Tooling hole (X2) BGA54B 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout Y 6.40mm [0.252"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 Top View of Land Pattern Scale: 2:1 0.20mm [0.008"] dia. 2 Side View (reference only) 1 2 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating. Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Pin Count 54 Array Size 6x9 Pitch 0.8mm Adapter Perimeter (XxY) 7.94mm [0.313"] x 7.91mm [0.312"] Description: Land Socket. 54 position 0.8mm pitch BGA SMT land pattern to male pins. LS-BGA54B-61 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: N/A Rev: A Drawing: H .Hansen Date: 11/4/05 File: LS-BGA54B-61 Dwg Modified: Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.