NCP59302, NCV59302 3.0 A, Very Low-Dropout (VLDO) Fast Transient Response Regulator series The NCP59302 is a high precision, very low dropout (VLDO), low ground current positive voltage regulator that is capable of providing an output current in excess of 3.0 A with a typical dropout voltage lower than 300 mV at 3.0 A load current. The device is stable with ceramic output capacitors. The device can withstand up to 18 V max input voltage. Internal protection features consist of output current limiting, built−in thermal shutdown and reverse output current protection. Logic level enable pin is available. The NCP59302 is an adjustable voltage device and is available in D2PAK−5 package. http://onsemi.com D2PAK CASE 936A MARKING DIAGRAMS Features Output Current in Excess of 3.0 A 300 mV Typical Dropout Voltage at 3.0 A Adjustable Output Voltage Range from 1.24 V to 13 V Low Ground Current Fast Transient Response Stable with Ceramic Output Capacitor Logic Compatible Enable Pin Current Limit, Reverse Current and Thermal Shutdown Protection Operation up to 13.5 V Input Voltage NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These are Pb−Free Devices Applications Consumer and Industrial Equipment Point of Regulation Servers and Networking Equipment FPGA, DSP and Logic Power supplies Switching Power Supply Post Regulation Battery Chargers Functional Replacement for Industry Standard MIC29300, MIC39300, MIC37300 Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 2 1 TAB y 59302 AWLYWWG 1 EN VIN GND VOUT ADJ y A WL Y WW G = P (NCP), V (NCV) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Publication Order Number: NCP59302/D NCP59302, NCV59302 TYPICAL APPLICATIONS NCP59302 VIN + CIN 1.3 V VIN VOUT EN ADJ GND R1 R2 + COUT 47 mF, Ceramic Figure 1. Adjustable Regulator PIN FUNCTION DESCRIPTION Pin Number Pin Name Pin Function 1 EN Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low = shutdown. 2 VIN Input voltage which supplies both the internal circuitry and the current to the output load 3 GND Ground TAB TAB TAB is connected to ground. 4 VOUT 5 ADJ Linear Regulator Output. Adjustable Regulator Feedback Input. Connect to output voltage resistor divider central node. ABSOLUTE MAXIMUM RATINGS Symbol Rating Value Unit VIN Supply Voltage 0 to 18 V VEN Enable Input Voltage 0 to 18 V VOUT – VIN Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1) 0 to 6.5 V PD Power Dissipation (Notes 2 and 3) Internally Limited TJ Junction Temperature –40 v TJ v +125 C TS Storage Temperature –65 v TJ v +150 C 2000 200 V ESD Rating (Notes 4 and 5) Human Body Model Machine Model Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: All voltages are referenced to GND pin unless otherwise noted. 1. The ENABLE pin input voltage must be 0.8 V or VIN must be connected to ground potential. 2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout. 3. This protection is not guaranteed outside the Recommended Operating Conditions. 4. Devices are ESD sensitive. Handling precautions recommended.. 5. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C) ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C) This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78. RECOMMENDED OPERATING CONDITIONS (Note 6) Symbol Rating Value Unit 2.24 to 13.5 V VIN Supply Voltage VEN Enable Input Voltage 0 to 13.5 V TJ Junction Temperature –40 v TJ v +125 C 6. The device is not guaranteed to function outside it’s Recommended operating conditions. http://onsemi.com 2 NCP59302, NCV59302 ELECTRICAL CHARACTERISTICS TJ = 25C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40C < TJ < +125C, unless noted. Parameter Output Voltage Accuracy Conditions Min Typ Max Unit IL = 10 mA −1 +1 % 10 mA < IOUT < 3 A , VOUT nominal + 1 v VIN v 13.5 V −2 +2 % 0.5 % Output Voltage Line Regulation VIN = VOUT nominal + 1.0 V to 13.5 V; IL = 10 mA 0.02 Output Voltage Load Regulation IL = 10 mA to 3 A 0.2 1 % VIN – VOUT Dropout Voltage (Note 7) IL = 1.5 A 175 350 mV IL = 3 A 300 500 mV Ground Pin Current (Note 8) IL = 3 A 60 90 120 mA Ground Pin Current in Shutdown VEN v 0.5 V 1.0 5 mA Overload Protection Current Limit VOUT = 0 V (Note 9) 3.5 5 A Start−up Time VEN = VIN, VOUT nominal = 2.5 V, IOUT = 10 mA, COUT = 47 mF 100 500 ms ENABLE INPUT Enable Input Signal Levels Regulator enable V 1.8 Regulator shutdown Enable pin Input Current VEN v 0.8 V (Regulator shutdown) 6.5 V > VEN w 1.8 V (Regulator enable) Reference Voltage Adjust Pin Bias Current 0.8 V 2 4 mA 1 15 30 40 mA 1.228 1.215 1.240 1.252 1.265 V 100 200 350 nA 7. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1 V. For output voltages below 1.74 V, dropout voltage specification does not apply due to a minimum input operating voltage of 2.24 V. 8. IIN = IGND + IOUT. 9. Device Power−on or Enable Start−up with output shorted to GND. Package Conditions / PCB Footprint D2PAK–5, Junction−to−Case D2PAK–5, Junction−to−Air Thermal Resistance RqJC = 2.1C/W PCB with 100 mm2 2.0 oz Copper Heat Spreading Area http://onsemi.com 3 RqJA = 52C/W NCP59302, NCV59302 TYPICAL CHARACTERISTICS TJ = 25C if not otherwise noted 100 100 90 90 80 80 70 COUT = 100 mF Ceramic 60 PSRR (dB) PSRR (dB) 70 50 40 COUT = 47 mF Ceramic 30 50 40 COUT = 47 mF Ceramic 30 20 VIN = 3.5 V 10 VOUT = 2.5 V, IOUT = 3 A, CIN = 0 0 10 100 1000 10k FREQUENCY (Hz) COUT = 100 mF Ceramic 60 20 100k VIN = 3.5 V 10 VOUT = 2.5 V, IOUT = 1 A, CIN = 0 0 10 100 1000 10k FREQUENCY (Hz) 1M Figure 2. Power Supply Rejection Ratio 450 VOUTnom = 2.5 V 450 DROPOUT (mV) DROPOUT (mV) 350 350 300 250 200 150 300 250 200 150 100 100 50 50 0 0.0 0.5 1.0 1.5 2.0 2.5 0 −50 3.0 −30 −10 10 30 50 70 90 110 OUTPUT CURRENT (A) TEMPERATURE (C) Figure 4. Dropout Voltage vs. Output Current Figure 5. Dropout Voltage vs. Temperature 130 3.0 1.4 10 mA 2.5 1A OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) VOUTnom = 2.5 V IOUT = 3 A 400 400 3A 1.0 0.8 0.6 2A 0.4 0.2 0 1 1M Figure 3. Power Supply Rejection Ratio 500 1.2 100k 1.2 1.4 1.6 SUPPLY VOLTAGE (V) 1.8 2.0 3A 1.5 1.0 2A 0.5 0.0 2 10 mA 1A 1 Figure 6. Dropout Characteristics (1.24 V) 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 SUPPLY VOLTAGE (V) 2.8 Figure 7. Dropout Characteristics (2.5 V) http://onsemi.com 4 3 NCP59302, NCV59302 TYPICAL CHARACTERISTICS TJ = 25C if not otherwise noted 1.4 VIN = 2.24 V VOUT = 1.24 V 50 1.2 GROUND CURRENT (mA) GROUND CURRENT (mA) 60 40 30 20 10 0 0 0.5 1 1.5 2 OUTPUT CURRENT (A) 2.5 1 0.8 0.6 0.4 0.2 0 3 10 mA 0 Figure 8. Ground Current vs. Output Current 0.5 1 1.5 2 2.5 3 3.5 SUPPLY VOLTAGE (V) 4 4.5 5 Figure 9. Ground Current vs. Supply Voltage (1.24 V) 2.5 120 60 3A 40 2A 20 1A 0 GROUND CURRENT (mA) GROUND CURRENT (mA) 80 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 2 1.5 1 0.5 0 5 1 1.5 2 2.5 3 3.5 4 4.5 5 Figure 10. Ground Current vs. Supply Voltage (1.24 V) Figure 11. Ground Current vs. Supply Voltage (2.5 V) 1.4 120 1.2 100 3A 80 60 40 2A 20 1A 0 0.5 SUPPLY VOLTAGE (V) 140 0 0 SUPPLY VOLTAGE (V) GROUND CURRENT (mA) GROUND CURRENT (mA) 10 mA 100 1 2 3 SUPPLY VOLTAGE (V) 4 1 0.8 0.6 0.4 0.2 0 −50 5 VIN = 3.5 V VOUT = 2.5 V, IOUT = 10 mA −30 −10 10 30 50 70 TEMPERATURE (C) Figure 12. Ground Current vs. Supply Voltage (2.5 V) 90 110 Figure 13. Ground Current vs. Temperature http://onsemi.com 5 130 NCP59302, NCV59302 TYPICAL CHARACTERISTICS 40 90 35 80 GROUND CURRENT (mA) GROUND CURRENT (mA) TJ = 25C if not otherwise noted 30 25 20 15 10 5 0 −50 VIN = 3.5 V VOUT = 2.5 V, IOUT = 1.5 A −30 −10 70 60 50 40 30 20 10 10 30 50 70 TEMPERATURE (C) 90 110 0 −50 130 Figure 14. Ground Current vs. Temperature VIN = 3.5 V VOUT = 2.5 V, IOUT = 3 A −30 −10 10 30 50 70 TEMPERATURE (C) 90 110 130 Figure 15. Ground Current vs. Temperature 2.6 22 ENABLE CURRENT (mA) OUTPUT VOLTAGE (V) 20 2.55 2.5 2.45 2.4 −50 VOUTNOM = 2.5 V IOUT = 10 mA −30 −10 10 18 VEN = 6.5 V 16 14 12 10 8 6 4 VEN = 1.8 V 2 30 50 70 90 110 0 −50 130 −30 −10 10 30 50 70 90 110 TEMPERATURE (C) TEMPERATURE (C) Figure 16. Output Voltage vs. Temperature Figure 17. Enable Pin Input Current vs. Temperature http://onsemi.com 6 130 NCP59302, NCV59302 FUNCTIONAL CHARACTERISTICS Figure 18. Load Transient Response Figure 19. Line Transient Response Figure 20. Enable Transient Response http://onsemi.com 7 NCP59302, NCV59302 APPLICATIONS INFORMATION Output Capacitor and Stability Adjustable Voltage Design The NCP59302 device requires an output capacitor for stable operation. The NCP59302 is designed to operate with ceramic output capacitors. The recommended output capacitance value is 47 mF or greater. Such capacitors help to improve transient response and noise reduction at high frequency. The NCP/NCV59302 Adjustable voltage Device Output voltage is set by the ratio of two external resistors as shown in Figure 21. The device maintains the voltage at the ADJ pin at 1.24 V referenced to ground. The current in R2 is then equal to 1.24 V / R2, and the current in R1 is the current in R2 plus the ADJ pin bias current. The ADJ pin bias current flows from VOUT through R1 into the ADJ pin. The output voltage can be calculated using the formula shown in Figure 21. Input Capacitor An input capacitor of 1.0 mF or greater is recommended when the device is more than 4 inches away from the bulk supply capacitance, or when the supply is a battery. Small, surface−mount chip capacitors can be used for the bypassing. The capacitor should be place within 1 inch of the device for optimal performance. Larger values will help to improve ripple rejection by bypassing the input of the regulator, further improving the integrity of the output voltage. NCP59302 VIN VIN VOUT VOUT + CIN R1 EN + COUT 47 mF, Ceramic ADJ GND R2 Minimum Load Current The NCP59302 regulator is specified between finite loads. A 10 mA minimum load current is necessary for proper operation. ǒ Ǔ R1 ) I ADJ @ R1 R2 Figure 21. Adjustable Voltage Operation V OUT + 1.24 V @ 1 ) Enable Input NCP59302 regulators also feature an enable input for on/off control of the device. It’s shutdown state draws “zero” current from input voltage supply (only microamperes of leakage). The enable input is TTL/CMOS compatible for simple logic interface, but can be connected up to VIN. Thermal Considerations The power handling capability of the device is limited by the maximum rated junction temperature (125C). The PD total power dissipated by the device has two components, Input to output voltage differential multiplied by Output current and Input voltage multiplied by GND pin current. Overcurrent and Reverse Output Current Protection The NCP59302 regulator is fully protected from damage due to output current overload conditions. When NCP59302 output is overloaded, Output Current limiting is provided. This limiting is linear; output current during overload conditions is constant. The device is also capable to withstand power−on or enable start−up with output shorted to ground for the full Recommended Operating Conditions range. These features are advantageous for powering FPGAs and other ICs having current consumption higher than nominal during their startup. Thermal shutdown disables the NCP59302 device when the die temperature exceeds the maximum safe operating temperature. When NCP59302 is disabled and (VOUT – VIN) voltage difference is less than 6.5 V in the application, the output structure of these regulators is able to withstand output voltage (backup battery as example) to be applied without reverse current flow. P D + ǒV IN * V OUTǓ @ I OUT ) V IN @ I GND (eq. 1) The GND pin current value can be found in Electrical Characteristics table and in Typical Characteristics graphs. The Junction temperature TJ is T J + T A ) P D @ R qJA (eq. 2) where TA is ambient temperature and RqJA is the Junction to Ambient Thermal Resistance of the NCP/NCV59302 device mounted on the specific PCB. To maximize efficiency of the application and minimize thermal power dissipation of the device it is convenient to use the Input to output voltage differential as low as possible. The static typical dropout characteristics for various output voltage and output current can be found in the Typical Characteristics graphs. http://onsemi.com 8 NCP59302, NCV59302 ORDERING INFORMATION Output Current Output Voltage Junction Temp. Range Package Shipping† NCP59302DSADJR4G 3.0 A ADJ −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCV59302DSADJR4G* 3.0 A ADJ −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 9 NCP59302, NCV59302 PACKAGE DIMENSIONS D2PAK 5 CASE 936A−02 ISSUE C −T− OPTIONAL CHAMFER A TERMINAL 6 E U S K B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. V H 1 2 3 4 5 M D 0.010 (0.254) M T INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN DIM A B C D E G H K L M N P R S U V P N G L R C SOLDERING FOOTPRINT 8.38 0.33 MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN 1.702 0.067 10.66 0.42 16.02 0.63 3.05 0.12 SCALE 3:1 1.016 0.04 mm Ǔ ǒinches 5−LEAD D2PAK ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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