CPC3710 250V N-Channel Depletion-Mode FET INTEGRATED CIRCUITS DIVISION V(BR)DSX / V(BR)DGX RDS(on) (max) IDSS (min) Package 250VP 10 220mA SOT-89 Features • • • • • • Low RDS(on) at Cold Temperatures Low On-Resistance: 10 max. at 25ºC High Input Impedance High Breakdown Voltage: 250VP Low VGS(off) Voltage: -1.6 to -3.9V Small Package Size SOT-89 The CPC3710 is an N-channel, depletion-mode, field effect transistor (FET) that utilizes IXYS Integrated Circuits Division’s proprietary third-generation vertical DMOS process. The third-generation process realizes world class, high voltage MOSFET performance in an economical silicon gate process. Our vertical DMOS process yields a robust device, with high input impedance, for use in high-power applications. The CPC3710 is a highly reliable FET device that has been used extensively in our solid state relays for industrial and telecommunications applications. This device excels in power applications requiring low drain-source resistance, particularly in cold environments such as automotive ignition modules. The CPC3710 offers a low, 10 maximum, on-state resistance at 25ºC. Applications • • • • • • Description Ignition Modules Normally-On Switches Solid State Relays Converters Telecommunications Power Supply The CPC3710 has a minimum breakdown voltage of 250VP , and is available in an SOT-89 package. As with all MOS devices, the FET structure prevents thermal runaway and thermal-induced secondary breakdown. Ordering Information Part # CPC3710CTR Package Pinout Description N-Channel Depletion Mode FET, SOT-89 Pkg. Tape and Reel (1000/Reel) Circuit Symbol D D G G D S S (SOT-89) DS-CPC3710-R02 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC3710 Absolute Maximum Ratings @ 25ºC Parameter Drain-to-Source Voltage Gate-to-Source Voltage Pulsed Drain Current Total Package Dissipation 1 Junction Temperature Operational Temperature Storage Temperature 1 Ratings 250 ±15 600 1.4 150 -55 to +125 -55 to +125 Units VP VP mA W ºC ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Mounted on FR4 board 1"x1"x0.062" Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Drain-to-Source Breakdown Voltage Gate-to-Source Off Voltage Change in VGS(off) with Temperatures Gate Body Leakage Current Symbol Conditions Min Typ Max Units V(BR)DSX VGS= -5V, ID=100µA 250 - - VP VGS(off) VDS= 5V, ID=1mA -1.6 - -3.9 V dVGS(off)/dT VDS= 5V, ID=1A - - 4.5 mV / ºC VGS=±15V, VDS=0V - - 100 nA VGS= -5V, VDS=250V - - 1 µA VGS= -5V, VDS=200V, TA=125ºC - - 1 mA IDSS VGS= 0V, VDS=15V 220 - - mA RDS(on) VGS= 0V, ID=220mA - - 10 IGSS Drain-to-Source Leakage Current ID(off) Saturated Drain-to-Source Current Static Drain-to-Source On-State Resistance dRDS(on) / dT VGS= 0V, ID=220mA - - 1.1 % / ºC GFS ID= 100mA, VDS = 10V 225 - - m Input Capacitance CISS 350 COSS - 30 80 Reverse Transfer Capacitance CRSS VGS= -5V VDS= 25V f= 1MHz 100 Common Source Output Capacitance 15 40 Turn-On Delay Time td(on) 23 35 Forward Transconductance Rise Time VDD= 25V ID= 150mA VGS= 0V to -10V Rgen= 50 tr Turn-Off Delay Time td(off) Fall time tf - Change in RDS(on) with Temperatures 8 20 17 25 70 80 pF ns Source-Drain Diode Voltage Drop VSD VGS= -5V, ISD= 150mA - 0.6 1.8 V Thermal Resistance (Junction to Ambient) RJA - - 90 - ºC/W VDD Switching Waveform & Test Circuit RL 0V 90% PULSE GENERATOR INPUT -10V 10% Rgen t on t d(on) VDS OUTPUT t off tf t d(off) tr 90% D.U.T. 90% INPUT OUTPUT 0V 2 10% 10% www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC3710 PERFORMANCE DATA* 300 270 240 210 180 150 120 90 60 30 0 VGS=0.0V 350 0 300 -0.5 +25ºC 1 2 3 VDS (V) 4 5 200 150 +125ºC -40ºC 50 0 -3.0 6 RON vs. Temperature (VGS=0V, ID=100mA) 1.6 12.0 1.4 -2.0 VGS (V) -1.5 -3.5 -40 -1.0 -0 40 80 Temperature (ºC) 300 -55ºC 250 +25ºC 6.0 1.0 GFS (m ) Power (W) 8.0 0.8 0.6 4.0 0.4 2.0 0.2 -0 40 80 Temperature (ºC) 120 100 20 40 60 80 100 120 Ambient Temperature (ºC) 0 140 160 0.01 120 CISS 100 RON (:) Capacitance (pF) 140 0.1 80 60 40 COSS 20 0 1000 CRSS 0 10 20 VDS (V) 30 40 10 20 30 40 50 60 ID (mA) 70 80 90 100 On-Resistance vs. Drain Current (VGS=0V) Capacitance vs. Drain Source Voltage (VGS=-5V) 1 1 10 100 Drain-Source Voltage (V) +125ºC 150 0 0 Max Rated Safe Operating Area 0.001 0.1 200 50 0.0 -40 120 Transconductance Vs. Drain Current (VDS=10V) : RON (:) -2.5 -3.0 1.2 10.0 Drain Current (A) -2.0 Power Dissipation vs. Ambient Temperature 14.0 0 -1.5 -2.5 100 VGS=-2.0V 0 VGS(off) (V) VGS=-1.5V VGS(off) vs. Temperature (VDS=10V, ID=1mA) -1.0 250 VGS=-1.0V ID (mA) ID (mA) Transfer Characteristics (VDS=5V) Output Characteristics (TA=25ºC) 20 18 16 14 12 10 8 6 4 2 0 0 0.06 0.12 0.18 ID (A) 0.24 0.3 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC3710 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC3710C MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC3710C 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC3710 MECHANICAL DIMENSIONS CPC3710C 1.626 / 1.829 (0.064 / 0.072) 1.397 / 1.600 (0.055 / 0.063) R 0.254 (R 0.010) PCB Land Pattern 1.90 (0.075) 3.937 / 4.242 (0.155 / 0.167) 45º 2.286 / 2.591 (0.090 / 0.102) 2.45 (0.096) 1.40 (0.055) Pin 1 0.889 / 1.194 (0.035 / 0.047) 0.356 / 0.483 (0.014 / 0.019) 0.432 / 0.559 (0.017 / 0.022) 50º 0.356 / 0.432 (0.014 / 0.017) 0.864 / 1.016 (0.034 / 0.040) 4.394 / 4.597 (0.173 / 0.181) 1.118 / 1.270 (0.044 / 0.050) 50º 5.00 (0.197) 1.90 (0.074) 0.432 / 0.508 (0.017 / 0.020) 0.60 (0.024) TYP 3 2.845 / 2.997 (0.112 / 0.118) 1.422 / 1.575 (0.056 / 0.062) 2.921 / 3.073 (0.115 / 0.121) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) CPC3710CTR Tape & Reel 177.8 Dia (7.00 Dia) 5.50 ± 0.05 (0.217 ± 0.002) Top Cover Tape Thickness 0.102 Max (0.004 Max) 1.75 ± 0.1 (0.069 ± 0.004) W=12.00 ± 0.3 (0.472 ± 0.012) B0=4.60 ± 0.1 (0.181 ± 0.004) K0=1.80 ± 0.1 (0.071 ± 0.004) Embossed Carrier 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) A0=4.80 ± 0.1 (0.189 ± 0.004) P=8.00 ± 0.1 (0.315 ± 0.004) Embossment Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: DS-CPC3710-R02 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/1/2014