Freescale MC9S12E32MFU Mc9s12e-family device user guide Datasheet

Freescale Semiconductor, Inc.
DOCUMENT NUMBER
9S12E128DGV1/D
Freescale Semiconductor, Inc...
MC9S12E-Family
Device User Guide
V01.04
Original Release Date: 4 APR 2003
Revised: 04 NOV 2003
Motorola, Inc.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in
different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components
in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product
could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall
indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action
Employer.
©Motorola, Inc., 2003
1
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DOCUMENT NUMBER
9S12E128DGV1/D
Revision History
Freescale Semiconductor, Inc...
Version Revision
Number
Date
Author
Description of Changes
01.00
04.APR.03
01.01
24.JUN.03
Minor typo corrections.
01.02
9.OCT.03
MC9S12E32 added.
31.OCT.03
Added Colpitts and Pierce connections to 2.3.8.
Updated input capacitance.
Updated Table A-8.
Changed pin name ROMONE to ROMCTL.
Added S12 LRAE to Flash section.
Added EXTAL VIH and VIL min/max values and hysteresis value to
Oscillator Characteristics.
New wording on NVM Reliability.
04.NOV.03
Updated PCB layouts.
Changed PP6 to PK7 on Table 4-1.
Updated DAC Supply min voltage and Operating frequency.
Added Non-multiplexed Address and Chip Select external bus
timing.
01.03
01.04
Original Version.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in
different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components
in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product
could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall
indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action
Employer.
©Motorola, Inc., 2003
2
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Inc.
Device User Guide — 9S12E128DGV1/D V01.04
Table of Contents
Freescale Semiconductor, Inc...
Section 1 Introduction
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Device Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Part ID Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Section 2 Signal Description
2.1
Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
2.2
Signal Properties Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
2.3
Detailed Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.3.1
EXTAL, XTAL — Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.3.2
RESET — External Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.3.3
TEST — Test Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.3.4
XFC — PLL Loop Filter Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.3.5
BKGD / TAGHI / MODC — Background Debug, Tag High & Mode Pin . . . . . . . 80
2.3.6
PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins . . . . . . . . . . . . . . . . . . . . 80
2.3.7
PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins . . . . . . . . . . . . . . . . . . . . . . 80
2.3.8
PE7 / NOACC / XCLKS — Port E I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
2.3.9
PE6 / MODB / IPIPE1 — Port E I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
2.3.10 PE5 / MODA / IPIPE0 — Port E I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
2.3.11 PE4 / ECLK— Port E I/O Pin 4 / E-Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . 83
2.3.12 PE3 / LSTRB / TAGLO — Port E I/O Pin 3 / Low-Byte Strobe (LSTRB) . . . . . . . 83
2.3.13 PE2 / R/W — Port E I/O Pin 2 / Read/Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
2.3.14 PE1 / IRQ — Port E input Pin 1 / Maskable Interrupt Pin . . . . . . . . . . . . . . . . . . 84
2.3.15 PE0 / XIRQ — Port E input Pin 0 / Non Maskable Interrupt Pin . . . . . . . . . . . . . 84
2.3.16 PK7 / ECS / ROMCTL — Port K I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
2.3.17 PK6 / XCS — Port K I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
2.3.18 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0] . . . . . . . . . . . . . . . . . . . . . . . . . 84
2.3.19
2.3.20
PAD[15:0] / AN[15:0] / KWAD[15:0] — Port AD I/O Pins [15:0] . . . . . . . . . . . . . . 85
PM7 / SCL — Port M I/O Pin 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
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Device User Guide — 9S12E128DGV1/D V01.04
2.3.21 PM6 / SDA — Port M I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
2.3.22 PM5 / TXD2 — Port M I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
2.3.23 PM4 / RXD2 — Port M I/O Pin 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
2.3.24 PM3 — Port M I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
2.3.25 PM1 / DAO1 — Port M I/O Pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
2.3.26 PM0 / DAO2 — Port M I/O Pin 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
2.3.27 PP[5:0] / PW0[5:0] — Port P I/O Pins [5:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
2.3.28 PQ[6:4] / IS[2:0] — Port Q I/O Pins [6:4] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
2.3.29 PQ[3:0] / FAULT[3:0] — Port Q I/O Pins [3:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
2.3.30 PS7 / SS — Port S I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
2.3.31 PS6 / SCK — Port S I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.3.32 PS5 / MOSI — Port S I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.3.33 PS4 / MISO — Port S I/O Pin 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.3.34 PS3 / TXD1 — Port S I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.3.35 PS2 / RXD1 — Port S I/O Pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.3.36 PS1 / TXD0 — Port S I/O Pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.3.37 PS0 / RXD0 — Port S I/O Pin 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.3.38 PT[7:4] / IOC1[7:4]— Port T I/O Pins [7:4] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.3.39 PT[3:0] / IOC0[7:4]— Port T I/O Pins [3:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.3.40 PU[7:6] — Port U I/O Pins [7:6] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.3.41 PU[5:4] / PW1[5:4] — Port U I/O Pins [5:4] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.3.42 PU[3:0] / IOC2[7:4]/PW1[3:0] — Port U I/O Pins [3:0] . . . . . . . . . . . . . . . . . . . . . 88
2.4
Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
2.4.1
VDDX,VSSX — Power & Ground Pins for I/O Drivers . . . . . . . . . . . . . . . . . . . . . 89
2.4.2
VDDR, VSSR — Power Supply Pins for I/O Drivers & for Internal Voltage Regulator
89
2.4.3
VDD1, VDD2, VSS1, VSS2 — Power Supply Pins for Internal Logic . . . . . . . . . 89
2.4.4
VDDA, VSSA — Power Supply Pins for ATD and VREG . . . . . . . . . . . . . . . . . . 89
2.4.5
VRH, VRL — ATD Reference Voltage Input Pins . . . . . . . . . . . . . . . . . . . . . . . . 89
2.4.6
VDDPLL, VSSPLL — Power Supply Pins for PLL . . . . . . . . . . . . . . . . . . . . . . . . 89
Section 3 System Clock Description
Section 4 Modes of Operation
4.1
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
4.2
Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
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Device User Guide — 9S12E128DGV1/D V01.04
4.3
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
4.3.1
Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
4.3.2
Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
4.3.3
Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
4.4
Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
4.4.1
Stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
4.4.2
Pseudo Stop. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
4.4.3
Wait . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
4.4.4
Run. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
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Section 5 Resets and Interrupts
5.1
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
5.2
Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
5.3
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
5.3.1
Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Section 6 HCS12 Core Block Description
6.1
6.2
6.3
6.4
6.5
6.6
CPU12 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
HCS12 Background Debug Module (BDM) Block Description . . . . . . . . . . . . . . . . . 97
HCS12 Debug (DBG) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
HCS12 Interrupt (INT) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
HCS12 Multiplexed External Bus Interface (MEBI) Block Description . . . . . . . . . . . 97
HCS12 Module Mapping Control (MMC) Block Description . . . . . . . . . . . . . . . . . . . 98
Section 7 Analog to Digital Converter (ATD) Block Description
Section 8 Clock Reset Generator (CRG) Block Description
8.1
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
8.1.1
XCLKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Section 9 Digital to Analog Converter (DAC) Block Description
Section 10 Flash EEPROM Block Description
Section 11 IIC Block Description
Section 12 Oscillator (OSC) Block Description
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Device User Guide — 9S12E128DGV1/D V01.04
Section 13 Port Integration Module (PIM) Block Description
Section 14 Pulse width Modulator with Fault protection (PMF) Block Description
Section 15 Pulse Width Modulator (PWM) Block Description
Section 16 Serial Communications Interface (SCI) Block Description
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Section 17 Serial Peripheral Interface (SPI) Block Description
Section 18 Timer (TIM) Block Description
Section 19 Voltage Regulator (VREG) Block Description
19.1
19.2
VREGEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
VDD1, VDD2, VSS1, VSS2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Section 20 Printed Circuit Board Layout Proposals
Appendix A Electrical Characteristics
A.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
A.1.1
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
A.1.2
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
A.1.3
Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
A.1.4
Current Injection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
A.1.5
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
A.1.6
ESD Protection and Latch-up Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
A.1.7
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
A.1.8
Power Dissipation and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 109
A.1.9
I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
A.1.10 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Appendix B Electrical Specifications
B.1 Voltage Regulator (VREG_3V3) Operating Characteristics . . . . . . . . . . . . . . . . . . 117
B.2 Chip Power-up and LVI/LVR graphical explanation . . . . . . . . . . . . . . . . . . . . . . . . 118
B.3 Output Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
B.3.1
Resistive Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
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Device User Guide — 9S12E128DGV1/D V01.04
B.3.2
B.4
B.4.1
B.4.2
B.4.3
B.5
B.5.1
B.5.2
B.6
B.6.1
B.6.2
B.7
B.7.1
B.7.2
B.7.3
B.7.4
B.7.5
B.8
B.8.1
Capacitive Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Reset, Oscillator and PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Phase Locked Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Flash NVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
NVM timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
NVM Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
ATD Operating Characteristics - 5V Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
ATD Operating Characteristics - 3.3V Range . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Factors influencing accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
ATD accuracy - 5V Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
ATD accuracy - 3.3V Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
DAC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
DAC Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Appendix C External Bus Timing
Appendix D Package Information
D.1
D.2
80-pin QFP package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
112-pin LQFP package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
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Freescale Semiconductor, Inc...
List of Figures
Figure 0-1
Figure 1-1
Figure 1-2
Figure 1-3
Figure 1-4
Figure 1-5
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 3-1
Figure 20-1
Figure 20-2
Figure B-1
Figure B-2
Figure B-3
Figure B-4
Figure B-5
Figure B-6
Figure B-7
Figure B-8
Figure C-1
Figure D-1
Order Part Number Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
MC9S12E-Family Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
MC9S12E256 User Configurable Memory Map . . . . . . . . . . . . . . . . . . . . . . 23
MC9S12E128 User Configurable Memory Map . . . . . . . . . . . . . . . . . . . . . . 24
MC9S12E64 User Configurable Memory Map . . . . . . . . . . . . . . . . . . . . . . . 25
MC9S12E32 User configurable Memory Map . . . . . . . . . . . . . . . . . . . . . . . . 26
Pin assignments 112 LQFP for MC9S12E-Family. . . . . . . . . . . . . . . . . . . . . 76
Pin assignments in 80 QFP for MC9S12E-Family. . . . . . . . . . . . . . . . . . . . . 77
Colpitts Oscillator Connections (PE7=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Pierce Oscillator Connections (PE7=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Clock Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Recommended PCB Layout (112 LQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Recommended PCB Layout (80 QFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Voltage Regulator - Chip Power-up and Voltage Drops (not scaled) . . . . 118
Basic PLL functional diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Jitter Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
SPI Master Timing (CPHA=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
SPI Master Timing (CPHA=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
SPI Slave Timing (CPHA=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
SPI Slave Timing (CPHA=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
ATD Accuracy Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
General External Bus Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
80-pin QFP Mechanical Dimensions (case no. 841B) . . . . . . . . . . . . . . . . 153
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Freescale Semiconductor, Inc...
List of Tables
Table 0-1
Table 0-2
Table 0-3
Table 0-4
Table 1-1
Table 1-2
Table 1-3
Table 2-1
Table 2-2
Table 3-1
Table 4-1
Table 4-2
Table 5-1
Table 5-2
Table 20-1
Table A-1
Table A-2
Table A-3
Table A-4
Table A-5
Table A-6
Table A-7
Table A-8
Table 20-2
Table B-1
Table B-2
Table B-3
Table B-4
Table B-5
Table B-6
Table B-7
Table B-8
Table B-9
Document References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Part Number Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package Option Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
List of MC9S12E-Family members . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Device Register Map Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Assigned Part ID Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Memory size registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Signal Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
MC9S12E-Family Power and Ground Connection Summary . . . . . . . . . . . . . 90
Clock Selection Based on PE7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Clock Selection Based on PE7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Interrupt Vector Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Reset Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Recommended decoupling capacitor choice . . . . . . . . . . . . . . . . . . . . . . . . . 101
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
ESD and Latch-up Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
ESD and Latch-Up Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 108
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Thermal Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
5V I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Preliminary 3.3V I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Supply Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
VREG_3V3 - Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Voltage Regulator - Capacitive Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Startup Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
PLL Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
NVM Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
NVM Reliability Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
SPI Master Mode Timing Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
SPI Slave Mode Timing Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
11
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5V ATD Operating Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
3.3V ATD Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
ATD Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
3.3V ATD Conversion Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
5V ATD Conversion Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
DAC Electrical Characteristics (Operating) . . . . . . . . . . . . . . . . . . . . . . . . . . 145
DAC Timing/Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Expanded Bus Timing Characteristics (5V Range). . . . . . . . . . . . . . . . . . . . 149
Expanded Bus Timing Characteristics (3.3V Range) . . . . . . . . . . . . . . . . . . 151
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Table B-10
Table B-11
Table B-12
Table B-14
Table B-13
Table B-15
Table B-16
Table C-1
Table C-2
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Device User Guide — 9S12E128DGV1/D V01.04
Preface
The Device User Guide provides information about the MC9S12E-Family devices made up of standard
HCS12 blocks and the HCS12 processor core. This document is part of the customer documentation. A
complete set of device manuals also includes all the individual Block Guides of the implemented modules.
In a effort to reduce redundancy, all module specific information is located only in the respective Block
Guide. If applicable, special implementation details of the module are given in the block description
sections of this document.
See Table 0-1 for names and versions of the referenced documents throughout the Device User Guide.
Freescale Semiconductor, Inc...
Table 0-1 Document References
E256
Version
E128, E64
Version
E32
Version
Document Order
Number
CPU12 Reference Manual
V02
V02
V02
S12CPUV2/D
HCS12 Background Debug (BDM)
V04
V04
V04
S12BDMV4/D
HCS12 Debug (DBG)
V01
V01
V01
S12DBGV1/D
HCS12 Interrupt (INT)
V01
V01
V01
S12INTV1/D
HCS12 Multiplexed Expanded Bus Interface (MEBI)
V03
V03
V03
S12MEBIV3/D
HCS12 Module Mapping Control (MMC)
V04
V04
V04
S12MMCV4/D
Analog to Digital Converter: 10-Bit, 16 Channels (ATD_10B16C)
V04
V02
V04
S12ATD10B16CVx/D1
Block Guide
Clock and Reset Generator (CRG)
V04
V04
V04
S12CRGV4/D
Digital to Analog Converter: 8-Bit, 1 Channel (DAC_8B1C)
V01
V01
V01
S12DAC8B1CV1/D
256Kbyte Flash EEPROM (FTS256K2)
V01
N/A
N/A
S12FTS256K2V1/D
128Kbyte Flash EEPROM (FTS128K1)
N/A
V01
N/A
S12FTS128K1V1/D
S12FTS32KV2/D
32Kbyte Flash EEPROM (FTS32K)
N/A
N/A
V02
Inter IC Bus (IIC)
V02
V02
V02
S12IICV2/D
Oscillator (OSC)
V02
V02
V02
S12OSCV2/D
Port Integration Module (PIM_9E128)
V01
V01
V01
S12PIM9E128V1/D
Pulse Modulator with Fault Protection: 15-Bit, 6 Channels (PMF_15B6C)
V02
V02
V02
S12PMF15B6CV2/D
Pulse Width Modulator: 8-Bit, 6 Channels (PWM_8B6C)
V01
V01
V01
S12PWM8B6CV1/D
Serial Communications Interface (SCI)
V04
V03
V04
S12SCIVy/D2
Serial Peripheral Interface (SPI)
V03
V03
V03
S12SPIV3/D
Timer: 16-Bit, 4 Channels (TIM_16B4C)
V01
V01
V01
S12TIM16B4CV1/D
Voltage Regulator (VREG_3V3)
V02
V02
V02
S12VREG3V3V2/D
NOTES:
1. x in S12ATD10B16CVx/D is 2 for E64 and E128, and 4 for E32 and E256.
2. y in S12SCIVy/D is 3 for E64 and E128, and 4 for E32 and E256.
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Device User Guide — 9S12E128DGV1/D V01.04
Part Number
Figure 0-1 provides an ordering number example.
MC9S12 E128 C FU
Package Option
Temperature Option
Temperature Options
C = -40°C to 85°C
V = -40°C to 105°C
M = -40°C to 125°C
Device Title
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Package Options
FC = 64QFN
FU = 80QFP
PV = 112LQFP
Controller Family
Figure 0-1 Order Part Number Coding
Table 0-2 lists the part number coding based on the package and temperature.
Table 0-2 Part Number Coding
Part Number
Temp.
Package
Description
MC9S12E256CFU
-40°C, 85°C
80QFP
MC9S12E256
MC9S12E256CPV
-40°C, 85°C
112LQFP
MC9S12E256
MC9S12E256MFU
-40°C, 125°C
80QFP
MC9S12E256
MC9S12E256MPV
-40°C, 125°C
112LQFP
MC9S12E256
MC9S12E128CFU
-40°C, 85°C
80QFP
MC9S12E128
MC9S12E128CPV
-40°C, 85°C
112LQFP
MC9S12E128
MC9S12E128MFU
-40°C, 125°C
80QFP
MC9S12E128
MC9S12E128MPV
-40°C, 125°C
112LQFP
MC9S12E128
MC9S12E64CFU
-40°C, 85°C
80QFP
MC9S12E64
MC9S12E64CPV
-40°C, 85°C
112LQFP
MC9S12E64
MC9S12E64MFU
-40°C, 125°C
80QFP
MC9S12E64
MC9S12E64MPV
-40°C, 125°C
112LQFP
MC9S12E64
MC9S12E32CFU
-40°C, 85°C
80QFP
MC9S12E32
MC9S12E32MFU
-40°C, 125°C
80QFP
MC9S12E32
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Device User Guide — 9S12E128DGV1/D V01.04
Table 0-3 summarizes the package option and size configuration.
Table 0-3 Package Option Summary
Device
80QFP
MC9S12E256
MC9S12E256
M, C
112LQFP MC9S12E256
MC9S12E256
M, C
MC9S12E128
MC9S12E128
M, C
112LQFP MC9S12E128
MC9S12E128
M, C
80QFP
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Temp.1
Options
Package
Part Number
80QFP
MC9S12E64
MC9S12E64
M, C
112LQFP
MC9S12E64
MC9S12E64
M, C
64QFN
MC9S12E32
MC9S12E32
M, C
80QFP
MC9S12E32
MC9S12E32
M, C
Flash
RAM
256K
16K
128K
8K
64K
4K
32K
2K
I/O2
60
92
60
92
60
92
44
60
NOTES:
1. C: TA = 85¯C, f = 25MHz. M: TA= 125¯C, f = 25MHz
2. I/O is the sum of ports capable to act as digital input or output.
Table 0-4 List of MC9S12E-Family members
Device Flash RAM Package MEBI
E256
E128
256K
128K
16K
8K
E64
64K
4K
E32
32K
2K
112 LQFP
1
80 QFP
0
112 LQFP
1
80 QFP
0
112 LQFP
1
80 QFP
0
80 QFP
0
TIM
SCI
SPI
IIC
A/D
D/A
PWM PMF KWU
12
3
1
1
16
2
6
6
16
12
3
1
1
16
2
6
6
16
12
3
1
1
16
2
6
6
16
8
2
1
1
16
2
0
6
16
I/O
92
60
92
60
92
60
60
• Pin out explanations:
— TIM is the number of channels.
— A/D is the number of A/D channels.
— D/A is the number of D/A channels.
— PWM is the number of channels.
— PMF is the number of channels.
— KWU is the number of key wake up interrupt pins.
— I/O is the sum of ports capable to act as digital input or output.
112 Pin Packages:
Port A = 8, B = 8, E = 6 + 2 input only, K = 8, M = 7, P = 6, Q = 7,
S = 8, T = 8, U = 8, AD = 16.
18 inputs provide Interrupt capability (AD = 16, IRQ, XIRQ)
80 Pin Packages:
E = 2 + 2 input only, M = 7, P = 6, Q = 7,
S = 8, T = 8, U = 4, AD = 16.
18 inputs provide Interrupt capability (AD = 16, IRQ, XIRQ)
— Versions with 3 SCI modules will have SCI0, SCI1 and SCI2.
— Versions with 2 SCI modules will have SCI0 and SCI1.
— Versions with 3 TIM modules will have TIM0, TIM1 and TIM2.
— Versions with 2 TIM modules will have TIM0 and TIM1.
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Device User Guide — 9S12E128DGV1/D V01.04
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Device User Guide — 9S12E128DGV1/D V01.04
Section 1 Introduction
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1.1 Overview
The MC9S12E-Family is a 112/80 pin low cost general purpose MCU family. All members of the
MC9S12E-Family are comprised of standard on-chip peripherals including a 16-bit central processing unit
(HCS12 CPU), up to 256K bytes of Flash EEPROM, up to 16K bytes of RAM, three asynchronous serial
communications interface modules (SCI), a serial peripheral interface (SPI), an Inter-IC Bus (IIC), three
4-channel 16-bit timer modules (TIM), a 6-channel 15-bit Pulse Modulator with Fault protection module
(PMF), a 6-channel 8-bit Pulse Width Modulator (PWM), a 16-channel 10-bit analog-to-digital converter
(ADC), and two 1-channel 8-bit digital-to-analog converters (DAC). The MC9S12E-Family has full 16-bit
data paths throughout. The inclusion of a PLL circuit allows power consumption and performance to be
adjusted to suit operational requirements. In addition to the I/O ports available on each module, 16
dedicated I/O port bits are available with Wake-Up capability from STOP or WAIT mode. Furthermore,
an on chip bandgap based voltage regulator (VREG) generates the internal digital supply voltage of 2.5V
(VDD) from a 3.135V to 5.5V external supply range.
1.2 Features
•
16-bit HCS12 CORE
–
HCS12 CPU
i. Upward compatible with M68HC11 instruction set
ii. Interrupt stacking and programmer’s model identical to M68HC11
iii. Instruction queue
iv. Enhanced indexed addressing
•
–
Module Mapping Control (MMC)
–
Interrupt Control (INT)
–
Background Debug Module (BDM)
–
Debugger (DBG12) including breakpoints and change-of-flow trace buffer
–
Multiplexed External Bus Interface (MEBI)
Wake-Up interrupt inputs
–
•
•
Up to 16 port bits available for wake up interrupt function with digital filtering
Memory options
–
32K, 64K, 128K or 256K Byte Flash EEPROM
–
2K, 4K, 8K or 16K Byte RAM
Two 1-channel Digital-to-Analog Converters (DAC)
–
8-bit resolution
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Device User Guide — 9S12E128DGV1/D V01.04
•
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•
•
•
•
•
Analog-to-Digital Converter (ADC)
–
16-channel module with 10-bit resolution
–
External conversion trigger capability
Three 4-channel Timers (TIM)
–
Programmable input capture or output compare channels
–
Simple PWM mode
–
Counter Modulo Reset
–
External Event Counting
–
Gated Time Accumulation
6 PWM channels (PWM)
–
Programmable period and duty cycle
–
8-bit 6-channel or 16-bit 3-channel
–
Separate control for each pulse width and duty cycle
–
Center-aligned or left-aligned outputs
–
Programmable clock select logic with a wide range of frequencies
–
Fast emergency shutdown input
6-channel Pulse width Modulator with Fault protection (PMF)
–
Three independent 15-bit counters with synchronous mode
–
Complementary channel operation
–
Edge and center aligned PWM signals
–
Programmable dead time insertion
–
Integral reload rates from 1 to 16
–
Four fault protection shut down input pins
–
Three current sense input pins
Serial interfaces
–
Three asynchronous serial communication interfaces (SCI)
–
Synchronous serial peripheral interface (SPI)
–
Inter-IC Bus (IIC)
Clock and Reset Generator (CRG)
–
Windowed COP watchdog
–
Real Time interrupt
–
Clock Monitor
18
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Device User Guide — 9S12E128DGV1/D V01.04
•
–
Pierce or low current Colpitts oscillator
–
Phase-locked loop clock frequency multiplier
–
Self Clock mode in absence of external clock
–
Low power 0.5 to 16Mhz crystal oscillator reference clock
Operating frequency
–
Freescale Semiconductor, Inc...
•
•
•
50MHz equivalent to 25MHz Bus Speed
Internal 2.5V Regulator
–
Input voltage range from 3.135V to 5.5V
–
Low power mode capability
–
Includes low voltage reset (LVR) circuitry
–
Includes low voltage interrupt (LVI) circuitry
112-Pin LQFP or 80-Pin QFP package
–
Up to 90 I/O lines with 5V input and drive capability (112 pin package)
–
Up to two dedicated 5V input only lines (IRQ and XIRQ)
–
Sixteen 3.3V/5V A/D converter inputs
Development Support.
–
Single-wire background debugTM mode
–
On-chip hardware breakpoints
–
Enhanced debug features
1.3 Modes of Operation
User modes (Expanded modes are only available in the 112 pin package version)
•
•
Normal modes
–
Normal Single-Chip Mode
–
Normal Expanded Wide Mode
–
Normal Expanded Narrow Mode
–
Emulation Expanded Wide Mode
–
Emulation Expanded Narrow Mode
Special Operating Modes
–
Special Single-Chip Mode with active Background Debug Mode
–
Special Test Mode (Motorola use only)
–
Special Peripheral Mode (Motorola use only)
19
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Device User Guide — 9S12E128DGV1/D V01.04
Low power modes
–
Stop Mode
–
Pseudo Stop Mode
–
Wait Mode
Freescale Semiconductor, Inc...
•
20
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Device User Guide — 9S12E128DGV1/D V01.04
1.4 Block Diagram
PW10
PW11
PW12
PW13
PW14
PW15
PWM
Multiplexed Address/Data Bus
PTB
Multiplexed
Narrow Bus
ADDR15
ADDR14
ADDR13
ADDR12
ADDR11
ADDR10
ADDR9
ADDR8
ADDR7
ADDR6
ADDR5
ADDR4
ADDR3
ADDR2
ADDR1
ADDR0
DATA15
DATA14
DATA13
DATA12
DATA11
DATA10
DATA9
DATA8
DATA7
DATA6
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
Multiplexed
Wide Bus
Voltage Regulator 3.3V/5V
VDDR
VSSR
PLL 2.5V
VDDPLL
VSSPLL
TIM2
AN0
AN1
AN2
AN3
ADC AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
ADC/DAC 3.3V/5V
Voltage Reference
I/O Driver 3.3V/5V
VDDX
VSSX
VRH
VRL
VDDA
VSSA
Internal Logic 2.5V
VDD1,2
VSS1,2
Signals shown in Bold are not available on the 80 Pin Package
DDRP
DDRQ
PT0
PT1
PT2
PT3
PT4
PT5
PT6
PT7
PU0
PU1
PU2
PU3
PU4
PU5
PU6
PU7
IOC24
IOC25
IOC26
IOC27
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
PTA
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
DDRB
MUX
PTP
TIM1
PTQ
TIM0
TEST
DDRA
IOC04
IOC05
IOC06
IOC07
IOC14
IOC15
IOC16
IOC17
PTS
SPI
DDRS
SCI1
PS0
PS1
PS2
PS3
PS4
PS5
PS6
PS7
PTT
DDRE
PTE
PTK
RXD0
TXD0
RXD1
TXD1
MISO
MOSI
SCK
SS
SCI0
XIRQ
IRQ
R/W
System
LSTRB/TAGLO
Integration
ECLK
Module
MODA/IPIPE0
(SIM)
MODB/IPIPE1
NOACC/XCLKS
XADDR14
XADDR15
XADDR16
XADDR17
XADDR18
XADDR19
XCS
ECS
DDRK
PK0
PK1
PK2
PK3
PK4
PK5
PK6
PK7
Generation
DATA7
DATA6
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
Freescale Semiconductor, Inc...
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
Clock and
CRG Reset
PQ0
PQ1
PQ2
PQ3
PQ4
PQ5
PQ6
SCI2
IIC
KWAD0
KWAD1
KWAD2
KWAD3
KWAD4
KWAD5
KWAD6
KWAD7
KWAD8
KWAD9
KWAD10
KWAD11
KWAD12
KWAD13
KWAD14
KWAD15
DAC0
DAO0
DAC1
DAO1
RXD2
TXD2
SDA
SCL
PAD
XFC
CPU12
Periodic Interrupt
COP Watchdog
Clock Monitor
Debugger(DBG12)
Breakpoints
PP0
PP1
PP2
PP3
PP4
PP5
PAD0
PAD1
PAD2
PAD3
PAD4
PAD5
PAD6
PAD7
PAD8
PAD9
PAD10
PAD11
PAD12
PAD13
PAD14
PAD15
PM0
PM1
PTM
Single-wire Background
Debug Module
EXTAL
XTAL
RESET
FAULT0
FAULT1
FAULT2
FAULT3
IS0
IS1
IS2
MODC/TAGHI
DDRAD
BKGD
PMF
Voltage Regulator
DDRM
VDDR
VSSR
DDRT
2K -16K Byte RAM
DDRU
PW00
PW01
PW02
PW03
PW04
PW05
32K - 256K Byte Flash EEPROM
PTU
Figure 1-1 MC9S12E-Family Block Diagram
PM3
PM4
PM5
PM6
PM7
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Device User Guide — 9S12E128DGV1/D V01.04
1.5 Device Memory Map
Table 1-1 shows the device register map of the MC9S12E-Family after reset. The following figures (,
Figure 1-3, and Figure 1-4) illustrate the full device memory map with Flash and RAM.
Table 1-1 Device Register Map Overview
Freescale Semiconductor, Inc...
Address
Module
Size
$000 - $017
CORE (Ports A, B, E, Modes, Inits, Test)
$018
Reserved
24
1
$019
Voltage Regulator (VREG)
1
$01A - $01B
Device ID register (PARTID)
2
$01C - $01F
CORE (MEMSIZ, IRQ, HPRIO)
$020 - $02F
CORE (DBG)
$030 - $033
CORE (PPAGE, Port K)
$034 - $03F
Clock and Reset Generator (PLL, RTI, COP)
4
16
4
12
$040 - $06F
Standard Timer 16-bit 4 channels (TIM0)
48
$070 - $07F
Reserved
16
$080 - $0AF
Analog to Digital Converter 10-bit 16 channels (ATD)
48
$0B0 - $0C7
Reserved
24
$0C8 - $0CF
Serial Communications Interface 0 (SCI0)
8
$0D0 - $0D7
Serial Communications Interface 1 (SCI1)
8
$0D8 - $0DF
Serial Peripheral Interface (SPI)
8
$0E0 - $0E7
Inter IC Bus
8
$0E8 - $0EF
Serial Communications Interface 2 (SCI2)
8
$0F0 - $0F3
Digital to Analog Converter 8-bit 1-channel (DAC0)
4
$0F4 - $0F7
Digital to Analog Converter 8-bit 1-channel (DAC1)
4
$0F8 - $0FF
Reserved
8
$100- $10F
Flash Control Register
16
$110 - $13F
Reserved
48
$140 - $16F
Standard Timer 16-bit 4 channels (TIM1)
48
$170 - $17F
Reserved
16
$180 - $1AF
Standard Timer 16-bit 4 channels (TIM2)
48
$1B0 - $1DF
Reserved
48
$1E0 - $1FF
Pulse Width Modulator 8-bit 6 channels (PWM)
32
$200 - $23F
Pulse Width Modulator with Fault 15-bit 6 channels (PMF)
64
$240 - $27F
Port Integration Module (PIM)
$280 - $3FF
Reserved
22
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64
384
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Device User Guide — 9S12E128DGV1/D V01.04
$0000
$0400
$0000
1K Register Space
$03FF
Mappable to any 2K Boundary
$4000
16K Bytes RAM
$4000
Mappable to any 16K Boundary
Freescale Semiconductor, Inc...
$7FFF
$8000
$8000
16K Page Window
sixteen * 16K Flash EEPROM Pages
EXT
$BFFF
$C000
$C000
16K Fixed Flash EEPROM
$FFFF
2K, 4K, 8K or 16K Protected Boot Sector
$FF00
$FF00
$FFFF
VECTORS
VECTORS
VECTORS
NORMAL
SINGLE CHIP
EXPANDED
SPECIAL
SINGLE CHIP
$FFFF
BDM
(If Active)
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0000 - $3FFF: 16K RAM (only 15K RAM visible $0400 - $3FFF)
Figure 1-2 MC9S12E256 User Configurable Memory Map
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Device User Guide — 9S12E128DGV1/D V01.04
$0000
$0400
$0000
1K Register Space
$03FF
Mappable to any 2K Boundary
$2000
8K Bytes RAM
$3FFF
Mappable to any 8K Boundary
$4000
0.5K, 1K, 2K or 4K Protected Sector
$2000
$4000
Freescale Semiconductor, Inc...
$7FFF
16K Fixed Flash EEPROM
$8000
$8000
16K Page Window
eight * 16K Flash EEPROM Pages
EXT
$BFFF
$C000
$C000
16K Fixed Flash EEPROM
$FFFF
2K, 4K, 8K or 16K Protected Boot Sector
$FF00
$FF00
$FFFF
VECTORS
VECTORS
VECTORS
NORMAL
SINGLE CHIP
EXPANDED
SPECIAL
SINGLE CHIP
$FFFF
BDM
(If Active)
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0000 - $1FFF: 8K RAM (only 7K RAM visible $0400 - $1FFF)
Figure 1-3 MC9S12E128 User Configurable Memory Map
24
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Device User Guide — 9S12E128DGV1/D V01.04
$0000
$0400
$0000
1K Register Space
$03FF
Mappable to any 2K Boundary
$3000
4K Bytes RAM
$3FFF
Mappable to any 4K Boundary
$4000
0.5K, 1K, 2K or 4K Protected Sector
$3000
$4000
Freescale Semiconductor, Inc...
$7FFF
16K Fixed Flash EEPROM
$8000
$8000
16K Page Window
four * 16K Flash EEPROM Pages
EXT
$BFFF
$C000
$C000
16K Fixed Flash EEPROM
$FFFF
2K, 4K, 8K or 16K Protected Boot Sector
$FF00
$FF00
$FFFF
VECTORS
VECTORS
VECTORS
NORMAL
SINGLE CHIP
EXPANDED
SPECIAL
SINGLE CHIP
$FFFF
BDM
(If Active)
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0000 - $0FFF: 4K RAM (only 3K RAM visible $0400 - $0FFF)
Figure 1-4 MC9S12E64 User Configurable Memory Map
25
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Device User Guide — 9S12E128DGV1/D V01.04
$0000
$0400
$0000
1K Register Space
$03FF
Mappable to any 2K Boundary
$3700
2K Bytes RAM
$3FFF
Mappable to any 2K Boundary
$4000
0.5K, 1K, 2K or 4K Protected Sector
$3000
$4000
Freescale Semiconductor, Inc...
$7FFF
16K Fixed Flash EEPROM
$8000
$8000
16K Page Window
two * 16K Flash EEPROM Pages
EXT
$BFFF
$C000
$C000
16K Fixed Flash EEPROM
$FFFF
2K, 4K, 8K or 16K Protected Boot Sector
$FF00
$FF00
$FFFF
VECTORS
VECTORS
VECTORS
NORMAL
SINGLE CHIP
EXPANDED
SPECIAL
SINGLE CHIP
$FFFF
BDM
(If Active)
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0000 - $07FF: 2K RAM (only 1K RAM visible $0400 - $07FF)
Figure 1-5 MC9S12E32 User configurable Memory Map
1.6 Detailed Register Map
The detailed register map of the MC9S12E-Family is listed in address order below. For detailed
information about register function please refer to the appropriate block guide.
26
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Device User Guide — 9S12E128DGV1/D V01.04
$0000 - $000F
Freescale Semiconductor, Inc...
Addres
s
Name
$0000
PORTA
$0001
PORTB
$0002
DDRA
$0003
DDRB
$0004
Reserved
$0005
Reserved
$0006
Reserved
$0007
Reserved
$0008
PORTE
$0009
DDRE
$000A
PEAR
MEBI map 1 of 3 (HCS12 Multiplexed External Bus Interface)
Bit 7
Read
:
Bit 7
Write
:
Read
:
Bit 7
Write
:
Read
:
Bit 7
Write
:
Read
:
Bit 7
Write
:
Read
0
:
Write
:
Read
0
:
Write
:
Read
0
:
Write
:
Read
0
:
Write
:
Read
:
Bit 7
Write
:
Read
:
Bit 7
Write
:
Read
: NOACC
E
Write
:
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
6
5
4
3
2
1
Bit 0
6
5
4
3
2
1
Bit 0
6
5
4
3
2
1
Bit 0
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 1
Bit 0
6
5
4
3
2
0
0
0
0
6
5
4
3
Bit 2
PIPOE
NECLK
LSTRE
RDWE
0
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Device User Guide — 9S12E128DGV1/D V01.04
$0000 - $000F
Freescale Semiconductor, Inc...
$000B
MODE
$000C
PUCR
$000D
RDRIV
$000E
EBICTL
$000F
Reserved
$0010 - $0014
Addres
s
Name
$0010
INITRM
$0011
INITRG
$0012
INITEE
$0013
MISC
$0014
MTST0
MEBI map 1 of 3 (HCS12 Multiplexed External Bus Interface)
Read
:
MODC
Write
:
Read
:
PUPKE
Write
:
Read
:
RDPK
Write
:
Read
0
:
Write
:
Read
0
:
Write
:
0
0
MODB
MODA
IVIS
0
0
0
EMK
0
PUPEE
0
0
PUPBE PUPAE
0
0
RDPE
0
0
0
EME
RDPB
0
0
RDPA
0
ESTR
0
0
0
0
0
0
0
MMC map 1 of 4 (HCS12 Module Mapping Control)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read
0
0
:
RAMHA
RAM15 RAM14 RAM13 RAM12 RAM11
L
Write
:
Read
0
0
0
0
:
REG14 REG13 REG12 REG11
Write
:
Read
0
0
:
EE15
EE14
EE13
EE12
EE11
EEON
Write
:
Read
0
0
0
0
:
EXSTR1 EXSTR0 ROMHM ROMON
Write
:
Read
Bit 7
6
5
4
3
2
1
Bit 0
:
Write
:
28
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Device User Guide — 9S12E128DGV1/D V01.04
$0015 - $0016
Addres
s
INT map 1 of 2 (HCS12 Interrupt)
Name
$0015
ITCR
$0016
ITEST
Read
:
Write
:
Read
:
Write
:
Freescale Semiconductor, Inc...
$0017 - $0017
Addres
s
$0017
Read
:
Write
:
$0018 - $0018
Addres
s
$0018
Read
:
Write
:
$0019 - $0019
Addres
s
Bit 5
0
0
0
INTE
INTC
INTA
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WRINT
ADR3
ADR2
ADR1
ADR0
INT8
INT6
INT4
INT2
INT0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
Miscellaneous Peripherals (Device User Guide)
Name
Reserved
Bit 6
MMC map 2 of 4 (HCS12 Module Mapping Control)
Name
MTST1
Bit 7
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
Bit 1
Bit 0
LVIE
LVIF
VREG3V3 (Voltage Regulator)
Name
Read
:
$0019 VREGCTRL
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
0
0
0
0
0
LVDS
29
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Device User Guide — 9S12E128DGV1/D V01.04
$001A - $001B
Addres
s
$001A
Freescale Semiconductor, Inc...
$001B
Miscellaneous Peripherals (Device User Guide)
Name
PARTIDH
PARTIDL
Read
:
Write
:
Read
:
Write
:
$001C - $001D
User Guide)
Addres
s
$001C
$001D
MEMSIZ1
$001E
$001F - $001F
Addres
s
$001F
Name
HPRIO
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ID15
ID14
ID13
ID12
ID11
ID10
ID9
ID8
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
Bit 6
Bit 5
Bit 4
Bit 3
Read
eep_sw eep_sw
reg_sw0
0
:
1
0
Write
:
Read rom_sw rom_sw
0
0
:
1
0
Write
:
0
0
Bit 2
Bit 1
Bit 0
ram_sw ram_sw ram_sw
2
1
0
0
pag_sw pag_sw
1
0
MEBI map 2 of 3 (HCS12 Multiplexed External Bus Interface)
Name
INTCR
Bit 5
Bit 7
$001E - $001E
Addres
s
Bit 6
MMC map 3 of 4 (HCS12 Module Mapping Control, Device
Name
MEMSIZ0
Bit 7
Read
:
Write
:
Bit 7
Bit 6
IRQE
IRQEN
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
Bit 0
INT map 2 of 2 (HCS12 Interrupt)
Bit 7
Read
:
PSEL7
Write
:
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
PSEL6
PSEL5
PSEL4
PSEL3
PSEL2
PSEL1
0
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Device User Guide — 9S12E128DGV1/D V01.04
$0020 - $002F
Addres
s
$0020
$0021
$0022
$0023
Freescale Semiconductor, Inc...
$0024
$0025
$0026
$0027
$0028
$0029
$002A
$002B
$002C
$002D
$002E
$002F
DBG (including BKP) map 1of 1 (HCS12 Debug)
Name
DBGC1
-
DBGSC
DBGTBH
DBGTBL
DBGCNT
DBGCCX
DBGCCH
DBGCCL
-
DBGC2
BKPCT0
DBGC3
BKPCT1
DBGCAX
BKP0X
DBGCAH
BKP0H
DBGCAL
BKP0L
DBGCBX
BKP1X
DBGCBH
BKP1H
DBGCBL
BKP1L
Bit 7
$0030
read
write
read
write
read
write
read
write
read
write
$0031
Reserved
Bit 4
Bit 3
Bit 2
Bit 1
ARM
TRGSEL
BEGIN
DBGBRK
BF
CF
0
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TBF
0
0
read
write
read
write
read
write
read
write
read
write
Bit 0
CAPMOD
TRG
CNT
PAGSEL
EXTCMP
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
RWCEN
RWC
RWBEN
RWB
read
BKABEN
FULL
BDM
TAGAB BKCEN
TAGC
write
read
BKAMBH BKAMBL BKBMBH BKBMBL RWAEN
RWA
write
read
PAGSEL
EXTCMP
write
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
PAGSEL
EXTCMP
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
MMC map 4 of 4 (HCS12 Module Mapping Control)
Name
PPAGE
Bit 5
read
DBGEN
write
AF
read
write
read Bit 15
write
$0030 - $0031
Addres
s
Bit 6
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
0
0
0
0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
PIX5
PIX4
PIX3
PIX2
PIX1
PIX0
0
0
0
0
0
0
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Device User Guide — 9S12E128DGV1/D V01.04
$0032 - $0033
Addres
s
Name
$0032
PORTK
$0033
DDRK
Freescale Semiconductor, Inc...
$0034 - $003F
Addres
s
$0034
$0035
$0036
$0037
$0038
$0039
$003A
$003B
MEBI map 3 of 3 (HCS12 Multiplexed External Bus Interface)
Name
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ECS
XCS
XAB19
XAB18
XAB17
XAB16
XAB15
XAB14
Bit 7
6
5
4
3
2
1
Bit 0
CRG (Clock and Reset Generator)
Bit 7
Bit 6
Bit 5
Read
0
0
:
SYNR
SYN5
Write
:
Read
0
0
0
:
REFDV
Write
:
Read
TOUT7 TOUT6 TOUT5
:
CTFLG
TEST ONLY Write
:
Read
0
:
CRGFLG
RTIF
PROF
Write
:
Read
0
0
:
CRGINT
RTIE
Write
:
Read
:
CLKSEL
PLLSEL PSTP SYSWAI
Write
:
Read
:
PLLCTL
CME
PLLON AUTO
Write
:
Read
0
:
RTICTL
RTR6
RTR5
Write
:
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SYN4
SYN3
SYN2
SYN1
SYN0
0
TOUT4
REFDV REFDV REFDV REFDV
3
2
1
0
TOUT3
TOUT2
LOCK
TRACK
LOCKIF
TOUT1
TOUT0
SCM
SCMIF
0
0
LOCKIE
0
SCMIE
ROAWA
PLLWAI
I
CWAI
RTIWAI
COPWA
I
PRE
PCE
SCME
RTR2
RTR1
RTR0
0
ACQ
RTR4
RTR3
32
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0034 - $003F
Freescale Semiconductor, Inc...
Addres
s
Name
CRG (Clock and Reset Generator)
Bit 7
Bit 6
Read
:
$003C
COPCTL
WCOP RSBCK
Write
:
Read
:
FORBYP
COPBY
$003D
RTIBYP
TEST ONLY Write
P
:
Read
TCTL7 TCTL6
:
CTCTL
$003E
TEST ONLY Write
:
Read
0
0
:
$003F ARMCOP
Write
Bit 7
6
:
$0040 - $006F
Addres
s
Name
$0040
TIOS
$0041
CFORC
$0042
OC7M
$0043
OC7D
$0044
TCNT (hi)
$0045
TCNT (lo)
Bit 5
Bit 4
Bit 3
0
0
0
0
0
Bit 2
Bit 1
Bit 0
CR2
CR1
CR0
0
PLLBYP
0
FCM
TCTL5
TCTL4
TCLT3
TCTL2
TCTL1
TCTL0
0
0
0
0
0
0
5
4
3
2
1
Bit 0
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
11
10
9
Bit 8
3
2
1
Bit 0
TIM0 (Timer 16 Bit 4 Channels)
Bit 7
Bit 6
Bit 5
Bit 4
Read
:
IOS7
IOS6
IOS5
IOS4
Write
:
Read
0
0
0
0
:
Write
FOC7
FOC6
FOC5
FOC4
:
Read
:
OC7M7 OC7M6 OC7M5 OC7M4
Write
:
Read
:
OC7D7 OC7D6 OC7D5 OC7D4
Write
:
Read
Bit 15
14
13
12
:
Write
:
Read
Bit 7
6
5
4
:
Write
:
33
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0040 - $006F
Freescale Semiconductor, Inc...
Addres
s
Name
$0046
TSCR1
$0047
TTOV
$0048
TCTL1
$0049
Reserved
$004A
TCTL3
$004B
Reserved
$004C
TIE
$004D
TSCR2
$004E
TFLG1
$004F
TFLG2
$0050
Reserved
TIM0 (Timer 16 Bit 4 Channels)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read
0
0
0
0
:
TEN
TSWAI TSFRZ TFFCA
Write
:
Read
0
0
0
0
:
TOV7
TOV6
TOV5
TOV4
Write
:
Read
:
OM7
OL7
OM6
OL6
OM5
OL5
OM4
OL4
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
:
EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
:
C7I
C6I
C5I
C4I
Write
:
Read
0
0
0
:
TOI
TCRE
PR2
PR1
PR0
Write
:
Read
0
0
0
0
:
C7F
C6F
C5F
C4F
Write
:
Read
0
0
0
0
0
0
0
:
TOF
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
34
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0040 - $006F
Freescale Semiconductor, Inc...
Addres
s
TIM0 (Timer 16 Bit 4 Channels)
Name
$0051
Reserved
$0052
Reserved
$0053
Reserved
$0054
Reserved
$0055
Reserved
$0056
Reserved
$0057
Reserved
$0058
TC4 (hi)
$0059
TC4 (lo)
$005A
TC5 (hi)
$005B
TC5 (lo)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
35
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0040 - $006F
Freescale Semiconductor, Inc...
Addres
s
TIM0 (Timer 16 Bit 4 Channels)
Name
$005C
TC6 (hi)
$005D
TC6 (lo)
$005E
TC7 (hi)
$005F
TC7 (lo)
$0060
PACTL
$0061
PAFLG
$0062
PACNT (hi)
$0063
PACNT (lo)
$0064
Reserved
$0065
Reserved
$0066
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
PAEN
PAMOD
PEDGE
CLK1
CLK0
PAOVI
PAI
0
0
0
0
0
PAOVF
PAIF
0
0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
36
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0040 - $006F
Freescale Semiconductor, Inc...
Addres
s
TIM0 (Timer 16 Bit 4 Channels)
Name
$0067
Reserved
$0068
Reserved
$0069
Reserved
$006A
Reserved
$006B
Reserved
$006C
Reserved
$006D
Reserved
$006E
Reserved
$006F
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
$0070 - $007F
$0070
$007F
Reserved
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reserved
Read
:
Write
:
0
37
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0080 - $00AF
Addres
s
Freescale Semiconductor, Inc...
$0080
ATD (Analog to Digital Converter 10 Bit 16 Channel)
Name
ATDCTL0
$0081
ATDCTL1
$0082
ATDCTL2
$0083
ATDCTL3
$0084
ATDCTL4
$0085
ATDCTL5
$0086
ATDSTAT0
$0087
Reserved
$0088
ATDTEST0
$0089
ATDTEST1
$008A
ATDSTAT0
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
0
0
0
0
0
0
0
AFFC
AWAI
S8C
S4C
S2C
SMP1
SMP0
PRS4
ETRIGS
EL2
ADPU
Bit 3
Bit 2
Bit 1
Bit 0
WRAP31 WRAP21 WRAP11 WRAP01
ETRIGC ETRIGC ETRIGC ETRIGC
H32
H22
H12
H02
ETRIGL
ETRIGP
E
ASCIF
ETRIG
ASCIE
S1C
FIFO
FRZ1
FRZ0
PRS3
PRS2
PRS1
PRS0
CC
CB
CA
0
CC2
CC1
CC0
0
SRES8
0
DJM
DSGN
SCAN
MULT
ETORF
FIFOR
0
SCF
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
SC
CCF15
CCF14
CCF13
CCF12
CCF11
38
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CCF10
CCF9
CCF8
Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0080 - $00AF
Freescale Semiconductor, Inc...
Addres
s
Name
$008B
ATDSTAT1
$008C
ATDDIEN0
$008D
ATDDIEN1
$008E
PORTAD0
$008F
PORTAD1
$0090
ATDDR0H
$0091
ATDDR0L
$0092
ATDDR1H
$0093
ATDDR1L
$0094
ATDDR2H
$0095
ATDDR2L
ATD (Analog to Digital Converter 10 Bit 16 Channel)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Read
CCF7
CCF6
CCF5
CCF4
CCF3
:
Write
:
Read
:
IEN15
IEN14
IEN13
IEN12
IEN11
Write
:
Read
:
IEN7
IEN6
IEN5
IEN4
IEN3
Write
:
Read
PTAD15 PTAD14 PTAD13 PTAD12 PTAD11
:
Write
:
Read
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
:
Write
:
Read
Bit15
14
13
12
11
:
Write
:
Read
Bit7
Bit6
0
0
0
:
Write
:
Read
Bit15
14
13
12
11
:
Write
:
Read
Bit7
Bit6
0
0
0
:
Write
:
Read
Bit15
14
13
12
11
:
Write
:
Read
Bit7
Bit6
0
0
0
:
Write
:
Bit 2
Bit 1
Bit 0
CCF2
CCF1
CCF0
IEN10
IEN9
IEN8
IEN2
IEN1
IEN0
PTAD10
PTAD9
PTAD8
PTAD2
PTAD1
PTAD0
10
9
Bit8
0
0
0
10
9
Bit8
0
0
0
10
9
Bit8
0
0
0
39
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0080 - $00AF
Freescale Semiconductor, Inc...
Addres
s
ATD (Analog to Digital Converter 10 Bit 16 Channel)
Name
$0096
ATDDR3H
$0097
ATDDR3L
$0098
ATDDR4H
$0099
ATDDR4L
$009A
ATDDR5H
$009B
ATDDR5L
$009C
ATDDR6H
$009D
ATDDR6L
$009E
ATDDR7H
$009F
ATDDR7L
$00A0
ATDDR8H
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
40
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0080 - $00AF
Freescale Semiconductor, Inc...
Addres
s
Name
$00A1
ATDDR8L
$00A2
ATDDR9H
$00A3
ATDDR9L
$00A4
ATDDR10H
$00A5
ATDDR10L
$00A6
ATDDR11H
$00A7
ATDDR11L
$00A8
ATDDR12H
$00A9
ATDDR12L
$00AA ATDDR13H
$00AB
ATD (Analog to Digital Converter 10 Bit 16 Channel)
ATDDR13L
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
41
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0080 - $00AF
Addres
s
ATD (Analog to Digital Converter 10 Bit 16 Channel)
Name
Freescale Semiconductor, Inc...
Read
:
$00AC ATDDR14H
Write
:
Read
:
$00AD ATDDR14L
Write
:
Read
:
$00AE ATDDR15H
Write
:
Read
:
$00AF ATDDR15L
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
Bit15
14
13
12
11
10
9
Bit8
Bit7
Bit6
0
0
0
0
0
0
0
0
0
NOTES:
1. WRAP0-3 bits are available in version V04 of ATD10B16C
2. ETRIGSEL and ETRIGCH0-3 bits are available in version V04 of ATD10B16C
$00B0 - $00C7
$00B0
$00C7
Reserved
$00C8 - $00CF
Addres
s
Name
$00C8
SCIBDH
$00C9
SCIBDL
$00CA
SCICR1
Reserved
Read
:
Write
:
0
0
0
0
0
SCI0 (Asynchronous Serial Interface)
Bit 7
Bit 6
Bit 5
Read
:
IREN
TNP1
TNP0
Write
:
Read
:
SBR7
SBR6
SBR5
Write
:
Read
:
SCISWA
LOOPS
RSRC
I
Write
:
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SBR12
SBR11
SBR10
SBR9
SBR8
SBR4
SBR3
SBR2
SBR1
SBR0
M
WAKE
ILT
PE
PT
42
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$00C8 - $00CF
Freescale Semiconductor, Inc...
Addres
s
SCI0 (Asynchronous Serial Interface)
Name
$00CB
SCICR2
$00CC
SCISR1
$00CD
SCISR2
$00CE
SCIDRH
$00CF
SCIDRL
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
0
0
0
R8
TXPOL1 RXPOL1 BRK13
RAF
TXDIR
0
0
0
0
0
0
T8
R7
R6
R5
R4
R3
R2
R1
R0
T7
T6
T5
T4
T3
T2
T1
T0
NOTES:
1. TXPOL and RXPOL bits are available in version V04 of SCI
$00D0 - $00D7
Addres
s
Name
$00D0
SCIBDH
$00D1
SCIBDL
$00D2
SCICR1
$00D3
SCICR2
SCI1 (Asynchronous Serial Interface)
Bit 7
Bit 6
Bit 5
Read
:
IREN
TNP1
TNP0
Write
:
Read
:
SBR7
SBR6
SBR5
Write
:
Read
:
SCISWA
LOOPS
RSRC
I
Write
:
Read
:
TIE
TCIE
RIE
Write
:
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SBR12
SBR11
SBR10
SBR9
SBR8
SBR4
SBR3
SBR2
SBR1
SBR0
M
WAKE
ILT
PE
PT
ILIE
TE
RE
RWU
SBK
43
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$00D0 - $00D7
Freescale Semiconductor, Inc...
$00D4
SCISR1
$00D5
SCISR2
$00D6
SCIDRH
$00D7
SCIDRL
SCI1 (Asynchronous Serial Interface)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
TDRE
TC
RDRF
0
0
0
IDLE
OR
1
NF
1
TXPOL RXPOL
R8
FE
PF
RAF
BRK13
TXDIR
0
0
0
0
0
0
T8
R7
R6
R5
R4
R3
R2
R1
R0
T7
T6
T5
T4
T3
T2
T1
T0
NOTES:
1. TXPOL and RXPOL are available in version V04 of SCI
$00D8 - $00DF
Addres
s
$00D8
SPI (Serial Peripheral Interface)
Name
SPICR1
$00D9
SPICR2
$00DA
SPIBR
$00DB
SPISR
$00DC
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
0
0
0
SPISWAI
SPC0
SPR2
SPR1
SPR0
MODFE BIDIRO
N
E
0
0
0
SPPR2
SPPR1
SPPR0
SPIF
0
SPTEF
MODF
0
0
0
0
0
0
0
0
0
0
0
0
44
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$00D8 - $00DF
Freescale Semiconductor, Inc...
Addres
s
SPI (Serial Peripheral Interface)
Name
$00DD
SPIDR
$00DE
Reserved
$00DF
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
$00E0 - $00E7
Addres
s
IBAD
$00E1
IBFD
$00E2
IBCR
$00E3
IBSR
$00E4
IBDR
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit7
6
5
4
3
2
1
Bit0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 0
IIC (Inter-IC Bus)
Name
$00E0
Bit 7
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
IBC7
IBC6
IBC5
IBC4
IBC3
IBC2
IBC1
0
0
IBEN
IBIE
MS/SL
Tx/Rx
TXAK
0
IBC0
IBSWAI
RSTA
TCF
IAAS
IBB
0
SRW
IBAL
D7
D6
D5
D4
RXAK
IBIF
D3
D2
D1
D0
45
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$00E0 - $00E7
Freescale Semiconductor, Inc...
Addres
s
Name
$00E5
Reserved
$00E6
Reserved
$00E7
Reserved
$00E8 - $00EF
Addres
s
IIC (Inter-IC Bus)
Name
$00E8
SCIBDH
$00E9
SCIBDL
$00EA
SCICR1
$00EB
SCICR2
$00EC
SCISR1
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
SCI2 (Asynchronous Serial Interface)
Bit 7
Bit 6
Bit 5
Read
:
IREN
TNP1
TNP0
Write
:
Read
:
SBR7
SBR6
SBR5
Write
:
Read
:
SCISWA
LOOPS
RSRC
I
Write
:
Read
:
TIE
TCIE
RIE
Write
:
Read
TDRE
TC
RDRF
:
Write
:
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SBR12
SBR11
SBR10
SBR9
SBR8
SBR4
SBR3
SBR2
SBR1
SBR0
M
WAKE
ILT
PE
PT
ILIE
TE
RE
RWU
SBK
IDLE
OR
NF
FE
PF
46
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$00E8 - $00EF
Freescale Semiconductor, Inc...
$00ED
SCISR2
$00EE
SCIDRH
$00EF
SCIDRL
SCI2 (Asynchronous Serial Interface)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
0
0
R8
0
TXPOL1 RXPOL1 BRK13
RAF
TXDIR
0
0
0
0
0
0
T8
R7
R6
R5
R4
R3
R2
R1
R0
T7
T6
T5
T4
T3
T2
T1
T0
Bit 3
Bit 2
Bit 1
Bit 0
DJM
DSGN
DACWAI
DACOE
NOTES:
1. TXPOL and RXPOL are available in version V04 of SCI
$00F0 - $00F3
Addres
s
DAC0 (Digital-to-Analog Converter)
Name
$00F0
DACC0
$00F1
DACC1
$00F2
DACD
$00F3
DACD
Bit 7
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 6
Bit 5
Bit 4
DACTE
0
0
DACE
0
0
0
0
0
0
0
0
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
47
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$00F4 - $00F7
Freescale Semiconductor, Inc...
Addres
s
DAC1 (Digital-to-Analog Converter)
Name
$00F4
DACC0
$00F5
DACC1
$00F6
DACD
$00F7
DACD
Bit 7
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
$00F8 - $00FF
$00F8
$00FF
Reserved
$0100 - $010F
Addres
s
Name
Bit 6
Bit 5
Bit 4
DACTE
0
0
DACE
Bit 3
Bit 2
Bit 1
Bit 0
DJM
DSGN
DACWAI
DACOE
0
0
0
0
0
0
0
0
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
0
0
0
0
0
0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
FDIV5
FDIV4
FDIV3
FDIV2
FDIV1
FDIV0
NV5
NV4
NV3
NV2
SEC1
SEC0
0
0
0
0
0
0
Reserved
Read
:
Write
:
0
0
Flash Control Register
Bit 7
Bit 6
Read
FDIVLD
:
$0100
FCLKDIV
PRDIV8
Write
:
Read KEYEN
NV6
:
1
$0101
FSEC
Write
:
Read
0
0
:
Reserved for
$0102
Factory Test Write
:
48
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0100 - $010F
Freescale Semiconductor, Inc...
Addres
s
Name
$0103
FCNFG
$0104
FPROT
$0105
FSTAT
$0106
FCMD
$0107
Reserved for
Factory Test
$0108
Reserved for
Factory Test
$0109
Reserved for
Factory Test
$010A
Reserved for
Factory Test
$010B
Reserved for
Factory Test
$010C
Reserved
Flash Control Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Read
0
0
0
:
KEYAC
CBEIE
CCIE
C
Write
:
Read
: FPOPE
NV6
FPHDIS FPHS1 FPHS0 FPLDIS
N
Write
:
Read
CCIF
0
:
ACCER
CBEIF
PVIOL
BLANK
R
Write
:
Read
0
0
0
:
CMDB6 CMDB5
CMDB2
Write
:
Read
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
:
Write
:
Bit 1
Bit 0
0
0
FPLS1
FPLS0
0
0
0
CMDB0
0
0
0
0
0
0
0
0
0
0
0
0
49
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0100 - $010F
Freescale Semiconductor, Inc...
Addres
s
Flash Control Register
Name
$010D
Reserved
$010E
Reserved
$010F
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
$0110 - $013F
$0110
$013F
Reserved
$0140 - $016F
Addres
s
Name
$0140
TIOS
$0141
CFORC
$0142
OC7M
$0143
OC7D
$0144
TCNT (hi)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
11
10
9
Bit 8
Reserved
Read
:
Write
:
0
TIM1 (Timer 16 Bit 4 Channels)
Bit 7
Bit 6
Bit 5
Bit 4
Read
:
IOS7
IOS6
IOS5
IOS4
Write
:
Read
0
0
0
0
:
Write
FOC7
FOC6
FOC5
FOC4
:
Read
:
OC7M7 OC7M6 OC7M5 OC7M4
Write
:
Read
:
OC7D7 OC7D6 OC7D5 OC7D4
Write
:
Read
Bit 15
14
13
12
:
Write
:
50
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0140 - $016F
Freescale Semiconductor, Inc...
Addres
s
Name
$0145
TCNT (lo)
$0146
TSCR1
$0147
TTOV
$0148
TCTL1
$0149
Reserved
$014A
TCTL3
$014B
Reserved
$014C
TIE
$014D
TSCR2
$014E
TFLG1
$014F
TFLG2
TIM1 (Timer 16 Bit 4 Channels)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read
Bit 7
6
5
4
3
2
1
Bit 0
:
Write
:
Read
0
0
0
0
:
TEN
TSWAI TSFRZ TFFCA
Write
:
Read
0
0
0
0
:
TOV7
TOV6
TOV5
TOV4
Write
:
Read
:
OM7
OL7
OM6
OL6
OM5
OL5
OM4
OL4
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
:
EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
:
C7I
C6I
C5I
C4I
Write
:
Read
0
0
0
:
TOI
TCRE
PR2
PR1
PR0
Write
:
Read
0
0
0
0
:
C7F
C6F
C5F
C4F
Write
:
Read
0
0
0
0
0
0
0
:
TOF
Write
:
51
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0140 - $016F
Freescale Semiconductor, Inc...
Addres
s
TIM1 (Timer 16 Bit 4 Channels)
Name
$0150
Reserved
$0151
Reserved
$0152
Reserved
$0153
Reserved
$0154
Reserved
$0155
Reserved
$0156
Reserved
$0157
Reserved
$0158
TC4 (hi)
$0159
TC4 (lo)
$015A
TC5 (hi)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
52
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0140 - $016F
Freescale Semiconductor, Inc...
Addres
s
TIM1 (Timer 16 Bit 4 Channels)
Name
$015B
TC5 (lo)
$015C
TC6 (hi)
$015D
TC6 (lo)
$015E
TC7 (hi)
$015F
TC7 (lo)
$0160
PACTL
$0161
PAFLG
$0162
PACNT (hi)
$0163
PACNT (lo)
$0164
Reserved
$0165
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
PAEN
PAMOD
PEDGE
CLK1
CLK0
PAOVI
PAI
0
0
0
0
0
PAOVF
PAIF
0
0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
53
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0140 - $016F
Freescale Semiconductor, Inc...
Addres
s
TIM1 (Timer 16 Bit 4 Channels)
Name
$0166
Reserved
$0167
Reserved
$0168
Reserved
$0169
Reserved
$016A
Reserved
$016B
Reserved
$016C
Reserved
$016D
Reserved
$016E
Reserved
$016F
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
54
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0170 - $017F
$0110
$013F
Reserved
$0180 - $01AF
Freescale Semiconductor, Inc...
Addres
s
Name
$0180
TIOS
$0181
CFORC
$0182
OC7M
$0183
OC7D
$0184
TCNT (hi)
$0185
TCNT (lo)
$0186
TSCR1
$0187
TTOV
$0188
TCTL1
Reserved
Read
:
Write
:
0
0
0
0
0
0
0
0
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
11
10
9
Bit 8
3
2
1
Bit 0
0
0
0
0
0
0
0
0
OM5
OL5
OM4
OL4
TIM2 (Timer 16 Bit 4 Channels)
Bit 7
Bit 6
Bit 5
Bit 4
Read
:
IOS7
IOS6
IOS5
IOS4
Write
:
Read
0
0
0
0
:
Write
FOC7
FOC6
FOC5
FOC4
:
Read
:
OC7M7 OC7M6 OC7M5 OC7M4
Write
:
Read
:
OC7D7 OC7D6 OC7D5 OC7D4
Write
:
Read
Bit 15
14
13
12
:
Write
:
Read
Bit 7
6
5
4
:
Write
:
Read
:
TEN
TSWAI TSFRZ TFFCA
Write
:
Read
:
TOV7
TOV6
TOV5
TOV4
Write
:
Read
:
OM7
OL7
OM6
OL6
Write
:
55
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0180 - $01AF
Freescale Semiconductor, Inc...
Addres
s
Name
$0189
Reserved
$018A
TCTL3
$018B
Reserved
$018C
TIE
$018D
TSCR2
$018E
TFLG1
$018F
TFLG2
$0190
Reserved
$0191
Reserved
$0192
Reserved
$0193
Reserved
TIM2 (Timer 16 Bit 4 Channels)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
:
EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
:
C7I
C6I
C5I
C4I
Write
:
Read
0
0
0
:
TOI
TCRE
PR2
PR1
PR0
Write
:
Read
0
0
0
0
:
C7F
C6F
C5F
C4F
Write
:
Read
0
0
0
0
0
0
0
:
TOF
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
Read
0
0
0
0
0
0
0
0
:
Write
:
56
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0180 - $01AF
Freescale Semiconductor, Inc...
Addres
s
TIM2 (Timer 16 Bit 4 Channels)
Name
$0194
Reserved
$0195
Reserved
$0196
Reserved
$0197
Reserved
$0198
TC4 (hi)
$0199
TC4 (lo)
$015A
TC5 (hi)
$019B
TC5 (lo)
$019C
TC6 (hi)
$019D
TC6 (lo)
$019E
TC7 (hi)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
57
For More Information On This Product,
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0180 - $01AF
Freescale Semiconductor, Inc...
Addres
s
TIM2 (Timer 16 Bit 4 Channels)
Name
$019F
TC7 (lo)
$01A0
PACTL
$01A1
PAFLG
$01A2
PACNT (hi)
$01A3
PACNT (lo)
$01A4
Reserved
$01A5
Reserved
$01A6
Reserved
$01A7
Reserved
$01A8
Reserved
$01A9
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
PAEN
PAMOD
PEDGE
CLK1
CLK0
PAOVI
PAI
0
0
0
0
0
PAOVF
PAIF
0
0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
58
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0180 - $01AF
Freescale Semiconductor, Inc...
Addres
s
TIM2 (Timer 16 Bit 4 Channels)
Name
$01AA
Reserved
$01AB
Reserved
$01AC
Reserved
$01AD
Reserved
$01AE
Reserved
$01AF
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
$01B0 - $01DF
$01B0
$01DF
Reserved
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reserved
Read
:
Write
:
0
59
For More Information On This Product,
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$01E0 - $01FF
Addres
s
PWM (Pulse Width Modulator)
Name
Freescale Semiconductor, Inc...
Read
:
$01E0
PWME
Write
:
Read
:
$01E1 PWMPOL
Write
:
Read
:
$01E2 PWMCLK
Write
:
Read
:
$01E3 PWMPRCLK
Write
:
Read
:
$01E4 PWMCAE
Write
:
Read
:
$01E5 PWMCTL
Write
:
Read
:
PWMTST
$01E6
Test Only
Write
:
Read
:
$01E7 PWMPRSC
Write
:
Read
:
$01E8 PWMSCLA
Write
:
Read
:
$01E9 PWMSCLB
Write
:
Read
:
$01EA PWMSCNTA
Write
:
Bit 7
Bit 6
0
0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
PWME5 PWME4 PWME3 PWME2 PWME1 PWME0
0
0
0
PPOL5
PPOL4
PPOL3
PPOL2
PPOL1
PPOL0
PCLK5
PCLK4
PCLK3
PCLK2
PCLK1
PCLK0
PCKB1
PCKB0
PCKA2
PCKA1
PCKA0
CAE5
CAE4
CAE3
CAE2
CAE1
CAE0
0
0
PSWAI
PFRZ
0
0
0
PCKB2
0
0
0
CON45 CON23 CON01
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
60
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$01E0 - $01FF
Freescale Semiconductor, Inc...
Addres
s
PWM (Pulse Width Modulator)
Name
Read
:
$01EB PWMSCNTB
Write
:
Read
:
$01EC PWMCNT0
Write
:
Read
:
$01ED PWMCNT1
Write
:
Read
:
$01EE PWMCNT2
Write
:
Read
:
$01EF PWMCNT3
Write
:
Read
:
$01F0 PWMCNT4
Write
:
Read
:
$01F1 PWMCNT5
Write
:
Read
:
$01F2 PWMPER0
Write
:
Read
:
$01F3 PWMPER1
Write
:
Read
:
$01F4 PWMPER2
Write
:
Read
:
$01F5 PWMPER3
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
61
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$01E0 - $01FF
Freescale Semiconductor, Inc...
Addres
s
Name
$01F6
PWMPER4
$01F7
PWMPER5
$01F8
PWMDTY0
$01F9
PWMDTY1
$01FA
PWMDTY2
$01FB
PWMDTY3
$01FC
PWMDTY4
$01FD
PWMDTY5
$01FE
PWMSDN
$01FF
Reserved
PWM (Pulse Width Modulator)
Bit 7
Bit 6
Read
:
Bit 7
6
Write
:
Read
:
Bit 7
6
Write
:
Read
:
Bit 7
6
Write
:
Read
:
Bit 7
6
Write
:
Read
:
Bit 7
6
Write
:
Read
:
Bit 7
6
Write
:
Read
:
Bit 7
6
Write
:
Read
:
Bit 7
6
Write
:
Read
:
PWMIF PWMIE
Write
:
Read
0
0
:
Write
:
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
5
4
3
2
1
Bit 0
5
4
3
2
1
Bit 0
5
4
3
2
1
Bit 0
5
4
3
2
1
Bit 0
5
4
3
2
1
Bit 0
5
4
3
2
1
Bit 0
5
4
3
2
1
Bit 0
5
4
3
2
1
Bit 0
0
PWM5I
N
0
PWMRSTR
T
PWMLV
L
0
0
0
62
For More Information On This Product,
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0
PWM5I
NL
0
PWM5E
NA
0
Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0200 - $023F
Addres
s
Freescale Semiconductor, Inc...
$0200
PMF (Pulse width Modulator with Fault protection)
Name
PMFCFG0
$0201
PMFCFG1
$0202
PMFCFG2
$0203
PMFCFG3
$0204
PMFFCTL
$0205
PMFFPIN
$0206
PMFFSTA
$0207
PMFQSMP
$0208
PMFDMPA
$0209
PMFDMPB
$020A
PMFDMPC
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WP
MTG
EDGEC
EDGEB
EDGEA
INDEPC
INDEPB
INDEPA
BOTNEGC
TOPNEGC
BOTNEGB
TOPNEGB
BOTNEGA
TOPNEGA
MSK5
MSK4
MSK3
MSK2
MSK1
MSK0
SWAPC
SWAPB
SWAPA
FIE1
FMODE0
FIE0
0
ENHA
0
0
0
PMFWAI PMFFRZ
FMODE3
FIE3
VLMODE
FMODE2
FIE2
0
0
0
FPINE3
FPINE1
0
FFLAG3
QSMP3
0
FPINE2
0
0
FMODE1
0
FFLAG2
QSMP2
FPINE0
FFLAG1
QSMP1
FFLAG0
QSMP0
DMP13
DMP12
DMP11
DMP10
DMP03
DMP02
DMP01
DMP00
DMP33
DMP32
DMP31
DMP30
DMP23
DMP22
DMP21
DMP20
DMP53
DMP52
DMP51
DMP50
DMP43
DMP42
DMP41
DMP40
63
For More Information On This Product,
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0200 - $023F
Freescale Semiconductor, Inc...
Addres
s
PMF (Pulse width Modulator with Fault protection)
Name
$020B
Reserved
$020C
PMFOUTC
$020D
PMFOUTB
$020E
PMFDTMS
$020F
PMFCCTL
$0210
PMFVAL0
$0211
PMFVAL0
$0212
PMFVAL1
$0213
PMFVAL1
$0214
PMFVAL2
$0215
PMFVAL2
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
OUTCTL OUTCTL OUTCTL OUTCTL OUTCTL OUTCTL
5
4
3
2
1
0
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
DT5
DT4
DT3
DT2
DT1
DT0
IPOLC
IPOLB
IPOLA
0
ISENS
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
64
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0200 - $023F
Freescale Semiconductor, Inc...
Addres
s
PMF (Pulse width Modulator with Fault protection)
Name
$0216
PMFVAL3
$0217
PMFVAL3
$0218
PMFVAL4
$0219
PMFVAL4
$021A
PMFVAL5
$021B
PMFVAL5
$021C
Reserved
$021D
Reserved
$021E
Reserved
$021F
Reserved
$0220
PMFENCA
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
LDOKA
PWMRIEA
PWMENA
65
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0200 - $023F
Addres
s
$0221
$0222
Freescale Semiconductor, Inc...
$0223
$0224
$0225
$0226
$0227
$0228
$0229
$022A
$022B
PMF (Pulse width Modulator with Fault protection)
Name
Bit 7
Read
:
PMFFQCA
Write
:
Read
:
PMFCNTA
Write
:
Read
:
PMFCNTA
Write
:
Read
:
PMFMODA
Write
:
Read
:
PMFMODA
Write
:
Read
:
PMFDTMA
Write
:
Read
:
PMFDTMA
Write
:
Read
:
PMFENCB
Write
:
Read
:
PMFFQCB
Write
:
Read
:
PMFCNTB
Write
:
Read
:
PMFCNTB
Write
:
Bit 6
Bit 5
Bit 4
LDFQA
Bit 3
Bit 2
HALFA
Bit 1
PRSCA
Bit 0
PWMRFA
0
Bit 14
13
12
11
10
9
Bit 8
6
5
4
3
2
1
Bit 0
Bit 14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
Bit 11
10
9
Bit 8
1
Bit 0
LDOKB
PWMRIEB
Bit 7
0
Bit 7
PWMENB
6
5
4
3
2
0
0
0
0
0
LDFQB
HALFB
PRSCB
PWMRFB
0
Bit 7
Bit 14
13
12
11
10
9
Bit 8
6
5
4
3
2
1
Bit 0
66
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0200 - $023F
Freescale Semiconductor, Inc...
Addres
s
PMF (Pulse width Modulator with Fault protection)
Name
$022C
PMFMODB
$022D
PMFMODB
$022E
PMFDTMB
$022F
PMFDTMB
$0230
PMFENCC
$0231
PMFFQCC
$0232
PMFCNTC
$0233
PMFCNTC
$0234
PMFMODC
$0235
PMFMODC
$0236
PMFDTMC
Bit 7
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
Bit 11
10
9
Bit 8
1
Bit 0
LDOKC
PWMRIEC
0
Bit 7
PWMENC
6
5
4
3
2
0
0
0
0
0
LDFQC
HALFC
PRSCC
PWMRFC
0
Bit 14
13
12
11
10
9
Bit 8
6
5
4
3
2
1
Bit 0
Bit 14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
Bit 11
10
9
Bit 8
Bit 7
0
67
For More Information On This Product,
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0200 - $023F
Freescale Semiconductor, Inc...
Addres
s
PMF (Pulse width Modulator with Fault protection)
Name
$0237
PMFDTMC
$0238
Reserved
$0239
Reserved
$023A
Reserved
$023B
Reserved
$023C
Reserved
$023D
Reserved
$023E
Reserved
$023F
Reserved
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
68
For More Information On This Product,
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
Freescale Semiconductor, Inc...
$0240 - $027F
$0240
PTT
$0241
PTIT
$0242
DDRT
$0243
RDRT
$0244
PERT
$0245
PPST
$0246
Reserved
$0247
Reserved
$0248
PTS
$0249
PTIS
$024A
DDRS
$024B
RDRS
PIM (Port Interface Module)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
PTT7
PTT6
PTT5
PTT4
PTT3
PTT2
PTT1
PTT0
PTIT7
PTIT6
PTIT5
PTIT4
PTIT3
PTIT2
PTIT1
PTIT0
DDRT7
DDRT7
DDRT5
DDRT4
DDRT3
DDRT2
DDRT1
DDRT0
RDRT7
RDRT6
RDRT5
RDRT4
RDRT3
RDRT2
RDRT1
RDRT0
PERT7
PERT6
PERT5
PERT4
PERT3
PERT2
PERT1
PERT0
PPST7
PPST6
PPST5
PPST4
PPST3
PPST2
PPST1
PPST0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PTS7
PTS6
PTS5
PTS4
PTS3
PTS2
PTS1
PTS0
PTIS7
PTIS6
PTIS5
PTIS4
PTIS3
PTIS2
PTIS1
PTIS0
DDRS7
DDRS6
DDRS5
DDRS4
DDRS3
DDRS2
DDRS1
DDRS0
RDRS7
RDRS6
RDRS5
RDRS4
RDRS3
RDRS2
RDRS1
RDRS0
69
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Device User Guide — 9S12E128DGV1/D V01.04
Freescale Semiconductor, Inc...
$0240 - $027F
$024C
PERS
$024D
PPSS
$024E
WOMS
$024F
Reserved
$0250
PTM
$0251
PTIM
$0252
DDRM
$0253
RDRM
$0254
PERM
$0255
PPSM
$0256
WOMM
$0257
Reserved
PIM (Port Interface Module)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
PERS7
PERS6
PERS5
PERS4
PERS3
PERS2
PERS1
PERS0
PPSS7
PPSS6
PPSS5
PPSS4
PPSS3
PPSS2
PPSS1
PPSS0
WOMS7
WOMS6
WOMS5
WOMS4
WOMS3
WOMS2
WOMS1
WOMS0
0
0
0
0
0
0
0
0
PTM7
PTM6
PTM5
PTM4
PTM3
PTM1
PTM0
PTIM7
PTIM6
PTIM5
PTIM4
PTIM3
PTIM1
PTIM0
DDRM7
DDRM6
DDRM5
DDRM4
DDRM3
DDRM1
DDRM0
RDRM1
RDRM0
PERM1
PERM0
PPSM1
PPSM0
0
0
0
0
RDRM7
RDRM6
RDRM5
RDRM4
RDRM3
PERM7
PERM6
PERM5
PERM4
PERM3
0
0
PPSM7
PPSM6
PPSM5
PPSM4
PPSM3
0
0
0
0
0
0
0
0
WOMM7 WOMM6 WOMM5 WOMM4
0
0
0
0
70
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Device User Guide — 9S12E128DGV1/D V01.04
$0240 - $027F
Freescale Semiconductor, Inc...
$0258
PTP
$0259
PTIP
$025A
DDRP
$025B
RDRP
$025C
PERP
$025D
PPSP
$025E
Reserved
$025F
Reserved
$0260
PTQ
$0261
PTIQ
$0262
DDRQ
$0263
RDRQ
PIM (Port Interface Module)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
0
0
0
0
0
0
0
0
0
PTP5
PTP4
PTP3
PTP2
PTP1
PTP0
PTIP5
PTIP4
PTIP3
PTIP2
PTIP1
PTIP0
DDRP5
DDRP4
DDRP3
DDRP2
DDRP1
DDRP0
RDRP5
RDRP4
RDRP3
RDRP2
RDRP1
RDRP0
PERP5
PERP4
PERP3
PERP2
PERP1
PERP0
PPSP5
PPSP4
PPSP3
PPSP2
PPSP1
PPSP0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PTQ6
PTQ5
PTQ4
PTQ3
PTQ2
PTQ1
PTQ0
PTIQ6
PTIQ5
PTIQ4
PTIQ3
PTIQ2
PTIQ1
PTIQ0
DDRQ6
DDRQ5
DDRQ4
DDRQ3
DDRQ2
DDRQ1
DDRQ0
RDRQ6
RDRQ5
RDRQ4
RDRQ3
RDRQ2
RDRQ1
RDRQ0
0
0
0
0
71
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
$0240 - $027F
Freescale Semiconductor, Inc...
$0264
PERQ
$0265
PPSQ
$0266
Reserved
$0267
Reserved
$0268
PTU
$0269
PTIU
$026A
DDRU
$026B
RDRU
$026C
PERU
$026D
PPSU
$026E
MODRR
$026F
Reserved
PIM (Port Interface Module)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
0
PERQ6
PERQ5
PERQ4
PERQ3
PERQ2
PERQ1
PERQ0
PPSQ6
PPSQ5
PPSQ4
PPSQ3
PPSQ2
PPSQ1
PPSQ0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PTU7
PTU6
PTU5
PTU4
PTU3
PTU2
PTU1
PTU0
PTIU7
PTIU6
PTIU5
PTIU4
PTIU3
PTIU2
PTIU1
PTIU0
DDRU7
DDRU6
DDRU5
DDRU4
DDRU3
DDRU2
DDRU1
DDRU0
RDRU7
RDRU6
RDRU5
RDRU4
RDRU3
RDRU2
RDRU1
RDRU0
PERU7
PERU6
PERU5
PERU4
PERU3
PERU2
PERU1
PERU0
PPSU7
PPSU6
PPSU5
PPSU4
PPSU3
PPSU2
PPSU1
PPSU0
0
0
0
0
0
MODRR3 MODRR2 MODRR1 MODRR0
0
0
0
0
0
72
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0
0
0
Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
Freescale Semiconductor, Inc...
$0240 - $027F
$0270
PTAD(H)
$0271
PTAD(L)
$0272
PTIAD(H)
$0273
PTIAD(L)
$0274
DDRAD(H)
$0275
DDRAD(L)
$0276
RDRAD(H)
$0277
RDRAD(L)
$0278
PERAD(H)
$0279
PERAD(L)
$027A
PPSAD(H)
$027B
PPSAD(L)
$027C
PIEAD(H)
PIM (Port Interface Module)
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read
:
Write
:
Read:
Write:
PTAD15
PTAD14
PTAD13
PTAD12
PTAD11
PTAD10
PTAD9
PTAD8
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
PTIAD15 PTIAD14 PTIAD13 PTIAD12 PTIAD11 PTIAD10
PTIAD9
PTIAD8
PTIAD7
PTIAD6
PTIAD5
PTIAD4
PTIAD3
PTIAD2
PTIAD1
PTIAD0
DDRAD15
DDRAD14
DDRAD13
DDRAD12
DDRAD11
DDRAD10
DDRAD9
DDRAD8
Read
:
DDRAD7 DDRAD6 DDRAD5 DDRAD4 DDRAD3 DDRAD2 DDRAD1 DDRAD0
Write
:
Read
:
RDRAD15
RDRAD14
RDRAD13
RDRAD12
RDRAD11
RDRAD10
RDRAD9
RDRAD8
Write
:
Read
:
RDRAD7 RDRAD6 RDRAD5 RDRAD4 RDRAD3 RDRAD2 RDRAD1 RDRAD0
Write
:
Read
:
PERAD15
PERAD14
PERAD13
PERAD12
PERAD11
PERAD10
PERAD9
PERAD8
Write
:
Read
:
PERAD7 PERAD6 PERAD5 PERAD4 PERAD3 PERAD2 PERAD1 PERAD0
Write
:
Read:
Write:
PPSAD15
PPSAD14
PPSAD13
PPSAD12
PPSAD11
PPSAD10
PPSAD9
PPSAD8
Read
:
PPSAD7 PPSAD6 PPSAD5 PPSAD4 PPSAD3 PPSAD2 PPSAD1 PPSAD0
Write
:
Read
:
PIEAD15 PIEAD14 PIEAD13 PIEAD12 PIEAD11 PIEAD10 PIEAD9 PIEAD8
Write
:
73
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Freescale Semiconductor, Inc.
Device User Guide — 9S12E128DGV1/D V01.04
Freescale Semiconductor, Inc...
$0240 - $027F
$027D
PIEAD(L)
$027E
PIFAD(H)
$027F
PIFAD(L)
PIM (Port Interface Module)
Read
:
PIEAD7 PIEAD6 PIEAD5 PIEAD4 PIEAD3 PIEAD2 PIEAD1
Write
:
Read
:
PIFAD15 PIFAD14 PIFAD13 PIFAD12 PIFAD11 PIFAD10 PIFAD9
Write
:
Read
:
PIFAD7 PIFAD6 PIFAD5 PIFAD4 PIFAD3 PIFAD2 PIFAD1
Write
:
$0280 - $03FF
Addres
s
PIEAD0
PIFAD8
PIFAD0
Reserved space
Name
Read
:
Reserved
Write
:
Read
$0300
:
Unimplement
ed
Write
$03FF
:
$0280
- $2FF
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1.7 Part ID Assignments
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses $001A and $001B after
reset. The read-only value is a unique part ID for each revision of the chip. Table 1-2 shows the assigned
part ID numbers.
Table 1-2 Assigned Part ID Numbers
Device
Mask Set Number
Part ID1
MC9S12E256
TBD
$5000
MC9S12E128
2L15P
$5102
MC9S12E64
2L15P
$5200
MC9S12E32
TBD
$5300
NOTES:
1. The coding is as follows:
Bit 15-12: Major family identifier
Bit 11-8: Minor family identifier
Bit 7-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor - non full - mask set revision
74
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Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C
and $001D after reset). Table 1-3 shows the read-only values of these registers. Refer to HCS12 Module
Mapping Control (MMC) Block Guide for further details.
Freescale Semiconductor, Inc...
Table 1-3 Memory size registers
Device
Register name
Value
MC9S12E32
MEMSIZ0
$00
MC9S12E32
MEMSIZ1
$80
MC9S12E64
MEMSIZ0
$03
MC9S12E64
MEMSIZ1
$80
MC9S12E128
MEMSIZ0
$03
MC9S12E128
MEMSIZ1
$80
MC9S12E256
MEMSIZ0
$07
MC9S12E256
MEMSIZ1
$81
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Device User Guide — 9S12E128DGV1/D V01.04
Section 2 Signal Description
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
MC9S12E-Family
112LQFP
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
PM3
RXD2/PM4
TXD2/PM5
SDA/PM6
SCL/PM7
FAULT0/PQ0
FAULT1/PQ1
FAULT2/PQ2
FAULT3/PQ3
ADDR0/DATA0/PB0
ADDR1/DATA1/PB1
ADDR2/DATA2/PB2
ADDR3/DATA3/PB3
VDDX
VSSX
ADDR4/DATA4/PB4
ADDR5/DATA5/PB5
ADDR6/DATA6/PB6
ADDR7/DATA7/PB7
IS0/PQ4
IS1/PQ5
IS2/PQ6
MODC/TAGHI/BKGD
IOC04/PT0
IOC05/PT1
IOC06/PT2
IOC07/PT3
IOC14/PT4
VRH
VDDA
PAD07/AN07/KWAD07
PAD06/AN06/KWAD06
PAD05/AN05/KWAD05
PAD04/AN04/KWAD04
PAD03/AN03/KWAD03
PAD02/AN02/KWAD02
PAD01/AN01/KWAD01
PAD00/AN00/KWAD00
PA7/ADDR15/DATA15
PA6/ADDR14/DATA14
PA5/ADDR13/DATA13
PA4/ADDR12/DATA12
VSS2
VDD2
PA3/ADDR11/DATA11
PA2/ADDR10/DATA10
PA1/ADDR9/DATA9
PA0/ADDR8/DATA8
PS7/SS
PS6/SCK
PS5/MOSI
PS4/MISO
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
IOC15/PT5
IOC16/PT6
IOC17/PT7
PW10/IOC24/PU0
PW11/IOC25/PU1
PW14/PU4
PW15/PU5
XCLKS/NOACC/PE7
MODB/IPIPE1/PE6
MODA/IPIPE0/PE5
ECLK/PE4
VSSR
VDDR
RESET
VDDPLL
XFC
VSSPLL
EXTAL
XTAL
TEST
PU6
PU7
PW12/IOC26/PU2
PW13/IOC27PU3
LSTRB/TAGLO/PE3
R/W/PE2
IRQ/PE1
XIRQ/PE0
Freescale Semiconductor, Inc...
PP0/PW00
PP1/PW01
PP2/PW02
PP3/PW03
PP4/PW04
PP5/PW05
PK7/ECS/ROMCTL
PK6/XCS
PK5/XADDR19
PK4/XADDR18
VDD1
VSS1
PK3/XADDR17
PK2/XADDR16
PK1/XADDR15
PK0/XADDR14
PM1/DA1
PM0/DA0
PAD15/AN15/KWAD15
PAD14/AN14/KWAD14
PAD13/AN13/KWAD13
PAD12/AN12/KWAD12
PAD11/AN11/KWAD11
PAD10/AN10/KWAD10
PAD09/AN09/KWAD09
PAD08/AN08/KWAD08
VSSA
VRL
2.1 Device Pinout
Signals shown in Bold are not available on the 80 Pin Package
Figure 2-1 Pin assignments 112 LQFP for MC9S12E-Family
76
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80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
MC9S12E-Family
80 QFP
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
VRH
VDDA
PAD07/AN07/KWAD07
PAD06/AN06/KWAD06
PAD05/AN05/KWAD05
PAD04/AN04/KWAD04
PAD03/AN03/KWAD03
PAD02/AN02/KWAD02
PAD01/AN01/KWAD01
PAD00/AN00/KWAD00
VSS2
VDD2
PS7/SS
PS6/SCK
PS5/MOSI
PS4/MISO
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
PM3
RXD2/PM4
TXD2/PM5
SDA/PM6
SCL/PM7
FAULT0/PQ0
FAULT1/PQ1
FAULT2/PQ2
FAULT3/PQ3
VDDX
VSSX
IS0/PQ4
IS1/PQ5
IS2/PQ6
MODC/TAGHI/BKGD
IOC04/PT0
IOC05/PT1
IOC06/PT2
IOC07/PT3
IOC14/PT4
IOC15/PT5
IOC16/PT6
IOC17/PT7
PW10/IOC24/PU0
PW11/IOC25/PU1
XCLKS/NOACC/PE7
ECLK/PE4
VSSR
VDDR
RESET
VDDPLL
XFC
VSSPLL
EXTAL
XTAL
TEST
PW12/IOC26/PU2
PW13/IOC27/PU3
IRQ/PE1
XIRQ/PE0
Freescale Semiconductor, Inc...
PP0/PW00
PP1/PW01
PP2/PW02
PP3/PW03
PP4/PW04
PP5/PW05
VDD1
VSS1
PM1/DA1
PM0/DA0
PAD15/AN15/KWAD15
PAD14/AN14/KWAD14
PAD13/AN13/KWAD13
PAD12/AN12/KWAD12
PAD11/AN11/KWAD11
PAD10/AN10/KWAD10
PAD09/AN09/KWAD09
PAD08/AN08/KWAD08
VSSA
VRL
Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
Figure 2-2 Pin assignments in 80 QFP for MC9S12E-Family
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Device User Guide — 9S12E128DGV1/D V01.04
2.2 Signal Properties Summary
Freescale Semiconductor, Inc...
Table 2-1 Signal Properties
Pin Name Power
Function 3 Domain
Internal Pull
Resistor
Pin Name
Function 1
Pin Name
Function 2
EXTAL
—
—
VDDPLL
NA
NA
XTAL
—
—
VDDPLL
NA
NA
XFC
—
—
VDDPLL
NA
NA
CTRL
Description
Reset State
Oscillator pins
PLL loop filter pin
RESET
—
—
VDDX
None
None
BKGD
MODC
TAGHI
VDDX
Up
Up
Background debug, mode pin, tag signal high
TEST
VPP
—
NA
NA
NA
Test pin only
Disabled
Port AD I/O Pins, ATD inputs, keypad Wake-up
External reset pin
PAD[15:0]
AN[15:0]
KWAD[15:0}
VDDX
PERAD/
PPSAD
PA[7:0]
ADDR[15:8]/
DATA[15:8]
—
VDDX
PUCR
Disabled
Port A I/O pin, multiplexed address/data
PB[7:0]
ADDR[7:0]/
DATA[7:0]
—
VDDX
PUCR
Disabled
Port B I/O pin, multiplexed address/data
PE7
NOACC
XCLKS
VDDX
Input
Input
Port E I/O pin, access, clock select
PE6
IPIPE1
MODB
VDDX
While RESET is low:
Down
PE5
IPIPE0
MODA
VDDX
While RESET is low:
Down
PE4
ECLK
—
VDDX
PUCR
PE3
LSTRB
TAGLO
VDDX
PUCR
Mode Dep(1) Port E I/O pin, low strobe, tag signal low
PE2
R/W
—
VDDX
PUCR
Mode Dep(1) Port E I/O pin, R/W in expanded modes
PE1
IRQ
—
VDDX
PUCR
PE0
XIRQ
—
VDDX
PK[7]
ECS
ROMCTL
VDDX
Mode Dep1
Port E I/O pin, pipe status, mode selection
Port E I/O pin, pipe status, mode selection
Port E I/O pin, bus clock output
Up
Port E input, external interrupt pin
PUCR
Up
Port E input, non-maskable interrupt pin
PUCR
Up
Port K I/O Pin, Emulation Chip Select
PK[6]
XCS
—
VDDX
PUCR
Up
Port K I/O Pin, External Chip Select
PK[5:0]
XADDR[19:14]
—
VDDX
PUCR
Up
Port K I/O Pins, Extended Addresses
PM7
SCL
—
VDDX
PERM/
PPSM
Up
Port M I/O Pin, IIC SCL signal
PM6
SDA
—
VDDX
PERM/
PPSM
Up
Port M I/O Pin, IIC SDA signal
PM5
TXD2
—
VDDX
PERM/
PPSM
Up
Port M I/O Pin, SCI2 transmit signal
PM4
RXD2
—
VDDX
PERM/
PPSM
Up
Port M I/O Pin, SCI2 receive signal
PM3
—
—
VDDX
PERM/
PPSM
Disabled
Port M I/O Pin, IIC SDA signal
PM1
DAO1
—
VDDX
PERM/
PPSM
Disabled
Port M I/O Pin, DAC1 output
PM0
DAO0
—
VDDX
PERM/
PPSM
Disabled
Port M I/O Pin, DAC0 output
PP[5:0]
PW0[5:0]
—
VDDX
PERP/
PPSP
Disabled
Port P I/O Pins, PWM output
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Pin Name
Function 1
Pin Name
Function 2
Pin Name Power
Function 3 Domain
PQ[6:4]
IS[6:4]
—
PQ[3:0]
FAULT[3:0]
PS7
Internal Pull
Resistor
Description
CTRL
Reset State
VDDX
PERQ/
PPSQ
Disabled
Port Q I/O Pins, IS[6:4] input
—
VDDX
PERQ/
PPSQ
Disabled
Port Q I/O Pins, Fault[3:0] input
SS
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SPI SS signal
PS6
SCK
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SPI SCK signal
PS5
MOSI
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SPI MOSI signal
PS4
MISO
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SPI MISO signal
PS3
TXD1
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SCI1 transmit signal
PS2
RXD1
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SCI1 receive signal
PS1
TXD0
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SCI0 transmit signal
PS0
RXD0
—
VDDX
PERS/
PPSS
Up
Port S I/O Pin, SCI0 receive signal
PT[7:4]
IOC1[7:4]
—
VDDX
PERT/
PPST
Disabled
Port T I/O Pins, timer (TIM1)
PT[3:0]
IOC0[7:4]
—
VDDX
PERT/
PPST
Disabled
Port T I/O Pins, timer (TIM0)
PU[7:6]
—
—
VDDX
PERU/
PPSU
Disabled
Port U I/O Pins
PU[5:4]
PW1[5:4]
—
VDDX
PERU/
PPSU
Disabled
Port U I/O Pins, PWM outputs
PU[3:0]
IOC2[7:4]
PW1[3:0]
VDDX
PERU/
PPSU
Disabled
Port U I/O Pins, timer (TIM2), PWM outputs
NOTES:
1. The Port E output buffer enable signal control at reset is determined by the PEAR register and is mode dependent. For example,
in special test mode RDWE = LSTRE = 1 which enables the PE[3:2] output buffers and disables the pull-ups. Refer to the S12
MEBI Block Guide for PEAR register details.
NOTE:
Signals shown in bold are not available in the 80 pin package.
NOTE:
If the port pins are not bonded out in the chosen package the user should initialize the
registers to be inputs with enabled pull resistance to avoid excess current consumption.
This applies to the following pins:
(80QFP): Port A[7:0], Port B[7:0], Port E[6,5,3,2], Port K[7:0], Port U[7:4]
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2.3 Detailed Signal Descriptions
2.3.1 EXTAL, XTAL — Oscillator Pins
EXTAL and XTAL are the external clock and crystal driver pins. On reset all the device clocks are derived
from the EXTAL input frequency. XTAL is the crystal output.
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2.3.2 RESET — External Reset Pin
RESET is an active low bidirectional control signal that acts as an input to initialize the MCU to a known
start-up state. It also acts as an open-drain output to indicate that an internal failure has been detected in
either the clock monitor or COP watchdog circuit. External circuitry connected to the RESET pin should
not include a large capacitance that would interfere with the ability of this signal to rise to a valid logic one
within 32 ECLK cycles after the low drive is released. Upon detection of any reset, an internal circuit
drives the RESET pin low and a clocked reset sequence controls when the MCU can begin normal
processing The RESET pin includes an internal pull up device.
2.3.3 TEST — Test Pin
The TEST pin is reserved for test and must be tied to VSS in all applications.
2.3.4 XFC — PLL Loop Filter Pin
Dedicated pin used to create the PLL loop filter. See appendix B.4.3.1and the CRG Block Guide for more
detailed information.
2.3.5 BKGD / TAGHI / MODC — Background Debug, Tag High & Mode Pin
The BKGD / TAGHI / MODC pin is used as a pseudo-open-drain pin for the background debug
communication. It is used as a MCU operating mode select pin during reset. The state of this pin is latched
to the MODC bit at the rising edge of RESET. In MCU expanded modes of operation, when instruction
tagging is on, an input low on this pin during the falling edge of E-clock tags the high half of the instruction
word being read into the instruction queue. This pin always has an internal pull up.
2.3.6 PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA[7:0] are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus. PA[7:0] pins are not available in the 80 pin package
version.
2.3.7 PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB[7:0] are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus. PB[7:0] pins are not available in the 80 pin package
version.
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2.3.8 PE7 / NOACC / XCLKS — Port E I/O Pin 7
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PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC
signal, when enabled, is used to indicate that the current bus cycle is an unused or “free cycle”. This signal
will assert when the CPU is not using the bus. The XCLKS is an input signal which controls whether a
crystal in combination with the internal Colpitts (low power) oscillator is used or whether Pierce
oscillator/external clock circuitry is used. The state of this pin is latched at the rising edge of RESET. If
the input is a logic low the EXTAL pin is configured for an external clock drive or a Pierce Oscillator. If
the input is a logic high a Colpitts oscillator circuit is configured on EXTAL and XTAL. Since this pin is
an input with a pull-up device during reset, if the pin is left floating, the default configuration is a Colpitts
oscillator circuit on EXTAL and XTAL.
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Figure 2-3 Colpitts Oscillator Connections (PE7=1)
EXTAL
CDC *
MCU
C1
Crystal or
ceramic resonator
XTAL
C2
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VSSPLL
* Due to the nature of a translated ground Colpitts oscillator a
DC voltage bias is applied to the crystal
.Please contact the crystal manufacturer for crystal DC
Figure 2-4 Pierce Oscillator Connections (PE7=0)
EXTAL
C1
MCU
XTAL
RB
RS*
Crystal or
ceramic resonator
C2
VSSPLL
* Rs can be zero (shorted) when use with higher frequency crystals.
Refer to manufacturer’s data.
2.3.9 PE6 / MODB / IPIPE1 — Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODB bit at the rising edge of RESET. This pin is shared with the
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instruction queue tracking signal IPIPE1. This pin is an input with a pull-down device which is only active
when RESET is low. PE6 is not available in the 80 pin package version.
2.3.10 PE5 / MODA / IPIPE0 — Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODA bit at the rising edge of RESET. This pin is shared with the
instruction queue tracking signal IPIPE0. This pin is an input with a pull-down device which is only active
when RESET is low. PE5 is not available in the 80 pin package version.
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2.3.11 PE4 / ECLK— Port E I/O Pin 4 / E-Clock Output
PE4 is a general purpose input or output pin. In Normal Single Chip mode PE4 is configured with an active
pull-up while in reset and immediately out of reset. The pullup can be turned off by clearing PUPEE in the
PUCR register. In all modes except Normal Single Chip Mode, the PE4 pin is initially configured as the
output connection for the internal bus clock(ECLK). ECLK is used as a timing reference and to
demultiplex the address and data in expanded modes. The ECLK frequency is equal to 1/2 the crystal
frequency out of reset. The ECLK output function depends upon the settings of the NECLK bit in the
PEAR register, the IVIS bit in the MODE register and the ESTR bit in the EBICTL register. All clocks,
including the ECLK, are halted when the MCU is in STOP mode. It is possible to configure the MCU to
interface to slow external memory. ECLK can be stretched for such accesses. The PE4 pin is initially
configured as ECLK output with stretch in all expanded modes. Reference the MISC register
(EXSTR[1:0] bits) for more information. In normal expanded narrow mode, the ECLK is available for use
in external select decode logic or as a constant speed clock for use in the external application system.
2.3.12 PE3 / LSTRB / TAGLO — Port E I/O Pin 3 / Low-Byte Strobe (LSTRB)
PE3 can be used as a general-purpose I/O in all modes and is an input with an active pull-up out of reset.
The pullup can be turned off by clearing PUPEE in the PUCR register. PE3 can also be configured as a
Low-Byte Strobe (LSTRB). The LSTRB signal is used in write operations, so external low byte writes will
not be possible until this function is enabled. LSTRB can be enabled by setting the LSTRE bit in the PEAR
register. In Expanded Wide and Emulation Narrow modes, and when BDM tagging is enabled, the LSTRB
function is multiplexed with the TAGLO function. When enabled a logic zero on the TAGLO pin at the
falling edge of ECLK will tag the low byte of an instruction word being read into the instruction queue.
PE3 is not available in the 80 pin package version.
2.3.13 PE2 / R/W — Port E I/O Pin 2 / Read/Write
PE2 can be used as a general-purpose I/O in all modes and is configured an input with an active pull-up
out of reset. The pullup can be turned off by clearing PUPEE in the PUCR register. If the read/write
function is required it should be enabled by setting the RDWE bit in the PEAR register. External writes
will not be possible until the read/write function is enabled. The PE2 pin is not available in the 80 pin
package version.
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2.3.14 PE1 / IRQ — Port E input Pin 1 / Maskable Interrupt Pin
PE1 is always an input and can always be read. The PE1 pin is also the IRQ input used for requesting an
asynchronous interrupt to the MCU. During reset, the I bit in the condition code register (CCR) is set and
any IRQ interrupt is masked until software enables it by clearing the I bit. The IRQ is software
programmable to either falling edge-sensitive triggering or level-sensitive triggering based on the setting
of the IRQE bit in the IRQCR register. The IRQ is always enabled and configured to level-sensitive
triggering out of reset. It can be disabled by clearing IRQEN bit in the IRQCR register. There is an active
pull-up on this pin while in reset and immediately out of reset. The pullup can be turned off by clearing
PUPEE in the PUCR register.
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2.3.15 PE0 / XIRQ — Port E input Pin 0 / Non Maskable Interrupt Pin
PE0 is always an input and can always be read. The PE0 pin is also the XIRQ input for requesting a
nonmaskable asynchronous interrupt to the MCU. During reset, the X bit in the condition code register
(CCR) is set and any XIRQ interrupt is masked until MCU software enables it by clearing the X bit.
Because the XIRQ input is level sensitive triggered, it can be connected to a multiple-source wired-OR
network. There is an active pull-up on this pin while in reset and immediately out of reset. The pullup can
be turned off by clearing PUPEE in the PUCR register.
2.3.16 PK7 / ECS / ROMCTL — Port K I/O Pin 7
PK7 is a general purpose input or output pin. During MCU expanded modes of operation, when the EMK
bit in the MODE register is set to 1, this pin is used as the emulation chip select output (ECS). In expanded
modes the PK7 pin can be used to determine the reset state of the ROMON bit in the MISC register. At
the rising edge of RESET, the state of the PK7 pin is latched to the ROMON bit. There is an active pull-up
on this pin while in reset and immediately out of reset. The pullup can be turned off by clearing PUPKE
in the PUCR register. Refer to the HCS12 MEBI Block Guide for further details. PK7 is not available in
the 80 pin package version.
2.3.17 PK6 / XCS — Port K I/O Pin 6
PK6 is a general purpose input or output pin. During MCU expanded modes of operation, when the EMK
bit in the MODE register is set to 1, this pin is used as an external chip select signal for most external
accesses that are not selected by ECS. There is an active pull-up on this pin while in reset and immediately
out of reset. The pullup can be turned off by clearing PUPKE in the PUCR register. Refer to the HCS12
MEBI Block Guide for further details. PK6 is not available in the 80 pin package version.
2.3.18 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0]
PK[5:0] are general purpose input or output pins. In MCU expanded modes of operation, when the EMK
bit in the MODE register is set to 1, PK[5:0] provide the expanded address XADDR[19:14] for the external
bus. There are active pull-ups on PK[5:0] pins while in reset and immediately out of reset. The pullup can
be turned off by clearing PUPKE in the PUCR register. Refer to the HCS12 MEBI Block Guide for further
details. PK[5:0] are not available in the 80 pin package version.
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2.3.19 PAD[15:0] / AN[15:0] / KWAD[15:0] — Port AD I/O Pins [15:0]
PAD[15:0] are the analog inputs for the analog to digital converter (ADC). They can also be configured
as general purpose digital input or output pin. When enabled as digital inputs or outputs, the PAD[15:0]
can also be configured as Keypad Wake-up pins (KWU) and generate interrupts causing the MCU to exit
STOP or WAIT mode. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and the
ATD_10B16C Block Guide for information about pin configurations.
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2.3.20 PM7 / SCL — Port M I/O Pin 7
PM7 is a general purpose input or output pin. When the IIC module is enabled it becomes the serial clock
line (SCL) for the IIC module (IIC). While in reset and immediately out of reset the PM7 pin is configured
as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and
the IIC Block Guide for information about pin configurations.
2.3.21 PM6 / SDA — Port M I/O Pin 6
PM6 is a general purpose input or output pin. When the IIC module is enabled it becomes the Serial Data
Line (SDL) for the IIC module (IIC). While in reset and immediately out of reset the PM6 pin is configured
as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and
the IIC Block Guide for information about pin configurations.
2.3.22 PM5 / TXD2 — Port M I/O Pin 5
PM5 is a general purpose input or output. When the Serial Communications Interface 2 (SCI2) transmitter
is enabled the PM5 pin is configured as the transmit pin TXD2 of SCI2. While in reset and immediately
out of reset the PM5 pin is configured as a high impedance input pin. Consult the Port Integration Module
(PIM) PIM_9E128 Block Guide and the SCI Block Guide for information about pin configurations.
2.3.23 PM4 / RXD2 — Port M I/O Pin 4
PM4 is a general purpose input or output. When the Serial Communications Interface 2 (SCI2) receiver is
enabled the PM4 pin is configured as the receive pin RXD2 of SCI2. While in reset and immediately out
of reset the PM4 pin is configured as a high impedance input pin. Consult the Port Integration Module
(PIM) PIM_9E128 Block Guide and the SCI Block Guide for information about pin configurations.
2.3.24 PM3 — Port M I/O Pin 3
PM3 is a general purpose input or output pin. While in reset and immediately out of reset the PM3 pin is
configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 Block
Guide for information about pin configurations.
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2.3.25 PM1 / DAO1 — Port M I/O Pin 1
PM1 is a general purpose input or output pin. When the Digital to Analog module 1 (DAC1) is enabled
the PM1 pin is configured as the analog output DA01 of DAC1. While in reset and immediately out of
reset the PM1 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM)
PIM_9E128 Block Guide and the DAC_8B1C Block Guide for information about pin configurations.
2.3.26 PM0 / DAO2 — Port M I/O Pin 0
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PM0 is a general purpose input or output pin. When the Digital to Analog module 2 (DAC2) is enabled
the PM0 pin is configured as the analog output DA02 of DAC2. While in reset and immediately out of
reset the PM0 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM)
PIM_9E128 Block Guide and the DAC_8B1C Block Guide for information about pin configurations.
2.3.27 PP[5:0] / PW0[5:0] — Port P I/O Pins [5:0]
PP[5:0] are general purpose input or output pins. When the Pulse width Modulator with Fault protection
(PMF) is enabled the PP[5:0] output pins, as a whole or as pairs, can be configured as PW0[5:0] outputs.
While in reset and immediately out of reset the PP[5:0] pins are configured as a high impedance input pins.
Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and the PMF_15B6C Block Guide
for information about pin configurations.
2.3.28 PQ[6:4] / IS[2:0] — Port Q I/O Pins [6:4]
PQ[6:4] are general purpose input or output pins. When enabled in the Pulse width Modulator with Fault
protection module (PMF), the PQ[6:4] pins become the current status input pins, IS[2:0], for top/bottom
pulse width correction. While in reset and immediately out of reset PP[5:0] pins are configured as a high
impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and the
PMF_15B6C Block Guide for information about pin configurations.
2.3.29 PQ[3:0] / FAULT[3:0] — Port Q I/O Pins [3:0]
PQ[3:0] are general purpose input or output pins. When enabled in the Pulse width Modulator with Fault
protection module (PMF), the PQ[3:0] pins become the Fault protection inputs pins, FAULT[3:0], of the
PMF. While in reset and immediately out of reset the PQ[3:0] pins are configured as a high impedance
input pins. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and the PMF_15B6C
Block Guide for information about pin configurations.
2.3.30 PS7 / SS — Port S I/O Pin 7
PS7 is a general purpose input or output. When the Serial Peripheral Interface (SPI) is enabled PS7
becomes the slave select pin SS. While in reset and immediately out of reset the PS7 pin is configured as
a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and the
SPI Block Guide for information about pin configurations.
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2.3.31 PS6 / SCK — Port S I/O Pin 6
PS6 is a general purpose input or output pin. When the Serial Peripheral Interface (SPI) is enabled PS6
becomes the serial clock pin, SCK. While in reset and immediately out of reset the PS6 pin is configured
as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide and
the SPI Block Guide for information about pin configurations.
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2.3.32 PS5 / MOSI — Port S I/O Pin 5
PS5 is a general purpose input or output pin. When the Serial Peripheral Interface (SPI) is enabled PS5 is
the master output (during master mode) or slave input (during slave mode) pin. While in reset and
immediately out of reset the PS5 pin is configured as a high impedance input pin Consult the Port
Integration Module (PIM) PIM_9E128 Block Guide and the SPI Block Guide for information about pin
configurations.
2.3.33 PS4 / MISO — Port S I/O Pin 4
PS4 is a general purpose input or output pin. When the Serial Peripheral Interface (SPI) is enabled PS4 is
the master input (during master mode) or slave output (during slave mode) pin. While in reset and
immediately out of reset the PS4 pin is configured as a high impedance input pin. Consult the Port
Integration Module (PIM) PIM_9E128 Block Guide and the SPI Block Guide for information about pin
configurations.
2.3.34 PS3 / TXD1 — Port S I/O Pin 3
PS3 is a general purpose input or output. When the Serial Communications Interface 1 (SCI1) transmitter
is enabled the PS3 pin is configured as the transmit pin, TXD1, of SCI1. While in reset and immediately
out of reset the PS3 pin is configured as a high impedance input pin. Consult the Port Integration Module
(PIM) PIM_9E128 Block Guide and the SCI Block Guide for information about pin configurations.
2.3.35 PS2 / RXD1 — Port S I/O Pin 2
PS2 is a general purpose input or output. When the Serial Communications Interface 1 (SCI1) receiver is
enabled the PS2 pin is configured as the receive pin RXD1 of SCI1. While in reset and immediately out
of reset the PS2 pin is configured as a high impedance input pin. Consult the Port Integration Module
(PIM) PIM_9E128 Block Guide and the SCI Block Guide for information about pin configurations.
2.3.36 PS1 / TXD0 — Port S I/O Pin 1
PS1 is a general purpose input or output. When the Serial Communications Interface 0 (SCI0) transmitter
is enabled the PS1 pin is configured as the transmit pin, TXD0, of SCI0. While in reset and immediately
out of reset the PS1 pin is configured as a high impedance input pin. Consult the Port Integration Module
(PIM) PIM_9E128 Block Guide and the SCI Block Guide for information about pin configurations.
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2.3.37 PS0 / RXD0 — Port S I/O Pin 0
PS0 is a general purpose input or output. When the Serial Communications Interface 0 (SCI0) receiver is
enabled the PS0 pin is configured as the receive pin RXD0 of SCI0. While in reset and immediately out
of reset the PS0 pin is configured as a high impedance input pin. Consult the Port Integration Module
(PIM) PIM_9E128 Block Guide and the SCI Block Guide for information about pin configurations.
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2.3.38 PT[7:4] / IOC1[7:4]— Port T I/O Pins [7:4]
PT[7:4] are general purpose input or output pins. When the Timer system 1 (TIM1) is enabled they can
also be configured as the TIM1 input capture or output compare pins IOC1[7-4]. While in reset and
immediately out of reset the PT[7:4] pins are configured as a high impedance input pins. Consult the Port
Integration Module (PIM) PIM_9E128 Block Guide and the TIM_16B4C Block Guide for information
about pin configurations.
2.3.39 PT[3:0] / IOC0[7:4]— Port T I/O Pins [3:0]
PT[3:0] are general purpose input or output pins. When the Timer system 0 (TIM0) is enabled they can
also be configured as the TIM0 input capture or output compare pins IOC0[7-4]. While in reset and
immediately out of reset the PT[3:0] pins are configured as a high impedance input pins. Consult the Port
Integration Module (PIM) PIM_9E128 Block Guide and the TIM_16B4C Block Guide for information
about pin configurations.
2.3.40 PU[7:6] — Port U I/O Pins [7:6]
PU[7:6] are general purpose input or output pins. While in reset and immediately out of reset the PU[7:6]
pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM)
PIM_9E128 for information about pin configurations. PU[7:6] are not available in the 80 pin package
version.
2.3.41 PU[5:4] / PW1[5:4] — Port U I/O Pins [5:4]
PU[5:4] are general purpose input or output pins. When the Pulse Width Modulator (PWM) is enabled the
PU[5:4] output pins, individually or as a pair, can be configured as PW1[5:4] outputs. While in reset and
immediately out of reset the PU[5:4] pins are configured as a high impedance input pins. Consult the Port
Integration Module (PIM) PIM_9E128 Block Guide and the PWM_8B6C Block Guide for information
about pin configurations. PU[5:4] are not available in the 80 pin package version.
2.3.42 PU[3:0] / IOC2[7:4]/PW1[3:0] — Port U I/O Pins [3:0]
PU[3:0] are general purpose input or output pins. When the Timer system 2 (TIM2) is enabled they can
also be configured as the TIM2 input capture or output compare pins IOC2[7-4]. When the Pulse Width
Modulator (PWM) is enabled the PU[3:0] output pins, individually or as a pair, can be configured as
PW1[3:0] outputs. The MODRR register in the Port Integration Module determines if the TIM2 or PWM
function is selected. While in reset and immediately out of reset the PU[3:0] pins are configured as a high
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impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 Block Guide, TIM_16B4C
Block Guide, and the PWM_8B6C Block Guide for information about pin configurations.
2.4 Power Supply Pins
2.4.1 VDDX,VSSX — Power & Ground Pins for I/O Drivers
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External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are
loaded.
2.4.2 VDDR, VSSR — Power Supply Pins for I/O Drivers & for Internal Voltage
Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Bypass requirements
depend on how heavily the MCU pins are loaded.
2.4.3 VDD1, VDD2, VSS1, VSS2 — Power Supply Pins for Internal Logic
Power is supplied to the MCU through VDD and VSS. This 2.5V supply is derived from the internal
voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is turned
off, if VDDR is tied to ground.
2.4.4 VDDA, VSSA — Power Supply Pins for ATD and VREG
VDDA, VSSA are the power supply and ground input pins for the voltage regulator and the analog to
digital converter.
2.4.5 VRH, VRL — ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog to digital converter.
2.4.6 VDDPLL, VSSPLL — Power Supply Pins for PLL
Provides operating voltage and ground for the Oscillator and the Phased-Locked Loop. This allows the
supply voltage to the Oscillator and PLL to be bypassed independently.This 2.5V voltage is generated by
the internal voltage regulator.
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Table 2-2 MC9S12E-Family Power and Ground Connection Summary
NOTE:
Mnemonic
Nominal
Voltage
VDD1
VDD2
2.5 V
VSS1
VSS2
0V
VDDR
3.3/5.0 V
VSSR
0V
VDDX
3.3/5.0 V
VSSX
0V
VDDA
3.3/5.0 V
VSSA
0V
VRH
3.3/5.0 V
VRL
0V
VDDPLL
2.5 V
VSSPLL
0V
Description
Internal power and ground generated by internal regulator. These also
allow an external source to supply the core VDD/VSS voltages and
bypass the internal voltage regulator.
External power and ground, supply to internal voltage regulator.
To disable voltage regulator attach VDDR to VSSR.
External power and ground, supply to pin drivers.
Operating voltage and ground for the analog-to-digital converter, the
reference for the internal voltage regulator and the digital-to-analog
converters, allows the supply voltage to the A/D to be bypassed
independently.
Reference voltage high for the ATD converter, and DAC.
Reference voltage low for the ATD converter.
Provides operating voltage and ground for the Phased-Locked Loop.
This allows the supply voltage to the PLL to be bypassed
independently. Internal power and ground generated by internal
regulator.
All VSS pins must be connected together in the application. Because fast signal
transitions place high, short-duration current demands on the power supply, use
bypass capacitors with high-frequency characteristics and place them as close to
the MCU as possible. Bypass requirements depend on MCU pin load.
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Section 3 System Clock Description
The Clock and Reset Generator provides the internal clock signals for the core and all peripheral modules.
Figure 3-1 shows the clock connections from the CRG to all modules. Consult the CRG Block Guide for
details on clock generation.
HCS12 CORE
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Core Clock
BDM
CPU
MEBI
MMC
INT
DBG
Flash
RAM
ATD
DAC
IIC
EXTAL
PIM
OSC
CRG
PMF
Bus Clock
PWM
Oscillator Clock
XTAL
SCI0, SCI1, SCI2
SPI
TIM0, TIM1, TIM2
VREG
Figure 3-1 Clock Connections
Table 3-1Clock Selection Based on PE7
PE7 = XCLKS
Description
1
Colpitts Oscillator selected
0
Pierce Oscillator/external clock selected
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Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12E-Family. Each mode has an
associated default memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device.
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4.2 Chip Configuration Summary
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA pins during
reset. The MODC, MODB, and MODA bits in the MODE register show the current operating mode and
provide limited mode switching during operation. The states of the MODC, MODB, and MODA pins are
latched into these bits on the rising edge of the reset signal. The ROMCTL signal allows the setting of the
ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the memory map.
ROMON = 1 mean the Flash is visible in the memory map. The state of the ROMCTL pin is latched into
the ROMON bit in the MISC register on the rising edge of the reset signal.
Table 4-1 Mode Selection
BKGD =
MODC
PE6 =
MODB
PE5 =
MODA
PK7 =
ROMCTL
ROMON
Bit
0
0
0
X
1
0
0
1
0
1
1
0
0
1
0
X
0
0
1
1
0
X
1
0
0
1
1
X
1
0
0
1
1
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
Mode Description
Special Single Chip, BDM allowed and ACTIVE. BDM is
allowed in all other modes but a serial command is
required to make BDM active.
Emulation Expanded Narrow, BDM allowed
Special Test (Expanded Wide), BDM allowed
Emulation Expanded Wide, BDM allowed
Normal Single Chip, BDM allowed
Normal Expanded Narrow, BDM allowed
Peripheral; BDM allowed but bus operations would cause
bus conflicts (must not be used)
Normal Expanded Wide, BDM allowed
For further explanation on the modes refer to the HCS12 MEBI Block Guide.
Table 4-2 Clock Selection Based on PE7
PE7 = XCLKS
Description
1
Colpitts Oscillator selected
0
Pierce Oscillator/external clock selected
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4.3 Security
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The device will make available a security feature preventing the unauthorized read and write of the
memory contents. This feature allows:
•
Protection of the contents of FLASH,
•
Operation in single-chip mode,
•
Operation from external memory with internal FLASH disabled.
The user must be reminded that part of the security must lie with the user’s code. An extreme example
would be user’s code that dumps the contents of the internal program. This code would defeat the purpose
of security. At the same time the user may also wish to put a back door in the user’s program. An example
of this is the user downloads a key through the SCI which allows access to a programming routine that
updates parameters.
4.3.1 Securing the Microcontroller
Once the user has programmed the FLASH, the part can be secured by programming the security bits
located in the FLASH module. These non-volatile bits will keep the part secured through resetting the part
and through powering down the part.
The security byte resides in a portion of the Flash array.
Check the Flash Block Guide for more details on the security configuration.
4.3.2 Operation of the Secured Microcontroller
4.3.2.1 Normal Single Chip Mode
This will be the most common usage of the secured part. Everything will appear the same as if the part was
not secured with the exception of BDM operation. The BDM operation will be blocked.
4.3.2.2 Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH will be disabled. BDM operations will be
blocked.
4.3.3 Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH must be erased. This can be done through an
external program in expanded mode.
Once the user has erased the FLASH, the part can be reset into special single chip mode. This invokes a
program that verifies the erasure of the internal FLASH. Once this program completes, the user can erase
and program the FLASH security bits to the unsecured state. This is generally done through the BDM, but
the user could also change to expanded mode (by writing the mode bits through the BDM) and jumping to
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an external program (again through BDM commands). Note that if the part goes through a reset before the
security bits are reprogrammed to the unsecure state, the part will be secured again.
4.4 Low Power Modes
The microcontroller features three main low power modes. Consult the respective Block Guide for
information on the module behavior in Stop, Pseudo Stop, and Wait Mode. An important source of
information about the clock system is the Clock and Reset Generator (CRG) Block Guide.
4.4.1 Stop
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Executing the CPU STOP instruction stops all clocks and the oscillator thus putting the chip in fully static
mode. Wake up from this mode can be done via reset or external interrupts.
4.4.2 Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running
and the Real Time Interrupt (RTI) or Watchdog (COP) sub module can stay active. Other peripherals are
turned off. This mode consumes more current than the full STOP mode, but the wake up time from this
mode is significantly shorter.
4.4.3 Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute
instructions. The internal CPU signals (address and databus) will be fully static. All peripherals stay active.
For further power consumption the peripherals can individually turn off their local clocks.
4.4.4 Run
Although this is not a low power mode, unused peripheral modules should not be enabled in order to save
power.
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Section 5 Resets and Interrupts
5.1 Overview
Consult the Exception Processing section of the CPU12 Reference Manual for information on resets and
interrupts. System resets can be generated through external control of the RESET pin, through the clock
and reset generator module CRG or through the low voltage reset (LVR) generator of the voltage regulator
module. Refer to the CRG and VREG Block Guides for detailed information on reset generation.
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5.2 Vectors
Table 5-1 lists interrupt sources and vectors in default order of priority.
Table 5-1 Interrupt Vector Locations
Interrupt Source
CCR
Mask
Local Enable
HPRIO Value
to Elevate
$FFFE, $FFFF
External Reset, Power On Reset or Low
Voltage Reset (see CRG Flags Register
to determine reset source)
None
None
–
$FFFC, $FFFD
Clock Monitor fail reset
None
COPCTL (CME, FCME)
–
$FFFA, $FFFB
COP failure reset
None
COP rate select
–
$FFF8, $FFF9
Unimplemented instruction trap
None
None
–
$FFF6, $FFF7
SWI
None
None
–
$FFF4, $FFF5
XIRQ
X-Bit
None
–
$FFF2, $FFF3
IRQ
I-Bit
INTCR (IRQEN)
$F2
$FFF0, $FFF1
Real Time Interrupt
I-Bit
CRGINT (RTIE)
$F0
Vector Address
$FFE8 to $FFEF
Reserved
$FFE6, $FFE7
Standard Timer 0 channel 4
I-Bit
TIE (C4I)
$E6
$FFE4, $FFE5
Standard Timer 0 channel 5
I-Bit
TIE (C5I)
$E4
$FFE2, $FFE3
Standard Timer 0 channel 6
I-Bit
TIE (C6I)
$E2
$FFE0, $FFE1
Standard Timer 0 channel 7
I-Bit
TIE (C7I)
$E0
$FFDE, $FFDF
Standard Timer overflow
I-Bit
TSCR2 (TOI)
$DE
$FFDC, $FFDD
Pulse accumulator overflow
I-Bit
PACTL(PAOVI)
$DC
$FFDA, $FFDB
Pulse accumulator input edge
I-Bit
PACTL (PAI)
$DA
$FFD8, $FFD9
SPI
I-Bit
SPICR1 (SPIE, SPTIE)
$D8
$D6
$FFD6, $FFD7
SCI0
I-Bit
SCICR2
(TIE, TCIE, RIE, ILIE)
$FFD4, $FFD5
SCI1
I-Bit
SCICR2
(TIE, TCIE, RIE, ILIE)
$D4
$FFD2, $FFD3
SCI2
I-Bit
SCICR2
(TIE, TCIE, RIE, ILIE)
$D2
$FFD0, $FFD1
ATD
I-Bit
ATDCTL2 (ASCIE)
$D0
$FFCE, $FFCF
Port AD (KWU)
I-Bit
PTADIF (PTADIE)
$CE
$FFC8 to $FFCD
Reserved
$FFC6, $FFC7
CRG PLL lock
I-Bit
PLLCR (LOCKIE)
$C6
$FFC4, $FFC5
CRG Self Clock Mode
I-Bit
PLLCR (SCMIE)
$C4
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$FFC2, $FFC3
Reserved
$FFC0, $FFC1
IIC Bus
I-Bit
$FFBA to $FFBF
$C0
$FFB8, $FFB9
FLASH
I-Bit
FCNFG (CCIE, CBEIE)
$B8
$FFB6, $FFB7
Standard Timer 1 channel 4
I-Bit
TIE (C4I)
$B6
$FFB4, $FFB5
Standard Timer 1 channel 5
I-Bit
TIE (C5I)
$B4
$FFB2, $FFB3
Standard Timer 1 channel 6
I-Bit
TIE (C6I)
$B2
$FFB0, $FFB1
Standard Timer 1 channel 7
I-Bit
TIE (C7I)
$B0
$FFAE, $FFAF
Standard Timer 1 overflow
I-Bit
TSCR2 (TOI)
$AE
$FFAC, $FFAD
Standard Timer 1 Pulse accumulator
overflow
I-Bit
PACTL (PAOVI)
$AC
$FFAA, $FFAB
Standard Timer 1 Pulse accumulator
input edge
I-Bit
PACTL (PAI)
$AA
$FFA8, $FFA9
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IBCR (IBIE)
Reserved
Reserved
$FFA6, $FFA7
Standard Timer 2 channel 4
I-Bit
TIE (C4I)
$A6
$FFA4, $FFA5
Standard Timer 2 channel 5
I-Bit
TIE (C5I)
$A4
$FFA2, $FFA3
Standard Timer 2 channel 6
I-Bit
TIE (C6I)
$A2
$FFA0, $FFA1
Standard Timer 2 channel 7
I-Bit
TIE (C7I)
$A0
$FF9E, $FF9F
Standard Timer overflow
I-Bit
TSCR2 (TOI)
$9E
$FF9C, $FF9D
Standard Timer 2 Pulse accumulator
overflow
I-Bit
PACTL (PAOVI)
$9C
$FF9A, $FF9B
Standard Timer 2 Pulse accumulator
input edge
I-Bit
PACTL (PAI)
$9A
$FF98, $FF99
PMF Generator A Reload
I-Bit
PMFENCA (PWMRIEA)
$98
$FF96, $FF97
PMF Generator B Reload
I-Bit
PMFENCB (PWMRIEB)
$96
$FF94, $FF95
PMF Generator C Reload
I-Bit
PMFENCC (PWMRIEC)
$94
$FF92, $FF93
PMF Fault 0
I-Bit
PMFFCTL (FIE0)
$92
$FF90, $FF91
PMF Fault 1
I-Bit
PMFFCTL (FIE1)
$90
$FF8E, $FF8F
PMF Fault 2
I-Bit
PMFFCTL (FIE2)
$8E
$FF8C, $FF8D
PMF Fault 3
I-Bit
PMFFCTL (FIE3)
$8C
$FF8A, $FF8B
VREG LVI
I-Bit
CTRL0 (LVIE)
$8A
$FF88, $FF89
PWM Emergency Shutdown
I-Bit
PWMSDN(PWMIE)
$88
$FF80 to $FF87
Reserved
5.3 Resets
Resets are a subset of the interrupts featured inTable 5-1. The different sources capable of generating a
system reset are summarized in Table 5-2.
Table 5-2 Reset Summary
Reset
Priority
Source
Power-on Reset
1
CRG Module
Vector
$FFFE, $FFFF
External Reset
1
RESET pin
$FFFE, $FFFF
Low Voltage Reset
1
VREG Module
$FFFE, $FFFF
Clock Monitor Reset
2
CRG Module
$FFFC, $FFFD
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Table 5-2 Reset Summary
COP Watchdog Reset
3
CRG Module
$FFFA, $FFFB
5.3.1 Effects of Reset
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the
respective module Block Guides for register reset states. Refer to the HCS12 MEBI Block Guide for mode
dependent pin configuration of port A, B and E out of reset.
Refer to the PIM Block Guide for reset configurations of all peripheral module ports.
Refer to Table 1-1 for locations of the memories depending on the operating mode after reset.
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The RAM array is not automatically initialized out of reset.
Section 6 HCS12 Core Block Description
6.1 CPU12 Block Description
Consult the CPU12 Reference Manual for information about the Central Processing Unit.
When the CPU12 Reference Manual refers to cycles this is equivalent to Bus Clock periods.
So 1 cycle is equivalent to 1 Bus Clock period.
6.2 HCS12 Background Debug Module (BDM) Block Description
Consult the HCS12 BDM Block Guide for information about the Background Debug Module.
When the BDM Block Guide refers to alternate clock this is equivalent to Oscillator Clock.
6.3 HCS12 Debug (DBG) Block Description
Consult the HCS12 DBG Block Guide for information about the Debug module.
6.4 HCS12 Interrupt (INT) Block Description
Consult the HCS12 INT Block Guide for information about the Interrupt module.
6.5 HCS12 Multiplexed External Bus Interface (MEBI) Block
Description
Consult the HCS12 MEBI Block Guide for information about the Multiplexed External Bus Interface
module.
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6.6 HCS12 Module Mapping Control (MMC) Block Description
Consult the HCS12 MMC Block Guide for information about the Module Mapping Control module.
Section 7 Analog to Digital Converter (ATD) Block
Description
Consult the ATD_10B16C Block Guide for further information about the A/D Converter module.
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Note that V04 of the ATD has an external trigger (ETRIG) function which is tied off and not available for
use.
Section 8 Clock Reset Generator (CRG) Block Description
Consult the CRG Block Guide for information about the Clock and Reset Generator module.
8.1 Device-specific information
The Low Voltage Reset feature uses the low voltage reset signal from the VREG module as an input to the
CRG module. When the regulator output voltage supply to the internal chip logic falls below a specified
threshold the LVR signal from the VREG module causes the CRG module to generate a reset. Consult the
VREG Block Guide for voltage level specifications. 3F.
8.1.1 XCLKS
The XCLKS input signal is active low (see 2.3.8 PE7 / NOACC / XCLKS — Port E I/O Pin 7).
Section 9 Digital to Analog Converter (DAC) Block
Description
There are two digital to analog converter modules (DAC0, DAC1). Consult the DAC Block Guide for
information about the DAC Module.
Section 10 Flash EEPROM Block Description
Consult the FTS32K Block Guide for information about the flash module for the MC9S12E32.
Consult the FTS128K1 Block Guide for information about the flash module for the MC9S12E64.
Consult the FTS128K1 Block Guide for information about the flash module for the MC9S12E128.
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Consult the FTS256K2 Block Guide for information about the flash module for the MC9S12E256.
The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into
the flash memory of this device during manufacture. This LRAE program will provide greater
programming flexibility to the end users by allowing the device to be programmed directly using SCI after
it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and, if not
required, it must simply be erased prior to flash programming. For more details of the S12 LRAE and its
implementation, please see the S12 LREA Application Note (AN2546/D) .
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It is planned that most HC9S12 devices manufactured after Q1 of 2004 will be shipped with the S12 LRAE
programmed in the Flash . Exact details of the changeover (ie blank to programmed) for each product will
be communicated in advance via GPCN and will be traceable by the customer via datecode marking on
the device.
Please contact Motorola SPS Sales if you have any additional questions.
Section 11 IIC Block Description
Consult the IIC Block Guide for information about the IIC Module.
Section 12 Oscillator (OSC) Block Description
Consult the OSC Block Guide for information about the Oscillator module.
Section 13 Port Integration Module (PIM) Block Description
Consult the PIM_9E128 Block Guide for information about the Port Integration Module.
Section 14 Pulse width Modulator with Fault protection
(PMF) Block Description
Consult the PMF_15B6C Block Guide for information about the Pulse width Modulator with Fault
protection Module.
Section 15 Pulse Width Modulator (PWM) Block Description
Consult the PWM_8B6C Block Guide for information about the Pulse Width Modulator Module.
Section 16 Serial Communications Interface (SCI) Block
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Description
There are three Serial Communications Interface modules (SCI0, SCI1, SCI2). Consult the SCI Block
Guide for information about the Serial Communications Interface module.
Section 17 Serial Peripheral Interface (SPI) Block
Description
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Consult the SPI Block Guide for information about the Serial Peripheral Interface module.
Section 18 Timer (TIM) Block Description
There are three timer modules (TIM0, TIM1, TIM2). Consult the TIM_16B4C Block Guide for
information about the Timer module.
Section 19 Voltage Regulator (VREG) Block Description
Consult the VREG Block Guide for information about the dual output linear voltage regulator.
19.1 VREGEN
On the MC9S12E-Family the regulator enable signal (VREGEN) is not available externally and is
connected internally to VDDR.
19.2 VDD1, VDD2, VSS1, VSS2
In both the 112 pin LQFP and the 80 pin QFP package versions, both internal VDD and VSS of the 2.5V
domain are bonded out on 2 sides of the device as two pin pairs (VDD1, VSS1 & VDD2, VSS2). VDD1
and VDD2 are connected together internally. VSS1 and VSS2 are connected together internally. This
allows systems to employ better supply routing and further decoupling.
Section 20 Printed Circuit Board Layout Proposals
The Printed Circuit Board (PCB) must be carefully laid out to ensure proper operation of the voltage
regulator as well as the MCU itself. The following rules must be observed:
•
Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins (C1 - C6).
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•
Central point of the ground star should be the VSSR pin.
•
Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
•
VSSPLL must be directly connected to VSSR.
•
Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7,
C8, C11 and Q1 as small as possible.
•
Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the
connection area to the MCU.
•
Central power input should be fed in at the VDDA/VSSA pins.
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Table 20-1 Recommended decoupling capacitor choice
Component
Purpose
Type
Value
C1
VDD1 filter cap
ceramic X7R
100 - 220nF
C2
VDD2 filter cap (80 QFP only)
ceramic X7R
100 - 220nF
C3
VDDA filter cap
ceramic X7R
100nF
C4
VDDR filter cap
X7R/tantalum
>=100nF
C5
VDDPLL filter cap
ceramic X7R
100nF
C6
VDDX filter cap
X7R/tantalum
>=100nF
C7
OSC load cap
C8
OSC load cap
C9
PLL loop filter cap
C10
PLL loop filter cap
C11
DC cutoff cap
R1
PLL loop filter res
Q1
Quartz
See PLL specification chapter
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Figure 20-1 Recommended PCB Layout (112 LQFP)
NOTE: Oscillator in Colpitts mode.
C1
VDD1
VSSA
VSS1
C3
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VDDA
VDDX
VSS2
C2
C6
VDD2
VSSX
VSSR
C4
C7
C8
C10
C9
R1
C11
C5
VDDR
Q1
VSSPLL
VDDPLL
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Figure 20-2 Recommended PCB Layout (80 QFP)
NOTE: Oscillator in Colpitts mode.
VSSA
VSS1
VDDA
VSS2
VDDX
C2
C6
VDD2
VSSX
VSSR
C4
C7
C8
VDDR
C11
C5
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C1
VDD1
C3
C10
C9
Q1
VSSPLL
R1
VDDPLL
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Device User Guide — 9S12E128DGV1/D V01.04
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Appendix A Electrical Characteristics
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A.1 General
NOTE:
The electrical characteristics given in this section are preliminary and should be
used as a guide only. Values cannot be guaranteed by Motorola and are subject to
change without notice.
NOTE:
The part is specified and tested over the 5V and 3.3V ranges. For the intermediate
range, generally the electrical specifications for the 3.3V range apply, but the part
is not tested in production test in the intermediate range.
This supplement contains the most accurate electrical information for the MC9S12E-Family
microcontroller available at the time of publication. The information should be considered
PRELIMINARY and is subject to change.
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
A.1.1 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
NOTE:
This classification will be added at a later release of the specification
P: Those parameters are guaranteed during production testing on each individual device.
C: Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations. They are regularly verified by production monitors.
T: Those parameters are achieved by design characterization on a small sample size from typical devices.
All values shown in the typical column are within this category.
D: Those parameters are derived mainly from simulations.
A.1.2 Power Supply
The MC9S12E-Family utilizes several pins to supply power to the I/O ports, A/D converter, oscillator,
PLL and internal logic.
The VDDA, VSSA pair supplies the A/D converter and D/A converter.
The VDDX, VSSX pair supplies the I/O pins
The VDDR, VSSR pair supplies the internal voltage regulator.
VDD1, VSS1, VDD2 and VSS2 are the supply pins for the internal logic.
VDDPLL, VSSPLL supply the oscillator and the PLL.
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VSS1 and VSS2 are internally connected by metal.
VDD1 and VDD2 are internally connected by metal.
VDDA, VDDX, VDDR as well as VSSA, VSSX, VSSR are connected by anti-parallel diodes for ESD
protection.
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NOTE:
In the following context VDD5 is used for either VDDA, VDDR and VDDX; VSS5
is used for either VSSA, VSSR and VSSX unless otherwise noted.
IDD5 denotes the sum of the currents flowing into the VDDA, VDDX and VDDR
pins.
VDD is used for VDD1, VDD2 and VDDPLL, VSS is used for VSS1, VSS2 and
VSSPLL.
IDD is used for the sum of the currents flowing into VDD1 and VDD2.
A.1.3 Pins
There are four groups of functional pins.
A.1.3.1 3.3V/5V I/O pins
Those I/O pins have a nominal level of 3.3V or 5V depending on the application operating point. This
group of pins is comprised of all port I/O pins, the analog inputs, BKGD pin and the RESET inputs.The
internal structure of all those pins is identical, however some of the functionality may be disabled.
A.1.3.2 Analog Reference
This group of pins is comprised of the VRH and VRL pins.
A.1.3.3 Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied
by VDDPLL.
A.1.3.4 TEST
This pin is used for production testing only.
A.1.4 Current Injection
Power supply must maintain regulation within operating VDD5 or VDD range during instantaneous and
operating maximum current conditions. If positive injection current (Vin > VDD5) is greater than IDD5, the
injection current may flow out of VDD5 and could result in external power supply going out of regulation.
Insure external VDD5 load will shunt current greater than maximum injection current. This will be the
greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is
very low which would reduce overall power consumption.
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A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either VSS5 or VDD5).
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Table A-1 Absolute Maximum Ratings
Num
Rating
Symbol
Min
Max
Unit
1
I/O, Regulator and Analog Supply Voltage
VDD5
-0.3
6.5
V
2
Internal Logic Supply Voltage1
VDD
-0.3
3.0
V
3
PLL Supply Voltage (1)
VDDPLL
-0.3
3.0
V
4
Voltage difference VDDX to VDDR and VDDA
∆VDDX
-0.3
0.3
V
5
Voltage difference VSSX to VSSR and VSSA
∆VSSX
-0.3
0.3
V
6
Digital I/O Input Voltage
VIN
-0.3
6.5
V
7
Analog Reference
VRH, VRL
-0.3
6.5
V
8
XFC, EXTAL, XTAL inputs
VILV
-0.3
3.0
V
9
TEST input
VTEST
-0.3
10.0
V
10
Instantaneous Maximum Current
Single pin limit for all digital I/O pins 2
I
D
-25
+25
mA
11
Instantaneous Maximum Current
Single pin limit for XFC, EXTAL, XTAL3
IDL
-25
+25
mA
12
Instantaneous Maximum Current
Single pin limit for TEST4
I
DT
-0.25
0
mA
13
Operating Temperature Range (packaged)
TA
– 40
125
°C
14
Operating Temperature Range (junction)
TJ
– 40
140
°C
15
Storage Temperature Range
Tstg
– 65
155
°C
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply.
The absolute maximum ratings apply when the device is powered from an external source.
2. All digital I/O pins are internally clamped to VSSX and VDDX, VSSR and VDDR or VSSA and VDDA.
3. These pins are internally clamped to VSSPLL and VDDPLL
4. This pin is clamped low to VSSR, but not clamped high. This pin must be tied low in applications.
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A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM), the Machine Model (MM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-2 ESD and Latch-up Test Conditions
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Model
Description
Human Body
Machine
Latch-up
Symbol
Value
Unit
Series Resistance
R1
1500
Ohm
Storage Capacitance
C
100
pF
Number of Pulse per pin
positive
negative
-
3
3
Series Resistance
R1
0
Ohm
Storage Capacitance
C
200
pF
Number of Pulse per pin
positive
negative
-
3
3
Minimum input voltage limit
-2.5
V
Maximum input voltage limit
7.5
V
Table A-3 ESD and Latch-Up Protection Characteristics
Num
C
1
C
2
Rating
Symbol
Min
Max
Unit
Human Body Model (HBM)
VHBM
2000
-
V
C
Machine Model (MM)
VMM
200
-
V
3
C
Charge Device Model (CDM)
VCDM
500
-
V
4
C
Latch-up Current at 125°C
positive
negative
ILAT
+100
-100
-
mA
5
C
Latch-up Current at 27°C
positive
negative
ILAT
+200
-200
-
mA
A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
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NOTE:
Instead of specifying ambient temperature all parameters are specified for the more
meaningful silicon junction temperature. For power dissipation calculations refer
to Section A.1.8 Power Dissipation and Thermal Characteristics.
Table A-4 Operating Conditions
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Rating
Symbol
Min
Typ
Max
Unit
I/O, Regulator and Analog Supply Voltage
VDD5
3.135
3.3/5
5.5
V
Internal Logic Supply Voltage1
VDD
2.35
2.5
2.75
V
PLL Supply Voltage (1)
VDDPLL
2.35
2.5
2.75
V
Voltage Difference VDDX to VDDA
∆VDDX
-0.1
0
0.1
V
Voltage Difference VSSX to VSSR and VSSA
∆VSSX
-0.1
0
0.1
V
Oscillator
fosc
0.5
-
16
MHz
Bus Frequency2
fbus
0.25
-
25
MHz
Operating Junction Temperature Range
TJ
-40
-
140
°C
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
given operating range applies when this regulator is disabled and the device is powered from an external source.
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in °C can be
obtained from:
T J = T A + ( P D • Θ JA )
T J = Junction Temperature, [°C ]
T A = Ambient Temperature, [°C ]
P D = Total Chip Power Dissipation, [W]
Θ JA = Package Thermal Resistance, [°C/W]
The total power dissipation can be calculated from:
P D = P INT + P IO
P INT = Chip Internal Power Dissipation, [W]
Two cases with internal voltage regulator enabled and disabled must be considered:
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1. Internal Voltage Regulator disabled
P INT = I DD ⋅ V DD + I DDPLL ⋅ V DDPLL + I DDA ⋅ V DDA
2
P IO =
R DSON ⋅ I IO
i
i
∑
Which is the sum of all output currents on I/O ports associated with VDDX and VDDM.
For RDSON is valid:
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respectively
V OL
R DSON = ------------ ;for outputs driven low
I OL
V DD5 – V OH
R DSON = ------------------------------------ ;for outputs driven high
I OH
2. Internal voltage regulator enabled
P INT = I DDR ⋅ V DDR + I DDA ⋅ V DDA
IDDR is the current shown in Table A-8 and not the overall current flowing into VDDR, which
additionally contains the current flowing into the external loads with output high.
2
P IO =
R DSON ⋅ I IO
i
i
∑
Which is the sum of all output currents on I/O ports associated with VDDX and VDDR.
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Table A-5 Thermal Package Characteristics1
Num
C
1
T
2
Rating
Symbol
Min
Typ
Max
Unit
Thermal Resistance LQFP112, single sided PCB2
θJA
–
–
54
°oC/W
T
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes3
θJA
–
–
41
oC/W
3
T
Junction to Board LQFP112
θJB
–
–
31
°oC/W
4
T
Junction to Case LQFP112
θJC
–
–
11
o
C/W
5
T
Junction to Package Top LQFP112
ΨJT
–
–
2
o
C/W
6
T
Thermal Resistance QFP 80, single sided PCB
θJA
–
–
51
°oC/W
7
T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θJA
–
–
41
o
8
T
Junction to Board QFP80
θJB
–
–
27
°oC/W
9
T
Junction to Case QFP80
θJC
–
–
14
oC/W
10
T
Junction to Package Top QFP80
ΨJT
–
–
3
oC/W
C/W
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
A.1.9 I/O Characteristics
This section describes the characteristics of all 3.3V/5V I/O pins. All parameters are not always applicable,
e.g. not all pins feature pull up/down resistances.
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Table A-6 5V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
1
2
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3
4
C
Rating
Symbol
Min
Typ
Max
Unit
P
Input High Voltage
VIH
0.65*VDD5
-
-
V
T
Input High Voltage
VIH
-
-
VDD5 + 0.3
V
P
Input Low Voltage
VIL
-
-
0.35*VDD5
V
T
Input Low Voltage
VIL
VSS5 - 0.3
-
-
V
C
Input Hysteresis
P
Input Leakage Current (pins in high ohmic input
mode)1
or V
V =V
in
DD5
VHYS
I
250
mV
in
–2.5
-
2.5
µA
SS5
5
C
Output High Voltage (pins in output mode)
Partial Drive IOH = –2mA
VOH
VDD5 – 0.8
-
-
V
6
P
Output High Voltage (pins in output mode)
Full Drive IOH = –10mA
VOH
VDD5 – 0.8
-
-
V
7
C
Output Low Voltage (pins in output mode)
Partial Drive IOL = +2mA
VOL
-
-
0.8
V
8
P
Output Low Voltage (pins in output mode)
Full Drive IOL = +10mA
VOL
-
-
0.8
V
9
P
Internal Pull Up Device Current,
tested at VIL Max.
IPUL
-
-
-130
µA
10
C
Internal Pull Up Device Current,
tested at VIH Min.
IPUH
-10
-
-
µA
11
P
Internal Pull Down Device Current,
tested at V Min.
IPDH
-
-
130
µA
12
C
Internal Pull Down Device Current,
tested at VIL Max.
IPDL
10
-
-
µA
13
D
Input Capacitance
Cin
6
-
pF
14
T
Injection current2
Single Pin limit
Total Device Limit. Sum of all injected currents
IICS
IICP
-
2.5
25
mA
15
P
Port AD Interrupt Input Pulse filtered3
tPIGN
3
µs
16
P
Port AD Interrupt Input Pulse passed(3)
tPVAL
IH
-2.5
-25
10
µs
NOTES:
1. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for
each 8°C to 12°C in the temperature range from 50°C to 125°C.
2. Refer to Section A.1.4 Current Injection, for more details
3. Parameter only applies in STOP or Pseudo STOP mode.
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Table A-7 Preliminary 3.3V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
1
2
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3
4
C
Rating
Symbol
Min
Typ
Max
Unit
P
Input High Voltage
VIH
0.65*VDD5
-
-
V
T
Input High Voltage
VIH
-
-
VDD5 + 0.3
V
P
Input Low Voltage
VIL
-
-
0.35*VDD5
V
T
Input Low Voltage
VIL
VSS5 - 0.3
-
-
V
C
Input Hysteresis
P
Input Leakage Current (pins in high ohmic input
mode)1
or V
V =V
in
DD5
VHYS
250
mV
Iin
–2.5
-
2.5
µA
SS5
5
C
Output High Voltage (pins in output mode)
Partial Drive IOH = –0.75mA
VOH
VDD5 – 0.4
-
-
V
6
P
Output High Voltage (pins in output mode)
Full Drive IOH = –4.5mA
VOH
VDD5 – 0.4
-
-
V
7
C
Output Low Voltage (pins in output mode)
Partial Drive IOL = +0.9mA
VOL
-
-
0.4
V
8
P
Output Low Voltage (pins in output mode)
Full Drive IOL = +5.5mA
VOL
-
-
0.4
V
9
P
Internal Pull Up Device Current,
tested at VIL Max.
IPUL
-
-
–60
µA
10
C
Internal Pull Up Device Current,
tested at VIH Min.
IPUH
-6
-
-
µA
11
P
Internal Pull Down Device Current,
tested at VIH Min.
IPDH
-
-
60
µA
12
C
Internal Pull Down Device Current,
tested at VIL Max.
IPDL
6
-
-
µA
13
D
Input Capacitance
Cin
6
-
pF
14
T
Injection current2
Single Pin limit
Total Device Limit. Sum of all injected currents
IICS
IICP
-
2.5
25
mA
15
P
Port AD Interrupt Input Pulse filtered3
tPIGN
3
µs
16
P
Port AD Interrupt Input Pulse passed(3)
tPVAL
-2.5
-25
10
µs
NOTES:
1. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for
each 8°C to 12°C in the temperature range from 50°C to 125°C.
2. Refer to Section A.1.4 Current Injection, for more details
3. Parameter only applies in STOP or Pseudo STOP mode.
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A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single
chip mode, internal voltage regulator enabled and at 25MHz bus frequency using a 4MHz oscillator.
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A.1.10.2 Additional Remarks
In expanded modes the currents flowing in the system are highly dependent on the load at the address, data
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be
given. A very good estimate is to take the single chip currents and add the currents due to the external
loads.
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Table A-8 Supply Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
1
P
Run supply currents
Single Chip, Internal regulator enabled
IDD5
65
2
P
P
IDDW
40
5
Unit
mA
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Wait Supply current
3
4
5
C
C
C
C
C
C
C
C
P
C
C
P
C
P
C
P
C
P
C
C
P
C
P
C
P
All modules enabled
only RTI enabled
Pseudo Stop Current (RTI and COP enabled) 1, 2
-40°C
27°C
70°C
85°C
105°C
125°C
140°C
Pseudo Stop Current (RTI and COP disabled) (1),(2)
-40°C
27°C
70°C
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
Stop Current
IDDPS
IDDPS
570
600
650
750
850
1200
1500
370
400
450
550
600
650
800
850
1200
mA
µA
500
1600
µA
2100
5000
(2)
-40°C
27°C
70°C
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
IDDS
12
30
100
130
160
200
350
400
600
100
1200
µA
1700
5000
NOTES:
1. PLL off
2. At those low power dissipation levels TJ = TA can be assumed
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Appendix B Electrical Specifications
B.1 Voltage Regulator (VREG_3V3) Operating Characteristics
This section describes the characteristics of the on chip voltage regulator.
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Table 20-2 VREG_3V3 - Operating Conditions
Num
C
1
P
Input Voltages
2
P
P
3
4
P
Characteristic
Symbol
Min
Typical
Max
Unit
VVDDR,A
3.135
—
5.5
V
Regulator Current
Reduced Power Mode
Shutdown Mode
IREG
—
—
20
12
50
40
µA
µA
Output Voltage Core
Full Performance Mode
Reduced Power Mode
Shutdown Mode
VDD
2.35
1.6
—
2.5
2.5
2.75
2.75
—
V
V
V
2.35
2.0
1.6
—
2.5
2.5
2.5
4
2.75
2.75
2.75
—
Output Voltage PLL
Full Performance Mode
Reduced Power Mode2
Reduced Power Mode3
Shutdown Mode
VDDPLL
1
V
V
V
V
5
P
Low Voltage Interrupt5
Assert Level
Deassert Level
VLVIA
VLVID
4.1
4.25
4.37
4.52
4.66
4.77
V
V
5
P
Low Voltage Reset6
Assert Level
Deassert Level
VLVRA
VLVRD
2.25
—
—
—
—
2.55
V
V
7
C
Power-on Reset7
Assert Level
Deassert Level
VPORA
VPORD
0.97
—
-----
—
2.05
V
V
NOTES:
1. High Impedance Output
2. Current IDDPLL = 1mA (Colpitts Oscillator)
3. Current IDDPLL = 3mA (Pierce Oscillator)
4. High Impedance Output
5. Monitors VDDA, active only in Full Performance Mode. Indicates I/O & ADC performance degradation due to
low supply voltage.
6. Monitors VDD, active only in Full Performance Mode. VLVRA and VPORD must overlap
7. Monitors VDD. Active in all modes.
NOTE:
The electrical characteristics given in this section are preliminary and
should be used as a guide only. Values in this section cannot be
guaranteed by Motorola and are subject to change without notice.
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B.2 Chip Power-up and LVI/LVR graphical explanation
Voltage regulator sub modules LVI (low voltage interrupt), POR (power-on reset) and LVR (low voltage
reset) handle chip power-up or drops of the supply voltage. Their function is described in Figure B-1.
Figure B-1 Voltage Regulator - Chip Power-up and Voltage Drops (not scaled)
V
VDDA
VLVID
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VLVIA
VDD
VLVRD
VLVRA
VPORD
t
LVI
POR
LVI enabled
LVI disabled due to LVR
LVR
B.3 Output Loads
B.3.1 Resistive Loads
The on-chip voltage regulator is intended to supply the internal logic and oscillator circuits allows no
external DC loads.
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B.3.2 Capacitive Loads
The capacitive loads are specified in Table B-1. Ceramic capacitors with X7R dielectricum are required.
Table B-1 Voltage Regulator - Capacitive Loads
Num
Characteristic
VDD external capacitive load
2
VDDPLL external capacitive load
Min
Typical
Max
Unit
CDDext
200
440
12000
nF
CDDPLLext
90
220
5000
nF
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1
Symbol
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B.4 Reset, Oscillator and PLL
This section summarizes the electrical characteristics of the various startup scenarios for Oscillator and
Phase-Locked-Loop (PLL).
B.4.1 Startup
Table B-2 summarizes several startup characteristics explained in this section. Detailed description of the
startup behavior can be found in the Clock and Reset Generator (CRG) Block User Guide.
Freescale Semiconductor, Inc...
Table B-2 Startup Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
T
POR release level
VPORR
2.07
V
2
T
POR assert level
VPORA
0.97
V
3
D
Reset input pulse width, minimum input time
PWRSTL
2
tosc
4
D
Startup from Reset
nRST
192
5
D
Interrupt pulse width, IRQ edge-sensitive mode
PWIRQ
20
6
D
Wait recovery startup time
tWRS
7
P
LVR release level
VLVRR
8
P
LVR assert level
VLVRA
196
nosc
ns
14
2.25
tcyc
V
2.55
V
B.4.1.1 POR
The release level VPORR and the assert level VPORA are derived from the VDD Supply. They are also valid
if the device is powered externally. After releasing the POR reset the oscillator and the clock quality check
are started. If after a time tCQOUT no valid oscillation is detected, the MCU will start using the internal self
clock. The fastest startup time possible is given by nuposc.
B.4.1.2 LVR
The release level VLVRR and the assert level VLVRA are derived from the VDD Supply. They are also valid
if the device is powered externally. After releasing the LVR reset the oscillator and the clock quality check
are started. If after a time tCQOUT no valid oscillation is detected, the MCU will start using the internal self
clock. The fastest startup time possible is given by nuposc.
B.4.1.3 SRAM Data Retention
Provided an appropriate external reset signal is applied to the MCU, preventing the CPU from executing
code when VDD5 is out of specification limits, the SRAM contents integrity is guaranteed if after the reset
the PORF bit in the CRG Flags Register has not been set.
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B.4.1.4 External Reset
When external reset is asserted for a time greater than PWRSTL the CRG module generates an internal
reset, and the CPU starts fetching the reset vector without doing a clock quality check, if there was an
oscillation before reset.
B.4.1.5 Stop Recovery
Out of STOP the controller can be woken up by an external interrupt. A clock quality check as after POR
is performed before releasing the clocks to the system.
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B.4.1.6 Pseudo Stop and Wait Recovery
The recovery from Pseudo STOP and Wait are essentially the same since the oscillator was not stopped in
both modes. The controller can be woken up by internal or external interrupts. After twrs the CPU starts
fetching the interrupt vector.
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B.4.2 Oscillator
The device features an internal Colpitts and Pierce oscillator. The selection of Colpitts oscillator or Pierce
oscillator/external clock depends on the XCLKS signal which is sampled during reset. Pierce
oscillator/external clock mode allows the input of a square wave. Before asserting the oscillator to the
internal system clocks the quality of the oscillation is checked for each start from either power-on, STOP
or oscillator fail. tCQOUT specifies the maximum time before switching to the internal self clock mode after
POR or STOP if a proper oscillation is not detected. The quality check also determines the minimum
oscillator start-up time tUPOSC. The device also features a clock monitor. A Clock Monitor Failure is
asserted if the frequency of the incoming clock signal is below the Assert Frequency fCMFA.
Table B-3 Oscillator Characteristics
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Conditions are shown in Table A-4 unless otherwise noted
Num C
Rating
Symbol
Min
Typ
Max
Unit
1a
C Crystal oscillator range (Colpitts)
fOSC
0.5
16
MHz
1b
C Crystal oscillator range (Pierce) 1
fOSC
0.5
40
MHz
2
P Startup Current
iOSC
100
3
C Oscillator start-up time (Colpitts)
tUPOSC
4
D Clock Quality check time-out
tCQOUT
0.45
5
P Clock Monitor Failure Assert Frequency
fCMFA
50
6
P External square wave input frequency 4
fEXT
0.5
7
D External square wave pulse width low(4)
tEXTL
9.5
ns
8
D External square wave pulse width high(4)
tEXTH
9.5
ns
9
D External square wave rise time(4)
tEXTR
1
ns
10
D External square wave fall time(4)
tEXTF
1
ns
11
D Input Capacitance (EXTAL, XTAL pins)
12
C
13
P EXTAL Pin Input High Voltage(4)
VIH,EXTAL
T EXTAL Pin Input High Voltage(4)
VIH,EXTAL
VDDPLL + 0.3
V
P EXTAL Pin Input Low Voltage(4)
VIL,EXTAL
0.3*VDDPLL
V
T EXTAL Pin Input Low Voltage(4)
VIL,EXTAL
14
15
DC Operating Bias in Colpitts Configuration on
EXTAL Pin
C EXTAL Pin Input Hysteresis(4)
µA
82
100
1003
ms
2.5
s
200
KHz
50
MHz
CIN
7
pF
VDCBIAS
1.1
V
0.7*VDDPLL
V
VSSPLL - 0.3
VHYS,EXTAL
V
250
mV
NOTES:
1. Depending on the crystal a damping series resistor might be necessary
2. fosc = 4MHz, C = 22pF.
3. Maximum value is for extreme cases using high Q, low frequency crystals
4. Only valid if Pierce oscillator/external clock mode is selected
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B.4.3 Phase Locked Loop
The oscillator provides the reference clock for the PLL. The PLL´s Voltage Controlled Oscillator (VCO)
is also the system clock source in self clock mode.
B.4.3.1 XFC Component Selection
This section describes the selection of the XFC components to achieve a good filter characteristics.
Freescale Semiconductor, Inc...
Cp
VDDPLL
R
Phase
Cs
fosc
fref
1
refdv+1
∆
fcmp
XFC Pin
VCO
KΦ
KV
fvco
Detector
Loop Divider
1
synr+1
1
2
Figure B-2 Basic PLL functional diagram
The following procedure can be used to calculate the resistance and capacitance values using typical
values for K1, f1 and ich from Table B-4.
The grey boxes show the calculation for fVCO = 50MHz and fref = 1MHz. E.g., these frequencies are used
for fOSC = 4MHz and a 25MHz bus clock.
The VCO Gain at the desired VCO frequency is approximated by:
KV = K1 ⋅ e
( f 1 – f vco )
----------------------K 1 ⋅ 1V
= – 100 ⋅ e
( 60 – 50 )
-----------------------– 100
= -90.48MHz/V
The phase detector relationship is given by:
K Φ = – i ch ⋅ K V
= 316.7Hz/Ω
ich is the current in tracking mode.
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The loop bandwidth fC should be chosen to fulfill the Gardner’s stability criteria by at least a factor of 10,
typical values are 50. ζ = 0.9 ensures a good transient response.
2 ⋅ ζ ⋅ f ref
f ref
1
Þ ------ → f C < ------------- ;( ζ = 0.9 )
f C < -----------------------------------------10
4
⋅
10
2
π ⋅ ζ + 1 + ζ 
fC < 25kHz


And finally the frequency relationship is defined as
Freescale Semiconductor, Inc...
f VCO
n = ------------- = 2 ⋅ ( synr + 1 )
f ref
= 50
With the above values the resistance can be calculated. The example is shown for a loop bandwidth
fC=10kHz:
2 ⋅ π ⋅ n ⋅ fC
R = ---------------------------- = 2*π*50*10kHz/(316.7Hz/Ω)=9.9kΩ=~10kΩ
KΦ
The capacitance Cs can now be calculated as:
2
2⋅ζ
0.516
C s = ---------------------- ≈ --------------- ;( ζ = 0.9 ) = 5.19nF =~ 4.7nF
π ⋅ fC ⋅ R fC ⋅ R
The capacitance Cp should be chosen in the range of:
C s ⁄ 20 ≤ C p ≤ C s ⁄ 10
Cp = 470pF
B.4.3.2 Jitter Information
The basic functionality of the PLL is shown in Figure B-2. With each transition of the clock fcmp, the
deviation from the reference clock fref is measured and input voltage to the VCO is adjusted
accordingly.The adjustment is done continuously with no abrupt changes in the clock output frequency.
Noise, voltage, temperature and other factors cause slight variations in the control loop resulting in a clock
jitter. This jitter affects the real minimum and maximum clock periods as illustrated in Figure B-3.
NOTE:
This section is under construction
The basic functionality of the PLL is shown in Figure B-2. With each transition of the clock fcmp, the
deviation from the reference clock fref is measured and input voltage to the VCO is adjusted
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accordingly.The adjustment is done continuously with no abrupt changes in the clock output frequency.
Noise, voltage, temperature and other factors cause slight variations in the control loop resulting in a clock
jitter. This jitter affects the real minimum and maximum clock periods as illustrated in Figure B-3.
1
0
2
3
N-1
N
tmin1
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tnom
tmax1
tminN
tmaxN
Figure B-3 Jitter Definitions
The relative deviation of tnom is at its maximum for one clock period, and decreases towards zero for larger
number of clock periods (N).
Defining the jitter as:
t min ( N ) 
t max ( N )

J ( N ) = max  1 – -------------------- , 1 – --------------------
N ⋅ t nom
N ⋅ t nom 

For N < 100, the following equation is a good fit for the maximum jitter:
j1
J ( N ) = ------- + j2
N
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J(N)
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1
5
10
20
N
This is very important to notice with respect to timers, serial modules where a pre-scaler will eliminate the
effect of the jitter to a large extent.
Table B-4 PLL Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
1
P
2
Rating
Symbol
Min
Self Clock Mode frequency
fSCM
D
VCO locking range
3
D
Lock Detector transition from Acquisition to
Tracking mode
4
D
Lock Detection
5
D
6
Typ
Max
Unit
1
5.5
MHz
fVCO
8
50
MHz
|∆trk|
3
4
%1
|∆Lock|
0
1.5
%(1)
Un-Lock Detection
|∆unl|
0.5
2.5
%(1)
D
Lock Detector transition from Tracking to
Acquisition mode
|∆unt|
6
8
%(1)
7
C
PLLON Total Stabilization delay (Auto Mode) 2
tstab
0.5
ms
8
D
PLLON Acquisition mode stabilization delay (2)
tacq
0.3
ms
9
D
PLLON Tracking mode stabilization delay (2)
tal
0.2
ms
10
D
Fitting parameter VCO loop gain
K1
-100
MHz/V
11
D
Fitting parameter VCO loop frequency
f1
60
MHz
12
D
Charge pump current acquisition mode
| ich |
38.5
µA
13
D
Charge pump current tracking mode
| ich |
3.5
µA
14
C
Jitter fit parameter 1(2)
j1
1.1
%
15
C
Jitter fit parameter 2(2)
j2
0.13
%
NOTES:
1. % deviation from target frequency
2. fOSC = 4MHz, fBUS = 25MHz equivalent fVCO = 50MHz: REFDV = #$03, SYNR = #$018, Cs = 4.7nF, Cp = 470pF, Rs =
10KΩ.
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B.5 Flash NVM
B.5.1 NVM timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency fNVMOSC is required for performing program or erase operations. The NVM modules
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
Freescale Semiconductor, Inc...
The Flash program and erase operations are timed using a clock derived from the oscillator using the
FCLKDIV register. The frequency of this clock must be set within the limits specified as fNVMOP.
The minimum program and erase times shown in Table B-5 are calculated for maximum fNVMOP and
maximum fbus. The maximum times are calculated for minimum fNVMOP and a fbus of 2MHz.
B.5.1.1 Single Word Programming
The programming time for single word programming is dependent on the bus frequency as a well as on
the frequency f¨NVMOP and can be calculated according to the following formula.
1
1
t swpgm = 9 ⋅ --------------------- + 25 ⋅ ---------f bus
f NVMOP
B.5.1.2 Row Programming
Flash programming where up to 32 words in a row can be programmed consecutively by keeping the
command pipeline filled. The time to program a consecutive word can be calculated as:
1
1
t bwpgm = 4 ⋅ --------------------- + 9 ⋅ ---------f bus
f NVMOP
The time to program a whole row is:
t brpgm = t swpgm + 31 ⋅ t bwpgm
Row programming is more than 2 times faster than single word programming.
B.5.1.3 Sector Erase
Erasing a 512 byte Flash sector takes:
1
t era ≈ 4000 ⋅ --------------------f NVMOP
The setup times can be ignored for this operation.
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B.5.1.4 Mass Erase
Erasing a NVM block takes:
1
t mass ≈ 20000 ⋅ --------------------f NVMOP
The setup times can be ignored for this operation.
B.5.1.5 Blank Check
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The time it takes to perform a blank check on the Flash is dependant on the location of the first non-blank
word starting at relative address zero. It takes one bus cycle per word to verify plus a setup of the
command.
t check ≈ location ⋅ t cyc + 10 ⋅ t cyc
Table B-5 NVM Timing Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
1
D
2
Rating
Symbol
Min
Typ
Max
Unit
External Oscillator Clock
fNVMOSC
0.5
501
MHz
D
Bus frequency for Programming or Erase Operations
fNVMBUS
1
3
D
Operating Frequency
fNVMOP
150
200
kHz
4
P
Single Word Programming Time
tswpgm
462
74.53
µs
5
D
Flash Burst Programming consecutive word
tbwpgm
20.42
313
µs
6
D
Flash Burst Programming Time for 32 Words
tbrpgm
678.42
1035.53
µs
7
P
Sector Erase Time
tera
204
26.73
ms
8
P
Mass Erase Time
tmass
1004
1333
ms
9
D
Blank Check Time Flash per block
t check
115
327786
tcyc
MHz
NOTES:
1. Restrictions for oscillator in crystal mode apply!
2. Minimum Programming times are achieved under maximum NVM operating frequency f NVMOP and maximum bus frequency fbus.
3. Maximum Erase and Programming times are achieved under particular combinations of f NVMOP and bus frequency f bus.
Refer to formulae in Sections A.3.1.1 - A.3.1.4 for guidance.
4. Minimum Erase times are achieved under maximum NVM operating frequency f NVMOP.
5. Minimum time, if first word in the array is not blank
6. Maximum time to complete check on an erased block.
B.5.2 NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures.
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The failure rates for data retention and program/erase cycling are specified at <2ppm defects over lifetime
at the operating conditions noted.
The program/erase cycle count on the sector is incremented every time a sector or mass erase event is
executed.
NOTE:
All values shown in Table B-6 are target values and subject to further extensive
characterization.
Table B-6 NVM Reliability Characteristics
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Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
C
Data Retention at an average junction temperature of
TJavg = 85°C
tNVMRET
15
Years
2
C
Data Retention at a junction temperature of TJ =
140°C
tNVMRET
10
Years
3
C
Flash number of Program/Erase cycles
nFLPE
10,000
Cycles
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B.6 SPI Characteristics
This section provides electrical parametrics and ratings for the SPI.
In Table B-7 the measurement conditions are listed.
Table B-7 Measurement Conditions
Description
Value
Unit
full drive mode
—
50
pF
(20% / 80%) VDDX
V
Drive mode
Load capacitance CLOAD,
on all outputs
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Thresholds for delay
measurement points
B.6.1 Master Mode
In Figure B-4 the timing diagram for master mode with transmission format CPHA=0 is depicted.
SS1
(OUTPUT)
2
1
SCK
(CPOL = 0)
(OUTPUT)
12
13
12
13
3
4
4
SCK
(CPOL = 1)
(OUTPUT)
5
MISO
(INPUT)
6
MSB IN2
10
MOSI
(OUTPUT)
BIT 6 . . . 1
LSB IN
9
MSB OUT2
BIT 6 . . . 1
11
LSB OUT
1.if configured as an output.
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure B-4 SPI Master Timing (CPHA=0)
In Figure B-5 the timing diagram for master mode with transmission format CPHA=1 is depicted.
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SS1
(OUTPUT)
1
2
SCK
(CPOL = 0)
(OUTPUT)
4
SCK
(CPOL = 1)
(OUTPUT)
4
5
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MISO
(INPUT)
12
13
12
13
3
6
MSB IN2
BIT 6 . . . 1
LSB IN
11
9
MOSI
(OUTPUT)PORT DATA
MASTER MSB OUT2
BIT 6 . . . 1
MASTER LSB OUT
PORT DATA
1.If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure B-5 SPI Master Timing (CPHA=1)
In Table B-8 the timing characteristics for master mode are listed.
Table B-8 SPI Master Mode Timing Characteristics
Num
C
Characteristic
1
P
SCK Frequency
1
P
2
Symbol
Unit
Min
Typ
Max
fsck
1/2048
—
1/2
fbus
SCK Period
tsck
2
—
2048
tbus
D
Enable Lead Time
tlead
—
1/2
—
tsck
3
D
Enable Lag Time
tlag
—
1/2
—
tsck
4
D
Clock (SCK) High or Low Time
twsck
—
1/2
—
tsck
5
D
Data Setup Time (Inputs)
tsu
8
—
—
ns
6
D
Data Hold Time (Inputs)
thi
8
—
—
ns
9
D
Data Valid after SCK Edge
tvsck
—
—
30
ns
Data Valid after SS fall (CPHA=0)
tvss
—
—
15
ns
10
D
11
D
Data Hold Time (Outputs)
tho
20
—
—
ns
12
D
Rise and Fall Time Inputs
trfi
—
—
8
ns
13
D
Rise and Fall Time Outputs
trfo
—
—
8
ns
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B.6.2 Slave Mode
In Figure B-6 the timing diagram for slave mode with transmission format CPHA=0 is depicted.
SS
(INPUT)
1
12
13 3
12
13
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SCK
(CPOL = 0)
(INPUT)
4
2
SCK
(CPOL = 1)
(INPUT)10
8
7
MISO
(OUTPUT)
4
9
see
note
5
MOSI
(INPUT)
SLAVE MSB
BIT 6 . . . 1
11
11
SLAVE LSB OUT
SEE
NOTE
6
MSB IN
BIT 6 . . . 1
LSB IN
NOTE: Not defined!
Figure B-6 SPI Slave Timing (CPHA=0)
In Figure B-7 the timing diagram for slave mode with transmission format CPHA=1 is depicted.
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SS
(INPUT)
3
1
2
SCK
(CPOL = 0)
(INPUT)
4
SCK
(CPOL = 1)
(INPUT)
4
Freescale Semiconductor, Inc...
see
note
SLAVE
7
MSB OUT
5
MOSI
(INPUT)
13
12
13
8
11
9
MISO
(OUTPUT)
12
BIT 6 . . . 1
SLAVE LSB OUT
6
MSB IN
BIT 6 . . . 1
LSB IN
NOTE: Not defined!
Figure B-7 SPI Slave Timing (CPHA=1)
In Table B-9 the timing characteristics for slave mode are listed.
Table B-9 SPI Slave Mode Timing Characteristics
Num
C
Characteristic
1
P
SCK Frequency
1
P
2
3
Symbol
Unit
Min
Typ
Max
fsck
DC
—
1/4
fbus
SCK Period
tsck
4
—
∞
tbus
D
Enable Lead Time
tlead
4
—
—
tbus
D
Enable Lag Time
tlag
4
—
—
tbus
twsck
4
—
—
tbus
4
D
Clock (SCK) High or Low Time
5
D
Data Setup Time (Inputs)
tsu
8
—
—
ns
6
D
Data Hold Time (Inputs)
thi
8
—
—
ns
7
D
Slave Access Time (time to data
active)
ta
—
—
20
ns
8
D
Slave MISO Disable Time
tdis
—
—
22
ns
1
ns
9
D
Data Valid after SCK Edge
tvsck
—
—
30 + tbus
10
D
Data Valid after SS fall
tvss
—
—
30 + tbus 1
ns
11
D
Data Hold Time (Outputs)
tho
20
—
—
ns
—
—
8
ns
—
—
8
ns
12
D
Rise and Fall Time Inputs
trfi
13
D
Rise and Fall Time Outputs
trfo
NOTES:
1. tbus added due to internal synchronization delay
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B.7 ATD Characteristics
This section describes the characteristics of the analog to digital converter.
The ATD is specified and tested for both the 3.3V and 5V range. For ranges between 3.3V and 5V the
ATD accuracy is generally the same as in the 3.3V range but is not tested in this range in production test.
B.7.1 ATD Operating Characteristics - 5V Range
Freescale Semiconductor, Inc...
The Table B-10 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results:
VSSA ≤ VRL ≤ VIN ≤ VRH ≤ VDDA. This constraint exists since the sample buffer amplifier can not
drive beyond the power supply levels that it ties to. If the input level goes outside of this range it will
effectively be clipped.
Table B-10 5V ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted. Supply Voltage 5V-10% <= VDDA <=5V+10%
Num C
Rating
Symbol
Min
VRL
VRH
VSSA
VDDA/2
VRH-VRL
4.75
fATDCLK
Typ
Max
Unit
VDDA/2
VDDA
V
V
5.25
V
0.5
2.0
MHz
NCONV10
TCONV10
TCONV10
14
7
3.5
28
14
7
Cycles
µs
µs
NCONV8
TCONV8
12
6
26
13
Cycles
µs
Reference Potential
1
D
Low
High
2
C Differential Reference Voltage1
3
D ATD Clock Frequency
5.0
ATD 10-Bit Conversion Period
4
D
Clock Cycles2
Conv, Time at 2.0MHz ATD Clock fATDCLK
Conv, Time at 4.0MHz3 ATD Clock fATDCLK
ATD 8-Bit Conversion Period
Clock Cycles(1)
Conv, Time at 2.0MHz ATD Clock fATDCLK
5
D
6
D Stop Recovery Time (VDDA=5.0 Volts)
tSR
20
µs
7
P Reference Supply current
IREF
0.375
mA
NOTES:
1. Full accuracy is not guaranteed when differential voltage is less than 4.75V
2. The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
3. Reduced accuracy see Table B-13 and Table B-14.
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B.7.2 ATD Operating Characteristics - 3.3V Range
The Table B-11 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results:
VSSA ≤ VRL ≤ VIN ≤ VRH ≤ VDDA. This constraint exists since the sample buffer amplifier can not
drive beyond the power supply levels that it ties to. If the input level goes outside of this range it will
effectively be clipped.
Table B-11 3.3V ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted; Supply Voltage 3.3V-10% <= VDDA <= 3.3V+10%
Freescale Semiconductor, Inc...
Num C
Rating
Symbol
Min
VRL
VRH
VSSA
VDDA/2
Typ
Max
Unit
VDDA/2
VDDA
V
V
3.6
V
Reference Potential
1
D
Low
High
2
C Differential Reference Voltage
VRH-VRL
3.0
3
D ATD Clock Frequency
fATDCLK
0.5
2.0
MHz
CONV10
TCONV10
14
7
3.5
28
14
7
Cycles
µs
µs
NCONV8
TCONV8
12
6
26
13
Cycles
µs
3.3
ATD 10-Bit Conversion Period
4
D
Clock Cycles1 NCONV10
Conv, Time at 2.0MHz ATD Clock fATDCLK T
Conv, Time at 4.0MHz2 ATD Clock fATDCLK
ATD 8-Bit Conversion Period
Clock Cycles(1)
Conv, Time at 2.0MHz ATD Clock fATDCLK
5
D
6
D Recovery Time (VDDA=3.3 Volts)
tREC
20
µs
7
P
IREF
0.250
mA
Reference Supply current
NOTES:
1. The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
2. Reduced accuracy see Table B-13 and Table B-14.
B.7.3 Factors influencing accuracy
Three factors - source resistance, source capacitance and current injection - have an influence on the
accuracy of the ATD.
B.7.3.1 Source Resistance:
Due to the input pin leakage current as specified in Table A-6 and Table A-7in conjunction with the
source resistance there will be a voltage drop from the signal source to the ATD input. The maximum
source resistance RS specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage
current. If device or operating conditions are less than worst case or leakage-induced error is acceptable,
larger values of source resistance are allowed.
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B.7.3.2 Source capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, Cf ≥ 1024 * (CINS- CINN).
B.7.3.3 Current injection
There are two cases to consider.
Freescale Semiconductor, Inc...
1. A current is injected into the channel being converted. The channel being stressed has conversion
values of $3FF ($FF in 8-bit mode) for analog inputs greater than VRH and $000 for values less
than VRL unless the current is higher than specified as disruptive conditions.
2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as VERR = K * RS *
IINJ, with IINJ being the sum of the currents injected into the two pins adjacent to the converted
channel.
Table B-12 ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
C
Max input Source Resistance
RS
-
-
1
KΩ
2
T
Total Input Capacitance
Non Sampling
Sampling
10
15
pF
3
C
Disruptive Analog Input Current
INA
2.5
mA
4
C
Coupling Ratio positive current injection
Kp
10-4
A/A
5
C
Coupling Ratio negative current injection
Kn
10-2
A/A
CINN
CINS
-2.5
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B.7.4 ATD accuracy - 5V Range
Table B-13 specifies the ATD conversion performance excluding any errors due to current injection,
input capacitance and source resistance.
Table B-13 5V ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
VREF = VRH - VRL = 5.12V. Resulting to one 8 bit count = 20mV and one 10 bit count = 5mV
fATDCLK = 2.0MHz
Freescale Semiconductor, Inc...
Num
C
Rating
Symbol
Min
Typ
Max
5
Unit
1
P 10-Bit Resolution
LSB
mV
2
P 10-Bit Differential Nonlinearity
DNL
–1
1
Counts
3
P 10-Bit Integral Nonlinearity
INL
–2.0
2.0
Counts
4
P 10-Bit Absolute Error1
AE
-2.5
2.5
Counts
5
C 10-Bit Absolute Error at fATDCLK= 4MHz
AE
±7.0
Counts
6
P 8-Bit Resolution
LSB
20
mV
7
P 8-Bit Differential Nonlinearity
DNL
–0.5
8
P 8-Bit Integral Nonlinearity
INL
–1.0
9
P 8-Bit Absolute Error(1)
AE
-1.5
0.5
Counts
±0.5
1.0
Counts
±1.0
1.5
Counts
NOTES:
1. These values include quantization error which is inherently 1/2 count for any A/D converter.
B.7.5 ATD accuracy - 3.3V Range
Table B-14 specifies the ATD conversion performance excluding any errors due to current injection,
input capacitance and source resistance.
Table B-14 3.3V ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
VREF = VRH - VRL = 3.328V. Resulting to one 8 bit count = 13mV and one 10 bit count = 3.25mV
fATDCLK = 2.0MHz
Num C
Rating
Symbol
Min
Typ
Max
3.25
Unit
1
P 10-Bit Resolution
LSB
2
P 10-Bit Differential Nonlinearity
DNL
–1.5
3
P 10-Bit Integral Nonlinearity
INL
–3.5
4
P 10-Bit Absolute Error1
AE
-5
5
C 10-Bit Absolute Error at fATDCLK= 4MHz
AE
±7.0
Counts
6
P 8-Bit Resolution
LSB
13
mV
7
P 8-Bit Differential Nonlinearity
DNL
–0.5
8
P 8-Bit Integral Nonlinearity
INL
–1.5
9
P 8-Bit Absolute Error(1)
AE
-2.0
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mV
1.5
Counts
±1.5
3.5
Counts
±2.5
5
Counts
0.5
Counts
±1.0
1.5
Counts
±1.5
2.0
Counts
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NOTES:
1. These values include the quantization error which is inherently 1/2 count for any A/D converter.
For the following definitions see also Figure B-8.
Differential Non-Linearity (DNL) is defined as the difference between two adjacent switching steps.
Freescale Semiconductor, Inc...
Vi – Vi – 1
DNL ( i ) = -----------------------–1
1LSB
The Integral Non-Linearity (INL) is defined as the sum of all DNLs:
n
Vn – V0
INL ( n ) =
∑ DNL ( i ) =
-------------------- – n
1LSB
i=1
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DNL
LSB
Vi-1
10-Bit Absolute Error Boundary
Vi
8-Bit Absolute Error Boundary
$3FF
$3FE
$3FD
$FF
$3FB
$3FA
$3F9
$3F8
$FE
$3F7
$3F6
$3F4
8-Bit Resolution
$3F5
10-Bit Resolution
Freescale Semiconductor, Inc...
$3FC
$FD
$3F3
9
Ideal Transfer Curve
8
2
7
10-Bit Transfer Curve
6
5
4
1
3
8-Bit Transfer Curve
2
1
0
5
10
15
20
25
30
35
40
50
5055 5060 5065 5070 5075 5080 5085 5090 5095 5100 5105 5110 5115 5120
Vin
mV
Figure B-8 ATD Accuracy Definitions
NOTE:Figure B-8 shows only definitions, for specification values refer to Table B-13 and Table
B-14.
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B.8 DAC Characteristics
This section describes the characteristics of the digital to analog converter.
B.8.1 DAC Operating Characteristics
Table B-15 DAC Electrical Characteristics (Operating)
Num
C
1
D
Characteristic
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DAC Supply Current
D
D
3
Symbol
Min
Typ
Max
Unit
VDDA
3.135
—
5.5
V
Running
IDDArun
—
—
3.5
mA
Stop
(low power)
IDDstop
—
—
1.0
mA
Low
VSSA
VSSA
—
VSSA
V
High
VREF
VDDA/2
—
VDDA
V
VREF to VSSA
IREF
—
—
400
mA
IOFF
-200
—
1
µA
T
-40
—
125
0C
DAC Supply
D
2
Condition
Reference Potential
D
4
D
Reference Supply Current
5
D
Input Current, Channel Off1
6
D
Operating Temperature
Range
Table B-16 DAC Timing/Performance Characteristics
Num
C
Parameters
D
DAC Operating
Frequency
1
D
Condition
Symbol
Min
Typ
Max
VDDA = 3.0V
VREF = TBD
fBUS
—
—
25
VDDA = 5.5V
VREF = TBD
fBUS
—
—
25
Unit
MHz
2
D
Integral Non-Linearity
INL
—
0.25
—
Count
3
D
Differential
Non-Linearity
DNL
—
0.10
—
Count
4
D
Resolution
RES
—
—
8
Bit
5
D
Settling Time
TS
5
—
10
µs
6
P
Absolute Accuracy
ABSACC
-1
—
1
Count
7
D
Offset Error
ERR
+/-2.5
mV
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Appendix C External Bus Timing
A timing diagram of the external multiplexed-bus is illustrated in Figure C-1 with the actual timing
values shown on table Table C-1. All major bus signals are included in the diagram. While both a data
write and data read cycle are shown, only one or the other would occur on a particular bus cycle.
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The expanded bus timings are highly dependent on the load conditions. The timing parameters shown
assume a balanced load across all outputs.
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Figure C-1 General External Bus Timing
1, 2
3
4
ECLK
PE4
5
9
Freescale Semiconductor, Inc...
Addr/Data
(read)
PA, PB
6
16
15
7
data
8
14
13
data
addr
17
11
data
addr
data
12
Addr/Data
(write)
PA, PB
10
19
18
Non-Multiplexed
Addresses
PK5:0
20
21
22
23
ECS
PK7
24
25
26
27
28
29
30
31
32
33
34
R/W
PE2
LSTRB
PE3
NOACC
PE7
35
36
IPIPO0
IPIPO1, PE6,5
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Table C-1 Expanded Bus Timing Characteristics (5V Range)
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Conditions are 4.75V < VDDX < 5.25V, Junction Temperature -40°C to +140°C, CLOAD = 50pF
Num
C
Rating
Symbol
Min
1
P
Frequency of operation (E-clock)
2
P
Cycle time
3
D
4
Typ
Max
Unit
fo
0
25.0
MHz
tcyc
40
ns
Pulse width, E low
PWEL
19
ns
D
Pulse width, E high1
PWEH
19
ns
5
D
Address delay time
tAD
6
D
Address valid time to E rise (PWEL–tAD)
tAV
11
ns
7
D
Muxed address hold time
tMAH
2
ns
8
D
Address hold to data valid
tAHDS
7
ns
9
D
Data hold to address
tDHA
2
ns
10
D
Read data setup time
tDSR
13
ns
11
D
Read data hold time
tDHR
0
ns
12
D
Write data delay time
tDDW
13
D
Write data hold time
tDHW
2
ns
14
D
Write data setup time(1) (PWEH–tDDW)
tDSW
12
ns
15
D
Address access time(1) (tcyc–tAD–tDSR)
tACCA
19
ns
16
D
E high access time(1) (PWEH–tDSR)
tACCE
6
ns
17
D
Non-multiplexed address delay time
tNAD
18
D
Non-muxed address valid to E rise (PWEL–tNAD)
tNAV
14
ns
19
D
Non-multiplexed address hold time
tNAH
2
ns
20
D
Chip select delay time
tCSD
21
D
Chip select access time(1) (tcyc–tCSD–tDSR)
tACCS
11
ns
22
D
Chip select hold time
tCSH
2
ns
23
D
Chip select negated time
tCSN
8
ns
24
D
Read/write delay time
tRWD
25
D
Read/write valid time to E rise (PWEL–tRWD)
tRWV
14
ns
26
D
Read/write hold time
tRWH
2
ns
27
D
Low strobe delay time
tLSD
28
D
Low strobe valid time to E rise (PWEL–tLSD)
tLSV
14
ns
29
D
Low strobe hold time
tLSH
2
ns
30
D
NOACC strobe delay time
tNOD
31
D
NOACC valid time to E rise (PWEL–tNOD)
tNOV
8
7
6
16
7
7
7
14
ns
ns
ns
ns
ns
ns
ns
ns
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Table C-1 Expanded Bus Timing Characteristics (5V Range)
Conditions are 4.75V < VDDX < 5.25V, Junction Temperature -40°C to +140°C, CLOAD = 50pF
32
D
NOACC hold time
tNOH
2
33
D
IPIPO[1:0] delay time
tP0D
2
34
D
IPIPO[1:0] valid time to E rise (PWEL–tP0D)
tP0V
11
35
D
IPIPO[1:0] delay time(1) (PWEH-tP1V)
tP1D
2
36
D
IPIPO[1:0] valid time to E fall
tP1V
11
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NOTES:
1. Affected by clock stretch: add N x tcyc where N=0,1,2 or 3, depending on the number of clock stretches.
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ns
7
ns
ns
25
ns
ns
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Table C-2 Expanded Bus Timing Characteristics (3.3V Range)
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Conditions are VDDX=3.3V+/-10%, Junction Temperature -40°C to +140°C, CLOAD = 50pF
Num
C
Rating
Symbol
Min
1
P
Frequency of operation (E-clock)
2
P
Cycle time
3
D
4
Typ
Max
Unit
fo
0
16.0
MHz
tcyc
62.5
ns
Pulse width, E low
PWEL
30
ns
D
Pulse width, E high1
PWEH
30
ns
5
D
Address delay time
tAD
6
D
Address valid time to E rise (PWEL–tAD)
tAV
16
ns
7
D
Muxed address hold time
tMAH
2
ns
8
D
Address hold to data valid
tAHDS
7
ns
9
D
Data hold to address
tDHA
2
ns
10
D
Read data setup time
tDSR
15
ns
11
D
Read data hold time
tDHR
0
ns
12
D
Write data delay time
tDDW
13
D
Write data hold time
tDHW
2
ns
14
D
Write data setup time(1) (PWEH–tDDW)
tDSW
15
ns
15
D
Address access time(1) (tcyc–tAD–tDSR)
tACCA
29
ns
16
D
E high access time(1) (PWEH–tDSR)
tACCE
15
ns
17
D
Non-multiplexed address delay time
tNAD
ns
18
D
Non-muxed address valid to E rise (PWEL–tNAD)
tNAV
ns
19
D
Non-multiplexed address hold time
tNAH
ns
20
D
Chip select delay time
tCSD
ns
21
D
Chip select access time(1) (tcyc–tCSD–tDSR)
tACCS
ns
22
D
Chip select hold time
tCSH
ns
23
D
Chip select negated time
tCSN
ns
24
D
Read/write delay time
tRWD
25
D
Read/write valid time to E rise (PWEL–tRWD)
tRWV
16
ns
26
D
Read/write hold time
tRWH
2
ns
27
D
Low strobe delay time
tLSD
28
D
Low strobe valid time to E rise (PWEL–tLSD)
tLSV
16
ns
29
D
Low strobe hold time
tLSH
2
ns
30
D
NOACC strobe delay time
tNOD
31
D
NOACC valid time to E rise (PWEL–tNOD)
tNOV
16
15
14
14
14
16
ns
ns
ns
ns
ns
ns
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Table C-2 Expanded Bus Timing Characteristics (3.3V Range)
Conditions are VDDX=3.3V+/-10%, Junction Temperature -40°C to +140°C, CLOAD = 50pF
32
D
NOACC hold time
tNOH
2
33
D
IPIPO[1:0] delay time
tP0D
2
34
D
IPIPO[1:0] valid time to E rise (PWEL–tP0D)
tP0V
16
35
D
IPIPO[1:0] delay time(1) (PWEH-tP1V)
tP1D
2
36
D
IPIPO[1:0] valid time to E fall
tP1V
11
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NOTES:
1. Affected by clock stretch: add N x tcyc where N=0,1,2 or 3, depending on the number of clock stretches.
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ns
14
ns
ns
25
ns
ns
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Device User Guide — 9S12E128DGV1/D V01.04
Appendix D Package Information
D.1 80-pin QFP package
L
60
41
61
B
D
D
S
V
B
P
B
0.20 M C A-B
L
0.20 M H A-B
-B-
0.05 D
Freescale Semiconductor, Inc...
-A-
S
S
S
40
-A-,-B-,-DDETAIL A
DETAIL A
21
80
1
A
0.20 M H A-B
S
F
20
-DD
S
0.05 A-B
J
S
0.20 M C A-B
S
D
N
S
E
M
D
DETAIL C
0.20 M C A-B
C
-CSEATING
PLANE
-H-
DATUM
PLANE
0.10
H
D
S
SECTION B-B
VIEW ROTATED 90 °
M
G
U
T
DATUM -HPLANE
R
K
W
X
DETAIL C
S
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
MILLIMETERS
MIN
MAX
13.90 14.10
13.90 14.10
2.15
2.45
0.22
0.38
2.00
2.40
0.22
0.33
0.65 BSC
--0.25
0.13
0.23
0.65
0.95
12.35 REF
5°
10°
0.13
0.17
0.325 BSC
0°
7°
0.13
0.30
16.95 17.45
0.13
--0°
--16.95 17.45
0.35
0.45
1.6 REF
Figure D-1 80-pin QFP Mechanical Dimensions (case no. 841B)
153
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Device User Guide — 9S12E128DGV1/D V01.04
D.2 112-pin LQFP package
0.20 T L-M N
4X
PIN 1
IDENT
0.20 T L-M N
4X 28 TIPS
112
J1
85
4X
P
J1
1
C
L
84
VIEW Y
108X
G
X
X=L, M OR N
VIEW Y
V
B
Freescale Semiconductor, Inc...
L
M
28
B1
57
29
F
D
56
0.13
N
S1
A
S
C2
VIEW AB
θ2
0.050
0.10 T
112X
θ3
T
θ
R
R2
R
0.25
R1
GAGE PLANE
(K)
E
θ1
(Y)
VIEW AB
T L-M N
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED
AT
SEATING PLANE, DATUM T.
4. DIMENSIONS S AND V TO BE DETERMINED
AT
SEATING PLANE, DATUM T.
5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
SEATING
PLANE
C1
M
BASE
METAL
SECTION J1-J1
ROTATED 90° COUNTERCLOCKWISE
A1
C
AA
J
V1
(Z)
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DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
P
R1
R2
S
S1
V
V1
Y
Z
AA
θ
θ1
θ2
θ3
MILLIMETERS
MIN
MAX
20.000 BSC
10.000 BSC
20.000 BSC
10.000 BSC
--1.600
0.050 0.150
1.350 1.450
0.270 0.370
0.450 0.750
0.270 0.330
0.650 BSC
0.090 0.170
0.500 REF
0.325 BSC
0.100 0.200
0.100 0.200
22.000 BSC
11.000 BSC
22.000 BSC
11.000 BSC
0.250 REF
1.000 REF
0.090 0.160
8 °
0°
7 °
3 °
11 ° 13 °
11 °
13 °
Freescale Semiconductor,
Inc.
Device User Guide — 9S12E128DGV1/D V01.04
Freescale Semiconductor, Inc...
Device User Guide End Sheet
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FINAL PAGE OF
156
PAGES
156
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