Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 LMX2531 High-Performance Frequency Synthesizer System With Integrated VCO 1 Features 3 Description • The LMX2531 is a low-power, high-performance frequency synthesizer system which includes a fully integrated delta-sigma PLL and VCO with fully integrated tank circuit. The third and fourth poles are also integrated and adjustable. Ultra-low noise and high-precision LDOs are integrated for the PLL and VCO, which yield higher supply-noise immunity and more consistent performance. When combined with a high-quality reference oscillator, the LMX2531 device generates very stable, low-noise local-oscillator signals for up and down conversion in wireless communication devices. The LMX2531 device is a monolithic integrated circuit, fabricated in an advanced BiCMOS process. Several different versions of this product accommodate different frequency bands. 1 • • • Multiple Frequency Options Available – See Device Information Table – Frequencies From: 553 MHz to 3132 MHz PLL Features – Fractional-N Delta-Sigma Modulator Order Programmable up to Fourth Order – FastLock/Cycle Slip Reduction with Timeout Counter – Partially Integrated, Adjustable Loop Filter – Very Low Phase Noise and Spurs VCO Features – Integrated Tank Inductor – Low Phase Noise Other Features – 2.8-V to 3.2-V Operation – Low Operating Current – Low Power-Down Current – 1.8-V MICROWIRE Support – 36-Pin 6-mm × 6-mm × 0.8-mm WQFN Package Device Information(1) PART LOW BAND HIGH BAND LMX2531LQ1146E 553 — 592 MHz 1106 — 1184 MHz LMX2531LQ1226E 592 — 634 MHz 1184 — 1268 MHz LMX2531LQ1312E 634 — 680 MHz 1268 — 1360 MHz LMX2531LQ1415E 680 — 735 MHz 1360 — 1470 MHz LMX2531LQ1500E 749.5 — 755 MHz 1499 — 1510 MHz LMX2531LQ1515E 725 — 790 MHz 1450 — 1580 MHz 2 Applications LMX2531LQ1570E 765 — 818 MHz 1530 — 1636 MHz • • • • • • • • • • LMX2531LQ1650E 795 — 850 MHz 1590 — 1700 MHz LMX2531LQ1700E 831 — 885 MHz 1662 — 1770 MHz LMX2531LQ1742 880 — 933 MHz 1760 — 1866 MHz LMX2531LQ1778E 863 — 920 MHz 1726 — 1840 MHz LMX2531LQ1910E 917 — 1014 MHz 1834 — 2028 MHz LMX2531LQ2080E 952 — 1137 MHz 1904 — 2274 MHz LMX2531LQ2265E 1089 — 1200 MHz 2178 — 2400 MHz LMX2531LQ2570E 1168 — 1395 MHz 2336 — 2790 MHz LMX2531LQ2820E 1355 — 1462 MHz 2710 — 2925 MHz LMX2531LQ3010E 1455 — 1566 MHz 2910 — 3132 MHz Cellular Base Stations Wireless LANs Broadband Wireless Access Satellite Communications Wireless Radios Automotive CATV Equipment Instrumentation and Test Equipment RFID Readers Data Converter Clocking (1) For all available packages, see the orderable addendum at the end of the datasheet. 4 Simplified Schematic Vtune Charge Pump CPout Fast Lock FLout VregVCO VrefVCO VCO VREG Prescaler N Divider I Fout 1/2 Comp MUX Ftest/ LD OSCin R Divider OSCin* DATA CLK LE CE Serial Interface Control DIG VREG PLL VREG1 PLL VREG2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 1 1 1 1 2 3 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 5 Electrical Characteristics........................................... 6 MICROWIRE Timing Requirements........................ 13 Typical Performance Characteristics ...................... 14 Detailed Description ............................................ 15 8.1 Overview ................................................................. 15 8.2 Functional Block Diagram ....................................... 15 8.3 Feature Description................................................. 15 8.4 Device Functional Modes........................................ 20 8.5 Programming........................................................... 20 8.6 Register Maps ......................................................... 21 9 Application and Implementation ........................ 33 9.1 Application Information............................................ 33 9.2 Typical Application ................................................. 33 9.3 Do's and Don'ts ....................................................... 35 10 Power Supply Recommendations ..................... 35 11 Layout................................................................... 35 11.1 Layout Guidelines ................................................. 35 11.2 Layout Example .................................................... 36 12 Device and Documentation Support ................. 37 12.1 12.2 12.3 12.4 Device Support...................................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 37 37 37 37 13 Mechanical, Packaging, and Orderable Information ........................................................... 37 5 Revision History Changes from Revision R (April 2013) to Revision S • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Changes from Revision Q (February 2013) to Revision R • 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 32 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 6 Pin Configuration and Functions VregDIG NC GND Test OSCin* OSCin Ftest/LD NC VregPLL2 NJH0036D Package 36-Pin WQFN, D Version, (LMX2531LQ1146E/1226E/1312E/1415E/1515E/2820E/3010E) Top View 36 35 34 33 32 31 30 29 28 VCCDIG 1 27 VCCPLL NC 2 26 VregPLL1 GND 3 25 FLout NC 4 24 CPout GND NC 5 23 Vtune VregBUF 6 22 VCCBUF NC 7 21 Fout DATA 8 20 GND CLK 9 19 GND NC 18 VrefVCO 17 VregVCO 16 VCCVCO 15 NC 14 NC 13 NC 12 NC 11 CE LE 10 VCCDIG 1 NC VregDIG NC GND Test OSCin* OSCin Ftest/LD NC VregPLL2 NJG0036A Package 36-Pin WQFN, A Version, (All Other Versions) Top View 36 35 34 33 32 31 30 29 28 27 VCCPLL 2 26 VregPLL1 GND 3 25 FLout NC 4 24 CPout NC 5 23 Vtune VregBUF 6 22 VCCBUF NC 7 21 Fout DATA 8 20 GND CLK 9 19 GND GND GND 10 11 12 13 14 15 16 17 18 LE CE NC NC NC NC VCCVCO VregVCO VrefVCO NC Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 3 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Pin Functions PIN 4 TYPE DESCRIPTION 11 Input Chip Enable Input. High impedance CMOS input. This pin must not exceed 2.75 V. When CE is brought high the LMX2531 is powered up corresponding to the internal power control bits. Although the part can be programmed when powered down, it is still necessary to reprogram the R0 register to get the part to re-lock. CLK 9 Input MICROWIRE clock input. High impedance CMOS input. This pin must not exceed 2.75 V. Data is clocked into the shift register on the rising edge. CPout 24 Output Charge pump output for PLL. For connection to Vtune through an external passive loop filter. DATA 8 Input MICROWIRE serial data input. High impedance CMOS input. This pin must not exceed 2.75 V. Data is clocked in MSB first. The last bits clocked in form the control or register select bits. FLout 25 Output An open drain NMOS output which is used for FastLock or a general purpose output. Fout 21 Output Buffered RF Output for the VCO. Ftest/LD 30 Output Multiplexed CMOS output. Typically used to monitor PLL lock condition. GND 3 — Ground GND 19 — Ground for the VCO circuitry. GND 20 — Ground for the VCO Output Buffer circuitry. GND 34 — Ground LE 10 Input NC 2, 4, 5, 7, 12, 13, 29, 35 — No Connect. NC 14, 15 — No Connect. Do NOT ground. This also includes the pad above these pins. OSCin 31 Input Oscillator input. OSCin* 32 Input Oscillator complimentary input. When a single ended source is used, then a bypass capacitor should be placed as close as possible to this pin and be connected to ground. Test 33 Output VccBUF 22 — Power Supply for the VCO Buffer circuitry. Input may range from 2.8 — 3.2 V. Bypass capacitors should be placed as close as possible to this pin and ground. VccDIG 1 — Power Supply for digital LDO circuitry. Input may range from 2.8 — 3.2 V. Bypass capacitors should be placed as close as possible to this pin and ground. VccPLL 27 — Power Supply for the PLL. Input may range from 2.8 — 3.2 V. Bypass capacitors should be placed as close as possible to this pin and ground. VccVCO 16 — Power Supply for VCO regulator circuitry. Input may range from 2.8 — 3.2 V. Bypass capacitors should be placed as close as possible to this pin and ground. VrefVCO 18 — Internal reference voltage for VCO LDO. Not intended to drive an external load. Connect to ground with a capacitor. VregBUF 6 — Internally regulated voltage for the VCO buffer circuitry. Connect to ground with a capacitor. VregDIG 36 — Internally regulated voltage for LDO digital circuitry. VregPLL1 26 — Internally regulated voltage for PLL charge pump. Not intended to drive an external load. Connect to ground with a capacitor. VregPLL2 28 — Internally regulated voltage for RF digital circuitry. Not intended to drive an external load. Connect to ground with a capacitor. VregVCO 17 — Internally regulated voltage for VCO circuitry. Not intended to drive an external load. Connect to ground with a capacitor and some series resistance. Vtune 23 Input NAME NO. CE MICROWIRE Latch Enable input. High impedance CMOS input. This pin must not exceed 2.75 V. Data stored in the shift register is loaded into the selected latch register when LE goes HIGH. This pin is for test purposes and should be grounded for normal operation. Tuning voltage input for the VCO. For connection to the CPout pin through an external passive loop filter. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Power Supply Voltage –0.3 3.5 V All other pins (Except Ground) Power Supply Voltage –0.3 3.0 V TL Lead Temperature (solder 4 sec.) 260 °C TJ Junction Temperature 125 °C Tstg Storage temperature 150 °C VCC (VccDIG, VccVCO, VccBUF, VccPLL) (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±500 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCC Power Supply Voltage (VccDig, VccVCO, VccBUF) Vi Serial Interface and Power Control Voltage TA Ambient Temperature (1) (1) MIN NOM MAX 2.8 3.0 3.2 UNIT V 0 2.75 V –40 85 °C Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was at the time that the R0 register was last programmed, and still have the part stay in lock. The action of programming the R0 register, even to the same value, activates a frequency calibration routine. This implies that the part will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the R0 register to ensure that it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the frequency range of –40°C ≤ TA ≤ 85°C without violating specifications. 7.4 Thermal Information THERMAL METRIC (1) LMX2531 LMX2531 NJH0036D NJG0036A 36 PINS 36 PINS RθJA Junction-to-ambient thermal resistance 35.5 35.5 ψJB Junction-to-board characterization parameter 9.1 9.1 (1) UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 5 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 7.5 Electrical Characteristics (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER TEST CONDITIONS MIN TYP MAX LMX2531LQ2265E/ 2570E 38 44 LMX2531LQ2820E/ 3010E 38 46 All Other Options 34 41 LMX2531LQ2265E/ 2570E 41 49 LMX2531LQ2820E/ 3010E 44 52 All Other Options 37 46 UNIT CURRENT CONSUMPTION Divider Disabled Power Supply Current Power Supply Current ICC Divider Enabled ICCPD Power Down Current CE = 0 V, Part Initialized 7 mA µA OSCILLATOR IIHOSC Oscillator Input High Current VIH = 2.75 V 100 µA IILOSC Oscillator Input Low Current VIL = 0 –100 fOSCin Frequency Range See (1) 5 80 MHz vOSCin Oscillator Sensitivity 0.5 2.0 Vpp 32 MHz µA PLL fPD Phase Detector Frequency Charge Pump Output Current Magnitude ICPout ICP = 0 90 µA ICP = 1 180 µA ICP = 3 360 µA ICP = 15 1440 ICPoutTRI CP TRI-STATE Current 0.4 V < VCPout < 2.0 V ICPoutMM Charge Pump Sink vs Source Mismatch ICPoutV ICPoutT LN(f) (1) (2) (3) 6 µA 2 10 VCPout = 1.2 V TA = 25°C 2% 8% Charge Pump Current vs CP Voltage Variation 0.4 V < VCPout < 2.0 V TA = 25°C 4% CP Current vs Temperature Variation VCPout = 1.2 V 8% Normalized PLL 1/f Noise LNPLL_flicker(10 kHz) See (2) ICP = 1X Charge Pump Gain –94 ICP = 16X Charge Pump Gain –104 Normalized PLL Noise Floor LNPLL_flat See (3) ICP = 1X Charge Pump Gain –202 ICP = 16X Charge Pump Gain –212 nA dBc/Hz dBc/Hz There are program bits that need to be set based on the OSCin frequency. Refer to the following sections: XTLSEL[2:0] -- OSCin Select, XTLDIV[1:0] -- Division Ratio for the OSCin Frequency, XTLMAN[11:0] -- Manual OSCin Mode, XTLMAN2 -- Manual Crystal Mode Second Adjustment, and LOCKMODE -- Frequency Calibration Mode. Not all bit settings can be used for all frequency choices of OSCin. For instance, automatic modes described in XTLSEL[2:0] -- OSCin Select do not work below 8 MHz. One of the specifications for modeling PLL in-band phase noise is the PLL 1/f noise normalized to 1 GHz carrier frequency and 10 kHz offset, LPLL_flicker(10 kHz). From this normalized index of PLL 1/f noise, the PLL 1/f noise can be calculated for any carrier and offset frequency as: LNPLL_flicker(f) = LPLL_flicker(10 kHz) – 10 × log (10 kHz / f) + 20 × log ( Fout / 1 GHz ). Flicker noise can dominate at low offsets from the carrier and has a 10 dB/decade slope and improves with higher charge pump currents and at higher offset frequencies . To accurately measure LPLL_flicker(10 kHz) it is important to use a high phase detector frequency and a clean reference to make it such that this measurement is on the 10 dB/decade slope close to the carrier. LPLL_flicker(f) can be masked by the reference oscillator performance if a low power or noisy source is used. The total PLL in-band phase noise performance is the sum of LPLL_flicker(f) and LPLL_flat. In other words,LPLL(f) = 10 × log (10 (LNPLL_flat / 10 ) + 10(LNPLL_flicker (f) / 10 ) A specification used for modeling PLL in-band phase noise floor is the Normalized PLL noise floor, LNPLL_flat, and is defined as: LNPLL_flat = L(f) – 20 × log (N) – 10 × log(fPD). LPLL_flat is the single side band phase noise in a 1 Hz Bandwidth and fPD is the phase detector frequency of the synthesizer. LPLL_flat contributes to the total noise, L(f). To measure LPLL_flat the offset frequency must be chosen sufficiently smaller then the loop bandwidth of the PLL, and yet large enough to avoid a substantial noise contribution from the reference and PLL flicker noise. LPLL_flat can be masked by the reference oscillator performance if a low power or noisy source is used. The total PLL in-band phase noise performance is the sum of LPLL_flicker(f) and LPLL_flat. In other words, LPLL(f) = 10 × log (10 (LNPLL_flat / 10 ) + 10 (LNPLL_flicker (f) / 10 ) Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 Electrical Characteristics (continued) (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VCO FREQUENCIES Operating Frequency Range (All options have a frequency divider, this applies before the divider. The frequency after the divider is half of what is shown) fFout LMX2531LQ1146E 1106 1184 LMX2531LQ1226E 1184 1268 LMX2531LQ1312E 1268 1360 LMX2531LQ1415E 1360 1470 LMX2531LQ1500E 1499 1510 LMX2531LQ1515E 1450 1580 LMX2531LQ1570E 1530 1636 LMX2531LQ1650E 1590 1700 LMX2531LQ1700E 1662 1770 LMX2531LQ1742 1760 1866 LMX2531LQ1778E 1726 1840 LMX2531LQ1910E 1834 2028 LMX2531LQ2080E 1904 2274 LMX2531LQ2265E 2178 2400 LMX2531LQ2570E 2336 2790 LMX2531LQ2820E 2710 2925 LMX2531LQ3010E 2910 3132 MHz OTHER VCO SPECIFICATIONS ΔTCL (4) Maximum Allowable Temperature Drift for Continuous Lock See (4) LMX2531LQ1742 65 LMX2531LQ1500E/1570E/1650E/ 1146E/1226/1312E/1415E/1515E 90 LMX2531LQ1700E/1778E/1910E/ 2080E/2265E/2570E/2820E/3010E 125 °C Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was at the time that the R0 register was last programmed, and still have the part stay in lock. The action of programming the R0 register, even to the same value, activates a frequency calibration routine. This implies that the part will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the R0 register to ensure that it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the frequency range of –40°C ≤TA≤ 85°C without violating specifications. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 7 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Electrical Characteristics (continued) (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER TEST CONDITIONS Divider Disabled pFout Output Power to a 50-Ω Load (Applies across entire tuning range.) Divider Enabled 8 MIN TYP MAX LMX2531LQ1146E 1 4.0 7 LMX2531LQ1226E 1 3.5 7 LMX2531LQ1312E 1 3.5 7 LMX2531LQ1415E 0 3.0 6 LMX2531LQ1500E 1 3.5 7.0 LMX2531LQ1515E –1 2.5 5 LMX2531LQ1570E 2 4.5 8 LMX2531LQ1650E 2 4.5 8 LMX2531LQ1700E 1 3.5 7 LMX2531LQ1742 1 3.5 7 LMX2531LQ1778E 1 3.5 7 LMX2531LQ1910E 1 3.5 7 LMX2531LQ2080E 1 3.5 7 LMX2531LQ2265E 1 3.5 7 LMX2531LQ2570E 0 3.0 6 LMX2531LQ2820E –0.5 2.5 5.5 LMX2531LQ3010E –1.5 1.5 4.5 LMX2531LQ1146E –1 2.0 5 LMX2531LQ1226E –1 2.0 5 LMX2531LQ1312E –1 1.5 4 LMX2531LQ1415E –2 0.5 3 LMX2531LQ1500E 1 3.0 6.0 LMX2531LQ1515E –2 0.5 3 LMX2531LQ1570E 1 3.0 6 LMX2531LQ1650E 1 3.0 6 LMX2531LQ1700E 1 3.0 6 LMX2531LQ1742 1 3.0 6 LMX2531LQ1778E 1 3.0 6 LMX2531LQ1910E 1 3.0 6 LMX2531LQ2080E 0 2.5 5 LMX2531LQ2265E 0 2.5 5 LMX2531LQ2570E –1 1.5 4 LMX2531LQ2820E –2.5 0 2.5 LMX2531LQ3010E –3 –0.5 2 Submit Documentation Feedback UNIT dBm dBm Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 Electrical Characteristics (continued) (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER KVtune Fine Tuning Sensitivity (When a range is displayed in the typical column, indicates the lower sensitivity is typical at the lower end of the tuning range, and the higher tuning sensitivity is typical at the higher end of the tuning range.) TEST CONDITIONS TYP 2.5 — 5.5 LMX2531LQ1226E 3—6 LMX2531LQ1312E 3—6 LMX2531LQ1415E 3.5 — 6.5 LMX2531LQ1500E 4—7 LMX2531LQ1515E 4—7 LMX2531LQ1570E 4—7 LMX2531LQ1650E 4—7 LMX2531LQ1700E 6 — 10 LMX2531LQ1742 MAX UNIT MHz/V 4—7 LMX2531LQ1778E 6 — 10 LMX2531LQ1910E 8 — 14 LMX2531LQ2080E 9 — 20 LMX2531LQ2265E 10 — 16 LMX2531LQ2570E 10 — 23 LMX2531LQ2820E 12 — 28 LMX2531LQ3010E 13 — 29 Divider Disabled Second Harmonic 50 Ω Load Divider Enabled HSFout MIN LMX2531LQ1146E Harmonic Suppression (Applies Across Entire Tuning Range) Divider Disabled Third Harmonic 50 Ω Load Divider Enabled LMX2531LQ1146E /1226E/1312E /1415E/1515E –35 LMX2531LQ2820E /3010E –40 All Other Options –30 –25 LMX2531LQ1146E /1226E/1312E /1415E/1515E –30 –20 LMX2531LQ2820E /3010E –30 –15 All Other Options –20 –15 LMX2531LQ1146E /1226E/1312E –35 –30 LMX2531LQ2820E /3010E –50 All Other Options –40 –35 LMX2531LQ1146E /1226E/1312E /1570E/1650E –20 –15 LMX2531LQ2820E /3010E –40 –20 All Other Options –25 –20 PUSHFout Frequency Pushing Creg = 0.1 µF, VDD ± 100 mV, Open Loop PULLFout Frequency Pulling VSWR = 2:1, Open Loop ZFout Output Impedance –25 300 kHz/V ±600 50 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 dBc kHz Ω 9 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Electrical Characteristics (continued) (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER VCO PHASE NOISE TEST CONDITIONS fFout = 1146 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1146E) fFout = 573 MHz DIV2 = 1 fFout = 1226 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1226E) fFout = 613 MHz DIV2 = 1 fFout = 1314 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1312E) fFout = 657 MHz DIV2 = 1 fFout = 1415 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1415E) fFout = 707.5 MHz DIV2 = 1 fFout = 1500 MHz DIV2 = 1 Phase Noise (LMX2531LQ1500E) fFout = 750 MHz DIV2 = 1 (5) 10 TYP 10-kHz Offset –96 100-kHz Offset –121 1-MHz Offset –142 5-MHz Offset –156 10-kHz Offset –101 100-kHz Offset –126 1-MHz Offset –147 5-MHz Offset –156 10-kHz Offset –95 100-kHz Offset –121 1-MHz Offset –142 5-MHz Offset –155 10-kHz Offset –101 100-kHz Offset –126 1-MHz Offset –147 5-MHz Offset –155 10-kHz Offset –95 100-kHz Offset –121 1-MHz Offset –140 5-MHz Offset –154 10-kHz Offset –101 100-kHz Offset –126 1-MHz Offset –146 5-MHz Offset –154 10-kHz Offset –95 100-kHz Offset –121 1-MHz Offset –141 5-MHz Offset –154 10-kHz Offset –100 100-kHz Offset –126 1-MHz Offset –146 5-MHz Offset –154 10-kHz Offset L(f)Fout MIN MAX UNIT (5) dBc/Hz dBc/Hz dBc/Hz dBc/Hz –97 100-KHz Offset –120 1-MHz Offset –142 5-MHz Offset –155 10-kHz Offset –103 100-kHz Offset –126 1-MHz Offset –131 5-MHz Offset –155 dBc/Hz The VCO phase noise is measured assuming that the loop bandwidth is sufficiently narrow that the VCO noise dominates. The maximum limits apply only at center frequency and over temperature, assuming that the part is reloaded at each test frequency. Over frequency, the phase noise can vary 1 to 2 dB, with the worst case performance typically occurring at the highest frequency. Over temperature, the phase noise typically varies 1 to 2 dB, assuming the part is reloaded. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 Electrical Characteristics (continued) (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER TEST CONDITIONS fFout = 1515 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1515E) fFout = 757.5 MHz DIV2 = 1 fFout = 1583 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1570E) fFout = 791.5 MHz DIV2 = 1 fFout = 1645 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1650E) fFout = 822.5 MHz DIV2 = 1 fFout = 1716 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1700E) fFout = 858 MHz DIV2 = 1 fFout= 1813 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1742) fFout = 906.5 MHz DIV2 = 1 fFout = 1783 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1778E) fFout = 891.5 MHz DIV2 = 1 MIN TYP 10-kHz Offset –96 100-kHz Offset –122 1-MHz Offset –142 5-MHz Offset –153 10-kHz Offset –99 100-kHz Offset –125 1-MHz Offset –145 5-MHz Offset –154 10-kHz Offset –93 100-kHz Offset –118 1-MHz Offset –140 5-MHz Offset –154 10-kHz Offset –99 100-kHz Offset –122 1-MHz Offset –144 5-MHz Offset –155 10-kHz Offset –93 100-kHz Offset –118 1-MHz Offset –140 5-MHz Offset –154 10-kHz Offset –99 100-kHz Offset –122 1-MHz Offset –144 5-MHz Offset –155 10-kHz Offset –92 100-kHz Offset –117 1-MHz Offset –139 5-MHz Offset –153 10-kHz Offset –98 100-kHz Offset –122 1-MHz Offset –144 5-MHz Offset –154 10-kHz Offset –92 100-kHz Offset –117 1-MHz Offset –140 5-MHz Offset –152 10-kHz Offset –99 100-kHz Offset –122 1-MHz Offset –143 5-MHz Offset –152 10-kHz Offset –92 100-kHz Offset –117 1-MHz Offset –139 5-MHz Offset –152 10-kHz Offset –97 100-kHz Offset –122 1-MHz Offset –144 5-MHz Offset –154 MAX Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 UNIT dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz 11 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Electrical Characteristics (continued) (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER TEST CONDITIONS fFout = 1931 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ1910E) fFout = 965.5 MHz DIV2 = 1 fFout = 2089 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ2080E) fFout = 1044.5 MHz DIV2 = 1 fFout = 2264 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ2265E) fFout = 1132 MHz DIV2 = 1 fFout = 2563 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ2570E) fFout = 1281.5 MHz DIV2 = 1 fFout = 2818 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ2820E) fFout = 1409 MHz DIV2 = 1 fFout = 3021 MHz DIV2 = 0 L(f)Fout Phase Noise (LMX2531LQ3010E) fFout = 1510.5 MHz DIV2 = 1 12 MIN TYP 10-kHz Offset –89 100-kHz Offset –115 1-MHz Offset –138 5-MHz Offset –151 10-kHz Offset –95 100-kHz Offset –121 1-MHz Offset –143 5-MHz Offset –155 10-kHz Offset –87 100-kHz Offset –113 1-MHz Offset –136 5-MHz Offset –150 10-kHz Offset –93 100-kHz Offset –119 1-MHz Offset –142 5-MHz Offset –154 10-kHz Offset –88 100-kHz Offset –113 1-MHz Offset –136 5-MHz Offset –150 10-kHz Offset –94 100-kHz Offset –118 1-MHz Offset –141 5-MHz Offset –154 10-kHz Offset –86 100-kHz Offset –112 1-MHz Offset –135 5-MHz Offset –149 10-kHz Offset –91 100-kHz Offset –117 1-MHz Offset –139 5-MHz Offset –152 10-kHz Offset –84 100-kHz Offset –111 1-MHz Offset –133 5-MHz Offset –148 10-kHz Offset –90 100-kHz Offset –117 1-MHz Offset –138 5-MHz Offset –150 10-kHz Offset –83 100-kHz Offset –110 1-MHz Offset –132 5-MHz Offset –147 10-kHz Offset –88 100-kHz Offset –116 1-MHz Offset –137 5-MHz Offset –148 Submit Documentation Feedback MAX UNIT dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 Electrical Characteristics (continued) (VCC = 3.0 V, –40°C ≤ TA ≤ 85 °C; except as specified.) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 2.75 V DIGITAL INTERFACE (DATA, CLK, LE, CE, Ftest/LD, FLout) VIH High-Level Input Voltage VIL Low-Level Input Voltage 1.6 IIH High-Level Input Current VIH = 1.75 –3.0 IIL Low-Level Input Current VIL = 0 V –3.0 VOH High-Level Output Voltage IOH = 500 µA VOL Low-Level Output Voltage IOL = –500 µA 2.0 0.4 V 3.0 µA 3.0 µA 2.65 0.0 V 0.4 V 7.6 MICROWIRE Timing Requirements See Figure 2 and Serial Data Timing Requirements. MIN NOM MAX UNIT tCS Data to Clock Set-Up Time 25 ns tCH Data to Clock Hold Time 20 ns tCWH Clock Pulse Width High 25 ns tCWL Clock Pulse Width Low 25 ns tES Clock to Enable Set-Up Time 25 ns tCES Enable to Clock Set-Up Time 25 ns tEWH Enable Pulse Width High 25 ns Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 13 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 7.7 Typical Performance Characteristics See Table 1. MAGNITUDE OF INPUT IMPEDANCE (k:) 6 5 4 Powered Down 3 2 Powered Up 1 0 0 25 50 75 100 125 150 FREQUENCY (MHz) Figure 1. OSCin Input Impedance 14 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 8 Detailed Description 8.1 Overview The LMX2531 is a low-power, high-performance frequency synthesizer system which includes the PLL, VCO, and partially integrated loop filter. Feature Description gives a discussion of the various blocks of this device. 8.2 Functional Block Diagram Vtune Charge Pump CPout Fast Lock FLout VregVCO VCO VREG VrefVCO Prescaler N Divider I Fout 1/2 Comp MUX Ftest/ LD OSCin R Divider OSCin* DIG VREG DATA CLK PLL VREG1 Serial Interface Control LE CE PLL VREG2 8.3 Feature Description 8.3.1 Reference Oscillator Input Because the VCO frequency calibration algorithm is based on clocks from the OSCin pin, there are certain bits that need to be set depending on the OSCin frequency. XTLSEL (R6[22:20]) and XTLDIV (R7[9:8]) are both need to be set based on the OSCin frequency, fOSCin. For some options and for low OSCin frequencies, the XTLMAN (R7[21:10]) and XTLMAN2 (R8[4]) words need to be set to the correct value. Table 1. OSCin Input Impedance (See Figure 1) FREQUENCY POWERED UP (kΩ) POWERED DOWN (kΩ) (MHz) REAL IMAGINARY MAGNITUDE REAL IMAGINARY MAGNITUDE 1 4.98 –2.70 5.66 6.77 –8.14 10.59 5 3.44 –3.04 4.63 5.73 –6.72 9.03 10 1.42 –2.67 3.02 1.72 –5.24 5.51 20 0.52 –1.63 1.71 0.53 –2.94 2.98 30 0.29 –1.22 1.25 0.26 –2.12 2.14 40 0.18 –0.92 0.94 0.17 –1.58 1.59 50 0.13 –0.74 0.75 0.14 –1.24 1.25 60 0.10 –0.63 0.64 0.10 –1.06 1.06 70 0.09 –0.56 0.56 0.09 –0.95 0.95 80 0.07 –0.50 0.50 0.08 –0.86 0.87 90 0.07 –0.46 0.46 0.07 –0.80 0.80 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 15 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Feature Description (continued) Table 1. OSCin Input Impedance (See Figure 1) (continued) FREQUENCY POWERED UP (kΩ) POWERED DOWN (kΩ) (MHz) REAL IMAGINARY MAGNITUDE REAL IMAGINARY MAGNITUDE 100 0.06 –0.41 0.42 0.07 –0.72 0.72 110 0.06 –0.37 0.38 0.07 –0.65 0.65 120 0.05 –0.34 0.34 0.06 –0.59 0.59 130 0.05 –0.32 0.32 0.06 –0.55 0.55 140 0.04 –0.29 0.30 0.05 –0.50 0.50 150 0.04 –0.27 0.28 0.05 –0.47 0.47 8.3.2 R Divider The R divider divides the OSCin frequency down to the phase detector frequency. The R divider value, R, is restricted to the values of 1, 2, 4, 8, 16, and 32. If R is greater than 8, then this also puts restrictions on the fractional denominator, FDEN, than can be used. This is discussed in greater depth in later sections. 8.3.3 Phase Detector and Charge Pump The phase detector compares the outputs of the R and N dividers and puts out a correction current corresponding to the phase error. The phase detector frequency, fPD, can be calculated as shown in Equation 1. fPD = fOSCin / R (1) Choosing R = 1 yields the highest possible phase detector frequency and is optimum for phase noise, although there are restrictions on the maximum phase detector frequency which could force the R value to be larger. The far out PLL noise improves 3 dB for every doubling of the phase detector frequency, but at lower offsets, this effect is much less due to the PLL 1 / f noise. Aside from getting the best PLL phase noise, higher phase detector frequencies also make it easier to filter the noise that the delta-sigma modulator produces, which peaks at an offset frequency of fPD / 2 from the carrier. The LMX2531 also has 16 levels of charge pump currents and a highly flexible fractional modulus. Increasing the charge pump current improves the phase noise about 3 dB per doubling of the charge pump current, although there are small diminishing returns as the charge pump current increases. From a loop filter design and PLL phase noise perspective, one might think to always design with the highest possible phase detector frequency and charge pump current. However, if one considers the worst case fractional spurs that occur at an output frequency equal to 1 channel spacing away from a multiple of the fOSCin, then this gives reason to reconsider. If the phase detector frequency or charge pump currents are too high, then these spurs could be degraded, and the loop filter may not be able to filter these spurs as well as theoretically predicted. For optimal spur performance, a phase detector frequency around 2.5 MHz and a charge pump current of 1X are recommended. 8.3.4 N Divider and Fractional Circuitry The N divider in the LMX2531 includes fractional compensation and can achieve any fractional denominator between 1 and 4,194,303. The integer portion, NInteger, is the whole part of the N divider value and the fractional portion, NFractional, is the remaining fraction. So in general, the total N divider value, N, is determined by Equation 2. N = NInteger + NFractional (2) For example, if the phase detector frequency (fPD) was 10 MHz and the VCO frequency (fVCO) was 1736.1 MHz, then N would be 173.61. This would imply that NInteger is 173 and NFractional is 61/100. NInteger has some minimum value restrictions that are arise due to the architecture of this divider. The first restrictions arise because the N divider value is actually formed by a quadruple modulus 16/17/20/21 prescaler, which creates minimum divide values. NInteger is further restricted because the LMX2531 due to the fractional engine of the N divider. 16 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 The fractional word, NFractional , is a fraction formed with the NUM and DEN words. In the example used here with the fraction of 61/100, NUM = 61 and DEN = 100. The fractional denominator value, DEN, can be set from 2 to 4,194,303. The case of DEN = 0 makes no sense, because this would cause an infinite N value; the case of 1 makes no sense either (but could be done), because integer mode should be used in these applications. All other values in this range, like 10, 32, 42, 734, or 4,000,000 are all valid. Once the fractional denominator, DEN, is determined, the fractional numerator, NUM, is intended to be varied from 0 to DEN-1. In general, the fractional denominator, DEN, can be calculated by dividing the phase detector frequency by the greatest common divisor (GCD) of the channel spacing (fCH) and the phase detector frequency. If the channel spacing is not obvious, then it can be calculated as the greatest common divisor of all the desired VCO frequencies. FDEN = k × fPD / GCD (fPD , fCH) k = 1, 2, 3 .. (3) For example, consider the case of a 10 MHz phase detector frequency and a 200 kHz channel spacing at the VCO output. The greatest common divisor of 10 MHz and 200 kHz is just 200 kHz. If one takes 10 MHz divided by 200 kHz, the result is 50. So a fractional denominator of 50, or any multiple of 50 would work in this example. Now consider a case with a 10 MHz phase detector frequency and a 30 kHz channel spacing. The greatest common divisor of 10 MHz and 30 kHz is 10 kHz. The fractional denominator therefore must be a multiple 1000, because this is 10 MHz divided by 10 kHz. For a final example, consider an application with a fixed output frequency of 2110.8 MHz and a OSCin frequency of 19.68 MHz. If the phase detector frequency is chosen to be 19.68 MHz, then the channel spacing can be calculated as the greatest common multiple of 19.68 MHz and 2110.8 MHz, which is 240 kHz. The fractional denominator is therefore a multiple of 41, which is 19.68 MHz / 240 kHz. Refer to AN-1865 Frequency Synthesis and Planning for PLL Architectures (SNAA061) for more details on frequency planning. To achieve a fractional N value, an integer N divider is modulated between different values. This gives rise to three main degrees of freedom with the LMX2531 delta-sigma engine including the modulator order, dithering, and the way that the fractional portion is expressed. The first degree of freedom is the modulator order, which gives the user the ability to optimize for a particular application. The modulator order can be selected as zero (integer mode), two, three, or four. One simple technique to better understand the impact of the delta-sigma fractional engine on noise and spurs is to tune the VCO to an integer channel and observe the impact of changing the modulator order from integer mode to a higher order. The higher the fractional modulator order is, the lower the spurs theoretically are. However, this is not always the case, and the higher order fractional modulator can sometimes give rise to additional spurious tones, but this is dependent on the application. The second degree of freedom with the LMX2531 delta-sigma engine is dithering. Dithering is often effective in reducing these additional spurious tones, but can add phase noise in some situations. The third degree of freedom is the way that the fraction is expressed. For example, 1/10 can be expressed as 100000/1000000. Expressing the fraction in higher order terms sometimes improves the performance, particularly when dithering is used. In conclusion, there are some guidelines to getting the optimum choice of settings, but these optimum settings are application specific. Refer to AN-1879 Fractional N Frequency Synthesis (SNAA062) for a much more detailed discussion on fractional PLLs and fractional spurs. 8.3.5 Partially Integrated Loop Filter The LMX2531 integrates the third pole (formed by R3 and C3) and fourth pole (formed by R4 and C4) of the loop filter. The values for C3, C4, R3, and R4 can also be programmed independently through the MICROWIRE interface and also R3 and R4 can be changed during FastLock, for minimum lock time. The larger the values of these components, the stronger the attenuation of the internal loop filter. The maximum attenuation can be achieved by setting R3 = R4 = 40 kΩ and C3 = C4 = 100 pF while the minimum attenuation is achieved by disabling the loop filter by setting EN_LPFLTR (R6[15]) to zero. Note that when the internal loop filter is disabled, there is still a small amount of input capacitance on front of the VCO on the order of 200 pF. Because that the internal loop filter is on-chip, it is more effective at reducing certain spurs than the external loop filter. The higher order poles formed by the integrated loop filter are also helpful for attenuating noise due to the delta-sigma modulator. This noise produced by the delta-sigma modulator is outside the loop bandwidth and dependent on the modulator order. Although setting the filtering for maximum attenuation gives the best filtering, it puts increased restrictions on how wide the loop bandwidth of the system can be, which corresponds to the case where the shunt loop filter capacitor, C1, is zero. Increasing the charge pump current and/or the phase detector frequency increases the maximum attainable loop bandwidth when designing with the integrated filter. It Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 17 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com is recommended to set the internal loop filter as high as possible without restricting the loop bandwidth of the system more than desired. If some setting between the minimum and maximum value is desired, it is preferable to reduce the resistor values before reducing the capacitor values because this will reduce the thermal noise contribution of the loop filter resistors. For design tools and more information on partially integrated loop filters, go to the Clock Design Tool on www.ti.com. 8.3.6 Low Noise, Fully Integrated VCO The LMX2531 includes a fully integrated VCO, including the inductors. For optimum phase noise performance, this VCO has frequency and phase noise calibration algorithms. The frequency calibration algorithm is necessary because the VCO internally divides up the frequency range into several bands, to achieve a lower tuning gain, and therefore better phase noise performance. The frequency calibration routine is activated any time that the R0 register is programmed. There are several bits including LOCKMODE and XTLSEL that need to be set properly for this calibration to be performed in a reliable fashion. If the temperature shifts considerably and the R0 register is not programmed, then it cannot drift more than the maximum allowable drift for continuous lock, ΔTCL, or else the VCO is not ensured to stay in lock. The phase noise calibration algorithm is necessary to achieve the lowest possible phase noise. Each version of the LMX2531, the VCO_ACI_SEL bit (R6[19:16]) needs to be set to the correct value to ensure the best possible phase noise. The gain of the VCO can change considerably over frequency. It is lowest at the minimum frequency and highest at the maximum frequency. This range is specified in Electrical Characteristics of the data sheet. When designing the loop filter, the following method is recommended to determine what VCO gain to design to. First, take the geometric mean of the minimum and maximum frequencies that are to be used. Then use a linear approximation to extrapolate the VCO gain. Suppose the application requires the LMX2531LQ2080E PLL to tune from 2100 to 2150 MHz. The geometric mean of these frequencies is sqrt (2100 × 2150) MHz = 2125 MHz. The VCO gain is specified as 9 MHz/V at 1904 MHz and 20 MHz/V at 2274 MHz. Over this range of 370 MHz, the VCO gain changes 11 MHz/V. Therefore, at 2125 MHz, the VCO gain would be approximately 9 + (2125 – 1904) × 11 / 370 = 15.6 MHz/V. Although the VCO gain can change from part to part, this variation is small compared to how much the VCO gain can change over frequency. The VCO frequency is related to the other frequencies and divider values as shown in Equation 4. fVCO = fPD × N = fOSCin × N / R (4) 8.3.7 Programmable VCO Divider All options of the LMX2531 offer the option of dividing the VCO output by two to get half of the VCO frequency at the Fout pin. The channel spacing at the Fout pin is also divided by two as well. Because this divide by two is outside feedback path between the VCO and the PLL, enabling does require one to change the N divider, R divider, or loop filter values. When this divider is enabled, there will be some far-out phase noise contribution to the VCO noise. Note that the R0 register should be reprogrammed the first time after the DIV2 bit is enabled or disabled for optimal phase noise performance. The frequency at the Fout pin is related to the VCO frequency and divider value, D, as shown in Equation 5. fFout = fVCO / D 18 (5) Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 8.3.8 Serial Data Timing Requirements See MICROWIRE Timing Requirements. MSB DATA D19 LSB D18 D17 D16 D15 D0 C3 C2 C1 C0 CLK tCES tCS tCWH tCH tCWL tES LE tEWH Figure 2. Serial Data Timing Diagram The DATA is clocked into a shift register on each rising edge of the CLK signal. On the rising edge of the LE signal, the data is sent from the shift registers to an actual counter. There are several other considerations as well: • A slew rate of at least 30 V/μs is recommended for the CLK, DATA, and LE signals. • After the programming is complete, the CLK, DATA, and LE signals should be returned to a low state. • It is recommended to put a small delay between the falling edge of the last CLK pulse and the rising edge of the LE pulse for optimal noise immunity and the most reliable programming. • Although it is strongly recommended to keep LE low after programming, LE can be kept high if bit R5[23] is changed to 0 (from its default value of 1). If this bit is changed, then the operation of the part is not ensured because it is not tested under these conditions. • If the CLK and DATA lines are toggled while the in VCO is in lock, as is sometimes the case when these lines are shared with other parts, the phase noise may be degraded during the time of this programming. • If the part is not programmed, the values of the registers in this part have to be assumed to be random. Therefore, the current consumption and spurs generated by this part can be random. If this is an issue, the CE pin can be held low for more consistent behavior. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 19 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 8.4 Device Functional Modes The LMX2531 operates mainly in the active mode. The other two modes are reset and powerdown modes. The powerdown mode can be achieved by taking the CE pin to 0 V. The reset mode is achieved if the REG_RST bit is set to 1. 8.5 Programming The LMX2531 is programmed using 11 24-bit registers used to control the LMX2531 operation. A 24-bit shift register is used as a temporary register to indirectly program the on-chip registers. The shift register consists of a data field and an address field. The last 4 register bits, CTRL[3:0] form the address field, which is used to decode the internal register address. The remaining 20 bits form the data field DATA[19:0]. While LE is low, serial data is clocked into the shift register upon the rising edge of clock (data is programmed MSB first). When LE goes high, data is transferred from the data field into the selected register bank. Although there are actually 14 registers in this part, only a portion of them should be programmed, because the state of the other hidden registers (R13, R11, and R10) are set during the initialization sequence. Although it is possible to program these hidden registers, as well as a lot of bits that are defined to either 1 or 0, the user should not experiment with these hidden registers and bits, because the parts are not tested under these conditions and doing so will most likely degrade performance. Table 2. Register Location Truth Table 20 C3 C2 C1 C0 Data Address 1 1 0 0 R12 1 0 0 1 R9 1 0 0 0 R8 0 1 1 1 R7 0 1 1 0 R6 0 1 0 1 R5 0 1 0 0 R4 0 0 1 1 R3 0 0 1 0 R2 0 0 0 1 R1 0 0 0 0 R0 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 8.6 Register Maps 8.6.1 General Programming Information Table 3. Programming Register Structure DATA[19:0] CONTROL[3:0] MSB D19 LSB D18 D17 D16 D15 D14 D13 D12 D11 D10 D 9 D 8 D 7 D 6 D 5 D 4 D 3 D 2 D 1 D 0 C 3 C 2 C 1 C0 8.6.1.1 Initialization Sequence The initial loading sequence from a cold start is described in Table 4. The registers must be programmed in order shown. There must be a minimum of 10 ms between the time when R5 is last loaded and R1 is loaded to ensure time for the LDOs to power up properly. Table 4. Initialization Sequence REG. 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 DATA[19:0] 3 2 1 0 C3 C2 C1 C0 R5 INIT1 1 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 R5 INIT2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 R5 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 0 1 0 1 Program R12 as shown in the complete register map. 1 1 0 0 R9 Program R9 as shown in the complete register map. 1 0 0 1 R8 See individual section for Register R8 programming information. Programming of this register is necessary under specific circumstances. 1 0 0 0 R7 See individual section for Register R7 programming information. 0 1 1 1 R6 See individual section for Register R6 programming information. 0 1 1 0 R4 See individual section for Register R4 programming information. Register R4 only needs to be programmed if FastLock is used. 0 1 0 0 R3 See individual section for Register R3 programming information. 0 0 1 1 R2 See individual section for Register R2 programming information. 0 0 1 0 R1 See individual section for Register R1 programming information. 0 0 0 1 R0 See individual section for Register R0 programming information. 0 0 0 0 R12 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 21 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 8.6.1.2 Complete Register Content Map Table 5 shows all the programmable bits for the LMX2531. No programming order or initialization sequence is implied by Table 5, only the location of the programming information. REGISTER Table 5. Complete Register Content Map 23 22 21 20 18 17 16 14 13 12 11 10 N [7:0] R1 0 0 R2 0 1 9 8 7 6 5 4 DIV2 FDM NUM [11:0] ICP [3:0] 1 N [10:8] NUM [21:12] DEN [11:0] DITHER [1:0] ORDER [1:0] R [5:0] FoLD [3:0] DEN [21:12] ICPFL [3:0] TOC [13:0] R4 0 0 R5 1 0 R6 0 R7 0 0 R8 0 0 0 0 0 0 1 R9 0 0 0 0 0 0 0 0 R12 0 0 0 0 0 0 0 1 22 15 DATA[19:0] R0 R3 19 0 0 0 XTLSEL [2:0] REG _RS T 0 0 0 EN_ LPF LTR VCO_ACI_SEL [3:0] 0 0 R4_ADJ [1:0] 0 0 R4_ADJ_F L [1:0] EN_ DIG LDO EN_ PLL LDO 2 R3_ADJ [1:0] XTLMAN [11:0] EN_ PLL LDO 1 EN_ EN_ EN_ VCO OSC VCO LD R3_ADJ_F L [1:0] EN_ PLL C3_4_ADJ [2:0] 3 2 1 0 C3 C2 C1 C0 0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 1 0 0 0 1 0 1 0 1 1 0 XTLDIV [1:0] 0 0 0 0 0 1 1 1 0 0 0 0 0 0 0 0 0 0 XTL MAN 2 1 0 0 0 0 0 0 0 1 0 1 1 1 0 1 0 1 0 0 1 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 0 LOCK MODE Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 8.6.1.3 Register R0 The action of programming the R0 register activates a frequency calibration routine for the VCO. This calibration is necessary to get the VCO to center the tuning voltage for optimal performance. If the temperature drifts considerably, then the PLL should stay in lock, provided that the temperature drift specification is not violated. 8.6.1.3.1 NUM[10:0] and NUM[21:12] -- Fractional Numerator The NUM word is split between the R0 register and R1 register. The Numerator bits determine the fractional numerator for the delta-sigma PLL. This value can go from 0 to 4095 when the FDM bit (R3[22]) is 0 (the other bits in this register are ignored), or 0 to 4194303 when the FDM bit is 1. Table 6. Fractional Numerator FRACTIONAL NUMERATOR NUM[21:12] 0 NUM[11:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 409503 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4096 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ... ... 4194303 Note that there are restrictions on the fractional numerator value depending on the R divider value if it is 16 or 32. 8.6.1.3.2 N[7:0] and N[10:8] The N counter is 11 bits. 8 of these bits are located in the R0 register, and the remaining 3 (MSB bits) are located in the R1 register. The LMX2531 consists of an A, B, and C counter, which work in conjunction with the 16/17/20/21 prescaler to form the final N counter value. Table 7. N Divider Value N[10:8] N[7:0] N Value C B <48 Values less than 48 are prohibited. 48 - 51 Possible ONLY with ORDER = 1 (Reset Modulator) 52-54 55 A Values of 52 - 54 are prohibited. 0 0 0 0 0 1 1 0 1 1 1 1 1 1 1 1 1 1 0 1 1 1 ... 2039 8.6.1.4 Register R1 8.6.1.4.1 NUM[21:12] These are the MSB bits in for the fractional numerator that already have been described. 8.6.1.4.2 N[10:8] -- 3 MSB Bits for the N Counter These are the 2 MSB bits for the N counter, which were discussed in Register R0. 8.6.1.4.3 ICP[3:0] -- Charge Pump Current This bit programs the charge pump current in from 90 µA to 1440 µA in 90 µA steps. In general, higher charge pump currents yield better phase noise for the PLL, but also can cause higher spurs. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 23 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Table 8. Charge Pump Current ICP CHARGE PUMP STATE TYPICAL CHARGE PUMP CURRENT at 3 VOLTS (µA) 0 1X 90 1 2X 180 2 3X 270 3 4X 360 4 5X 450 5 6X 540 6 7X 630 7 8X 720 8 9X 810 9 10X 900 10 11X 990 11 12X 1080 12 13X 1170 13 14X 1260 14 15X 1350 15 16X 1440 8.6.1.5 Register R2 8.6.1.5.1 R[5:0] -- R Counter Value These bits determine the phase detector frequency. The OSCin frequency is divided by this R counter value. Note that only the values of 1, 2, 4, 8, 16, and 32 are allowed. Table 9. R Divider Value R VALUE FRACTIONAL DENOMINATOR RESTRICTIONS R[5:0] 0,3,5-7, 9-15,17-31, 33-63 n/a These values are illegal. 1 none 0 0 0 0 0 1 2 none 0 0 0 0 1 0 4 none 0 0 0 1 0 0 8 none 0 0 1 0 0 0 16 Must be divisible by 2 0 1 0 0 0 0 32 Must be divisible by 4 1 0 0 0 0 0 The R counter value can put some restrictions on the fractional denominator. In the case that it is 16, the fractional denominator must be divisible by 2, which is equivalent to saying that the LSB of the fractional denominator word is zero. In the case that the R counter is 32, the two LSB bits of the fractional denominator word must also be zero, which is equivalent to saying that the fractional denominator must be divisible by 4. Because the fractional denominator can be very large, this should cause no issues. For instance, if one wanted to achieve a fractional word of 1/65, and the R counter value was 16, the fractional word could be changed to 4/260, and the same resolution could be achieved. 24 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 8.6.1.5.2 DEN[21:12] and DEN[11:0]-- Fractional Denominator These bits determine the fractional denominator. Note that the MSB bits for this word are in register R3. If the FDM bit is set to 0, DEN[21:12] are ignored. The fractional denominator should only be set to zero if the fractional circuitry is being disabled by setting ORDER = 1. A value of one never makes sense to use. All other values could reasonably be used in fractional mode. Table 10. Fractional Denominator FRACTIONAL DENOMINATOR DEN[21:12] 0 DEN[11:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4095 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4096 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ... ... 4194303 8.6.1.6 Register R3 8.6.1.6.1 DEN[21:12] -- Extension for the Fractional Denominator These are the MSB bits of the DEN word, which have already been discussed. 8.6.1.6.2 FoLD[3:0] -- Multiplexed Output for Ftest/LD Pin The FoLD[3:0] word is used to program the output of the Ftest/LD pin. This pin can be used for a general purpose I/O pin, a lock detect pin, and for diagnostic purposes. When programmed to the digital lock detect state, the output of the Ftest/LD pin will be high when the part is in lock, and low otherwise. Lock is determined by comparing the input phases to the phase detector. The analog lock detect modes put out a high signal with very fast negative pulses, that correspond to when the charge pump comes on. This output can be low pass filtered with an RC filter to determine the lock detect state. If the open drain state is used, a additional pullup resistor is required. For diagnostic purposes, the options that allow one to view the output of the R counter or the N counter can be very useful. Be aware that the output voltage level of the Ftest/LD is not equal to the supply voltage of the part, but rather is given by VOH and VOL in Electrical Characteristics. Table 11. Ftest/LD Pin Functions FoLD OUTPUT TYPE FUNCTION 0 High Impedance Disabled 1 Push-Pull Logical High State 2 Push-Pull Logical Low State 3 Push-Pull Digital Lock Detect 4 N/A Reserved 5 Push-Pull N Counter Output Divided by 2 6 Open-Drain Analog Lock Detect 7 Push-Pull Analog Lock Detect 8 N/A Reserved 9 N/A Reserved 10 N/A Reserved 11 N/A Reserved 12 N/A Reserved 13 N/A Reserved 14 Push-Pull R Counter Output 15 N/A Reserved Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 25 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 8.6.1.6.3 ORDER -- Order of Delta-Sigma Modulator This bit determines the order of the delta-sigma modulator in the PLL. In general, higher order fractional modulators tend to reduce the primary fractional spurs that occur at increments of the channel spacing, but can also create spurs that are at a fraction of the channel spacing, if there is not sufficient filtering. The optimal choice of modulator order is very application specific, however, a third order modulator is a good starting point if not sure what to try first. Table 12. Delta-Sigma Modulator ORDER DELTA-SIGMA MODULATOR ORDER 0 Fourth 1 Reset Modulator (Integer Mode - all fractions are ignored) 2 Second 3 Third 8.6.1.6.4 DITHER -- Dithering Dithering is useful in reducing fractional spurs, especially those that occur at a fraction of the channel spacing. The only exception is when the fractional numerator is zero. In this case, dithering usually is not a benefit. Dithering also can sometimes increase the PLL phase noise by a fraction of a dB. In general, if dithering is disabled, phase noise may be slightly better inside the loop bandwidth of the system, but spurs are likely to be worse too. Table 13. Fractional Dithering DITHER DITHERING MODE 0 Weak Dithering 1 Reserved 2 Strong Dithering 3 Dithering Disabled 8.6.1.6.5 FDM -- Fractional Denominator Mode When this bit is set to 1, the 10 MSB bits for the fractional numerator and denominator are considered. This allows the fractional denominator to range from 1 to 4,194,303. If this bit is set to zero, only the 12 LSB bits of the fractional numerator and denominator are considered, and this allows a fractional denominator from 1 to 4095. When this bit is disabled, the current consumption is about 0.5 mA lower. 8.6.1.6.6 DIV2 When this bit is enabled, the output of the VCO is divided by 2. Enabling this bit does have some impact on harmonic content and output power. Table 14. VCO Output Divider DIV2 VCO OUTPUT FREQUENCY 0 Not Divided by 2 1 Divided by 2 8.6.1.7 Register R4 8.6.1.7.1 TOC[13:0] -- Time-Out Counter for FastLock When the value of this word is 3 or less, then FastLock is disabled, and this pin can only be used for general purpose I/O. When this value is 4 or greater, the time-out counter is engaged for the amount of phase detector cycles shown in Table 15. 26 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 Table 15. FastLock Timeout Counter TOC VALUE FLout PIN STATE TIMEOUT COUNT 0 High Impedance 0 1 Low Always Enabled 2 Low 0 3 High 0 4 Low 4 × 2 Phase Detector . . . 16383 Low 16383 × 2 Phase Detector When this count is active, the FLout pin is grounded, the FastLock current is engaged, and the resistors R3 and R4 are also potentially changed. The table below summarizes the bits that control various values in and out of FastLock differences. Table 16. FastLock Filter Values CHARGE PUMP CURRENT FastLock STATE FLout R3 R4 Steady State High Impedance ICP R3_ADJ R4_ADJ Fastlock Grounded ICPFL R3_ADJ_FL R4_ADJ_FL 8.6.1.7.2 ICPFL[3:0] -- Charge Pump Current for Fastlock When FastLock is enabled, this is the charge pump current that is used for faster lock time. Table 17. FastLock Charge Pump Current TYPICAL Fastlock CHARGE PUMP CURRENT at 3 VOLTS (µA) ICPFL Fastlock CHARGE PUMP STATE 0 1X 90 1 2X 180 2 3X 270 3 4X 360 4 5X 450 5 6X 540 6 7X 630 7 8X 720 8 9X 810 9 10X 900 10 11X 990 11 12X 1080 12 13X 1170 13 14X 1260 14 15X 1350 15 16X 1440 8.6.1.8 Register R5 8.6.1.8.1 EN_PLL -- Enable Bit for PLL When this bit is set to 1 (default), the PLL is powered up, otherwise, it is powered down. 8.6.1.8.2 EN_VCO -- Enable Bit for the VCO When this bit is set to 1 (default), the VCO is powered up, otherwise, it is powered down. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 27 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 8.6.1.8.3 EN_OSC -- Enable Bit for the Oscillator Inverter When this bit is set to 1 (default), the reference oscillator is powered up, otherwise it is powered down. 8.6.1.8.4 EN_VCOLDO -- Enable Bit for the VCO LDO When this bit is set to 1 (default), the VCO LDO is powered up, otherwise it is powered down. 8.6.1.8.5 EN_PLLLDO1 -- Enable Bit for the PLL LDO 1 When this bit is set to 1 (default), the PLL LDO 1 is powered up, otherwise it is powered down. 8.6.1.8.6 EN_PLLLDO2 -- Enable Bit for the PLL LDO 2 When this bit is set to 1 (default), the PLL LDO 2 is powered up, otherwise it is powered down. 8.6.1.8.7 EN_DIGLDO -- Enable Bit for the digital LDO When this bit is set to 1 (default), the Digital LDO is powered up, otherwise it is powered down. 8.6.1.8.8 REG_RST -- Resets All Registers to Default Settings This bit needs to be programmed three times to initialize the part. When this bit is set to one, all registers are set to default mode, and the part is powered down. The second time the R5 register is programmed with REG_RST = 0, the register reset is released and the default states are still in the registers. However, because the default states for the blocks and LDOs is powered off, it is therefore necessary to program R5 a third time so that all the LDOs and blocks can be programmed to a power up state. When this bit is set to 1, all registers are set to the default modes, but part is powered down. For normal operation, this bit is set to 0. Once this initialization is done, it is not necessary to do this again unless power is removed from the device. 8.6.1.9 Register R6 8.6.1.9.1 C3_C4_ADJ[2:0] -- Value FOR C3 and C4 In The Internal Loop Filter Table 18. Internal Loop Filter Capacitors C3_C4_ADJ C3 (pF) 0 50 C4 (pF) 50 1 50 100 2 50 150 3 100 50 4 150 50 5 100 100 6 50 150 7 50 150 8.6.1.9.2 R3_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R3 During Fastlock Table 19. Internal Loop Filter Resistor R3 During Fastlock 28 R3_ADJ_FL Value R3 RESISTOR DURING Fastlock (kΩ) 0 10 1 20 2 30 3 40 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 8.6.1.9.3 R3_ADJ[1:0] -- Value for Internal Loop Filter Resistor R3 Table 20. Internal Loop Filter Resistor R3 R3_ADJ R3 VALUE (kΩ) 0 10 1 20 2 30 3 40 8.6.1.9.4 R4_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R4 During Fastlock Table 21. Internal Loop Filter Resistor R4 During FastLock R4_ADJ_FL R4 VALUE DURING Fast Lock (kΩ) 0 10 1 20 2 30 3 40 8.6.1.9.5 R4_ADJ[1:0] -- Value for Internal Loop Filter Resistor R4 Table 22. Internal Loop Filter Resistor R4 R4_ADJ R4 VALUE (kΩ) 0 10 1 20 2 30 3 40 8.6.1.9.6 EN_LPFLTR-- Enable for Partially Integrated Internal Loop Filter The Enable Loop Filter bit is used to enable or disable the third and fourth pole on-chip loop filters. Table 23. Enable Bit for Internal Loop Filter EN_LPFLTR 3rd and 4th POLES of LOOP FILTER 0 disabled (R3 = R4 = 0 Ω and C3 + C4 = 200 pF) 1 enabled 8.6.1.9.7 VCO_ACI_SEL This bit is used to optimize the VCO phase noise. The recommended values are what are used for all testing purposes, and this bit should be set as instructed in the following table. Table 24. VCO ACI Selection PART VCO_ACI_SEL All Other Options 8 LMX2531LQ2265E LMX2531LQ2570E LMX2531LQ2820E LMX2531LQ3010E 6 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 29 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 8.6.1.9.8 XTLSEL[2:0] -- OSCin Select The XTLSEL bit is used to select between manual oscin mode and one of the automatic modes. The user may choose manual oscin mode (XTLSEL = 4) and program the XTLMAN (R7[21:10]) and XTLMAN2 (R7[4]) bits for a specific OSCin frequency, or one of the automatic modes (XTLSEL = 0, 1, 2, 3). For the LMX2531LQ2080E/2570E options or when the OSCin frequency is less than 8 MHz, manual oscin mode must always be selected. The automatic modes can be used for the other frequency options. When using one of the automatic modes, XTLSEL should be set based on the OSCin frequency. Table 25. OSCin Frequency Select XTLSEL MODE OSCin FREQUENCY 0 8 — 25 MHz Automatic Modes Programming of XTLMAN (R7[21:10]) not required. Programming of XTLMAN2 (R7[4]) not required. 1 2 25 — 50 MHz 50 — 70 MHz 3 70 — 80 MHz Manual OSCin Mode Must use this for LMX2531LQ2080E/2570E/2820E/3010E Must use this if fOSCin < 8 MHz Programming of XTLMAN (R7[21:10]) required. Programming of XTLMAN2 (R7[4]) may be required. 4 5, 6, 7 5 — 80 MHz Reserved 8.6.1.10 Register R7 8.6.1.10.1 XTLDIV[1:0] -- Division Ratio for the OSCin Frequency The frequency provided to the VCO frequency calibration circuitry is based on the OSCin frequency divided down by a factor, determined by the XTLDIV word. Note that this division ratio is independent of the R counter value or the phase detector frequency. The necessary division ratio depends on the OSCin frequency and is shown in Table 26. Table 26. OSCin Division Ratio XTLDIV 30 OSCin DIVISION RATIO OSCin RANGE 0 Reserved Reserved 1 Divide by 2 < 20 MHz 2 Divide by 4 20 — 40 MHz 3 Divide by 8 > 40 MHz Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 8.6.1.10.2 XTLMAN[11:0] -- Manual OSCin Mode XTLMAN must be programmed if word XTLSEL (XTLSEL[2:0] -- OSCin Select) is set to manual OSCin mode. In the table below, the proper value for XTLMAN is shown based on some common OSCin frequencies (fOSCin) and various LMX2531 options. For any OSCin frequency XTLMAN can be calculated as 16 × fOSCin / Kbit. fOSCin is expressed in MHz and Kbit values for the LMX2531 frequency options can be found in Table 28. Table 27. XTLMAN Values for Common OSCin Frequencies DEVICE fOSCin 5 MHz 10 MHz 20 MHz 30.72 MHz 61.44 MHz 76.8 MHz LMX2531LQ1146E 53 107 213 327 655 819 LMX2531LQ1226E 53 107 213 327 655 819 LMX2531LQ1312E 47 94 188 289 578 722 LMX2531LQ1415E 47 94 188 289 578 722 LMX2531LQ1500E 40 80 160 246 492 614 LMX1531LQ1515E 40 80 160 246 492 614 LMX2531LQ1570E 38 76 152 234 468 585 LMX2531LQ1650E 38 76 152 234 468 585 LMX2531LQ1700E 35 70 139 214 427 534 LMX2531LQ1742 32 64 128 197 393 492 LMX2531LQ1778E 31 62 123 189 378 473 LMX2531LQ1910E 27 53 107 164 328 410 LMX2531LQ2265E 20 40 80 123 246 307 LMX2531LQ2080E 18 36 71 109 218 273 LMX2531LQ2570E 13 27 53 82 164 205 LMX2531LQ2820E 11 23 46 70 140 178 LMX2531LQ3010E 10 20 40 61 123 154 Table 28. Kbit Values for Various LMX2531 Options DEVICE Kbit LMX2531LQ1146E 1.5 LMX2531LQ1226E 1.5 LMX2531LQ1312E 1.7 LMX2531LQ1415E 1.7 LMX2531LQ1500E 2 LMX2531LQ1515E 2 LMX2531LQ1570E 2.1 LMX2531LQ1650E 2.1 LMX2531LQ1700E 2.3 LMX25311742 2.5 LMX2531LQ1778E 2.6 LMX2531LQ1910E 3 LMX2531LQ2265E 4 LMX2531LQ2080E 4.5 LMX2531LQ2570E 6 LMX2531LQ2820E 7 LMX2531LQ3010E 8 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 31 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com 8.6.1.11 Register R8 8.6.1.11.1 XTLMAN2 -- Manual Crystal Mode Second Adjustment This bit also adjusts the calibration timing for lock time. In the case that manual mode for XTLSEL is selected and the OSCin frequency is greater than 40 MHz, this bit should be enabled, otherwise it should be 0. 8.6.1.11.2 LOCKMODE -- Frequency Calibration Mode This bit controls the method for which the VCO frequency calibration is done. The two valid modes are linear mode and mixed mode. Linear mode works by searching through the VCO frequency bands in a consecutive manner. Mixed mode works by initially using a divide and conquer approach and then using a linear approach. For small frequency changes, linear mode is faster and for large frequency changes, mixed mode is faster. Linear mode can always be used, but there are restrictions for when Mixed Mode can be used. Table 29. Lockmode Settings LOCKMODE DESCRIPTION CONDITIONS on OSCin FREQUENCY CONDITIONS on OPTIONS 0 Reserved Never use this mode 1 Linear Mode Works over all options and all valid OSCin Frequencies 2 Mixed Mode 3 Reserved All but the following options LMX2531LQ1146E/1226E/1312E/1415E/1515E fOSCin ≥ 8 MHz Never use this mode 8.6.1.12 Register R9 All the bits in this register should be programmed as shown in Complete Register Content Map. 8.6.1.13 Register R12 Even though this register does not have user-selectable bits, it still needs to be programmed. This register should be loaded as shown in Complete Register Content Map. 32 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LMX2531 can be used in a broad class of applications. In general, they tend to fall in the categories where the output frequency is a nicely related input frequency and those that require fractional mode. The following schematic generally applies to most applications. 9.2 Typical Application TCXO C2_LF 100 nF C1_LF OSCin 100 nF OSCin* 1 PF FLout VccDIG R2pLF CPout 10: Vtune R2_LF 10 nF VregDIG 3.3: VccVCO Power Supply 4.7 PF VregVCO 10: 10 nF 1 PF VrefVCO LMX2531 10 nF 10: VregBUF VccBUF 0.22: 470 nF 0.22: 470 nF 1 PF Fout Test 1 PF CE VccPLL 10 PF CLK DATA LE 10: Ftest/LD VregPLL2 VregPLL1 100 pF Microcontroller Circuit Table 30. Typical Connection Diagram PIN(S) Vcc, Vreg, and Vref Pins APPLICATION INFORMATION Consult the power supply recommendations for these pins. CLK DATA LE Because the maximum voltage on these pins is less than the minimum Vcc voltage, level shifting may be required if the output voltage of the microcontroller is too high. This can be accomplished with a resistive divider. CE As with the CLK, DATA, and LE pins, level shifting may be required if the output voltage of the microcontroller is too high. A resistive divider or a series diode are two ways to accomplish this. The diode has the advantage that no current flows through it when the chip is powered down. Ftest/LD It is an option to use the lock detect information from this pin. Fout This is the high frequency output. This needs to be AC coupled, and matching may also be required. The value of the DC blocking capacitor may be changed, depending on the output frequency. CPout Vtune In most cases, it is sufficient to short these together, although there always the option of adding additional poles. C1_LF, C2_LF, and R2_LF are used in conjunction with the internal loop filter to make a fourth order loop filter. R2pLF This is the fastlock resistor, which can be useful in many cases, because the spurs are often better with low charge pump currents, and the internal loop filter can be adjusted during fastlock. OSCin This is the reference oscillator input pin. It needs to be AC coupled. OSCin* If the device is being driven single-ended, this pin needs to be shunted to ground with a capacitor. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 33 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Typical Application (continued) 9.2.1 Design Requirements Consider generating 1500-MHz fixed frequency from a fixed 10-MHz input frequency. This is the situation similar that was used for the LMX2531LQ1500E evaluation board. For this design example, use the parameters listed in Table 31 as the user-input parameters. Table 31. Design Procedure PARAMETER VALUE REASON FOR CHOOSING Fout 1500 MHz This value was given. Fosc 10 MHz This value was given. Fpd 10 MHz This maximized for the best phase noise performance. This is an integer PLL design, so it makes sense to maximize this. If Fpd 10 MHz it was a fractional design, then sometimes lowering this frequency can improve fractional spurs. Loop Bandwidth 11.5 kHz This is wider for better jitter, but it is also restricted by the internal loop filter Phase Margin 76.8 deg Choosing a high phase margin is good for better jitter. Kpd 16x C3_LF 50 pF Higher charge pump gains are better for better PLL phase noise C4_LF 50 pF R3_LF 10 kΩ R4_LF 10 kΩ C1_LF Open The internal loop filter restricts the loop bandwidth. By making C1_LF=open, this maximizes the achievable bandwidth for a particular setup condition. C2_LF 82 nF These can be calculated with the Clock Architect. R2_LF 1.5 kΩ These can be calculated with the Clock Architect. ORDER "Reset Modulator" DITHER "Disabled" XTLMAN 80 In general, the internal loop filter restricts how wide the loop bandwidth can be. Although a wider loop bandwidth could be obtained by switching out the internal loop filter altogether, it is nice to have some internal poles to filter some unwanted spurs. So this is the minimum setting for the internal loop filter. The device should be set to integer mode. Dithering does not help in integer mode. This is a setting for the LMX2531LQ1500E for a 10 MHz input. 9.2.2 Detailed Design Procedure Use the WEBENCH® Clock Architect to calculate the values of C2_LF and R2_LF. Set the device to integer mode and DITHER to disabled. 9.2.3 Application Curves Figure 3. Closed Loop Phase Noise 34 Submit Documentation Feedback Figure 4. Open Loop VCO Noise Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 9.3 Do's and Don'ts Category Don't Why Loop Filter Design For integer Designs: Maximize charge pump current and phase detector frequency. For Fractional Designs: Blindly maximize charge pump current and phase detector frequency. Maximizing the charge pump current and phase detector frequency give the best PLL phase noise and also allow a wider bandwidth with the internal filter engaged. However, increasing these also increase the integer boundary spur. So for a fractional design, these need to be balanced against fractional spurs. Partially Integrated Loop Filter Be aware that engaging this can restrict the loop filter bandwidth. Use TI simulation tools to see how wide the bandwidth can be. Design for the widest possible bandwidth with the integrated filter engaged and be surprised when the bandwidth is smaller. Enabling the internal loop filter poles provides useful filtering, but also restricts how wide the loop bandwidth can be. Ground the "No Connect" Pins where the pin description says "Do Not Ground". The DAP is grounded and used. However, if the terminal description says "Do not ground" this is for a reason. Some of these pins are for the VCO tank circuit. There are other no connect pins that are true no connect, but there is no advantage to grounding them. Note that the pad labeled "NC" above pins 14 and 15 should NOT be grounded. "No Connect" and DAP Pins Do Ground the DAP Pin 10 Power Supply Recommendations The device is designed to operate within a recommended supply voltage range of 2.8 V to 3.2 V. Do not exceed the values listed in the Absolute Maximum Ratings table. If the supply is not available, ensure that the CLK, DATA, LE, and CE pins are held low. A power-on reset (POR) feature is not available for this device. 11 Layout 11.1 Layout Guidelines For the layout of the LMX2531, perhaps the most important factor is to be aware of the package footprint. The asymmetrical land pattern can cause issues if not correctly done. 11.1.1 Typical Connection Diagram 11.1.1.1 VccDIG, VccVCO, VccBUF, and VccPLL These pins are inputs to voltage regulators. Because the LMX2531 contains internal regulators, the power supply noise rejection is very good and capacitors at this pin are not critical. An RC filter can be used to reduce supply noise, but if the capacitor is too large and is placed too close to these pins, they can sometimes cause phase noise degradation in the 100 — 300 kHz offset range. Recommended values are from open to 1 μF. The 10 Ω series resistors serve to filter power supply noise and isolate these pins from large capacitances. 11.1.1.2 VregDIG A bypass capacitor of 10 nF is recommended. 11.1.1.3 VrefVCO If the VrefVCO capacitor is changed, it is recommended to keep this capacitor between 1/100 and 1/1000 of the value of the VregVCO capacitor. 11.1.1.4 VregVCO Because this pin is the output of a regulator, there are stability concerns if there is not sufficient series resistance. For ceramic capacitors, the ESR (Equivalent Series Resistance) is too low, and it is recommended that a series resistance of 1 — 3.3 Ω is necessary. If there is insufficient ESR, then there may be degradation in the phase noise, especially in the 100 — 300 kHz offset. Recommended values are from 1 μF to 10 μF. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 35 LMX2531 SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 www.ti.com Layout Guidelines (continued) 11.1.1.5 VregPLL1VregPLL2 The choice of the capacitor value at this pin involves a trade-off between integer spurs and phase noise in the 100 — 300 kHz offset range. Using a series resistor of about 220 mΩ in series with a capacitance that has an impedance of about 150 mΩ at the phase detector frequency seems to give an optimal trade-off. For instance, if the phase detector frequency is 2.5 MHz, then make this series capacitor 470 nF. If the phase detector frequency is 10 MHz, make this capacitance about 100 nF. 11.2 Layout Example 36 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 LMX2531 www.ti.com SNAS252S – OCTOBER 2005 – REVISED DECEMBER 2014 12 Device and Documentation Support 12.1 Device Support For the Clock Architect tool, go to http://www.ti.com/lsds/ti/analog/webench/clock-architect.page 12.2 Trademarks All trademarks are the property of their respective owners. 12.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: LMX2531 37 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMX2531LQ1146E/NOPB ACTIVE WQFN NJH 36 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311146E LMX2531LQ1226E/NOPB ACTIVE WQFN NJH 36 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311226E LMX2531LQ1312E/NOPB ACTIVE WQFN NJH 36 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311312E LMX2531LQ1415E/NOPB ACTIVE WQFN NJH 36 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311415E LMX2531LQ1500E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311500EB LMX2531LQ1515E/NOPB ACTIVE WQFN NJH 36 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311515E LMX2531LQ1570E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311570EB LMX2531LQ1650E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311650EA LMX2531LQ1700E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311700EB LMX2531LQ1742/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311742A LMX2531LQ1778E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311778EA LMX2531LQ1910E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311910EB LMX2531LQ2080E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312080EB LMX2531LQ2265E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312265ED LMX2531LQ2570E/NOPB ACTIVE WQFN NJG 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312570EC LMX2531LQ2820E/NOPB ACTIVE WQFN NJH 36 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312820E LMX2531LQ3010E/NOPB ACTIVE WQFN NJH 36 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 313010E Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 9-Oct-2014 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMX2531LQE1146E/NOPB ACTIVE WQFN NJH 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311146E LMX2531LQE1226E/NOPB ACTIVE WQFN NJH 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311226E LMX2531LQE1312E/NOPB ACTIVE WQFN NJH 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311312E LMX2531LQE1415E/NOPB ACTIVE WQFN NJH 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311415E LMX2531LQE1515E/NOPB ACTIVE WQFN NJH 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311515E LMX2531LQE2820E/NOPB ACTIVE WQFN NJH 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312820E LMX2531LQE3010E/NOPB ACTIVE WQFN NJH 36 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 313010E LMX2531LQX1146E/NOPB ACTIVE WQFN NJH 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311146E LMX2531LQX1226E/NOPB ACTIVE WQFN NJH 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311226E LMX2531LQX1312E/NOPB ACTIVE WQFN NJH 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311312E LMX2531LQX1415E/NOPB ACTIVE WQFN NJH 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311415E LMX2531LQX1500E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311500EB LMX2531LQX1515E/NOPB ACTIVE WQFN NJH 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311515E LMX2531LQX1570E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311570EB LMX2531LQX1650E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311650EA LMX2531LQX1700E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311700EB LMX2531LQX1742/NOPB ACTIVE WQFN NJG 36 2500 TBD Call TI Call TI -40 to 85 LMX2531LQX1778E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 Addendum-Page 2 311778EA Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 9-Oct-2014 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMX2531LQX1910E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 311910EB LMX2531LQX2080E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312080EB LMX2531LQX2265E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312265ED LMX2531LQX2570E/NOPB ACTIVE WQFN NJG 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312570EC LMX2531LQX2820E/NOPB ACTIVE WQFN NJH 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 312820E LMX2531LQX3010E/NOPB ACTIVE WQFN NJH 36 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 313010E (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMX2531LQ1146E/NOPB WQFN NJH 36 1000 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1226E/NOPB WQFN NJH 36 1000 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1312E/NOPB WQFN NJH 36 1000 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1415E/NOPB WQFN NJH 36 1000 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1500E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1515E/NOPB WQFN NJH 36 1000 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1570E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1650E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1700E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1778E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1910E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ2080E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ2265E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ2570E/NOPB WQFN NJG 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ2820E/NOPB WQFN NJH 36 1000 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ3010E/NOPB WQFN NJH 36 1000 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 NJH 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQ1742/NOPB LMX2531LQE1146E/NOP WQFN Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2014 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant B LMX2531LQE1226E/NOP B WQFN NJH 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQE1312E/NOP B WQFN NJH 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQE1415E/NOP B WQFN NJH 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQE1515E/NOP B WQFN NJH 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQE2820E/NOP B WQFN NJH 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQE3010E/NOP B WQFN NJH 36 250 178.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1146E/NOP B WQFN NJH 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1226E/NOP B WQFN NJH 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1312E/NOP B WQFN NJH 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1415E/NOP B WQFN NJH 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1500E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1515E/NOP B WQFN NJH 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1570E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1650E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1700E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1778E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX1910E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX2080E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX2265E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX2570E/NOP B WQFN NJG 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX2820E/NOP B WQFN NJH 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 LMX2531LQX3010E/NOP B WQFN NJH 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMX2531LQ1146E/NOPB WQFN NJH 36 1000 367.0 367.0 38.0 LMX2531LQ1226E/NOPB WQFN NJH 36 1000 367.0 367.0 38.0 LMX2531LQ1312E/NOPB WQFN NJH 36 1000 367.0 367.0 38.0 LMX2531LQ1415E/NOPB WQFN NJH 36 1000 367.0 367.0 38.0 LMX2531LQ1500E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ1515E/NOPB WQFN NJH 36 1000 367.0 367.0 38.0 LMX2531LQ1570E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ1650E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ1700E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ1742/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ1778E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ1910E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ2080E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ2265E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ2570E/NOPB WQFN NJG 36 250 213.0 191.0 55.0 LMX2531LQ2820E/NOPB WQFN NJH 36 1000 367.0 367.0 38.0 LMX2531LQ3010E/NOPB WQFN NJH 36 1000 367.0 367.0 38.0 LMX2531LQE1146E/NOP B WQFN NJH 36 250 213.0 191.0 55.0 LMX2531LQE1226E/NOP B WQFN NJH 36 250 213.0 191.0 55.0 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2014 Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMX2531LQE1312E/NOP B Device WQFN NJH 36 250 213.0 191.0 55.0 LMX2531LQE1415E/NOP B WQFN NJH 36 250 213.0 191.0 55.0 LMX2531LQE1515E/NOP B WQFN NJH 36 250 213.0 191.0 55.0 LMX2531LQE2820E/NOP B WQFN NJH 36 250 213.0 191.0 55.0 LMX2531LQE3010E/NOP B WQFN NJH 36 250 213.0 191.0 55.0 LMX2531LQX1146E/NOP B WQFN NJH 36 2500 367.0 367.0 38.0 LMX2531LQX1226E/NOP B WQFN NJH 36 2500 367.0 367.0 38.0 LMX2531LQX1312E/NOP B WQFN NJH 36 2500 367.0 367.0 38.0 LMX2531LQX1415E/NOP B WQFN NJH 36 2500 367.0 367.0 38.0 LMX2531LQX1500E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX1515E/NOP B WQFN NJH 36 2500 367.0 367.0 38.0 LMX2531LQX1570E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX1650E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX1700E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX1778E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX1910E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX2080E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX2265E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX2570E/NOP B WQFN NJG 36 2500 367.0 367.0 38.0 LMX2531LQX2820E/NOP B WQFN NJH 36 2500 367.0 367.0 38.0 LMX2531LQX3010E/NOP B WQFN NJH 36 2500 367.0 367.0 38.0 Pack Materials-Page 4 MECHANICAL DATA NJG0036A LQA36A (Rev C) www.ti.com MECHANICAL DATA NJH0036D LQA36D (Rev B) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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