Datasheet
AC/DC Drivers
Quasi-Resonant Control type
DC/DC Converter IC
BM1Q011FJ
●General Description
The quasi-resonant controller typed AC/DC converter IC
BM1Q011FJ provides an optimum system for all products
that include an electrical outlet. Quasi-resonant operation
enables soft switching and helps to keep EMI low.
With MOSFET for switching and current detection
resistors as external devices, a higher degree of design
freedom is achieved.
This IC built in HV starter circuit, it contributes to low
consumption power and high speed start.
Because the burst mode is built-in and IC consumption
current is low, stand-by power becomes very low.
Because BM1Q011FJ series built-in soft-start, burst mode,
over current limiter which is cycle-by-cycle, over load
protection, over voltage protection, CS Open Protection
and so on, BM1Q011FJ are highly safety.
●Features
Quasi-resonant method
Built-in 650V tolerate start circuit
Low power at the light load (burst operation)
Maximum frequency control (120kHz)
Frequency reduction function
AC voltage correction function
VCC pin : under voltage protection
VCC pin : over voltage protection
Over-current protection (cycle-by-cycle)
Output driver 12V clamp circuits
Soft start function
ZT trigger mask function
Over Load protection [Auto-restart]
CS pin open protection [Auto-restart]
●Package
SOP-J7S
●Key Specifications
Operating Power Supply Voltage Range:
:
VCC：8.9V to 26.0V
VH：
to 600V
Operating Current:
Normal：0.60mA (Typ.)
Burst ： 0.35mA(Typ.)
Max frequency:
120kHz(Typ.)
Operate temperature range:
-40
to +85
●Typical Application Circuit
6.00mm × 4.90mm × 1.65mm
(Typ.)
(Typ.)
(Typ.)
●Applications
Air conditioner, AC adapters, TV such as the products
which need the outlet.
Figure 1. Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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Datasheet
BM1Q011FJ
●Absolute Maximum Ratings（Ta=25C）
Item
Symbol
Rating
Unit
Condition
Input voltage range 1
Vmax1
-0.3 ~ 30
V
VCC
Input voltage range 2
Vmax2
-0.3 ~ 6.5
V
FB, CS
Input voltage range 3
Vmax3
-0.3 ~ 7.0
V
ZT
Input voltage range 4
Vmax4
-0.3 ~ 15
V
OUT
Input voltage range 5
Vmax5
-0.3 ~ 650
V
VH
OUT pin out peak current1
IOH
-0.5
A
OUT pin out peak current2
IOL
1.0
A
ZT pin current1
ISZT1
-3.0
mA
ZT pin current2
ISZT2
3.0
mA
CS pin current1
ISCS1
-0.45
mA
Sink current
Allowable dissipation
Pd
0.675 (Note1)
W
o
Operating temperature
Topr
-40 ～ +85
C
o
Max junction temperature
Tjmax
150
C
o
Storage temperature range
Tstr
-55 ～ +150
C
(Note1) When mounted on 70 mm × 70 mm × 1.6 mm (glass epoxy on single-layer substrate).
Reduce to 5.4 mW/C when Ta = 25C or above.
●Operating Conditions（Ta=25C）
Parameter
Power supply voltage range 1
Power supply voltage range 2
Symbol
VCC
VH
Rating
8.9～26.0
80～600
Unit
V
V
●Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
Symbol
MIN
TYP
MAX
Conditions
VCC
VH
Unit
Conditions
［Circuit current］
FB=2.0V
(Switching operation)
FB=0.5V
(Switching OFF)
VCC=12V , VH: open
VCC UVLO = disable
Circuit current (ON)1
ION1
-
600
1000
uA
Circuit current (ON)2
ION2
-
350
450
uA
Circuit current(OFF)
IOFF
-
-
25
uA
VH Start current 1
VH Start current 2
ISTART1
ISTART2
0.400
1.00
0.700
3.00
1.000
6.00
mA
mA
VH OFF current
ISTART3
-
10
20
uA
VSC
0.400
0.800
1.400
V
VUVLO1
VUVLO2
VUVLO3
VCHG1
VCHG2
VOVP1
VOVP2
VOVP3
12.50
7.50
7.70
12.00
26.00
-
13.50
8.20
5.30
8.70
13.00
27.50
23.50
4.00
14.50
8.90
9.70
14.00
29.00
-
V
V
V
V
V
V
V
V
VCC rise
VCC fall
VUVLO3= VUVLO1-VUVLO2
Starter circuit
Stop voltage from VCHG1
VCC rise
VCC fall
VOUTH
VOUTL
RPDOUT
10.5
75
12.5
100
14.5
0.30
125
V
V
kΩ
IO=-20mA, VCC=15V
IO=+20mA
［VH pin starter］
VH start current switched voltage
VCC= 0V
VCC=10V
After releasing VCCUVLO
VH pin current
VCC pin
［VCC pin protection］
VCC UVLO voltage1
VCC UVLO voltage2
VCC UVLO hysteresis
VCC charge start voltage
VCC charge end voltage
VCC OVP voltage1
VCC OVP voltage2
VCC OVP hysteresis
［OUT pin］
OUT pin H voltage
OUT pin L voltage
OUT pin Pull-down resistor
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Datasheet
BM1Q011FJ
●IC control unit Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
Symbol
Unit
MIN
TYP
MAX
Conditions
[ DC/DC converter unit （Turn-off）]
Pull-up resistor of FB pin
CS over current voltage 1A
CS over current voltage 1B
CS over current voltage 2A
CS over current voltage 2B
Voltage gain1
（∆VFB/∆VCS）
Voltage gain 2
（∆VFB/∆VCS）
ZT current switched CS 1
ZT current switched CS 2
ZT current hysteresis
switched CS voltage
CS Leading Edge Blanking time
Turn-off time
Minimum ON width
Maximum ON width
RFB
Vlim1A
Vlim1B
Vlim2A
Vlim2B
22.5
0.475
0.310
-
30.0
0.500
0.350
0.125
0.088
37.5
0.525
0.390
-
kΩ
V
V
V
V
FB=2.2V (ACSNS＝L)
FB=2.2V (ACSNS＝H)
FB=0.5V (ACSNS＝L)
FB=0.5V (ACSNS＝H)
AVCS1
3.40
4.00
4.60
V/V
ACSNS＝L
AVCS2
4.86
5.71
6.57
V/V
ACSNS＝H
IZT1
IZT2
0.93
0.82
1.00
0.90
1.07
0.98
mA
mA
IZTHYS
-
0.10
-
mA
TLEB
TOFF
Tmin
Tmax
30.0
0.250
0.150
0.400
39.0
50.7
us
us
us
us
IZT1
IZT2
IZT3
FSW1
FSW2
4
6
8
108
-
14
16
18
120
30
24
26
28
132
-
uA
uA
uA
kHz
kHz
TLEB＋TOFF
[ DC/DC converter unit （Turn-on）]
ZT input current 1
ZT input current 2
ZT input current 3
Max frequency 1
Max frequency 2
Frequency reduction start
voltage
Frequency reduction end voltage
ZT comparator voltage1
ZT comparator voltage2
VFBSW1
1.10
1.25
1.40
V
VFBSW2
VZT1
VZT2
0.42
60
120
0.50
100
200
0.58
140
280
V
mV
mV
ZT trigger mask time
TZTMASK
-
0.6
-
us
ZT trigger Timeout1
ZT trigger Timeout2
TZTOUT1
TZTOUT2
10.5
3.5
15.0
5.0
19.5
6.5
us
us
Soft start time1
TSS1
0.35
0.50
Soft start time 2
TSS2
0.70
1.00
Soft start time 3
TSS3
1.40
2.00
Soft start time 4
TSS4
2.80
4.00
FB Burst voltage
VBURST
0.42
0.50
FB OLP voltage a
VFOLP1A
2.6
2.8
FB OLP voltage b
VFOLP1B
2.6
FB OLP detection timer
TFOLP
44.8
64
FBOLP stop timer
TOLPST
358
512
Latch mask time
TLATCH
50
100
* Definition of ACSNS (L : ZT current < IZT1 、H : ZT current > IZT1)
0.65
1.30
2.60
5.20
0.58
3.0
83.2
666
200
ms
ms
ms
ms
V
V
V
ms
ms
ms
OUT=L, ZT=4.65V
OUT=L, ZT=5.00V
OUT=L, ZT=5.35V
FB=2.0V
FB=0.5V
ZT fall
ZT rise
In OUT H ->L,
prevent noise
Without bottom detection
Count from final ZT trigger
[DC/DC protection ]
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FBOLP detect（FB fall）
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Datasheet
BM1Q011FJ
●Pin Configuration
Table 1 Input-Output PIN Function
NO.
Pin Name
I/O
1
2
3
4
5
6
7
ZT
FB
CS
GND
OUT
VCC
VH
I
I
I
I/O
O
I/O
I
Function
Zero current detect pin
Feedback signal input pin
Primary current sensing pin
GND pin
External MOS drive pin
Power supply pin
Starter circuit pin
ESD Diode
VCC
○
○
○
○
-
GND
○
○
○
○
○
○
● External Dimensions
(TOP VIEW)
ZT
1
7
VH
FB
2
CS
3
6
VCC
GND
4
5
OUT
Figure 2. SOP-J7 package external dimensions
●I/O Equivalent Circuit Diagram
Figure 3. I/O Equivalent Circuit Diagram
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BM1Q011FJ
OSC
OSC
●Block Diagram
Figure 4. Block Diagram
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BM1Q011FJ
●Description of Blocks
(1-1) Starter Circuit VH pin（7pin）
The IC builds in starter circuit (tolerates 650V) to VH pin (8pin). It enables to be low standby power and high speed
starting. The operating current is shown in Figure 6. After starting the IC, the idling current ISTART3（typ=10uA） flows
from VH voltage. The loss by the idling current is shown below.
ex) power consumption of starter circuit only
Vac=100V Power＝100V*√2*10uA=1.41mW
Vac=240V Power＝240V*√2*10uA=3.38mW
Starting time is decided by VH current and VCC pin capacitor value. The reference value of starting time is shown in
Figure 7.
For example, VCC pin is charged within about 0.1 sec at CVCC=10uF. When the VCC pin is shorted to GND, the
current of ISTART1 flows to (shown in Figure 6). When the VH pin is shorted to GND, the large current flows from VH
line to GND. To prevent this, it is needed to insert the resistor (5kΩ~60kΩ) for limiting current between the VH line and
2
the VH pin. When VH pin is shorted to GND, the power of VH /RVH is applied to this resistor, so please decide the
resistor value depending on specifications after having confirmed allowable electricity.
+
FUSE
AC
Input
Diode
Bridge
-
Rvh
7
VH
SW1
6
VCC
Cvcc
+
VCCUVLO
Figure 5. Starter Block Diagram
Start time [ms]
VCC Capacitor value – startup time
VCC Capacitor value [uF]
Figure 6. Start-up Current vs. VCC Voltage
*The start up current is flown from VH pin (7Pin).
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Figure 7. Start-up Time（example）
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Figure 8 shows operation waveform of start-up.
VH
Voltage
ISTART2
VH input
current
ISTART1
ISTART3
VUVLO1
VCC(5pin)
VSC
Switing
Set voltage
Secondary
output
A
B
C
D
Figure 8. Start-up Waveform
A: By inserting to outlet, the VH voltage applies. From this moment, charging to VCC pin starts from the VH pin through
starter circuit. At the time, due to VCC < VSC (typ=0.8V), VH input current is limited to ISTART1 by the VCC pin short
protection function.
B: Because of VCC voltage > VSC (typ=0.8V), VCC short protection is released and the current of the VH input current
waveform flows from VH pin.
C: Because of VCC voltage > VUVLO1 (typ=13.5V), the start-up circuit stops and VH input current is limited to ISTART3
(typ=10uA) only. Furthermore, for starting switching operation secondary output starts to rise however the VCC pin
voltage lowers because the Secondary output is low yet. The falling rate of the VCC is determined by the VCC pin
capacitance, the consumption current of the IC and the load current that flows from the VCC pin. (V/t = Cvcc/Icc)
D: Because secondary output has risen to specific voltage, the VCC pin is applied from the auxiliary winding and VCC
voltage is stabilized.
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(1-2) a case without using VH pin
This IC is also possible to start by connecting the start-up resistor to the VCC pin in the open start-up circuit (650V
breakdown voltage) of the VH pin. The structure that does not use the recharge function is shown in Figure 9.At
start-up (before VCC VULO released), please be careful to set the start-up resistor Rstart shown in Figure 9, because
the consumption current IOFF (Max=25uA) flows from VCC pin (6pin).
Rstart
Figure 9. Application Circuit without using the VH pin
・How to set the start-up resistance
Start-up resistor Rstart shown in Figure 9 is necessary for the IC to start if you do not use the VH pin. If the value of
Rstart is small, the standby power is increased and the start-up time becomes shorter. Adversely, if the value of Rstart
is big, the standby power is reduced and start-up time becomes longer. When the VCC voltage=12V, the standby
current IOFF is 25μA (max) and the VCC UVLO voltage VUVLO1 is 14.5V (max).
ex） The example of start-up resistor Rstart setting
Rstart = (VH min - VUVLO1（max）) / IOFF（max）
In Vac=100V, if margin is -30%, VH min=100×√2×0.7=99V
VUVLO1（max）=14.5V, so Rstart = (99-14.5) / 25μA＝3.38MΩ
For an example, with a sufficient margin to 3.38MΩ, the Rstart is set to 2.0MΩ.In case of AC100V, Power consumption
in Rstart is below.
2
2
Pd (Rstart) = (VH-VCC) /Rstart = (141V-14.5V) /2.0M = 8.00mW
Pd in using start-up resistor is more than in using VH pin. However, about the value of VCC pin capacitance and VCC
start-up resistor, please confirm by performing the evaluation of the actual application.
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BM1Q011FJ
(2) Start Sequence (Soft start, Light load operation, Auto recovery in over load protection)
The start sequence of IC is shown in Figure 10. About each detail, explain in each section.
VH(7pin)
13.5V
VCC(6pin)
VCC=8.5V
Internal REF
Pull Up
64ms
Within 44.8ms
64msec
2.8V
FB(2pin)
Vout
Over Load
Normal Load
Light LOAD
Iout
Burst mode
Switching
Soft
Start
A
BC
D
E
F
GH
I J
K
Figure 10. Start Sequence Time Chart
A: The voltage is applied to the Input voltage VH pin (7pin).
B : VCC pin (6pin) voltage rise, when VCC＞VUVLO1（typ=13.5V）, IC starts operating. In the case that protection
function is normal condition, the IC starts switching operation. Then the VCC pin voltage drops absolutely by the
VCC pin consumption current. In case of the VCC< VCHG1 (typ =8.7V), the starting circuit operates and charges the
VCC. After starting to charge, it lasts charging until VCC> VCHG1 (typ =13.0V)
C: The IC has a soft start function which regulates the voltage level at the CS pin to prevent a rise in voltage and
current.
D: When the switching operation starts, the secondary output voltage VOUT rises. After starting switching, it is
necessary to set the output voltage to stable the due output voltage within the TFOLP (typ=64ms) period.
E: At light load condition, the burst operation starts for keeping power consumption low.
F: When it is heavy load, FB pin voltage (2pin) is larger than VFOLP1A (typ=2.8V), because output voltage is down.G:
When the condition that FB pin (2pin) voltage is more than VFOLP1A (typ=2.8V) continues for T FOLP (64ms typ), the
switching is stopped by the over load protection for TOLPST (typ=512ms). When the FB pin (2pin) voltage becomes to
be lower than VFOLP1B, the timer internal the IC T FOLP (64ms typ) is reset.
H: When VCC voltage (6pin) is less than VCHG1 (typ=8.7V), the starter circuit starts to operate and charge the VCC pin
(6pin) .
I : When VCC voltage (6pin) is more than VCHG2 (typ =13.0V), the starter circuit stops to charge to the VCC pin (6pin).
J: Same as F.
K: Same as G.
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(3) VCC pin (6pin) Protection Function
The IC built in VCC UVLO (Under Voltage Protection) function, VCC OVP (Over Voltage Protection) function and
VCC charge function which operates when the VCC voltage drops.VCC UVLO and VCC OVP are the function that
prevents MOSFET for switching from destroying at the VCC voltage low or high conditions. And the VCC charge
function charges in high voltage line from starting circuits and stabilize the secondary output voltage.
(3-1) VCC UVLO / VCC OVP Function
VCC UVLO is the function monitors the VCC pin voltage and switches ON/OFF of the IC. This function has a voltage
hysteresis and it is auto recovery protection type. VCC OVP is also the type. Refer to the operation figure 11. The auto
recovery protection function of this IC’s VCC OVP stops the switching when the condition that the VCC pin (6pin)
voltage is more than VOVP1 (typ=27.5V) continues for more than mask time TSTOP (typ=100us). And it restarts switching
when the condition that VCC pin (6pin) voltage is lower than VOVP2 (typ=23.5V).
Figure 11. VCC UVLO / OVP Timing Chart
A: The VH (7pin) voltage is applied, and the VCC (6pin) voltage starts rising.
B: The VCC pin (6pin) voltage > VUVLO1, the VCC UVLO function is released and DC/DC operation starts.
C: The VCC pin (6pin) voltage >VOVP1, VCCOVP detects the over-voltage in the IC.
D: When the condition that the VCC (6pin) voltage is more than VOVP1 continues for TSTOP (typ =100us), switching is
stopped by the VCCOVP function.
E: The VCC (6pin) voltage < VCHG1, the VCCOVP function is released and the operation is restarted.
F: The high voltage line VH drops.
G: The VCC voltage < VUVLO2, VCCUVLO function starts operation and the switching is stopped.
H: The high voltage line VH is applied.
I: The VCC pin (6pin) becomes more than VUVLO1 and VCCUVLO function operates.
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・Regarding capacitor value of VCC pin
For stable operation of the IC, please set the capacitor value to 1uF or higher of the VCC pin. When the VCC
capacitor terminal is too large, the response of the VCC pin to the Secondary output is slows down. Additionally,
if the degree of the transformer coupling is low, since a large surge occurs to the VCC pin, the IC may be
destroyed. In this case, it is necessary that a resistor which is from 10Ω to 100Ω is attached to the path between
the capacitor and diode at the back of the auxiliary winding or the capacitor of the VCC pin is increased. And the
fixed number is has to be set the VCC pin surge voltage not to exceed the absolute maximum rating of the VCC
pin by evaluating the waveform of the VCC pin.
・Regarding VCC OVP voltage protection setting method in case of rising Vout (secondary output)
The VCC pin voltage is determined by the transformer ratio (Np:Ns) and Vout (Secondary output). Therefore,
when the Secondary output becomes large, it is possible to protect the IC by VCCOVP. Setting method of
VCCOVP protection is shown below.
Vout
Np
Ns
Nb
Figure 12. How to Set VCCOVP
The VCC voltage is determined by the formula below.
VCC voltage = (Vout-VFs)×Nb/Ns -VFb
(Vout: Secondary output, Nb: Number of auxiliary winding, Ns: Number of secondary winding
VFx: Secondary diode VF, VFb: auxiliary winding diode VF)
If you want to apply protection when it becomes Secondary output × 1.3, please set the number of turns to be the next
formula. 1.3 × (Vout × (Nb/Ns) - VF) > VOVP1
Because VCCOVP protection has a blanking time of TSTOP (typ = 100us), it is not detected for momentary surge noise
of the VCC pin. However, VCCOVP is detected when the VCC voltage becomes higher than VOVP1 for the period of
more than VSTOP. So it is necessary to check in application evaluation when you set VCCOVP.
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(3-2）VCC Recharge Function
After the VCC (6pin) voltage > VUVLO1, the IC start to operate. After that, when the VCC pin voltage < VCHG1, VCC
charge function operates. Then the IC charges the VCC pin (6pin) from the VH pin through the starting circuits. This
operation prevents the IC from the VCC starting errors. After the VCC pin (6pin) is charged and rise to more than VCHG2,
the charging is stopped. This operation is shown to Figure 13.
Figure 13. VCC pin Charge Operation
A: As the VH pin voltage (7pin) rises, the VCC pin (6pin) is started to charge by the VCC charge function.
B: The VCC pin (6pin) voltage > VUVLO1, VCC UVLO function is released, VCC charge function is stopped, DC/DC
operation start.
C: The VCC pin (6pin) voltage is dropped because OUTPUT voltage is low at starting.
D: The VCC pin (6pin) voltage < VCHG1, the VCC charge function operates and VCC pin (6pin) voltage rises.
E: The VCC pin (6pin) voltage > VCHG2, the VCC charge function stops.
F: The VCC pin (6pin) voltage < VCHG1, the VCC charge function operates and VCC pin (6pin) voltage rises.
G: The VCC pin (6pin) voltage > VCHG2, the VCC charge function stops.
H: The output voltage stops stating operation and the VCC pin is charged from auxiliary winding. Then the VCC pin
(6pin) becomes to be stable.
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(4) DC/DC Driver
The IC operates in PFM (Pulse Frequency Modulation) mode method. By monitoring the FB pin (2pin), ZT pin (1pin)
and CS pin(3pin), the IC supply optimum system for DC/DC operation. The IC controls ON width (Turn Off) of the
switching MOSFET by the FB pin (2pin) and CS pin (3pin). The IC also does OFF width (Turn ON) by the ZT pin (1pin).
The detail is shown below.
OSC
(4-1) QR-basic Operations
The QR basic block diagram and the basic operation are shown in Figure 14 and 15.
Figure 14. DC/DC Operation Block
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Figure 15. QR Basic Operation
About Figure 15
A: The IC detects a bottom signal and outputs SET signal. Then it turns ON the MOSFET. At this moment, a noise
occurs at the CS pin because the capacitor between DRAIN and SORCE of MOSFET is discharged. This noise is
called Leading Edge. And this IC has an internal filter for this noise (Refer to (4-3)). This filter and delay time make
the minimum pulse of the IC 400ns (typ). After that, the current flows to the MOSFET and the voltage (Vcs=Rs*Ip)
applies to the CS pin.
B: If the CS pin voltage rises to more than the FB pin voltage / Gain (typ=4) or over current detection voltage VCS
(typ=0.5V), the IC outputs the RESET signal and turns OUT off.
C: It takes delay time Tondelay until the IC turn off from point B. For this time, the maximum electric power increases
depending the AC voltage. This IC has the function that restricts the increment (Refer to (4-4)).
D: The DRAIN voltage drops because the energy stocked in transformer is discharged to secondary side and there is
no energy in it. At this moment, the IC detects a bottom signal but the signal is ignored not to exceed the maximum
frequency. Then the auto vibration of the transformer Lp and MOSFET Cds (the capacitor between the DRAIN and
SORCE) starts.
E: After the specific period passes from the point A and the time which determined by the maximum frequency also
passes, the SET signal is outputs if the IC detects a bottom and turns MOSFET on.
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(4-2) Determination of ON Width（Turn OFF）
ON width is controlled by FB (2pin) and CS (3pin).By comparison between the FB pin voltage divided by AVcs (typ=4)
and CS pin voltage, the IC decides ON width. Besides, by comparison with Vlim1 (typ=0.5V) voltage which is
generated in the IC, the CS comparator level is changed lineally to be shown in Figure 16 (the bottom side). Then the
maximum frequency also changes. The CS pin (3pin) is shared with over current limiter circuit by pulse. The IC
changes the maximum blanking frequency and over current limiter level by the FB pin (2pin) voltage.
mode1:
mode2:
mode3:
mode4:
Burst operation
Frequency reduction operation（reduce max frequency）
Max frequency operation (operate at maximum frequency)
Over load operation（stop the pulse operation detecting the over load condition）
Y
MAX Fsw[kHz]
mode1
mode2
mode3
mode4
120kHz
30kHz
0.0V
0.5V
1.25V
2.0V
2.8V
X
FB [V]
Y
CS Limiter[V]
mode1
mode2
mode3
mode4
Vlim1
Vlim2
0.0V
0.5V
1.25V
2.0V
2.8V
X
FB [V]
Figure 16. relation of the FB pin, over current limiter and maximum frequency
The ON width Ton is decided by the CS Limiter level (VCS).
.
Ton = (Lp*Vcs) / (Vin*RS)
Lp: primary inductance value, Vin: VH voltage (Figure 14), RS: Sense resistor (Figure 14)
To adjust over current limiter level, the IC switches the soft start function and over current protection at input voltage. In
this case, the value of Vlim1 and Vlim2 is changed as below.
Soft start
Table 2. Over current protection voltage Detail
AC=100V
AC=230V
Vlim1
Vlim2
Vlim1
Vlim2
start～0.5ms
0.063V (12%)
0.016V (3%)
0.044V (10%)
0.011V (2%)
0.5ms～1ms
0.125V (25%)
0.032V (6%)
0.088V (20%)
0.022V (4%)
1ms～2ms
0.250V (50%)
0.063V (12%)
0.175V (40%)
0.044V (9%)
2ms～4ms
0.375V (75%)
0.094V (19%)
0.263V (60%)
0.066V (13%)
4ms～
0.500V (100%)
0.125V (25%)
0.350V (70%)
0.088V (18%)
*(percent) is shown the comparative related value with Vlim1（typ=0.5V）in normal operation.
The reason that distinguish between AC100V and AC230V is by CS over current protection voltage switch function
which is shown to（4-4）.
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(4-3) LEB（Leading Edge Blanking） Function
When a MOSFET for switching is turned ON, a surge current occurs in cause of a capacitance or rush current.
Therefore, when the CS (3pin) voltage rises temporarily, an over current limiter circuit may miss detections. To prevent
miss detections, the IC build-in blanking function which mask for TLEB （typ=250ns） from switching the OUT pin(5pin)
from L to H. This blanking function enables to reduce noise filter of the CS pin (3pin). However, when the CS pin noise
does not converge less than 250ns, it is needed to attach RC filter to the CS pin shown in Figure 17. Then, a delay
time occurs to the CS pin detection by RC filter. Also, even if the filter in not attached, it is recommended that it is
attached an Rcs resistor to the CS pin as a surge provision. Rcs recommended resistor value is about 1kΩ. If you
would like to filter, please adjust in Ccs for this resistor.
Figure 17. a circuit surrounding the CS pin
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(4-4) CS over Current Protection Switching Function
If the input voltage (VH) becomes higher, the slope of L current raises. The switching has a constant delay time, so
the maximum allowable power increases for a constant over current limiter depending AC voltage. For this
countermeasure, this IC switches the internal over current protection function monitoring the input voltage. In case of
high voltage (AC230V), it is needed to set the over current comparator to normal 0.7 times. The IC detects by
monitoring the ZT inflow current and switching. When the MOSFET is turns ON, Va becomes minus voltage depending
on the input voltage (VH). The ZT pin (1pin) cramps near 0V internal the IC. The way to determine Rzt1, Rzt2 and Czt
is below. The block diagram is shown in Figure 18. The graph is also shown in Figure 19 and 20.
Izt1 = (Va－Vzt) / Rzｔ1 ≒ Va / Rzｔ1 = VH * Na/Np /Rzｔ1
Rzt1 = Va / Izt1
Va: the auxiliary winding voltage (switching plus/minus) At deciding Rzt1, it should be determined from minus
voltage value, and deciding Rzt2, it should be done from plus voltage value.
Izt1: the current that flows to the ZT pin Vzt: the ZT pin voltage
As the formula, Rzt1 is has to be set to the value that is divided by 1zt (typ=1mA) for the auxiliary winding Va under
the AC voltage condition which the IC is going to switch the over current detection level. Secondly, the timing of turning
on is has to be set by Czt to operate the ZT pin bottom detection at the moment that the Drain voltage of MOSFET is
0V. Finally, Rzt2 is also has to set the maximum ZT pin voltage is around 1 to 3V for the plus voltage of the auxiliary
winding. (The noises are piled up to the ZT pin so the value of maximum voltage has been set considering a margin.)
For that, Rzt2 is calculated as below. (In the case of setting in 2V)
VZT = Va×Rzt2/(Rzt1+Rzt2) < 2V
=>
Rzt2 < 2×Rzt1 / (Va-2)=2×Rzt1/(Na/Ns×(Vout-VFs)-2)
The auxiliary winding voltage Va has to be calculated in the plus voltage at maximum loads. In addition, the CS over
current protection switching ZT current has the hysteresis of IZTHYS (typ=0.1mA).
6
NOUT
+
12V Clamp
Circuit
-
1 shot
1
+
TimeOut
15 usec
5 usec
AND
-
7V
100mV
/200mV
ZT Blanking
OUT(H->L)
0.60us
OR
AND
SET
POUT
S Q
NOUT
FBOLP_OH
AND
AND
PRE
Driver
5
NOUT
OR
Max frequency
control
R
RESET
30k
2
+
-
0.5V
+
-
Timer
(64ms)
FBOLP_OH
Timer stop
(512ms)
1MΩ
Soft Start
300kΩ
100kΩ
FB/4 0.50V -
SS
SS SS
0.5ms 1ms 2ms
SS
4ms
+
CURRENT SENSE (V-V Change)
Normal : ×1.0
Leading Edge
Blanking
3
4
Figure 18. CS over Current Detection Switched ZT current block diagram
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CS
Limiter[V] Y
Vlim1
Vlim1*0.7
0.9mA 1.0mA
Figure 19. FB pin Voltage vs. CS pin Voltage Characteristics
X
Izt[mA]
Figure 20 Izt Current vs Switched CS Voltage Characteristics
ex) a setting method （Switching between AC100V and AC230V ）
AC100V: 141V±42V（±30% margin）
AC230V: 325V±65V（±20% margin）
The winding numbers of transformer are: Np = 100, Na = 15, Ns =20
According to above, when the IC switches the CS detection current between VH: 182 ~ 260V, in case of switching the
AC voltage at VH = 214V (AC150V) the minus voltage Va at MOSFET of QR turn on is calculated as below.
Va = Vin*Na / Np = 214V*15 / 100 *(-1) = -32.1
Rzt1 = Va / IZT = -32.1V/-1mA = 32.1kΩ
According to this, Rzt1 is set to 33kΩ. At this time, according to Rzt2=2×33k/(20/15×19-2)=2.83kΩ, Rzt2 is also set to
3kΩ. Czt is set to the value which turns on MOSFET when the Drain voltage is minimum voltage after having checked
the operation in the actual applications.
CS
Limiter[V] Y
Vlim1
Vlim1*0.7
192V 214V
X
VH[V]
Figure 21 CS switching example VH voltage – CS voltage characteristics
(4-5) Determination of OFF Width（Turn on）
The OFF width is controlled at the ZT pin. While the switching is OFF, the IC supplies the electric power which is
stored at coils to the secondary output capacitor. After supplying, the DRAIN pin is drops because the current doesn’t
flow to the secondary side. For that, the voltage of auxiliary winding side also drops. The voltage divided by Rzt1 and
Rzt2 applies to the ZT pin (1pin). If the voltage level drops to less than VZT1 (typ =100mV), the IC turns on the OUT pin.
To detection the zero current at the ZT pin (1pin), Czt, Rzt1 and Rzt2 makes time constant. However, the bottom
time is adjusted by Czt because Rzt1 and Rzt2 needs to be set by the AC voltage correct function (4-3).
Toff1=Ls/(Vout+VF)*Is
(Toff1 : transformer discharge time、Ls : secondary inductance 、Vout : Secondary output、
VF：secondary diode forward voltage、Is：secondary peak current）
For that, switching frequency is calculated below:
switching frequency=1 / {transformer charge and discharge time(Ton+Toff1) + (bottom-1/2) × resonant time }
resonance time = 1 / (2×π×Lp×Cds)
＊Lp: primary inductance , MOSFET D-S capacitor : Cds
Because a frequency reduction range in light load is restricted shown in Figure 16, bottom detection operates by the
frequency which is lower than max frequency function in Figure 16.Additionally, the ZT trigger mask function (4-6) and
a ZT timeout function (4-7) are built in IC.
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(4-6) ZT Trigger Mask Function（Figure 22）
When switching is set from ON to OFF, superposition of noise may occur at the ZT pin. Then, the ZT comparator and ZTOVP
comparator are masked for the TZTMASK time to prevent ZT comparator operation errors. In addition, taking a surge withstand
pressure into consideration, the ZT voltage set by resistor divided is has to be set within 3V for the auxiliary winding voltage.
Figure 22 ZT Trigger Mask Function
A: DC/DC OFF=>ON
B: DC/DC ON=>OFF then the surge noise occurs to ZT pin.
C: Since a noise occurs to ZT pin, the IC masks ZT comparator and ZTOVP comparator detection for TZTMASK time.
(4-7-1) ZT Timeout Function1 （Figure 23）
When the ZT pin voltage is not higher than VZT2 (typ=200mV) for TZTOUT1 (typ=15us) such as start or low output voltage or ZT
pin short, the IC turns on MOSFET by force.
(4-7-2) ZT Timeout Function2 （Figure 23）
After ZT comparator detects bottom, when the IC does not detect next bottom within TZTOUT2（typ =5us）, it turns on MOSFET by
force. After ZT comparator detects bottom at once, the function operates. For that, it does not operate at start or at low output
voltage. When the IC is not able to detect bottom by decreasing auxiliary winding voltage, the function operates.
Figure 23 ZT Timeout Function
A:
B:
C:
D:
E:
F:
G:
H:
I:
At starting up, the IC starts to operate by ZT timeout function1 because of ZT=0V.
MOSFET turns ON.
MOSFET turns OFF.
ZT voltage is lower than VZT2 (typ=200mV) by ZT dump decreasing.
MOSFET turns ON by ZT timeout fucntion2 after TZT2 (typ=5us) from D point.
ZT voltage is lower than VZT2 (typ=200mV) by ZT dump decreasing.
MOSFET turns ON by ZT timeout fucntion2 after TZT2 (typ=5us) from F point.
ZT pin is short to GND.
MOSFET turns ON by ZT timeout function1 after TZTOUT1 (typ=15us).
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(5) Soft Start Sequence
Normally, when the AC voltage is applied, a large current flows to raise the output voltage. This IC has a built-in soft
start function to prevent the output voltage and current from large change. This function is reset when the VCC pin
(6pin) drops to less than VUVLO2 (typ=8.2V), and it performs at next applying. It operates as below after starting up.
(Refer to the article of (4)-1 turn off.)
・start ～ 0.5ms
・0.5ms～1ms
・1ms～2ms
・2ms～4ms
・4ms～
=> Set CS limiter to 12.5% of normal operation.
=> Set CS limiter to 25% of normal operation.
=> Set CS limiter to 50% of normal operation.
=> Set CS limiter to 75% of normal operation.
=> normal operation
(6) CS (3pin) Open Protection
If the CS (3pin) is open, to prevent the OUT pin from making a error, the IC builds in the CS (3pin) open protection.
When the CS (3pin) is open, the OUT pin (5pin) switching is stopped by the function. (This is auto-recovery)
VCCOVP
Timeout
Bottom det
OR
POUT
AND
S
Q
FBOLP_OH AND
5 OUT
PRE
Driver
NOUT
R
VREF(4V)
1MΩ
CURRENT SENSE
(V-V Change)
Normal : ×1.0
Leading
Edge
Blanking
3
CS
RS
Figure 24. CS Open Protection
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(8) OUTPUT Over Load Protection（FB OLP comparator）
The over load protection is the function that monitors the condition of the secondary output current’s over load and fixes the
OUT pin (5pin) to Low at an over load condition. At a over load condition, there is no current in a photocoupler so the FB pin
(2pin) rise to near 3.7V. When the condition continues for TFOLP （typ =64ms）, the IC judges this is over load state and the OUT
pin (5pin) is fixed to L. If the FB pin (2pin) drops to VFOLP1B (typ =2.6V) within TFOLP (typ =64ms) from the moment that its voltage
becomes higher VFOLP1A (typ =2.8V), the over load protection timer is reset. At starting up, the FB pin starts to operate from
more than VFOLP1A (typ =2.8V) voltage because it is pull-up by a resistor to internal voltage. For this reason, the starting up time
of the secondary output voltage is has to be set within TFOLP (typ =64ms) from starting up.
After detecting the over load condition, the IC is stopped for TOLPST (typ =512ms) and the IC operates auto-recovery. At this
moment, the IC operates soft start. At stopping, although the VCC voltage drops, the VCC pin voltage keeps more than VUVLO2
because it is charged from starting circuits.
FB
VFOLP1A
VH charge
charge
charge
64ms
64ms
Switching
512ms
VUVLO1
VCHG2
VCC
512ms
VCHG1
VUVLO2
A
B
C D
E
F
GH
Figure 25. Over Load Protection: Auto-recovery
A: When FB voltage is over VFOLP1A, FBOLP comparator detects an over load state.
B: When the state A continues for TFOLP (typ=64ms), the IC stops switching by over load protection.
C: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC (6pin) voltage is lower than
VCHG, VCC re-charge function operates and the VCC (6pin) voltage is up.
D: When the VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.
E: It passes for TOLPST (typ =512ms) from B, the IC starts switching with soft start.
F: When over load state continues, the FB (2pin) voltage is over VFOLP1A. When it passes for TFOLP (typ=64ms) from E,
the IC stops switching.
G: During stopping switching by over load protection, the VCC (6pin) voltage drops. When the VCC (6pin) voltage is
lower than VCHG, VCC re-charge function operates and the VCC (6pin) voltage is up.
H: When the VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.
(9) OUT (5pin) Voltage Clamp Function
For the purpose which protects the external MOSFET, H level of the OUT (5pin) is clamped to VOUTH (typ=12.5V). It
prevents gate destruction of MOSFET by raising the VCC (6pin) voltage. (Refer to Figure 23) The OUT (5pin) is
pulled-down RPDOUT (typ=100kΩ).
6
12V Clamp
Circuit
POUT
PRE
Driver
5
NOUT
3
Figure 26. OUT (5pin) Construction
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●Operation Mode of Protection Circuit
Operation mode of protection functions are shown in table3.
Table 3. Operation Mode of Protection Circuit
Item
Protection mode
VCC Under Voltage Locked Out
Auto recovery
VCC Over Voltage Protection
Auto recovery (with 100us timer)
FB Over Load Protection
Auto recovery (delay: 64ms, stop: 512ms)
CS Open Protection
Auto recovery
ZT Over Voltage Protection
-
VCC Charge Protection
Auto recovery
● Power Dissipation
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 85 or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70 mm × 70 mm × 1.6 mm, mounted on glass epoxy substrate)
1000
900
800
700
Pd[mW]
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ta[℃]
Figure 27. SOP-J8 Thermal Abatement Characteristics
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●Operational Notes
(1) Absolute maximum ratings
Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are
exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular
mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a
fuse should be investigated.
(2) Power supply and ground lines
In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there
are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in
the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes
and small signal routes, including the external circuits. Also, with regard to all of the LSI’s power supply pins, in
addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be
problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems
with the characteristics of the capacitor to be used before determining constants.
(3) Ground potential
The ground pin’s potential should be set to the minimum potential in relation to the operation mode.
(4) Pin shorting and attachment errors
When attaching ICs to the set board, be careful to avoid errors in the IC’s orientation or position. If such attachment
errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin
and a power supply line, or between ground lines.
(5) Operation in strong magnetic fields
Note with caution that these products may become damaged when used in a strong magnetic field.
(6) Input pins
In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic
elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.
Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage
that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no
power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied
to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical
characteristics.
(7) External capacitors
When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal
capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining
constants.
(8) Thermal design
The thermal design should fully consider allowable dissipation (Pd) under actual use conditions.
Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.
(9) Rush current
In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,
so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern
wires, and how they are laid out.
(10) Handling of test pins and unused pins
Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the
descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.
(11) Document contents
Documents such as application notes are design documents used when designing applications, and as such their
contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for
external parts.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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●Ordering Information
B
M
1
Q
0
1
1
F
J
-
Package
Product name
E2
Packaging and
forming specification
E2: Embossed tape and reel
●Marking Diagram
1PIN MARK
1Q011
Part Number Marking
LOT No.
Line-Up
Marking Name
1Q011
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SOP-J7S
Order name
BM1Q011FJ-E2
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Physical Dimension, Tape and Reel Information
Package Name
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●Revision History
Date
Revision
21.Jun.2016
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BM1Q011FJ - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BM1Q011FJ
SOP-J7S
2500
2500
Taping
inquiry
Yes