ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D High Brightness SMT Round LED Lamps Amber, Red, Green and Blue Tinted LEDs Data Sheet Description Features The new Avago ALMD-xx3D LED series has the same or just slightly less luminous intensity than conventional high brightness, through-hole LEDs. x Compact form factor The new LED lamps can be assembled using common SMT assembly processes and are compatible with industrial reflow soldering processes. x Red AlInGaP 626nm The LEDs are made with an advanced optical grade epoxy for superior performance in outdoor sign applications. For easy pick and place assembly, the LEDs are shipped in EIA-compliant tape and reel. Every reel is shipped from a single intensity and color bin– except the red color–for better uniformity. Package Dimensions A x High brightness material x Available in Red, Amber, Green and Blue color x Amber AlInGaP 590nm x Green InGaN 525nm x Blue InGaN 470nm x Jedec MSL 2A x Compatible with industrial reflow soldering process x Typical Viewing angle: 30° x Tinted, non-diffused Applications x Variable Message Signs A 4.20 ±0.20 C A: Anode C: Cathode C 4.20 ±0.20 4.75 ±0.50 6.50 ±0.50 3.40 ±0.50 2.50 ±0.20 1.4 (4x) C A 1.0 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.20 mm unless other specified. CAUTION: InGaN devices are Class 1C HBM ESD sensitive; AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Part Number Color and Dominant Wavelength Od (nm) Typ [3] Luminous Intensity Iv (mcd) [1,2,5] Min Max Viewing Angle Typ (°) [4] 30° ALMD-EG3D-VX002 Red 626 4200 9300 ALMD-EL3D-VX002 Amber 590 4200 9300 ALMD-CM3D-WY002 Green 525 5500 12000 ALMD-CB3D-RT002 Blue 470 1500 3200 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. T½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% Part Numbering System ALMD – X X 3D – x x x xx Packaging Option 02: tested 20mA, 13 inch carrier tape, 8mm pitch, 16mm carrier width Color Bin Selection 0: Full Distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Untinted/Tinted Lens D: Tinted Viewing Angle 3: 30° Color B: Blue G: Red L: Amber M: Green Package C: SMT Round Lamp InGaN E: SMT Round Lamp AlInGaP SMT Lamps 2 Absolute Maximum Rating, TJ = 25°C Parameter Red and Amber DC Forward Current [1] Blue and Green Unit 50 30 mA Peak Forward Current 100 [2] 100 [3] mA Power Dissipation 120 114 mW Reverse Voltage 5 (IR = 100 PA) 5 (IR = 10 PA) V LED Junction Temperature 130 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4 and Figure 9 2. Duty Factor 30%, frequency 1KHz. 3. Duty Factor 10%, frequency 1KHz. Electrical / Optical Characteristics, TJ = 25°C Parameter Symbol Forward Voltage Red Amber Green Blue VF Reverse Voltage Red & Amber Green & blue VR Dominant Wavelength [1] Red Amber Green Blue Od Peak Wavelength Red Amber Green Blue Thermal Resistance Luminous Efficacy [2] Red Amber Green Blue Thermal coefficient of Od Red Amber Green Blue Min. 1.8 1.8 2.8 2.8 Typ. 2.1 2.1 3.2 3.2 Max. Units Test Conditions V IF = 20 mA V IF = 100 PA IF = 10 PA 2.4 2.4 3.8 3.8 5 5 IF = 20 mA 618.0 584.5 519.0 460.0 626.0 590.0 525.0 470.0 630.0 594.5 539.0 480.0 OPEAK 634 594 516 464 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA RTJ-PIN 130 °C/W LED Junction-to-Pin KV 200 520 530 65 lm/W Emitted Luminous Power/Emitted Radiant Power nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C 0.059 0.103 0.028 0.024 Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is the luminous efficacy in lumens/watt. 3 AlInGaP 100 RELATIVE INTENSITY 0.8 Amber FORWARD CURRENT - mA 1 Red 0.6 0.4 0.2 500 550 600 WAVELENGTH - nm 20 0.5 1 1.5 2 FORWARD VOLTAGE - V 2.5 3 60 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Amber Red 50 40 30 20 10 0 0 20 40 60 FORWARD CURRENT - mA 80 100 Figure 3. Relative Intensity vs Forward Current 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 0 Figure 2. Forward Current vs Forward Voltage MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 40 650 Figure 1. Relative Intensity vs Wavelength RELATIVE DOMINANT WAVELENGTH SHIFT(NORMALIZED AT 20mA) - nm 60 0 0 Amber Red 0 20 0 20 40 60 TA - AMBIENT TEMPERATURE (°C) 80 Figure 4. Maximum Forward Current vs Ambient Temperature 40 60 FORWARD CURRENT - mA 80 Figure 5. Relative Dominant Wavelength Shift vs Forward Current 4 80 100 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 100 BLUE FORWARD CURRENT-mA RELATIVE INTENSITY InGaN GREEN 80 60 40 20 0 380 430 480 530 WAVELENGTH - nm 580 0 630 Figure 6. Relative Intensity vs Wavelength 1 2 3 FORWARD VOLTAGE-V 4 5 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 Figure 7. Forward Current vs Forward Voltage 35 3.5 3.0 IFmax - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) Blue 2.5 Green 2.0 1.5 1.0 0.5 0 20 40 60 80 DC FORWARD CURRENT-mA 100 120 Figure 8. Relative Intensity vs Forward Current RELATIVE DOMINANT WAVELENGTH SHIFT -nm 20 15 10 5 5 Green Blue 0 -5 0 20 0 20 Figure 9. Maximum Forward Current vs Ambient Temperature 10 40 60 FORWARD CURRENT-mA Figure 10. Dominant Wavelength Shift vs Forward Current 5 25 0 0.0 -10 30 80 100 NORMALIZED INTENSITY 1.0 0.8 0.6 0.4 A A X X 0.2 C 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE 60 90 Figure 11a. Radiation Pattern for X axis Figure 11b. Component Axis for Radiation Pattern 0.3 Red Amber Blue Green 1 -40 -15 10 35 TJ - JUNCTION TEMPERATURE 60 Figure 12. Relative Intensity Shift vs Junction Temperature 6 FORWARD VOLTAGE SHIFT-V NORMALZIED INTENSITY (PHOTO) 10 0.1 C 85 Red Amber 0.2 Green Blue 0.1 0 -0.1 -0.2 -0.3 -40 -15 10 35 TJ - JUNCTION TEMPERATURE Figure 13. Forward Voltage Shift vs Junction Temperature 60 85 4.0 0.7 2.1 Note: Recommended stencil thickness is 0.1524mm (6 mils) minimum and above 5.2 Figure 14. Recommended Soldering Land Pattern 20 SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME Figure 16. Recommended Leaded Reflow Soldering Profile TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME Figure 17. Recommended Pb- Free Reflow Soldering Profile Note: For detail information on reflow soldering of Avago Surface Mount LED, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 7 0.40±0.05 4.00±0.10 2.00±0.10 1.55±0.10 1.75±0.10 1.80±0.20 7.50±0.10 5.20±0.10 8.00±0.10 2.20±0.20 4.50±0.10 16.00±0.30 1.60±0.10 5.30±0.10 7.10±0.10 Figure 18. Carrier Tape Dimension +0.20 LAB EL Ø 100±0.50 16.4 -0.00 13.00±0.20 Ø 330 MAX 1.5 MIN Figure 19. Reel Dimension Anode Figure 20. Unit Orientation from reel 8 Intensity Bin Limit Table (1.3:1 Iv bin ratio) VF Bin Table (V at 20mA) for Red&Amber Intensity (mcd) at 20mA Bin ID Min Max Bin Min Max VD 1.8 2.0 R 1500 1900 VA 2.0 2.2 S 1900 2500 VB 2.2 2.4 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 Tolerance for each bin limit is ± 0.05V Tolerance for each bin limit is ± 15% Red Color Range Min Dom Max Dom X min Y Min X max Y max 618.0 630.0 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 Tolerance for each bin limit is ± 0.5nm Amber Color Range Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 584.5 587.0 0.5420 0.4580 0.5530 0.4400 0.5370 0.4550 0.5570 0.4420 0.4420 0.5670 0.4250 2 587.0 589.5 0.5570 0.5530 0.4400 0.5720 0.4270 4 589.5 592.0 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 6 592.0 594.5 Tolerance for each bin limit is ± 0.5nm 9 Green Color Range Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 519.0 523.0 0.0667 0.8323 0.1450 0.7319 0.1200 0.7375 0.0979 0.8316 2 523.0 527.0 0.0979 0.8316 0.1711 0.7218 0.1450 0.7319 0.1305 0.8189 0.1305 0.8189 0.1967 0.7077 0.1711 0.7218 0.1625 0.8012 0.1625 0.8012 0.2210 0.6920 0.1967 0.7077 0.1929 0.7816 0.1929 0.7816 0.2445 0.6747 0.2210 0.6920 0.2233 0.7600 3 4 5 527.0 531.0 535.0 531.0 535.0 539.0 Tolerance for each bin limit is ± 0.5nm Blue Color Range Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.0671 0.1517 0.1423 3 468.0 472.0 4 472.0 476.0 0.1187 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Tolerance for each bin limit is ± 0.5nm 10 Moisture Sensitivity and Handling The ALMD-xx3D series oval package has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. A. Storage before use x An unopened moisture barrier bag (MBB) can be stored at < 40° C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required then it is safe to reflow solder the LEDs per the original MSL rating. x It is recommended that the MBB not be opened prior to assembly (e.g. for IQC). B. Control after opening the MBB x The humidity indicator card (HIC) shall be read immediately upon opening of the MBB. C. Control for unfinished tape and reel parts x Unused LEDs must be stored in a sealed MBB with a desiccant or desiccator at < 5% RH. D. Control of assembled boards x If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB needs to be stored in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours E. Baking is required if: x The HIC indicator is not BROWN at 10% and is AZURE at 5% x The LEDs are exposed to a condition of > 30° C/60% RH at any time. x The LED floor life exceeded 672 hours. The recommended baking condition is: 60 ± 5° C for 20 hours. x The LEDs must be kept at < 30° C/60% RH at all times, and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-2372EN - March 22, 2010