ON BAS16XV2T1 Switching diode Datasheet

BAS16XV2T1
Switching Diode
•
•
•
•
High−Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Reflow Temperature: 260°C
Extremely Small SOD−523 Package
http://onsemi.com
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VR
75
V
Continuous Forward Current
IF
200
mA
Peak Forward Surge Current
IFM(surge)
500
mA
Repetitive Peak Forward Current
IFRM
500
mA
Non−Repetitive Peak Forward Current
(Square Wave, TJ = 25°C prior to surge)
t = 1 ms
t = 1 ms
t=1s
IFSM
Continuous Reverse Voltage
A
4.0
1.0
0.5
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings
are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
PD
200
mW
1.57
mW/°C
RθJA
635
°C/W
TJ, Tstg
−55 to 150
°C
Total Device Dissipation, (Note 1)
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
1
CATHODE
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 75 V)
(VR = 75 V, TJ = 150°C)
(VR = 25 V, TJ = 150°C)
Reverse Breakdown Voltage
(IBR = 100 mA)
IR
V(BR)
mA
−
−
−
1.0
50
30
75
−
−
−
−
−
715
855
1000
1250
1
SOD−523
CASE 502
PLASTIC
VF
Diode Capacitance (VR = 0, f = 1.0 MHz)
CD
−
2.0
pF
Forward Recovery Voltage
(IF = 10 mA, tr = 20 ns)
VFR
−
1.75
V
Reverse Recovery Time
(IF = IR = 10 mA, RL = 50 Ω)
trr
−
6.0
ns
Stored Charge
(IF = 10mA to VR = 5.0V, RL = 500 Ω)
QS
−
45
pC
September, 2010 − Rev. 5
1
A6 MG
G
2
A6 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
BAS16XV2T1
SOD−523
3000/Tape & Reel
BAS16XV2T1G
SOD−523
(Pb−Free)
3000/Tape & Reel
BAS16XV2T5G
SOD−523
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
V
Forward Voltage
(IF = 1.0 mA)
(IF = 10 mA)
(IF = 50 mA)
(IF = 150 mA)
© Semiconductor Components Industries, LLC, 2010
MARKING
DIAGRAM
2
1. FR-5 Minimum Pad.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
2
ANODE
mV
1
Publication Order Number:
BAS16XV2T1/D
BAS16XV2T1
820 Ω
+10 V
2.0 k
tr
0.1 μF
tp
IF
100 μH
IF
t
trr
10%
t
0.1 μF
90%
D.U.T.
50 Ω INPUT
SAMPLING
OSCILLOSCOPE
50 Ω OUTPUT
PULSE
GENERATOR
iR(REC) = 1.0 mA
IR
VR
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
INPUT SIGNAL
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
10
100
IR , REVERSE CURRENT (μA)
TA = 85°C
10
TA = -40°C
1.0
TA = 25°C
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
TA = 25°C
0.001
0.1
0.2
0.4
0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)
0
1.2
10
Figure 2. Forward Voltage
20
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Leakage Current
0.68
CD, DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
TA = 150°C
0.64
0.60
0.56
0.52
0
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
http://onsemi.com
2
8
40
50
BAS16XV2T1
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE C
−X−
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
−Y−
B
1
2
D 2 PL
0.08 (0.003)
M
DIM
A
B
C
D
J
K
S
T X Y
C
J
MILLIMETERS
MIN
NOM
MAX
1.10
1.20
1.30
0.70
0.80
0.90
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
0.15
0.20
0.25
1.50
1.60
1.70
MIN
0.043
0.028
0.020
0.010
0.0028
0.006
0.059
INCHES
NOM
MAX
0.047
0.051
0.032
0.035
0.024
0.028
0.012
0.014
0.0055 0.0079
0.008
0.010
0.063
0.067
−T−
K
SEATING
PLANE
S
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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BAS16XV2T1/D
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