ISM98 Series 5 mm x 7 mm Ceramic Package SMD Oscillator, LVPECL / LVDS Product Features: Applications: Low Noise Surface Mount Package Reflow Compatible Compatible with Leadfree Processing Test Equipment Server & Storage Sonet /SDH Frequency 1 MHz to 180.000 MHz Output Level LVDS LVPECL Vod = 393 mV Typ., 475 mV Max. ‘0’ = Vcc - 1.63 V Max. ‘1’ = Vcc - 1.02 V Min. Duty Cycle Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 0.6 nS Max. Output Load LVDS LVPECL 100 Ω Differential 50 Ω to Vcc - 2.0 VDC Frequency Stability See Frequency Stability Table in Part Number Guide (Includes room temperature tolerance and stability over operating temperature) Start-up Time 10 mS Max. Enable / Disable Time 100 nS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % Current LVDS = 90 mA Max. *** Recommended Pad Layout LVPECL = 130 mA Max. *** Jitter <1.0 pS RMS* Operating See Operating Temperature Table in Part Number Guide Storage -55° C to +125° C Part Number Guide Package ISM98 - Input Voltage Pin Connection 1 Enable 2 N.C. 3 GND 4 Output 5 Comp. Output 6 Vcc Dimension Units: mm Sample Part Number: Operating Temperature ISM98 - 3159BH - 125.000 Symmetry (Duty Cycle) Output Stability (in ppm) Enable / Disable Frequency **A = ±25 H = Enable - 125.000 MHz 3 = 3.3 V 1 = 0° C to +70° C 5 = 45 / 55 Max. 8 = LVDS 7 = 3.0 V 6 = -10° C to +70° C 6 = 40 / 60 Max. 9 = LVPECL 2 = 2.7 V 3 = -20° C to +70° C 6 = 2.5 V 4 = -30° C to +75° C B = ±50 C = ±100 2 = -40° C to +85° C NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. *Frequency related, for additional information contract your sales representative. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 10/10 Specifications subject to change without notice Page 1 ISM98 Series 5 mm x 7 mm Ceramic Package SMD Oscillator, LVPECL / LVDS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 10/10 Specifications subject to change without notice Page 2