AVAGO ALMD-CB3D-RT002 High brightness smt round led lamps amber, red, green and blue tinted led Datasheet

ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D
High Brightness SMT Round LED Lamps
Amber, Red, Green and Blue Tinted LEDs
Data Sheet
Description
Features
The new Avago ALMD-xx3D LED series has the same or
just slightly less luminous intensity than conventional
high brightness, through-hole LEDs.
x Compact form factor
The new LED lamps can be assembled using common
SMT assembly processes and are compatible with industrial reflow soldering processes.
x Red AlInGaP 626nm
The LEDs are made with an advanced optical grade epoxy
for superior performance in outdoor sign applications.
For easy pick and place assembly, the LEDs are shipped
in EIA-compliant tape and reel. Every reel is shipped from
a single intensity and color bin– except the red color–for
better uniformity.
Package Dimensions
A
x High brightness material
x Available in Red, Amber, Green and Blue color
x Amber AlInGaP 590nm
x Green InGaN 525nm
x Blue InGaN 470nm
x Jedec MSL 2A
x Compatible with industrial reflow soldering process
x Typical Viewing angle: 30°
x Tinted, non-diffused
Applications
x Variable Message Signs
A
4.20 ±0.20
C
A: Anode
C: Cathode
C
4.20 ±0.20
4.75 ±0.50
6.50 ±0.50
3.40 ±0.50
2.50 ±0.20
1.4 (4x)
C
A
1.0
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm unless other specified.
CAUTION: InGaN devices are Class 1C HBM ESD sensitive; AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard.
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Part Number
Color and Dominant Wavelength
Od (nm) Typ [3]
Luminous Intensity Iv (mcd) [1,2,5]
Min
Max
Viewing Angle
Typ (°) [4]
30°
ALMD-EG3D-VX002
Red 626
4200
9300
ALMD-EL3D-VX002
Amber 590
4200
9300
ALMD-CM3D-WY002
Green 525
5500
12000
ALMD-CB3D-RT002
Blue 470
1500
3200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. T½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
Part Numbering System
ALMD – X X 3D – x x x xx
Packaging Option
02: tested 20mA, 13 inch carrier tape, 8mm pitch, 16mm carrier width
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Untinted/Tinted Lens
D: Tinted
Viewing Angle
3: 30°
Color
B: Blue
G: Red
L: Amber
M: Green
Package
C: SMT Round Lamp InGaN
E: SMT Round Lamp AlInGaP
SMT Lamps
2
Absolute Maximum Rating, TJ = 25°C
Parameter
Red and Amber
DC Forward Current [1]
Blue and Green
Unit
50
30
mA
Peak Forward Current
100 [2]
100 [3]
mA
Power Dissipation
120
114
mW
Reverse Voltage
5 (IR = 100 PA)
5 (IR = 10 PA)
V
LED Junction Temperature
130
110
°C
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 4 and Figure 9
2. Duty Factor 30%, frequency 1KHz.
3. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics, TJ = 25°C
Parameter
Symbol
Forward Voltage
Red
Amber
Green
Blue
VF
Reverse Voltage
Red & Amber
Green & blue
VR
Dominant Wavelength [1]
Red
Amber
Green
Blue
Od
Peak Wavelength
Red
Amber
Green
Blue
Thermal Resistance
Luminous Efficacy [2]
Red
Amber
Green
Blue
Thermal coefficient of Od
Red
Amber
Green
Blue
Min.
1.8
1.8
2.8
2.8
Typ.
2.1
2.1
3.2
3.2
Max.
Units
Test Conditions
V
IF = 20 mA
V
IF = 100 PA
IF = 10 PA
2.4
2.4
3.8
3.8
5
5
IF = 20 mA
618.0
584.5
519.0
460.0
626.0
590.0
525.0
470.0
630.0
594.5
539.0
480.0
OPEAK
634
594
516
464
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
RTJ-PIN
130
°C/W
LED Junction-to-Pin
KV
200
520
530
65
lm/W
Emitted Luminous Power/Emitted
Radiant Power
nm/°C
IF = 20 mA ; +25°C ≤ TJ ≤ +100°C
0.059
0.103
0.028
0.024
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is
the luminous efficacy in lumens/watt.
3
AlInGaP
100
RELATIVE INTENSITY
0.8
Amber
FORWARD CURRENT - mA
1
Red
0.6
0.4
0.2
500
550
600
WAVELENGTH - nm
20
0.5
1
1.5
2
FORWARD VOLTAGE - V
2.5
3
60
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Amber
Red
50
40
30
20
10
0
0
20
40
60
FORWARD CURRENT - mA
80
100
Figure 3. Relative Intensity vs Forward Current
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
0
Figure 2. Forward Current vs Forward Voltage
MAXIMUM FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
40
650
Figure 1. Relative Intensity vs Wavelength
RELATIVE DOMINANT WAVELENGTH
SHIFT(NORMALIZED AT 20mA) - nm
60
0
0
Amber
Red
0
20
0
20
40
60
TA - AMBIENT TEMPERATURE (°C)
80
Figure 4. Maximum Forward Current vs Ambient Temperature
40
60
FORWARD CURRENT - mA
80
Figure 5. Relative Dominant Wavelength Shift vs Forward Current
4
80
100
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100
BLUE
FORWARD CURRENT-mA
RELATIVE INTENSITY
InGaN
GREEN
80
60
40
20
0
380
430
480
530
WAVELENGTH - nm
580
0
630
Figure 6. Relative Intensity vs Wavelength
1
2
3
FORWARD VOLTAGE-V
4
5
40
60
80
TA - AMBIENT TEMPERATURE - °C
100
Figure 7. Forward Current vs Forward Voltage
35
3.5
3.0
IFmax - MAXIMUM FORWARD
CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Blue
2.5
Green
2.0
1.5
1.0
0.5
0
20
40
60
80
DC FORWARD CURRENT-mA
100
120
Figure 8. Relative Intensity vs Forward Current
RELATIVE DOMINANT
WAVELENGTH SHIFT -nm
20
15
10
5
5
Green
Blue
0
-5
0
20
0
20
Figure 9. Maximum Forward Current vs Ambient Temperature
10
40
60
FORWARD CURRENT-mA
Figure 10. Dominant Wavelength Shift vs Forward Current
5
25
0
0.0
-10
30
80
100
NORMALIZED INTENSITY
1.0
0.8
0.6
0.4
A
A
X
X
0.2
C
0.0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
60
90
Figure 11a. Radiation Pattern for X axis
Figure 11b. Component Axis for Radiation Pattern
0.3
Red
Amber
Blue
Green
1
-40
-15
10
35
TJ - JUNCTION TEMPERATURE
60
Figure 12. Relative Intensity Shift vs Junction Temperature
6
FORWARD VOLTAGE SHIFT-V
NORMALZIED INTENSITY (PHOTO)
10
0.1
C
85
Red
Amber
0.2
Green
Blue
0.1
0
-0.1
-0.2
-0.3
-40
-15
10
35
TJ - JUNCTION TEMPERATURE
Figure 13. Forward Voltage Shift vs Junction Temperature
60
85
4.0
0.7
2.1
Note: Recommended stencil thickness
is 0.1524mm (6 mils) minimum and
above
5.2
Figure 14. Recommended Soldering Land Pattern
20 SEC. MAX.
183°C
100-150°C
-6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
Figure 16. Recommended Leaded Reflow Soldering Profile
TEMPERATURE
TEMPERATURE
10 to 30 SEC.
240°C MAX.
3°C/SEC. MAX.
217°C
200°C
255 - 260 °C
3°C/SEC. MAX.
6°C/SEC. MAX.
150°C
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
Figure 17. Recommended Pb- Free Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago Surface Mount LED, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
7
0.40±0.05
4.00±0.10 2.00±0.10
1.55±0.10
1.75±0.10
1.80±0.20
7.50±0.10
5.20±0.10
8.00±0.10
2.20±0.20
4.50±0.10
16.00±0.30
1.60±0.10
5.30±0.10 7.10±0.10
Figure 18. Carrier Tape Dimension
+0.20
LAB
EL
Ø 100±0.50
16.4 -0.00
13.00±0.20
Ø 330 MAX
1.5 MIN
Figure 19. Reel Dimension
Anode
Figure 20. Unit Orientation from reel
8
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
VF Bin Table (V at 20mA) for Red&Amber
Intensity (mcd) at 20mA
Bin ID
Min
Max
Bin
Min
Max
VD
1.8
2.0
R
1500
1900
VA
2.0
2.2
S
1900
2500
VB
2.2
2.4
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
Tolerance for each bin limit is ± 0.05V
Tolerance for each bin limit is ± 15%
Red Color Range
Min Dom
Max Dom
X min
Y Min
X max
Y max
618.0
630.0
0.6872
0.3126
0.6890
0.2943
0.6690
0.3149
0.7080
0.2920
Tolerance for each bin limit is ± 0.5nm
Amber Color Range
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
584.5
587.0
0.5420
0.4580
0.5530
0.4400
0.5370
0.4550
0.5570
0.4420
0.4420
0.5670
0.4250
2
587.0
589.5
0.5570
0.5530
0.4400
0.5720
0.4270
4
589.5
592.0
0.5720
0.4270
0.5820
0.4110
0.5670
0.4250
0.5870
0.4130
0.5870
0.4130
0.5950
0.3980
0.5820
0.4110
0.6000
0.3990
6
592.0
594.5
Tolerance for each bin limit is ± 0.5nm
9
Green Color Range
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
519.0
523.0
0.0667
0.8323
0.1450
0.7319
0.1200
0.7375
0.0979
0.8316
2
523.0
527.0
0.0979
0.8316
0.1711
0.7218
0.1450
0.7319
0.1305
0.8189
0.1305
0.8189
0.1967
0.7077
0.1711
0.7218
0.1625
0.8012
0.1625
0.8012
0.2210
0.6920
0.1967
0.7077
0.1929
0.7816
0.1929
0.7816
0.2445
0.6747
0.2210
0.6920
0.2233
0.7600
3
4
5
527.0
531.0
535.0
531.0
535.0
539.0
Tolerance for each bin limit is ± 0.5nm
Blue Color Range
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
2
464.0
468.0
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.0671
0.1517
0.1423
3
468.0
472.0
4
472.0
476.0
0.1187
0.1616
0.1209
0.1063
0.0945
5
476.0
480.0
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
Tolerance for each bin limit is ± 0.5nm
10
Moisture Sensitivity and Handling
The ALMD-xx3D series oval package has a Moisture
Sensitive Level 2a rating per JEDEC J-STD-020. Refer to
Avago Application Note AN5305, Handling of Moisture
Sensitive Surface Mount Devices, for additional details
and a review of proper handling procedures.
A. Storage before use
x An unopened moisture barrier bag (MBB) can be
stored at < 40° C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required then it is safe to reflow solder the LEDs per
the original MSL rating.
x It is recommended that the MBB not be opened
prior to assembly (e.g. for IQC).
B. Control after opening the MBB
x The humidity indicator card (HIC) shall be read
immediately upon opening of the MBB.
C. Control for unfinished tape and reel parts
x Unused LEDs must be stored in a sealed MBB with a
desiccant or desiccator at < 5% RH.
D. Control of assembled boards
x If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB needs
to be stored in a sealed MBB with desiccant or
desiccator at < 5% RH to ensure that all LEDs have
not exceeded their floor life of 672 hours
E. Baking is required if:
x The HIC indicator is not BROWN at 10% and is AZURE
at 5%
x The LEDs are exposed to a condition of > 30° C/60%
RH at any time.
x The LED floor life exceeded 672 hours.
The recommended baking condition is: 60 ± 5° C for 20
hours.
x The LEDs must be kept at < 30° C/60% RH at all
times, and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2372EN - March 22, 2010
Similar pages