Spec. No. : C065SP Issued Date : 2017.10.13 Revised Date : Page No. : 1/7 CYStech Electronics Corp. Switching Control Diode DIS0365CTSP Features • High current capability • Smoothly soft reverse recovery time (trr) • Low profile surface mounted package in order to minimize board space • Two dice in a package • Pb-free lead plating and halogen-free package Mechanical data •Case : TO-277 Molded plastic •Epoxy : UL94-V0 rated flame retardant •Terminals : Plated terminals, solderable per MIL-STD-202 method 208 •Weight : approx. 0.094 gram Symbol Outline TO-277 DIS0365CTSP Anode Anode 2 1 2 3 Cathode Cathode 3 Cathode Cathode 1 Ordering Information Device DIS0365CTSP-65-TD-G Package TO-277 (Pb-free lead plating and halogen-free package) Shipping 5000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TD : 5000 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name DIS0365CTSP Preliminary CYStek Product Specification Spec. No. : C065SP Issued Date : 2017.10.13 Revised Date : Page No. : 2/7 CYStech Electronics Corp. Absolute Maximum Ratings (TA=25℃, unless otherwise noted) , per leg Parameters Conditions Symbol Value Units Repetitive peak reverse voltage VRRM 650 V RMS voltage VRMS 455 V VR 650 V IF(AV) 3 A IF(AV) 6 A IFRM 4.7 A IFSM 48 A trr 1 μs Tstg -55~+150 °C Tj -55~+150 °C Continuous reverse voltage Forward rectified current Forward rectified current Repetitive Peak Forward Current Forward surge current Maximum reverse recovery time Single phase half wave, 60Hz @TJ=25°C, per leg Single phase half wave, 60Hz @TJ=25°C, per device Single phase half wave, 60Hz @TJ=25°C 8.3ms single half sine-wave superimposed on rated load (JEDEC method) IF=1A, dIF/dt=100A/μs Storage temperature range Operating junction temperature range Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Thermal Resistance, Junction-to-ambient, max Thermal Resistance, Junction-to-ambient, max Power Dissipation @ TC=25°C Power Dissipation @ TA=25°C Power Dissipation @ TA=25°C Power Dissipation @ TA=25°C Symbol Rth,j-c Value 6.5 39 75 169 19 3.2 1.7 0.74 (Note 1 ) (Note 2 ) Rth,j-a (Note 3) (Note 1 ) PD (Note 2 ) (Note 3 ) Unit °C/W W Note: 1. Device mounted on FR-4 PCB, single sided 2 oz. copper, pad dimension 50mm×50mm. 2. Device mounted on FR-4 PCB, single sided 1 oz. copper, pad dimension 25mm×25mm. 3. Device mounted on FR-4 PCB, single sided 1 oz. copper, minimum recommended pad dimension. Characteristics (TA=25°C, unless otherwise noted) , per leg Characteristic Symbol Condition Continuous reverse voltage VR IR=100μA Forward Voltage VF 1 VF 2 IF=1A IF=3A VR=540V VR=540V, TA=125°C VR=1V, f=1MHz Reverse Leakage Current IR Junction Capacitance CJ DIS0365CTSP Preliminary Min. Typ Max. Unit 650 - - V - 53 1.1 1.2 100 10 - V nA μA pF CYStek Product Specification Spec. No. : C065SP Issued Date : 2017.10.13 Revised Date : Page No. : 3/7 CYStech Electronics Corp. Typical Characteristics , per leg Power Derating Curve Power Derating Curve 3.5 20 See Note1 on page 2 18 See Note 2 on page 2 2.5 2 Power Dissipation(W) Power Dissipation(W) 3 See Note 3 on page 2 1.5 1 16 14 12 10 8 6 4 0.5 2 0 0 0 25 50 75 100 125 150 Ambient Temperature---TA(℃) 175 0 50 75 100 125 150 175 Case Temperature---TC ℃) Forward Current vs Forward Voltage Reverse Leakage Current vs Reverse Voltage 10000 10000 Tj=150℃ Reverse Leakage Current---I R (nA) Instantaneous Forward Current---IF (mA) 25 150℃ 1000 12 5° 25°C 100 0℃ 75°C -40°C 10 Pulse width=300μs, 1% Duty cycle 1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Forward Voltage---VF(V) 2 1000 Tj=125°C 100 Tj=75℃ 10 Tj=25℃ Tj=0°C 1 Tj=-40°C 0.1 0.01 0 50 100 150 200 250 300 350 400 450 500 550 600 650 Reverse Voltage---VR (V) Junction Capacitance vs Reverse Voltage Junction Capacitance---C J(pF) 100 10 Tj=25℃, f=1.0MHz 1 0.1 1 10 100 Reverse Voltage---VR (V) DIS0365CTSP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C065SP Issued Date : 2017.10.13 Revised Date : Page No. : 4/7 Recommended Soldering Footprint DIS0365CTSP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C065SP Issued Date : 2017.10.13 Revised Date : Page No. : 5/7 Reel Dimension Carrier Tape Dimension DIS0365CTSP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C065SP Issued Date : 2017.10.13 Revised Date : Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note :1. All temperatures refer to topside of the package, measured on the package body surface. 2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care should be taken to match the coefficients of thermal expansion between components and PCB. If they are not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly cools. DIS0365CTSP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C065SP Issued Date : 2017.10.13 Revised Date : Page No. : 7/7 TO-277 Dimension Marking: Cathode Cathode Cathode DIS 0365 CT Anode □□ Cathode Date Code Anode TO-277 Plastic Surface Mounted Package CYStek Package Code: SP Millimeters Min. Max. 1.05 1.15 0.80 0.99 1.70 1.88 0.15 0.35 0.20 0.33 4.00 4.30 3.90 4.05 DIM A b1 b2 b3 C D D1 Inches Min. Max. 0.041 0.045 0.031 0.039 0.067 0.074 0.006 0.014 0.008 0.013 0.157 0.169 0.154 0.159 DIM D2 E E1 E2 E3 e L Millimeters Min. Max. 2.95 3.15 6.40 6.60 5.30 5.45 3.45 3.65 4.20 4.60 1.84 TYP 0.75 0.95 Inches Min. Max. 0.116 0.124 0.252 0.260 0.209 0.215 0.136 0.144 0.165 0.181 0.072 TYP 0.030 0.037 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DIS0365CTSP Preliminary CYStek Product Specification