Formosa BZX84C20 Smd zener diode Datasheet

SMD Zener Diode
BZX84C2V4 THRU BZX84C75
Formosa MS
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3
Rating and characteristic curves........................................................ 4~5
Pinning information........................................................................... 6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities........................................................... 9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
Formosa MS
SMD Zener Diode
BZX84C2V4 THRU BZX84C75
300mW Surface Mount Zener
Diodes - 2.4V-75V
Package outline
Features
(B)
0.012 (0.30)
0.020 (0.50)
0.045 (1.15)
.084(2.10)
.068(1.70)
0.120 (3.04)
0.110 (2.80)
MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free parts, ex.BZX84C2V4-H.
0.034 (0.85)
SOT-23
• Silicon epitaxial planar chip structure.
• Wide zener reverse voltage range 2.4V to 75V.
• Small package size for high density applications.
• Ideally suited for automated assembly processes.
• Lead-free parts meet environmental standards of
(C)
(A)
0.063 (1.60)
0.027 (0.67)
0.047 (1.20)
0.013 (0.32)
0.108 (2.75)
Mechanical data
0.051 (1.30)
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic , SOT-23
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
0.003 (0.09)
0.007 (0.18)
0.083 (2.10)
0.035 (0.89)
Dimensions in inches and (millimeters)
• Mounting Position : Any
• Weight : Approximated 0.008 gram
Maximum ratings (at T =25 C unless otherwise noted)
o
A
PARAMETER
Power Dissipation at T A=25°C
Thermal Resistance
CONDITIONS
Mounted on Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
Junction to Ambient
Operating junction temperature range
TYP.
PD
T STG
Page 2
MIN.
MAX.
300
R θJA
TJ
Storage temperature range
Http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Symbol
417
-55
-55
Document ID
Issued Date
DS-221718
2008/02/10
UNIT
mW
°C/W
+150
o
C
+150
o
C
Revised Date
Revision
2013/04/18
C
Page.
9
Formosa MS
SMD Zener Diode
BZX84C2V4 THRU BZX84C75
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Zener
voltage
Part No.
Marking
code
Zener
impedance
V Z @ I ZT ( Volts )
I ZT
Z ZT @ I ZT
Leakage
current
Z ZK @ I ZK
(Ω)Max
I ZK
mA
IR
θVz
(mV/k)
@ I ZT
C
@VR=0V
f=1MHz
VR
Min.
Nom.
Max.
mA
(Ω)Max
Volts
Min.
Max.
pF
BZX84C2V4
Z11
2.28
2.4
2.52
5.0
100
600
1
(uA)Max
50
1.0
-3.5
0
450
BZX84C2V7
Z12
2.57
2.7
2.84
5.0
100
600
1
20
1.0
-3.5
0
450
BZX84C3V0
Z13
2.85
3.0
3.15
5.0
95
600
1
10
1.0
-3.5
0
450
BZX84C3V3
Z14
3.14
3.3
3.47
5.0
95
600
1
5
1.0
-3.5
0
450
BZX84C3V6
Z15
3.42
3.6
3.78
5.0
90
600
1
5
1.0
-3.5
0
450
BZX84C3V9
Z16
3.71
3.9
4.1
5.0
90
600
1
3
1.0
-3.5
-2.5
450
BZX84C4V3
W9
4.09
4.3
4.52
5.0
90
600
1
3
1.0
-3.5
0
450
BZX84C4V7
Z1
4.47
4.7
4.94
5.0
80
500
1
3
2.0
-3.5
0.2
260
BZX84C5V1
Z2
4.85
5.1
5.36
5.0
60
480
1
2
2.0
-2.7
1.2
225
BZX84C5V6
Z3
5.32
5.6
5.88
5.0
40
400
1
1
2.0
-2.0
2.5
200
BZX84C6V2
Z4
5.89
6.2
6.51
5.0
10
150
1
3
4.0
0.4
3.7
185
BZX84C6V8
Z5
6.46
6.8
7.14
5.0
15
80
1
2
4.0
1.2
4.5
155
BZX84C7V5
Z6
7.13
7.5
7.88
5.0
15
80
1
1
5.0
2.5
5.3
140
BZX84C8V2
Z7
7.79
8.2
8.61
5.0
15
80
1
0.7
5.0
3.2
6.2
135
BZX84C9V1
Z8
8.65
9.1
9.56
5.0
15
100
1
0.5
6.0
3.8
7.0
130
BZX84C10
Z9
9.50
10
10.50
5.0
20
150
1
0.2
7.0
4.5
8.0
130
BZX84C11
Y1
10.45
11
11.55
5.0
20
150
1
0.1
8.0
5.4
9.0
130
BZX84C12
Y2
11.40
12
12.60
5.0
25
150
1
0.1
8.0
6.0
10
130
BZX84C13
Y3
12.35
13
13.65
5.0
30
170
1
0.1
8.0
7.0
11
120
BZX84C15
Y4
14.25
15
15.75
5.0
30
200
1
0.1
10.5
9.2
13
110
BZX84C16
Y5
15.20
16
16.80
5.0
40
200
1
0.1
11.2
10.4
14
105
BZX84C18
Y6
17.10
18
18.90
5.0
45
225
1
0.1
12.6
12.4
16
100
BZX84C20
Y7
19.00
20
21.00
5.0
55
225
1
0.1
14.0
14.4
18
85
BZX84C22
Y8
20.90
22
23.10
5.0
55
250
1
0.1
15.4
16.4
20
85
BZX84C24
Y9
22.80
24
25.20
5.0
70
250
1
0.1
16.8
18.4
22
80
BZX84C27
Y10
25.65
27
28.35
2.0
80
300
0.5
0.1
18.9
21.4
25.3
70
BZX84C30
Y11
28.50
30
31.50
2.0
80
300
0.5
0.1
21.0
24.4
29.4
70
BZX84C33
Y12
31.35
33
34.65
2.0
80
325
0.5
0.1
23.1
27.4
33.4
70
BZX84C36
Y13
34.20
36
37.80
2.0
90
350
0.5
0.1
25.2
30.4
37.4
70
BZX84C39
Y14
37.05
39
40.95
2.0
130
350
0.5
0.1
27.3
33.4
41.2
45
BZX84C43
Y15
40.85
43
45.15
2.0
150
375
0.5
0.1
30.1
37.6
46.6
40
51.8
40
BZX84C47
Y16
44.65
47
49.35
2.0
170
375
0.5
0.1
32.9
42.0
BZX84C51
Y17
48.45
51
53.55
2.0
180
400
0.5
0.1
35.7
46.6
57.2
40
BZX84C56
Y18
53.20
56
58.80
2.0
200
425
0.5
0.1
39.2
52.2
63.8
40
BZX84C62
Y19
58.90
62
65.10
2.0
215
450
0.5
0.1
43.4
58.8
71.6
35
BZX84C68
Y20
64.60
68
71.40
2.0
240
475
0.5
0.1
47.6
65.6
79.8
35
BZX84C75
Y21
71.25
75
78.75
2.0
255
500
0.5
0.1
52.5
73.4
88.6
35
Note : 1. 5% tolerance of Zener voltage
2. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
8
7
TYPICAL
TYPICAL TC
TC VALUES
VALUES
6
5
4
VZ@ IZT
3
2
1
0
-1
-2
-3
2
3
4
5
6
7
8
9
10
11
12
θVZ, TEMPERATURE COEFFICIENT (mV/°C)
θVZ, TEMPERATURE COEFFICIENT (mV/°C)
Rating and characteristic curves (BZX84C2V4 THRU BZX84C75)
100
TYPICAL
TYPICAL TC
TC VALUES
VALUES
VZ @ I ZT
10
1
10
100
VZ, NOMINAL ZENER VOLTAGE (V)
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 2. Temperature Coefficients
(Temperature Range −55°C to +150°C)
Figure 1. Temperature Coefficients
(Temperature Range −55°C to +150°C)
1000
IZ = 1 mA
TJ=25°C
IZ(AC)=0.1IZ(DC)
f=1kHz
IF, FORWARD CURRENT (mA)
ZZT,DYNAMIC IMPEDANCE(Ω)
1000
100
5 mA
20 mA
10
1
1
10
100
100
VZ, NOMINAL ZENER VOLTAGE (V)
150C
1
0.4
0.5
75 C 25 C
0.6
0.7
0C
0.8
0.9
1.0
1.1
1.2
VF, FORWARD VOLTAGE (V)
Figure 3. Effect of Zener Voltage on
Zener Impedance
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Figure 4. Typical Forward Voltage
Page 4
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
, LEAKAGE CURRENT (μA)
Rating and characteristic curves (BZX84C2V4 THRU BZX84C75)
1000
TA = 25C
C, CAPACITANCE (pF)
0V BIAS
1V BIAS
100
BIAS AT
50% OF V Z NOM
100
10
1
+150 C
0.1
0.01
IR
10
1000
+25 C
0.001
-55 C
0.0001
1
1
0.00001
0
100
10
V Z , NOMINAL ZENER VOLTAGE (V)
10
20
30
40
50
60
Figure 5. Typical Capacitance
90
100
TA = 25C
I Z , ZENER CURRENT (mA)
TA = 25C
I Z , ZENER CURRENT (mA)
80
Figure 6. Typical Leakage Current
100
10
1
0.1
0.01
0
70
V Z , NOMINAL ZENER VOLTAGE (V)
2
4
6
8
10
12
10
1
0.1
0.01
10
50
70
90
Figure 8. Zener Voltage versus Zener Current
(12V to 91V)
Figure 7. Zener Voltage versus Zener Current
(VZ Up to 12 V)
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30
V Z , ZENER VOLTAGE (V)
V Z , ZENER VOLTAGE (V)
Page 5
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
SMD Zener Diode
BZX84C2V4 THRU BZX84C75
Formosa MS
Pinning information
Pin
Simplified outline
Symbol
(C)
PinA
PinB
PinC
no connection
anode
cathode
(C)
(A)
(B)
(A)
(B)
Suggested solder pad layout
SOT-23
0.037(0.95)
0.037(0.95)
0.079(2.0)
0.035(0.90)
0.031(0.80)
Dimensions in inches and (millimeters)
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TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
Formosa MS
SMD Zener Diode
BZX84C2V4 THRU BZX84C75
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOT-23
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.15
2.77
1.22
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
SMD Zener Diode
BZX84C2V4 THRU BZX84C75
Formosa MS
Reel packing
PACKAGE
SOT-23
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
3,000
4.0
30,000
REEL
DIA,
(m/m)
INNER
BOX
(m/m)
183*183*123
CARTON
SIZE
(m/m)
178
382*262*387
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
11.6
240,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
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TEL:886-2-22696661
FAX:886-2-22696141
Page 8
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
SMD Zener Diode
BZX84C2V4 THRU BZX84C75
Formosa MS
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Pressure Cooker
15P SIG at T A=121 OC for 4 hrs.
JESD22-A102
5. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
MIL-STD-750D
METHOD-1051
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
6. Humidity
7. High Temperature Storage Life
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TEL:886-2-22696661
FAX:886-2-22696141
Page 9
Document ID
Issued Date
DS-221718
2008/02/10
Revised Date
Revision
2013/04/18
C
Page.
9
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