AVAGO HLMP-CX3B New 5mm blue and green led lamps high luminous output Datasheet

HLMP-Cx1A/1B/2A/2B/3A/3B
New 5mm Blue and Green LED Lamps
Data Sheet
Description
Features
These high intensity blue and green T-1¾ package LEDs
are untinted and non-diffused. Based on the most efficient
and cost effective InGaN material technology and incorporating second generation optics they produce well
defined spatial radiation patterns at specific viewing cone
angles.
• Well defined spatial radiation pattern
Advanced optical grade epoxy construction offers superior
high temperature and moisture resistance performance in
outdoor signal and sign applications. The epoxy contains
UV inhibitor ro reduce the effects of long term exposure
to direct sunlight.
• High luminous output
• Untinted, Non-diffused
• Available in Color:
– Blue 470nm
– Green 525nm
• Viewing Angle: 15°, 23° and 30°
• Standoff or non-standoff
• Superior resistance to moisture
Applications
• Commercial outdoor advertising
• Traffic Sign
• Variable Message Sign
CAUTION: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.
Package Dimensions
Drawing A (Non-standoff)
1.00 ± 0.20
0.039 ± 0.008
8.70 ± 0.20
0.343 ± 0.008
0.70 max
0.028
5.80 ± 0.20
0.228 ± 0.008
0.50 ± 0.10 sq. typ.
0.020 ± 0.004
5.00 ± 0.20
0.197 ± 0.008
2.54 ± 0.38
0.100 ± 0.015
31.60 min
1.244
Cathode
1.00 min
0.039
cathode
flat
Drawing B (Standoff)
8.70 ± 0.20
0.343 ± 0.008
1.00 ± 0.20
0.039 ± 0.008
1.30 ± 0.15
0.051 ± 0.006 0.70 max
0.028
5.80 ± 0.20
0.228 ± 0.008
0.50 ± 0.10 sq. typ.
0.020 ± 0.004
5.00 ± 0.20
0.197 ± 0.008
2.54 ± 0.38
0.100 ± 0.015
Cathode
d
31.60 min
1.244
Viewing Angle
d
HLMP-Cx1B
12.96±0.25
(0.510±0.010)
HLMP-Cx2B
12.32 ±0.25
(0.485±0.010)
HLMP-Cx3B
2
12.00±0.25
(0.472±0.010)
1.00 min
0.039
Notes:
1. All dimensions are in millimeters (inches)
2. Leads are mild steel with tin plating.
3. The epoxy meniscus is 1.50mm max
cathode
flat
Device Selection Guide
Part Number
Color
Typical Viewing
angle, 2θ½ (°) [4]
Luminous Intensity Iv (mcd) at 20
mA [1,2,5]
Standoff /
Min
Max
Non Standoff
HLMP-CB1A-XY0DD
Blue
15°
7200
12000
Package
drawing
Non Standoff
A
Standoff
B
Non Standoff
A
Standoff
B
Non Standoff
A
Standoff
B
Non Standoff
A
Standoff
B
Non Standoff
A
Standoff
B
Non Standoff
A
Standoff
B
HLMP-CB1A-XYBDD
HLMP-CB1A-XYCDD
HLMP-CB1B-XY0DD
HLMP-CB1B-XYBDD
HLMP-CB1B-XYCDD
HLMP-CB2A-VW0DD
23°
4200
7200
HLMP-CB2A-VWBDD
HLMP-CB2A-VWCDD
HLMP-CB2B-VW0DD
HLMP-CB2B-VWBDD
HLMP-CB2B-VWCDD
HLMP-CB3A-UV0DD
30°
3200
5500
HLMP-CB3A-UVBDD
HLMP-CB3A-UVCDD
HLMP-CB3B-UV0DD
HLMP-CB3B-UVBDD
HLMP-CB3B-UVCDD
HLMP-CM1A-560DD
Green
15°
45000
76000
23°
21000
35000
HLMP-CM1B-560DD
HLMP-CM2A-230DD
HLMP-CM2B-230DD
HLMP-CM3A-Z10DD
30°
12000
21000
HLMP-CM3A-Z1BDD
HLMP-CM3A-Z1CDD
HLMP-CM3B-Z10DD
HLMP-CM3B-Z1BDD
HLMP-CM3B-Z1CDD
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
3
Part Numbering System
HLMP  C x xx  x x x xx
Packaging Option
DD: Ammo Pack
Color Bin Selection
0: Full Distribution
B: Color Bin 2 & 3
C: Color Bin 3 & 4
Maximum Intensity Bin
0: No maximum intensity limit (refer to selection guide)
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Standoffs
1A: 15° without lead standoff
1B: 15° with lead standoff
2A: 23° without lead standoff
2B: 23° with lead standoff
3A: 30° without lead standoff
3B: 30° with lead standoff
Color
B: Blue 470
M: Green 525
Note: please refer to AB 5337 for complete information on part numbering system
Absolute Maximum Ratings
TJ = 25°C
Parameter
Blue / Green
Unit
DC Forward Current [1]
30
mA
Peak Forward Current
100 [2]
mA
Power Dissipation
116
mW
Reverse Voltage
5
V
LED Junction Temperature
110
°C
Operating Temperature Range
-40 to + 85
°C
Storage Temperature Range
-40 to + 100
°C
Notes:
1. Derate linearly as shown in figure 4.
2. Duty Factor 10%, frequency 1KHz.
4
Electrical / Optical Characteristics
TJ = 25°C
Parameter
Symbol
Forward Voltage
Green / Blue
VF
Reverse Voltage
VR
Dominant Wavelength[1]
λd
Peak Wavelength
Green
Blue
λPEAK
Spectral Half Width
Green
Blue
Δλ1/2
Thermal Resistance
RθJ-PIN
Luminous Efficacy [2]
ηV
Green
Blue
Green
Blue
Thermal coefficient of λd
Green
Blue
Min.
Typ.
Max.
2.8
3.2
3.8
5
519.0
460.0
525.0
470.0
516
464
30
23
240
518
78
0.028
0.024
539.0
480.0
Units
Test Conditions
V
IF = 20 mA
V
IR = 10 µA
nm
IF = 20 mA
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
nm
IF = 20mA
°C/W
LED Junction-to-Pin
lm/W
Emitted Luminous Flux /
Emitted Radiant Flux
nm/°C
IF = 20 mA ; +25°C ≤ TJ ≤ +100°C
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens/watt.
5
100
BLUE
430
FORWARD CURRENT-mA
RELATIVE INTENSITY
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
GREEN
480
530
WAVELENGTH - nm
580
IFmax - MAXIMUM FORWARD
CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
2.5
GREEN
2.0
1.5
1.0
0.5
0
20
40
60
80
DC FORWARD CURRENT-mA
100
1
2
3
FORWARD VOLTAGE-V
4
5
40
60
80
TA - AMBIENT TEMPERATURE - °C
100
30
25
20
15
10
5
0
120
0
20
Figure 4. Maximum Forward Current vs Ambient Temperature
10
1.0
5
NORMALIZED INTENSITY
RELATIVE DOMINANT
WAVELENGTH SHIFT -nm
0
Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current
GREEN
BLUE
0
-5
0
20
40
60
FORWARD CURRENT-mA
80
Figure 5. Relative Dominant Wavelength Shift vs Forward Current
6
20
BLUE
3.0
-10
40
35
3.5
0.0
60
0
630
Figure 1. Relative Intensity vs Wavelength
80
100
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT -DEGREE
Figure 6. Radiation Pattern for 15°
90
1.0
0.8
0.8
NORMALIZED INTENSITY
NORMALIZED INTENSITY
1.0
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREE
FORWARD VOLTAGE SHIFT-V
NORMALZIED INTENSITY (PHOTO)
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREE
90
0.3
Blue
Green
1
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE
Figure 9. Relative Light Output vs Junction Temperature
7
0.2
Figure 8. Radiation Pattern for 30°
10
0.1
0.4
0.0
-90
90
Figure 7. Radiation Pattern for 23°
0.6
100
120
Blue
Green
0.2
0.1
0
-0.1
-0.2
-0.3
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE
Figure 10. Relative Forward Voltage vs Junction Temperature
100
120
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Bin
Intensity (mcd) at 20mA
Min
Max
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
1
16000
21000
2
21000
27000
3
27000
35000
4
35000
45000
5
45000
59000
6
59000
76000
Tolerance for each bin limit is ± 15%
Green Color Bin Table
Blue Color Bin Table
Min Max
Bin Dom Dom
Corner
Point Chromaticity Coordinate
Min Max
Bin Dom Dom
Corner
Point Chromaticity Coordinate
1
519
523
x
0.0667
0.1200
0.1450
0.0979
1
460
464
x
0.1440
0.1818
0.1766
0.1374
y
0.8323
0.7375
0.7319
0.8316
y
0.0297
0.0904
0.0966
0.0374
2
523
527
x
0.0979
0.1450
0.1711
0.1305
2
464
468
x
0.1374
0.1766
0.1699
0.1291
y
0.8316
0.7319
0.7218
0.8189
y
0.0374
0.0966
0.1062
0.0495
3
527
531
x
0.1305
0.1711
0.1967
0.1625
3
468
472
x
0.1291
0.1699
0.1616
0.1187
y
0.8189
0.7218
0.7077
0.8012
y
0.0495
0.1062
0.1209
0.0671
4
531
535
x
0.1625
0.1967
0.2210
0.1929
4
472
476
x
0.1187
0.1616
0.1517
0.1063
y
0.8012
0.7077
0.6920
0.7816
y
0.0671
0.1209
0.1423
0.0945
5
535
539
x
0.1929
0.2210
0.2445
0.2233
5
476
480
x
0.1063
0.1517
0.1397
0.0913
y
0.7816
0.6920
0.6747
0.7600
y
0.0945
0.1423
0.1728
0.1327
Tolerance for each bin limit is ± 0.5 nm.
Tolerance for each bin limit is ± 0.5 nm
Note:
1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
8
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
Avago Technologies LED Configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
• ESD precaution must be properly applied on the
1.59mm
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105°C Max.
-
Preheat time
60 sec Max
-
Peak temperature
260°C Max.
260°C Max.
Dwell time
5 sec Max.
5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
9
CATHODE
InGaN Device
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
6.35 ± 1.30
0.250 ± 0.051
12.70 ± 1.00
0.500 ± 0.039
CATHODE
20.5 ± 1.00
0.8070 ± 0.0394
9.125 ± 0.625
0.3595 ± 0.0245
18.00 ± 0.50
0.7085 ± 0.0195
12.70 ± 0.30
0.500 ± 0.012
0.70 ± 0.20
0.0275 ± 0.0075 A
A
VIEW AA
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
10
4.00 ± 0.20
Ø 0.1575 ± 0.0075 TYP.
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 260C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Color Bin
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
11
Lamps Baby Label
RoHS Compliant
e3
max temp 260C
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 260C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Color Bin
DATECODE: Date Code
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sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
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make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
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Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-2228EN - May 22, 2013