MC10174 Dual 4 to 1 Multiplexer The MC10174 is a high speed dual channel multiplexer with output enable capability. The select inputs determine one of four active data inputs for each multiplexer. An output enable forces both outputs low when in the high state. • PD = 305 mW typ/pkg (No Load) • tpd = 3.5 ns typ (Dta to output) • tr, tf = 2.0 ns typ (20%–80%) http://onsemi.com MARKING DIAGRAMS 16 LOGIC DIAGRAM CDIP–16 L SUFFIX CASE 620 D003 MC10174L AWLYYWW 1 16 D015 PDIP–16 P SUFFIX CASE 648 2 Q0 D024 MC10174P AWLYYWW D036 1 PLCC–20 FN SUFFIX CASE 775 A 7 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 B9 A WL YY WW ENABLE 14 D1013 1 10174 AWLYYWW = Assembly Location = Wafer Lot = Year = Work Week DIP PIN ASSIGNMENT D1111 15 Q1 D1212 D1310 TRUTH TABLE ENABLE ADDRESS INPUTS OUTPUTS E B A Q0 Q1 H X X L L L L L D00 D10 L L H D01 D11 L H L D02 D12 L H H D03 D13 VCC1 1 16 VCC2 Q0 2 15 Q1 DO0 3 14 ENABLE DO2 4 13 D10 DO1 5 12 D12 DO3 6 11 D11 A 7 10 D13 VEE 8 9 B Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). ORDERING INFORMATION Device Semiconductor Components Industries, LLC, 2002 January, 2002 – Rev. 7 1 Package Shipping MC10174L CDIP–16 25 Units / Rail MC10174P PDIP–16 25 Units / Rail MC10174FN PLCC–20 46 Units / Rail Publication Order Number: MC10174/D MC10174 ELECTRICAL CHARACTERISTICS Test Limits Characteristic Symbol Pin Under Test Power Supply Drain Current IE 8 80 IinH 4 14 350 525 IinL 4 0.5 VOH 15 –1.060 –0.890 –0.960 –0.810 –0.890 –0.700 Vdc –1.675 –1.850 –1.650 –1.825 –1.615 Vdc Input Current –30°C Min +25°C Max Min +85°C Typ Max Min 58 73 80 Max 220 330 220 330 0.5 Output Voltage Logic 1 Output Voltage Logic 0 VOL 15 –1.890 Threshold Voltage Logic 1 VOHA 15 –1.080 Threshold Voltage Logic 0 VOLA 15 t13+15+ t13–15– t7+15– t7–15+ t14+15– t14–15+ 15 15 15 15 15 15 1.4 1.4 1.9 1.9 1.0 1.0 5.0 5.0 6.6 6.6 3.3 3.3 1.5 1.5 2.0 2.0 1.0 1.0 3.5 3.5 5.0 5.0 2.0 2.0 4.7 4.7 6.2 6.2 3.1 3.1 1.4 1.4 2.1 2.1 0.9 0.9 5.0 5.0 6.6 6.6 3.4 3.4 –0.910 –1.655 Vdc –1.630 –1.595 Switching Times (50Ω Load) Propagation Delay µAdc µAdc 0.3 –0.980 Unit mAdc Vdc ns Rise Time (20 to 80%) t+ 15 1.0 3.4 1.1 2.0 3.3 1.1 3.6 Fall Time (20 to 80%) t– 15 1.0 3.4 1.1 2.0 3.3 1.1 3.6 ELECTRICAL CHARACTERISTICS (continued) Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures rocedures are shown for only one gate. The other gates are tested in the same manner. Characteristic Power Supply Drain Current Input Current TEST VOLTAGE VALUES (Volts) @ Test Temperature VIHmax VILmin VIHAmin VILAmax VEE –30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2 Symbol Pin Under Test IE 8 IinH 4 14 IinL 4 TEST VOLTAGE APPLIED TO PINS LISTED BELOW VIHmax VILmin VIHAmin VILAmax 4 14 4 VEE (VCC) Gnd 8 1, 16 8 8 1, 16 1, 16 8 1, 16 Output Voltage Logic 1 VOH 15 13 8 1, 16 Output Voltage Logic 0 VOL 15 14 8 1, 16 Threshold Voltage Logic 1 VOHA 15 8 1, 16 Logic 0 VOLA 15 Threshold Voltage Switching Times (50Ω Load) Propagation Delay 13 8 1, 16 +1.11V Pulse In 14 Pulse Out –3.2 V +2.0 V 15 15 15 15 15 15 8 8 8 8 8 8 1, 16 1, 16 1, 16 1, 16 1, 16 1, 16 t13+15+ t13–15– t7+15– t7–15+ t14+15– t14–15+ 15 15 15 15 15 15 11 11 13 13 13 13 7 7 14 14 Rise Time (20 to 80%) t+ 15 13 14 15 8 1, 16 Fall Time (20 to 80%) t– 15 13 14 15 8 1, 16 http://onsemi.com 2 MC10174 PACKAGE DIMENSIONS PLCC–20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) B Y BRK –N– M T L-M 0.007 (0.180) U M N S T L-M S G1 0.010 (0.250) S N S D –L– –M– Z W 20 D 1 X V S T L-M S N S VIEW D–D A 0.007 (0.180) M T L-M S N S R 0.007 (0.180) M T L-M S N S Z 0.007 (0.180) H M T L-M S N S K1 K C E F 0.004 (0.100) G J –T– VIEW S G1 0.010 (0.250) S T L-M S N S 0.007 (0.180) M T L-M S VIEW S SEATING PLANE NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --0.025 --0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --0.020 2 10 0.310 0.330 0.040 --- MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --0.64 --8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --0.50 2 10 7.88 8.38 1.02 --- N S MC10174 –A– 16 9 1 8 –B– CDIP–16 L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE T C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M S PDIP–16 P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R –A– 16 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M S T A M INCHES MIN MAX 0.750 0.785 0.240 0.295 --0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0 15 0.51 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0 10 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0 10 0.51 1.01 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: [email protected] ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800–282–9855 Toll Free USA/Canada http://onsemi.com 4 MC10174/D