ON NCP803SN293T1G Very low supply current 3-pin microprocessor reset monitor Datasheet

NCP803
Very Low Supply Current
3−Pin Microprocessor
Reset Monitor
The NCP803 is a cost−effective system supervisor circuit designed
to monitor VCC in digital systems and provide a reset signal to the host
processor when necessary. No external components are required.
The reset output is driven active within 10 sec of VCC falling
through the reset voltage threshold. Reset is maintained active for a
minimum of 140 msec after VCC rises above the reset threshold. The
NCP803 has an open drain active−low RESET output. The output of
the NCP803 is guaranteed valid down to VCC = 1.0 V and is available
in a SOT−23 package.
The NCP803 is optimized to reject fast transient glitches on the VCC
line. Low supply current of 1.0 A (VCC = 3.2 V) make this device
suitable for battery powered applications.
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MARKING
DIAGRAM
3
3
SOT−23
(TO−236)
CASE 318
1
xxxM
1
2
xxx
M
2
= Specific Device Code
= Date Code
= Pb−Free Package
Features
• Precision VCC Monitor for 2.5 V, 3.0 V, 3.3 V, and 5.0 V Supplies
• Precision Monitoring Voltages from 1.6 V to 4.9 V Available
•
•
•
•
•
•
•
•
in 100 mV Steps
140 msec Guaranteed Minimum RESET Output Duration
RESET Output Guaranteed to VCC = 1.0 V
Low 1.0 µA Supply Current
VCC Transient Immunity
Small SOT−23 Package
No External Components
Wide Operating Temperature: −40°C to 105°C
Pb−Free Packages are Available
PIN CONFIGURATION
GND
1
3
RESET
VCC
2
SOT−23
(Top View)
NOTE: SOT−23 is equivalent to JEDEC (TO−236)
Typical Applications
•
•
•
•
ORDERING INFORMATION
Computers
Embedded Systems
Battery Powered Equipment
Critical µP Power Supply Monitoring
Device
NCP803SNxxxT1
NCP803SNxxxT3
SOT−23
3000/Tape & Reel
NCP803
C = 100 nF
NCP803SNxxxT3G SOT−23 10000/Tape & Reel
(Pb−Free)
µP
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
RESET
GND
SOT−23 10000/Tape & Reel
VCC
Rpull−up
RESET
Shipping†
NCP803SNxxxT1G SOT−23 3000/Tape & Reel
(Pb−Free)
VCC
VCC
Package
GND
0
NOTE: The “xxx” denotes a suffix for Vcc voltage threshold
options − see page 5 for more details.
0
Figure 1. Typical Application Diagram
*The “T3” suffix refers to a 13 inch reel.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 5 of this data sheet.
 Semiconductor Components Industries, LLC, 2005
April, 2005 − Rev. 5
1
Publication Order Number:
NCP803/D
NCP803
PIN DESCRIPTION
ÁÁÁÁ
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ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
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ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Pin No.
Symbol
1
GND
2
RESET
3
VCC
Description
Ground
RESET output remains low while VCC is below the reset voltage threshold, and for 240 msec (typ.)
after VCC rises above reset threshold.
Supply Voltage: C = 100 nF is recommended as a bypass capacitor between VCC and GND.
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
VCC
6.0
V
−0.3 to (VCC + 0.3)
V
Input Current, VCC
20
mA
Output Current, RESET
20
mA
Supply Voltage (VCC to GND)
RESET
dV/dt (VCC)
100
V/µsec
RJA
491
°C/W
Operating Temperature Range
TA
−40 to +105
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Lead Temperature (Soldering, 10 Seconds)
Tsol
+260
°C
Thermal Resistance, Junction to Air
Latch−up performance:
ILatch−up
Negative
mA
150
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 4000 V per MIL−STD−883, Method 3015.
Machine Model Method 400 V.
2. The maximum package power dissipation limit must not be exceeded.
TJ(max) TA
with TJ(max) = 150°C
PD RJA
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2
NCP803
ELECTRICAL CHARACTERISTICS TA = −40°C to +105°C unless otherwise noted. Typical values are at TA = +25°C. (Note 3)
Symbol
Characteristic
VCC Range
TA = 0°C to +70°C
TA = −40°C to +105°C
Min
Typ
Max
1.0
1.2
−
−
5.5
5.5
Unit
V
Supply Current
VCC = 3.3 V
TA = −40°C to +85°C
TA = 85°C to +105°C
VCC = 5.5 V
TA = −40°C to +85°C
TA = 85°C to +105°C
ICC
Reset Threshold (Note 4)
VTH
µA
−
−
0.5
−
1.2
2.0
−
−
0.8
−
1.8
2.5
V
NCP803SN463
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
4.56
4.51
4.40
4.63
−
−
4.70
4.75
4.88
NCP803SN438
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
4.31
4.27
4.16
4.38
−
−
4.45
4.49
4.60
NCP803SN308
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
3.04
3.00
2.92
3.08
−
−
3.11
3.15
3.23
NCP803SN293
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
2.89
2.85
2.78
2.93
−
−
2.96
3.00
3.08
NCP803SN263
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
2.59
2.55
2.50
2.63
−
−
2.66
2.70
2.76
NCP803SN232
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
2.29
2.26
2.20
2.32
−
−
2.35
2.38
2.45
NCP803SN160
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
1.58
1.56
1.52
1.60
−
−
1.62
1.64
1.68
Reset Temperature Coefficient
−
30
−
VCC to Reset Delay VCC = VTH to (VTH − 100 mV)
−
10
−
µsec
140
240
460
msec
VOL
−
−
0.3
V
ILEAK
−
−
1
µA
Reset Active Timeout Period
RESET Output Voltage Low
VCC = VTH − 0.2 V
1.6 V VTH 2.0 V, ISINK = 0.5 mA
2.1 V VTH 4.0 V, ISINK = 1.2 mA
4.1 V VTH 4.9 V, ISINK = 3.2 mA
RESET Leakage Current
VCC VTH, RESET De−asserted
3. Production testing done at TA = 25°C, over temperature limits guaranteed by design.
4. Contact your ON Semiconductor sales representative for other threshold voltage options.
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3
ppm/°C
NCP803
TYPICAL CHARACTERISTICS
1.8
1.4
VTH = 1.60 V
1.2
105°C
SUPPLY CURRENT (A)
SUPPLY CURRENT (A)
1.6
1.4
1.2
85°C
1.0
25°C
0.8
0.6
0°C
0.4
−40°C
85°C
1.0
0.8
25°C
0.6
0°C
0.4
−40°C
0.2
0.2
0
0.5
1.5
2.5
3.5
4.5
0
0.5
5.5
1.5
2.5
SUPPLY VOLTAGE (V)
105°C
VTH = 4.90 V
1.2
0.999
85°C
1.0
VTH = 1.60 V
1.000
NORMALIZED VTH VOLTAGE
SUPPLY CURRENT (A)
5.5
1.001
VTH = 3.08 V
0.998
VTH = 4.90 V
0.997
0.8
0°C
0.6
25°C
0.996
0.995
0.4
−40°C
0.2
0
0.5
1.5
2.5
3.5
4.5
0.994
0.993
−40
5.5
−20
0
20
40
60
80
100
120
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Figure 4. Supply Current vs. Supply Voltage
Figure 5. Normalized Reset Threshold Voltage
vs. Temperature
POWER−DOWN RESET TIMEOUT (S)
280
POWER−UP RESET TIMEOUT (mS)
4.5
Figure 3. Supply Current vs. Supply Voltage
1.6
270
260
250
VTH = 4.90 V
240
230
VTH = 3.08 V
220
VTH = 1.60 V
210
200
−40
3.5
SUPPLY VOLTAGE (V)
Figure 2. Supply Current vs. Supply Voltage
1.4
105°C
VTH = 3.08 V
−20
0
20
40
60
80
100
120
350
300
VTH = 4.90 V
250
200
150
100
VTH = 3.08 V
50
0
−40
VTH = 1.60 V
−20
0
20
40
60
80
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 6. Power−up Reset Timeout vs. Temperature
Figure 7. Power−down Reset Timeout vs.
Temperature (Overdrive = 20 mV)
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4
100
NCP803
TAPING FORM
Component Taping Orientation for 3L SOT−23 (JEDEC−236) Devices
USER DIRECTION OF FEED
DEVICE
MARKING
PIN 1
Standard Reel Component Orientation
(Mark Right Side Up)
Tape & Reel Specifications Table
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOT−23
8 mm
4 mm
3000
7 inches
SOT−23
8 mm
4 mm
10000
13 inches
MARKING AND THRESHOLD INFORMATION
Semicond ctor Part #
ON Semiconductor
VTH*
Marking (Note 5)
NCP803SN160T1
1.60
SCQM
NCP803SN160T1G
1.60
SCQM
NCP803SN232T1
2.32
SQRM
NCP803SN232T1G
2.32
SQRM
NCP803SN263T1
2.63
SQCM
NCP803SN263T1G
2.63
SQCM
NCP803SN293T1
2.93
SQDM
NCP803SN293T1G
2.93
SQDM
NCP803SN293T3
2.93
SQDM
NCP803SN293T3G
2.93
SQDM
NCP803SN308T1
3.08
SQEM
NCP803SN308T1G
3.08
SQEM
NCP803SN438T1
4.38
SQFM
NCP803SN438T1G
4.38
SQFM
NCP803SN463T1
4.63
SQGM
NCP803SN463T1G
4.63
SQGM
NOTE: The “G” suffix indicates Pb−Free package available.
*Contact your ON Semiconductor sales representative for other threshold voltage options.
5. M = Monthly Date Code
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5
NCP803
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
A
L
3
1
V
B S
2
DIM
A
B
C
D
G
H
J
K
L
S
V
G
C
D
H
K
J
INCHES
MIN
MAX
0.1102
0.1197
0.0472
0.0551
0.0350
0.0440
0.0150
0.0200
0.0701
0.0807
0.0005
0.0040
0.0034
0.0070
0.0140
0.0285
0.0350
0.0401
0.0830
0.1039
0.0177
0.0236
MILLIMETERS
MIN
MAX
2.80
3.04
1.20
1.40
0.89
1.11
0.37
0.50
1.78
2.04
0.013
0.100
0.085
0.177
0.35
0.69
0.89
1.02
2.10
2.64
0.45
0.60
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
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NCP803/D
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