1/4 STRUCTURE PRODUCT NAME FUNCTION FEATURE Silicon monolithic integrated circuit BU9798GUW LCD control driver for segment type LCD display ○ LCD drive output : Common output : 4, Segment output : 49 ○ built-in Display data RAM (DDRAM) : RAM: 49*4 =196 bit ○ 3-wire Serial interface(SD, SCL, CSB ) ○ built-in Oscillator circuit ○ built-in LCD Voltage Generator circuit: support 1/3 Bias, 1/3 or 1/4 Duty, 1/1 Bias, 1/1Duty (Static Driving) Built-in Buffer AMP, Built-in regulator (3.2, 3.3, 3.4, 4.4, 4.5, 4.6, 5.0V) ○ Support Split Supply for Logic (VDD) and LCD (VLCD) ○ Support two output mode SEG/GPO (SEG15~45) ○ built-in LED driver ○ Support two output mode SEG/LED driver (SEG46~48) ○ Support PWM source select, external clock or internal clock ( 12bit / 8bit mode selectable） ○ Low power consumption ○ Support standby mode ○ built-in Power-on Reset circuit ○ No external component ○ Support blink function （Blink frequency 1.6, 2.0, 2.6, 4.0 Hz selectable） ○ Operating power supply: 1.8~3.6V ○ LCD drive power supply voltage : 3.3~5.5V ○ Absolute maximum ratings (VSS = 0V) Parameter Symbol Rated values Unit Remarks Power supply voltage 1 Power supply voltage 2 Allowable loss Input voltage range Operational temperature range Storage temperature range Output current VDD -0.3 ~ +4.5 V Power supply VLCD -0.5 ~ +7.0 V LCD drive voltage Pd 0.8*1 W VIN -0.5 ~ VDD+0.5 V Topr -30 ~ +75 ℃ Tstg -55 ~ +125 ℃ Iout1 5 mA SEG ouput Iout2 5 mA COM ouput Iout3 10 mA GPO ouput Iout4 50 mA LED ouput *1 When use more than Ta=25 degree, subtract 8.0mW per degree. （using ROHM standard board） （board size：114.3mm×76.2mm×1.6mm material: FR4 board copper foil: land pattern only） ○ Recommend operating conditions (Ta=-30~＋75degree, VSS = 0V) Parameter Symbol MIN TYP MAX Unit Power supply voltage 1 VDD 1.8 - 3.6 V Power supply voltage 2 VLCD 3.3 - 5.5 V For LCD drive LED Power supply voltage VLED 1.0 - VLCD V LED drive voltage Output current Remarks Power supply Iout4 - - 25 mA At one LED port Iout4 - - 75 mA At all LED port ○ This product is not designed against radioactive ray. ● As for contents of mention of these materials. A service in the foreign exchange and foreign trade control law (Technology in the design, the manufacture and the use). Be careful of handling because it is likely to correspond. ● These goods are specific machines. Because the exclusive goods which are specially designed for the device are considered. Whether that machine, device corresponds to strategic goods to decide as the foreign exchange and foreign trade control law. You must have it judged. Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. REV. B 2/4 ○Block diagrams ○Outline drawing VSS2 COM0……CO M3 SEG0 ……………………………… SEG48 VLCD LCD voltage Generator common driver Segment driver Seg ment Segment driver/GPO driver/LED BU9798 Ref Voltage Circuit Vreg GPO/LED Contr ol ler LCD BIAS SELECTOR Lot No. common counter blink ti ming generator DDRAM GPO data latch PW M Generator VSS INHb Command register Data Decoder CLKIN OSCILLATOR Power On Reset seri al inter face Output Controller VDD IF FILTER VSS CSB SD SCL PWMOUT ○ Electrical Characteristics ( Ta=-30~75degree, VDD=1.8V~3.6V, VLCD=3.3V~5.5V, VSS=0 ; unless otherwise specified ) Limit TYP 0.2 Parameter Symbol “H” level input voltage “L” level input voltage Hysteresis width VIH VIL VH “H” level input current IIH1 - - “L” level input current IIL1 -5 - MIN 0.8VDD VSS - MAX VDD 0.2VDD - Unit Condition V V V SD, SCL, CSB, CLKIN, TEST1, INHb SD, SCL, CSB, CLKIN, TEST1, INHb SCL, INHb, VDD=3.3V, Ta=25degree 5 uA SD, SCL, CSB, CLKIN, INHb, VI=3.6V - uA SD, SCL, CSB, CLKIN, INHb, TEST1, VI=0V Iload=-50uA, VLCD=5.0V, SEG0~48, VOH1 VLCD-0.4 V In case, internal regulator do not use Iload=-50uA, VLCD=5.0V, COM0~3, “H” level output VOH2 VLCD-0.4 V IN case, internal regulator do not use voltage (＊1) (＊3) Iload=-1mA,VLCD=5.0V,SEG15~45(GPO mode) VOH3 VLCD-0.6 V In case, internal regulator do not use VOH4 VDD-0.6 V Iload=-1mA, VDD=3.3V, PWMOUT VOL1 0.4 V Iload= 50uA, VLCD=5.0V, SEG0~48 VOL2 0.4 V Iload= 50uA, VLCD=5.0V, COM0~3 “L” level output Iload=1mA, VLCD=5.0V, VDD=3.3V VOL3 0.5 V voltage (＊3) SEG15~45(GPO mode）, PWMOUT Iload=20mA, VLCD=5.0V VOL4 0.11 0.5 V SEG46~48（LED drive mode） IstVDD 3 10 uA Input terminal ALL’L’, Display off, Oscillation off IstVLCD 0.5 5 uA Input terminal ALL’L’, Display off, Oscillation off VDD=3.3V, Ta=25degree, 1/3bias, fFR=64Hz, IVDD1 8 15 uA PWM generate off, All output pin open VDD=3.3V, Ta=25degree, 1/3bias, fFR=64Hz, IVDD2 90 130 uA PWM Frequency=500Hz setting, output pin open VLCD=5.0V, Ta=25degree, 1/3bias、fFR=64Hz, Supply current (＊2) IVLCD1 10 15 uA internal regulator do not use, LED drive mode off, All output pin open VLCD=5.0V, Ta=25degree, 1/3bias, fFR=64Hz, IVLCD2 25 40 uA using internal regulator , LED drive mode off, All output pin open VLCD=5.0V, Ta=25degree, 1/3bias, IVLCD3 30 48 uA fFR=64Hz, using internal regulator, PWM Frequency=500Hz setting, output pin open *1 In case, internal regulator do not use. When you use internal regulator, please add load regulation specified at page3 *2 In case, power save mode 1 and frame inversion setting *3 Iload : In case, load current from only one port REV. B 3/4 ○Oscillation Frequency Characteristics ( Ta=-30~75degree, VDD=1.8V~3.6V, VLCD=3.3V~5.5V, VSS=0 ; unless otherwise specified ) Parameter Symbol Frame frequency 1 Frame frequency 2 Frame frequency 3 CLKIN input frequency fFR1 fFR2 fFR3 fCLK Limit TYP 64 64 2 MIN 57.6 51.2 45.0 - MAX 70.4 73.0 64 4 Unit Condition Hz Hz Hz MHz VDD=3.3V, Ta=25degree, fFR=64Hz setting VDD=2.5~3.6V fFR=64Hz setting VDD=1.8~2.5V fFR=64Hz setting ○ Load regulation ( Ta=-30~75degree, VDD=1.8V~3.6V, VLCD=3.3V~5.5V, VSS=0 ; unless otherwise specified ) Vreg1 Vreg2 MIN 4.25 4.38 Limit TYP 4.5 4.5 MAX 4.70 4.62 ⊿Vreg - - 0.3 Parameter Symbol Output voltage 1 Output voltage 2 Load Regulation (**) Unit Condition V V 4.5V setting (VLCD=5.5V, Ta=-30~75degree) 4.5V setting (VLCD=5.5V, Ta=25degree) V Iout = -300uA Caution : Please use regulator at “Regulator output voltage < VLCD – 0.5V” ** Internal regulator unit only. ○ MPU interface Characteristics ( Ta=-30~75degree, VDD=1.8V~3.6V, VLCD=3.3V~5.5V, VSS=0 ) Parameter Symbol Input rise time Input fall time SCL cycle time “H” SCL pulse width “L” SCL pulse width SD setup time SD hold time CSB setup time CSB hold time “H” CSB pulse width tr tf tSCYC tSHW tSLW tSDS tSDH tCSS tCSH tCHW Limit TYP - MIN 250 50 50 50 50 50 50 50 MAX 50 50 - Unit Condition ns ns ns ns ns ns ns ns ns ns ○ Terminal number/name A1 A2 A3 A4 CSB PWMOUT SEG48 SEG46 B1 B2 B3 B4 (NC) CLKIN VSS2 SEG44 C1 C2 C3 C4 VSS1 SDA SCL SEG45 D1 D2 D3 D4 VLCD VDD INHB SEG47 E1 E2 E3 E4 A5 A6 A7 A8 SEG43 SEG41 SEG37 SEG36 B5 B6 B7 B8 SEG40 SEG39 SEG35 SEG34 C5 C6 C7 C8 SEG42 SEG38 SEG33 SEG32 D5 D6 D7 D8 SEG31 SEG29 SEG28 SEG30 E5 E6 E7 E8 REV. B COM2 COM0 COM1 COM 3 SEG15 SEG26 SEG24 SEG27 F1 F2 F3 F4 SEG0 SEG1 SEG6 SEG10 G1 G2 G3 G4 SEG2 SEG3 SEG7 SEG8 H1 H2 H3 H4 SEG4 SEG5 SEG9 SEG11 F5 F6 F7 F8 SEG13 SEG22 SEG23 SEG25 G5 G6 G7 G8 SEG12 SEG17 SEG19 SEG21 H5 H6 H7 H8 SEG14 SEG16 SEG18 SEG20 4/4 Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, or the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) No Connecting input terminals In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable state brings the inside gate voltage of p-channel or n-channel transistor into active. As a result, battery current may increase. And unstable state can also causes unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or GND line. (13) Rush current When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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