TI ISO7420MDR Low-power dual digital isolator Datasheet

ISO7420, ISO7420M
ISO7421, ISO7421M
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SLLS984D – JUNE 2009 – REVISED JULY 2010
Low-Power Dual Digital Isolators
Check for Samples: ISO7420, ISO7420M, ISO7421, ISO7421M
FEATURES
APPLICATIONS
•
•
•
1
2
•
•
•
•
•
•
Highest Signaling Rate: 1 Mbps
Low Power Consumption, Typical ICC per
Channel (3.3V operation):
– ISO7420: 1.1 mA, ISO7421: 1.5 mA
Low Propagation Delay – 9 ns Typ. and Low
Skew – 300 ps Typ.
Wide TA Range Specified: –40°C to 125°C
4-kVpeak Maximum Isolation, 2.5 kVrms per
UL 1577, IEC/VDE and CSA Approvals, IEC
60950-1, IEC 61010-1 End Equipment
Standards Approvals. All Approvals Pending.
50 kV/ms Transient Immunity, Typical
Over 25-Year Isolation Integrity at Rated
Voltage
Operates From 3.3V and 5V Supply and Logic
Levels
Optocoupler Replacement in:
– Industrial Fieldbus
– Profibus
– Modbus
– DeviceNet™ Data Buses
– Servo Control Interface
– Motor Control
– Power Supplies
– Battery Packs
DESCRIPTION
The ISO7420, ISO7420M, ISO7421, and ISO7421M provide galvanic isolation up to 2.5 kVrms for 1 minute per
UL. These digital isolators have two isolated channels. Each isolation channel has a logic input and output buffer
separated by a silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, these
devices prevent noise currents on a data bus or other circuit from entering the local ground and interfering with or
damaging sensitive circuitry. The suffix M indicates wide temperature range (–40°C to 125°C).
The devices have TTL input thresholds and require two supply voltages, 3.3V or 5V, or any combination. All
inputs are 5-V tolerant when supplied from a 3.3V supply.
Note: The ISO7420 and ISO7421 are specified for signaling rates up to 1 Mbps. Due to their fast response time,
under most cases, these devices will also transmit data with much shorter pulse widths. Designers should add
external filtering to remove spurious signals with input pulse duration < 20ns if desired.
SPACER
1
INA
2
INB
3
GND1
4
ISO7421
D Package
(Top View)
8
VCC2
VCC1
1
7
OUTA
OUTA
2
6
OUTB
INB
3
5
GND2
GND1
4
Isolation
VCC1
Isolation
ISO7420
D Package
(Top View)
8
VCC2
7
INA
6
OUTB
5
GND2
P0066-08
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DeviceNet is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
ISO7420, ISO7420M
ISO7421, ISO7421M
SLLS984D – JUNE 2009 – REVISED JULY 2010
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN FUNCTIONS
PIN
NAME
I/O
NO.
DESCRIPTION
INA
7
I
Input, channel A
INB
3
I
Input, channel B
GND1
4
–
Ground connection for VCC1
GND2
5
–
Ground connection for VCC2
OUTA
2
O
Output, channel A
OUTB
6
O
Output, channel B
VCC1
1
–
Power supply, VCC1
VCC2
8
–
Power supply, VCC2
Table 1. FUNCTION TABLE (1)
INPUT SIDE
VCC
PU
PD
(1)
(2)
OUTPUT SIDE
VCC
PU
PU
INPUT
IN
OUTPUT
OUT
H
H
L
L
Open
H (2)
X
H (2)
PU = Powered up (VCC ≥ 3 V); PD = Powered down (VCC ≤ 2.4 V);
X = Irrelevant; H = High level; L = Low level
In fail-safe condition, output is at high level for ISO7420, ISO7420M,
ISO7421 and ISO7421M.
AVAILABLE OPTIONS
PRODUCT
RATED
ISOLATION
PACKAGE
INPUT
THRESHOLD
RATED TA
CHANNEL
DIRECTION
MARKED
AS
ISO7420
–40°C to 105°C
IS7420
ISO7420M
–40°C to 125°C
I7420M
–40°C to 105°C
IS7421
Same direction
2.5 kVrms
D-8
ISO7421
2
~1.5 V (TTL)
(CMOS compatible)
–40°C to 125°C
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ISO7420D (rail)
ISO7420DR (reel)
ISO7420MD (rail)
Opposite
directions
ISO7421M
(PREVIEW)
ORDERING
NUMBER
ISO7420MDR
(reel)
ISO7421D (rail)
ISO7421DR (reel)
ISO7421MD (rail)
I7421M
ISO7421MDR
(reel)
Copyright © 2009–2010, Texas Instruments Incorporated
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ISO7421, ISO7421M
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SLLS984D – JUNE 2009 – REVISED JULY 2010
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
VCC
Supply voltage (2), VCC1, VCC2
–0.5 V to 6 V
VI
Voltage at IN, OUT
–0.5 V to 6 V
IO
Output current
ESD
Electrostatic
discharge
±15 mA
Human-body model
JEDEC Standard 22, Test Method A114-C.01
Field-induced charged-device
model
JEDEC Standard 22, Test Method C101
Machine model
ANSI/ESDS5.2-1996
±4 kV
All pins
±1.5 kV
±200 V
TJ(Max) Maximum junction temperature
Tstg
(1)
(2)
150°C
Storage temperature
-65°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values.
RECOMMENDED OPERATING CONDITIONS
MIN
VCC1, VCC2
TYP MAX
Supply voltage - 3.3V operation
3.15
3.3
3.45
Supply voltage - 5V operation
4.75
5
5.25
V
IOH
High-level output current
IOL
Low-level output current
VIH
High-level input voltage
2
VCC
VIL
Low-level input voltage
0
0.8
V
TJ (1)
Junction temperature
–40
136
°C
1/tui
Signaling rate
0
1
tui
Input pulse duration
1
(1)
–4
UNIT
mA
4
mA
V
Mbps
us
To maintain the recommended operating conditions for TJ, see the Package Thermal Characteristics table and the ICC limits in this data
sheet.
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ISO7421, ISO7421M
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ELECTRICAL CHARACTERISTICS
VCC1 and VCC2 at 5V ± 5%; TA = –40°C to 125°C for ISO742xM, TA = –40°C to 105°C for ISO742x
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
TEST CONDITIONS
MIN
TYP
IOH = –4 mA; see Figure 1.
VCC – 0.8
4.6
IOH = –20 mA; see Figure 1.
VCC – 0.1
5
High-level input current
IIL
Low-level input current
0.2
0.4
IOL = 20 mA; see Figure 1.
0
0.1
CMTI
Common-mode transient immunity
400
–10
VI = VCC or 0 V; see Figure 3.
25
V
mV
10
INx at 0 V or VCC
UNIT
V
IOL = 4 mA; see Figure 1.
VI(HYS) Input threshold voltage hysteresis
IIH
MAX
mA
mA
50
kV/ms
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
DC to 1 Mbps VI = VCC or 0 V, 15 pF load
0.4
1
3
6
2
4
2
4
mA
ISO7421
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
DC to 1 Mbps VI = VCC or 0 V, 15 pF load
mA
SWITCHING CHARACTERISTICS
VCC1 and VCC2 at 5V ± 5%; TA = –40°C to 125°C for ISO742xM, TA = –40°C to 105°C for ISO742X
PARAMETER
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(pp)
Part-to-part skew time
tsk(o)
Channel-to-channel output skew time
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(1)
4
TEST CONDITIONS
See Figure 1.
See Figure 1.
MIN
TYP
UNIT
9
14
ns
0.3
3.5
ns
4
ns
3.6
ns
1
See Figure 2.
MAX
ns
1
ns
6
ms
Also known as pulse skew.
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SLLS984D – JUNE 2009 – REVISED JULY 2010
ELECTRICAL CHARACTERISTICS
VCC1 at 5V ± 5%, VCC2 at 3.3V ± 5%; TA = –40°C to 125°C for ISO742xM , TA = –40°C to 105°C for ISO742x
PARAMETER
TEST CONDITIONS
IOH = –4 mA;
see Figure 1.
VOH
High-level output voltage
MIN
TYP
ISO7421 (5-V side)
VCC – 0.8
4.6
ISO7420 / 7421 (3.3-V side)
.
VCC – 0.4
3
VCC – 0.1
VCC
IOH = –20 mA; see Figure 1,
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
IIL
Low-level input current
CMTI
Common-mode transient immunity
MAX
V
IOL = 4 mA; see Figure 1.
0.2
0.4
IOL = 20 mA; see Figure 1.
0
0.1
400
–10
VI = VCC or 0 V; see Figure 3.
25
V
mV
10
INx at 0 V or VCC
UNIT
mA
mA
40
kV/ms
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
DC to 1 Mbps VI = VCC or 0 V, 15 pF load
0.4
1
mA
2
4.5
mA
2
4
mA
1.5
3.5
mA
ISO7421
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
DC to 1 Mbps VI = VCC or 0 V, 15 pF load
SWITCHING CHARACTERISTICS
VCC1 at 5V ± 5%, VCC2 at 3.3V ± 5%; TA = –40°C to 125°C for ISO742xM, TA = –40°C to 105°C for ISO742x
PARAMETER
TYP
MAX
10
17
ns
0.5
4
ns
Part-to-part skew time
5
ns
Channel-to-channel output skew time
4
ns
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(pp)
tsk(o)
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(1)
TEST CONDITIONS
MIN
See Figure 1.
See Figure 1.
2
See Figure 2.
UNIT
ns
2
ns
6
ms
Also known as pulse skew.
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ELECTRICAL CHARACTERISTICS
VCC1 at 3.3V ± 5%, VCC2 at 5V ± 5%; TA = –40°C to 125°C for ISO742xM, TA = –40°C to 105°C for ISO742X
PARAMETER
TEST CONDITIONS
IOH = –4 mA;
see Figure 1.
VOH
High-level output voltage
MIN
TYP
ISO7420 / 7421 (5-V side).
VCC – 0.8
4.6
ISO7421 (3.3-V side)
VCC – 0.4
3
VCC – 0.1
VCC
IOH = –20 mA; see Figure 1
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
IIL
Low-level input current
CMTI
Common-mode transient immunity
MAX
V
IOL = 4 mA; see Figure 1.
0.2
0.4
IOL = 20 mA; see Figure 1.
0
0.1
400
–10
VI = VCC or 0 V; see Figure 3.
25
V
mV
10
INx at 0 V or VCC
UNIT
mA
mA
40
kV/ms
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
DC to 1 Mbps
VI = VCC or 0 V, 15 pF load
DC to 1 Mbps
VI = VCC or 0 V, 15 pF load
0.2
0.7
3
6
1.5
3.5
2
4
mA
ISO7421
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
mA
SWITCHING CHARACTERISTICS
VCC1 at 3.3V ± 5%, VCC2 at 5V ± 5%, TA = –40°C to 125°C for ISO742xM, TA = –40°C to 105°C for ISO742x
PARAMETER
TYP
MAX
10
17
ns
0.5
4
ns
Part-to-part skew time
5
ns
Channel-to-channel output skew time
4
ns
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(pp)
tsk(o)
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(1)
6
TEST CONDITIONS
See Figure 1.
See Figure 1.
MIN
2
See Figure 2.
UNIT
ns
2
ns
6
ms
Also known as pulse skew.
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ELECTRICAL CHARACTERISTICS
VCC1 and VCC2 at 3.3V ± 5%, TA = –40°C to 125°C for ISO742xM, TA = –40°C to 105°C for ISO742x
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VOL
Low-level output voltage
MIN
IOH = –4 mA; see Figure 1.
VCC – 0.4
3
IOH = –20 mA; see Figure 1.
VCC – 0.1
3.3
High-level input current
IIL
Low-level input current
CMTI
Common-mode transient
immunity
MAX
UNIT
V
IOL = 4 mA; see Figure 1.
0.2
0.4
IOL = 20 mA; see Figure 1.
0
0.1
VI(HYS) Input threshold voltage hysteresis
IIH
TYP
V
400
mV
10
INx at 0 V or VCC
mA
–10
VI = VCC or 0 V; see Figure 3.
25
mA
40
kV/ms
SUPPLY CURRENT (All inputs switching with square wave clock signal for dynamic ICC measurement)
ISO7420
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
DC to 1 Mbps
VI = VCC or 0 V, 15 pF load
DC to 1 Mbps
VI = VCC or 0 V, 15 pF load
0.2
0.7
2
4.5
1.5
3.5
1.5
3.5
mA
ISO7421
ICC1
Supply current for VCC1
ICC2
Supply current for VCC2
mA
SWITCHING CHARACTERISTICS
VCC1 and VCC2 at 3.3V ± 5%, TA = –40°C to 125°C for ISO742xM, TA = –40°C to 105°C for ISO742x
PARAMETER
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(pp)
Part-to-part skew time
tsk(o)
Channel-to-channel output skew time
tr
Output signal rise time
tf
Output signal fall time
tfs
Fail-safe output delay time from input power loss
(1)
TEST CONDITIONS
MIN
See Figure 1.
See Figure 1.
See Figure 2.
TYP
MAX
12
20
UNIT
ns
1
5
ns
6
ns
5.5
ns
2
ns
2
ns
6
ms
Also known as pulse skew.
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Isolation Barrier
PARAMETER MEASUREMENT INFORMATION
IN
Input
Generator
(1)
50 W
VI
VCC1
VI
OUT
1.4 V
1.4 V
0V
VO
CL
tPLH
(2)
tPHL
90%
10%
VCC/2
VO
VCC/2
VOH
VOL
tr
tf
S0412-01
(1)
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50 kHz, 50% duty cycle,
tr ≤ 3 ns, tf ≤ 3 ns, ZO = 50 Ω. At the input, a 50-Ω resistor is required to terminate the Input Generator signal. It is not
needed in an actual application.
(2)
CL = 15 pF ± 20% includes instrumentation and fixture capacitance.
Figure 1. Switching Characteristic Test Circuit and Voltage Waveforms
VCC1
0 V IN
or
VCC1
Isolation Barrier
VI
VCC1
VI
OUT
2.7 V
0V
VO
tfs
VOH
(1)
CL
50%
VO
VOL
(1)
CL = 15 pF ± 20% includes instrumentation and fixture capacitance.
Figure 2. Fail-Safe Output Delay-Time Test Circuit and Voltage Waveforms
S1
IN
C = 0.1 mF ±1%
VCC2
GND1
C = 0.1 mF ±1%
Pass-fail criteria –
output must remain
stable.
Isolation Barrier
VCC1
OUT
+
VOH or VOL
GND2
(1)
–
+ VCM –
S0414-01
(1)
CL = 15 pF ±20% includes instrumentation and fixture capacitance.
Figure 3. Common-Mode Transient Immunity Test Circuit
8
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DEVICE INFORMATION
PACKAGE CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
L(I01)
Minimum air gap (clearance)
Shortest terminal-to-terminal distance through air
4.8
mm
L(I02)
Minimum external tracking
(creepage)
Shortest terminal-to-terminal distance across the
package surface
4.3
mm
CTI
Tracking resistance (comparative
tracking index)
DIN IEC 60112 / VDE 0303 Part 1
>175
V
Minimum internal gap (internal
clearance)
Distance through the insulation
0.014
mm
RIO
Isolation resistance, input to
output (1)
CIO
Barrier capacitance, input to
output (1)
CI
Input capacitance (2)
(1)
(2)
>1012
Ω
11
Ω
VIO = 0.4 sin (2pft), f = 1 MHz
1
pF
VI = VCC/2 + 0.4 sin (2pft), f = 1 MHz, VCC = 5 V
1
pF
VIO = 500 V, TA < 100°C
VIO = 500 V, 100°C ≤ TA ≤ max
>10
All pins on each side of the barrier tied together creating a two-terminal device.
Measured from input pin to ground.
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed-circuit board do not reduce this distance.
Creepage and clearance on a printed-circuit board become equal according to the
measurement techniques shown in the Isolation Glossary. Techniques such as inserting
grooves and/or ribs on a printed circuit board are used to help increase these
specifications.
INSULATION CHARACTERISTICS (3)
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIORM
Maximum working insulation voltage
VPR
Input-to-output test voltage
VIOTM
Transient overvoltage
VISO
Isolation voltage per UL
RS
Insulation resistance
t = 1 s (100% production), partial discharge 5 pC
t = 60 s (qualification)
t = 1 s (100% production)
UNIT
560
Vpeak
1050
Vpeak
4000
Vpeak
t = 60 s (qualification)
2500
t = 1 s (100% production)
3000
VIO = 500 V at TS
>109
Pollution degree
(3)
SPECIFICATION
Vrms
Ω
2
Climatic Classification 40/125/21
Table 2. IEC 60664-1 RATINGS TABLE
PARAMETER
Basic isolation group
Installation classification
TEST CONDITIONS
SPECIFICATION
Material group
III-a
Rated mains voltage ≤ 150 Vrms
I–IV
Rated mains voltage ≤ 300 Vrms
I–III
Rated mains voltage ≤ 400 Vrms
I–II
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REGULATORY INFORMATION
VDE
CSA
UL
Certified according to IEC
60747-5-2
Approved under CSA Component
Acceptance Notice
Recognized under 1577 Component Recognition
Program (1)
File number: pending (40016131)
File number: pending (1698195)
File number: pending (E181974)
(1)
Production tested ≥ 3000 Vrms for 1 second in accordance with UL 1577.
LIFE EXPECTANCY vs WORKING VOLTAGE
Life Expectancy – Years
100
VIORM at 560 V
28 Years
10
0
120
250
500
750
880
1000
VIORM – Working Voltage – V
G001
Figure 4. Life Expectancy vs Working Voltage
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of
the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat
the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER
TEST CONDITIONS
IS
Safety input, output, or supply
current
TS
Maximum case temperature
MIN
TYP
MAX
qJA = 212°C/W, VI = 5.25 V, TJ = 150°C, TA = 25°C
112
qJA = 212°C/W, VI = 3.45 V, TJ = 150°C, TA = 25°C
171
150
UNIT
mA
°C
The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum
Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed in the JESD51-3, Low-Effective-Thermal-Conductivity
Test Board for Leaded Surface-Mount Packages and is conservative. The power is the recommended maximum
input voltage times the current. The junction temperature is then the ambient temperature plus the power times
the junction-to-air thermal resistance.
10
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PACKAGE THERMAL CHARACTERISTICS
(over recommended operating conditions unless otherwise noted)
PARAMETER
TEST CONDITIONS
Junction-to-air thermal resistance
qJB
Junction-to-board thermal resistance
qJC
Junction-to-case thermal resistance
PD
(1)
212
122
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,
Input a 150-Mbps 50% duty-cycle square wave
Device power dissipation
TYP
High-K thermal resistance (1)
Low-K thermal resistance
qJA
MIN
(1)
MAX
UNIT
°C/W
37
°C/W
69.1
°C/W
390
mW
Tested in accordance with the low-K or high-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages
Safety Limiting Current − mA
180
VCC1, VCC2 at 3.45 V
160
140
120
100
VCC1, VCC2 at 5.25 V
80
60
40
20
0
0
50
100
150
200
Case Temperature − °C
G002
Figure 5. qJC Thermal Derating Curve per IEC 60747-5-2
VCC1
0.1mF
OUTPUT
INPUT
GND1
VCC2
2 mm
2 mm
max.
max.
ISO7421
from
from
VCC1
VCC2
8
1
OUTA
INA
7
2
INB
OUTB
6
3
5
4
0.1mF
INPUT
OUTPUT
GND2
S0417-01
Figure 6. Typical ISO7421 Application Circuit
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ISO7420, ISO7420M
ISO7421, ISO7421M
SLLS984D – JUNE 2009 – REVISED JULY 2010
www.ti.com
ISO742x and ISO742xM Input
VCC1
VCC1
VCC1
Output
VCC2
1 MW
8W
500 W
IN
OUT
13 W
Figure 7. Device I/O Schematics
12
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Product Folder Link(s): ISO7420 ISO7420M ISO7421 ISO7421M
ISO7420, ISO7420M
ISO7421, ISO7421M
www.ti.com
SLLS984D – JUNE 2009 – REVISED JULY 2010
TYPICAL CHARACTERISTICS
PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
INPUT VOLTAGE SWITCHING THRESHOLD
vs
FREE-AIR TEMPERATURE
1.6
12
Input Voltage Switching Threshold − V
tpd − Propagation Delay Time − ns
14
VCC1, VCC2 at 3.3 V
10
8
VCC1, VCC2 at 5 V
6
4
2
0
−55
−35
−15
5
25
45
65
85
105
TA − Free-Air Temperature − °C
1.4
1.2
1.1
VIT−, 5 V
1.0
VIT−, 3.3 V
0.9
0.8
−55
125
−35
−15
5
25
45
65
85
105
125
TA − Free-Air Temperature − °C
G004
G005
Figure 8.
Figure 9.
FAIL-SAFE VOLTAGE THRESHOLD
vs
FREE-AIR TEMPERATURE
HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
IOH − High-Level Output Current − mA
Fail-Safe Voltage Threshold − V
VIT+, 3.3 V
1.3
2.62
2.61
FS+
2.60
2.59
2.58
2.57
2.56
2.55
FS−
2.54
2.53
2.52
−55
VIT+, 5 V
1.5
TA = 25°C
−10
−20
−30
−40
VCC1, VCC2 at 3.3 V
−50
−60
−70
VCC1, VCC2 at 5 V
−80
−90
−35
−15
5
25
45
65
85
105
TA − Free-Air Temperature − °C
125
0
1
2
3
4
5
VOH − High-Level Output Voltage − V
G006
Figure 10.
6
G007
Figure 11.
LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
IOL − Low-Level Output Current − mA
80
TA = 25°C
70
60
VCC1, VCC2 at 5 V
50
40
VCC1, VCC2 at 3.3 V
30
20
10
0
0
1
2
3
4
VOL − Low-Level Output Voltage − V
5
6
G008
Figure 12.
Copyright © 2009–2010, Texas Instruments Incorporated
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Product Folder Link(s): ISO7420 ISO7420M ISO7421 ISO7421M
13
ISO7420, ISO7420M
ISO7421, ISO7421M
SLLS984D – JUNE 2009 – REVISED JULY 2010
www.ti.com
REVISION HISTORY
Changes from Original (June 2009) to Revision A
Page
•
Added devices ISO7420 and ISO7420M to the data sheet .................................................................................................. 1
•
Added the ICC EQUATIONS section ................................................................................................................................... 11
Changes from Revision A (December 2009) to Revision B
•
Page
Switching Characteristics Table, Added Note (2) - Typical specifications are measured at ideal conditions of 25°C.
Max or Min specifications are measured at worst case conditions for VCC and temperature. .............................................. 4
Changes from Revision B (February 2010) to Revision C
Page
•
Added devices ISO7420F and ISO7420FM to the data sheet ............................................................................................. 1
•
Added The suffix M indicates wide temperature range (–55°C to 125°C) and the suffix F indicates output-low option
in fail-safe condition. All other devices without the F suffix default to output-high in fail-safe state. .................................... 1
•
Changed the Function Table Output values for PU (Open) From: H To: H/L ...................................................................... 2
•
Changed the Function Table Output values for PU (X) From: H To: H/L ............................................................................. 2
•
Changed the Function Table Output values for PU (X) From: H/L To: H ............................................................................. 2
•
Added Note (2) in the Function Table ................................................................................................................................... 2
•
Added ISO7420F and ISO7420FM tothe Available Options Table ...................................................................................... 2
•
Changed value from a max of 4 mA to a min of -4 mA ........................................................................................................ 3
•
Changed value from a min of -4 mA to a max of 4 mA ........................................................................................................ 3
•
Changed Electrical Characteristics Conditions ..................................................................................................................... 4
•
Deleted Ci from the ELECTRICAL CHARACTERISTICS ..................................................................................................... 4
•
Added (All inputs switching with square wave clock signal for dynamic ICC measurement) ............................................... 4
•
Changed SWITCHING CHARACTERISTICS conditions ..................................................................................................... 4
•
Changed PWD parameter from duration to width ................................................................................................................. 4
•
Changed ELECTRICAL CHARACTERISTICS conditions .................................................................................................... 5
•
Added High-level output voltage ISO7420 / 7421 (3.3-V side) test condition ...................................................................... 5
•
Changed High-level output voltage min value ...................................................................................................................... 5
•
Deleted CI specification ........................................................................................................................................................ 5
•
Added (All inputs switching with square wave clock signal for dynamic ICC measurement) ............................................... 5
•
Changed SWITCHING CHARACTERISTICS conditions ..................................................................................................... 5
•
Changed Pulse duration distortion to Pulse width distortion ................................................................................................ 5
•
Changed ELECTRICAL CHARACTERISTICS conditions .................................................................................................... 6
•
Added High-level output voltage ISO7420 / 7421 (5-V side) test condition ......................................................................... 6
•
Changed High-level output voltage min value ...................................................................................................................... 6
•
Deleted CI specification ........................................................................................................................................................ 6
•
Added (All inputs switching with square wave clock signal for dynamic ICC measurement) ............................................... 6
•
Changed SWITCHING CHARACTERISTICS conditions ..................................................................................................... 6
•
Changed Pulse duration distortion to Pulse width distortion ................................................................................................ 6
•
Changed ELECTRICAL CHARACTERISTICS conditions .................................................................................................... 7
•
Deleted CI specification ........................................................................................................................................................ 7
•
Added (All inputs switching with square wave clock signal for dynamic ICC measurement) ............................................... 7
•
Changed SWITCHING CHARACTERISTICS conditions ..................................................................................................... 7
•
Changed Pulse duration distortion to Pulse width distortion ................................................................................................ 7
•
Changed Note 1 Figure 1 ..................................................................................................................................................... 8
14
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ISO7420, ISO7420M
ISO7421, ISO7421M
www.ti.com
SLLS984D – JUNE 2009 – REVISED JULY 2010
•
Changed Figure 2 ................................................................................................................................................................. 8
•
Added input to output and note 1 to Isolation resistance, input to output ............................................................................ 9
•
Changed the Isolation resistance test conditions ................................................................................................................. 9
•
Changed the Isolation resistance test conditions ................................................................................................................. 9
•
Added note 1 to Barrier capacitance, input to output ........................................................................................................... 9
•
Added Input capacitance ...................................................................................................................................................... 9
•
Changed TJ = 170°C to TJ = 150°C .................................................................................................................................... 10
•
Changed From: 124mA To: 107mA .................................................................................................................................... 10
•
Changed TJ = 170°C to TJ = 150°C .................................................................................................................................... 10
•
Changed From: 190mA To: 164mA .................................................................................................................................... 10
•
Changed Figure 5 ............................................................................................................................................................... 11
•
Changed Figure 7 ............................................................................................................................................................... 12
Changes from Revision C (March 2010) to Revision D
Page
•
Deleted devices ISO7420F and ISO7420FM from the data sheet ....................................................................................... 1
•
Updated the Features List .................................................................................................................................................... 1
•
Updated the device Description. Add paragraph - Note: The ISO7420 and ISO7421 ......................................................... 1
•
Changed the Function Table Output values for PU (Open) From: H/L To: H ...................................................................... 2
•
Changed ISO7420M TA temp From: -55 to 125 To: 40 to 125 in the Available Options Table ............................................ 2
•
Added Tstg to the Absolute Maximum Ratings Table .......................................................................................................... 3
•
Updated the Recommended Opetating Conditions Table .................................................................................................... 3
•
Updates throughout the Electrical Characteristics and Switching Characteristics tables ..................................................... 4
•
Updated the Supply Current test conditions ......................................................................................................................... 4
•
Changed Figure 2 ................................................................................................................................................................. 8
•
Changed Note 1 in Figure 3 ................................................................................................................................................. 8
•
Changed Minimum internal gap MIN value From: 0.008 To: 0.014mm ................................................................................ 9
•
Changed the Barrier capacitance, input to output test conditions ........................................................................................ 9
•
Changed the Input capacitance test conditions .................................................................................................................... 9
•
Changed the VIORM, VPR, and VIOTM unit values From: V To: Vpeak .................................................................................... 9
•
Changed VI From: 5.5V To: 5.25V ...................................................................................................................................... 10
•
Changed From: 107mA To: 112mA .................................................................................................................................... 10
•
Changed VI From: 3.6V To: 3.45V ...................................................................................................................................... 10
•
Changed From: 164mA To: 171mA .................................................................................................................................... 10
•
Changed Figure 5 ............................................................................................................................................................... 11
•
Deleted the ICC EQUATIONS section ................................................................................................................................. 11
•
Changed Figure 7 ............................................................................................................................................................... 12
•
Deleted the SUPPLY CURRENT vs SIGNAL RATE (ALL CHANNELS) graphs and the EYE DIAGRAM plots ............... 13
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15
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ISO7420D
ACTIVE
SOIC
D
8
ISO7420DR
ACTIVE
SOIC
D
8
ISO7420MD
ACTIVE
SOIC
D
8
ISO7420MDR
ACTIVE
SOIC
D
8
ISO7421D
ACTIVE
SOIC
D
8
ISO7421DR
ACTIVE
SOIC
D
8
ISO7421MD
PREVIEW
SOIC
D
8
75
TBD
Call TI
Call TI
ISO7421MDR
PREVIEW
SOIC
D
8
2500
TBD
Call TI
Call TI
75
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
75
75
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ISO7420DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
ISO7420MDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
ISO7421DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ISO7420DR
SOIC
D
8
2500
358.0
335.0
35.0
ISO7420MDR
SOIC
D
8
2500
358.0
335.0
35.0
ISO7421DR
SOIC
D
8
2500
358.0
335.0
35.0
Pack Materials-Page 2
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