TECHNICAL DATA IN74HCT74A Dual D Flip-Flop with Set and Reset High-Performance Silicon-Gate CMOS The IN74HCT74A is identical in pinout to the LS/ALS74. This device may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. This device consists of two D flip-flops with individual Set, Reset, and Clock inputs. Information at a D-input is transferred to the corresponding Q output on the next positive going edge of the clock input. Both Q and Q outputs are available from each flip-flop. The Set and Reset inputs are asynchronous. • TTL/NMOS Compatible Input Levels • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 4.5 to 5.5 V • Low Input Current: 1.0 µA ORDERING INFORMATION IN74HCT74AN Plastic IN74HCT74AD SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs PIN 14 =VCC PIN 7 = GND Outputs Set Reset Clock Data Q Q L H X X H L H L X X L H L L H X * H* X H H H H L H H L L H H H L X No Change H H H X No Change H H X No Change *Both outputs will remain high as long as Set and Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously. X = don’t care Rev. 00 IN74HCT74A MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Current, per Pin ±25 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond whitch damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) Min Max Unit 4.5 5.5 V 0 VCC V -55 +125 °C 0 500 ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74HCT74A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limit V 25 °C to -55°C ≤85 °C ≤125 °C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 µA 4.5 5.5 2.0 2.0 2.0 2.0 2.0 2.0 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA 4.5 5.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOH Minimum HighLevel Output Voltage VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA 4.5 5.5 4.4 5.4 4.4 5.4 4.4 5.4 V VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA 4.5 3.98 3.84 3.7 VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA 4.5 0.26 0.33 0.4 VOL Maximum LowLevel Output Voltage V IIN Maximum Input Leakage Current VIN=VCC or GND 5.5 ±0.1 ±1.0 ±1.0 µA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND IOUT=0µA 5.5 1.0 10 40 µA ∆ICC Additional Quiescent Supply Current VIN=2.4 V, Any One Input VIN=VCC or GND, Other Inputs ≥-55°C 25°C to 125°C mA 2.9 2.4 IOUT=0µA 5.5 Rev. 00 IN74HCT74A AC ELECTRICAL CHARACTERISTICS (VCC =5.0 V±10%,CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit Symbol Parameter 25 °C to -55°C ≤85°C ≤125°C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) 30 24 20 MHz tPLH, tPHL Maximum Propagation Delay, Clock to Q or Q (Figures 1 and 4) 24 30 36 ns tPLH, tPHL Maximum Propagation Delay, Set or Reset to Q or Q (Figures 2 and 4) 24 30 36 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 4) 15 19 22 ns Maximum Input Capacitance 10 10 10 pF CIN CPD Power Dissipation Capacitance (Per Enabled Output) Typical @25°C,VCC=5.0 V Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC 130 pF TIMING REQUIREMENTS (VCC =5.0 V±10%,CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit Symbol Parameter 25 °C to-55°C ≤85°C ≤125°C Unit tsu Minimum Setup Time, Data to Clock (Figure 3) 15 19 22 ns th Minimum Hold Time, Clock to Data (Figure 3) 3 3 3 ns trec Minimum Recovery Time, Set or Reset Inactive to Clock (Figure 2) 6 8 9 ns tw Minimum Pulse Width, Clock (Figure 1) 15 19 22 ns tw Minimum Pulse Width, Set or Reset (Figure 2) 15 19 22 ns tr, tf Maximum Input Rise and Fall Times (Figure 1) 500 500 500 ns Rev. 00 IN74HCT74A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Test Circuit EXPANDED LOGIC DIAGRAM Rev. 00 IN74HCT74A N SUFFIX PLASTIC DIP (MS - 001AA) A Dimension, mm 8 14 B 7 1 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE N G M K J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AB) Dimension, mm A 14 8 H B 1 G P 7 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 8.55 8.75 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.27 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 Rev. 00