HLMP-EL55/EG55/EL57/EH57/ED57 T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps Data Sheet Description Features These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology. • Well defined and smooth spatial radiation patterns These LED lamps are tinted, diffused, T-13/4 packages incorporating second generation optics producing well defined radiation patterns at specific viewing cone angles. There are two families of amber, red, and red-orange lamps; AlInGaP and the higher performance AlInGaP II. The high maximum LED junction temperature limit of +130°C enables high temperature operation in bright sunlight conditions. These lamps are available in two package options to give the designer flexibility with device mounting. Benefits • Viewing angles match traffic management sign requirements • Colors meet automotive specifications • Superior performance in outdoor environments • Suitable for autoinsertion onto PC boards • Wide viewing angle • Tinted diffused lamp • High luminous output • Colors: 590/592 nm Amber 617 nm Reddish-Orange 626/630 nm Red • High operating temperature: TJLED = +130°C • Superior resistance to moisture Applications • Traffic management: Variable message signs Traffic management signs • Commercial indoor/outdoor advertising: Signs Marquees Passenger information • Automotive: Exterior and interior lights Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk Packaging DD: Ammo Pack Color Bin Selections 0: No color bin limitation K: Amber color bins 2 and 4 only L: Amber Color Bins 4 and 6 only Maximum Intensity Bin Minimum Intensity Bin Viewing Angle & Lead Stand Offs 55: 55 deg without lead stand offs; AlInGaP 57: 55 deg without lead stand offs; AlInGaP II Color D: 630 nm Red G: 626 nm Red H: 617 nm Red-Orange L: 590/592 Amber Package E: 5 mm Round Device Selection Guide for AlInGaP Part Number Color and Dominant Wavelength Luminous Intensity Iv ld (nm) Typ. [3] (mcd) at 20 mA Min. [1,2] Luminous Intensity Iv (mcd) at 20 mA Max. [1,2] HLMP-EL55-GK0DD Amber 590 140 400 HLMP-EL55-GHKDD Amber 590 140 240 HLMP-EL55-HJKxx Amber 590 180 310 HLMP-EL55-JKLDD Amber 590 240 400 HLMP-EL55-LP000 Amber 590 400 1150 HLMP-EG55-GK0DD Red 626 140 400 HLMP-EG55-HJ0xx Red 626 180 310 HLMP-EG55-JK0xx Red 626 240 400 Device Selection Guide for AlInGaPII Part Number Color and Dominant Wavelength Luminous Intensity Iv ld (nm) Typ. [3] (mcd) at 20 mA Min. [1,2] Luminous Intensity Iv (mcd) at 20 mA Max. [1,2] HLMP-EL57-LP0xx Amber 592 400 1150 HLMP-EH57-LP000 Red-Orange 617 400 1150 HLMP-ED57-LP0xx Red 630 400 1150 HLMP-ED57-LPT00 Red 630 400 1150 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 2 Package Dimensions 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 31.60 (1.244) MIN. 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE FLAT 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS. 3. RECOMMENDED PC BOARD HOLE DIAMETERS: LAMP PACKAGE WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF LAMP PACKAGE = 1.143/1.067 (0.044/0.042). 3 Absolute Maximum Ratings at TA = 25°C DC Forward Current[1,2,3] ........................................................................................................ 50 mA Peak Pulsed Forward Current[2,3] ..........................................................................................100 mA Average Forward Current[3] ..................................................................................................... 30 mA Reverse Voltage (IR = 100 µA)........................................................................................................... 5 V LED Junction Temperature.......................................................................................................... 130°C Operating Temperature...........................................................................................–40°C to +100°C Storage Temperature................................................................................................–40°C to +100°C Notes: 1. Derate linearly as shown in Figure 4. 2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E). 3. Please contact your Avago Technologies sales representative about operating currents below 10 mA. Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Units Forward Voltage VFV Amber (λd = 590 nm) 2.02 2.4 Amber (λd = 592 nm) 2.15 2.4 Red-Orange (λd = 617 nm) 2.08 2.4 Red (λd = 626 nm) 1.90 2.4 Red (λd = 630 nm) 2.00 2.4 Reverse Voltage VR 5 20 V Peak Wavelength λPEAK nm Amber (λd = 590 nm) 592 Amber (λd = 592 nm) 594 Red-Orange (λd = 617 nm) 623 Red (λd = 626 nm) 635 Red (λd = 630 nm) 639 Test Conditions IF = 20 mA IR = 100 µA Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth ∆λ1/2 17 nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA Speed of Response τs 20 ns Exponential Time Constant, e-t/τs Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RθJ-PIN 240 LED Junction-to-Cathode Lead Luminous Efficacy[1] ηv Amber (λd = 590 nm) Amber (λd = 592 nm) Red-Orange (λd = 617 nm) Red (λd = 626 nm) Red (λd = 630 nm) °C/W lm/W 480 500 235 150 155 Emitted Luminous Power/Emitted Radiant Power Note: 1. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. 4 1.0 RED-ORANGE AMBER RELATIVE INTENSITY RED 0.5 0 500 550 600 650 700 WAVELENGTH – nm Figure 1. Relative intensity vs. peak wavelength. 100 3.0 50 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 80 CURRENT – mA 70 60 RED 50 40 AMBER 30 20 10 0 1.0 2.5 1.5 2.0 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. 3.0 2.5 IF – FORWARD CURRENT – mA 90 2.0 1.5 1.0 0.5 0 0 20 40 IF – DC FORWARD CURRENT – mA Figure 3. Relative luminous intensity vs. forward current. 100 90 RELATIVE INTENSITY – % 80 70 60 50 40 30 20 10 0 -100 -80 -60 -40 -20 0 20 40 θ – ANGULAR DISPLACEMENT – DEGREES 60 Figure 5. Representative spatial radiation pattern for 55° viewing angle lamps. 5 80 100 60 40 RθJA = 585 C/W 30 RθJA = 780 C/W 20 10 0 0 40 80 20 60 100 TA – AMBIENT TEMPERATURE – C Figure 4. Maximum forward current vs. ambient temperature. Derating based on TJMAX = 130°C. Intensity Bin Limits (mcd at 20 mA) Amber Color Bin Limits (nm at 20 mA) Bin Name Min. Max. Bin Name Min. Max. G 140 180 1 584.5 587.0 H 180 240 2 587.0 589.5 J 240 310 4 589.5 592.0 K 310 400 6 592.0 594.5 L 400 520 Tolerance for each bin limit is ± 0.5 nm. M 520 680 N 680 880 P 880 1150 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Tolerance for each bin limit is ± 15%. 6 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. 1.59mm Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 7 CATHODE Note: Electrical connection between bottom surface of LED die and AllnGaP Device the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 40 60 50 TIME (SECONDS) 80 70 90 100 Ammo Pack Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) A VIEW A–A ALL DIMENSIONS IN MILLIMETERS (INCHES). NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. 8 ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A GO AVA OGIES NOL ECH + DE ANO T HOD CAT E – ANODE LEAD LEAVES THE BOX FIRST. C BEL R LA THE MO NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 9 Lamps Baby Label RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin OR (ii) Color bin incorporated with VF Bin BIN: 2VB VB: VF bin “VB” (Applicable for part number that have both color bin and VF bin) 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4364EN AV02-1541EN - July 18, 2014