FJX3008R FJX3008R Switching Application (Bias Resistor Built In) 3 • Switching circuit, Inverter, Interface circuit, Driver Circuit • Built in bias Resistor (R1=47KΩ, R2=22KΩ) • Complement to FJX4008R 2 1 SOT-323 1. Base 2. Emitter 3. Collector Marking S08 Equivalent Circuit C R1 B R2 NPN Epitaxial Silicon Transistor E Absolute Maximum Ratings Ta=25°C unless otherwise noted Symbol VCBO Collector-Base Voltage Parameter Value 50 Units V VCEO VEBO Collector-Emitter Voltage 50 V Emitter-Base Voltage 10 IC V Collector Current 100 mA PC Collector Power Dissipation 200 mW TJ Junction Temperature 150 °C TSTG Storage Temperature -55 ~ 150 °C Electrical Characteristics Ta=25°C unless otherwise noted Symbol BVCBO Parameter Collector-Base Breakdown Voltage Test Condition IC=10µA, IE=0 BVCEO Collector-Emitter Breakdown Voltage IC=100µΑ, IB=0 ICBO Collector Cut-off Current VCB=40V, IE=0 Min. 50 Typ. Max. Units V 0.1 µA 50 V hFE DC Current Gain VCE=5V, IC=5mA VCE(sat) Collector-Emitter Saturation Voltage IC=10mA, IB=0.5mA 56 fT Current Gain Bandwidth Product IC=10mA, IB=0.5mA 250 MHz Cob Output Capacitance VCB=10V, IE=0 f=1.0MHz 3.7 pF 0.3 VI(off) Input Off Voltage VCE=5V, IC=100µA VI(on) Input On Voltage VCE=0.3V, IC=2mA R1 Input Resistor 32 R1/R2 Resistor Ratio 1.9 ©2002 Fairchild Semiconductor Corporation 0.8 V V 4 V 47 62 KΩ 2.1 2.4 Rev. A2, August 2002 FJX3008R Typical Characteristics 100 VCE = 5V R1 = 47K R2 = 22K VCE = 0.3V R1 = 47K R2 = 22K VI(on)[V], INPUT VOLTAGE hFE, DC CURRENT GAIN 1000 100 10 100 1 0.1 0.1 10 1 10 1000 1 10 100 IC[mA], COLLECTOR CURRENT IC[mA], COLLECTOR CURRENT Figure 1. DC current Gain Figure 2. Input On Voltage 400 VCE = 5V R1 = 47K R2 = 22K 350 PC[mW], POWER DISSIPATION IC [µA], COLLECTOR CURRENT 1000 100 10 0.6 300 250 200 150 100 50 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 VI(off)[V], INPUT OFF VOLTAGE Figure 3. Input Off Voltage ©2002 Fairchild Semiconductor Corporation 2.4 2.6 2.8 0 25 50 75 100 125 150 175 o T a[ C], AMBIENT TEMPERATURE Figure 4. Power Derating Rev. A2, August 2002 FJX3008R Package Dimensions SOT-323 2.00±0.20 3° 1.25±0.10 2.10±0.10 0.95±0.15 0.90 ±0.10 +0.05 0.05 –0.02 1.00±0.10 1.30±0.10 0.275±0.100 3° +0.04 0.135 –0.01 0.10 Min Dimensions in Millimeters ©2002 Fairchild Semiconductor Corporation Rev. A2, August 2002 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FACT™ ActiveArray™ FACT Quiet series™ Bottomless™ FAST® FASTr™ CoolFET™ CROSSVOLT™ FRFET™ GlobalOptoisolator™ DOME™ EcoSPARK™ GTO™ E2CMOS™ HiSeC™ EnSigna™ I2C™ Across the board. Around the world.™ The Power Franchise™ Programmable Active Droop™ ImpliedDisconnect™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET® VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. ©2002 Fairchild Semiconductor Corporation Rev. I1