Model C40A50Z4 Surface Mount Termination 40 Watts, 50Ω Description The C40A50Z4 is a high performance RoHS compliant Alumina (Al2O3) surface mount termination intended as a lower cost alternative to Aluminum Nitride (AIN) and Beryllium Oxide (BeO). The SMD termination is well suited to all cellular frequency bands such as: AMPS, GSM, DCS, PCS, PHS and UMTS. The high power handling makes the part ideal for terminating 90º hybrids, directional couplers, and for use in isolators. General Specifications Resistive Element Substrate Terminal Finish Operating Temperature Features: • 40 Watts • Lowest Cost Thick film Alumina Ceramic Tin over Nickel -55 to +125°C (see chart) Tolerance is ±0.010”, unless otherwise specified. Designed to meet of exceed applicable portions of MIL-E-5400. All dimensions in inches. • RoHS Compliant Electrical Specifications • Alumina Ceramic • Non-Nichrome Resistive Element • Low VSWR 50 ohms, ± 2% 40 Watts 1KHz – 2.3GHz <1.20:1 Resistance Value: Power: Frequency Range: V.S.W.R.: Specification based on unit properly installed using suggested mounting instructions and a 50 ohm nominal impedance. Specifications subject to change without notice • 100% Tested Outline Drawing C40 A50Z4 HATCHED AREA INDICATES LOCATION OF PROTECTIVE GLASS COATING BACK VIEW 0.060 [1.52] 0.003 [0.08] TYP. 0.113 [2.87] 0.050 [1.26] 0.030 [0.76] 0.375 [9.52] 0.375 [9.52] SIDE VIEW 0.070 [1.78] TOP VIEW RF IN 0.050 [1.27] DIMENSIONS IN INCHES [MILLIMETERS] Rev. 5/13/05 Available on Tape and Reel For Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model C40A50Z4 Typical Performance: Power De-rating: Tape & Reel: .472 [11.99] RF IN .069 [1.75] .079 [2.01] Ø.059 [Ø1.50] .157 [3.99] .013 [0.33] .453 [11.51] .945 [24.00] .413 [10.49] C40 A50Z4 .413 [10.49] .080 [2.03] DESPOOLING DIRECTION DIMENSIONS IN INCHES [MILLIMETERS] Mounting Footprint and Procedure: 0.255 [6.48] 50 ohm line 0.067 [1.70] 0.040 [1.02] SCREW (2 PLS.) Ø0.101 [Ø2.57] 2x 4-40 Screw Hole C40 A50Z4 0.040 [1.02] SOLDER PASTE SOLDER FILLED VIA PC BOARD HEATSINK 0.040 [1.02] MOUNTING PROCEDURE Ø0.020 [Ø0.51] 0.450 [11.43] Dimension given in inches [millimeters] For best thermal performance the PCB should be soldered to the heat sink. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Available on Tape and Reel For Pick and Place Manufacturing. 1. Drill thermal vias through PCB and fill with solder. 2. To ensure good thermal connectivity to heat sink, which is critical for proper operation drill and tap heatsink and mount PCB to heat sink using screws.