FAN5350 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Features Description The FAN5350 is a step-down switching voltage regulator that delivers a fixed 1.82V from an input voltage supply of 2.7V to 5.5V. Using a proprietary architecture with synchronous rectification, the FAN5350 is capable of delivering 600mA at over 90% efficiency, while maintaining a very high efficiency of over 80% at load currents as low as 1mA. The regulator operates at a nominal fixed frequency of 3MHz at full load, which reduces the value of the external components to 1µH for the output inductor and 4.7µF for the output capacitor. 3MHz Fixed-Frequency Operation 16µA Typical Quiescent Current 600mA Output Current Capability 2.7V to 5.5V Input Voltage Range 1.82V Fixed Output Voltage Synchronous Operation Power-Save Mode Soft-Start Capability Input Under-Voltage Lockout (UVLO) Thermal Shutdown and Overload Protection 6-Lead 3 x 3mm MLP 5-Bump 1 x 1.37mm WLCSP Applications At moderate and light loads, pulse frequency modulation is used to operate the device in power-save mode with a typical quiescent current of 16µA. Even with such a low quiescent current, the part exhibits excellent transient response during large load swings. At higher loads, the system automatically switches to fixed-frequency control, operating at 3MHz. In shutdown mode, the supply current drops below 1µA, reducing power consumption. The FAN5350 is available in a 6-lead Molded Leadless Package (MLP) and a 5-bump Wafer Level Chip Scale Package (WLCSP). Cell Phones, Smart-Phones Pocket PCs WLAN DC-DC Converter Modules PDA, DSC, PMP, and MP3 Players Portable Hard Disk Drives Ordering Information Part Number Pb-Free Operating Temperature Range Package Packing Method FAN5350UCX Yes -40°C to 85°C WLCSP-5 1x1.37mm Tape and Reel(1) FAN5350MPX Yes -40°C to 85°C MLP-6 3 x 3mm Tape and Reel(1) Note: 1. Please refer to tape and reel specifications on www.fairchildsemi.com; http://www.fairchildsemi.com/packaging. © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 www.fairchildsemi.com FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging July 2007 4.7µF VIN CIN VIN A1 A3 SW B2 EN C1 PGND GND C3 FB L1 VOUT 1µH 1 AGND 2 FB 3 4.7µF VOUT P1 (GND) 6 VIN 5 SW 4 EN VIN 4.7µF C IN L1 COUT 1µΗ C OUT 4.7µF Figure 1. WLCSP (top view) Figure 2. MLP (top view) Block Diagram VIN Current Limit EN Bias 1.8V Reference + Modulator FB Logic SW Driver - FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Typical Applications 3MHz OSC Zero Crossing GND Figure 3. Block Diagram © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 www.fairchildsemi.com 2 VIN A1 A3 GND B2 EN C1 GND A3 SW SW C3 FB FB C3 Figure 4. WLCSP - Bumps Facing Down A1 VIN B2 C1 EN Figure 5. WLCSP - Bumps Facing Up PGND 1 AGND 2 FB 3 P1 (GND) 6 VIN 5 SW 4 EN Figure 6. 3x3mm MLP - Leads Facing Down Pin Definitions WLCSP Pin # Name A1 VIN A3 GND Description Power Supply Input. Ground Pin. Signal and power ground for the part. C1 EN Enable Pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled when >1.2V. Do not leave this pin floating. C3 FB Feedback Analog Input. Connect directly to the output capacitor. B2 SW Switching Node. Connection to the internal PFET switch and NFET synchronous rectifier. MLP Pin # Name Description 1 PGND Power Ground Pin. Power stage ground. Connect PGND and AGND together via the board ground plane. 2 AGND Analog Ground Pin. Signal ground for the part. 3 FB Feedback Analog Input. Connect directly to the output capacitor. 4 EN Enable Pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled when >1.2V. Do not leave this pin floating. 5 SW Switching Node. Connection to the internal PFET switch and NFET synchronous rectifier. 6 VIN Power Supply Input. © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Pin Configurations www.fairchildsemi.com 3 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Min. Max. Input Voltage with respect to GND -0.3 6.0 V Voltage on any other pin with respect to GND -0.3 VIN V TJ Junction Temperature -40 150 °C TSTG Storage Temperature -65 150 °C VIN TL Parameter Lead Temperature (Soldering 10 Seconds) ESD Electrostatic Discharge Protection Level 260 Unit °C Human Body Model 4.5 kV Charged Device Model 1.5 kV Machine Model 200 V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter VCC Supply Voltage Range IOUT Output Current L CIN COUT Min. Typ. 2.7 0 Max. Unit 5.5 V 600 mA Inductor 0.7 1.0 3.0 µH Input Capacitor 3.3 4.7 12.0 µF Output Capacitor 3.3 4.7 12.0 µF TA Operating Ambient Temperature -40 +85 °C TJ Operating Junction Temperature -40 +125 °C Max. Units Thermal Properties Symbol ΘJA_WLCSP ΘJA_MLP Parameter Min. Typ. (2) 180 °C/W (2) 49 °C/W Junction-to-Ambient Thermal Resistance Junction-to-Ambient Thermal Resistance FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Absolute Maximum Ratings Note: 2. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 1s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA. © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 www.fairchildsemi.com 4 Minimum and maximum values are at VIN = 2.7V to 5.5V, TA = -40°C to +85°C, CIN = COUT = 4.7µF, L = 1µH, unless otherwise noted. Typical values are at TA = 25°C, VIN =3.6V. Symbol Parameter Conditions Min. Typ. Max. Units Power Supplies IQ I(SD) Quiescent Current Shutdown Supply Current VUVLO Under-Voltage Lockout Threshold V(ENH) Enable HIGH-Level Input Voltage V(ENL) Enable LOW-Level Input Voltage I(EN) Enable Input Leakage Current Device is not switching, EN=VIN 16 Device is switching, EN=VIN 18 25 µA 0.05 1.00 µA VIN = 3.6V, EN = GND µA Rising Edge 1.8 2.1 Falling Edge 1.75 1.95 1.2 V V 0.4 V 0.01 1.00 µA 2.5 3.0 3.5 MHz ILOAD = 0 to 600mA 1.775 1.820 1.865 V CCM 1.784 1.820 1.856 V 300 µs EN = VIN or GND Oscillator f0SC Oscillator Frequency Regulation VO Output Voltage Accuracy tSS Soft-Start EN = 0 -> 1 Output Driver RDS(on) PMOS On Resistance VIN = VGS = 3.6V 180 mΩ NMOS On Resistance VIN = VGS = 3.6V 170 mΩ (3) ILIM PMOS Peak Current Limit Open-Loop TTSD Thermal Shutdown CCM Only THYS Thermal Shutdown Hysteresis 650 800 900 °C 20 °C Note: 3. The Electrical Characteristics table reflects open-loop data. Refer to Operation Description and Typical Characteristic for closed-loop data. © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 mA 150 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Electrical Characteristics www.fairchildsemi.com 5 The FAN5350 is a step-down switching voltage regulator that delivers a fixed 1.82V from an input voltage supply of 2.7V to 5.5V. Using a proprietary architecture with synchronous rectification, the FAN5350 is capable of delivering 600mA at over 90% efficiency, while maintaining a light load efficiency of over 80% at load currents as low as 1mA. The regulator operates at a nominal frequency of 3MHz at full load, which reduces the value of the external components to 1µH for the output inductor and 4.7µF for the output capacitor. Enable and Soft Start Maintaining the EN pin LOW keeps the FAN5350 in non-switching mode in which all circuits are off and the part draws ~50nA of current. Increasing EN above its threshold voltage activates the part and starts the softstart cycle. During soft start, the current limit is increased in discrete steps so that the inductor current is increased in a controlled manner. This minimizes any large surge currents on the input and prevents any overshoot of the output voltage. Control Scheme Under-Voltage Lockout The FAN5350 uses a proprietary non-linear, fixedfrequency PWM modulator to deliver a fast load transient response, while maintaining a constant switching frequency over a wide range of operating conditions. The regulator performance is independent of the output capacitor ESR, allowing for the use of ceramic output capacitors. Although this type of operation normally results in a switching frequency that varies with input voltage and load current, an internal frequency loop holds the switching frequency constant over a large range of input voltages and load currents. When EN is high, the under-voltage lock-out keeps the part from operating until the input supply voltage rises high enough to properly operate. This ensures no misbehavior of the regulator during start-up or shutdown. Current Limiting A heavy load or short circuit on the output causes the current in the inductor to increase until a maximum current threshold is reached in the high-side switch. Upon reaching this point, the high-side switch turns off, preventing high currents from causing damage. For very light loads, the FAN5350 operates in discontinuous current (DCM) single-pulse PFM mode, which produces low output ripple compared with other PFM architectures. Transition between PWM and PFM is seamless, with a glitch of less than 14mV at VOUT during the transition between DCM and CCM modes. The peak current limit shown in Figure 16, ILIM(PK) is slightly higher than the open-loop tested current limit, ILIM(OL), in the Electrical Characteristics table. This is primarily due to the effect of propagation delays of the IC current limit comparator. Combined with exceptional transient response characteristics, the very low quiescent current of the controller (<16µA) maintains high efficiency, even at very light loads, while preserving fast transient response for applications requiring very tight output regulation. © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 Thermal Shutdown When the die temperature increases, due to a high load condition and/or a high ambient temperature, the output switching is disabled until the temperature on the die has fallen sufficiently. The junction temperature at which the thermal shutdown activates is nominally 150°C with a 20°C hysteresis. FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Operation Description www.fairchildsemi.com 6 The increased RMS current produces higher losses through the RDS(ON) of the IC MOSFETs as well as the inductor ESR. Selecting the Inductor The output inductor must meet both the required inductance and the energy handling capability of the application. Increasing the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor size, increased inductance usually results in an inductor with lower saturation current. The inductor value affects the average current limit, the PWM-to-PFM transition point, the output voltage ripple, and the efficiency. Table 1 shows the effects of inductance higher or lower than the recommended 1μH on regulator performance. The ripple current (∆I) of the regulator is: ΔI ≈ VOUT ⎛ VIN − VOUT • ⎜⎜ VIN ⎝ L • FSW ⎞ ⎟ ⎟ ⎠ Output Capacitor EQ. 1 Table 2 suggests 0603 capacitors. 0805 capacitors may further improve performance in that the effective capacitance is higher and ESL is lower than 0603. This improves the transient response and output ripple. The maximum average load current, IMAX(LOAD) is related to the peak current limit, ILIM(PK) (see figure 17) by the ripple current: Increasing COUT has no effect on loop stability and can therefore be increased to reduce output voltage ripple or to improve transient response. Output voltage ripple, ∆VOUT, is: ΔI EQ. 2 2 The transition between PFM and PWM operation is determined by the point at which the inductor valley current crosses zero. The regulator DC current when the inductor current crosses zero, IDCM, is: IMAX(LOAD ) = ILIM(PK ) − IDCM = ΔI 2 ⎛ ⎞ 1 ΔVOUT = ΔI • ⎜⎜ + ESR ⎟⎟ 8 • C • F OUT SW ⎝ ⎠ EQ. 3 Input Capacitor The 4.7μF ceramic input capacitor should be placed as close as possible between the VIN pin and GND to minimize the parasitic inductance. If a long wire is used to bring power to the IC, additional “bulk” capacitance (electrolytic or tantalum) should be placed between CIN and the power source lead to reduce ringing that can occur between the inductance of the power source leads and CIN. The FAN5350 is optimized for operation with L=1μH, but is stable with inductances ranging from 700nH to 3.0μH. The inductor should be rated to maintain at least 80% of its value at ILIM(PK). Efficiency is affected by the inductor DCR and inductance value. Decreasing the inductor value for a given physical size typically decreases the DCR; but since ∆I increases, the RMS current increases, as do the core and skin effect losses. IRMS = IOUT(DC) 2 + ΔI2 12 EQ. 5 EQ. 4 Inductor Value IMAX(LOAD) EQ. 2 ILIM(PK) ∆VOUT EQ. 5 Transient Response Increase Increase Decrease Decrease Degraded Decrease Decrease Increase Increase Improved FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Applications Information Table 1. Effects of changes in inductor value (from 1µH recommended value) on regulator performance © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 www.fairchildsemi.com 7 ensures that the control sections of the IC do not behave erratically due to excessive noise. This reduces switching cycle jitter and ensures good overall performance. It is not considered critical to place either the inductor or the output capacitor very close to the IC. There is some flexibility in moving these two components further away from the IC. For the bill of materials of the FAN5350 evaluation board, see Table 1. There are only three external components: the inductor and the input and output capacitors. For any buck switcher IC, including the FAN5350, it is always important to place a low-ESR input capacitor very close to the IC, as shown in Figure 7. That ensures good input decoupling, which helps reduce the noise appearing at the output terminals and Description Qty. Ref. 1.2μH, 1.8A, 55mΩ Inductor 1.3μH, 1.2A, 90mΩ 1 Vendor Part Number TOKO 1117AS-1R2M FDK MIPSA2520D1R0 Taiyo Yuden CBC3225T15MR L1 1.5μH, 1.3A Capacitor 4.7μF, ±10%, 6.3V, X5R, 0603 2 CIN,COUT MURATA GRM39 X5R 475K 6.3 IC DC/DC Regulator in CSP, 5 bumps 1 U1 Fairchild FAN5350UCX Load Resistor (Optional) 1 RLOAD Any Table 2. FAN5350 Evaluation Board Bill of Materials (optional parts are installed by request only) Feedback Loop One key advantage of the non-linear architecture is that there is no traditional feedback loop. The loop response to changes in VOUT is essentially instantaneous, which explains its extraordinary transient response. The absence of a traditional, high-gain compensated linear loop means that the FAN5350 is inherently stable over a wide range of LOUT and COUT. LOUT can be reduced further for a given application, provided it is confirmed that the calculated peak current for the required maximum load current is less than the minimum of the closed-loop current limit. The advantage is that this generally leads to improved transient response, since a small inductance allows for a much faster increase in current to cope with any sudden load demand. The inductor can be increased to 2.2µH; but, for the same reason, the transient response gets slightly degraded. In that case, increasing the output capacitor to 10µF helps significantly. Figure 7. The FAN5350 Evaluation Board PCB (CSP) © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging PCB Layout Guidelines www.fairchildsemi.com 8 VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified. 1850 22 DC Output Voltage (mV) Quiescent Current (µA) 24 +85°C 20 18 +25°C 16 14 -40°C 12 10 2.5 3.0 3.5 4.0 4.5 5.0 1840 DCM spreading 1830 CCM 1820 1810 1800 1790 0 5.5 100 200 300 400 500 600 Load Current (m A) Figure 8. Quiescent Current vs. Battery Voltage Figure 9. Load Regulation, Increasing Load 600 600 500 500 85°C CCM border 400 Continuous Conduction Mode 300 200 Load Current (mA) Load Current (mA) Battery Voltage (V) Switching mode changes at these borders Hysteresis 100 Discontinuous Conduction Mode 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 300 200 100 -30°C CCM border 85°C DCM border -30°C DCM border 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Battery Voltage (V) Battery Voltage (V) Figure 10. Switch Mode Operating Areas Figure 11. Switch Mode Over Temperature 2.00 VIN=2.7V 1.50 Output Voltage (mV) 1835 1.75 Output Voltage (V) 400 VIN=5.5V 1.25 1.00 0.75 VIN=3.6V 0.50 0.25 0 0 0.1 0.2 1825 VIN=3.6V 1815 VIN=5.5V 1810 1805 -40 Load Current (A) VIN=2.7V 1820 1800 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 ILOAD=300mA -20 0 20 40 60 80 Ambient Temperature (°C) Figure 12. DC Current Voltage Output Characteristics © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 1830 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Typical Performance Characteristics Figure 13. Output Voltage vs. Temperature www.fairchildsemi.com 9 VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified. 100 100 Power Efficiency (%) 90 V IN=2.7V 85 V IN=3.3V 80 Power Efficiency (%) V IN=2.5V 95 V IN=3.6V 75 V IN=4.2V 70 V IN=5V 65 60 V IN=5.5V 0.001 0.010 0.100 95 -40°C 90 +85°C 85 +25°C 80 75 0.001 1.000 0.010 Figure 14. Power Efficiency vs. Load Current 1.000 Figure 15. Power Efficiency Over Temperature Range 1.3 250 Shutdown Current (nA) VIN=5.5V 1.2 Current Limit (A) 0.100 Load Current (A) Load Current (A) 1.1 1.0 VIN=3.6V 0.9 0.8 VIN=2.7V 0.7 -40 -20 0 20 40 60 200 150 100 +25°C 50 -40°C 0 2.5 80 +85°C 3.0 Figure 16. PMOS Current Limit in Closed Loop 85dB 3.5 4.0 4.5 5.0 5.5 Battery Voltage (V) Ambient Temperature (°C) Figure 17. Shutdown Supply Current vs. Battery Voltage 3.3 250mA Load Frequency (MHz) 3.2 5dB /div 3.1 -40°C +25°C 3.0 2.9 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Typical Performance Characteristics (Continued) +85°C 2.8 2.7 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 35dB 1Hz 10Hz 100Hz 1kHz 10kHz Battery Voltage (V) Figure 18. Power Supply Rejection Ratio in CCM © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 Figure 19. Switching Frequency in CCM www.fairchildsemi.com 10 VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified. IL, 0.5A / div. IL, 0.5A / div. VOUT, 0.5V / div. VOUT, 0.5V / div. EN, 5.0V / div. EN, 5.0V / div. H scale: 20µs / div. H scale: 10µs / div. Figure 20. Start-Up, Full Load Figure 21. Start-Up, No Load VOUT(ac), 20mV / div. VOUT(ac), 20mV / div. ILOAD, 0.5A / div. ILOAD, 0.5A / div. H scale: 1µs / div. H scale: 1µs / div. Figure 22. Fast Load Transient, No Load to Full Load Figure 23. Fast Load Transient, Full Load to No Load VSW, 5V / div. VSW, 5V / div. VOUT(ac), 20mV / div. VOUT(ac), 20mV / div. ILOAD = 600mA ILOAD = 50mA ILOAD = 300mA ILOAD = 1mA H scale: 20µs / div. H scale: 20µs / div. Figure 24. Fast Load Transient in CCM © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Typical Performance Characteristics (Continued) Figure 25. Fast Load Transient in DCM www.fairchildsemi.com 11 VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified. VSW, 2V / div. VSW, 5V / div. VOUT(ac), 20mV / div. VOUT(ac), 20mV / div. ILOAD = 300mA ILOAD = 20mA ILOAD, 0.2A / div. H scale: 20µs / div. H scale: 2ms / div. Figure 26. Fast Load Transient DCM – CCM – DCM Figure 27. Slow Load Transient DCM – CCM – DCM VOUT(ac), 20mV / div. VOUT(ac), 20mV / div. VIN = 3.6V VIN = 3.6V VIN = 3.0V VIN = 3.0V H scale: 10µs / div. H scale: 10µs / div. Figure 28. Line Transient, 600mV, 50mA Load Figure 29. Line Transient, 600mV, 50mA Load VOUT(ac), 10mV / div. VIN = 3.6V ILOAD = 350mA VIN = 3.0V ILOAD = 100mA H scale: 5µs / div. Figure 30. Combined Line (600mV) and Load (100mA to 350mA) Transient Response VSW, 2V / div. VSW, 2V / div. IL = 0.2A / div. IL = 0.1A / div. VOUT(ac), 20mV / div. VOUT(ac), 20mV / div. H scale: 1µs / div. H scale: 200µs / div. Figure 31. Typical Waveforms in DCM, 50mA Load © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Typical Performance Characteristics (Continued) Figure 32. Typical Waveforms in CCM, 150mA Load www.fairchildsemi.com 12 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Physical Dimensions Dimensions are in millimeters unless otherwise noted. Figure 33. 6-Lead Molded Leadless Package (MLP) © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 www.fairchildsemi.com 13 Dimensions are in millimeters unless otherwise noted. F BALL A1 INDEX AREA A E (0.50) (Ø0.25) Cu PAD B 0.03 C (0.866) A1 2X D (Ø0.35) SOLDER MASK OPENING (0.433) F 0.03 C 2X TOP VIEW D 0.332±0.018 0.06 C 0.625 MAX 0.05 C RECOMMENDED LAND PATTERN (NSMD) E 0.250±0.025 SEATING PLANE C SIDE VIEWS (X)+/-.018 0.50 0.50 F 0.005 A. NO JEDEC REGISTRATION APPLIES B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 D DATUM C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E PACKAGE TYPICAL HEIGHT IS 582 MICRONS +/- 43 MICRONS (539-625 MICRONS) F FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6 SAC405 ALLOY H. DRAWING FILENAME: MKT-UC005AArev3 C A B 5 X Ø0.315 +/- .025 C B A 0.433 F 123 (Y)+/-.018 BOTTOM VIEW Product Specific Dimensions Product D E X Y FAN5350UCX 1.370 +/- 0.030 1.000 +/- 0.030 0.270 0.272 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging Physical Dimensions (Continued) Figure 34. 5-Bump Wafer-Level Chip-Scale Package (WLCSP) © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 www.fairchildsemi.com 14 FAN5350 — 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging © 2007 Fairchild Semiconductor Corporation FAN5350 Rev. 1.0.1 www.fairchildsemi.com 15