Rohm BM1P101FJ-E2 Pwm control type dc/dc converter ic Datasheet

Datasheet
AC/DC Drivers
PWM Control type
DC/DC converter IC
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
●General
The PWM type DC/DC converter (BM1Pxxx) for
AC/DC provide an optimum system for all products
that include an electrical outlet.
BM1Pxxx supports both isolated and non-isolated
devices, enabling simpler design of various types of
low-power electrical converters.
BM1Pxxx built in a HV starter circuit that tolerates
650V, it contributes to low-power consumption.
With switching MOSFET and current detection
resistors as external devices, a higher degree of
design freedom is achieved. Since current mode
control is utilized, current is restricted in each cycle
and excellent performance is demonstrated in
bandwidth and transient response.
At light load, the switching frequency is reduced and
high efficiency is achieved.
A frequency hopping function is also on chip, which
contributes to low EMI.
BM1Pxxx has rich protection.
●Features
„ PWM frequency : 65kHz, 100kHz
„ PWM current mode method
„ Frequency Hopping function
„ Burst operation / Frequency reduction function
when load is light
„ Built-in 650V start circuit
„ VCC pin under voltage protection
„ VCC pin over voltage protection
„ CS pin Open protection
„ CS pin Leading-Edge-Blanking function
„ Per-cycle over current protection circuit
„ Current protection with AC voltage compensation
„ Soft start
„ Secondary Over current protection circuit
●Package
SOP-J8
●Basic specifications
„ Operating Power Supply Voltage Range:
VCC 8.9V to 26.0V
VH:
to 600V
„ Operating Current:
Normal Mode:0.60mA (Typ.)
Burst Mode: 0.35mA(Typ.)
„ Oscillation Frequency:
BM1P06xFJ:65kHz(Typ.)
BM1P10xFJ:100kHz(Typ.)
„ Operating Temperature:
- 40deg. to +85deg.
●Application circuit
4.90mm×3.90mm ×1.65mm
(Typ.) (Typ.) (TYP.)
Pitch 1.27mm
(TYP.)
●Applications
AC adapters and household appliances (vacuum
cleaners, humidifiers, air cleaners, air conditioners, IH
cooking heaters, rice cookers, etc.)
●Line-Up
BM1P101FJ
BM1P102FJ
BM1P061FJ
BM1P062FJ
Frequency
100kHz
100kHz
65kHz
65kHz
VCCOVP
Auto Restart
Latch
Auto Restart
Latch
Figure 1.Application circuit
○Product structure:Silicon monolithic integrated circuit
.www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
○This product is not designed protection against radioactive rays
1/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
●Absolute Maximum Ratings(Ta=25°C)
Parameter
Symbol
Rating
Unit
Conditions
Maximum voltage 1
Vmax1
-0.3~30.0
V
VCC
Maximum voltage 2
Vmax2
-0.3~6.5
V
CS, FB, ACMONI
Maximum voltage 3
Vmax3
-0.3~15.0
V
OUT
Maximum voltage 4
Vmax4
-0.3~650
V
VH
OUT Pin Peak Current
IOUT
±1.0
A
Allowable dissipation
Pd
674.9 (Note1)
mW
When implemented
Operating
o
C
Topr
-40 ~ +85
temperature range
Storage
o
Tstr
-55 ~ +150
C
temperature range
(Note1) When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
Reduce to 5.40 mW/°C when Ta = 25°C or above.
●Operating Conditions(Ta=25°C)
Parameter
Power supply voltage range 1
Power supply voltage range 2
Symbol
VCC
VH
Rating
8.9~26.0
80 ~600
Unit
V
V
●Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)
Specifications
Parameter
Symbol
Minimum
Standard Maximum
Conditions
VCC pin voltage
VH pin voltage
Unit
Conditions
[Circuit current]
FB=2.0V
(during pulse operation)
FB=0.0V
(during burst operation)
Circuit current (ON) 1
ION1
-
600
850
µA
Circuit current (ON) 2
ION2
-
350
450
µA
[VCC protection function]
VCC UVLO voltage 1
VUVLO1
12.50
13.50
14.50
V
VCC UVLO voltage 2
VUVLO2
7.50
8.20
8.90
V
VCC UVLO hysteresis
VUVLO3
-
5.30
-
V
VCC Recharge start voltage
VCHG1
7.70
8.70
9.70
V
VCC Recharge stop voltage
VCC OVP voltage 1
VCHG2
VOVP1
12.00
26.0
13.00
27.5
14.00
29.0
V
V
VCC OVP voltage 2
VOVP2
VCC OVP hysteresis
VOVP3
-
4.00
-
V
VCC rise
VCC drop
BM1P061FJ/BM1P101FJ
VUVLO3= VUVLO1- VUVLO2
Start up circuit operation
voltage
The stop voltage from VCHG1
VCC rise
VCC drop
BM1P061FJ/BM1P101FJ
BM1P061FJ/BM1P101FJ
VOUTH
10.5
12.5
14.5
V
IO=-20mA
IO=+20mA
23.5
V
[OUT pin]
OUT Pin High voltage
OUT Pin Low voltage
VOUTL
-
-
1.00
V
OUT Pin pull down resistance
RPDOUT
75
100
125
kΩ
VACMONI1
0.92
1.00
1.08
V
ACMONI rise
ACMONI detect voltage2
VACMONI2
0.63
0.70
0.77
V
ACMONI drop
ACMONI hysteresis
VACMONI3
0.20
0.30
0.40
V
ACMONI Timer
TACMONI1
180
256
330
mS
[Start circuit block ]
Start current 1
ISTART1
0.400
0.700
1.000
mA
VCC= 0V
Start current 2
ISTART2
1.000
3.000
5.000
mA
OFF current
ISTART3
-
10
20
uA
VCC=10V
Inflow current from Drain pin
after UVLO released UVLO
VSC
0.400
0.800
1.400
V
[ ACMONI Detector ]
ACMONI detect voltage1
Start current changing voltage
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
●Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)
Specifications
Parameter
Symbol
Minimum
Standard Maximum
Unit
Conditions
[PWM type DCDC driver block]
FB=2.00V
average frequency
BM1P061FJ/BM1P062FJ
FB=2.00V
average frequency
BM1P101FJ/BM1P102FJ
FB=0.40V
average frequency
FB=2.00V
average frequency
BM1P061FJ/BM1P062FJ
FB=2.00V
average frequency
BM1P101FJ/BM1P102FJ
Oscillation frequency 1a
FSW1a
60
65
70
kHz
Oscillation frequency 1b
FSW1b
90
100
110
kHz
Oscillation frequency 2
FSW2
-
25
-
kHz
Hopping fluctuation
frequency range 1
FDEL1
-
4.0
-
kHz
Hopping fluctuation
frequency range 2
FDEL2
-
6.0
-
kHz
Hopping fluctuation frequency
Minimum pulse width
Soft start time 1
Soft start time 2
Soft start time 3
Soft start time 4
Maximum duty
FB pin pull-up resistance
FB / CS gain
FB burst voltage 1
FB burst voltage 2
FCH
Tmin
TSS1
TSS2
TSS3
TSS4
Dmax
RFB
Gain
VBST1
VBST2
75
0.30
0.60
1.20
2.40
68.0
22
0.300
0.350
125
400
0.50
1.00
2.00
4.00
75.0
30
4.00
0.400
0.450
175
0.70
1.40
2.80
5.60
82.0
38
0.500
0.550
Hz
ns
ms
ms
ms
ms
%
kΩ
V/V
V
V
FB OLP voltage 1a
VFOLP1A
2.60
2.80
3.00
V
FB OLP voltage 1b
VFOLP1B
-
VFOLP2A-0.2
-
V
FB OLP ON timer
FB OLP Start up timer
FB OLP OFF timer
TFOLP
TFOLP2
TOLPST
44
26
358
64
32
512
84
38
666
ms
ms
ms
Latch released VCC voltage
VLATCH
-
VUVLO2-0.5
-
V
Latch mask time
TLATCH
50
100
200
us
VCS
0.380
0.400
0.420
V
VCS_SS1
-
0.100
-
V
VCS_SS2
-
0.150
-
V
TSS1 [ms] ~ TSS2 [ms]
VCS_SS3
-
0.200
-
V
TSS2 [ms] ~ TSS3[ms]
VCS_SS4
-
0.300
-
V
TSS3 [ms] ~ TSS4 [ms]
TLEB
-
250
-
ns
KCS
12
20
28
mV/us
FB drop
FB drop
When overload is detected
(FB rise)
When overload is detected
(FB drop)
VCC Pin voltage
BM1P062FJ/BM1P102FJ
VCCOVP
BM1P062FJ/BM1P102FJ
[Over current detection block]
Over current detection voltage
Over current detection
voltage SS1
Over current detection
voltage SS2
Over current detection
voltage SS3
Over current detection
voltage SS4
Leading Edge Blanking Time
Over current detection AC
Voltage compensation factor
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/18
Ton=0us
0[ms] ~ Tss1[ms]
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
●PIN DESCRIPTIONS
Table 1. Pin Description
NO.
Pin Name
I/O
1
2
3
4
5
6
7
8
ACMONI
FB
CS
GND
OUT
VCC
N.C.
VH
I
I
I
I/O
O
I/O
I
Function
Comparator input pin
Feedback signal input pin
Primary Current sense pin
GND pin
External MOSFET driver pin
Power supply input pin
Non Connection
Starter pin
ESD Diode
VCC
○
○
○
○
○
-
GND
○
○
○
○
○
○
●I/O Equivalent Circuit Diagram
Figure 2 .
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
I/O Equivalent Circuit Diagram
4/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Datasheet
●Block Diagram
Figure 3. Block Diagram
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
●Description of Blocks
( 1 ) Start circuit (VH Pin : 8pin)
This IC built in the Start up circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.
After starting, consumption power is idling current ISTART3(typ=10uA) only.
Reference values of Starting time are shown in Figure-6. When Cvcc=10uF it can start less than 0.1 sec.
Figure 4. Block diagram of start up circuit
1.0
0.9
0.8
起動時間[sec]
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
5
10
15
20
25
30
35
40
45
50
Cvcc [uF]
Figure 5. Start current vs VCC voltage
Figure 6. Start time( reference value)
* Start up current flows from the DRAIN pin
ex) Consumption power of start up circuit only when the Vac=100V
PVH=100V*√2*10uA=1.41mW
ex) Consumption power of start up circuit only when the Vac=240V
PVH=240V*√2*10uA=3.38mW
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
6/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(2 ) Start sequences
(Soft start operation, light load operation, and auto recovery operation during overload protection)
Start sequences are shown in Figure 7. See the sections below for detailed descriptions.
VH
VCC=13.5V
VCC(1pin)
VCC=8.2V
Within
Internal REF
Pull Up
Within
64ms
Within
64ms
64ms
FB(8pin)
Vout
Over Load
Normal Load
Light LOAD
Iout
Burst mode
Switching
stop
Switching
Soft
Start
A
BC
D
E
F
GH
IJ
K
Figure 7. Start sequences Timing Chart
A : Input voltage VH is applied
B : This IC starts operating , when VCC pin voltage rises VCC > VUVLO1 (13.5 V typ).
Switching function starts when other protection functions are judged as normal.
Between the secondary output voltage become constant level, because the VCC pin consumption current causes the VCC
value to drop, IC should set to start switching until VCC<VUVLO2 (8.2V typ).
C : With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.
D : When the switching operation starts, VOUT rises.
Once the output voltage starts, set the rated voltage within the TFOLP2 period (32ms typ).
E : When there is a light load it reaches FB voltage < VBST (= 0.4Vtyp, burst operation is used to keep power consumption
down.
During burst operation, it becomes low-power consumption mode.
F : When the FB Voltage>VFOLP1A(=2.8V.typ), it becomes a overload
G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above T FOLP (32 ms typ), the overload protection function is
triggered and switching stops. During the TFOLP period (32ms typ) if the FB pin voltage becomes FB<VFOLP1B even once,
the IC’s internal timer is reset.
H : If the VCC voltage drops to VCC < VUVLO2 (7.7Vtyp) or below, restart is executed.
I : The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)
J : Same as F
K : Same as G
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
7/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(3) VCC pin protection function
BM1Pxxx built in VCCUVLO (Under Voltage Lock Out), VCC OVP (Over Voltage Protection) and VCC charge function that
operates in case of dropping the VCC voltage.
This function monitors VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal voltage.
VCC charge function stabilizes the secondary output voltage to be charged from the high voltage line by start circuit when
dropping the VCC voltage.
(3-1) VCC UVLO / VCC OVP function
VCCUVLO is auto recovery comparator. BM1Pxx1 series have auto recovery type VCCOVP that has voltage hysteresis.
BM1Pxx2 series has latch type VCCOVP.
Refer to the operation figure-8.
VCCOVP operates detection in case of continuing VCC pin voltage > VOVP1 (typ=27.5V).
This function built in mask time TLATCH(typ=100us).By this function, this IC masks pin generated surge etc. (please refer to
section (7))
Vovp
VCCuvlo1
VCCCHG2
VCCCHG1
VCCuvlo2
Vlatch
ON
ON
OFF
OFF
ON
OFF
OFF
ON
ON
OFF
OFF
ON
ON
OFF
ON
OFF
OFF
OFF
ON
ON
OFF
OFF
L : Normal
H : Latch
TLATCH
A
B
CD
E
F
G H
I
J K
A
Figure 8. VCC UVLO / OVP Timing Chart
A:The VH pin voltage input, the VCC pin voltage starts rising.
B:VCC>Vuvlo1, the DC/DC operation starts
C:VCC > VOVP1 , the VCCOVP function is detected.
D:VCC > VOVP1 continues TLATCH(typ =100us), switching is stopped by the VCCOVP function (LATCH MODE) .
E:VCC< VCHG1, the VCC charge function operates and the VCC voltage is rise.
F:VCC > VCHG2, the VCC charge function is stopped.
G:Same as E.
H:Same as F.
I: The VH pin is OPEN. The VCC Voltage is fall.
J: VCC<Vuvlo2, the DC/DC operation stops
K: VCC<VLATCH,, the LATCH function is reset.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
8/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(3-2)VCC Charge function
The VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin voltage
drops to <VCHG1. At that time the VCC pin is charged from the VH pin through the start up circuit.
By this operation, BM1Pxxx doesn’t occur to start failure.
The VCC pin voltage is rise, then VCC >VCHG2, charge is stopped. The operations are shown in figure 9.
VH
VUVLO1
VCHG2
VCC VCHG1
VUVLO2
Switching
VH charge
charge
charge charge charge
OUTPUT
voltage
A
B C D E
F G H
Figure 9. Charge operation VCC pin charge operation
A:The VH pin voltage rises, the charge starts to the VCC pin by the VCC charge function.
B:VCC > VUVLO1, the VCC UVLO function releases, the VCC charge function stops, the DC/DC operation starts.
C:When DC/DC operation starts, the VCC voltage drops.
D:VCC < VCHG1, the VCC recharge function operates.
E:VCC > VCHG2, the VCC recharge function stops.
F:VCC < VCHG1, the VCC recharge function operates.
G:VCC < VCHG1, the VCC recharge function stops.
H:After a start of output voltage finished, the VCC Pin is charged by the auxiliary winding, then VCC pin stabilizes.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
9/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
( 4 ) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)
BM1Pxxx is a current mode PWM control.
An internal oscillator sets a fixed switching frequency.
BM1Pxxx is integrated the hopping function of the switching frequency which changes the switching frequency to fluctuate
as shown in Figure 10.
The fluctuation cycle is 125 Hz typ.
Figure 10-1.
hopping function (BM1P06x series)
Figure 10-2. hopping function (BM1P10x series)
Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).
With the current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.
As a countermeasure to this, BM1Pxxx is built in slope compensation circuits.
BM1Pxxx is built in the burst mode circuit and the frequency reduction circuit to achieve low power consumption, when the
load is light.
The FB pin is pull up by RFB (30 kΩ typ).
The FB pin voltage is changed by secondary output voltage (secondary load power).
To monitor the FB pin, the burst mode operation and the frequency detection is operated.
Figure 11 shows the FB voltage, the switching frequency and the DC/DC operation
・mode1 : the burst operation
・mode2: the frequency reduction operation. (reduce the max frequency)
・mode3 : the fixed frequency operation.(operate at the max frequency)
・mode4 : the over load operation.(detect the over load state and stop the pulse operation)
Figure-11-1. Switching operation state
Figure-11-2. Switching operation state
(BM1P06x series)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
(BM1P10x series)
10/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(5) Over Current limiter
BM1Pxxx is built in the Over Current limiter per cycle. If the CS pin is over a certain voltage, the switching is stopped. It is
also built in the AC voltage compensation function. The function is rise over the current limiter level by time to compensate
AC voltage.
Shown in figure-12,13,14
Figure 12. No AC voltage compensation function
Figure 13.buit-in AC compensation voltage
The primary peak current is decided as the formula below.
The primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay
Vcs :the over current limiter voltage
Rs :the current detection resistance
Vdc :the input DC voltage
Lp :the Primary inductance
Tdelay:the delay time after the detection of the over current limiter
Figure 14. Over current limiter voltage
(6)L.E.B blanking period
When the driver MOSFET is turned ON, a surge current occurs at capacitor components and the drive current.
Therefore, because of rising the CS pin voltage temporarily, the detection errors may occur in the over current limiter
circuit. To prevent detection errors, when the OUT pin is switched from high to low, the CS signal is masked for 250 ns by
the on-chip LEB (Leading Edge Blanking) function. This blanking function reduces CS pin noise filter for the noise that
occurs when the OUT pin is switched from high to low.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(7) CS pin (1pin) open protection
If the CS pin becomes OPEN, other IC may be damaged.
To prevent this damage, BM1Pxxx built in the OPEN protection circuit(auto recovery protection).
(8) Output over load protection function (FB OLP Comparator)
The output overload protection monitors the secondary output load status at the FB pin.
This function stops a switching when an overload occurs. When there is an overload, the output voltage is dropped and the
photo coupler current becomes zero, so the FB pin voltage is rised.
When the FB pin voltage > VFOLP1A (2.8 V typ) continuously for the period T FOLP2 (32 ms typ), it is judged as an overload and
stops switching.
When the FB pin > FVFOLP1A (2.8 V typ), if the voltage goes lower than VFOLP1B (2.6V typ) during the period T FOLP2 (32 ms typ),
the overload protection timer is reset. The switching operation is performed during this period T FOLP2 (32ms typ)
At startup, the FB voltage is pulled up to the IC’s internal voltage, so the operation starts at a voltage of VFOLP1A (2.8 V typ)
or above. Therefore, at startup the FB voltage must be set to go to V FOLP1B (2.6 Vtyp) or below during the period T FOLP1 (32
ms typ), and the secondary output voltage’s start time must be set within the period T FOLP2 (32 ms typ) following startup of
the IC.
Recovery from the once detection of FBOLP, after the period T FOLP2 (512 ms typ)
Figure 15. Over load protection (Auto recovery)
A: The FBOLP comparator detects over load for FB>VFOLP1A
B: States of A continuously for the period TFOLP2 (32 ms typ), it is judged as an overload and stops switching.
C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches
< VCHG , the VCC charge function operates so the VCC pin voltage rises.
D: VCC charge function stops when VCC pin voltage > VCHG2
E: If TOLPST (typ =512ms) go on from B point, Switching function starts on soft start.
F: If TFOLP2(typ=32ms) go on from E point to continues a overload condition (FB>VFOLP1A), Switching function stops at F
point.
G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises.
H: If VCC pin (1pin) voltage becomes over VCHG2 by the VCC charge function, VCC charge function operation stops
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(9) OUT Pin Voltage clamper
BM1Pxxx has a gate clamper function. It set the OUT pin high voltage to VOUTH(typ=12.5V).
It prevents the damage for MOSFET gate by the rising of VCC pin (6pin) voltage. (Shown in Figure16)
Figure 16. OUT pin (5pin) Block Diagram
( 10 ) ACMONI Function
Brownout function is built inside BM1PXXX. Brownout function means that DC/DC action will stop when input AC
voltage is low. Application example is shown in Figure 17. Input voltage is divided by resistance and input into ACMONI
terminal. If voltage of ACMONI terminal exceeds VACMONI1 (1.0V typ), circuit will detect normal status and start to execute
DC/DC action. After DC/DC action and voltage of ACMONI terminal is lower than VACMONI2(0.7V typ), TACMONI(typ.256ms)
later, DC/DC action becomes OFF.
Figure 17. Application circuit
* If brownout function is not used, please set voltage value within the range of VACMONI(1.0Vtyp)~5.0V.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
●Operation mode of protection circuit
Operation mode of protection functions are shown in table2.
Table 2.
Operation mode of protection circuit
Function
Operation mode
VCC Under Voltage Locked Out
VCC Over Voltage Protection
FB Over Limited Protection
CS Open Protection
Auto recovery
BM1Pxx1 series : Auto recovery (with 100us Timer)
BM1Pxx2 series : Latch (with 100us Timer)
Auto recovery(with 32ms timer)
Auto recovery
●Sequence
The sequence diagram is show in Figure 18 and Figure19
All condition transits OFF Mode VCC<8.2V
Figure 18. The sequence diagram (BM1PXX1 Series)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Datasheet
OFF MODE
Soft Start1
Soft Start2
Soft Start3
Soft Start4
CS OPEN MODE
( Pulse Stop)
LATCH OFF MODE
( Pulse Stop)
Normal MODE
OLP MODE
( Pulse Stop)
Burst & Low Power MODE
Figure 19. The sequence diagram(BM1PXX2 Series)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Thermal loss
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 85 or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70 mm × 70 mm × 1.6 mm, mounted on glass epoxy substrate)
1000
900
800
700
Pd[mW]
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ta[℃]
Figure 20. Thermal Abatement Characteristics
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Datasheet
● Use-related cautions
(1) Absolute maximum ratings
Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are
exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular
mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a
fuse should be investigated.
(2) Power supply and ground lines
In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there
are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in
the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes
and small signal routes, including the external circuits. Also, with regard to all of the LSI’s power supply pins, in
addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be
problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems
with the characteristics of the capacitor to be used before determining constants.
(3) Ground potential
The ground pin’s potential should be set to the minimum potential in relation to the operation mode.
(4) Pin shorting and attachment errors
When attaching ICs to the set board, be careful to avoid errors in the IC’s orientation or position. If such attachment
errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin
and a power supply line, or between ground lines.
(5) Operation in strong magnetic fields
Note with caution that these products may become damaged when used in a strong magnetic field.
(6) Input pins
In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic
elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.
Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage
that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no
power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied
to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical
characteristics.
(7) External capacitors
When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal
capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining
constants.
(8) Thermal design
The thermal design should fully consider allowable dissipation (Pd) under actual use conditions.
Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.
(9) Rush current
In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,
so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern
wires, and how they are laid out.
(10) Handling of test pins and unused pins
Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the
descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.
(11) Document contents
Documents such as application notes are design documents used when designing applications, and as such their
contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for
external parts.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
●Ordering Information
B
M
1
P
X
X
X
F
J
-
Package
FJ
: SOP-J8
Product name
E2
Packaging and
forming specification
E2: Embossed tape and reel
●Physical Dimension Tape and Reel Information
SOP-J8
<Tape and Reel information>
4.9±0.2
(MAX 5.25 include BURR)
+6°
4° −4°
6
5
0.45MIN
7
3.9±0.2
6.0±0.3
8
1
2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.545
0.2±0.1
0.175
1.375±0.1
S
1.27
0.42±0.1
0.1 S
Direction of feed
1pin
(Unit : mm)
Reel
●Marking Diagram
∗ Order quantity needs to be multiple of the minimum quantity.
●Line-Up
Product name
(BM1PXXXFJ)
BM1P101FJ
1PXXX
BM1P102FJ
BM1P061FJ
BM1P062FJ
LOT No.
1PIN MARK
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/18
TSZ02201-0F2F0A200090-1-2
22.NOV.2012.Rev.003
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Similar pages