ON BAV99LT1 Dual series switching diode Datasheet

BAV99LT1
Dual Series
Switching Diode
Features
• Pb−Free Packages are Available
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ANODE
1
MAXIMUM RATINGS (Each Diode)
Rating
Symbol
Value
Unit
Reverse Voltage
VR
70
Vdc
Forward Current
IF
215
mAdc
IFM(surge)
500
mAdc
Repetitive Peak Reverse Voltage
VRRM
70
V
Average Rectified Forward Current (Note 1)
(averaged over any 20 ms period)
IF(AV)
715
mA
Repetitive Peak Forward Current
IFRM
Non−Repetitive Peak Forward Current
t = 1.0 ms
t = 1.0 ms
t = 1.0 s
IFSM
Peak Forward Surge Current
450
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation
Alumina Substrate (Note 2)
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage
Temperature Range
September, 2006 − Rev. 4
CASE 318
SOT−23
STYLE 11
1
MARKING DIAGRAM
A
2.0
1.0
0.5
Symbol
Max
Unit
PD
225
mW
1.8
mW/°C
RqJA
556
°C/W
PD
300
mW
2.4
mW/°C
RqJA
417
°C/W
TJ, Tstg
−65 to
+150
°C
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in 99.5% alumina.
© Semiconductor Components Industries, LLC, 2006
3
mA
THERMAL CHARACTERISTICS
Total Device Dissipation
FR−5 Board (Note 1) TA = 25°C
Derate above 25°C
3
CATHODE/ANODE
2
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Characteristic
CATHODE
2
A7 MG
G
1
A7 = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping †
BAV99LT1
SOT−23
3000/Tape & Reel
SOT−23
(Pb−Free)
3000/Tape & Reel
SOT−23
10,000/Tape & Reel
SOT−23
(Pb−Free)
10,000/Tape & Reel
BAV99LT1G
BAV99LT3
BAV99LT3G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
Publication Order Number:
BAV99LT1/D
BAV99LT1
OFF CHARACTERISTICS (TA = 25°C unless otherwise noted) (Each Diode)
Characteristic
Symbol
Min
Max
Unit
V(BR)
70
−
Vdc
IR
−
−
−
2.5
30
50
mAdc
(VR = 0, f = 1.0 MHz)
CD
−
1.5
pF
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)
VF
−
−
−
−
715
855
1000
1250
mVdc
(IF = IR = 10 mAdc, iR(REC) = 1.0 mAdc) RL = 100 W
trr
−
6.0
ns
VFR
−
1.75
V
Reverse Breakdown Voltage,
(I(BR) = 100 mA)
Reverse Voltage Leakage Current,
(VR = 70 Vdc)
(VR = 25 Vdc, TJ = 150°C)
(VR = 70 Vdc, TJ = 150°C)
Diode Capacitance,
Forward Voltage,
Reverse Recovery Time,
Forward Recovery Voltage,
(IF = 10 mA, tr = 20 ns)
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2
BAV99LT1
CURVES APPLICABLE TO EACH DIODE
100
10
I R, REVERSE CURRENT (A)
μ
10
TA = 85°C
TA = 25°C
1.0
TA = −40°C
0.1
0.2
0.4
0.6
0.8
1.0
TA = 85°C
0.1
TA = 55°C
0.01
0.001
1.2
TA = 125°C
1.0
TA = 25°C
0
10
VF, FORWARD VOLTAGE (VOLTS)
20
0.64
0.60
0.56
0
40
Figure 2. Leakage Current
0.68
0.52
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Forward Voltage
CD , DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
TA = 150°C
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Capacitance
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3
8
50
BAV99LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08.
SEE VIEW C
3
HE
E
c
1
DIM
A
A1
b
c
D
E
e
L
L1
HE
2
b
0.25
e
q
A
L
A1
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
STYLE 11:
PIN 1. ANODE
2. CATHODE
3. CATHODE−ANODE
VIEW C
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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BAV99LT1/D
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