50 mV tBOD Min Pulse Width on Brown-out Reset 2 µs VBG Internal bandgap reference voltage VCC = 5V TA = 25°C tBG Internal bandgap reference start-up time IBG Internal bandgap reference current consumption Note: 1.0 1.1 1.2 V VCC = 5V TA = 25°C 40 70 µs VCC = 5V TA = 25°C 15 µA 1. Values are guidelines, only Two versions of power-on reset have been implemented, as follows. 20.5.1 Standard Power-On Reset This implementation of power-on reset existed in early versions of ATtiny24/44/84. The table below describes the characteristics of this power-on reset and it is valid for the following devices, only: • ATtiny24, revision D, and older • ATtiny44, revision C, and older • ATtiny84, revision A Note: Revisions are marked on the package (packages 14P3 and 14S1: bottom, package 20M1: top) Table 20-5. Symbol VPOR Characteristics of Standard Power-On Reset. TA = -40 - 85°C Parameter Release threshold of power-on reset (2) VPOA Activation threshold of power-on reset SRON Power-on slope rate Note: (3) Min(1) Typ(1) Max(1) Units 0.7 1.0 1.4 V 0.05 0.9 1.3 V 4.5 V/ms 0.01 1. Values are guidelines, only 2. Threshold where device is released from reset when voltage is rising 3. The power-on reset will not work unless the supply voltage has been below VPOA 179 8006G–AVR–01/08 20.5.2 Enhanced Power-On Reset This implementation of power-on reset exists in newer versions of ATtiny24/44/84. The table below describes the characteristics of this power-on reset and it is valid for the following devices, only: • ATtiny24, revision E, and newer • ATtiny44, revision D, and newer • ATtiny84, revision B, and newer Table 20-6. Symbol Characteristics of Enhanced Power-On Reset. TA = -40 - 85°C Parameter Release threshold of power-on reset VPOR Typ(1) Max(1) Units 1.1 1.4 1.6 V 0.6 1.3 1.6 V (2) VPOA Activation threshold of power-on reset VPSR Power-On Slope Rate Note: Min(1) (3) 0.01 V/ms 1. Values are guidelines, only 2. Threshold where device is released from reset when voltage is rising 3. The Power-on Reset will not work unless the supply voltage has been below VPOT (falling) 20.5.3 Brown-Out Detection Table 20-7. VBOT vs. BODLEVEL Fuse Coding BODLEVEL [2..0] Fuses Min(1) 111 180 Max(1) Units BOD Disabled 110 1.7 1.8 2.0 101 2.5 2.7 2.9 100 4.1 4.3 4.5 0XX Note: Typ(1) V Reserved 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a Brown-out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 20.6 ADC Characteristics – Preliminary Data Table 20-8. Symbol ADC Characteristics, Single Ended Channels. -40°C - 85°C Parameter Condition Min(1) Typ(1) Resolution Units 10 Bits VREF = 4V, VCC = 4V, ADC clock = 200 kHz 2.0 TBD LSB VREF = 4V, VCC = 4V, ADC clock = 1 MHz 2.5 TBD LSB VREF = 4V, VCC = 4V, ADC clock = 200 kHz Noise Reduction Mode 1.5 TBD LSB VREF = 4V, VCC = 4V, ADC clock = 1 MHz Noise Reduction Mode 2.0 TBD LSB Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 1.0 TBD LSB Differential Non-linearity (DNL) VREF = 4V, VCC = 4V, ADC clock = 200 kHz 0.5 TBD LSB Gain Error VREF = 4V, VCC = 4V, ADC clock = 200 kHz 2.0 TBD LSB Offset Error VREF = 4V, VCC = 4V, ADC clock = 200 kHz 1.5 TBD LSB Conversion Time Free Running Conversion 14 280 µs 50 1000 kHz GND VREF V Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) Clock Frequency VIN Max(1) Input Voltage Input Bandwidth 38.4 kHz AREF External Voltage Reference 2.0 VINT Internal Voltage Reference 1.0 RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ ADC Conversion Output Note: 0 1.1 VCC V 1.2 V 1023 LSB 1. Values are preliminary. 181 8006G–AVR–01/08 Table 20-9. Symbol ADC Characteristics, Differential Channels (Unipolar Mode), TA = -40°C to 85°C Parameter Max(1) Units Gain = 1x 10 Bits Gain = 20x 10 Bits Condition Min(1) Typ(1) Resolution Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 10.0 TBD LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 20.0 TBD LSB Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4.0 TBD LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 10.0 TBD LSB Gain = 1x 10.0 TBD LSB Gain = 20x 15.0 TBD LSB Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 3.0 TBD LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4.0 TBD LSB 70 280 µs 50 200 kHz GND VCC V VREF/Gain V Gain Error Offset Error Conversion Time Clock Frequency VIN Input Voltage VDIFF Input Differential Voltage Free Running Conversion Input Bandwidth 4 kHz AREF External Reference Voltage 2.0 VINT Internal Voltage Reference 1.0 RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ ADC Conversion Output Note: 182 0 1.1 VCC - 1.0 V 1.2 V 1023 LSB 1. Values are preliminary. ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 20-10. ADC Characteristics, Differential Channels (Bipolar Mode), TA = -40°C to 85°C Symbol Parameter Max(1) Units Gain = 1x 10 Bits Gain = 20x 10 Bits Condition Min(1) Typ(1) Resolution Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 8.0 TBD LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 8.0 TBD LSB Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4.0 TBD LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 5.0 TBD LSB Gain = 1x 4.0 TBD LSB Gain = 20x 5.0 TBD LSB Gain = 1x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 3.0 TBD LSB Gain = 20x VREF = 4V, VCC = 5V ADC clock = 50 - 200 kHz 4.0 TBD LSB 70 280 µs 50 200 kHz GND VCC V VREF/Gain V Gain Error Offset Error Conversion Time Clock Frequency VIN Input Voltage VDIFF Input Differential Voltage Free Running Conversion Input Bandwidth 4 kHz AREF External Reference Voltage 2.0 VINT Internal Voltage Reference 1.0 RREF Reference Input Resistance 32 kΩ RAIN Analog Input Resistance 100 MΩ ADC Conversion Output Note: -512 1.1 VCC - 1.0 V 1.2 V 511 LSB 1. Values are preliminary. 183 8006G–AVR–01/08 20.7 Serial Programming Characteristics Figure 20-4. Serial Programming Timing MOSI SCK tSLSH tSHOX tOVSH tSHSL MISO Figure 20-5. Serial Programming Waveform SERIAL DATA INPUT (MOSI) MSB LSB SERIAL DATA OUTPUT (MISO) MSB LSB SERIAL CLOCK INPUT (SCK) SAMPLE Table 20-11. Serial Programming Characteristics, TA = -40°C to 85°C, VCC = 1.8 - 5.5V (Unless Otherwise Noted) Symbol Parameter 1/tCLCL Oscillator Frequency (ATtiny24/44/84V) Oscillator Period (ATtiny24/44/84V) tCLCL tCLCL Oscillator Period (ATtiny24/44/84, VCC = 4.5V - 5.5V) 50 tSHSL SCK Pulse Width High SCK Pulse Width Low tOVSH MOSI Setup to SCK High tSHOX MOSI Hold after SCK High Note: Max Units 4 MHz 250 0 tSLSH Typ 0 Oscillator Frequency (ATtiny24/44/84, VCC = 4.5V 5.5V) 1/tCLCL 184 Min ns 20 MHz ns 2 tCLCL(1) ns (1) ns 2 tCLCL tCLCL ns 2 tCLCL ns 1. 2 tCLCL for fck < 12 MHz, 3 tCLCL for fck >= 12 MHz ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 20.8 High-Voltage Serial Programming Characteristics Figure 20-6. High-voltage Serial Programming Timing SDI (PA6), SII (PA5) tIVSH SCI (PB0) tSLSH tSHIX tSHSL SDO (PA4) tSHOV Table 20-12. High-voltage Serial Programming Characteristics TA = 25°C, VCC = 5V (Unless otherwise noted) Symbol Parameter Min tSHSL SCI (PB0) Pulse Width High 125 ns tSLSH SCI (PB0) Pulse Width Low 125 ns tIVSH SDI (PA6), SII (PB1) Valid to SCI (PB0) High 50 ns tSHIX SDI (PA6), SII (PB1) Hold after SCI (PB0) High 50 ns tSHOV SCI (PB0) High to SDO (PA4) Valid 16 ns Wait after Instr. 3 for Write Fuse Bits 2.5 ms tWLWH_PFB Typ Max Units 185 8006G–AVR–01/08 21. Typical Characteristics The data contained in this section is largely based on simulations and characterization of similar devices in the same process and design methods. Thus, the data should be treated as indications of how the part will behave. The following charts show typical behavior. These figures are not tested during manufacturing. During characterisation devices are operated at frequencies higher than test limits but they are not guaranteed to function properly at frequencies higher than the ordering code indicates. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. Current consumption is a function of several factors such as operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. A sine wave generator with rail-to-rail output is used as clock source but current consumption in Power-Down mode is independent of clock selection. The difference between current consumption in Power-Down mode with Watchdog Timer enabled and Power-Down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. The current drawn from pins with a capacitive load may be estimated (for one pin) as follows: I CP ≈ V CC × C L × f SW where VCC = operating voltage, CL = load capacitance and fSW = average switching frequency of I/O pin. 21.1 Supply Current of I/O Modules The tables and formulas below can be used to calculate the additional current consumption for the different I/O modules in Active and Idle mode. The enabling or disabling of the I/O modules is controlled by the Power Reduction Register. See “Power Reduction Register” on page 34 for details. Table 21-1. PRR bit Additional Current Consumption for the different I/O modules (absolute values) Typical numbers VCC = 2V, F = 1MHz VCC = 3V, F = 4MHz VCC = 5V, F = 8MHz PRTIM1 5.1 uA 31.0 uA 118.2 uA PRTIM0 6.6 uA 40.0 uA 153.0 uA PRUSI 3.7 uA 23.1 uA 92.2 uA PRADC 29.6 uA 88.3 uA 333.3 uA Table 21-2 below can be used for calculating typical current consumption for other supply voltages and frequencies than those mentioned in the Table 21-1 above. Table 21-2. 186 Additional Current Consumption (percentage) in Active and Idle mode PRR bit Current consumption additional to active mode with external clock (see Figure 21-1 and Figure 21-2) Current consumption additional to idle mode with external clock (see Figure 21-6 and Figure 21-7) PRTIM1 1.8 % 8.0 % ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Table 21-2. 21.1.1 Additional Current Consumption (percentage) in Active and Idle mode PRR bit Current consumption additional to active mode with external clock (see Figure 21-1 and Figure 21-2) Current consumption additional to idle mode with external clock (see Figure 21-6 and Figure 21-7) PRTIM0 2.3 % 10.4 % PRUSI 1.4 % 6.1 % PRADC 6.7 % 28.8 % Example Calculate the expected current consumption in idle mode with USI, TIMER0, and ADC enabled at VCC = 2.0V and f = 1MHz. From Table 21-2 on page 186, third column, we see that we need to add 6.1% for the USI, 10.4% for TIMER0, and 28.8% for the ADC. Reading from Figure 21-6 on page 190, we find that current consumption in idle mode at 2V and 1MHz is about 0.04mA. The total current consumption in idle mode with USI, TIMER0, and ADC enabled is therefore: I CCTOT ≈ 0.04mA × ( 1 + 0.061 + 0.104 + 0.288 ) ≈ 0.06mA 21.2 Active Supply Current Figure 21-1. Active Supply Current vs. Low Frequency (0.1 - 1.0 MHz) ACTIVE SUPPLY CURRENT vs. LOW FREQUENCY (PRR=0xFF) 1.2 1 5.5 V 5.0 V 0.8 ICC (mA) 4.5 V 4.0 V 0.6 3.3 V 0.4 2.7 V 1.8 V 0.2 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) 187 8006G–AVR–01/08 Figure 21-2. Active Supply Current vs. frequency (1 - 20 MHz) ACTIVE SUPPLY CURRENT vs. FREQUENCY (PRR=0xFF) 14 5.5 V 12 5.0 V ICC (mA) 10 4.5 V 8 6 4.0 V 4 3.3 V 2.7 V 2 1.8 V 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) Figure 21-3. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) ACTIVE SUPPLY CURRENT vs. SUPPLY VOLTAGE INTERNAL RC OSCILLATOR, 8 MHz 6 25 °C 5 -40 °C 85 °C ICC (mA) 4 3 2 1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 188 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-4. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 1 MHz 1.2 85 °C 25 °C -40 °C 1 ICC (mA) 0.8 0.6 0.4 0.2 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-5. Active Supply Current vs. VCC (Internal RC Oscillator, 128 kHz) ACTIVE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 128 KHz 0.14 -40 °C 25 °C 85 °C 0.12 ICC (mA) 0.1 0.08 0.06 0.04 0.02 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 189 8006G–AVR–01/08 21.3 Idle Supply Current Figure 21-6. Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz) IDLE SUPPLY CURRENT vs. LOW FREQUENCY (PRR=0xFF) ICC (mA) 0.18 0.16 5.5 V 0.14 5.0 V 0.12 4.5 V 0.1 4.0 V 0.08 3.3 V 0.06 2.7 V 0.04 1.8 V 0.02 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) Figure 21-7. Idle Supply Current vs. Frequency (1 - 20 MHz) IDLE SUPPLY CURRENT vs. FREQUENCY (PRR=0xFF) 5 4.5 4 ICC (mA) 3.5 5.5 V 3 5.0 V 2.5 4.5 V 2 1.5 4.0 V 3.3 V 2.7 V 1 0.5 1.8 V 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) 190 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-8. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz) IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 8 MHz 2 1.8 1.6 85 °C 1.4 25 °C -40 °C ICC (mA) 1.2 1 0.8 0.6 0.4 0.2 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-9. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz) IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 1 MHz 0.35 85 °C 0.3 25 °C -40 °C ICC (mA) 0.25 0.2 0.15 0.1 0.05 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 191 8006G–AVR–01/08 Figure 21-10. Idle Supply Current vs. VCC (Internal RC Oscillator, 128 MHz) IDLE SUPPLY CURRENT vs. VCC INTERNAL RC OSCILLATOR, 128 KHz 0.03 -40 °C 25 °C 0.025 85 °C ICC (mA) 0.02 0.015 0.01 0.005 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 21.4 Power-down Supply Current Figure 21-11. Power-down Supply Current vs. VCC (Watchdog Timer Disabled) POWER-DOWN SUPPLY CURRENT vs. VCC WATCHDOG TIMER DISABLED 0.7 85 °C 0.6 ICC (uA) 0.5 0.4 0.3 0.2 25 °C 0.1 -40 °C 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 192 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-12. Power-down Supply Current vs. VCC (Watchdog Timer Enabled) POWER-DOWN SUPPLY CURRENT vs. VCC WATCHDOG TIMER ENABLED 10 9 -40 °C 8 25 °C 85 °C 7 ICC (uA) 6 5 4 3 2 1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 21.5 Standby Supply Current Figure 21-13. Standby Supply Current vs. VCC (4 MHz External Crystal, Watchdog Timer Disabled) STANDBY SUPPLY CURRENT vs. VCC 4 MHz EXTERNAL CRYSTAL, WATCHDOG TIMER DISABLED I CC (mA) 0.14 0.12 85 ˚C 0.1 25 ˚C 0.08 -40 ˚C 0.06 0.04 0.02 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 193 8006G–AVR–01/08 21.6 Pin Pull-up Figure 21-14. I/O pin Pull-up Resistor Current vs. Input Voltage (VCC = 1.8V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE VCC = 1.8V 50 45 40 IOP (uA) 35 30 25 20 15 10 25 ˚C 5 85 ˚C -40 ˚C 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VOP (V) Figure 21-15. I/O Pin Pull-up Resistor Current vs. input Voltage (VCC = 2.7V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE VCC = 2.7V 80 70 60 IOP (uA) 50 40 30 20 25 ˚C 10 85 ˚C -40 ˚C 0 0 0.5 1 1.5 2 2.5 3 VOP (V) 194 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-16. I/O pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V) I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE VCC = 5V 160 140 120 IOP (uA) 100 80 60 40 25 ˚C 20 85 ˚C -40 ˚C 0 0 1 2 3 4 5 6 VOP (V) Figure 21-17. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE VCC = 1.8V 40 35 I RESET (uA) 30 25 20 15 10 25 ˚C 5 -40 ˚C 85 ˚C 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VRESET (V) 195 8006G–AVR–01/08 Figure 21-18. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE VCC = 2.7V 60 50 I RESET(uA) 40 30 20 25 ˚C 10 -40 ˚C 85 ˚C 0 0 0.5 1 1.5 2 2.5 3 VRESET (V) Figure 21-19. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V) RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE VCC = 5V 120 100 I RESET (uA) 80 60 40 25 ˚C 20 -40 ˚C 85 ˚C 0 0 1 2 3 4 5 6 VRESET(V) 196 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 21.7 Pin Driver Strength Figure 21-20. I/O Pin Output Voltage vs. Sink Current (VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 3V 1 0.9 85 ˚C 0.8 VOL (V) 0.7 25 ˚C 0.6 -40 ˚C 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 IOL (mA) Figure 21-21. I/O pin Output Voltage vs. Sink Current (VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 5V 0.7 0.6 85 ˚C VOL (V) 0.5 25 ˚C 0.4 -40 ˚C 0.3 0.2 0.1 0 0 5 10 15 20 25 IOL (mA) 197 8006G–AVR–01/08 Figure 21-22. I/O Pin Output Voltage vs. Source Current (VCC = 3V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 3V 3.5 3 VOH (V) 2.5 -40 ˚C 25 ˚C 85 ˚C 2 1.5 1 0.5 0 0 5 10 15 20 25 IOH (mA) Figure 21-23. I/O Pin output Voltage vs. Source Current (VCC = 5V) I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 5V 5.1 5 4.9 VOH (V) 4.8 4.7 4.6 -40 ˚C 4.5 25 ˚C 85 ˚C 4.4 4.3 0 5 10 15 20 25 IOH (mA) 198 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-24. Reset Pin Output Voltage vs. Sink Current (VCC = 3V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 3V 1.5 85 °C VOL (V) 1 0 °C -45 °C 0.5 0 0 0.5 1 1.5 2 2.5 3 IOL (mA) Figure 21-25. Reset Pin Output Voltage vs. Sink Current (VCC = 5V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT VCC = 5V 1 0.8 VOL (V) 0.6 85 °C 0.4 0 °C -45 °C 0.2 0 0 0.5 1 1.5 2 2.5 3 IOL (mA) 199 8006G–AVR–01/08 Figure 21-26. Reset Pin Output Voltage vs. Source Current (VCC = 3V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 3V 3.5 3 VOH (V) 2.5 2 1.5 -45 °C 25 °C 85 °C 1 0.5 0 0 0.5 1 1.5 2 IOH (mA) Figure 21-27. Reset Pin Output Voltage vs. Source Current (VCC = 5V) RESET AS I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT VCC = 5V 5 4.5 VOH (V) 4 3.5 3 -45 °C 25 °C 85 °C 2.5 0 0.5 1 1.5 2 IOH (mA) 200 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 21.8 Pin Threshold and Hysteresis Figure 21-28. I/O Pin Input Threshold Voltage vs. VCC (VIH, IO Pin Read as ‘1’) I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC VIH, IO PIN READ AS '1' 3.5 85 ˚C 25 ˚C -40 ˚C Threshold (V) 3 2.5 2 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-29. I/O Pin Input threshold Voltage vs. VCC (VIL, IO Pin Read as ‘0’) I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC VIL, IO PIN READ AS '0' 2.5 85 ˚C 25 ˚C Threshold (V) 2 -40 ˚C 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 201 8006G–AVR–01/08 Figure 21-30. I/O Pin Input Hysteresis vs. VCC I/O PIN INPUT HYSTERESIS vs. VCC 0.6 Input Hysteresis (mV) 0.5 85 ˚C -40 ˚C 0.4 25 ˚C 0.3 0.2 0.1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-31. Reset Input Threshold Voltage vs. VCC (VIH, I/O Pin Threshold as ‘1’) RESET INPUT THRESHOLD VOLTAGE vs. VCC VIH, IO PIN READ AS '1' 2.5 -40 ˚C 25 ˚C 2 Threshold (V) 85 ˚C 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 202 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-32. Reset Input Threshold Voltage vs. VCC (VIL, I/O pin Read as ‘0’) RESET INPUT THRESHOLD VOLTAGE vs. V CC VIL, IO PIN READ AS '0' 2.5 85 ˚C 25 ˚C 2 Threshold (V) -40 ˚C 1.5 1 0.5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-33. Reset Pin Input Hysteresis vs. VCC RESET PIN INPUT HYSTERESIS vs. VCC 0.8 Input Hysteresis (mV) 0.7 0.6 0.5 0.4 0.3 0.2 -40 ˚C 0.1 25 ˚C 85 ˚C 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 203 8006G–AVR–01/08 Figure 21-34. Reset Pin Input Hysteresis vs. VCC (Reset Pin Used as I/O) RESET PIN AS I/O, INPUT HYSTERESIS vs. VCC VIL, I/O PIN READ AS "0" 1 0.9 0.8 Input Hysteresis (mV) -40 °C 0.7 25 °C 0.6 85 °C 0.5 0.4 0.3 0.2 0.1 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 21.9 BOD Threshold and Analog Comparator Offset Figure 21-35. BOD Threshold vs. Temperature (BODLEVEL is 4.3V) BOD THRESHOLDS vs. TEMPERATURE BODLEVEL is 4.3V 4.34 4.32 Rising Vcc Threshold (V) 4.3 4.28 4.26 4.24 4.22 Falling Vcc 4.2 4.18 4.16 4.14 -60 -40 -20 0 20 40 60 80 100 Temperature (C) 204 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-36. BOD Threshold vs, Temperature (BODLEVEL is 2.7V) BOD THRESHOLDS vs. TEMPERATURE BODLEVEL is 2.7V 2.75 Rising Vcc 2.74 2.73 Threshold (V) 2.72 2.71 2.7 2.69 2.68 2.67 Falling Vcc 2.66 2.65 2.64 -60 -40 -20 0 20 40 60 80 100 Temperature (C) Figure 21-37. BOD Threshold vs. Temperature (BODLEVEL is 1.8V) BOD THRESHOLDS vs. TEMPERATURE BODLEVEL is 1.8V 1.82 Rising Vcc 1.815 Threshold (V) 1.81 1.805 1.8 1.795 1.79 Falling Vcc 1.785 1.78 1.775 1.77 -60 -40 -20 0 20 40 60 80 100 Temperature (C) 205 8006G–AVR–01/08 21.10 Internal Oscillator Speed Figure 21-38. Watchdog Oscillator Frequency vs. VCC WATCHDOG OSCILLATOR FREQUENCY vs. OPERATING VOLTAGE 110 109 108 Frequency (kHz) 107 -40 °C 106 105 25 °C 104 103 102 101 85 °C 100 99 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-39. Watchdog Oscillator Frequency vs. Temperature WATCHDOG OSCILLATOR FREQUENCY vs. TEMPERATURE 110 109 108 Frequency (kHz) 107 106 105 104 1.8 V 103 2.7 V 102 3.3 V 101 4.0 V 5.5 V 100 -60 -40 -20 0 20 40 60 80 100 Temperature 206 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-40. Calibrated 8 MHz RC Oscillator Frequency vs. VCC CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. OPERATING VOLTAGE 9 85 °C 8 25 °C -40 °C Frequency (MHz) 7 6 5 4 3 2 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-41. Calibrated 8 MHz RC oscillator Frequency vs. Temperature CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE 8.3 5.0 V 8.2 3.0 V Frequency (MHz) 8.1 8 7.9 7.8 7.7 7.6 -60 -40 -20 0 20 40 60 80 100 Temperature 207 8006G–AVR–01/08 Figure 21-42. Calibrated 8 MHz RC Oscillator Frequency vs, OSCCAL Value CALIBRATED 8 MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE 16 85 ˚C 14 25 ˚C 12 -40 ˚C FRC (MHz) 10 8 6 4 2 0 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 OSCCAL (X1) 21.11 Current Consumption of Peripheral Units Figure 21-43. ADC Current vs. VCC ADC CURRENT vs. VCC 4.0 MHz FREQUENCY 700 600 ICC (uA) 500 400 300 200 100 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 208 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-44. AREF External Reference Current vs. VCC AREF EXTERNAL REFERENCE CURRENT vs. VCC 180 25 ˚C 150 ICC (uA) 120 90 60 30 0 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) Figure 21-45. Analog Comparator Current vs. VCC ANALOG COMPARATOR CURRENT vs. VCC 140 120 ICC (uA) 100 25 ˚C 80 60 40 20 0 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) 209 8006G–AVR–01/08 Figure 21-46. Programming Current vs. VCC (ATtiny24) PROGRAMMING CURRENT vs. VCC ATtiny24 8000 7000 25 °C 6000 ICC (uA) 5000 4000 3000 2000 1000 0 1.5 2.5 3.5 4.5 5.5 VCC (V) Figure 21-47. Programming Current vs. VCC (ATtiny44) PROGRAMMING CURRENT vs. VCC ATtiny44 9000 8000 25 °C 7000 ICC (uA) 6000 5000 4000 3000 2000 1000 0 1.5 2.5 3.5 4.5 5.5 VCC (V) 210 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-48. Programming Current vs. VCC (ATtiny84) PROGRAMMING CURRENT vs. VCC ATtiny84 16000 25 °C 14000 12000 ICC (uA) 10000 8000 6000 4000 2000 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) Figure 21-49. Brownout Detector Current vs. VCC BROWNOUT DETECTOR CURRENT vs. VCC 45 40 35 ICC (uA) 30 85 ˚C 25 ˚C -40 ˚C 25 20 15 10 5 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VCC (V) 211 8006G–AVR–01/08 Figure 21-50. Watchdog Timer Current vs. VCC WATCHDOG TIMER CURRENT vs. VCC 10 9 -40 ˚C 85 ˚C 8 7 25 ˚C ICC (uA) 6 5 4 3 2 1 0 1,5 2 2,5 3 3,5 4 4,5 5 5,5 VCC (V) 21.12 Current Consumption in Reset and Reset Pulsewidth Figure 21-51. Reset Supply Current vs. VCC (0.1 - 1.0 MHz, excluding Current Through the Reset Pull-up) RESET SUPPLY CURRENT vs. VCC 0.1 - 1.0 MHz,EXCLUDING CURRENT THROUGH THE RESET PULLUP 0.14 5.5 V 0.12 5.0 V ICC (mA) 0.1 4.5 V 0.08 4.0 V 0.06 3.3 V 2.7 V 0.04 1.8 V 0.02 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) 212 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Figure 21-52. Reset Supply Current vs. VCC (1 - 20 MHz, Excluding Current Through the Reset Pull-up) RESET SUPPLY CURRENT vs. VCC 1 - 20 MHz, EXCLUDING CURRENT THROUGH THE RESET PULLUP 3 2.5 5.5 V 5.0 V 4.5 V ICC (mA) 2 1.5 1 4.0V 3.3V 2.7V 0.5 1.8V 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (MHz) Figure 21-53. Minimum Reset Pulse Width vs. VCC MINIMUM RESET PULSE WIDTH vs. VCC 2500 Pulsewidth (ns) 2000 1500 1000 500 85 ˚C 25 ˚C -40 ˚C 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VCC (V) 213 8006G–AVR–01/08 22. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F (0x5F) SREG I T H S V N Z C Page 8 – – – – SP9 SP8 Page 11 SP1 SP0 0x3E (0x5E) SPH – – 0x3D (0x5D) SPL SP7 SP6 0x3C (0x5C) OCR0B 0x3B (0x5B) GIMSK – INT0 PCIE1 PCIE0 – – – – Page 50 0x3A (0x5A GIFR – INTF0 PCIF1 PCIF0 – – – – Page 51 0x39 (0x59) TIMSK0 – – – – – OCIE0B OCIE0A TOIE0 Page 84 0x38 (0x58) TIFR0 – – – – OCF0B OCF0A TOV0 Page 84 0x37 (0x57) SPMCSR – – – CTPB RFLB PGWRT Timer/Counter0 – Output Compare Register A PGERS SPMEN Page 157 SP5 SP4 SP3 SP2 Timer/Counter0 – Output Compare Register B Page 11 Page 84 0x36 (0x56) OCR0A 0x35 (0x55) MCUCR BODS PUD SE SM1 SM0 BODSE ISC01 ISC00 Page 83 Page 50 0x34 (0x54) MCUSR – – – – WDRF BORF EXTRF PORF Page 44 0x33 (0x53) TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 Page 82 0x32 (0x52) TCNT0 0x31 (0x51) OSCCAL CAL2 CAL1 CAL0 Page 29 Timer/Counter0 CAL7 CAL6 CAL5 CAL4 CAL3 Page 83 0x30 (0x50) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 – WGM01 WGM00 Page 79 0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – WGM11 WGM10 Page 107 ICNC1 ICES1 – WGM13 WGM12 CS11 CS10 Page 109 0x2E (0x4E) TCCR1B 0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High Byte CS12 Page 111 0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low Byte Page 111 0x2B (0x4B) OCR1AH Timer/Counter1 – Compare Register A High Byte Page 111 0x2A (0x4A) OCR1AL Timer/Counter1 – Compare Register A Low Byte Page 111 0x29 (0x49) OCR1BH Timer/Counter1 – Compare Register B High Byte Page 111 Page 111 0x28 (0x48) OCR1BL Timer/Counter1 – Compare Register B Low Byte 0x27 (0x47) DWDR DWDR[7:0] 0x26 (0x46) CLKPR 0x25 (0x45) ICR1H – CLKPCE – – Page 152 CLKPS3 CLKPS2 CLKPS1 CLKPS0 Timer/Counter1 - Input Capture Register High Byte Page 30 Page 112 0x24 (0x44) ICR1L 0x23 (0x43) GTCCR TSM – Timer/Counter1 - Input Capture Register Low Byte – – – – – PSR10 Page 112 Page 115 0x22 (0x42) TCCR1C FOC1A FOC1B – – – – – – Page 110 0x21 (0x41) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 Page 44 0x20 (0x40) PCMSK1 – – – – PCINT11 PCINT10 PCINT9 PCINT8 Page 51 Page 20 0x1F (0x3F) EEARH – – – – – – – EEAR8 0x1E (0x3E) EEARL EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 0x1D (0x3D) EEDR EEPROM Data Register Page 20 Page 21 0x1C (0x3C) EECR – – EEPM1 EEPM0 EERIE EEMPE EEPE EERE Page 21 0x1B (0x3B) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 Page 66 0x1A (0x3A) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 Page 66 0x19 (0x39) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 Page 67 0x18 (0x38) PORTB – – – – PORTB3 PORTB2 PORTB1 PORTB0 Page 67 0x17 (0x37) DDRB – – – – DDB3 DDB2 DDB1 DDB0 Page 67 0x16 (0x36) PINB – – – – PINB3 PINB2 PINB1 PINB0 0x15 (0x35) GPIOR2 General Purpose I/O Register 2 Page 22 0x14 (0x34) GPIOR1 General Purpose I/O Register 1 Page 22 0x13 (0x33) GPIOR0 General Purpose I/O Register 0 0x12 (0x32) PCMSK0 0x11 (0x31)) Reserved – 0x10 (0x30) USIBR USI Buffer Register Page 124 0x0F (0x2F) USIDR USI Data Register Page 124 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 Page 67 Page 22 PCINT2 PCINT1 PCINT0 Page 52 0x0E (0x2E) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 0x0D (0x2D) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC Page 126 0x0C (0x2C) TIMSK1 – – ICIE1 – – OCIE1B OCIE1A TOIE1 Page 112 0x0B (0x2B) TIFR1 – – ICF1 – – OCF1B OCF1A TOV1 Page 113 0x0A (0x2A) Reserved 0x09 (0x29) Reserved 0x08 (0x28) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 Page 130 0x07 (0x27) ADMUX REFS1 REFS0 MUX5 MUX4 MUX3 MUX2 MUX1 MUX0 Page 145 0x06 (0x26) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 0x05 (0x25) ADCH 0x04 (0x24) ADCL 0x03 (0x23) ADCSRB 0x02 (0x22) Reserved 0x01 (0x21) 0x00 (0x20) 214 Page 125 – – ADC Data Register High Byte ADC Data Register Low Byte BIN ACME – ADLAR DIDR0 ADC7D ADC6D ADC5D ADC4D PRR – – – – – Page 147 Page 149 Page 149 ADTS2 ADTS1 ADTS0 Page 149 ADC3D ADC2D PRTIM1 PRTIM0 ADC1D ADC0D Page 131,Page 150 PRUSI PRADC Page 34 – ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 215 8006G–AVR–01/08 23. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 2 BRANCH INSTRUCTIONS RJMP k IJMP RCALL k Relative Jump PC ← PC + k + 1 None Indirect Jump to (Z) PC ← Z None 2 Relative Subroutine Call PC ← PC + k + 1 None 3 3 ICALL Indirect Call to (Z) PC ← Z None RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 1/2/3 1 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1 216 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 Mnemonics Operands Description Operation Flags #Clocks ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C←1 C 1 CLC Clear Carry C←0 C 1 SEN Set Negative Flag N←1 N 1 CLN Clear Negative Flag N←0 N 1 SEZ Set Zero Flag Z←1 Z 1 CLZ Clear Zero Flag Z←0 Z 1 SEI Global Interrupt Enable I←1 I 1 CLI Global Interrupt Disable I←0 I 1 SES Set Signed Test Flag S←1 S 1 CLS Clear Signed Test Flag S←0 S 1 SEV Set Twos Complement Overflow. V←1 V 1 CLV Clear Twos Complement Overflow V←0 V 1 SET Set T in SREG T←1 T 1 CLT Clear T in SREG T←0 T 1 SEH CLH Set Half Carry Flag in SREG Clear Half Carry Flag in SREG H←1 H←0 H H 1 Rd ← Rr Rd+1:Rd ← Rr+1:Rr None 1 None 1 1 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers MOVW Rd, Rr Copy Register Word LDI Rd, K Load Immediate Rd ← K None LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 Load Program Memory R0 ← (Z) None 3 LPM LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 Store Program Memory (z) ← R1:R0 None IN Rd, P In Port Rd ← P None OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 SPM 1 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR BREAK Watchdog Reset Break (see specific descr. for WDR/Timer) For On-chip Debug Only None None 1 N/A 217 8006G–AVR–01/08 24. Ordering Information 24.1 ATtiny24 Speed (MHz) 10 20 Notes: Power Supply Ordering Code(1) Package(2) 1.8 - 5.5V ATtiny24V-10SSU ATtiny24V-10PU ATtiny24V-10MU 14S1 14P3 20M1 Industrial (-40°C to 85°C) 2.7 - 5.5V ATtiny24-20SSU ATtiny24-20PU ATtiny24-20MU 14S1 14P3 20M1 Industrial (-40°C to 85°C) Operational Range 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 218 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 24.2 ATtiny44 Speed (MHz) Power Supply Ordering Code(1) Package(2) 10 1.8 - 5.5V ATtiny44V-10SSU ATtiny44V-10PU ATtiny44V-10MU 14S1 14P3 20M1 Industrial (-40°C to 85°C) 20 2.7 - 5.5V ATtiny44-20SSU ATtiny44-20PU ATtiny44-20MU 14S1 14P3 20M1 Industrial (-40°C to 85°C) Notes: Operational Range 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 219 8006G–AVR–01/08 24.3 ATtiny84 Speed (MHz) Power Supply Ordering Code(1) Package(2) 10 1.8 - 5.5V ATtiny84V-10SSU ATtiny84V-10PU ATtiny84V-10MU 14S1 14P3 20M1 Industrial (-40°C to 85°C) 20 2.7 - 5.5V ATtiny84-20SSU ATtiny84-20PU ATtiny84-20MU 14S1 14P3 20M1 Industrial (-40°C to 85°C) Notes: Operational Range 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 220 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 25. Packaging Information 25.1 20M1 D 1 Pin 1 ID 2 SIDE VIEW E 3 TOP VIEW A2 D2 A1 A 0.08 1 2 Pin #1 Notch (0.20 R) 3 COMMON DIMENSIONS (Unit of Measure = mm) E2 b L e BOTTOM VIEW SYMBOL MIN A 0.70 0.75 0.80 A1 – 0.01 0.05 A2 b D D2 E2 L MAX NOTE 0.23 0.30 4.00 BSC 2.45 2.60 2.75 4.00 BSC 2.45 e Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5. NOM 0.20 REF 0.18 E Note: C 2.60 2.75 0.50 BSC 0.35 0.40 0.55 10/27/04 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF) DRAWING NO. 20M1 REV. A 221 8006G–AVR–01/08 25.2 14P3 D PIN 1 E1 A SEATING PLANE A1 L B B1 e E COMMON DIMENSIONS (Unit of Measure = mm) C eC eB Notes: 1. This package conforms to JEDEC reference MS-001, Variation AA. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). SYMBOL MIN NOM MAX A – – 5.334 A1 0.381 – – D 18.669 – 19.685 E 7.620 – 8.255 E1 6.096 – 7.112 B 0.356 – 0.559 B1 1.143 – 1.778 L 2.921 – 3.810 C 0.203 – 0.356 eB – – 10.922 eC 0.000 – 1.524 e NOTE Note 2 Note 2 2.540 TYP 11/02/05 R 222 2325 Orchard Parkway San Jose, CA 95131 TITLE 14P3, 14-lead (0.300"/7.62 mm Wide) Plastic Dual Inline Package (PDIP) DRAWING NO. 14P3 REV. A ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 25.3 14S1 1 E H E N L Top View End View e COMMON DIMENSIONS (Unit of Measure = mm/inches) b SYMBOL A1 A D Side View NOM MAX – 1.75/0.0688 NOTE 1.35/0.0532 A1 0.1/.0040 – 0.25/0.0098 b 0.33/0.0130 – 0.5/0.0200 5 D 8.55/0.3367 – 8.74/0.3444 2 3 E 3.8/0.1497 – 3.99/0.1574 H 5.8/0.2284 – 6.19/0.2440 L 0.41/0.0160 – 1.27/0.0500 e Notes: MIN A 4 1.27/0.050 BSC 1. This drawing is for general information only; refer to JEDEC Drawing MS-012, Variation AB for additional information. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusion and gate burrs shall not exceed 0.15 mm (0.006") per side. 3. Dimension E does not include inter-lead Flash or protrusion. Inter-lead flash and protrusions shall not exceed 0.25 mm (0.010") per side. 4. L is the length of the terminal for soldering to a substrate. 5. The lead width B, as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm (0.024") per side. 2/5/02 TITLE R 2325 Orchard Parkway San Jose, CA 95131 DRAWING NO. 14S1, 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14S1 REV. A 223 8006G–AVR–01/08 26. Errata The revision letters in this section refer to the revision of the corresponding ATtiny24/44/84 device. 26.1 ATtiny24 26.1.1 Rev. E No known errata. 26.1.2 Rev. D No known errata. 26.1.3 Rev. C • Reading EEPROM when system clock frequency is below 900 kHz may not work 1. Reading EEPROM when system clock frequency is below 900 kHz may not work Reading data from the EEPROM at system clock frequency below 900 kHz may result in wrong data read. Problem Fix/Work around Avoid using the EEPROM at clock frequency below 900 kHz. 26.1.4 Rev. B • EEPROM read from application code does not work in Lock Bit Mode 3 • Reading EEPROM when system clock frequency is below 900 kHz may not work 1. EEPROM read from application code does not work in Lock Bit Mode 3 When the Memory Lock Bits LB2 and LB1 are programmed to mode 3, EEPROM read does not work from the application code. Problem Fix/Work around Do not set Lock Bit Protection Mode 3 when the application code needs to read from EEPROM. 2. Reading EEPROM when system clock frequency is below 900 kHz may not work Reading data from the EEPROM at system clock frequency below 900 kHz may result in wrong data read. Problem Fix/Work around Avoid using the EEPROM at clock frequency below 900 kHz. 26.1.5 Rev. A Not sampled. 224 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 26.2 ATtiny44 26.2.1 Rev. D No known errata. 26.2.2 Rev. C No known errata. 26.2.3 Rev. B No known errata. 26.2.4 Rev. A • Reading EEPROM when system clock frequency is below 900 kHz may not work 1. Reading EEPROM when system clock frequency is below 900 kHz may not work Reading data from the EEPROM at system clock frequency below 900 kHz may result in wrong data read. Problem Fix/Work around Avoid using the EEPROM at clock frequency below 900 kHz. 225 8006G–AVR–01/08 26.3 ATtiny84 26.3.1 Rev. B No known errata. 26.3.2 Rev. A No known errata. 226 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 27. Datasheet Revision History 27.1 Rev G. 01/08 1. Updated sections: – “Features” on page 1 – “RESET” on page 3 – “Overview” on page 4 – “About” on page 6 – “SPH and SPL — Stack Pointer Register” on page 11 – “Atomic Byte Programming” on page 17 – “Write” on page 17 – “Clock Sources” on page 24 – “Default Clock Source” on page 28 – “Sleep Modes” on page 32 – “Software BOD Disable” on page 33 – “External Interrupts” on page 48 – “USIBR – USI Data Buffer” on page 124 – “USIDR – USI Data Register” on page 124 – “DIDR0 – Digital Input Disable Register 0” on page 131 – “Features” on page 132 – “Prescaling and Conversion Timing” on page 135 – “Temperature Measurement” on page 144 – “ADMUX – ADC Multiplexer Selection Register” on page 145 – “Limitations of debugWIRE” on page 152 – “Reading Lock, Fuse and Signature Data from Software” on page 155 – “Device Signature Imprint Table” on page 161 – “Enter High-voltage Serial Programming Mode” on page 168 – “Absolute Maximum Ratings*” on page 175 – “DC Characteristics” on page 175 – “Speed Grades” on page 177 – “Clock Characteristics” on page 177 – “Calibrated Internal RC Oscillator Accuracy” on page 177 – “System and Reset Characteristics” on page 179 – “Supply Current of I/O Modules” on page 186 – “ATtiny24” on page 224 – “ATtiny44” on page 225 – “ATtiny84” on page 226 2. Updated bit definitions in sections: – “MCUCR – MCU Control Register” on page 35 – “MCUCR – MCU Control Register” on page 50 – “MCUCR – MCU Control Register” on page 66 227 8006G–AVR–01/08 – “PINA – Port A Input Pins” on page 67 – “SPMCSR – Store Program Memory Control and Status Register” on page 157 – “Register Summary” on page 214 3. Updated Figures: – “Reset Logic” on page 38 – “Watchdog Reset During Operation” on page 41 – “Compare Match Output Unit, Schematic (non-PWM Mode)” on page 97 – “Analog to Digital Converter Block Schematic” on page 133 – “ADC Timing Diagram, Free Running Conversion” on page 137 – “Analog Input Circuitry” on page 140 – “High-voltage Serial Programming” on page 167 – “Serial Programming Timing” on page 184 – “High-voltage Serial Programming Timing” on page 185 – “Active Supply Current vs. Low Frequency (0.1 - 1.0 MHz)” on page 187 – “Active Supply Current vs. frequency (1 - 20 MHz)” on page 188 – “Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)” on page 188 – “Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)” on page 189 – “Active Supply Current vs. VCC (Internal RC Oscillator, 128 kHz)” on page 189 – “Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz)” on page 190 – “Idle Supply Current vs. Frequency (1 - 20 MHz)” on page 190 – “Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)” on page 191 – “Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)” on page 191 – “Idle Supply Current vs. VCC (Internal RC Oscillator, 128 MHz)” on page 192 – “Power-down Supply Current vs. VCC (Watchdog Timer Disabled)” on page 192 – “Power-down Supply Current vs. VCC (Watchdog Timer Enabled)” on page 193 – “Reset Pin Input Hysteresis vs. VCC” on page 203 – “Reset Pin Input Hysteresis vs. VCC (Reset Pin Used as I/O)” on page 204 – “Watchdog Oscillator Frequency vs. VCC” on page 206 – “Watchdog Oscillator Frequency vs. Temperature” on page 206 – “Calibrated 8 MHz RC Oscillator Frequency vs. VCC” on page 207 – “Calibrated 8 MHz RC oscillator Frequency vs. Temperature” on page 207 – “ADC Current vs. VCC” on page 208 – “Programming Current vs. VCC (ATtiny24)” on page 210 – “Programming Current vs. VCC (ATtiny44)” on page 210 – “Programming Current vs. VCC (ATtiny84)” on page 211 4. Added Figures: – “Reset Pin Output Voltage vs. Sink Current (VCC = 3V)” on page 199 – “Reset Pin Output Voltage vs. Sink Current (VCC = 5V)” on page 199 – “Reset Pin Output Voltage vs. Source Current (VCC = 3V)” on page 200 – “Reset Pin Output Voltage vs. Source Current (VCC = 5V)” on page 200 5. Updated Tables: 228 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 – “Device Clocking Options Select” on page 24 – “Start-up Times for the Crystal Oscillator Clock Selection” on page 28 – “Start-up Times for the Internal Calibrated RC Oscillator Clock Selection” on page 26 – “Start-up Times for the External Clock Selection” on page 25 – “Start-up Times for the 128 kHz Internal Oscillator” on page 26 – “Active Clock Domains and Wake-up Sources in the Different Sleep Modes” on page 32 – “Watchdog Timer Prescale Select” on page 46 – “Reset and Interrupt Vectors” on page 47 – “Overriding Signals for Alternate Functions in PA7..PA5” on page 62 – “Overriding Signals for Alternate Functions in PA4..PA2” on page 63 – “Overriding Signals for Alternate Functions in PA1..PA0” on page 63 – “Port B Pins Alternate Functions” on page 64 – “Overriding Signals for Alternate Functions in PB3..PB2” on page 65 – “Overriding Signals for Alternate Functions in PB1..PB0” on page 66 – “Waveform Generation Modes” on page 109 – “ADC Conversion Time” on page 138 – “Temperature vs. Sensor Output Voltage (Typical Case)” on page 144 – “DC Characteristics. TA = -40°C to +85°C (1)” on page 175 – “Calibration Accuracy of Internal RC Oscillator” on page 178 – “Reset, Brown-out, and Internal Voltage Characteristics” on page 179 – “VBOT vs. BODLEVEL Fuse Coding” on page 180 – “ADC Characteristics, Single Ended Channels. -40°C - 85°C” on page 181 – “ADC Characteristics, Differential Channels (Bipolar Mode), TA = -40°C to 85°C” on page 183 – “Serial Programming Characteristics, TA = -40°C to 85°C, VCC = 1.8 - 5.5V (Unless Otherwise Noted)” on page 184 – “High-voltage Serial Programming Characteristics TA = 25°C, VCC = 5V (Unless otherwise noted)” on page 185 6. Updated code examples in sections: – “Write” on page 17 – “SPI Master Operation Example” on page 119 7. Updated “Ordering Information” in – “ATtiny84” on page 220 27.2 Rev F. 02/07 1. 2. 3. Updated Figure 1-1 on page 2, Figure 8-7 on page 42, Figure 20-6 on page 185. Updated Table 9-1 on page 47, Table 10-7 on page 64, Table 11-2 on page 79, Table 11-3 on page 80, Table 11-5 on page 80, Table 11-6 on page 81, Table 11-7 on page 81, Table 11-8 on page 82, Table 20-10 on page 183, Table 20-12 on page 185. Updated table references in “TCCR0A – Timer/Counter Control Register A” on page 79. 229 8006G–AVR–01/08 27.3 27.4 27.5 27.6 4. 5. 6. 7. 8. 9. Updated Port B, Bit 0 functions in “Alternate Functions of Port B” on page 64. Updated WDTCR bit name to WDTCSR in assembly code examples. Updated bit5 name in “TIFR1 – Timer/Counter Interrupt Flag Register 1” on page 113. Updated bit5 in “TIFR1 – Timer/Counter Interrupt Flag Register 1” on page 113. Updated “SPI Master Operation Example” on page 119. Updated step 5 in “Enter High-voltage Serial Programming Mode” on page 168. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. All characterization data moved to “Electrical Characteristics” on page 175. All Register Descriptions gathered up in separate sections at the end of each chapter. Updated “System Control and Reset” on page 38. Updated Table 11-3 on page 80, Table 11-6 on page 81, Table 11-8 on page 82, Table 12-3 on page 108 and Table 12-5 on page 109. Updated “Fast PWM Mode” on page 99. Updated Figure 12-7 on page 100 and Figure 16-1 on page 133. Updated “Analog Comparator Multiplexed Input” on page 129. Added note in Table 19-12 on page 165. Updated “Electrical Characteristics” on page 175. Updated “Typical Characteristics” on page 186. 1. 2. 3. 4. 5. 6. Updated “Calibrated Internal 8 MHz Oscillator” on page 25. Updated “OSCCAL – Oscillator Calibration Register” on page 29. Added Table 20-2 on page 178. Updated code examples in “SPI Master Operation Example” on page 119. Updated code examples in “SPI Slave Operation Example” on page 120. Updated “Signature Bytes” on page 162. 1. 2. 3. 4. Updated Features in “USI – Universal Serial Interface” on page 117. Added “Clock speed considerations” on page 123. Updated Bit description in “ADMUX – ADC Multiplexer Selection Register” on page 145. Added note to Table 18-1 on page 157. 1. 2. 3. Updated “Default Clock Source” on page 28 Updated “Power Reduction Register” on page 34. Updated Table 20-4 on page 179, Table 9-4 on page 42, Table 16-3 on page 145, Table 19-5 on page 161, Table 19-12 on page 165, Table 19-16 on page 172, Table 2010 on page 183. Updated Features in “Analog to Digital Converter” on page 132. Rev E. 09/06 Rev D. 08/06 Rev C. 07/06 Rev B. 05/06 4. 230 ATtiny24/44/84 8006G–AVR–01/08 ATtiny24/44/84 5. 6. 7. 8. 9. 27.7 Updated Operation in “Analog to Digital Converter” on page 132. Updated “Temperature Measurement” on page 144. Updated DC Characteristics in “Electrical Characteristics” on page 175. Updated “Typical Characteristics” on page 186. Updated “Errata” on page 224. Rev A. 12/05 Initial revision. 231 8006G–AVR–01/08 232 ATtiny24/44/84 8006G–AVR–01/08