Cymbet CBC005-BDC-WF Rechargeable solid state bare die battery Datasheet

EnerChip™ Bare Die
Rechargeable Solid State Bare Die Batteries
Features
•
•
•
•
•
•
•
•
•
•
All Solid State Construction
Designed for Wirebond Attachment
Lead-Free Reflow Tolerant
Thousands of Recharge Cycles
Low Self-Discharge
Fast Recharge
Eco-friendly, RoHS Tested Compliant
Smallest Commercially Available Rechargeable
Energy Storage Device
Flat Output Voltage Profile
100% Non-cytotoxic
Electrical Properties
Output voltage (nominal): 3.8V
Capacity (nominal):
5µAh, 50µAh
Charging source:
4.1V
Recharge time to 80%: Varies by device
Charge/discharge cycles: >5000 at 10% discharge
Physical Properties
Die size (mm):
Varies by device
Operating temperature: -40°C to 70°C
Storage temperature:
-40°C to 125°C
Applications
•
•
•
•
•
•
Standby supply for non-volatile SRAM, real-time
clocks, controllers, supply supervisors, and other
system-critical components.
Portable devices requiring ultra-slim profile and
small footprint backup power source.
Localized power source to keep microcontrollers
and other devices alert in standby mode.
Power bridging to provide backup power to
system during exchange of main battery.
Internet of Things - EnerChips used as primary
rechargeable system power for devices such as
wireless sensors and micro-Wearables
Medical, Health and Fitness - EnerChip
batteries are ideal for these applications as the
EnerChip battery has been tested in vitro and
in vivo settings and shown to be 100% noncytotoxic.
CBC005
1.7mm x 2.25mm
x 0.200mm
CBC050
5.7 mm x 6.1mm
x 0.200mm
EnerChip™ bare die batteries are solid state, thin
film, rechargeable energy storage devices rated
at 5µAh and 50µAh at 3.8V. They are ideal as an
integrated power source for power backup or primary
rechargeable applications. EnerChip bare die are
the smallest and thinnest rechargeable energy
storage devices available to Original Equipment
Manufacturers (OEMs) and are a superior alternative
to coin cell batteries and super-capacitors for many
handheld, sensors and wearable systems.
The mounting footprint of EnerChip bare die are less
than legacy energy storage devices and up to 15
times thinner than a coin cell battery in a holder.
Small dimensions make the EnerChips ideal for
space-constrained applications.
Because of their solid state design, EnerChip™
energy storage devices are able to withstand solder
reflow temperatures and can be processed in highvolume manufacturing lines similar to conventional
semiconductor devices. In contrast to traditional
rechargeable batteries and super-capacitors, there
are no harmful gases, liquids or special disposal
procedures associated with the EnerChip.
EnerChip bare die are based on a patented, all solid
state, rechargeable lithium cell with a nominal 3.8V
output. Recharge is fast and simple with a direct
connection to a 4.1V voltage source and no current
limiting components are required. Recharge time
averages 20 minutes to 80% capacity. A robust
design offers thousands of charge/discharge cycles.
The EnerChip bare die have two wirebondable pads
for co-packaging with other components or chip-onboard mounting. Die are shipped as full wafers, dice
and ground on tape backing or in waffle packs.
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06Page 1 of 13
EnerChip™ Bare Die Batteries
Preliminary
Operating Characteristics - CBC005
PARAMETER
Discharge Cutoff Voltage
CONDITION
25°C
Charge Voltage
25°C
Pulse Discharge Current
Self-Discharge (5-yr. average; 25°C)
25°C
MIN
3.0(1)
TYPICAL
MAX
UNITS
-
-
V
4.0
4.1
4.3
Variable - see App. Note 1025
(2)
Non-recoverable
-
2.5
-
% per year
Recoverable
1.5
25
+70
% per year
°C
°C
Operating Temperature
-
-40
Storage Temperature
-
-40
-
+125(4)
Charge cycle 2
-
7
11
Charge cycle 1000
-
30
60
10% depth-of-discharge
5000
-
-
Cell Resistance (25°C)
Recharge Cycles
(to 80% of rated capacity; 4.1V charge
voltage)
25°C
40°C
Recharge Time (to 80% of rated capacity; 4.1V charge voltage; 25°C)(5)
Capacity
V
-
(3)
kΩ
cycles
50% depth-of discharge
1000
-
-
cycles
10% depth-of-discharge
2500
-
-
cycles
50% depth-of-discharge
500
-
-
cycles
Charge cycle 2
-
11
22
Charge cycle 1000
-
45
70
40nA discharge; 25°C
5
-
-
(1)
Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation.
(2)
Charging at 4.0V will charge the cell to approximately 70% of its rated capacity.
(3)
First month recoverable self-discharge is 4% average.
(4)
Storage temperature is for uncharged EnerChip.
(5)
EnerChip charging time and cell resistance increase approximately 2x per 10°C decrease in temperature.
minutes
µAh
CBC005 EnerChip Discharge Characteristics
Note: All specifications contained within this document are subject to change without notice.
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 2 of 13
EnerChip™ Bare Die Batteries
Preliminary
CBC005 Charging Characteristics
The EnerChip can be recharged quickly. The following graphs illustrate the correlation between charging time
and charging current into a discharged cell, and also the cumulative charge vs. charging time. Both graphs are
typical based on constant 4.1V charging at room temperature. Charging time increases at lower temperature.
EnerChip Temperature Characteristics
EnerChip cell resistance increases (decreases) with decreasing (increasing) temperature. The following graph
represents typical cell resistance over the rated operating temperature range.
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 3 of 13
EnerChip™ Bare Die Batteries
Preliminary
Operating Characteristics - CBC050
Condition
Min
Typical
Max
Units
Discharge Cutoff Voltage
Parameter
25°C
3.0(1)
-
-
V
Charge Voltage
25°C
4.0
4.1
4.3
V
Pulse Discharge Current
25°C
Variable - see App. Note 1025
-
Cell Resistance (25°C)
Charge cycle 2
-
500
1250
Charge cycle 1000
-
2250
5000
Non-recoverable
-
2.5
-
% per year
Recoverable
-
1.5(3)
-
% per year
Operating Temperature
-
-40
25
+70
°C
Storage Temperature
-
-40
-
125(4)
°C
Self-Discharge (5-yr. average; 25°C)
Recharge Cycles
(to 80% of rated
capacity; 4.1V charge
voltage)
25°C
40°C
Recharge Time (to 80% of rated capacity;
4.1V charge voltage)(5)
Capacity
(2)
Ω
10% depth-of-discharge
5000
-
-
cycles
50% depth-of discharge
1000
-
-
cycles
10% depth-of-discharge
2500
-
-
cycles
50% depth-of-discharge
500
-
-
cycles
Charge cycle 2
-
20
35
Charge cycle 1000
-
60
95
100µA discharge; 25°C
50
-
-
(1)
Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation.
(2)
Charging at 4.0V will charge the cell to approximately 70% of its rated capacity.
(3)
First month recoverable self-discharge is 5% average.
(4)
Storage temperature is for uncharged EnerChip.
(5)
EnerChip charging time and cell resistance increase approximately 2x per 10°C decrease in temperature.
minutes
µAh
CBC050 EnerChip Discharge Characteristics
Note: All specifications contained within this document are subject to change without notice.
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 4 of 13
EnerChip™ Bare Die Batteries
Preliminary
CBC050 Charging Characteristics
The EnerChip can be recharged quickly. The following graphs illustrate the correlation between charging time
and charging current into a discharged cell, and also the cumulative charge vs. charging time. Both graphs are
typical based on constant 4.1V charging at room temperature. Charging time increases at lower temperature.
EnerChip Temperature Characteristics
EnerChip cell resistance increases (decreases) with decreasing (increasing) temperature. The following graph
represents typical cell resistance over the rated operating temperature range.
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 5 of 13
EnerChip™ Bare Die Batteries
Preliminary
ENERCHIP CHARGING GUIDELINES
As with other rechargeable batteries, discharge capacity and cycle life are a function of charge voltage,
discharge cutoff voltage, depth-of-discharge, temperature, and other factors. The system designer must
understand the effect of these factors when designing the charge control circuit. Cymbet encourages all
designers to utilize the CBC910 Power Management IC (datasheet is DS-72-11) to optimize performance.
•
•
•
•
•
•
Never charge EnerChip batteries before soldering or exposing to temperatures above the specified
operating temperatures. The EnerChip will be damaged or may not work at all.
Never apply more than 4.3V across the battery terminals as cycle life will be dramatically reduced.
There is no need to externally limit the charging current of small surface-mount batteries. The intrinsic
cell resistance is sufficient to limit the current to an acceptable level as long as the applied voltage does
not exceed 4.3V.
The charging voltage and charge time determine the amount of charge delivered to, and accessible
from, the battery. A higher charging voltage will deliver more charge, but will also result in greater
long-term capacity fade as a function of charge/discharge cycling. Figure 1 shows trade-offs between
charging voltage, charge capacity and cycle fade.
The batteries may be charged at a constant current (CC) followed by a constant voltage (CV). During the
CC phase, the current may be set to any value that results in an acceptable charging time and does not
cause the battery voltage to exceed 4.3V.
CV charging will normally result in faster charging times than the combined CC-CV approach. The latter
may become necessary with future, larger batteries with lower intrinsic cell resistance. Please refer to
the Operating Characteristics data tables for these batteries.
60
Achieved Capacity (µAh)
50
40
4.3V
4.2V
4.15V
4.1V
4.0V
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
Cycles
Figure 1: Effect of Charging Voltage on Battery Charge and Cycle Fade
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 6 of 13
EnerChip™ Bare Die Batteries
Preliminary
BATTERY PERFORMANCE CONSIDERATIONS
There are several considerations that determine EnerChip performance over time and with use. These are:
Temperature
•
•
•
Battery aging accelerates with increasing temperature.
The operating temperature range is narrower than the storage temperature range; moreover, the storage
temperature range for an EnerChip that has never been charged is different from that of an EnerChip
that has been charged one or more times - partially or fully.
Battery impedance increases with decreasing temperature - by a factor of approximately 2 for every
10°C reduction in operating temperature.
Number of Charge/Discharge Cycles
•
•
As the depth-of-discharge on the cell increases, the number of charge/discharge cycles decrease.
The charge/discharge cycle life of the EnerChip is dependent on a number of variables, including temperature, depth-of-discharge, charging voltage, and discharge cutoff voltage. Note that the CBC910 PMIC
has built in temperature compensation for battery charging.
Input Charging Conditions
•
•
It is important to regulate the charging voltage applied to the EnerChip in order to ensure a long service
life and delivery of the rated capacity.
Charging at a lower voltage at high temperatures reduces the EnerChip per charge capacity but increased the number of charge/discharge cycles. The CBC910 power management IC performs this function using temperature compensation circuitry.
Discharge Cutoff Conditions
•
•
During discharge of the EnerChip, the minimum discharge cutoff voltage as specified in the data sheet
must be enforced. If the discharge voltage is allowed to drop below the rated value, particularly at low
discharge currents, the performance of the EnerChip will be degraded, and under certain conditions,
the device will ultimately fail to operate according to specifications.
Regarding resistance to humidity, chemical exposure, and g-forces, the EnerChip product family is designed to meet JEDEC standards.
In-Circuit Use Guidelines
•
•
Do not connect these batteries to other types of batteries except through an approved charging circuit.
To increase battery life, avoid installing near heat-generating devices.
GUIDELINES FOR HANDLING ENERCHIPS
Certain precautions should be taken when handling and storing EnerChips.
Temperature and Moisture Sensitivity Level
•
•
Store the EnerChip wafers and bare die batteries in waffle packs in their original packaging in an
environment where the temperature and humidity do not undergo large fluctuations. Store at 10°C to
30°C and at less than 60% relative humidity.
Treat EnerChip bare die batteries as you would other MSL-1 devices when handling for assembly.
Electrostatic Discharge (ESD)
•
•
•
•
Similar to integrated circuits, the batteries are sensitive to ESD damage prior to receiving a charge
cycle. Therefore, adherence to ESD prevention guidelines is required.
Remove devices from protective shipping and storage containers at approved ESD workstations only.
All equipment used to process the devices must be configured to minimize the generation of static
charges. This includes soldering and de-soldering equipment and tools, pick-and-place equipment, test
equipment, and all other tools and equipment used to handle or process the devices.
Failure to observe these precautions can lead to premature failure and shall void product warranty.
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 7 of 13
EnerChip™ Bare Die Batteries
Preliminary
REFLOW SOLDERING
•
•
•
•
The maximum number of times the battery may be reflow soldered is three times.
The surface temperature of the battery must not exceed 240°C.
The recommended solder reflow profile is shown in Figure 2 below; refer to Figure 3 Parameters table
for time and temperature requirements. Whenever possible, use lower temperature solder reflow
profiles.
Never hand solder or reflow solder an EnerChip battery that has been charged as damage will occur.
TP
TL
Figure 2: EnerChip Solder Reflow Profile
Parameter
Sn/Pb
Pb-free
Soak temperature, min, TSMIN
100°C
150°C
Soak temperature, max, TSMAX
Soak time, max, tS
Max ramp-up rate (TL to TP)
Liquidous temperature, TL
150°C
2 min
3°C/sec
183°C
200°C
2 min
3°C/sec
217°C
60-150 sec
60-150 sec
220°C
240°C
20 sec
6°C/sec
6 min max
30 sec
6°C/sec
8 min max
Time tL maintained above TL
Max peak temperature, TP
Max time tP at peak temperature TP
Max ramp-down rate (TP to TL)
Time 25°C to peak temperature
Figure 3: Solder Reflow Parameters as per IPC/JEDEC J-STD-020D.1
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 8 of 13
EnerChip™ Bare Die Batteries
Preliminary
BARE DIE DELIVERY OPTIONS
EnerChip bare die applications often require custom procedures and significant variation exists among package
vendors and assembly equipment, making specific guidelines difficult. Contact Cymbet Application Engineering
to review handling, wirebonding, bumping, and assembly guidelines.
Bare die undergo the following screening procedures prior to leaving the manufacturing facility:
•
•
Electrical test to ensure the cell is not shorted, open, and is within the specification limits of cell resistance.
MIL-STD-883 optical inspection.
BARE DIE HANDLING GUIDELINES
•
•
•
•
•
•
•
When unpacking, storing, inspecting, or handling bare die EnerChips, all operations should be performed
in a Class-1,000 (or better) clean room - ISO 6 equivalent.
When removing die from waffle packs, use the minimum downward force possible with the handling
mechanism.
Handling and insertion forces need to be kept to a minimum to reduce damage to the device materials.
Tool recommendations: Use pick-and-place tool having a “soft” tip, e.g., rubber or other pliable material.
EnerChips are sensitive to electrostatic discharge (ESD) and should always be handled in an ESDcontrolled environment.
EnerChips should be stored in a humidity-controlled environment to prevent excess moisture from
penetrating the EnerChip.
Never use tweezers (or other mechanical means) on the film surface of the bare die. When using
mechanical means (vs. vacuum pick and place tool) always pick up EnerChip bare by the outside edges of
the part.
DIE BUMPING AND WIREBONDING
EnerChip bare die have bond pads that are suitable for either wirebonding. The pad structure on the EnerChip
bare die described in this datasheet are designed for wire bonds. With only two bond pads on an EnerChip die,
gold stud bumping is not suggested as it would yield a mechanically unsound configuration.
Bond pads are made of aluminum with a small amount of silicon and copper and therefore either gold or aluminum wires may be attached to the bond pad.
Standard wirebond machine and process settings are generally applicable when wirebonding to EnerChip die.
When placing EnerChip die onto the die attach material, use the minimum downward force possible. Ensure
there is a uniform coating of die attach material on the substrate (i.e., no voids or gaps) and that the die attach
material extends to the edge of the EnerChip die during die placement.
Recommended wirebond process time and temperatures are as follows:
Die Attach Epoxy Cure
190°C +/- 10°C for 1.5 hours
Wirebond
Pre-heat:
190°C
Wirebond:
200°C
Post-heat:
190°C
Package Epoxy Cure
175°C +/- 10°C
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 9 of 13
EnerChip™ Bare Die Batteries
Preliminary
BARE DIE TEMPERATURE GUIDELINES
Temperature Guidelines:
• Operating temperature (charged): -40°C to +70°C.
• Storage temperature (uncharged): -40°C to +125°C.
• Bare die assembly process temperatures: Do not exceed +200°C for duration consistent with die attach,
wire bond & mold compound cure periods.
BARE DIE ENCAPSULATION AND UNDERFILL GUIDELINES
EnerChip die undergo a minute amount of expansion and contraction when being charged and discharged.
Consequently, it is important to not encapsulate the die with overly compressive or rigid materials. Similarly,
application of rigid epoxy underfill compounds between a flip-chipped die and printed circuit board material is
discouraged.
If applying a protective overcoat on the die, Cymbet recommends either of the following silicone encapsulants,
applied at a minimum thickness of 100 microns:
Q1-4939
Q3-6646
Both materials are products from Dow Corning.
Contact Cymbet Applications Engineering to discuss any encapsulation or underfill requirements.
IN-CIRCUIT TESTING OF ENERCHIPS
Once the EnerChip has been assembled in system, it may be charged. If in-circuit testing is to be done for
purposes of testing the EnerChip itself or other circuitry on the board, the following guidelines should be
observed:
•
•
•
Never apply a voltage outside the rated charge or discharge voltage range as specified in the respective
EnerChip data sheet.
As with all batteries, the EnerChip has an inherent internal resistance. Never force a current into or out
of the EnerChip that would result in the battery voltage rising above or falling below a voltage outside the
rated charge or discharge voltage range as specified in the data sheet.
Once the EnerChip has been charged - partially or fully - do not store or operate the EnerChip outside of the
operating temperature range as specified in the data sheet.
Please contact Cymbet Applications Engineering to discuss In-Circuit and System Testing when using
EnerChip Bare Die. All customer applications are uinque and the EnerChip testing techniques may vary
between different end-user products. Please use the Cymbet.com Support Form or call +1-763-633-1780.
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 10 of 13
EnerChip™ Bare Die Batteries
Preliminary
CBC005 Bare Die Dimensions
Notes:
1. All Dimensions in Microns
2. The Positive and Negative
battery terminals on the CBC005
are in a reversed position from the
CBC050
CBC005 Bare Die Anode Pad Cross-Section
(Not to Scale)
CBC005 Bare Die Cathode Pad Cross-Section
(Not to Scale)
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 11 of 13
EnerChip™ Bare Die Batteries
Preliminary
CBC050 Bare Die Dimensions
CBC050 Bare Die Anode Pad Cross-Section
(Not to Scale)
CBC050 Bare Die Cathode Pad Cross-Section
(Not to Scale)
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 12 of 13
EnerChip™ Bare Die Batteries
Preliminary
ENERCHIP BARE DIE ASSEMBLY EXAMPLES
The following photos demonstrate how easy it is to use EnerChip bare die batteries in products. The first
example in Figure 4 shows the internal construction of the EnerChip RTC device. This device combines a
CBC005 5uAh EnerChip bare die battery, a CBC910 Power Management IC, a Real Time Clock bare die, and a
capacitor.
EnerChip Bare Die
Battery
Capacitor
Real Time Clock
Bare Die
Power Management
ASIC Bare Die
Figure 4: EnerChip RTC multiple bare die in single package
Figure 5 illustrates a three layer EnerChip bare die battery stack using a waterfall wirebond approach.
Figure 5: EnerChip bare die battery stack with close-up view
Ordering Information
EnerChip Part Number
CBC005-BDC-WP
CBC005-BDC-WF
CBC050-BDC-WP
CBC050-BDC-WP
Description
5µAh EnerChip Bare Die, Waffle Pack
5µAh EnerChip Bare Die, Wafer for wire bond
50µAh EnerChip Bare Die, Waffle Pack
50µAh EnerChip Bare Die, Wafer for wire bond
Notes
Contact Cymbet
Contact Cymbet
Contact Cymbet
Contact Cymbet
Disclaimer of Warranties; As Is
The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any
kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the
implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of
dealing, course of performance, or usage of trade. Cymbet EnerChip products are not authorized for use in life critical applications. Users
shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted
for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and
any use of the Cymbet EnerChip product described herein in any such product or applications.
Cymbet, the Cymbet Logo, and EnerChip are Cymbet Corporation Trademarks
©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-41 Rev06
Page 13 of 13
Similar pages