GP2S24J0000F Series GP2S24J0000F Series Detecting Distance : 0.7mm Phototransistor Output, Compact Reflective Photointerrupter ■ Description ■ Agency approvals/Compliance GP2S24J0000F Series is a compact-package, phototransistor output, reflective photointerrupter, with emitter and detector facing the same direction in a molding that provides non-contact sensing. The compact package series is a result of unique technology, combing transfer and injection molding, that also blocks visible light to minimize false detection. 1. Compliant with RoHS directive ■ Applications 1. Detection of object presence or motion. 2. Example : printer, optical storage ■ Features 1. Reflective with Phototransistor Output 2. Highlights : • Compact Size 3. Key Parameters : • Optimal Sensing Distance : 0.7mm • Package : 4×3×1.7mm • Visible light cut resin package 4. Lead free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D3-A01801EN Date Oct. 3. 2005 © SHARP Corporation GP2S24J0000F Series ■ Internal Connection Diagram 4 3 1 2 3 4 1 2 (Unit : mm) (0.4) Detector center (0.2) Emitter center ■ Outline Dimensions Top view 4 Anode Emitter Collector Cathode 3 C0.7 1 2 1.75 ∗4±0.2 3+0.2 −0.1 0.75 1.7 4+0.2 −0.1 3.5+1 −0 4−(0.5) 4−0.15+0.2 −0.1 4−0.4+0.2 −0.1 (4) ±15° Date code mark θ θ : 0 to 20° • Tolerance : ±1.5mm • ( ) : Reference dimensions • The dimensions indicated by ∗ refer to those measured from the lead bending part. • The dimensions shown do not include burr. Burr's dimension : 0.15mm MAX. Product mass : approx. 0.04g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D3-A01801EN 2 GP2S24J0000F Series Date code (Symbol) January July February August March September April October May November June December Rank mark There is no rank indicator. Country of origin Japan Sheet No.: D3-A01801EN 3 ■ Absolute Maximum Ratings Parameter Forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature ∗1 Soldering temperature ∗ Symbol Rating IF 50 VR 6 P 75 VCEO 35 VECO 6 20 IC 75 PC 100 Ptot Topr −25 to +85 Tstg −40 to +100 Tsol 260 (Ta=25˚C) Unit mA V mW V V mA mW mW ˚C ˚C ˚C 1mm or more GP2S24J0000F Series Soldering area 1 For 5s or less ■ Electro-optical Characteristics Parameter Forward voltage Input Reverse current Output Collector dark current ∗2 Collector Current Transfer Rise time Response time characFall time teristics ∗3 Leak current ∗ ∗ Symbol VF IR ICEO IC tr tf ILEAK Condition IF=20mA VR=6V VCE=20V IF=4mA, VCE=2V VCE=2V, IC=100μA, RL=1kΩ, d=1mm IF=4mA, VCE=2V MIN. − − − 20 − − − TYP. 1.2 − 1 45 20 20 − (Ta=25˚C) MAX. Unit 1.4 V 10 μA 100 nA 120 μA 100 μs 100 100 nA 2 The condition and arrangement of the reflective object are shown below. The rank splitting of collector current (IC) shall be executed according to the table below. Rank Collector current, IC [μA] (IF=4mA, VCE=2V) A 20 to 42 Yellow B 34 to 71 Transparent C 58 to 120 Green Package sleeve color 3 Without reflective object. ● Test Conditon and Arrangement for Collector Current Al evaporation d=1mm glass plate Sheet No.: D3-A01801EN 4 GP2S24J0000F Series ■ Model Line-up ∗ Model No. Rank GP2S24J0000F GP2S24BJ000F GP2S24CJ000F GP2S24ABJ00F GP2S24BCJ00F A, B or C B C A or B B or C Collector current IC[μA] (IF=4mA, VCE=2V, Ta=25˚C) 20 to 120 34 to 71 58 to 120 20 to 71 34 to 120 The ratio of each rank can not be guaranteed. Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D3-A01801EN 5 GP2S24J0000F Series Fig.2 Power Dissipation vs. Ambient Temperature 60 120 50 100 Power dissipation P (mW) Forward current IF (mA) Fig.1 Forward Current vs. Ambient Temperature 40 30 20 Ptot P, PC 80 75 60 40 20 15 10 0 −25 0 25 50 75 Ambient temperature Ta (˚C) 85 0 −25 100 VCE =2V Ta =25˚C 600 0˚C −25˚C Collector current IC (μA) Forward current IF (mA) 700 100 100 Fig.4 Collector Current vs. Forward Current Fig.3 Forward Current vs. Forward Voltage Ta =75˚C 50˚C 25˚C 50 75 85 0 25 Ambient temperature Ta (˚C) 10 500 400 300 200 100 1 0 0.5 1 1.5 2 Forward voltage VF (V) 2.5 0 3 0 Fig.5 Collector Current vs. Collector-Emitter Voltage Ta = 25˚C Collector current IC (μA) 300 120 IF =15mA 250 10mA 200 150 10 15 20 Forward current IF (mA) 25 30 Fig.6 Relative Collector Current vs. Ambient Temperature Relative collector current IC (%) 350 5 7mA 100 4mA 50 IF =4mA VCE =2V 100 80 60 40 20 2mA 0 0 2 4 6 8 10 Collector-emitter voltage VCE (V) 0 −25 12 0 25 50 75 Ambient temperature Ta (˚C) 100 Sheet No.: D3-A01801EN 6 GP2S24J0000F Series Fig.7 Collector Dark Current vs. Ambient Temperature 1 000 VCE =20V VCE=2V IC=100μA Ta=25˚C 10 −8 tf td 10 ts 1 10 −9 10 −10 0 0.1 0.1 100 25 50 75 Ambient temperature Ta (˚C) 1 Input Output Relative collector current (%) RD VCC RL 100 1 000 Fig.10 Relative Collector Current vs. Distance (Reference value) 100 Reflector Plate 10 Load resistance RL (kΩ) Fig.9 Test Circuit for Response Time Input tr 100 10 −7 Response time (μs) Collector dark current ICEO (A) 10 −6 Fig.8 Response Time vs. Load Resistance 10% Output 90% td tr ts tf IF =4mA VCE =2V Ta =25˚C 80 60 40 20 0 0 1 2 3 4 5 Distance between sensor and Al evaporation glass d (mm) Fig.11 Detecting Position Characteristics (1) Fig.12 Detecting Position Characteristics (2) 100 IF=4mA VCE=2V d=1mm Ta=25˚C 80 Relative collector current (%) Relative collector current (%) 100 60 40 20 0 −2 −1 0 1 2 3 4 5 6 80 60 40 20 0 −3 7 Card moving distance L (mm) IF=4mA VCE=2V d=1mm Ta=25˚C −2 −1 1 3 0 2 4 Card moving distance L (mm) 5 6 Sheet No.: D3-A01801EN 7 GP2S24J0000F Series Fig.13 Test Condition for Distance & Detecting Position Characteristics Fig.14 Freauency Response 5 Al evaporated glass Correspond to Fig.10 VCE =2V IC =100μA Ta =25˚C d Correspond to Fig.11 Correspond to Fig.12 Test condition IF = 4mA VCE = 2V d = 1mm Test condition IF = 4mA VCE = 2V d = 1mm OMS card White OMS card Black d 1mm − L=0 Voltage gain AV (dB) 0 Black White d + L=0 1kΩ RL =10kΩ −10 −15 1mm − −5 -20 102 103 104 Frequency f (Hz) 105 106 + Fig.15 Spectral Sensitivity (Detecting Side) 100 Ta=25˚C Relative sensitivity (%) 80 60 40 20 0 600 700 800 900 1 000 Wavelength λ (nm) 1 100 1 200 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D3-A01801EN 8 GP2S24J0000F Series ■ Design Considerations ● Design guide 1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Distance characteristic Please refer to Fig.10 (Relative collector current vs. Distance) to set the distance of the photointerrupter and the object. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photointerrupter will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ● Parts This product is assembled using the below parts. • Photodetector (qty. : 1) Category Material Maximum Sensitivity wavelength (nm) Sensitivity wavelength (nm) Response time (μs) Phototransister Silicon (Si) 930 700 to 1 200 20 • Photo emitter (qty. : 1) Category Material Maximum light emitting wavelength (nm) I/O Frequency (MHz) Infrared emitting diode (non-coherent) Gallium arsenide (GaAs) 950 0.3 • Material Case Lead frame Lead frame plating Black polyphernylene 42Alloy SnCu plating Sheet No.: D3-A01801EN 9 GP2S24J0000F Series ■ Manufacturing Guidelines ● Soldering Method Flow Soldering: Soldering should be completed below 260˚C and within 5 s. Soldering area is 1mm or more away from the bottom of housing. Please take care not to let any external force exert on lead pins. Please don't do soldering with preheating, and please don't do soldering by reflow. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions. ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : Do not execute ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D3-A01801EN 10 GP2S24J0000F Series ■ Package specification ● Sleeve package Package materials Sleeve : Polystyrene Stopper : Styrene-Butadiene Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. MAX. 40 sleeves in one case. Color of sleeve Rank classification is distinguished by the color of the sleeve as shown in the table below. But the ratio of each rank can not be guaranteed. Rank A B C Color of sleeve Yellow Transparent Green Sheet No.: D3-A01801EN 11 GP2S24J0000F Series ■ Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D3-A01801EN [H143] 12