TI1 LMH0387SL/NOPB 3 gbps hd/sd sdi configurable i/o adaptive cable equalizer / cable driver Datasheet

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LMH0387
SNLS315H – APRIL 2010 – REVISED AUGUST 2015
LMH0387 3 Gbps HD/SD SDI Configurable I/O Adaptive Cable Equalizer / Cable Driver
1 Features
3 Description
•
The LMH0387 3 Gbps HD/SD SDI Configurable I/O
Adaptive Cable Equalizer / Cable Driver provides a
single chip interface to a BNC. The device can be
configured either in the input mode as an equalizer to
receive data over coaxial cable or in the output mode
as a cable driver to transmit data over coaxial cable.
The same I/O pin is used both for the input and the
output functions of the device, allowing the system
designer the flexibility to use a BNC attached to the
device as either an input or an output.
1
ST 424, ST 292, ST 344, and ST 259 Compliant
(1)
•
•
•
•
•
•
•
•
•
•
•
•
Supports DVB-ASI at 270 Mbps
Data Rates: 125 Mbps to 2.97 Gbps when
Receiving (DC to 2.97 Gbps when Driving Cable)
Equalizes up to 120 Meters of Belden 1694A at
2.97 Gbps, up to 200 Meters of Belden 1694A at
1.485 Gbps, or up to 400 Meters of Belden 1694A
at 270 Mbps
Integrated Return Loss Network (No External
Components Required)
Power Saving Modes
Cable Driver Selectable Slew Rate
Internally Terminated 100-Ω LVDS Receiver
Outputs With Programmable Common Mode
Voltage and Swing
Programmable Launch Amplitude Optimization for
Receiver
Cable Length Indication
Single 3.3-V Supply Operation
48-Pin Laminate TLGA Package
Industrial Temperature Range: −40°C to 85°C
2 Applications
•
•
•
•
ST 424 (SMPTE 424M), ST 292 (SMPTE 292M),
and ST 259 (SMPTE 259M) Serial Digital
Interfaces (1)
Digital Video Servers and Modular Equipment
Video Encoders and Decoders
Distribution Amplifiers
The device operates over a wide range of data rates
from 125 Mbps to 2.97 Gbps (DC to 2.97 Gbps when
driving cable) and supports ST 424, ST 292, ST 344,
and ST 259. The return loss network is integrated
within the device so no external components are
required to meet the SMPTE return loss specification.
The LMH0387 offers designers flexibility in system
design and quicker time to market.
In the input mode, the LMH0387 features include a
power-saving sleep mode, programmable output
common mode voltage and swing, cable length
indication, launch amplitude optimization, input signal
detection, and an SPI interface. In the output mode,
the LMH0387 features include two selectable slew
rates for ST 424 / 292 and ST 259 compliance, and
output driver power-down control.
The device is available in a 7-mm × 7-mm 48-pin
laminate Thin Laminate Grid Array (TLGA) Package.
Device Information(1)
PART NUMBER
LMH0387
PACKAGE
TLGA (48)
BODY SIZE (NOM)
7.00 mm × 7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
Existing Solution
LMH0387 Solution
VCC
Cable
Driver
(1)
Due to SMPTE naming convention, all SMPTE Engineering
Documents will be numbered as a two-letter prefix and a
number. Documents and references with the same root
number and year are functionally identical; for example ST
424-2006 and SMPTE 424M-2006 refer to the same
document.
FPGA
LMH0387
Configurable
I/O
FPGA
Cable
Equalizer
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMH0387
SNLS315H – APRIL 2010 – REVISED AUGUST 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
1
1
1
2
3
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 5
Control Pin Electrical Characteristics........................ 6
Input Mode (Equalizer) DC Electrical
Characteristics ........................................................... 6
6.7 Output Mode (Cable Driver) DC Electrical
Characteristics ........................................................... 7
6.8 Input Mode (Equalizer) AC Electrical
Characteristics ........................................................... 7
6.9 Output Mode (Cable Driver) AC Electrical
Characteristics ........................................................... 8
6.10 Input Mode (Equalizer) SPI Interface AC Electrical
Characteristics ........................................................... 8
6.11 Typical Characteristics .......................................... 10
7
Detailed Description ............................................ 11
7.1
7.2
7.3
7.4
7.5
7.6
8
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
Register Maps .........................................................
11
11
11
14
14
17
Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Application ................................................. 19
9 Power Supply Recommendations...................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 22
11 Device and Documentation Support ................. 23
11.1
11.2
11.3
11.4
11.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
23
23
23
23
23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (April 2013) to Revision H
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Changes from Revision F (April 2013) to Revision G
•
2
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 18
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5 Pin Configuration and Functions
RSVD
RSVD
RSVD
TERMTX
SD/HD
VCCTX
RSVD
VEE
TX_EN
MOSI
SCK
VEE
NPD Package
48-Pin TLGA
Top View
48
47
46
45
44
43
42
41
40
39
38
37
RSVD
1
36
RREF
VCCTX
2
35
VEE
VCCTX
3
34
SDI
RSVD
4
33
SDI
RSVD
5
32
VEE
RSVD
6
31
VEE
RSVD
7
30
VCCRX
BNC_IO
8
29
MISO
RSVD
9
28
SDO
RSVD
10
27
SDO
RSVD
11
26
SS
RSVD
12
25
VEE
15
16
17
18
19
20
21
22
RSVD
RSVD
RSVD
TERMRX
SPI_EN
VEE
AEC+
AEC-
CD
23
24
VEE
14
CDTHRESH
13
RSVD
LMH0387
(Top View)
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Pin Functions
PIN
NAME
NO.
I/O, TYPE
DESCRIPTION
20, 21
I/O, Analog
AEC loop filter external capacitor for equalizer (1 µF connected between AEC+ and
AEC-).
BNC_IO
8
I/O, Analog
Serial digital interface input or output for connection to a BNC. Connect this pin to the
BNC through an AC coupling capacitor (nominally 4.7 μF).
CD
22
O, LVCMOS
Carrier detect for BNC_IO pin.
H = No input signal detected on BNC_IO pin.
L = Input signal detected on BNC_IO pin.
CDTHRESH
23
I, Analog
MISO (SPI)
29
O, LVCMOS
SPI Master Input / Slave Output. LMH0387 control data transmit.
MOSI (SPI)
39
I, LVCMOS
SPI Master Output / Slave Input. LMH0387 control data receive.
RREF
36
I, Analog
RSVD
1, 4-7, 9–16,
42, 46-48
N/A
SCK (SPI)
38
I, LVCMOS
SPI serial clock input.
SD/HD
44
I, LVCMOS
BNC_IO output slew rate control. SD/HD has an internal pulldown.
H = BNC_IO output rise/fall time complies with SMPTE 259M (SD).
L = BNC_IO output rise/fall time complies with SMPTE 424M / 292M (3G/HD).
SDI, SDI
33, 34
I, Analog
Serial data differential input for transmitter (cable driver).
SDO, SDO
27, 28
O, LVDS
Serial data differential output from receiver (equalizer).
SPI_EN
18
I, LVCMOS
SPI register access enable (equalizer). This pin should always be high; it must be pulled
high while operating in the input mode and may optionally be pulled high while operating
in the output mode. This pin has an internal pulldown.
SS (SPI)
26
I, LVCMOS
SPI slave select. This pin has an internal pullup.
TERMRX
17
I, Analog
Termination for unused receiver (equalizer) input. This network should consist of a 1-µF
capacitor followed by a 220-Ω resistor to ground.
TERMTX
45
O, Analog
Termination for unused transmitter (cable driver) output. This network should consist of a
4.7-µF capacitor followed by a 75-Ω resistor to ground.
40
I, LVCMOS
Transmitter output driver enable. TX_EN has an internal pullup.
H = BNC_IO output driver is enabled.
L = BNC_IO output driver is powered off.
To configure the LMH0387 as a receiver, the BNC_IO output driver must be disabled by
tying TX_EN low. To configure the LMH0387 as a transmitter, the output driver must be
enabled by tying TX_EN high and the receiver may be powered down using the sleep
mode setting through the SPI.
AEC+, AEC-
TX_EN
VCCTX
VEE
VCCRX
4
Carrier detect threshold input. Sets the threshold for CD. CDTHRESH may be either
unconnected or connected to ground for normal CD operation.
BNC_IO output driver level control. Connect a resistor (nominally 715 Ω) to VCC to set
the output voltage swing for the BNC_IO pin.
Do not connect.
2, 3, 43
Power
Positive power supply for transmitter (3.3 V).
19, 24, 25, 31,
32, 35, 37, 41
Power
Negative power supply (ground).
30
Power
Positive power supply for receiver (3.3 V).
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
4
V
Supply Voltage
−0.3
Input Voltage (all inputs)
VCC+0.3
V
125
°C
150
°C
Junction Temperature
−65
Storage Temperature
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±6000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±2500
Machine model
±300
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Supply Voltage (VCC – VEE)
MIN
NOM
MAX
3.14
3.3
3.46
BNC_IO Input / Output Coupling Capacitance
UNIT
V
4.7
AEC Capacitor (Connected between AEC+ and AEC-)
µF
1
µF
−40
Operating Free Air Temperature (TA)
85
°C
6.4 Thermal Information
LMH0387
THERMAL METRIC (1)
NPD (TLGA)
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
64.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
20.8
°C/W
RθJB
Junction-to-board thermal resistance
32.3
°C/W
ψJT
Junction-to-top characterization parameter
0.9
°C/W
ψJB
Junction-to-board characterization parameter
32
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Control Pin Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIH
Input Voltage High Level
2
VCC
V
VIL
Input Voltage Low Level
VEE
0.8
V
VOH
Output Voltage High Level
IOH = –2 mA
VOL
Output Voltage Low Level
IOL = 2 mA
(1)
(2)
2.4
V
0.4
V
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3 V and TA = 25°C.
6.6 Input Mode (Equalizer) DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2).
PARAMETER
MIN
TYP
MAX
UNIT
720
800
950
mVP−P
Differential Output Voltage, P-P
500
700
900
mVP-P
VOD
Differential Output Voltage
250
350
450
mV
ΔVOD
Change in Magnitude of VOD for
complementary Output States
50
mV
VOS
Offset Voltage
ΔVOS
Change in Magnitude of VOS for
complementary Output States
50
mV
IOS
Output Short Circuit Current
30
mA
CDTHRESH
CDTHRESH DC Voltage (floating)
1.3
V
CDTHRNG
CDTHRESH Range
0.8
V
VIN
Input Voltage Swing
VSSP-P
ICC
(1)
(2)
(3)
(4)
(5)
6
Supply Current
TEST CONDITIONS
0-m cable length (3)
100-Ω load, default register settings,
Figure 1 (4)
1.125
1.25
1.375
V
Equalizing cable > 120 m
(Belden 1694A), TX_EN = 0
91
Equalizing cable ≤ 120 m
(Belden 1694A), TX_EN = 0 (5)
71
mA
Power save mode (equalizer in sleep
mode, TX_EN = 0)
11
mA
113
mA
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3 V and TA = 25°C.
The LMH0387 equalizer can be optimized for different launch amplitudes through the SPI.
The differential output voltage and offset voltage are adjustable through the SPI.
The equalizer automatically shifts equalization stages at cable lengths less than or equal to 120 m (Belden 1694A) to reduce power
consumption. This power saving is also achieved by setting Extended 3G Reach Mode = 1 through the SPI. (Note: Forcing the Extended
3G Reach Mode in this way increases the cable reach for 3G data rates but also limits the achievable cable lengths at HD and SD data
rates).
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6.7 Output Mode (Cable Driver) DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2).
PARAMETER
TEST CONDITIONS
VCMOUT
BNC_IO Output Common Mode Voltage
VOUT
BNC_IO Output Voltage Swing
VCMIN
SDI, SDI Input Common Mode Voltage
VID
SDI, SDI Input Voltage Swing
ICC
MIN
TYP
720
800
0.9 +
VID/2
Differential
100
(2)
V
880
mVP-P
VCC –
VID/2
V
2200
mVP-P
SD/HD = 0, equalizer in sleep mode
57
SD/HD = 1, equalizer in sleep mode
50
mA
Power save mode (TX_EN = 0,
equalizer in sleep mode)
11
mA
117
mA
Loopback mode (Tx and Rx both
enabled), SD/HD = 0
(1)
UNIT
VCC –
VOUT
RREF = 715 Ω ±1%
Supply Current
MAX
71
mA
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3 V and TA = 25°C.
6.8 Input Mode (Equalizer) AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1).
PARAMETER
DRMIN
Minimum Input Data Rate
DRMAX
Maximum Input Data Rate
TEST CONDITIONS
MIN
TYP
0.35
1.485 Gbps, Belden 1694A,
0-170 meters (2) (3)
1.485 Gbps, Belden 1694A,
170-200 meters (3)
0.3
Output Rise Time, Fall Time
Δtr, Δtf
Mismatch in Rise/Fall Time (4)
tOS
Output Overshoot (4)
RLIN
BNC_IO Return Loss
(1)
(2)
(3)
(4)
(5)
0.2
20% – 80%, 100 Ω load,
Figure 1 (4)
80
.
UI
UI
0.2
270 Mbps, Belden 1694A,
350-400 meters (3)
UI
UI
0.25
270 Mbps, Belden 1694A,
0-350 meters (2) (3)
tr, tf
Mbps
0.3
2.97 Gbps, Belden 1694A,
100-120 meters (3)
tjit
UNIT
Mbps
2970
2.97 Gbps, Belden 1694A,
0-100 meters (2) (3)
Equalizer Jitter for Various Cable
Lengths (SDO, SDO)
MAX
125
UI
UI
130
ps
2
15
ps
1%
5%
5 MHz - 1.5 GHz (4) (5)
15
dB
(4) (5)
10
dB
1.5 GHz - 3 GHz
Typical values are stated for VCC = +3.3 V and TA = 25°C.
Based on design and characterization data over the full range of recommended operating conditions of the device. Jitter is measured in
accordance with ST RP 184, ST RP 192, and the applicable serial data transmission standard: ST 424, ST 292, or ST 259.
LMH0387 equalizer launch amplitude fine tuning set to nominal through the SPI by writing 30h (“00110000 binary”) to SPI register 02h.
Specification is ensured by characterization.
Return loss is dependent on board design. The LMH0387 exceeds this specification on the SD387EVK evaluation board.
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6.9 Output Mode (Cable Driver) AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1).
PARAMETER
DRMAX
tjit
Output Rise Time, Fall Time
Δtr, Δtf
Mismatch in Rise/Fall Time
Duty Cycle Distortion
tOS
Output Overshoot
RLOUT
(1)
(2)
(3)
(4)
MIN
TYP
Maximum Input Data Rate
Additive Jitter
tr, tf
TEST CONDITIONS
BNC_IO Output Return Loss
MAX
UNIT
2970
Mbps
2.97 Gbps (2)
20
psP-P
1.485 Gbps (2)
18
psP-P
270 Mbps (2)
15
psP-P
SD/HD = 0, 20% – 80%
130
ps
800
ps
SD/HD = 0
30
ps
SD/HD = 1
50
ps
SD/HD = 0 (3)
30
ps
SD/HD = 1 (3)
100
ps
(3)
10%
SD/HD = 1, 20% – 80%
SD/HD = 0
65
400
SD/HD = 1 (3)
8%
5 MHz - 1.5 GHz (3) (4)
15
dB
1.5 GHz - 3 GHz (3) (4)
10
dB
Typical values are stated for VCC = +3.3 V and TA = 25°C.
Cable driver additive jitter is measured with the input AC coupled.
Specification is ensured by characterization.
Return loss is dependent on board design. The LMH0387 exceeds this specification on the SD387EVK evaluation board.
6.10 Input Mode (Equalizer) SPI Interface AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
PARAMETER
fSCK
SCK Frequency
tPH
SCK Pulse Width High
tPL
SCK Pulse Width Low
tSU
MOSI Setup Time
tH
MOSI Hold Time
tSSSU
SS Setup Time
tSSH
SS Hold Time
tSSOF
SS Off Time
tODZ
MISO Driven-to-Tristate Time
tOZD
MISO Tristate-to-Driven Time
tOD
MISO Output Delay Time
(1)
8
TEST CONDITIONS
Figure 2, Figure 3
Figure 2, Figure 3
Figure 2, Figure 3
Figure 3
(1)
.
MIN
TYP
MAX
UNIT
20
MHz
40%
SCK period
40%
SCK period
4
ns
4
ns
4
ns
4
ns
10
ns
15
ns
15
ns
15
ns
Typical values are stated for VCC = +3.3 V and TA = 25°C.
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VODVOS
VOD+
80%
80%
+ VOD
VSSP-P
0V differential
20%
- VOD
20%
VSSP-P = (VOD+) – (VOD-)
tr
tf
Figure 1. LVDS Output Voltage, Offset, and Timing Parameters
SS
(host)
tSSSU
tPH
tPL
tSSH
SCK
(host)
tH
tSU
MOSI
(host)
MISO
(device)
tSSOF
0
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
Hi-Z
Figure 2. SPI Write Operation
SS
(host)
tSSSU
tPH
tPL
tSSH
SCK
(host)
tH
tSU
MOSI
(host)
Hi-Z
1
A6
A5
A4
A3
A2
A1
A0
tOZD
MISO
(device)
tSSOF
Hi-Z
D7
D6
tOD
D5
D4
D3
tODZ
D2
D1
D0
Hi-Z
Figure 3. SPI Read Operation
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6.11 Typical Characteristics
120m 0f B1694A at 2.97 Gbps, PRBS10 H: 100 ps / div, V: 50 mV
/ div (SDO Output Shown)
Figure 4. Differential Serial Data Output After Equalizing
H: 62.5 ps / div, V: 100 mV / div (BNC_IO Output Shown)
Figure 5. Cable Driver Output at 2.97 Gbps, PRBS10
Figure 6. BNC_IO Return Loss
10
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7 Detailed Description
7.1 Overview
The LMH0387 3 Gbps HD/SD SDI Configurable I/O Adaptive Cable Equalizer / Cable Driver provides a single
chip interface to a BNC. The same I/O pin is used both for the input and the output functions of the device,
allowing the system designer to use a BNC attached to the device as either an input or an output. The LMH0387
operates over a wide range of data rates from 125 Mbps to 2.97 Gbps and supports ST 424, ST 292, ST 344, ST
259, and DVB/ASI standards. The LMH0387 includes passive components for the return loss network –
simplifying board design and development time.
SD/HD
TX_EN
RREF
TERMTX
7.2 Functional Block Diagram
SDI
Cable
Driver
SDI
BNC_IO
SDO
Cable
Equalizer
SCK
MOSI
MISO
SS
CDTHRESH
CD
SPI_EN
AEC–
AEC+
TERMTX
SDO
7.3 Feature Description
The LMH0387 can be configured either in the input mode as an equalizer to receive data over coaxial cable or in
the output mode as a cable driver to transmit data over coaxial cable. The LMH0387 requires register
programming to operate either in Input Mode (Equalizer) or Output Mode (Cable Driver).
7.3.1 Input Mode (Equalizer) Description
SPI register access is required while operating the LMH0387 in the input mode. The equalizer launch amplitude
fine tuning must be set to nominal through the SPI for correct equalizer operation. To do this, write 30h
(“00110000 binary”) to SPI register 02h. The SPI registers provide access to many other useful LMH0387
features while in the input mode. Refer to the Input Mode (Equalizer) SPI Register Access section for details.
7.3.1.1 Input Interfacing
The LMH0387 accepts a single-ended input at the BNC_IO pin. The input must be AC coupled as shown in
Figure 9 . The TERMRX input must be properly terminated with a 1-µF capacitor followed by a 220-Ω resistor to
ground.
The LMH0387 BNC_IO input can be optimized for different launch amplitudes through the SPI (see Launch
Amplitude Optimization (Register 02h) in the Input Mode (Equalizer) SPI Register Access section).
The LMH0387 correctly handles equalizer pathological signals for standard and high definition serial digital video,
as described in ST RP 178 and RP 198, respectively.
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Feature Description (continued)
7.3.1.2 Output Interfacing
The LMH0387 equalizer outputs, SDO and SDO, are internally terminated 100-Ω LVDS outputs. These outputs
can be DC coupled to most common differential receivers.
The default output common mode voltage (VOS) is 1.25 V. The output common mode voltage may be adjusted
through the SPI in 200 mV increments, from 1.05 V to 1.85 V (see Output Driver Adjustments (Register 01h) in
the Input Mode (Equalizer) SPI Register Access section). This adjustable output common mode voltage offers
flexibility for interfacing to many types of receivers.
The default differential output swing (VSSP-P) is 700 mVP-P. The differential output swing may be adjusted through
the SPI in 100 mV increments from 400 mVP-P to 800 mVP-P (see Output Driver Adjustments (Register 01h) in the
Input Mode (Equalizer) SPI Register Access section).
The LMH0387 equalizer output should be DC coupled to the input of the receiving device as long as the common
mode ranges of both devices are compatible. 100-Ω differential transmission lines should be used to connect
between the LMH0387 outputs and the input of the receiving device where possible.
The LMH0387 allows flexibility when interfacing to low voltage crosspoint switches (that is, 1.8 V) and other
devices with limited input ranges. The LMH0387 equalizer outputs can be DC coupled to these devices in most
cases.
The LMH0387 may be AC coupled to the receiving device when necessary. For example, the LMH0387
equalizer outputs are not strictly compatible with 3.3 V CML and thus should not be connected through 50-Ω
resistors to 3.3 V. If the input common mode range of the receiving device is not compatible with the output
common mode range of the LMH0387, then AC coupling is required. Following the AC coupling capacitors, the
signal may have to be biased at the input of the receiving device.
7.3.1.3 Carrier Detect (CD)
Carrier detect CD indicates if a valid signal is present at the LMH0387 BNC_IO pin. If CDTHRESH is used, the
carrier detect threshold will be altered accordingly. CD provides a high voltage when no signal is present at the
LMH0387 BNC_IO pin. CD is low when a valid input signal is detected.
7.3.1.4 Carrier Detect Threshold (CDTHRESH)
The CDTHRESH pin sets the threshold for the carrier detect. The carrier detect threshold is set by applying a
voltage inversely proportional to the length of cable to equalize before loss of carrier is triggered. The applied
voltage must be greater than the CDTHRESH floating voltage (typically 1.3 V) to change the CD threshold. As the
applied CDTHRESH voltage is increased, the amount of cable that will be equalized before carrier detect is
deasserted is decreased. CDTHRESH may be left unconnected or connected to ground for normal CD operation.
Figure 7 shows the minimum CDTHRESH input voltage required to force carrier detect to inactive vs. Belden 1694A
cable length. The results shown are valid for Belden 1694A cable lengths of 0 m to 120 m at 2.97 Gbps, 0 m
to200 m at 1.485 Gbps, and 0 m to 400 m at 270 Mbps.
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Feature Description (continued)
3.2
CDTHRESH (V)
3.0
2.8
2.6
2.4
2.2
2.0
0
50
100 150 200 250 300 350 400
BELDEN 1694A CABLE LENGTH (m)
Figure 7. CDTHRESH vs Belden 1694A Cable Length
7.3.1.5 Auto Sleep
The LMH0387 equalizer is set for auto sleep operation by default. The equalizer portion of the LMH0387 powers
down when no input signal is detected on the BNC_IO pin. The equalizer powers on again once an input signal
is detected. The auto sleep functionality can be changed to force sleep or turned off completely through the SPI
registers.
In auto sleep mode, the time to power down the equalizer when the input signal is removed is less than 200 µs
and should not have any impact on the system timing requirements. The equalizer will wake up automatically
once an input signal is detected, and the delay between signal detection and full functionality of the equalizer is
negligible. The overall system will be limited only by the settling time constant of the equalizer adaptation loop.
7.3.2 Output Mode (Cable Driver) Description
7.3.2.1 Input Interfacing
The LMH0387 cable driver accepts differential input signals which can be DC or AC coupled.
7.3.2.2 Output Interfacing
The LMH0387 cable driver uses 75-Ω internally terminated current mode outputs. The output level is 800 mVP-P
with an RREF resistor of 715 Ω. The RREF resistor is connected between the RREF pin and VCC, and should be
placed as close as possible to the RREF pin.
The output should be AC coupled as shown in the Figure 9. The TERMTX output must be properly terminated
with a 4.7-µF capacitor followed by a 75-Ω resistor to ground as shown.
7.3.2.3 Output Slew Rate Control
The LMH0387 cable driver output rise and fall times are selectable for either ST 259 or ST 424 / 292 compliance
through the SD/HD pin. For slower rise and fall times, or ST 259 compliance, SD/HD is set high. For faster rise
and fall times, or ST 424 and ST 292 compliance, SD/HD is set low. SD/HD has an internal pulldown.
7.3.2.4 Output Enable
The LMH0387 cable driver can be enabled or disabled with the TX_EN pin. When set low, the cable driver is
powered off. TX_EN has an internal pullup to enable the cable driver by default. When using the LMH0387 in the
input mode (as an equalizer), the cable driver must be disabled by setting the TX_EN pin low.
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7.4 Device Functional Modes
SPI register access is required while operating the LMH0387 in the input mode. The equalizer launch amplitude
fine tuning must be set to nominal through the SPI for correct equalizer operation. To do this, write 30h
(“00110000 binary”) to SPI register 02h. The SPI registers provide access to many other useful LMH0387
features while in the input mode.
To configure the LMH0387 in the output mode, the cable driver must be enabled. The equalizer may either be
disabled for power savings or enabled to provide a loopback path for the data being transmitted. For the normal
output mode (equalizer disabled for power savings) follow these steps:
1. Disable the equalizer by forcing it to sleep through the SPI. To do this, write “10” (force sleep) to bits [4:3] of
SPI register 00h.
2. Enable the cable driver by pulling the TX_EN pin high.
7.5 Programming
The LMH0387 3 Gbps HD/SD SDI Configurable I/O Adaptive Cable Equalizer / Cable Driver is used at the input
or output port of digital video equipment. It is designed to allow the sharing of a single BNC connector for either
input or output. The LMH0387 must be configured in either the output mode as a cable driver, or the input mode
as an equalizer.
7.5.1 Output Mode (Cable Driver)
To configure the LMH0387 in the output mode, the cable driver must be enabled. The equalizer may either be
disabled for power savings or enabled to provide a loopback path for the data being transmitted. For the normal
output mode (equalizer disabled for power savings) follow these steps:
1. Disable the equalizer by forcing it to sleep through the SPI. To do this, write “10” (force sleep) to bits [4:3] of
SPI register 00h.
2. Enable the cable driver by pulling the TX_EN pin high.
To configure the LMH0387 for the output mode with the loopback path, the equalizer can be enabled in output
mode by writing either “01” (auto sleep – default) or “00” (never sleep) to bits [4:3] of SPI register 00h. In this
case, the LMH0387 input/output mode may be configured simply by toggling the TX_EN pin because the
equalizer remains active in either mode (TX_EN set low for input mode and high for output mode).
7.5.2 Input Mode (Equalizer)
To configure the LMH0387 in the input mode, the equalizer must be enabled and the cable driver must be
disabled as described in the following steps:
1. Disable the cable driver by pulling the TX_EN pin low.
2. Enable the equalizer by setting the sleep mode through the SPI to either auto sleep or disabled (never
sleep). To do this, write either “01” (auto sleep – default) or “00” (never sleep) to bits [4:3] of SPI register
00h.
3. Set the equalizer launch amplitude fine tuning to the nominal setting through the SPI. To do this, write 30h
(“00110000” binary) to SPI register 02h.
7.5.3 Input Mode (Equalizer) SPI Register Access
SPI register access is required for correct input mode (equalizer) operation. The SPI registers provide access to
all of the equalizer features along with a cable length indicator, programmable output common mode voltage and
swing, and launch amplitude optimization. There are four supported 8-bit registers in the device (see SPI
Registers).
Note: The SPI_EN pin must always be pulled high while using the LMH0387 in the input mode (equalizer), and
may optionally be pulled high while using the LMH0387 in the output mode (cable driver) as well.
7.5.3.1 SPI Write
The SPI write is shown in Figure 2. The MOSI payload consists of a “0” (write command), seven address bits,
and eight data bits. The SS signal is driven low, and the 16 bits are sent to the LMH0387's MOSI input. Data is
latched on the rising edge of SCK. The MISO output is normally tri-stated during this operation. After the SPI
write, SS must return high.
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Programming (continued)
7.5.3.2 SPI Read
The SPI read is shown in Figure 3. The MOSI payload consists of a “1” (read command) and seven address bits.
The SS signal is driven low, and the eight bits are sent to the LMH0387's MOSI input. The addressed location is
accessed immediately after the rising edge of the 8th clock and the eight data bits are shifted out on MISO
starting with the falling edge of the 8th clock. MOSI must be tri-stated immediately after the rising edge of the 8th
clock. After the SPI read, SS must return high.
7.5.3.3 Output Driver Adjustments (Register 01h)
The equalizer output driver swing (amplitude) and offset voltage (common mode voltage) are adjustable through
SPI register 01h.
7.5.3.3.1 Output Swing
The output swing is adjustable through bits [7:5] of SPI register 01h. The default value for these register bits is
“011” for a peak-to-peak differential output voltage of 700 mVP-P. The output swing can be adjusted in 100 mV
increments from 400 mVP-P to 800 mVP-P.
7.5.3.3.2 Offset Voltage
The offset voltage is adjustable through bits [4:2] of SPI register 01h. The default value for these register bits is
“001” for an output offset of 1.25 V. The output common mode voltage may be adjusted in 200 mV increments,
from 1.05 V to 1.85 V. It can also be set to “101” for the maximum offset voltage. At this maximum offset voltage
setting, the outputs are referenced to the positive supply and the offset voltage is around 2.1 V.
7.5.3.4 Launch Amplitude Optimization (Register 02h)
The LMH0387 can compensate for attenuation of the input signal before the equalizer. This compensation is
useful for applications with a passive splitter at the equalizer input or a non-ideal input termination network, and
is controlled by SPI register 02h.
NOTE
For correct equalizer operation with the default SMPTE 800 mVP-P launch amplitude and
no external attenuation, the equalizer launch amplitude fine tuning must be set to the
“nominal” setting through the SPI. To do this, write 30h (“00110000” binary) to SPI register
02h.
7.5.3.4.1 Coarse Control
Bit 7 of SPI register 02h is used for coarse control of the launch amplitude setting. At the default setting of “0”,
the equalizer operates normally and expects a launch amplitude of 800 mVP-P. Bit 7 may be set to “1” to optimize
the equalizer for input signals with 6 dB of attenuation (400 mVP-P).
7.5.3.4.2 Fine Control
Once the coarse control is set, the equalizer input compensation may be further fine tuned by bits [6:3] of SPI
register 02h. These bits may be used to tweak the input gain stage -2% to 60% around the coarse control
setting. For typical equalizer operation, bits [6:3] of SPI register 02h should be changed from the default setting
of “0000” to the nominal setting of “0110”.
7.5.3.5 Cable Length Indicator (CLI (Register 03h)
The Cable Length Indicator (CLI) provides an indication of the length of cable attached to the equalizer input. CLI
is accessible through bits [7:3] of SPI register 03h. The 5-bit CLI ranges in decimal value from 0 to 25 (“00000” to
“11001” binary) and increases as the cable length is increased. Figure 8 shows typical CLI values vs. Belden
1694A cable length. CLI is valid for Belden 1694A cable lengths of 0 m to 120 m at 2.97 Gbps, 0 m to 200 m at
1.485 Gbps, and 0 m to 400 m at 270 Mbps.
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Programming (continued)
30
CLI (decimal value)
25
20
15
10
5
0
0
50
100 150 200 250 300 350 400
BELDEN 1694A CABLE LENGTH (m)
Figure 8. CLI vs. Belden 1694A Cable Length
7.5.4 Input Mode (Equalizer) SPI Register Access
7.5.4.1 General Control (Register 00h)
SPI Register 00h, General Control, provides access to many basic features of the equalizer, including the carrier
detect status and the mute, sleep mode, and extended 3G reach mode controls.
7.5.4.1.1 Carrier Detect
This bit shows the status of the carrier detect for the BNC_IO pin.
7.5.4.1.2 Mute
The mute control can be used to manually mute or enable SDO and SDO. Setting this bit to “1” will mute the
equalizer outputs by forcing them to logic zero. Setting the mute bit to “0” will force the equalizer outputs to be
active.
7.5.4.1.3 Sleep Mode
The sleep mode is used to automatically or selectively power down the equalizer for power savings when it is not
needed. The auto sleep mode allows the equalizer to power down when no input signal is detected, and is
activated by default or by writing “01” to bits [4:3] of SPI register 00h. If the auto sleep mode is active, the
equalizer goes into a deep power save mode when no input signal is detected on the BNC_IO pin. The device
powers on again once an input signal is detected. The sleep functionality can be turned off completely (equalizer
will never sleep) by writing “00” to bits [4:3] of SPI register 00h. Additionally, the equalizer can be forced to power
down regardless of whether there is an input signal or not by writing “10” to bits [4:3] of SPI register 00h. The
sleep mode has precedence over the mute mode.
7.5.4.1.4 Extended 3G Reach Mode
The LMH0387 equalizer provides a mode to extend the 3G cable reach in systems that have margin in the jitter
budget. This allows for additional cable reach at 2.97 Gbps at the expense of slightly higher output jitter. The
extended 3G reach mode provides 10m of additional Belden 1694A cable reach, with an increase of output jitter
at this longer cable length of 0.05 to 0.1 UI. (Note: In Extended 3G Reach Mode, the maximum equalizable cable
lengths for HD and SD data rates will be limited to less than what can be achieved in normal mode).
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7.6 Register Maps
7.6.1 SPI Registers
Table 1. SPI Register Descriptions
ADDRESS
00h
R/W
R/W
NAME
General Control
BITS
7
Carrier Detect
6
Mute
5
Reserved
4:3
R/W
DEFAULT
Extended 3G Reach Mode
1:0
Reserved
0
0: Normal operation.
1: Equalizer outputs muted.
0
Reserved as 0. Always write 0
to this bit.
01
Equalizer sleep mode control.
Sleep has precedence over
Mute.
00: Never sleep. Disable sleep
mode (force equalizer to stay
enabled).
01: Auto sleep. Sleep mode
active when no input signal
detected.
10: Force sleep. Force
equalizer into sleep mode
(powered down) regardless of
whether there is an input signal
or not.
11: Reserved.
0
Extended 3G reach mode to
extend the equalizable cable
length for 2.97 Gbps
applications.
0: Normal operation.
1: Extended 3G reach mode.
00
Equalizer output driver swing
(VSSP-P).
000: VSSP-P = 400 mVP-P.
001: VSSP-P = 500 mVP-P.
010: VSSP-P = 600 mVP-P.
011: VSSP-P = 700 mVP-P.
100: VSSP-P = 800 mVP-P.
101, 110, 111: Reserved.
001
Equalizer output driver offset
voltage (common mode
voltage).
000: VOS = 1.05V.
001: VOS = 1.25V.
010: VOS = 1.45V.
011: VOS = 1.65V.
100: VOS = 1.85V.
101: VOS referenced to positive
supply.
110, 111: Reserved.
00
Reserved as 00. Always write
00 to these bits.
Output Driver
Offset Voltage
1:0
Reserved
Reserved as 00. Always write
00 to these bits.
011
Output Swing
4:2
DESCRIPTION
Read only.
0: No carrier detected on
BNC_IO pin.
1: Carrier detected on BNC_IO
pin.
Sleep Mode
2
7:5
01h
FIELD
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Register Maps (continued)
Table 1. SPI Register Descriptions (continued)
ADDRESS
R/W
NAME
BITS
7
02h
03h
18
R/W
R
FIELD
DEFAULT
Coarse launch amplitude
optimization for equalizer input.
0: Normal optimization with no
external attenuation (800 mVP-P
launch amplitude).
1: Optimized for -6 dB external
attenuation (400 mVP-P launch
amplitude).
0000
Launch amplitude optimization
fine tuning for equalizer input.
0000: +20% from nominal.
0001: +16% from nominal.
0010: +12% from nominal.
0011: +9% from nominal.
0100: +6% from nominal.
0101: +3% from nominal.
0110: Nominal. (The default
setting must be changed to this
nominal setting for most
applications).
0111: -2% from nominal.
1001: +24% from nominal.
1010: +29% from nominal.
1011: +34% from nominal.
1100: +40% from nominal.
1101: +46% from nominal.
1110: +53% from nominal.
1111: +60% from nominal.
1000: Reserved.
000
Reserved as 000. Always write
000 to these bits.
Coarse Control
Launch Amplitude
CLI
6:3
Fine Control
2:0
Reserved
7:3
CLI
2:0
Reserved
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DESCRIPTION
0
Cable Length Indicator.
Provides an indication of the
length of cable attached to the
equalizer input. CLI increases
as the cable length increases.
000
Reserved.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LMH0387 is a single channel SDI cable driver and equalizer that supports different application spaces. The
following sections describe the typical use cases and common implementation practices.
8.1.1 General Guidance for Applications
The LMH0387 supports SPI interface for configuring the device. Registers must be programmed (see
Programming) for proper operation of the device. Attention must be paid to the PCB layout for the high speed
signals to facilitate the SMPTE specification compliance. SMPTE specifies requirements for the Serial Digital
Interface to transport digital video over coaxial cable. SMPTE specifies the use of AC coupling capacitors for
transporting uncompressed serial data with heavy low-frequency content. This specification requires the use of a
4.7-μF AC coupling capacitor to avoid low-frequency DC wander. The 75-Ω trace impedance is required to meet
SMPTE specified rise/fall requirements to facilitate highest eye opening for the receiving device.
8.2 Typical Application
To meet SMPTE requirements, the optimal placement of the LMH0387 is to be as close to the BNC as possible.
Figure 9 shows the application circuit for the LMH0387.
VCC
4.7 PF
TX_EN
715:
SD/HD
RREF
TERMTX
75:
TX_EN
SD/HD
LMH0387
4.7 PF
SDI
Configurable
SDI In/Out
Cable
Driver
100:
SDI
4.7 PF
4.7 PF
BNC_IO
SDO
Cable
Equalizer
4.7 PF
SCK
MOSI
MISO
SS
CDTHRESH
CD
AEC-
SPI_EN
AEC+
TERMRX
SDO
To FPGA
4.7 PF
1.0 PF
SCK
MOSI
220:
MISO
1.0 PF
SS
VCC
CDTHRESH
CD
Figure 9. Typical Application Schematic
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Typical Application (continued)
8.2.1 Design Requirements
Table 2 lists the key design parameters of the LMH0387.
Table 2. Design Parameters
DESIGN PARAMETER
REQUIREMENTS
Input AC coupling capacitor
Required. A common type of AC coupling capacitor
is 4.7-µF ±10% X7R ceramic capacitor (0402 or
0201 size).
Trace or via under the device
No trace or via under the device.
Distance from device to BNC
Keep this distance as short as possible to minimize
the parasitic.
BNC_IO, TERMTX, TERMRX trace impedance
Design single-ended trace impedance with 75 Ω ±
5%.
SDI, SDI and SDO, SDO differential trace
impedance
Design differential trace impedance with 100 Ω ± 5%.
DC power supply coupling capacitors
To minimize power supply noise, use 0.1-µF shunt
across 10-µF capacitors as close to the device as
possible.
8.2.2 Detailed Design Procedure
To begin the design process, determine the followings:
• Maximum power consumption for PCB regulator selection: Use maximum current consumption in the data
sheet to compute the maximum power consumption.
• Closely compare schematic against typical connection diagram in the data sheet.
• With layout guideline in mind (see Layout Guidelines ) plan out the PCB layout and component placement to
minimize parasitic.
• Consult the BNC vendor for optimum BNC landing pattern.
8.2.3 Application Curve
Figure 10. Differential Serial Data Output After Equalizing 200m of B1694A at 1.485 Gbps, PRBS10
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9 Power Supply Recommendations
Follow these general guidelines when designing the power supply:
• The power supply should be designed to provide the recommended operating conditions in terms of DC
voltage and maximum current consumption.
• The maximum current draw for the LMH0387 is provided in the data sheet. This number can be used to
calculate the maximum current the supply must provide.
• The LMH0387 does not require any special power supply filtering, provided the recommended operating
conditions are met. Use 0.1-µF capacitors as close to the device VCCRX and VCCTX pins as possible.
10 Layout
10.1 Layout Guidelines
For information on layout and soldering of the laminate TLGA package, refer to the following application note:
AN-1125 (SNAA002), Laminate CSP/FBGA.
NOTE
For a CSP package, it is a general requirement not to have any metal (traces or vias) on
the top layer in the area directly underneath the device, other than the footprint. This is
intended to provide a flat planar surface for the package.
The ST 424, 292, and 259 standards have stringent requirements for the input and output return loss of receivers
and transmitters, which essentially specify how closely they must resemble a 75-Ω network. Any non-idealities in
the network between the BNC and the LMH0387 will degrade the return loss. Take care to minimize impedance
discontinuities both for the BNC footprint and for the trace between the BNC and the LMH0387 to ensure that the
characteristic impedance is 75 Ω. Best return loss performance is achieved with the LMH0387 placed closely to
the BNC to minimize the trace length between the BNC and the LMH0387's BNC_IO pin. Consider the following
PCB recommendations:
• Place the LMH0387 in close proximity to the BNC.
• Use surface mount components, and use the smallest components available. In addition, use the smallest
size component pads.
• Select trace widths that minimize the impedance mismatch between the BNC and the LMH0387.
• Select a board stack up that supports both 75-Ω single-ended traces and 100-Ω loosely-coupled differential
traces.
• Maintain symmetry on the complementary signals.
• Route 100-Ω traces uniformly (keep trace widths and trace spacing uniform along the trace).
• Avoid sharp bends in the signal path; use 45° or radial bends.
• Place bypass capacitors close to each power pin, and use the shortest path to connect device power and
ground pins to the respective power or ground planes.
• Remove ground plane under input/output components to minimize parasitic capacitance.
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10.2 Layout Example
GND and VCC relief under BNC and component pad
Figure 11. Ground and VCC Relief Under Controlled Impedance Component Pads
No metal (traces or vias) in this area
Figure 12. Top Etch Routing Restriction
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• AN-1125 Laminate CSP/FBGA, SNAA002
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: LMH0387
23
PACKAGE OPTION ADDENDUM
www.ti.com
5-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMH0387SL/NOPB
ACTIVE
TLGA
NPD
48
1000
Green (RoHS
& no Sb/Br)
NIAU
Level-3-260C-168 HR
LMH0387SL
LMH0387SLE/NOPB
ACTIVE
TLGA
NPD
48
250
Green (RoHS
& no Sb/Br)
NIAU
Level-3-260C-168 HR
LMH0387SL
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Aug-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-May-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LMH0387SL/NOPB
TLGA
NPD
48
1000
330.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
LMH0387SLE/NOPB
TLGA
NPD
48
250
178.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-May-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMH0387SL/NOPB
TLGA
NPD
48
1000
367.0
367.0
38.0
LMH0387SLE/NOPB
TLGA
NPD
48
250
213.0
191.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
NPD0048A
SLD48A (Rev B)
www.ti.com
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