IRC TT OARS1R005JLF Open air sense resistors metal alloy strip Datasheet

OARS
Open Air Sense Resistors
Metal Alloy Strip
•
•
•
•
•
•
Greater than 1 Watt rating for 2512 pad design
Zero ohm jumper available
Economical low value SMT
Resistance values 2mΩ to 50mΩ
±1% or ±5% tolerance (0.002Ω 5% only)
Open air design provides cooler operation
Electrical Data
IRC Type
Power Rating
(watts)
Available Resistance
(ohms)
OARS-1
3W @ 70°C
.002, .003, .004, .005, .010, .015
.020, .022, .025, .030, .040, .050
*Contact factory for unlisted resistance values between 0.002 & 0.050 ohms.
Features:
Applications:
• Superior thermal expansion cycling
• Current sensing
• Flameproof
• Feedback
• Inductance less than 10 nanohenries
• Low inductance
• Lead flexible for thermal expansion
• Surge and pulse
• AC applications (please contact the factory)
Physical Data
Recommended Landing Pad Size
L
0.369
W
0.121
0.127
0.121
0.126
D
T
H
Dimensions (Inches and (mm))
IRC
Type
L
H
T
D
W
0.440 ±0.015
0.120 ±0.030
0.093 ±0.010
0.190 ±0.030
0.125 ±0.015
(11.18 ±0.381)
(3.05 ±0.762)
(2.36 ±0.254)
(4.83 ±0.762)
(3.175 ±0.381)
OARS-1
0.002Ω
0.455 ±.015
0.150 ±0.030
0.093 ±0.010
0.185 ±0.030
0.140 ±0.015
(11.56 ±.381 )
(3.51 ±0.762)
(2.36 ±0.254)
(4.70 ±0.762)
(3.56 ±0.381)
OARS-1
0.003Ω
0.440 ±.015
0.138 ±0.030
0.093 ±0.010
0.190 ±0.030
0.125 ±0.015
(11.18 ±.381 )
(3.51 ±0.762)
(2.36 ±0.254)
(4.83 ±0.762)
(3.175 ±0.381)
OARS-1
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A Subsidiary of
TT electronics plc
June 2009 Issue Page 1 of 4
OARS
Open Air Sense Resistors
Metal Alloy Strip
Environmental Data
Test Spec: AEC Q200
2m - 3m
4m - 15m
>15m
TCR +125 to -55°C
240ppm
40ppm
40ppm
Thermal Shock
<0.75%
<0.75%
<0.75%
High Temperature Exposure 125°C
<1.75%
<0.5%
<1.0%
Temperature Cycling: -40 to +125°C
<1.0%
<1.0%
<0.75%
Operational Life
<2.0%
<1.0%
<1.0%
Baised Humidity
<0.75%
<0.5%
<0.5%
Mechanical Shock
<1.5%
<1.0%
<1.0%
Vibration
<1.0%
<1.0%
<1.0%
<1.0
<2.5%
<2.0
Moisture Resistance
Terminal Strength
Meets JIS-C-6429
Solvent Resistance
Meets MIL-STD-202 Method 215
Solderability
Meets J-STD-002 Method B
Power Derating Curve
3.5
Note:
The power derating curve is a guidance based on a conservative design model. The OARS is a solid metal alloy
construction that can withstand significantly greater operating
temperatures than conservative design models permit. The
resistive alloys can withstand temperatures in exess of 350°C.
Therefore, the system thermal design is a more significant
design parameter due to the heat limitations of solder joints
and/or circuit board substrate materials. Refer to additional
information below.
Power Rating (watts)
3.0
2.5
2.0
1.0
0.0
25
60
95
130
165
195
225
Ambient Temperature (°C)
The thermal image (not a simulation) to the left is of an OARS
10 mΩ running at 2 Watts, which exceeds the 1 Watt conservative model. Notice the hotpsot is nearly 200°C, but the solder joint is approximately 65°C (FR4 is rated for 130°C). The
unique construction of the OARS isolates the hotspot from
the circuit board material preventing damage. Additionally,
the thermal energy is dissipated to the air instead of being
conducted into the circuit board potentially causing a nearby
power component to exceed its rating.
The standard test circuit board consists of a four layer FR4
material with 2 ounce outer layers and 1 ounce inner layers,
which is typical of many industry designs. Contact IRC for
more details or for other thermal image test data for specific
resistance values and power levels.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
June 2009 Issue Page 2 of 4
OARS
Open Air Sense Resistors
Metal Alloy Strip
Pulse/Surge Chart
70
Note:
The high pulse surge capability of the OARS parts is
attributed to the solid metal alloy construction. In many
applications the cross-section of the OARS is greater
than the cross-section of the board traces connecting
the parts to the circuit board.
Joules (watts-second)
60
50
40
Cross-Sectional area ranges from approximately 650
mils to 3600 mils.
30
20
10
0
0
10
20
30
40
50
60
Resistance (milli ohms)
Tape Specifications
G
E
D
C
B
F
A
Dimensions (Inches and (mm))
IRC
Type
OARS
A
B
C
D
E
F
G
0.17 ±0.003
0.461 ±0.003
0.945 ±0.010
0.453 ±0.004
0.069 ±0.004
0.315 ±0.004
0.157 ±0.004
(4.32 ±0.08)
(11.7 ±0.08)
(24.0 ±0.30)
(11.5 ±0.10)
(1.75 ±0.10)
(8.0 ±0.10)
(4.0 ±0.1)
Ordering Data
Sample Part No.
OARS1
R005
J
LF
IRC Type
OARS1
Power Rating in Watts
Resistance Range (ohms)
Tolerance
F = ±1%, G = ±2%, J = ±5%
RoHS Indicator
LF indicates RoHS compliance
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
June 2009 Issue Page 3 of 4
OARS
Open Air Sense Resistors
Metal Alloy Strip
IRC Solder Reflow Recommendations
Sn-Pb Eutectic and Pb-Free Reflow Profiles
tP
TP
Ramp-up
Critical Zone
TL to TP
TL
tL
Temperature
Tsmax
Tsmin
ts
Preheat
25
Ramp-down
t 25°C to Peak
Time
* Based on Industry Standards and IPC recommendations
Profile Feature
Sn-Pb Eutectic
Assembly
Pb-Free
Assembly
3°C / second max.
3°C / second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100°C
150°C
60 -120 seconds
150°C
200°C
60 -180 seconds
Time maintained above
- Temperature (TL)
- Time (tL)
183°C
60 - 150 seconds
217°C
60 - 150 seconds
Peak Temperature (TP)
See Table 1
See Table 2
Average Ramp-up rate (Tsmax to Tp)
Time within 5°C of actual Peak Temperature (tp)2
Ramp-down Rate
Time 25°C to Peak Temperature
10 - 30 seconds
20 - 40 seconds
6°C / second max.
6°C / second max.
6 minutes max.
8 minutes max.
Note 1: All temperatures refer
to topside of the package,
measured on the package
body surface.
Note 2: Time within 5 °C of
actual peak temperature (tp)
specified for the reflow profiles
is a “supplier” minimum and a
“user” maximum.
Note 1: Package volume excludes external
terminals (balls, bumps, lands, leads) and/or
non-integral heat sinks.
Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures
Package
Thickness
Volume mm3 < 350
Volume mm3 ≥ 350
< 2.5 mm
240 +0/-5°C
225 +0/-5°C
≥ 2.5 mm
225 +0/-5°C
225 +0/-5°C
Tabel 2: Pb-free Process Package Peak Reflow Temperatures
Package
Thickness
Volume mm3
< 350
Volume mm3
350 - 2000
Volume mm3
> 2000
< 1.6 mm
260°C *
260°C *
260°C *
1.6 mm - 2.5 mm
260°C *
250°C *
245°C *
≥ 2.5 mm
250°C *
245°C *
245°C *
Note 2: The maximum component temperature
reached during reflow depends on package
thickness and volume. The use of convection
reflow processess reduces the thermal gradients
between packages. However, thermal gradients
due to differences in thermal mass of SMD packages may still exist.
Note 3: Components intended for use in “leadfree” assembly process shall be evaluated using
the “lead-free” peak temperature and profiles
defined in Table 1, 2 and reflow profile whether
or not lead-free.
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL
level.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
June 2009 Issue Page 4 of 4
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